TWI312644B - Discharge produced plasma euv light source - Google Patents

Description

1312644 IX. DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to EUV and 5 soft X-ray sources that utilize the discharge between electrodes to form luminescent plasma. Related Application This application is a partial succession of the following cases. It is the US number submitted on April 8, 2003, as part of the US serial number 10/384,967 submitted on March 8, 2003. US No. 10/189,824 filed on July 3, 2002, US number 10/120,655 filed on April 10, 2002, and US Patent No. 6,586,757, filed June 6, 2001 US number 09/875,719, and US number 09/875,721 submitted on June 6, 2001, and US number 15 09/690,084 submitted on January 16, 2000; and requested October 2nd, 2nd October The patent application No. 60/422,808 filed on the 31st and the benefit of 6〇/419,805, filed on January 18, 2002, are hereby incorporated by reference. BACKGROUND OF THE INVENTION It has been known to generate far ultraviolet rays ('$11乂,)) by applying a high voltage across a electrode to produce a plasma generated by discharging electricity, such as in a gas medium, for example, including an active such as a sputum. The light at the Euv wavelength is produced in the material, such as I3.5 nm (also known as soft parent ray). These light sources are often referred to as discharge-generated money ("DPP,") EUV (soft ray-ray) sources. Issued on June 9, 1998, Patro (part(8), US Patent No. 7 1312644 5,763,930, 2000 5 U.S. Patent No. 6,064,072 issued to Patro et al. on June 16 and U.S. Patent No. 6,452 issued on September 17, 2002 to Patro (? & , No. 199, US Patent No. 6,541,786 issued to Partlo on April 1, 2003, and US Patent No. 5 issued to July 1, 2003 to Melnychuck et al. US Patent No. 6,586,757, and US Patent Application No. 09/752,818, filed on April 10, 2002, entitled "Pulse Power System for Far Ultraviolet and X-Ray, No. 10/120, 655, Inventor Ness ( Ness) et al., published on November 7, 2002, Announcement No. US/2002-0163313-A1, July 3, 2002, submitted a name for the plasma-focusing light source with an improved pulse power system, 10/ No. 189,824, inventor Melnychuck et al., published on January 9, 2003, Announcement No. US/2003-0006383-A1, March 8, 2003 The name is "High-power deep-ultraviolet laser with long-life optical device, 10/384,967, inventor Yager, et al., submitted on April 8, 2003, 15 as "far ultraviolet light source" 1〇/4〇9,254, inventor Melnychuck et al; all of the above cases deal with the type of EUV light source that uses Dpp to generate plasma for light, the disclosure of each case This is incorporated herein by reference. The current EUV collection optics are, for example, at some common ambient temperatures of 20, such as by a plurality of nested shells having a common focus. Typically, 5, such as nickel Formed with emphasis on relatively thin walls that are approximately 丨 mm thick. EUV light produces a high thermal load on components close to the EUV source point. In the case of optical components, these heat loads are distorted The critical surface shifts the focus. 1312644 A very efficient method of transmitting EUV light, such as via an "incident grazing angle" reflector. In general, a nested collector casing, for example, has at least two different anti- A surface, such as a flat or curved surface, whereby the plasma generated by self-discharge emits light at a large angle to be collected and transported to an intermediate focus or focal plane at a smaller angle of 5, ie, a numerical aperture. Maintaining the focal plane or focus is a type of design that can be designed with a partially modified EUV source. Electrode lifetime is another topic of EUV light source that needs attention. The electrode life of a 100 M shot with 10 10% output degradation is believed to be the minimum requirement for the DPP EUV system. The current technology allows only about 30 M or so of firing for the above-mentioned left and right degradation. The by-product of the EUV luminescence of the 匝-like plasma produced by a DPP is the high thermal load on the structure and components of the 形态 clip form. This can have several deleterious effects on performance and component life. For example, in the case of a 15 center electrode, the thermal load can be severe enough to cause excessive erosion of the outer surface of the electrode, such as through evaporation of the material. Due to several factors including the influence on the morphology of the plasma and the inability to withstand the pressure of the cooling water circulating inside the electrode structure, these electrodes must eventually be replaced due to the erosion. At this time, the life of the EUV electrode is an order of magnitude different from the life number 20 quoted by the microfilm industry. Therefore, replacement costs and machine downtime during electrode replacement constitute the bulk of the “cost of ownership” of the DPP EUV source. It is known to use SiC-BN in the defense industry as a plated coating. SiC doped with BN is common for SiC-graphite systems 1312644 such as coated fibers containing BN. TiW has been used in the semiconductor industry as a common machining material, such as for PVD targets. Another important consideration for DPP EUV sources is the need to significantly reduce the deleterious effects of electrode dust caused by the plasma EUV source generated by the discharge on system light devices such as collector optics. Another important aspect of the DPP EUV source is the need to use the energy injected into the DPP device most efficiently to achieve maximum light output for a given energy input. Extremely high energy light output is required, and there is a limit, for example, due to timing and heat dissipation requirements, such as the ability to deliver very high energy pulses to the discharge electrode at the desired repetition rate 10. SUMMARY OF THE INVENTION A DPP EUV source is disclosed that can include a debris abatement device that produces a metal halide from debris exiting the plasma using a metal halide gas. The EUV source may have a debris shutter that may include a plurality of curved shielding members, wherein the plurality of curved shielding members have inner and outer surfaces connected by optical channels aligned to a focus, and the shielding members may The open space with it alternates and may have a circular shape formed in one axis of rotation and an elliptical surface formed in the other axis of rotation. A 20 electrical pulse can be applied to the electrode and it is shaped to produce a moderate current during the axial run-out phase of the discharge and a peak during the radial compression phase of the discharge. The light source can include a turbomolecular pump and has an inlet connected to the generating chamber and operable to preferentially pump more source gases from the chamber than the buffer gas. The source may include an adjusted conductive electrode comprising: a differentially doped 1312644-doped ceramic material doped into a first region to select at least conductivity and a second region to select at least thermal conductivity . The first zone may be located at or near the outer surface of the _ electrode structure, and the ceramic material may be SiC or alumina, and the dopant may be BN or a metal oxide including SiO or TiO 2 . The source portion can include a shiftable electrode assembly mount and is operable to move the electrode assembly mount from a change position to an operative position, wherein the moveable mount is located on a telescoping joint. The source portion can have a temperature control mechanism operatively coupled to the collector and operable to adjust the temperature of the respective jacket member to maintain a B-temperature dependent geometry such that the individual housing members are The grazing angle of the incident reflection 10 is optimized or has a mechanical positioner for positioning the casing member. The sleeve can be biased at a voltage. A debris shutter can be fabricated using off-focus laser radiation. The anode can be cooled by a hollow interior defining two coolant passages or a porous metal defining a passage. An interlocking signature that provides uniform separation and reinforcement without blocking significant amounts of light can be utilized to form a debris shield by a plurality of large, medium, and small fins attached to a mounting ring or hub or attached to each other. Device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a plasma EUV (soft X-ray) light source generated by a discharge and a main assembly of an embodiment of the system; 20 Fig. 2 shows an electrode for generating DPP EUV light. A schematic diagram of an embodiment; FIG. 3 shows an embodiment of a collector system for EUV light source, such as light that collects light from an emission cone from a light-generating plasma; Figure 4 shows a schematic view of Figure 3. A cross-sectional view of the glancing angle of the incident 11 1312644 operation of an embodiment of a collector shown; FIG. 5 shows an embodiment of the present invention including an electrode exchange system in accordance with an embodiment of the present invention; The figure shows a near-figure of the embodiment of Fig. 4; 5 Fig. 7 shows an embodiment of Figs. 5 and 6, in which there is a gate valve sealing mechanism adapted to replace the electrode; and Fig. 8 shows an embodiment in accordance with the present invention. A schematic diagram of a procedure for fabricating materials useful in electrodes of DPP; FIG. 9 shows a cross-sectional view of a center electrode (anode) 10 in accordance with an embodiment of the present invention; An embodiment A perspective cutaway view of an electrode assembly; Fig. 11 shows a close-up perspective view of a portion of the electrode assembly shown in Fig. 10 and a center electrode (anode) shown in Fig. 9; 15 Fig. 12 shows a top view of the electrode assembly shown in Figs. 10 and 11; and Figs. 12a to c are cross-sectional views showing the electrode assembly of Figs. 10 to 12, wherein the cross section is taken along lines AA, BB, and CC of Fig. 12; Figure 13 is a cross-sectional view showing the electrode assembly of Figures 10 to 12c, including a center electrode (anode) assembly; 20 Figure 14 shows one of the cold plate portions of the assembly of Figures 10 to 13, wherein the display is based on A cooling passage according to an embodiment of the present invention; Fig. 15 is a perspective view showing a debris shutter according to an embodiment of the present invention; and Fig. 16 is a view showing one of the embodiments of the present invention for manufacturing debris 12 1312644 Schematic diagram of the procedure of the shutter; FIGS. 17A to 19 show another chip 'shader according to an embodiment of the present invention; and FIGS. 18 and 18 are diagrams showing a type of production according to an embodiment of the present invention. A simulation model of a plasma clamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT Referring now to Figure 1, there is shown a plasma generated ("DPP") EUV and soft X-ray source 20 in accordance with one embodiment of the present invention. The EUV light source 譬 10 includes a housing 22 that defines a discharge chamber 24. For example, a pair of electrodes 26 may be sealed, for example, by sealing one of the walls of chamber 22, which may, for example, comprise a substantially cylindrical electrode, such as including an electrode 28, such as may be a cathode, and For example, the inner electrode 30 can be an anode, or vice versa, but the present disclosure will employ the foregoing. The inner electrode 30 can be insulated from the outer electrode 28 by an insulator 70 as shown in Fig. 2, and supplied with a very high voltage from a solid pulse power module 139 as shown in Fig. 7 and soon. When the time-pulse energy pulse is raised, it will, for example, generate a discharge between the electrodes 28, 30 via a plasma such as helium. For example, as shown in Figures 10 through 12, the discharge can be facilitated by activation of a pre-ionizer 206. 