JP2013258290A - Electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable electronic circuit device in which heat dissipation of semiconductor elements is ensured even if there is a variation in the mounting of semiconductor elements or the ambient temperature.SOLUTION: Since a plurality of rubber bushes A19 for supporting a printed circuit board 5 from the opposite side of the opening in a housing case 1 are provided, and a rubber bush B20 for supporting the printed circuit board 5 from the aluminum plate 21 side is fixed at a position, where the printed circuit board 5 is displaced to the aluminum plate 21 side by reaction, when a semiconductor element 39 mounted on the printed circuit board 5 is pushed to the opposite side of the opening in a housing case 1 and the rubber bushes A19 is compressed with the printed circuit board by means of the aluminum plate 21 fixed to close the opening in a housing case, heat generated from the semiconductor element 39 is transmitted reliably to the aluminum plate 21 and dissipated to the outside of the housing case 1, resulting in enhancement of reliability of an electronic circuit device.

Description

  The present invention relates to an electronic circuit device having a configuration in which a printed circuit board on which an electronic component such as a semiconductor element is mounted is stored in a storage case.

  2. Description of the Related Art Conventionally, in an electronic circuit device, a printed circuit board on which a semiconductor element is mounted is stored in a storage case, and the metal plate that forms the outline of the storage case and the semiconductor element are in surface contact with each other to generate heat from the semiconductor element on the metal plate. It is configured to conduct heat and dissipate heat (see, for example, Patent Document 1).

  Hereinafter, the conventional fixing method will be described with reference to the drawings.

  FIG. 7 is a cross-sectional view showing a schematic structure in a state in which the conventional electronic circuit device described in Patent Document 1 is attached to an external radiator.

  In FIG. 7, a printed circuit board 100 is mounted by soldering a terminal 102a to a semiconductor element 102 such as an IPM (intelligent power module) for driving a motor. A metal plate 105 is disposed so as to be in contact with the semiconductor element 102.

  The storage case 108 is arranged such that the printed board 100 is fixed by screws 111 and the metal plate 105 covers the opening of the storage case 108.

  The outer surface of the metal plate 105 and the mounting surface of the storage case 108 form the same plane, and are attached by screws 114 so that the same plane is in contact with the external radiator.

  The cover 117 covers the printed circuit board 100.

  The operation of the electronic circuit device configured as described above will be described below.

  When the electronic circuit device operates, the semiconductor element 102 generates heat by energization, but the generated heat is thermally conducted to the metal plate 105 in close contact with the semiconductor element 102.

  Since the metal plate 105 is attached so as to be in close contact with the external heat sink, the heat generated by the semiconductor element 102 thermally conducted to the metal plate 105 is further conducted to the external heat sink, so that the temperature of the semiconductor element 102 becomes higher than necessary. Therefore, the semiconductor element 102 can be prevented from thermal destruction, and the electronic circuit device can operate while maintaining reliability.

JP 2004-134491 A

However, in the conventional configuration, when the semiconductor element 102 is not mounted horizontally with respect to the printed circuit board 100, a gap is generated between the semiconductor element 102 and the metal plate 105, and the heat of the semiconductor element 102 and the metal plate 105 is generated. As a result, the conduction is hindered, and as a result, the temperature of the semiconductor element 102 rises, and the reliability of the semiconductor element 102 decreases.

  Even when the ambient temperature changes, a gap is generated between the semiconductor element 102 and the metal plate 105 due to the difference in coefficient of linear expansion between the storage case 108 and the semiconductor element 102, and the temperature of the semiconductor element 102 rises. However, there is a problem that the reliability of the semiconductor element 102 is lowered.

  The present invention solves the above-described conventional problems, and ensures that the semiconductor element and the metal plate are in close contact even when the semiconductor element is not mounted horizontally with respect to the printed circuit board or when the ambient temperature changes. An object of the present invention is to provide a highly reliable electronic circuit device that secures stable and stable heat dissipation of semiconductor elements.

  In order to solve the above conventional problems, an electronic circuit device of the present invention stores a printed circuit board, a semiconductor element mounted on the printed circuit board, and the printed circuit board, and includes an opening on at least one surface. A case, a plurality of rubber bushes A disposed inside the storage case and supporting the printed circuit board from the opposite side of the opening of the storage case, and an aluminum attached so as to close the opening of the storage case When the rubber bush A is compressed by a plate and the aluminum plate, a rubber bush B for supporting the printed board is provided at a position where the printed board is displaced to the aluminum plate side by a reaction thereof. It is.