20 such a discharge can initially form a magnetic field extending substantially radially from the inner electrode of the pre-ionizer 206 and the insulator 70, as shown by 82 in FIG. 2, and then along the inner electrode (anode) 30. Surface 208 is more axially extended when transmitted, • as indicated at 84 in Figure 2. The axially extending magnetic field 84 forms a high-density plasma 匝 13 1312644 which is defined by a magnetic field 84 containing a source material such as ruthenium. The material 枓 S is passed through a source transport tube 6 such as input to φ, μ : Λ 4± The position of the clip and one of the main electrodes of the tip of the electrode 13 is in the center. The bungee (% pole) tip depression 34 is emitted from the plasma resisting clip by passing through an ionized gas such as the generated surface of the reflective surface in the collection (4). Miscellaneous particles such as particles or f-pole materials such as from the beginning of the period _ 4 « H % can be collected by the grazing angle of 譬 ~ 'heger 4 〇. The light focused by the collector 4 is also passed through a spectral purity filter in which (4) the focused light (9) I is collected as EUV light caused by the inversion of the focal point or the focal plane of the intermediate focus 42. The single-curved surface reflected beam generator is operable with the secret of substantially all of the light except for the 13.5 nm and 135 bandwidths. A form of an embodiment of the present invention includes a heat source on the collector 40, thereby generating a high EUV energy delivered to the intermediate focus 42 ® Figures 3 and 4 show a schematic view of an example of a collector 40 of the embodiment of the present invention in accordance with the present invention, in accordance with the present invention, a perspective cutaway view of one of the collectors 40. As shown in Figure 4, a ray system for tracking some exemplary restricted rays has a limiting edge 丨1 〇4, which is deleted into a grazing angle that can be incident:: Body: 104, 1〇 4, reflected from the portion 102a to the portion i〇2b, each of the shells 102 of the ', middle collector 40 has a first casing portion 102a and a first casing portion 10b, and portions L〇2a, l〇2b can be flat or curved. On the portion l〇2b 14 1312644, the grazing angle of the incident reflection focuses the light in the rays 104, 104' toward the intermediate focus 42. For this application, the light can be broadened and passed through a filter such as the spectral purity filter 50 shown in Figure 1. As shown in Fig. 4, there is only a very small volume, i.e., physical space, to support the thickness of each of the casings 102 and the package portions 102a, 102b. This will hinder the transmission of the adjacent casing as follows. By modifying the geometry of the casing, thicker walls can be used to increase the individual glancing angles, thus reducing the transmission efficiency of the design. For example, depending on the wavelength λ of the emitted light and the reflective surface material, portions of the light rays 104" and 104"' do not enter the entry cone of the collector 40 or an incident grazing angle of at least 10 (typically less than about 2). °) does not enter, so it is not collected by the collector. As shown in Fig. 3, the collector 40 can be constructed from a plurality of nested casings 102, each having a smaller diameter than the other outer casing. The casing may be formed by a plurality of sections, such as two sections 102a and 102b, wherein portion 15 102a is closest to the jaw portion 32. For example, each of the casing 102 portions 102a can be angled to reflect the light rays in a portion of the incident cone of light generated by the plasma incident on the casing 102 of the collector 40 and reflect the light to the portion 102b. On portion 102b, a further incident reflection glancing angle can occur, which can, for example, focus at the angle of intermediate focus 42 to reflect incident EUV 20 light. The casing 102 can be mounted, for example, to a collector hub 90, such as a collector hub extension 92 that may extend from the hub 90 along the axial length of the collector 40. A plurality of, for example, four radial brackets 94 are also attached to the hub 90. For example, each shell]02 can be connected to the bracket 94 by welding or brazing. The structure of the collector 40 and the mounting manner of the casing 1〇2 to the bracket 94 can be enhanced by collecting the smashing resistance 100 from a path 15 1312644. According to one aspect of an embodiment of the invention, the maximum thermal load that the collector 4 can expect to see is obtained. The geometry of the collector 4 and its composition 5 The shell 102 and its portions 102a, 1〇2b can be generated in such a way that, for example, only one of the properties required for the focus, such as focus, is achieved at this temperature. That is, at some known preselected temperatures, there will be a known geometry of the collector elements resulting in a desired operating parameter, such as a particular focus of the intermediate focal point 42 of 1; A heating element (not shown) may be attached to each of the 10 jackets 102 of the collector 4 or, for example, to the -9 and/or its extensions, and for example, regardless of the temperature of the collector 4 Which task cycle or repetition rate changes over time can be used to maintain this ideal geometry. This varying temperature may, for example, cause the jacket portions 1〇2a to flex and/or modify their positional relationship with each other. According to another version of an embodiment of the invention, 15 cooling can be utilized to maintain the desired fixed temperature, such as including a Peltier cooler (not shown) instead of a heater element, such as Kryotherm. A type of Drift 0.8 (40 mm ^ 2 ) made of 172 watts. In either case, the collector casing 102 can be equipped with a biomorphic piezoelectric actuator, such as the Model 20 PU22'140 series manufactured by Physik Instrumente, which can be brazed, for example. It is bonded to the outer surfaces of the respective sheath portions 102a, 102b. Applying a voltage to the piezoelectric actuator, for example, will distort the casing portions 1〇2a, 102b, thereby substantially altering the focal point of the casing 102, e.g., to the intermediate focus 42. According to one aspect of an embodiment of the invention, each of the casings 2, for example, can have 16 1312644 with two discrete portions 102a, 102b, each having its own for the other and for the hub 90 Curvature and / or angular relationship. The focus and the point can be maintained, for example, by changing the relationship between the two halves 102a, 102b along the optical axis. For example, depending on the degree of action required, such as using a positioning motor (not shown in Figure 5 or a piezoelectric element (not shown), this can be achieved, for example, via a telescopic section (not shown) coupled to the mantle of the casing 1〇2 ( Not shown) to mount the motor or bad electrical component, for example, outside of a vacuum environment. The casing 102 can be interconnected, for example, on the joint 106, such as by a thin connecting member that does not impede significant amount of light transmitted through the collector. Thus, for example, the use of an actuator as described above for the manipulation of the outermost casing 102, such as the joint 106, will have the effect of simultaneously manipulating all of the casings 102. According to another embodiment of an embodiment of the invention, The electrode can be quickly replaced, so that the electrode life can be changed to the "cost of ownership" problem. For example, the rapid electrode replacement assembly shown in Figures 5 to 7 can be used for this purpose. In one embodiment, since the bias voltage is, for example, from the reflective surface of the sheath 102 and, for example, toward the roughened surface, the sheath can be connected to a bias voltage (not shown) to enable charged ions of the same polarity. For the purpose of collecting impurities. 20 At this time, the EHF electrode life is the same as the life figure of the money film (4). Therefore, the replacement cost and the machine stop during the material replacement constitute the DPP EUV. The cost, the cut-off. The electrode % is positioned in - or in the large vacuum chamber 24 containing the collecting optics 4Q, the frequency (4) 50, the light and light member 32, etc. by breaking the vacuum chamber to 17 1312644 The seal is, for example, connected to the electrode 26, and the chain can be made different. If the internal chamber of the vacuum chamber 24 is violently exposed to the surrounding chambers such as humidity and uncleanness, the operating conditions are The time will be "" to (the influence of the right #士, B + field ^ also affects the overall performance ^ ring the cost of ownership u may also be difficult because the exposed vapor is attached to the inside of the chamber (four). Money makes the miscellaneous and water even in In a perfect environment, the volume required for the optical components required for 4 is about 5 to 1 minute. In addition, by adding extra:: straight: in addition to time, the pumping time is faster. But according to the selected u pump up to 10 15 20 $30KMls square 4 Each of the equations requires approximately $20 to the cost. However, it is possible to eliminate important downtime factors by pumping water vapor trapped in chamber 24. ...,; - Reality of the type _ by adding A sealed flange adjacent to the = pole 26 will eliminate the need for the container to be vented and resealed for subsequent pumping. However, this position is detrimental to the position of the sealed flange. The collecting optics 4 must be positioned (so the miscellaneous light member is positioned to be close to the hard clip 32 points. In addition, the area immediately adjacent to the blocking clip 32 may be subjected to a temperature exceeding the fineness, or is also susceptible to self-electrode during the illumination. The surface of the metal which is evaporated by the "can." according to the embodiment of the present invention, therefore, by using the - expansion joint m, such as increasing the tip of the electrode 26 and the like - such as the debris resist 36 The distance between the components 'by means of # replace the electricity (four). The telescoping section 122 may also have some utility for the following items: Applicants have observed optical alignment of the position of the baffle 32 which may vary (e.g., due to repetition rate and gas mixture), and thermal effects on the collection optics (e.g., collection) The deflection of the device 4G, the shadow 18 1312644 leaks and fills the chamber with dry nitrogen to prevent the formation of water vapor and surrounding debris. The components of the EUV light source 20 can be quite large and thus quite heavy. Individual segments of the vacuum handler 22 may weigh more than 4 inches. According to one embodiment of the present invention, by means of a module such as a vacuum vessel 22, the segment: the 32/DPP commutator 14G is independently mounted on a common linear actuator (not on, these segments can be Unlock and slide open to service as shown in Figure 7). Linear actuators provide dual use of the Valley Easy Module and alignment during reassembly during electrode replacement. 10 15 20 According to the embodiment of the present invention, the material of the pole 26 must be carefully considered, and the manufacturing technique and its specific structural type must be tested to the harsh environment in which the operation must be performed, in particular, _ Sexual and thermal load. Carbon Carbide SlC is an example of a material having advantageous properties according to the embodiment of the present invention, wherein S1C is adjusted, for example, for high conductivity. It is also possible to change two by adding a specific flaming impurity f: the conductivity of such materials and materials for the refractory gold material is described in more detail below. In addition to adjusting Sic and similar materials, for example, it is also possible to add light, such as titanium dioxide, to light oxygen (tetra), dioxane 2). Produced = Conductively doped ceramics, such as better than any metal can withstand the spray damage and thermal damage. In addition, the Tiw metallurgical metal composition ("c(10) him") may also have utility similar to SiC and related materials. Coffee beans are conductive and do not require metal doping to produce electrical conductivity, however, they have more limited thermal conductivity. If produced by vacuum heat, the TiW implement can be used well and optimally for use in accordance with an embodiment of the present invention. The alumina-titania, alumina-titanium dihalide (A1N_Ti02) system can also be useful for cryogenic systems. Applicants have found that the metal electrode 26, and particularly the inner electrode (anode) 3 〇 5, tends to tend to melt and/or ablate on the surface of the electrode 26, particularly near the jaw 32, i.e., on the anode 3〇. Since the Applicant has observed damage to the surface of the electrode 26 used, it is suggested that the plasma formed in the crucible 32 will transfer significant thermal and ion energy to the surface of the electrode 26, particularly the anode. Even tungsten-tungsten (W-Th) alloys are about 3,500. κ appears to melt and is easily splashed. 10 Covalent materials tend to be electrically insulating and more resistant to ionic damage. A doped ceramic such as Sic or alumina can be adjusted for conductivity and thermal conductivity. For example, SiC doped with BN will be at 2700. K decomposes and can be modified to have a thermal conductivity close to that of pure aluminum. The degree of BN doping in Sic may be as much as 30% by weight. Since the thermal shock resistance is proportional to the thermal conductivity of the material, the strength of 15 degrees and the fracture toughness, and inversely proportional to the expansion coefficient, the SiC-BN composite exhibits excellent thermal shock resistance. The thermal shock resistance of Oxidation is 2 〇〇.匸(△T°C) 'BN_Sic composite with 30% BN doping exhibits 630 to 120 (TC (△!"(:). Adjustable due to possible bulk conductivity of ceramics, adjustable) It is close to the conductivity of the surface of the 20 electrode 26. As for the alumina material, the surface conductivity can be enhanced by metal oxide doping (SnO, Ti〇2) without significantly negatively changing other advantageous properties of the material. To synthesize SiC-BN or alumina-titania system. Plasma spray or liquid phase sintering can be used for the mixed source powder. 21 1312644 t can be changed to a particle-enhanced CVD growth private sequence used in Kauai. In order to obtain the best material density and it is important for electrodes that do not crack or explode. For example, please see the available literature and information.

Trex Enterprises' web page. Since Trex's program is completed at low pressure (1 Torr), the electrode will have a relatively low dissolved gas and a high density. Trex '

The SiC material is close to ι〇0% dense, which is ideal. This procedure is schematically shown. The SiC BN retort synthesis via particle-enhanced CVD is shown, for example, in a schematic representation of Figure 8, which is, for example, 1 Torr. In the reduction environment of ruthenium, thermal decomposition of ruthenium methyl decane (Methly_Chl〇ro 8 such as 1^) 140 on 61^ particles 142 occurs when a Sic surface 144 is present by a Mcs in the presence of Η2. Other synthetic methods such as alumina _Tiw: A) sintering in a reducing environment to form a non-ideal proportioning oxide on the ceramic surface, ie, its oxygen is insufficient and conductive; B) placing the alumina in the titanium dioxide And sintering and diffusing 15 together; c) depositing two materials of alternating layers, then grilling the system at > 1900 ° C or D) vacuum hot pressing because the hot press of the refractory metal may contain high The solubility of the dissolved gas, so it can be used for pure %. The degree of dissolved gas in Lu will promote electrode erosion and volcanic eruptions in the metal electrode. Referring now to Figure 9, there is shown an electrode 26 (e.g., an anode 3) which may, for example, be formed of doped alumina or Sic_BN and may also be untwisted TiW. Outer surface 150. An electro-plasma focusing source 20, such as that used for micro-lithography for EUV discharges, also raises other requirements regarding electrode 26, particularly with the cooling and manufacturing requirements of 22 1312644. Figure 2 is a schematic representation of a coaxial electrode set of one of the cathodes 28 and an anode 30, such as a high average heat flux (> 1 kW/cm 2 ) and a very high transient heat flux during pulsed operation. Quantity (> 1 MW/cm 2 ). This may be desirable, for example, in conjunction with the best available cooling techniques for the use of metal and special alloys, as described above. High vacuum and structurally complete joints may also be required between different metals having different coefficients of thermal expansion. Referring to Figures 9 through 16, an embodiment of the invention including an electrode assembly 160 is shown. The electrode assembly 160 can include, for example, a cathode (outer electrode) assembly 162 10 and an anode assembly 220. Applicants have tested cylindrical anodes 30 (internal electrodes) in a number of geometric embodiments having different outer diameters. The smallest cooled device tested had an outer diameter of 0.625 inches and tested with the other with an outer diameter of 0.725 inch. It is conceivable that larger electrodes with an outer diameter of 1" or larger will be required in the future. However, since the heat flux is distributed over a large area, cooling of larger electrodes may be less difficult. 15 However, at larger diameter electrodes In this case, the bonding between different metals will become more difficult as the temperature has a larger relative dimensional change during manufacturing and operation. Conversely, smaller diameter electrodes may be easier to manufacture but more difficult to cool during operation. In general, this design will be made more complicated by the need to transport a plasma source such as a gas through the center of the electrode. It is expected that the gas will be in a solid state or in a liquid state. The electrode 26 can be used. And together with the delivered plasma source as a consumable, and therefore also cost sensitive. In general, a combination of brazing and fusion welding techniques can be used to assemble an electrode of the type contemplated by an embodiment of the present invention. Bonding type 23 1312644 and manufacturing order depend, for example, on the specific design. If possible, use fusible stainless steel such as 304L or 316L. The electrode assembly is fabricated to 16 〇. This can, for example, maintain low material costs, simplify machining and assembly, and improve the yield of the finished product. Due to the high surface temperature transient, the electrode 26 can be completely as a 5 such as a crane or its pseudo alloy. Made of refractory metals including W-Cu, W-La, W-Th and W-Re. However, this will result in a brittle refractory metal with a ~4.5 ppm/t: low coefficient of thermal expansion (CTE) bonded to, for example, ~16.6 Ppm/t: Problems with steels such as higher CTEs. "This joint may need to be compatible with high vacuum and can withstand internal coolant pressures of more than 1000 psig at the same time. Due to the need for 10 machining in tungsten, for example, even using so-called “Mechanical processing, the deep annular cooling path that can not be screwed or milled normally, will make this design more complicated, so it must be generated by using discharge machining (“EDM”) and grinding program. . Most components require high precision machining, and proper and uniform cooling of the stone electrode assembly 160 can meet the increased requirements such as tight 15 limited cooling volume. According to one aspect of an embodiment of the invention, the applicant currently desires to use a brazing method for the steel joint, such as in a vacuum oven having a pressure range of 1 to 6 Torr, such as ~1000°. Gold and nickel alloys at C temperature, such as NIORO® (82〇/〇AU-18%Ni). Because gold can wet tungsten well and has a high ductility, such as causing lower residual stress in the joint, it has been gold. The particular joint design according to one of the embodiments of the present invention allows the steel to be provided with tungsten for the tungsten. During furnace heating, the more rapidly expanding steel will cause the rotation to produce elastic-strain from its inner diameter. This has the dual benefit of reducing the residual stress in the tungsten, for example, while cooling, and also accurately centering the tungsten in the steel ball. Lower residual stress is important for avoiding tungsten cracking. Another possible technique for the metamorphosis of the present invention is copper back casting. The Applicant would like to see a procedure involving the pouring of molten oxygen-free copper around a billet of a metal-resistant electrode. The finished component can then be machined from the resulting assembly. Although oxygen-free copper has a CTE of 17 ppm/°c, it is soft and malleable with only a 10 ksi drop stress (~25% of Vostian stainless steel such as 304L), so it can locally fluctuate at the joint and The compressive stress on the tungsten is reduced. If it is necessary to further reduce the residual stress, it can be annealed subsequently. A particular advantage of this procedure is the good vacuum and structural properties of the bond. This combination produced by this program, for example, is less likely to have a leak condition that would otherwise be a problem with the braze assembly. The main lack of adhesion of this technology lies in the lack of strength of copper. The gongs do not cope well with the high local support forces exerted by the thread details or metal seals, and their type according to an embodiment of the invention is considered to be important to the present application. However, the town has been carefully designed to avoid such problems, and the Applicant believes that such problems would not limit the use of this technique to fabricate DPP EUV electrodes in accordance with an embodiment of the present invention. Piansee and its US subsidiary, Schwartzkopf, and other unit systems 20 are sources of supply for joints made according to the procedure just cited. Tungsten electrodes having a hard-to-steel greater than ~0.75" outer diameter may have a high risk of cracking due to residual stresses in the joint interface. A technique for avoiding this phenomenon, such as use in joints, is a transition insert. The material selection of the transition insert, for example, may require a CTE close to tungsten but also a good 25 1312644 ductility to better cope with materials such as higher stresses that would eventually occur at the boundary with the steel. Good machinability In order to be of a useful nature, according to one embodiment of the invention, since the molybdenum can meet this discriminating criterion and can be brazed well by similar techniques, the applicant would like to make the appliance 5 have 5.35 ppm/°. Molybdenum of CCTE. This would be particularly useful for larger diameter tungsten electrodes, and it implies the use of this concept in engineering. According to an embodiment of the invention, the electrode assembly 160 can be ordered - The outer electrode assembly 162, the outer electrode assembly 162 may have an electrode connected to an electrode assembly 1 mounting flange 166 for mounting the electrode assembly 160 to the SSPPM 139 with mounting screws 168 Side wall 164. The generally cylindrical side wall 164 can be coupled to or integral with a circular cold plate 170 in which a central opening can be machined to insert a cathode substrate 21 and a plurality of cooling passages 172, 174 and 214, 216. The outer electrode (cathode) substrate 210 can be machined therein with a plurality of cooling 15 passages 184 and inlet tube 182 openings and outlet tube 180 openings, such as four passages 184 and each having an inlet Tube 182 and an outlet tube 18 are used to cool cathode 28. Coolant can pass from a coolant inlet 173 to an inlet plenum 172, and inlet plenum 172 is coupled to a pair of opposing inlet plenums 176 and 178 ( Shown in Figure 12c and in the drawings. The two long tubes 180 are each connected 20 to the inlet plenum 176 or 178. The two short tubes 182 are each connected to a respective passage 184 and connected to a An outlet plenum 214 or 216, each outlet plenum 214 or 216 is coupled to a coolant outlet 175. The cathode substrate 210 can also be machined to include a central opening 218 for forming the cathode inner wall 163. 26 1312644 Electrode assembly 160 Materials and The electrode (cathode) assembly 162 and the inner electrode (anode) assembly 220 may be of the stainless steel type 3〇4L, except for the anode 30 made of sintered tungsten or the above materials. The separator 256 and the inner wall 25〇 and 254 The separation distance between the points encountered on top of the electrode 30 may be an important 5 size and must be selected based on the coolant flow required to provide proper cooling between the separator 256 and the electrode walls 25A, 254 through this point. According to one aspect of an embodiment of the invention, the anode 30 can be cooled by a simple open path cooling arrangement, such as in which a coolant stream is formed by an anode 3 of a hollow interior 252 having an electrode 30. The inner wall 250 of one of the inner electrodes 1 (anode) 30 and then the other inner wall 254' of the inner electrode (anode) 3 可能 may be assembled by arranging a heat pipe partition 256 on the inner wall 250 in the hollow interior 2 Between 254 to facilitate this role. Heat transfer can be achieved by convection at the boundary between the inner walls 25, 254 of the electrodes and through a coolant between the separator 256 and the inner walls 250, 254. The Applicant has determined the most pleasing thermal results achievable in this application, such as flowing coolant onto the inner inner wall 254 and down the outer inner wall 250. In addition, the consideration factor is, for example, a thin-walled (〇._,) partition 256, which can separate the inlet of the internal electrode (anode) 3〇 cooling system according to one of the consistent embodiments of the present invention, and is used by itself. The discharge passage 27 of the heat exchanger passing through between the cooling inner electrode 3 and the outer side wall 250 is guided to a passage between the partition 256 and the inner inner wall 2M. In accordance with an embodiment of the present invention - for example, to avoid buckling, the baffle 256 may be loaded with tension due to cold agent pressure rather than pressure, and it is the result of the flow path just described. This solution, for example, can also have a design with a full relief strength of materials such as 3〇4l 27 1312644 that can utilize the partition 256. Applicants have tested a prototype electrode 30 that utilizes this cooling method and has a flow rate of up to 37 lpm and > 80 psig entry pressure. Applicants believe that this design may, for example, be able to withstand inlet water pressures well above 1000 psig and higher and heat loads corresponding to source plasma discharge repetition rates of more than 3 kHz 5 and higher.