  This ensures close contact between the semiconductor element and the aluminum plate even when the semiconductor element is not mounted horizontally to the printed circuit board or when the semiconductor element is mounted away from the center of the printed circuit board. The rubber bush B holds the printed circuit board from the aluminum plate side, and even when vibration is applied, the printed circuit board can be attached stably, and the aluminum plate and the printed circuit board can be charged. There is an effect that the insulation distance from the part can be secured.

  According to the electronic circuit device of the present invention, since the close contact between the semiconductor element, the aluminum plate, and the insulating sheet can be secured, and the insulation of the aluminum plate can be secured, a highly reliable electronic circuit device can be provided.

1 is an exploded perspective view of an electronic circuit device according to Embodiment 1 of the present invention. The perspective view of the semiconductor element in Embodiment 1 Side view of the semiconductor element with a metal spacer attached The perspective view of the rubber bush in Embodiment 1 Sectional drawing in the AA line in FIG. The side view of the state which attached the electronic circuit device in Embodiment 1 to the compressor Sectional drawing which showed schematic structure of the conventional electronic circuit device

According to a first aspect of the present invention, there is provided a printed circuit board, a semiconductor element mounted on the printed circuit board, a storage case that stores the printed circuit board and includes an opening on at least one surface, and an interior of the storage case. A plurality of rubber bushes A for supporting the printed circuit board from the opposite side of the opening of the storage case, an aluminum plate attached so as to close the opening of the storage case, and the rubber bush A by the aluminum plate When compressed, a rubber bush B that supports the printed circuit board at a location where the printed circuit board is displaced toward the aluminum plate by the reaction
It is equipped with.

  This ensures close contact between the semiconductor element and the aluminum plate even when the semiconductor element is not mounted horizontally to the printed circuit board or when the semiconductor element is mounted away from the center of the printed circuit board. The rubber bush B holds the printed circuit board from the aluminum plate side, and even when vibration is applied, the printed circuit board can be attached stably, and the aluminum plate and the printed circuit board can be charged. An insulating distance from the portion can be secured, and a highly reliable electronic circuit device can be provided.

  The second invention is characterized in that the rubber bush A and the rubber bush B are provided on opposite sides of the printed circuit board.

  As a result, the printed circuit board can be reliably supported from both sides, and when the semiconductor element is not mounted horizontally with respect to the printed circuit board, or the semiconductor element is mounted at a place away from the central portion of the printed circuit board. Even in the case, the semiconductor element and the aluminum plate have the effect of ensuring the close contact, and the rubber bush B holds the printed board from the aluminum plate side, and even when vibration is applied, a stable printed board can be obtained. The electronic circuit device can be provided with high reliability because it has an effect of securing the insulation distance between the aluminum plate and the charging portion of the printed board.

  According to a third aspect of the present invention, the aluminum plate is attached to the storage case, so that the aluminum plate pushes the semiconductor element to the opposite side of the opening of the storage case, so that the printed board is connected to the rubber bush A and While the rubber bush B is compressed, the semiconductor element and the aluminum plate are in close contact with each other.

  As a result, it is possible to ensure close contact between the semiconductor element and the aluminum plate, and to transfer heat generated by the semiconductor element to the aluminum plate, thereby preventing the semiconductor element from being damaged by heat and providing a highly reliable electronic circuit device. .

  According to a fourth aspect of the present invention, a sufficient insulation distance is secured from the terminal of the semiconductor element, and a metal spacer is attached in close contact with the heat dissipation surface of the semiconductor element so as to be sandwiched between the semiconductor element and the aluminum plate. Therefore, while ensuring the heat conduction between the semiconductor element and the aluminum plate, the distance between the aluminum plate and the printed board is increased by the thickness of the metal spacer, and the insulation distance between the aluminum plate and the charging part of the printed board is increased. Thus, a child circuit device that is safer against electric shock can be provided.

  According to a fifth aspect of the present invention, the rubber bush B has a cylindrical shape with a hollow portion, the printed circuit board includes a board mounting hole and a protruding portion that protrudes toward the opening inside the storage case, and the protrusion of the storage case Since the rubber bush B is arranged at a predetermined position of the printed board by inserting the portion into the board mounting hole of the printed board and the rubber bush B at the same time, the rubber bush B is attached to the printed board. It is possible to provide an inexpensive electronic circuit device that can be easily attached and can be assembled.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is an exploded perspective view of an electronic circuit device according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of a semiconductor element according to the embodiment, and FIG. 3 is a metal spacer attached to the semiconductor element according to the embodiment. 4 is a perspective view of the rubber bush in the same embodiment, FIG. 5 is a cross-sectional view taken along line AA in FIG. 4, and FIG. 6 is an electronic circuit device of the same embodiment attached to the compressor. FIG.