However, according to one embodiment of an embodiment of the invention, the annular passage may, for example, require a heat transfer coefficient in the south, for example, exposure to a limited area of the coolant, for example, may require efficient heat transfer and thus require high heat. Pass coefficient. And 'in accordance with a version of the present invention, such as the ancient 10 temperature on the inner walls 250, 254, for example, would require high pressure to deliver a high flow rate of coolant to, for example, inhibit the boiling of the coolant, particularly the flakes of the flakes or blocks. Non-nuclear boiling, which can actually improve heat transfer from the inner walls 250, 254 to the coolant. According to another version of an embodiment of the invention, Applicant uses a porous metal heat exchanger in the hollow interior of the 119 pole. In this embodiment, for example, particularly in the tip region of the jaw opening containing the electrode 30, a porous metal medium can be bonded, for example, to the inner walls 250, 254 of the electrode 30, for example by brazing. This will eventually lead to the anode 2〇 - large

Extended fins for cooling. The conductive heat (4) from the inner wall 25A, 254 into the extended porous surface area is more comparable than the simple wall 20 that traverses the annular passage. The extended porous surface can have, for example, a much larger area from which heat is dissipated into the coolant. The result is, for example, the use of less coolant and better heat transfer. This structure can also replace the possible defects of the separator 2$6 and the inner wall 250, 254 porous metal heat exchanger in the integral hollow portion 2 5 2 of the electrode 3 譬, such as the possibility that the 28 1312644 is inherently high across the porous medium. Pressure drop. At high source repetition rates • Xiao, this # would have a high population pressure and cause large mechanical stresses in the hard-discharge joint and only in the flow separator associated with cold pumping, m = , review. Another possible defect is, for example, due to the fact that the heat transfer into the coolant is increased, the temperature across the electrode wall is lowered, and the temperature across the electrode is lowered, and the temperature across the electrode is lowered, and it is generated across the electrode 3〇. The height of the wall: # ° 〜, φ The degree of stress of the rider may lead to structural failure of the electrode sheath wall of the electrode. The criterion for the design of another design may be, for example, an alternating stress in the wall of the electrode 3 of the electrode 3 due to the operation of the electrode 3 in the burst mode, which may have a different result than the static stress load. This has led to the need for electrode slabs to have tensile strength and sharpness. For example, in different operating methods, including factors such as repetition rate, Ε 、, task cycle, etc., the heat flux distribution incident on the % pole is also determined as the electrode 15 factor. Bran and 4 test ', ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, In ruin. Another possibility, according to one embodiment of an embodiment of the invention, such as the use of a porous copper foam from Porvair, a porous steel bead, such as a dischargeable electrode 30, can be discharged. Machining 20 ("EDM") machines, &, Festling Iron Processing & Moths are processed to have r) biosystems for applications in accordance with embodiments of the present invention. Another type of embodiment in accordance with an embodiment of the present invention can be used at 2 °, such as by electroplating or ion fusion techniques, to uniformly deposit silver onto the upper, dry, and optimal braze thickness. This approach, for example, achieves the full potential of porous metal cooling as described above for the inner neighboring brothers (electrode). 29 1312644 According to an implementation of the present invention, you can realize the A:g卩,~ type, for example, the micro-channel can be used to solve the heat-passing cold portion. According to this embodiment, the force will be sent to the cooling age. After the road, micro peach. ^, These channels may be, for example, tubular or long and the overall size of 5. In this configuration, the path # 〃 G.G2G or less may be in the system, and similar to the target 2 (four) in the ratio of cooling accumulation, high heat flux "sub-components and power semiconductors / 卩 卩 laser diodes and other cooling The electrode of the invention is 3〇. Shen, person (4) can use this technology to test the prototype micro-secret cooling ^^ up to 2 kHz repeat 10 15

However, the technology is far more repetitive and believes that this cold rate can be utilized. However, this technique does exhibit a pressure drop of == high and may also be stress-tight during the operation of the source section - the relatively hard micro-channel insert is brazed to the hollow portion of the axillary anode 3G This may result in additional beam limits and stresses in the anode assembly as described above, which must be considered in the overall design.

As shown in Figures 10 through 15, the outer electrode (cathode) 28 can include a cathode assembly 162, such as a generally annular shape. The cathode 28 itself may have within the cathode (four) 162, for example, facing the inner electrode 30 and, for example, from the 〇19吋 of the substrate to the gap of 0.46吋 of the upper edge. The form of a conical inner surface 163. The upper edge can be covered by a cathode cover 212. The outer electrode (cathode) 28 can be much larger than the inner electrode (anode) 30 and thus is relatively easy to cool. According to an embodiment of the present invention, the erosion of the outer electrode 28 may be less problematic than the internal electrode 30, so the material selection and manufacture are also relatively simple. Therefore, the additional electrode (cathode) 28 may not be regarded as a consumable. 30 1312644 According to the embodiment of the invention - (d), the outer electrode (cathode) 28 can be made, for example, of GUdco^ALM, which is a special oxide dispersion obtained from OMG Metals Inc. Reinforced copper, according to the present invention, is selected based on its thermal conductivity and electrical conductivity, and which, for example, combines good mechanical strength and reasonable machinability. The (four)-8 external electrode 28 can be brazed to, for example, 3 in the steel substrate 210. The substrate 210 may, for example, be interfaced with the electrode 28 having a portion other than the portion of the pulsed power unit 139 shown in FIG. Applicants have used the use of a recording base alloy to braze the outer electrode 28 to the substrate trace. This nickel-based alloy is, for example, Nibsi® from Morgan Crucible c(6). Recently, the (4) brain brazing material obtained from Morgan Inc. has been used, and it is also used for the hard glow of the internal electrode. As described above, similar brazing preparation and stove procedures are used for the internal electrode as described above. > The above, relative to the money, the external electrode 28 has a larger size and uses a high-heat-conducting material, so that the cooling work is simplified. A relatively large open-channel water channel 184 can be mechanically completed into a fairy- 8 external electrode 28 The body 21〇 can be supplied and discharged, for example, via a rat fitting formed, such as by brazing into the opening in the body 21〇, and also connected to the inlet manifold 214 and the discharge manifold 216 In accordance with an embodiment of the present invention, for example, four or more such tunnels 184 may be provided to break the coolant flow of the average sentence, thereby providing more uniform cooling at all locations. 214 and exit plenum 216 (more Finely shown on the 14th clear inlet and discharge fittings to have similar flow resistance 31 1312644 for each tunnel m' thus causing a similar cooling dose to flow through each. The applicant according to the invention is expected to have a high The coolant flow rate and sufficient back pressure to prevent 'Furton's open path m as described above is sufficient to cool the external electrode Μ. _ · $ and 'If necessary, for example, using the above porous media or micro path cooling. In accordance with one embodiment of the present invention, for example, a full-plate cold plate 170 can be included and machined into the top surface of a 3〇4L cathode assembly 162. The flow path of the cold plate 170 (more in detail Illustrated in Fig. 16) may include, for example, the actual inlet manifold 214 and the exhaust manifold 216 for the electrode 28. This effect may be achieved, for example, by cooling a pulsed power output that may be located below the electrode assembly 160, for example. The switches 1% are not shown) and are also used to equalize the flow to each of the cooling tunnels 182. For example, passages such as 214, 216 may be milled into the top of the cathode assembly 162 and may also be welded, for example, via fusion welding. Densify The outer electrode 28 may be opened by a cooling passage wall for forming the cooling tunnel 184, and a cathode cover 15212 for sealing the coolant tunnel 84 may have been stewed to its top end and cathode substrate 210. The assembly 163 can be joined to the anode assembly 22 by screws 231 and can be insulated from each other, for example, by an overlapping central insulator 222, such as pyrifiable boron nitride or Made of alumina and ## extending axially along the outer wall of the inner electrode 30 and extending a section of the non-elastomer 20 electrode insulator 224, the elastomer-free electrode insulator 224 may be made of pyrolytic II fossil or oxidized | An insulator clip 242 and its set screw 244 are held in position. The seal can be sealed by a pair of non-elastomeric metal c. The ring 230 provides a seal between the insulator 224 and the cathode substrate 210, one of which is: - between the rim body 2 24 and the cathode substrate 21 且 and one Located between the insulators of the blood yang 32 1312644 pole assembly 220, and inserted into the respective opposing grooves. According to another version of an embodiment of the invention, it is believed that debris reduction is an important consideration for long-acting DPP EUV sources. According to one embodiment of the invention, the central electrical poles 28 of the plasma EUV source produced by a discharge can be made of a material which is high temperature and possibly fire resistant as described above and may also have a strong magnetic permeability. Sex. According to an embodiment of the invention

10 15

In this type, the smudm from the electrode 30 caused by the plasma bombardment 'surface melting or ablation, surface boiling, etc., may also have significant magnetic properties. According to one form of the invention, Applicants may envisage generating, for example, at least about 50 millitesla ("mT") and, for example, 5 光 in the optical path between the locations of the plasma and the optical elements such as the collector. A moderately large magnetic field in the range of mT to 1T. In this way, for example, the chips can be deflected and then quasi-permanently collected, for example, by static magnets (not shown) placed appropriately in one of the perimeters of the optical path. According to one aspect of this embodiment of the invention, the collector magnetic field can be generated, for example, by an electromagnet, in this case 'for example, the debris can be swept during a regeneration cycle, and during this time, for example, the electromagnet can be deactivated . A suitably cooled high temperature refractory magnetic metal can be a drill. According to another embodiment of the invention, it is desirable to use a current pulse for the electrodes 30, 28 to be shaped by the magnetic Μ ^ Μ & % peak at the discharge, such as in a compression active component (electrical source) h optimally enables n to include an additional saturable inductor in the final stage of the DPP DDPPM, according to the embodiment of this embodiment. - Possible optimization waveforms, for example, can start from a moderate current in the axial reduction phase and then peak in the radial compression phase. 33 1312644 5 15 20 Yes, ', and two use—a kind of slightly more than the geometric structure of the micro-money, the power of the figure. However, this simulation: the details of the embodiment are as follows: the details of the embodiment are sufficient to understand the dynamic process of the % of the hair. The simulation invites employees to obtain the current SSPPM for the products of Digong, Shen Rongru, and discharge materials. The heart and the final stage of the compression term can saturate the electric star with a inductance of 6πΗ, and its approximate power can have a state of Μ _ reading material, what structure is the target to achieve - k low county is called the fastest possible for crossing the electrode The discharge, the H-liter time of the discharge pulse, this simulation is shown on the time scale for illustrative purposes. For example, the first /, τ lengthening. If the brother 1 is not, first use 12 η Η = = - the additional saturable inductor is switched on to quickly reach " Η one of the total inductance is similar to the simulation, put about 20 recognition The pavilion is gently raised to _KA in the back, and the sensation is as high as h. 'At this time, according to this, Makizaki’s secret is clear to the clerk = then to the 约 in the covenant. The axial reduction in the discharge During the phase, by the peak capacitor across the electrode, that is, from about 5〇nS_24Gns in the simulation of the i8a diagram, the discharge is generally horizontally disposed on the inner surface of the outer electrode 28 and the inner electricity _ ❸ 表面 surface m (four) Increasing the angle ^' until the arrival of the inner electrode 30 is summarized in the region of the tip end portion 34 of the inner electrode 3 adjacent to the recess_lowest extension portion, the action of which causes the discharge at 2, such as 82, and the county (10) The material is moved to the tip of the electrode 26, and a small current is required to maintain the discharge of the transition. During the radial compression phase, as in the simulation of Figure (8), 240 appears to be between 260 ns, when the plasma is formed in electricity. When the pole 26 is shot 34, the discharge is fast in terms of fluid flow to the electrode 26.

34 1312644 is rapidly increased, which, for example, rapidly transfers a significant incremental amount of kinetic energy to the plasma via, for example, a rapidly increasing magnetic field for defining the plasma, such as to result in a better • clamp 32. This is shown in Figure 18B in a further simulation. Better jaws • There are several advantageous properties, such as keeping the active source gas ions in the clamp for a longer period of time, for example, inducing greater energy transfer to the ions, such as causing more X-rays from the clamp 32. With the increase in compression, the shape of the delivered current can, for example, be allowed to have a current greater than 3 ® to 5 times greater than the current during the formation of the clamp during radial reduction, but overall, the electrode is from the SSPPM The peak capacitor dissipates the same amount of energy, so the thermal energy budget in the electrodes 30, 28 is also maintained during the overall pulse, which is not different from the conventional discharge shown in the simulation of Fig. 18a. Conventional saturable inductors, for example, can be included in the SSPPM 139 compression head circuit, such as twice as much as currently known and inductive, such as 12 nH as shown in the simulation of Figure 18A, and can be saturated in the usual manner. . An additional saturable inductor, such as 15 in parallel with a conventional saturable inductor to make the shunt inductance smaller, can then be biased to saturate, as shown in the simulation of Figure 18A, such as increasing the final termination of the discharge. The discharge current is shown in the simulation of Figure 18a. The applicant's simulation of the plasma fluid using the simulated software has confirmed the advantages of the proposed driver configuration. According to another aspect of an embodiment of the present invention, it may be desirable to use a source gas such as helium to generate a specific EUV light such as 13.5 nm, but it is also capable of highly absorbing the same light. Light that is sufficient to interfere with the overall • produces an output. Therefore, applicants may wish to use a buffer gas such as argon and helium that is less absorbing for the light produced by the ideal λ, and 譬35 1312644, such as from the EUV light generating container, to differentially remove the source gas and buffer. The gas according to an embodiment of the invention can be configured for a higher level of a source gas such as gas - the turbine is not shown, while reducing the pumping energy with respect to: argon and helium. This can be achieved, for example, by changing the operating characteristics of the pump, such as internal clearance, 5 blade angle and speed, and also eliminating the pump's Holweck (molecular resistance) phase. Therefore, the turbomolecular pump can be designed to preferentially pump a higher atomic weight such as gas (or molecular weight as required) with a much lower molecular weight gas than, for example, a molecular velocity based helium. )gas. 1 〇 Referring to the 15th®, the debris shutter 300 according to the embodiment of the present invention is shown. This chip blanker 3 简化 simplifies the manufacture of the chip shutter 3 (9) and still achieves a functional solution to prevent debris from the source from reaching the collector mirror. In accordance with this embodiment of the invention, simplified manufacturing techniques can be employed to fabricate the debris shutter 300, for example, while being more cost effective than other proposed manufacturing techniques such as those used to fabricate 15 columnar structures. The fabrication structure and technology also relaxes the range of materials that can be used to create this simplification of the manufacturing process. The chip shutter 3 according to this embodiment of the invention may be designed, for example, by a coplanar layer 302, such as by arranging the coplanar layer 3〇2 such that the photon 20 is like a columnar structure The plasma source 32 emits and leads to the collector 40. The debris will need to be piloted through these layers 302 to reach the mirror of the collector 4〇. It will be utilized to monitor how much debris actually can exit the outer surface of the debris shutter 300 formed by an outer surface 306 of the outermost layer 302 (i.e., the outermost surface of the plasma clamp 32) to determine the desired layer 3 2 numbers. 36 1312644 - Each layer 302 is comprised of -(d) of the respective layers 302.复: a plurality of lights extending between an inner surface 308. The respective curved outer surfaces 3 〇 6 of the respective layers 302 may be located at the electrical-around = 10 15 points, and the middle of the 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬The —-fixation command controls the beam to position the discharges at a point that is dynamically determined from the position of the actual electro-convergence (eg, pulse pulsation), such as in each = the arc 316 may be a focus in focus The circular arc on the top. Each of the door faces 3〇8 may have the same or similar centering at the same focus. The inter-center arc differs in that it has a smaller radius of curvature depending on the thickness of layer 302. The significance of the surface being coplanar is that the two axes of rotation may remain the same as in the overall structure, that is, from the outer surface of the layer to the inner surface of the layer to the outer surface of the layer facing the clip 32. the same. The outer surface 306 of each individual layer 302 can have, for example, an arc 318, such as an ellipse at the first focus, a circle or one formed with the arc 316, and having an arc 316 for forming. The concentric circles in the center of the circle coincide with each other. This can be determined, for example, by the shape of the collector mirror used by the collector 40. 〆 Each of the light tunnels 304 may have a uniform shape between the outer surface 3〇6 and the inner surface 2〇308 in each layer 302, or may be pushed toward one or both centers containing the shapes of the arcs 316 and 318. The layer may be formed of a metal such as titanium or tungsten, a ceramic or refractory metal such as Si 2 , alumina α 〇 2 or titania, or other ceramic metal composition. Port 37 1312644 According to another version of this embodiment of the invention, there may be a gap between the layers 302, as shown in Fig. 15. The individual layers 302 can be attached to each other 5, for example, by connector posts 320 that may correspond to each of the four corners of the light tunnel 304 in the overall interface space between the respective layers, or by periodically separating the connector posts 320, such as Figure 15 shows. As also shown in Fig. 15, layer 302 can be divided into segments, such as having the overall dimensions shown in Fig. 15 or subsections such as segment 330 shown in Fig. 15. In this manner, for example, a fully rotating solid body can be fabricated to fit around or substantially all of the plasma clamp focus 32. 10 The debris may fall to the bottom of the shader 300 rather than accumulating in the hole of the proposed design. Debris removal can be an added feature, for example, to allow for longer intervals between replacements. It is also understood that the debris shutter 300 can be formed, for example, in an opening in each layer 302 or between adjacent layers 302 (if such openings are present) along an arc 316 or 15 318, such as an opening formed by opposing sidewalls. 304. That is, the passage 304 does not need to have four walls 312 and still provides sufficient debris resistance and a sound structure, but for example, it would be advantageous to manufacture and/or facilitate having a part of a circle and being like a body. A chip shader 300 of arc 2 = 316, 318 which is part of an ellipse. 20 Referring now to Figure 16, another embodiment of the present invention relating to the manufacture and construction of a debris shutter 400 is shown. Figure 16 shows an example of an "defocus laser machining" technique such as that used to make DPP or other EUV debris shutters, such as a light transmission channel that focuses to a focus, or a push-out with a common focus. Other applications of array structures. 1312644 Push-up = cover, 4°, if possible, need to point to - common focus 4〇2 ^ 5 * Yes - unfocused laser beam with high enough laser