  In FIGS. 1 to 5, an opening 9 that is slightly larger than the size of the printed circuit board 5 is accommodated in a storage case 1 that is injection-molded with a resin such as a modified polyphenylene ether resin. And a plurality of mounting legs 1c and 1d provided with holes for mounting the electronic circuit device.

  The printed board 5 is made of glass cloth / nonwoven glass epoxy resin, has a connector 13 mounted thereon, and is provided with a plurality of board mounting holes 5a at four corners.

  The storage case 1 is opened at a position facing the connector 13 to form a cord lead-out portion 17.

  Protruding portions 1f that protrude toward the opening are integrally formed at three locations inside the storage case 1, and a cylindrical rubber bush A19 having a hollow portion is provided in the protruding portion 1f. Are fitted into the hollow portion of the rubber bush A19.

  The height of the protruding portion 1f is higher than the height of the rubber bush A19, and the tip protrudes from the rubber bush A19. The protruding portion fits into the board mounting hole 5a of the printed board 5. . The rubber bush A19 is sandwiched and compressed between the storage case 1 and the printed circuit board 5 with the printed circuit board 5 stored and attached to the storage case 1.

  Further, the hole diameter of the board mounting hole 5a is designed so that there is an appropriate clearance when the protruding part 1f is inserted (for example, if the diameter of the protruding part 1f is 3 mm, the hole diameter of the board mounting hole 5a is 4 mm). ).

  In addition, a protruding portion 1 f that protrudes toward the opening is integrally formed inside the storage case 1, and the protruding portion 1 f is a printed circuit board with the printed circuit board 5 attached to the storage case 1. 5 is fitted into the hollow portion 20a of the cylindrical rubber bush B20 having the hollow portion.

  There are four mounting holes 1b at the corners of the opening 9 of the storage box 1, and holes 21a are formed at the corners of the aluminum plate 21 made of pressed aluminum alloy. The aluminum plate 21 is fixed to the storage case 1 with a plate fixing screw 25 so that the opening 9 can be closed.

  A semiconductor element 39 such as an IPM (intelligent power module) for driving a compressor is mounted on the printed circuit board 5, but only the semiconductor element 39 is an aluminum plate 21 on the side opposite to other parts such as the connector 13. It is mounted on the mounting surface opposite.

  Further, a metal spacer 43 is attached to the semiconductor element 39 with a mounting screw 44 so as to be in close contact with the heat radiating surface 39a of the semiconductor element 39, and when the opening 9 of the storage box 1 is closed by the aluminum plate 21. The aluminum plate 21 pushes down the metal spacer 43 and the semiconductor element 39 toward the side opposite to the opening of the storage box 1, and as a result, the rubber bush A 19 is compressed by the printed circuit board 5.

  At this time, the aluminum plate 21 and the metal spacer 43 are brought into close contact with each other by the compressive force of the rubber bush A19.

  Here, the rubber bush B20 is attached so as to support the printed board 5 from the aluminum board 21 side at a position where the distance between the aluminum board 21 and the printed board 5 becomes short when the rubber bush A19 is compressed by the printed board. .

  still. The width W of the metal spacer 43 is smaller than the distance between the terminals 39b and 39c of the semiconductor element 39, and a sufficient insulation creepage distance is secured from the terminals 39b and 39c.

In FIG. 6, a hermetic compressor 47 has a bracket 51 attached to its outer shell by welding or the like.
The electronic circuit device according to the present embodiment is used to drive the compressor 47, and the electronic circuit device is attached to the compressor 47 by fixing the mounting leg 1 c of the storage case 1 to the bracket 51 with the mounting screw 55. It is attached.

  An assembly method and operation of the electronic circuit device for a compressor configured as described above will be described below.

  In assembling the electronic circuit device, first, the rubber bush A19 is inserted into the protruding portion 1f of the storage case 1. Next, the printed circuit board 5 on which the semiconductor element 39 to which the metal spacer 43 is previously attached by the attachment screw 44 is mounted can be electrically connected to the outside with the connector 13 facing the cord lead-out portion 17 of the storage box 1. Thus, it is inserted from the opening 9 of the storage box 1. At this time, the printed circuit board 5 is installed in the storage case 1 so that the protrusions 1 f and the protrusions 1 f of the storage case 1 fit into the board mounting holes 5 a of the printed circuit board 5.

  Next, the rubber bush B20 is attached to the protruding portion 1f from above the printed board 5.

  Thus, rubber bush A19 and rubber bush B20 are each arrange | positioned on the reverse side of the printed circuit board 5, and are supporting the printed circuit board 5 from the reverse side.