10 = to cut the laser machine plus h for this, the towel has been found, for example, can be used behind a grid of material to use the 1 line mirror to produce - the debris cover (four) and its channel forward. In the configuration of the first level, it can be as good as: using the XLA double-chamber configuration laser processing of the applicant's assignee to provide the laser power for the defocus laser mechanical reinforcement, such as high laser power and short The field wavelength. The general construction shown in Fig. 16 may include, for example, a parallel laser beam 41 入射 incident from the right as shown in Fig. 18 (not necessarily all parallel). The laser beam may, for example, be first incident on a mask 406 that may be a lattice or a perimeter, such as to create a square or circular path. A mask made of W or Mg, for example, may be coated with a reflective coating on the side facing the laser beam 41, such as a film to enhance reflectivity and to prevent the mask 406 from being lasered. The beam 41G is deteriorated. The mask can also be tilted slightly to avoid reflection back into the laser amplifier/oscillator. Also, if the ''circumference (not shown) is made of a line having a circular cross section, the reflection problem can be reduced. The lens 404 or, more generally, the focusing optics may, for example, produce a convergence beamlet 414 that is an array of ones of the required push rates. A workpiece 420 can be, for example, a segment that is constructed or positioned to have a spherical solid body at the center of the focus 4〇2 20, which can be placed at the correct distance between the lens 404 and the laser focus 402. Even if the intensity of the laser beam 41 譬 is not sufficient to mechanically machine the overall debris shutter 400 once, for example, by using a scanned laser beam that traverses the mask 406, it may have the desired effect. That is, the overall construction of the masks 406, 404 and the workpiece 420 39 1312644 can be moved laterally and vertically in front of the laser beam 410 as shown in Fig. 16 and, for example, the passage can be machined continuously. For example, scanning above the overall surface of the control workpiece can be made faster than the passage 412, so no additional stress is induced in the workpiece portion due to partially completed drilling. In order to make the scan reproducible, it can be motorized and/or controlled, for example, by a piezoelectric actuator for driving the lateral movement of the overall construction 404, 406, 420 relative to the laser beam. . Alternatively, the laser beam can be scanned across lens 404 by, for example, a biasing optical device (not shown) for controlling the direction of incidence of the laser beam and the focus of the laser focus (not shown). The laser beam 410 10 can be controlled to have a high enough intensity to be sufficient to ablate the workpiece even when out of focus, while not damaging the lens 404 and the reflective mask 406. Therefore, in most cases, the short (ultraviolet) wavelength such as the laser beam 410 is most suitable. Applicants believe that it is a better way to place the mask 4〇6 in front of the lens 404 as shown in Fig. 16 to avoid damage to the lens by the laser sputter material from the mask 406 being incident on the lens. Sputtered materials are often emitted in the direction of incident laser light. Another option, such as increasing the laser intensity on the workpiece 420, may be, for example, a femtosecond laser machining using a 745 nm or 772 nm Ti-sapphire laser, and for example increasing its subsequent frequency to three Multiply or quadruple and then amplify this pulse using, for example, a KrF or ArF excimer laser discharge laser 20 amplifier. According to another aspect of an embodiment of the invention, an electrochemical reaction can be utilized to effect debris removal. Applicants would like to see that tungsten can be directly reacted with fluorine F2 or a fluorine-containing molecule such as nf3 at room temperature to form tungsten fluoride WF62. In accordance with an embodiment of the present invention, a source gas can be combined with a halogen gas such as fluorine or gas to form, for example, a metal halide, thereby removing excess tungsten atoms from the source 30, such as from tungsten electrode 30. In one example, for example, in the presence of reactive halogen gases, unwanted impurities • particles such as tungsten atoms, ions, and clusters are similarly evaluated. 6 or \^(:16, etc. Reaction of molecule 5 to form a volatile gas. In sharp contrast to pure tungsten particles with high adhesion on solid surfaces such as collector optics, these molecular compounds are on solid surfaces. It has a very low adhesion rate and is therefore preferentially pumped and removed from the container. For example, inserting this volatile gas from the output light emitted by the EUV plasma source can provide a tungsten atom that may be 10 undesired. An environment in which an increased atom collision occurs with the "washer" halogen gas. This can then, for example, cause the tungsten atoms to combine with the gas to form a compound such as tungsten fluoride WF6 or tungsten chloride WC16 and remove it from the container. According to another aspect of an embodiment of the present invention, electrode life and/or replacement cost can be increased in a variety of different ways, such as by including a threaded connection on the outer wall of the electrode and on the anode assembly 220. So that the inner electrode 30 ® is made into a screw shape. The electrode 30 can be made, for example, continuously supplied by an external device, such as an accessory that extends through the wall of the container 22 and It can be threaded for electrode movement over time and provides a tortuous path for the 20 pressure seal of the container. The electrode 30 can be mounted on a sleeve having a corresponding thread. The electrode 30 can be replaced by a plurality of electrodes For example, the plurality of electrodes are arranged in an array and grilled to share a discharge pulse or, for example, burned one by one, or wait for a period of not being grilled and then placed in a discharge circuit. The shape of the electrode 30 can be selected to have a longer length. Lifetime. Thermoelectric cooling may be utilized instead of 41 1312644 water cooling. Referring now to Figures 17A to ,, another debris shutter in accordance with an embodiment of the present invention is shown. Figure 17 shows a pattern in accordance with an embodiment of the present invention. A perspective view of a debris shutter 450. The debris shutter 450 can include a mounting ring 452 having an opening 5 that defines a portion of a spherical surface that extends from a source of plasma that is in focus. Extending and covering a collection opening, such as approximately 1 to 2 steradian. There may be a valley 454 at the center of the opening, the hub 454 having a sidewall containing the groove 455 and, for example, facing the coke The mounting ring 452 can also have a slot 453 (as shown in Figure 17C). 10 A plurality of thin long fins 456, such as about 0.25 cm thick, can be snap-fitted into the mounting ring 452 or hub 454, respectively. Slots 455 and/or 453. Please understand that 'may only need slots in one or the other of mounting ring 452 and hub 454' and/or the slots may be a plurality of short slots instead of as shown in Figures 17a and 17D A slot extending through the length of the hub 454 and may be associated with a particular long fin 456 to be positioned around the hub 454, such as each of the long fins 456, which may have one or more outer surfaces along the valley 454. A particular slot that is radially and vertically displaced can engage a particular length of Korean 456 and can only engage the long tab 456. Similarly, the groove 453 on the mounting ring 452 is also established. Between the long fins 456, according to one embodiment of the present invention, 20 forms a group such as five fins and is composed of, for example, two long slits 456, one for example, adjacent two The middle fin 458 between the long fins 456 and the two short fins 470 are formed, wherein each short fin 470 is interposed between the middle fin 458 and the adjacent long Korean sheet 456. As shown in more detail in Figure 1.7E, the long turn 456 can have an intermediate 1312644 chip receiving groove 457 and a short fin receiving groove 459. Then, the intermediate tabs can have a long Korean sheet 46〇 as shown in Fig. 17, and the long Korean sheets can be joined, for example, to the adjacent long fins 456--the respective intermediate label receiving grooves "?. For example, a 5-pair wafer 470 can be mounted between the intermediate fin 458 and the adjacent long fin 456. Each short fin 47 can have, for example, a short fin signature, and the short fin signature can be The mating type fits into one of the short fin support receiving grooves 459 of one of the adjacent adjacent long fins 456. The middle fin 458 and the short fin 470 may each have a separate spacer/strength. The strips, 472& and, for example, can be placed against the adjacent respective intermediate fins 458 10 or long fins 454 as appropriate. It can be seen that the tabs 46〇, 46〇a, 472, 472a can be as The radius extends to the focus of the debris shutter, such as at the center of the plasma clamp 32, without obstructing any significant amount of light emitted from the clamp 32 and through the debris shutter 45. As shown in the top view of Figure 17B It can be seen that the signatures 46〇, 460a '472, 472a extend along the respective radii to the focus. 15 The debris shutter 450 can have a difference One of the positions of the screws 486 and 490 held on the mounting ring is a ring top locking ring 484 and a mounting ring bottom locking ring 488'. Therefore, regardless of whether the groove 453 is present on the mounting ring 452, the respective fins 454 are used. The mounting rings of 456 and 470 are side-to-side retained to the mounting ring 452. Likewise, the hub 454 can have a top locking plate 480 that can be held in position by a locking plate nut 482 and a bottom locking nut 483, for example. Please understand that 'in operation, thin fins 456, * 458 ' 470, such as 0.25 cm thick, can be used to collect the debris deposited on the surfaces of fins 456, 458, 47, while interlocking signatures 460, 472 and divider strips 460a, 472a may stiffen and evenly divide fins 456' 458 and 47 〇 43 1312644 in a group of structures and prevent flexing due to thermal exposure of debris shutter 450, for example. In another version of an embodiment of the invention, it is known to use a metal compound as a source of plasma generated by a discharge, and a metal compound such as tin in the form of a powder may be a reliable source for transporting the source of the plasma. 5 method. However, right The applicant has found this method as a reliable method of delivering a positive number of such materials. According to one embodiment of an embodiment of the invention, the Applicant proposes to provide, for example, particles which are as small as possible and which have a diameter of, for example, about 1 micron. The metal particles in the form of a powder can be transported to the plasma forming portion by blowing a powdery compound such as tin into a gas feed portion 10 used for a pulse plasma discharge. The feed portion, that is, the carrier gas is, for example. It may be a harmless gas such as helium, such as a carrier-only gas, or, for example, an effective gas such as helium, which may also contribute to the formation of plasma and/or the collapse of the plasma discharge. For example, a method of atomizing a tin crucible into a feedstock, for example, may include a method of passing a feed gas through or over a quantity of 15 powdered metal such as tin, which may be imparted by a piezoelectric actuator. The shaking is sufficient, for example, to cause the fine metal powder to propagate through the gas in the feed gas stream' and then, for example, via a hollow anode to the plasma forming site. It can be appreciated that in this manner, a 20 metered amount of powdered material can be inserted into the feed gas stream at a particular density per unit time, as desired, for example by adjusting the amount of actuation (e.g., via adjustment to a piezoelectric actuator). Voltage) to adjust this amount. It is also understood that control can also be applied by modifying the feed gas flow rate through the agitated powdered material. Adjustments can be implemented to limit the formation of debris in the plasma, for example. The adjustment can also be effected by periodically interrupting the feed air flow (譬 44 1312644 if the structure is utilized, for example, via periodic injections - pure feed gas flow, without any intervening material). Also, for example, if larger particles can be used, for example, to perform debris reduction using a mesh, the pores of the mesh stop passing through the particles of the crucible phase to the (four) body. The above-mentioned embodiments of the present invention are the only examples of the present invention disclosed in the present application, and many variations and modifications are known to those skilled in the art and equivalents. Still in place (four) please patent