  Next, the aluminum plate 21 is attached to the opening 9 of the storage case 1 with the aluminum plate fixing screw 25. At this time, the upper surface of the metal spacer 43 is slightly perpendicular to the opening 9 of the storage case 1 (for example, about 2 mm). Since the dimension protrudes in the direction, the metal spacer 43 is pushed by the aluminum plate 21, and the rubber bush A 19 is compressed by the printed circuit board 5.

  In the electronic circuit device for a compressor assembled as described above, the semiconductor element 39 generates heat when energized to drive the compressor or the like, but the generated heat is transferred to the metal spacer 43 and the aluminum plate 21 that are in close contact with each other. Heat is transferred to dissipate heat to the outside of the storage case 1.

  As described above, in the present embodiment, since the rubber bush A19 is compressed and absorbs the vertical dimension variation, the metal spacer 43 even when the semiconductor element 39 is not mounted horizontally with respect to the printed circuit board 5. And the aluminum plate 21 are brought into close contact with each other, and the heat generation of the semiconductor element 39 is dissipated to the outside of the storage case 1, so that the semiconductor element 39 is prevented from being thermally destroyed.

Further, when the semiconductor element 39 is mounted at a location away from the central portion of the printed circuit board 5, the printed circuit board 5 is pushed to the aluminum plate 21 side by the rubber bush A19, and the reaction of the printed circuit board 5 is caused by the reaction. The side opposite to the mounting portion of the semiconductor element 39 with respect to the diagonal line BB is displaced to the aluminum plate 21 side, but the printed board 5 is pushed and held by the rubber bush B20 on the side opposite to the aluminum plate 21. Even when vibration or the like is applied, the printed circuit board 5 can be stably attached, and an insulation distance between the aluminum plate and the charged part of the 21 printed circuit board 5 can be secured, so that an electronic circuit device having high reliability and safety. Can be provided.

  Further, since the metal spacer 43 is in close contact with the aluminum plate 21, the aluminum plate 21 and the printed circuit board 5 are radiated by the thickness H of the metal spacer 43 while radiating the heat generated by the semiconductor element 39 to the outside of the storage case 1. Since the distance between the charging portion and the charging portion of the printed board 5 can be increased, the electronic circuit device that is safer against electric shock can be provided.

  Further, in attaching the rubber bush B20, the protruding portion 1f of the storage case 1 is merely fitted into the hollow portion 20a of the rubber bush B20, and the positioning in attaching the printed circuit board 5 can be performed by the protruding portion 1f. The assembly workability of the apparatus can be improved.

  As described above, the electronic circuit device according to the present invention can improve the reliability against vibration and the safety against electric shock as well as the assembly workability as well as ensuring the heat dissipation of the semiconductor element. The present invention can also be applied to other devices using semiconductors.

DESCRIPTION OF SYMBOLS 1 Storage case 1f Protrusion part 5 Printed circuit board 5a Board attachment hole 19 Rubber bush A
20 Rubber bush B
20a Cavity 21 Aluminum plate 39 Semiconductor element 43 Metal spacer

Claims (5)

A printed circuit board, a semiconductor element mounted on the printed circuit board, a storage case that stores the printed circuit board and has an opening on at least one surface, and a storage case that is disposed inside the storage case and stores the printed circuit board A plurality of rubber bushes A supported from the opposite side of the opening of the case, an aluminum plate attached so as to close the opening of the storage case, and the reaction when the rubber bush A is compressed by the aluminum plate An electronic circuit device comprising a rubber bush B for supporting the printed board at a location where the printed board is displaced toward the aluminum plate. The electronic circuit device according to claim 1, wherein the rubber bush A and the rubber bush B are provided on opposite sides of the printed circuit board. By attaching the aluminum plate to the storage case, the aluminum plate pushes the semiconductor element to the opposite side of the opening of the storage case, so that the printed circuit board compresses the rubber bush A and the rubber bush B. However, the electronic circuit device according to claim 1, wherein the semiconductor element and the aluminum plate are in close contact with each other. The metal spacer is attached in close contact with the heat radiating surface of the semiconductor element so as to secure a sufficient insulation distance from the terminal of the semiconductor element and to be sandwiched between the semiconductor element and the aluminum plate. The electronic circuit device according to any one of the above. The rubber bush B has a cylindrical shape with a hollow portion, and the printed board includes a board mounting hole and a protruding portion that protrudes toward the opening inside the storage case, and the protrusion of the storage case. 5. The rubber bush B is formed at a predetermined position of the printed board by inserting a portion into the board mounting hole of the printed board and the rubber bush B. 6. The electronic circuit device according to 1.