The scope of the invention is limited only by the scope of the patent application. 10 [Simple description of the drawing] / I. * Schematic diagram of an electric smash (soft X-ray) light source generated by a discharge and a main component of an embodiment of the system; Fig. 2 shows a method for generating EUV light A schematic diagram of an embodiment of an electrode; 15 Figure 3 shows an embodiment of an collector system for EUV light sources, such as a light collector system that collects light in an emission cone; Figure 4 shows a schematic third Figure 6 is a cross-sectional view showing the grazing angle of the incident operation of the embodiment of a collector; Figure 5 is a view showing an embodiment of the present invention comprising an electrode exchange system according to the embodiment of the present invention; Figure 6 shows a close-up view of the embodiment of Figure 4; Figure 7 shows an embodiment of Figures 5 and 6 with a valve sealing mechanism adapted to replace the electrodes; Figure 8 shows a Figure 1 according to the present invention. The embodiment is used for the production; it is not intended to have a procedure for the material used in the electrode of the DPP, and FIG. 9 is a cross-sectional view showing the center electrode (anode) according to an embodiment of the present invention; Figure 10 shows one of the embodiments in accordance with the present invention A vertical sectional view of the electrode assembly; Fig. 11 shows a close-up perspective view of a portion of the electrode assembly shown in Fig. 10 and a center electrode (anode) shown in Fig. 9; A top view of the electrode assembly shown in Figs. 10 and 11; and Figs. 12a to c are cross-sectional views of the electrode assembly of Figs. 10 to 12, wherein the cross section taken along lines AA, BB, and CC of Fig. 12 Figure 13 is a cross-sectional view showing the electrode assembly of Figures 10 to 12c, including a center electrode (anode) assembly; and Figure 14 is a view showing one of the cold plate portions of the assembly of Figures 10 to 13, wherein the display is based on Cooling path of an embodiment of the present invention; 15 Figure 15 shows a perspective view of a debris shutter according to an embodiment of the present invention; Figure 16 shows one of the embodiments for manufacturing a dust mask according to an embodiment of the present invention. A schematic diagram of a program of a device; a 17A to a block diagram showing another chip 20 shader according to an embodiment of the present invention; and 18th and 18th views showing a pattern of a plasma according to an embodiment of the present invention. The simulation model of the clip. 46 1312644 [Explanation of main component symbols] 20.. Plasma generated by discharge ("DPP") EUV and soft X-ray source 22... Vacuum vessel (housing) 24. Large vacuum chamber (discharge chamber) 26... Metal Electrode 28: external electrode 30.. internal electrode (anode) 32.. high-density plasma clamp 34.. electrode tip 36, 300, 400, 450...dust shutter 40.. Collector 42.. Intermediate Focus 50.. Spectrum Purity Filter 60.. Source Delivery Tube 70.. Insulator 82, 84... Magnetic Field 90.. Collector Hub 92.. Collector Hub Extension Section 94.. Radial Bracket 100.. Radial Collector Drag Reducer 102.. Shell 102a... First Shell Section 102b... Second Shell Section 104, 104'... Limiting Radiation 1〇4”, 104′”···Partial light ray 106.. joint portion 122.. telescopic joint 126.. sealing flange 130... gate valve 132.. chamber wall 134.. flange 136. . Replaceable sealing surface 139.. DPP pulsed power unit, solid state pulse power module (SSPPM) 140.. .DPP commutator 142.. BN particles 150, 208, 306 · external surface 160 .. . electrode assembly 162.. external electrode (cathode) assembly 163.. cathode inner wall 164, 3 12... wall 168.. mounting screws 170.. circular cold plates 172, 176, 178... inlet plenum 173.. coolant inlet 174 '184... cooling passage 47 1312644 175.. Coolant outlets 316, 318 · · arc 180 ... outlet tube 402 ... common focus 182. · inlet tube 404 ... focusing lens 184 ... open access water channel 406 ... grid-like mask 206. .. pre-ionizer 410...laser beam 210...outer electrode (cathode) substrate 412...square or circular passage 212...cathode cover 420...workpiece 214...inlet manifold 452...mounting ring 216...drain manifold 453,455...slot 218...central opening 454·._ hub 220...internal electrode (anode) assembly 456...thin long fin 222. .. center insulator 457... intermediate chip receiving groove 224... non-elastic body electrode insulator 458 · thin thin fin (middle fin) 230... non-elastic metal C sealing ring 459... short Fin-chip receiving grooves 231, 486, 490... screws 460, 472... interlocking tabs 242... insulator clips 460a, 472a... separators/reinforcing fins 244... fixing screws 470. .. short fins 250, 254... electrode inner wall 480... top locking plate 252... tungsten casing Hollow portion 482 of the anode... Locking plate nut 256... Heat pipe baffle 483... Bottom locking nut 270... Heat exchanger discharge passage 484... Mounting ring top locking ring 302... Coplanar layer 488... Mounting ring bottom locking ring 304.. Light channel 308.. . Inner surface λ ... wavelength of light 48

Claims (1)

L3 12644 Patent No. 94135161 Patent Application Amendment | 97.07.23 • 9V7· I3 Ώ修(更)本本|十、申请专利范^~^ 1. A discharge generated by an electrode containing a pulse power source Pulp EUV source, which contains: 10 15 a pulse-shaped saturable inductor included in a chamber of the pulse power module operable to shape a pulse waveform delivered to the discharge electrodes, wherein the discharge pulse is in an axial run-out phase of the discharge The period consists of a moderate current and one of the peaks during the radial compression phase of the discharge. 2. The plasma EUV source of claim 1, further comprising: the pulse waveform of the discharge pulse comprising one of the current flows during the radial compression phase and at least for the axial runout phase for the electrodes Three times the current. 3. The plasma EUV source of claim 1, further comprising: the pulse waveform of the discharge pulse comprising one of the current flows during the radial compression phase and at least for the axial runout phase for the electrodes Two to five times the current. 4. A discharge generated plasma EUV light source comprising: an EUV light generating chamber; a source gas contained in the generating chamber; a buffer gas contained in the chamber having more than the source gas Low molecular weight; a thirst wheel molecular pump having an inlet connected to the generating chamber and operable to preferentially pump more of the source gas 49 1312644 from the chamber than the buffer gas. 5. The plasma EUV source of claim 4, further comprising: the turbomolecular pump having an internal gap, vane angle and velocity selected to preferentially pump higher molecular weight molecules. 5 6. The plasma EUV light source of claim 4, further comprising: the turbomolecular pump preferentially pumping based on the atomic velocity of the pumped gas. 7. The plasma EUV light source of claim 5, further comprising: the turbomolecular pump pumping preferentially based on the atomic velocity of the pumped gas. 8. The plasma EUV light source of claim 4, further comprising: the turbomolecular pump does not include a molecular resistance class. 9. The plasma EUV light source of claim 5, further comprising: the turbomolecular pump does not include a molecular resistance class. 15 10. The plasma EUV light source of claim 6 of the patent scope further comprises: The turbomolecular pump does not contain a molecular resistance class. 11. The plasma EUV light source of claim 7, further comprising: the turbomolecular pump does not include a molecular resistance class. 12. A plasma EUV light source produced by a discharge comprising: an adjusted conductive electrode comprising: a differentially doped ceramic material doped in a first region to select at least conductivity and doped Miscible in a second zone to select at least thermal conductivity. 13. The plasma EUV light source of claim 12, further comprising: 50 1312644 10 15 20 The first zone is located on or adjacent to the outer surface of the electrode structure. 14. The plasma EUV light source of claim 12, further comprising: the ceramic material being SiC and the dopant being BN. 15. The plasma EUV light source of claim 13, further comprising: the ceramic material is SiC and the dopant is BN. 16. The plasma EUV light source of claim 12, further comprising: the ceramic material being alumina and the dopant being BN. 17. The plasma EUV light source of claim 13, further comprising: the ceramic material being alumina and the dopant being BN. 18. The plasma EUV light source of claim 12, further comprising: the ceramic material is oxidized IS and the dopant is a metal oxide. 19. The plasma EUV light source of claim 13, further comprising: the ceramic material is oxidized and the dopant is a metal oxide. 20. The plasma EUV light source of claim 18, further comprising: the dopant being SiO or TiO 2 . 21. The plasma EUV light source of claim 19, further comprising: the dopant being SiO or TiO 2 . 22. A plasma EUV light source comprising a discharge generated in a discharge chamber, comprising: an electrode assembly comprising a discharge electrode mounted in a movable electrode assembly mount; an expandable seal An element coupled to the movable mount and operable to move the electrode assembly from a replacement position to an operational position; 51 1312644 a sealing mechanism removably mounted in a sealing mechanism housing and Operating to seal the discharge chamber by movement from a receiving position to a sealing position when the movable mount is moved to the replacement position. 23. The plasma EUV light source of claim 22, further comprising: 5 the expandable sealing element being a telescopic joint and the sealing mechanism being a gate valve. 24. A plasma EUV light source produced by a discharge comprising: a collector comprising a plurality of nested casing members aligned relative to a plasma clamp to form a grazing angle of an incident reflector of EUV light 10 emitted from the paddle; and a temperature control a mechanism operatively coupled to the collector and operable to adjust a temperature of the respective casing members to maintain a temperature-dependent geometry for grazing incident incident reflections from the respective casing members The angle is optimized. 15 25. The plasma EUV light source of claim 24, further comprising: The temperature control mechanism includes a heater. 26. The plasma EUV light source of claim 24, further comprising: the temperature control member comprising a heat remover. 27. The plasma EUV light source of claim 24, further comprising: 20 nested shell members, comprising: a first glancing angle of the incident reflector element, collected from the plasma jaw EUV light; and a second glancing angle of the incident reflector element that collects EUV light emitted from the first glancing angle of the incident reflector element. 52 1312644 10 20 28. The plasma EUV light source of claim 25, further comprising: each nested sheath member comprising: a first glancing angle of the incident reflector element, the collection being emitted from the plasma clamp EUV light; and a second glancing angle of the incident reflector element that collects EUV light emitted from the first glancing angle of the incident reflector element. 29. The plasma EUV light source of claim 26, further comprising: each nested casing member comprising: a first glancing angle of the incident reflector element collected from the plasma jaw EUV light; and a second glancing angle of the incident reflector element that collects EUV light emitted from the first glancing angle of the incident reflector element. 30. A plasma generated EUV light source comprising: a collector comprising a plurality of nested shell members aligned relative to a plasma clamp to form an EUV emitted from the plasma jaw a grazing angle of the incident reflector of light; and a mechanical control mechanism operatively coupled to the collector and operable to mechanically adjust the at least one of the respective sheath members to maintain a geometry such that The grazing angle of the incident reflection of the casing member is optimized. 31. The plasma EUV light source of claim 30, further comprising: each nested shell member comprising: a first glancing angle of the incident reflector element collected from the plasma jaw EUV light; 53 1312644 a second glancing angle of the incident reflector element that collects EUV light emitted from the first glancing angle of the incident reflector element; and the mechanical control mechanism includes a first adjustment device operable The fifth glancing angle is coupled to the incident reflector element and a second glancing angle of the incident reflector element. 32. The plasma EUV light source of claim 30, further comprising: the mechanical control mechanism comprising a piezoelectric actuator. 33. The plasma EUV light source of claim 31, further comprising: the mechanical control mechanism comprising a piezoelectric actuator. 10: The plasma EUV light source of claim 32, further comprising: the piezoelectric actuator comprising a biomorphic piezoelectric actuator coupled to an outer surface of each of the respective sheath members. 35. The plasma EUV light source of claim 33, further comprising: the piezoelectric actuator comprising a biomorphic piezoelectric actuator coupled to an outer surface of each of the respective sheath members. 36. A plasma generated EUV light source, comprising: an EUV light collector having a plurality of reflectors, each of the reflectors comprising a reflective surface and each having a reverse surface; and a bias A voltage source electrically connected to each of the plurality of reflectors 20. 37. The plasma EUV light source of claim 36, further comprising: a plasma generated by the discharge having an polarity; and selecting a voltage of the bias voltage source to have a polarity opposite to the plasma . 54 1312644 38. The plasma EUV light source of claim 35, further comprising: the reverse surface of each reflector having a roughened light. 39. The plasma EUV light source of claim 36, further comprising: the reverse surface of each reflector having a roughened light. 40. A plasma generated EUV source debris shutter comprising: a high energy irradiation source comprising a working beam; a mask member positioned in the path of the working beam and operable to The work bundle is divided into a plurality of work bundles; 10 a focusing optical device positioned in the path of the plurality of secondary working beams and operable to focus the plurality of secondary working beams to a focus; a workpiece interposed between the focusing optics and the focus, Thus, the plurality of working beams are each drilled in the workpiece with a hole aligned with the focus and pushed toward the focus. 41. The plasma EUV source dust shield of claim 40, further comprising: the workpiece comprising at least one surface having a radius of curvature concentric with the focus. 42. A plasma generated EUV light source comprising: at least one plasma generating electrode formed by a casing having a hollow interior; a first-class defining member located within the hollow interior along the hollow interior A pair of opposing inner walls define a coolant flow path from a coolant inlet to a coolant outlet. 43. The plasma EUV light source of claim 42, further comprising: 55 1312644 the flow defining member comprising a porous region for interconnecting the opposing inner walls. 44. The plasma EUV light source of claim 42, further comprising: the flow defining member comprising a thin-walled cylindrical member having its coolant inlet connected to the thin walled Cylindrical structure A passage formed between the member and an inner inner wall of the hollow interior and having a coolant outlet connected to a passage between the thin-walled cylindrical member and the outer inner wall of the hollow interior. 45. A plasma generated EUV light source comprising: 10 at least one electrode comprising a material having a high magnetic permeability sufficient to magnetically bias debris in the form of material removed from the electrode without Deposited on a protected system component. 46. An EUV debris shutter comprising: a mounting ring having a collection opening to define a collection opening having a focal point of 15; a hub; a plurality of large fins that are operatively mounted to the hub and the mounting ring; and at least one intermediate fin mounted between adjacent large fins and interposed between 20 adjacent large fins Mounting to the hub or the mounting ring and including at least one support tab and extending along a radius extending through the focus and engagingly mounted in one of the signature receiving slots of the at least one of the adjacent large fins . 47. If the EUV debris shutter of claim 46 is applied, further package 56 Ϊ 312644 10 includes: the at least one intermediate fin includes a first intermediate fin and a second intermediate fin, and: at least one short fin that is joint-mounted to the hub or adjacent to the adjacent intermediate fin The ring includes at least one support tab and extends along a radius extending through the focus and is matingly mounted in one of the signature receiving slots of the at least one of the adjacent intermediate fins. 48. A method for forming a plasma generated by a discharge, comprising: providing a metal compound as a source of a discharge generated in the form of a metal particle in powder form, wherein the particles are contained in a feed gas The particles are placed in the feed gas by passing the feed gas through a quantity of excited powdered material. 57 1312644 #年, /月f日杂:) is replacing page 丨 VII. Designated representative map: (1) The representative representative figure of this case is: (1). (2) A brief description of the symbol of the representative figure: 20.. Plasma generated by discharge ("DPP") EUV and soft X-ray source 22. Vacuum container (housing) 24. Large vacuum chamber ( Discharge chamber) 26.. Metal electrode 28.. External electrode 30.··Internal electrode (anode) 36.. .dust shutter 40.. Collector 42.. . Intermediate focus 50.. Spectrum purity filter 60.. Source delivery tube 8. If there is a chemical formula in this case, please reveal the best indication of the characteristics of the invention. Chemical formula: