JP2013247067A - Inorganic molding article for color conversion, method of manufacturing the same and light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inorganic molding article for color conversion with less constraint of a shape of a molding article and an inorganic phosphor to be used and excellent color conversion efficiency and having a compact structure, to provide a light-emitting device having the same and a method of manufacturing the same.SOLUTION: There is provided an inorganic molding article 1 for color conversion which includes: a base substance 2 with light transmissivity containing a color conversion member consisting of a first inorganic material which absorbs light and emits light of a color different from the color of the absorbed light; and an inorganic particle layer 3 containing particles 31 of a color conversion member consisting of a second inorganic material which absorbs light and emits light of a color different from the color of the absorbed light. The inorganic particle layer 3 includes: an aggregate successively connected by bringing the particles 31 into contact with the particles each other or the base substance; a coating layer 32 which successively covers the surface of the base substance 2 and the surfaces of the particles 31 and consists of the inorganic material; and a gap 33 surrounded by any of the base substance 2, the particles 31 and the coating layer 32. There are also provided a light emitting device having the same and a method of manufacturing the same.

Description

  The present invention relates to an inorganic molded body for color conversion containing a particulate inorganic material, a method for producing the same, and a light emitting device using the inorganic molded body for color conversion.

  In a semiconductor light emitting device such as a light emitting diode or a semiconductor laser, part or all of the light color emitted from the semiconductor light emitting device is color-converted using a color conversion molding containing a phosphor, and the emission color is converted. There are light emitting devices that output. Such light emitting devices are also used for applications that require high output such as headlights and projectors.

  Conventionally, as a color conversion molded body used in such a light-emitting device, a color conversion molded body in which a phosphor is dispersed in a silicone resin having relatively good heat resistance and light resistance has been used. However, in recent severe applications corresponding to higher output and higher load of light sources using semiconductor light emitting devices such as LEDs (light emitting diodes) and LD (laser diodes), they are used for molded products for color conversion. It is conceivable that the resin deteriorated.

Therefore, ceramic conversion body for color conversion, which does not contain resin or organic matter, and only inorganic phosphor, or inorganic phosphor and transparent inorganic material are molded into a plate shape, has high output and high load. LEDs and LDs used as color conversion moldings have been put to practical use.
In addition, various methods have been proposed for manufacturing a ceramic molded body for color conversion made of only an inorganic material.

  For example, Patent Document 1 describes an inorganic oxide rare earth garnet compound, particularly a YAG (yttrium, aluminum, garnet) phosphor as an example of a durable light-emitting converter. Although the manufacturing method is not described in detail, it is assumed that a luminescence conversion body is manufactured by a method of manufacturing a polycrystalline ceramic body from a ceramic base material and then doping an activator serving as a luminescence center. Thereafter, a method of using the polycrystalline ceramic body, which is the luminescence conversion body, in combination with a semiconductor light emitting element is described.

Patent Document 2 describes the configuration and manufacturing method of glass containing an inorganic phosphor as a luminescent color conversion member. Here again, YAG phosphors of oxide phosphors are cited as examples.
Patent Document 3 describes a method of obtaining a luminescent ceramic as a color converter by sintering an inorganic phosphor at a high temperature and a high pressure.

Patent Document 4 discloses a method for producing an inorganic color conversion glass sheet by producing a sheet from phosphor powder and glass powder and introducing the sheet into a high-temperature furnace. Here, a method of using a low-melting glass having a melting point of 400 ° C. or lower is described as a method of making phosphors of various compounds into inorganic color conversion glass sheets.
Furthermore, Patent Document 5 describes a method for depositing and growing a YAG phosphor from a melt such as alumina as a method for producing a ceramic composite for light conversion.

JP 2004-146835 A JP 2003-258308 A JP 2006-5367 A JP 2006-37097 A JP 2006-169422 A

  However, the ceramic molded bodies described in Patent Document 1 to Patent Document 5 are all manufactured by sintering or melting an inorganic material. A ceramic molded body produced by sintering or melting is generally molded into a desired shape by processing such as slicing and polishing from a bulk ceramic. For this reason, for example, when forming into a plate shape, there was a limit to reducing the thickness.

  Furthermore, when a ceramic body is formed by sintering a phosphor and an inorganic material other than the phosphor, the phosphor content in the produced ceramic body is low, so that sufficient color conversion can be performed. A considerable thickness was necessary.

  Moreover, since the conventional ceramic molded body needs to be cut out from a bulk ceramic and molded into a desired shape, there is a restriction on the shape of the molded body that can be processed.

Further, as inorganic red phosphors, for example, nitride phosphors such as CASN having a basic composition of CaSiAlN ₃ : Eu and SCASN containing a large amount of Sr are known. The shape is not made. In addition, many of the nitride phosphors are vulnerable to heat, and the phosphors are deactivated by the heat during sintering, so that a molded body having excellent performance containing these phosphors is produced by sintering. It was difficult.

  Furthermore, for example, in order to obtain a daylight color having excellent color rendering properties, it is desirable to combine three light components of red, blue, and green. Conventionally, it has been necessary to adopt a complicated structure in which a plurality of light emitting elements of different colors are used in combination or a plurality of color conversion phosphors are combined. And phosphors that can be used are limited in terms of water resistance.

  In view of such problems, the present invention has few restrictions on the shape of the molded body and the inorganic phosphor to be used, is excellent in color conversion efficiency, has a compact structure, a method for producing the same, and a method for producing the same. It is an object of the present invention to provide a light-emitting device using an inorganic molded body for use.

  The present invention was devised to solve the above-described problems, and the inorganic conversion body for color conversion according to the first invention absorbs light and emits light of a color different from the color of the absorbed light. A translucent substrate containing a color conversion member made of the first inorganic material, and a second inorganic material provided on the substrate that absorbs light and emits light of a color different from the absorbed light color An inorganic particle layer containing particles of a color conversion member made of a material, and the inorganic particle layer includes an aggregate, a coating layer, and a void.

According to such a configuration, a part of the light incident on the color conversion inorganic molded body is absorbed by the color conversion member made of the first inorganic material contained in the substrate, and becomes a light of a color different from the incident light. The color is converted and emitted. On the other hand, another part of the light incident on the color conversion inorganic molded body is absorbed by the color conversion member made of the second inorganic material contained in the inorganic particle layer, and the color of the light is different from the incident light. It is converted and emitted.
At this time, the incident light to the color conversion inorganic molded body is scattered by the voids present in the inorganic particle layer, and is efficiently irradiated to the color conversion member in the substrate or the inorganic particle layer. As a result, the incident light is efficiently absorbed by the color conversion member, and is color-converted into light having a different color from the incident light.

  The color conversion member made of the second inorganic material contained in the inorganic particle layer absorbs light and emits light of a color different from the color of the absorbed light. For example, a nitride phosphor or fluoride An inorganic phosphor such as a phosphor. Further, in the inorganic particle layer, the particles of the color conversion member become aggregates continuously connected by contacting the particles or the substrate. And the surface of a board | substrate and the surface of the particle | grains of a color conversion member are continuously coat | covered with the coating layer which consists of inorganic materials. That is, the thickness and shape of the inorganic particle layer are determined by the thickness and shape of the particle aggregate of the color conversion member. In addition, a void surrounded by any of the base, the color conversion member particles, and the coating layer is formed inside the inorganic particle layer.

In the inorganic conversion body for color conversion according to the second invention, the voids in the inorganic particle layer preferably have a porosity of 1 to 50%.
According to such a configuration, the inorganic molded body for color conversion contains the color conversion member at a high content rate due to voids in this range of porosity, and the incident light is well scattered to perform color conversion in the inorganic particle layer. The member is irradiated and the incident light is efficiently color-converted. In addition, due to the voids in this range, even if there is a difference between the linear expansion coefficient of the substrate and the linear expansion coefficient of the inorganic particle layer, the color conversion inorganic molded body has a thermal expansion during heat generation. Absorbs distortion caused by cracks and prevents cracks.

In the inorganic conversion body for color conversion according to the third invention, the average particle diameter of the particles of the color conversion member contained in the inorganic particle layer is 0.1 to 100 μm, and the average thickness of the coating layer is 10 nm to The thickness is preferably 50 μm.
By using a color conversion member having an average particle diameter in this range, a thin inorganic particle layer can be obtained. Moreover, the particle | grains of a color conversion member can be coat | covered favorably by making the average thickness of a coating layer into this range.

In the inorganic conversion body for color conversion according to a fourth aspect of the invention, the surface of the inorganic particle layer is formed with an uneven shape due to the particle size of the color conversion member particles contained in the inorganic particle layer. preferable.
According to this configuration, the inorganic conversion body for color conversion can reduce the total reflection at the interface of light propagating in the inorganic particle layer, and can be efficiently taken out from the surface on which the uneven shape is formed.

In the inorganic conversion body for color conversion according to the fifth invention, the coating layer is preferably formed by an atomic layer deposition method.
According to such a configuration, the inorganic molded body for color conversion is coated with the particles contained in the inorganic particle layer by the uniform and dense coating layer formed by the atomic layer deposition method, and in the gaps between the particles. Is formed well.

In the inorganic conversion body for color conversion according to the sixth invention, the coating layer has Al ₂ O ₃ , SiO ₂ , ZrO ₂ , HfO ₂ , TiO ₂ , ZnO, Ta ₂ O ₅ , Nb ₂ O ₅ , In _2. It is preferable to contain at least one compound selected from the group consisting of O ₃ , SnO ₂ , TiN, and AlN.
According to such a configuration, the color-converting inorganic molded body satisfactorily covers the particles of the color conversion member with the coating layer made of a suitable material.

In the inorganic molded body for color conversion according to the seventh invention, the color conversion member contained in the inorganic particle layer is a sulfide-based phosphor, a halogen silicate-based phosphor, a nitride phosphor, and an oxynitride. It can contain at least one compound selected from the group consisting of phosphors.
According to such a configuration, the inorganic conversion body for color conversion can be subjected to color conversion using these inorganic phosphors that are easily deactivated by heat.

In the inorganic conversion body for color conversion according to the eighth invention, the color conversion member contained in the inorganic particle layer may contain a fluoride fluorescent material.
According to such a configuration, the color conversion inorganic molded body can perform color conversion using a fluoride phosphor that is easily deteriorated by moisture.

In the color conversion inorganic molded body according to the ninth aspect of the invention, it is preferable that the particles of the color conversion member contained in the inorganic particle layer are bound to each other and to the substrate and the inorganic binder.
According to such a configuration, the inorganic particle layer of the color conversion inorganic molded body is formed without dissipating the aggregate of the particles of the color conversion member by the inorganic binder.

In the inorganic conversion body for color conversion according to the tenth invention, the base is preferably made of an inorganic material.
According to such a configuration, since the inorganic conversion body for color conversion is composed of an inorganic material, the substrate is irradiated with high-intensity light at the time of use, and even when exposed to a high temperature, unlike an organic substance such as a resin, Deterioration such as discoloration of the substrate is prevented.

In the inorganic conversion body for color conversion according to the eleventh invention, the thermal conductivity of the substrate is preferably 5 W / m · K or more.
According to such a configuration, the color-converting inorganic molded body can dissipate heat generated during color conversion in the inorganic particle layer through the substrate having high thermal conductivity.

In the inorganic conversion body for color conversion according to the twelfth invention, a translucent layer having translucency can be provided between the base and the inorganic particle layer.
According to such a configuration, the color conversion inorganic molded body can be used as a color conversion inorganic molded body in which incident light and / or color-converted light passes through the light-transmitting layer and the substrate. Further, in the color conversion inorganic molded body, the particles of the color conversion member are continuously covered with the light transmitting layer and the coating layer.

In the inorganic conversion body for color conversion according to the thirteenth invention, it is preferable that the translucent layer and the coating layer are formed of the same material.
According to such a configuration, the color conversion inorganic molded body is continuously coated with the color conversion member particles contained in the inorganic particle layer by the translucent layer and the coating layer made of the same material.

In the inorganic conversion body for color conversion according to the fourteenth aspect of the invention, the base body can be made of a conductive material.
According to such a configuration, the inorganic molded body for color conversion is obtained by directly forming inorganic particles on the substrate by using an electrodeposition method or an electrostatic coating method using the substrate as one electrode without providing a conductor layer on the substrate. A layer can be formed.

In the color conversion inorganic molded body according to the fifteenth invention, the first inorganic material and the second inorganic material are preferably different types.
According to such a configuration, the inorganic conversion body for color conversion contains a color conversion member made of a plurality of types of inorganic materials, and color-converts incident light into two or more types of light different from incident light. Thus, it is possible to emit the light after mixing the colors.

A light emitting device according to a sixteenth invention includes a light source and the color conversion inorganic molded body.
According to such a configuration, the light emitting device absorbs light emitted from the light source, and outputs light of a color different from the color of light absorbed by the color conversion inorganic molded body as output light. Accordingly, the light emitting device outputs output light obtained by color-converting the color of light from the light source.

A light emitting device according to a seventeenth aspect of the invention can be configured to output light obtained by mixing a part of light emitted from the light source and light emitted from the color conversion inorganic molded body.
According to this configuration, the light-emitting device is a part of the light emitted from the light source and the light emitted from the color conversion inorganic molded body, and the color conversion inorganic molded body absorbs the light from the light source and emits light. The light of the color which mixed the light of the color different from the color of the light of a light source is output. For example, the color of the light source can be blue, the color of light emitted from the substrate can be green, the color of light emitted from the inorganic particle layer can be red, and these can be mixed and output as white light.

The method for producing an inorganic molded body for color conversion according to the eighteenth invention includes an inorganic particle layer forming step and a coating layer forming step, and is performed in this order.
According to such a procedure, first, in the inorganic particle layer forming step, on the substrate containing the color conversion member made of the first inorganic material that absorbs light and emits light of a color different from the color of the absorbed light. Aggregates containing particles of a color conversion member made of a second inorganic material that absorbs light and emits light of a color different from the color of the absorbed light are formed. That is, the thickness and shape of the inorganic particle layer are determined by the thickness and shape of the particle aggregate of the color conversion member.

  Next, in the coating layer forming step, a coating layer made of an inorganic material that continuously covers the surface of the substrate and the surface of the particles of the color conversion member is formed. That is, the above-described aggregate becomes a molded body integrated with the substrate by the coating layer while maintaining this shape.

According to a nineteenth aspect of the present invention, there is provided a method for producing an inorganic molded body for color conversion, wherein in the inorganic particle layer forming step, the agglomerates are electrodeposited, electrostatic coating, pulse spray or centrifugal sedimentation, or these It is preferably formed on the substrate by a combination of methods.
According to such a procedure, in the inorganic particle layer forming step, the aggregate containing the particles of the color conversion member is formed without becoming high temperature.

According to a twentieth aspect of the invention, there is provided a method for producing an inorganic molded body for color conversion, wherein the substrate is made of a conductive material, and in the inorganic particle layer forming step, the electrodeposition method or electrostatic method using the substrate as one electrode. The aggregate is preferably formed on the substrate by a coating method.
According to such a procedure, in the inorganic particle layer forming step, the inorganic particle layer can be directly formed on the substrate by using an electrodeposition method or an electrostatic coating method using the substrate as one electrode.

According to a twenty-first aspect of the present invention, there is provided a method for producing an inorganic molded body for color conversion, wherein the substrate is made of an insulating material, and a conductor layer forming step is performed before the inorganic particle layer forming step to form the inorganic particle layer. It is preferable to perform a conductor layer transparency step after the step and before the coating layer forming step.
According to such a procedure, first, in the conductor layer forming step, a conductor layer made of metal is formed on a base made of an insulating material. Next, in the inorganic particle layer forming step, the aggregate containing the inorganic particles of the color conversion member via the conductor layer on the substrate by the electric deposition method or the electrostatic coating method using the conductor layer as one electrode. Form. Next, in the conductor layer transparentizing step, the conductor layer made of metal is made transparent by oxidizing, for example, using hot water. In the coating layer forming step, a coating layer made of an inorganic material that continuously covers the surface of the transparent conductor layer and the surface of the color conversion member particles is formed.

In the method for producing an inorganic molded body for color conversion according to the twenty-second aspect, the transparent conductor layer is preferably made of the same material as the coating layer.
According to this procedure, in the coating layer forming step, the particle layer of the color conversion member formed on the substrate via the transparent conductor layer is covered with the coating layer made of the same material as the transparent conductor layer. .

In the method for manufacturing an inorganic molded body for color conversion according to a twenty-third aspect of the invention, the base is made of an insulating material, and the conductive material having translucency is formed on the base before the inorganic particle layer forming step. It is preferable to perform a conductor layer forming step made of a material.
According to such a procedure, first, in a conductor layer forming step, a conductor layer made of a light-transmitting conductive material is formed on a base made of an insulating material. Next, in the inorganic particle layer forming step, an aggregate containing an inorganic phosphor is formed on the substrate via the conductor layer by an electrodeposition method or an electrostatic coating method using the conductor layer as one electrode. . In the coating layer forming step, a coating layer made of an inorganic material that continuously covers the surface of the light-transmitting conductor layer and the surface of the color conversion member particles is formed.

In the method for producing an inorganic molded body for color conversion according to the twenty-fourth invention, in the coating layer forming step, the coating layer is preferably formed by an atomic layer deposition method.
According to such a procedure, in the coating layer forming step, a dense and uniform thickness coating layer is formed by the atomic layer deposition method, and the color conversion member particles are satisfactorily covered and the gaps between the particles are crushed. It is well formed as a void.

The method for producing an inorganic molded body for color conversion according to a twenty-fifth aspect of the present invention includes, in the inorganic particle layer forming step, at least an alkaline earth metal element as a component as an inorganic binder when forming the aggregate. It is preferable to use a compound.
According to such a procedure, the aggregate formed in the inorganic particle layer forming step is bound by the inorganic binder. This prevents the particles constituting the aggregate from escaping until the coating layer is formed in the subsequent coating layer forming step and the aggregate is firmly fixed.

In the method for producing an inorganic molded body for color conversion according to a twenty-sixth aspect of the invention, the average particle diameter of the color conversion member contained in the inorganic particle layer is 0.1 to 100 μm, and the average thickness of the coating layer is The thickness is preferably 10 nm to 50 μm.
According to this procedure, a thin inorganic particle layer is formed by using a color conversion member having an average particle diameter in this range. Moreover, the particle | grains of a color conversion member are coat | covered favorably by making the average thickness of a coating layer into this range.

In the method for producing an inorganic molded body for color conversion according to a twenty-seventh aspect of the invention, the coating layer is made of Al ₂ O ₃ , SiO ₂ , ZrO ₂ , HfO ₂ , TiO ₂ , ZnO, Ta ₂ O ₅ , Nb ₂ O _5. It is preferable to contain at least one compound selected from the group consisting of In ₂ O ₃ , SnO ₂ , TiN, and AlN.
According to such a procedure, in the coating layer forming step, the particles of the color conversion member are satisfactorily coated with the coating layer made of a suitable material.

Since the inorganic particle layer for color conversion of the present invention has a structure in which the inorganic particle layer is formed by covering the aggregate of the particles of the color conversion member with the coating layer, the content of the color conversion member can be increased, and the void High color conversion efficiency can be obtained by the light scattering effect. Moreover, the inorganic molded body for color conversion of the present invention has few restrictions on the shape of the molded body and the type of color conversion member used.
Furthermore, since the inorganic molded body for color conversion of the present invention contains a plurality of types of color conversion members composed of the first inorganic material and the second inorganic material in the base and the inorganic particle layer, it has a compact structure. However, a plurality of colors different from the incident light can be mixed and emitted.

The light-emitting device of the present invention has high color conversion efficiency, and can emit light of a plurality of colors different from incident light.
The method for producing an inorganic molded body for color conversion according to the present invention has high color conversion efficiency and is different from incident light while having a compact structure with few restrictions on the shape of the molded body and the type of color conversion member to be used. It is possible to manufacture a color conversion inorganic molded body that can emit light of a plurality of colors mixed.

The structure of the inorganic molded object which concerns on 1st Embodiment is shown, (a) is typical sectional drawing, (b) is the elements on larger scale of (a). It is a flowchart which shows the flow of the manufacturing method of the inorganic molded object which concerns on 1st Embodiment. It is typical sectional drawing for demonstrating the manufacturing process of the inorganic molded object which concerns on 1st Embodiment, (a) is a mode that the conductor layer was formed, (b) is a mode that the fluorescent substance particle was laminated | stacked, (c ) Shows how the conductor layer is made transparent, and (d) shows how the coating layer is formed. It is a flowchart which shows the flow of the detailed process of a coating layer formation process in the manufacturing method of the inorganic molded object which concerns on 1st Embodiment. It is typical sectional drawing which shows the structure of the inorganic molded object which concerns on the modification of 1st Embodiment, (a) is a dome shape, (b) is a tube type, (c) is a lens type, respectively. Show. It is typical sectional drawing which shows the structure of the inorganic molded object which concerns on 2nd Embodiment. It is a flowchart which shows the flow of the manufacturing method of the inorganic molded object which concerns on 2nd Embodiment. It is typical sectional drawing for demonstrating the manufacturing process of the inorganic molded object which concerns on 2nd Embodiment, (a) is a mode that masked, (b) is a mode that laminated | stacked fluorescent substance particle, (c) is a coating layer. (D) shows a state where masking is removed. It is typical sectional drawing which shows the structure of the inorganic molded object which concerns on 3rd Embodiment. (A) is a schematic diagram which shows the structure of the light-emitting device concerning 4th Embodiment, (b) is the example which has arrange | positioned the fluorescent substance layer inside, (c) is the example which has arrange | positioned the fluorescent substance layer outside. It is. It is the photograph image which image | photographed the cross section of the fluorescent substance layer of the inorganic molded object which concerns on the Example of this invention with the electron microscope. FIG. 12 is an image in which a coating layer is filled in a region A of FIG. FIG. 12 is an image in which a coating layer and a phosphor are filled in a region A of FIG.

  Hereinafter, an inorganic molded body for color conversion in the present invention (hereinafter abbreviated as “inorganic molded body”), a method for producing the inorganic molded body, and a light-emitting device using the inorganic molded body will be described. However, the present invention is not limited to the embodiment of the inorganic molded body described below.

First Embodiment [Configuration of Inorganic Molded Body]
The structure of the inorganic molded body according to the first embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 1A, the inorganic molded body 1 according to the first embodiment has a translucent layer 5 on the upper surface of a translucent substrate 2, and the substrate 2 is interposed via the translucent layer 5. A phosphor layer (inorganic particle layer) 3 is provided on the upper surface of the substrate. The translucent substrate 2 contains an inorganic phosphor (color conversion member) 4 made of a first inorganic material (not shown). The phosphor layer 3 is formed of a granular inorganic phosphor (color conversion member) 31 made of the second inorganic material and a coating layer 32 that covers the inorganic phosphor 31. More specifically, as shown in FIG. 1B, a gap 33 is formed inside the phosphor layer 3.

In the inorganic molded body 1 according to this embodiment, the substrate 2 and the translucent layer 5 are configured using a translucent material, and the substrate 2 and the translucent layer 5 are irradiated from above or below. Light that has been color-converted by the light and the color conversion member can be transmitted.
When light is incident on the inorganic molded body 1 according to the present embodiment from the phosphor layer 3 side, a part of the incident light is absorbed by the granular second inorganic material in the phosphor layer 3, and the incident light It is converted into light of a color different from the color, and another part of the incident light is absorbed by the first inorganic material present in the substrate 2 and converted into light of a color different from the color of the incident light. Also, the light is emitted from the surface on the substrate 2 side opposite to the surface on which the incident light is incident.

On the other hand, when light is incident on the inorganic molded body 1 according to the present embodiment from the substrate 2 side, a part of the incident light is absorbed by the first inorganic material present in the substrate 2, and the color of the incident light Is converted into light of a different color, and another part of the incident light is absorbed by the granular second inorganic material in the phosphor layer 3 and converted into light of a color different from the color of the incident light. Is also emitted from the surface on the phosphor layer 3 side opposite to the surface on which the incident light is incident.
Therefore, the inorganic molded body 1 according to the present embodiment is used as a transmission-type inorganic molded body for color conversion.

Hereinafter, the structure of each part of the inorganic molded body 1 will be described in detail.
In this specification, “having translucency” means having translucency with respect to light incident on the inorganic molded body 1 and light that has been color-converted by the color conversion member in the inorganic molded body 1. Say.

(Substrate (base))
The substrate 2 is a member having translucency, containing a color conversion member 4 made of a first inorganic material, and having a function of supporting the phosphor layer 3. Furthermore, you may have the function to control light, the function to thermally radiate heat, etc. As the substrate 2, various materials can be selected according to the purpose and application.
The substrate 2 is transparent to incident light, light that has been color-converted by the first inorganic material in the substrate 2, and light that has been color-converted by the second inorganic material in the phosphor layer 3. As a measure of translucency, the light transmittance, which is the ratio of the transmitted light amount to the incident light amount, is 50% or more, preferably 70% or more, more preferably 90% or more.
Examples of the substrate 2 include glass, oxides and composite oxides such as Al ₂ O ₃ and SiO ₂ , nitrides and oxynitrides such as AlN and GaN, carbides and carbonitrides such as SiC, halides, and translucency. Transparent inorganic materials such as conductive carbon can be used.

The substrate 2 contains an inorganic phosphor 4 made of a first inorganic material that emits light of a color different from incident light (not shown). Therefore, the substrate 2 has a color conversion function of absorbing part or all of light incident from above or below and emitting light of a color different from the incident light.
The light incident on the substrate 2 is absorbed by the inorganic phosphor 4 made of the first inorganic material contained in the substrate 2 and emits light having a color different from the color of the incident light.
Various forms of the inorganic phosphor 4 made of the first inorganic material contained in the substrate 2 are conceivable. The inorganic phosphor 4 made of the first inorganic material may be a main raw material of the substrate 2 or may be contained as a part of the translucent material constituting the substrate 2. A thin layer may be formed on the surface or inside of the substrate 2.

The main structural aspects of the substrate 2 are classified as follows.
(1) A substrate made of a polycrystalline phosphor produced by sintering only an inorganic phosphor; firing a crystalline inorganic phosphor powder such as a YAG-based oxide or non-oxide nitride or sulfide. It can be obtained by tying.
(2) A substrate made of an inorganic phosphor single crystal or an inorganic phosphor composite material prepared by a method such as melt growth.
(3) A substrate made of a material in which phosphor fine particles are dispersed in a transparent inorganic material; it can be obtained by mixing and melting a transparent inorganic material such as glass, alumina or silica and inorganic phosphor fine particles.
(4) A substrate made of luminescent glass.
(5) A substrate having a phosphor thin film on the surface of a transparent substrate; as the transparent substrate, a sintered body plate, a single crystal plate, a glass plate, a film or the like can be used. As the single crystal plate, transparent inorganic compounds such as sapphire, ZnO, SiO ₂ , GaN, and Ga ₂ O ₃ can be used. As a method for forming the phosphor thin film, methods such as vapor deposition, thermal spraying, and sputtering can be used.
(6) A substrate made of a material in which a layer made of an inorganic phosphor is sandwiched between layers made of a transparent inorganic compound.

  These structural aspects are described as an example. Among these configuration modes, an appropriate configuration mode can be selected and used according to the characteristics of the inorganic phosphor 4 and the purpose / use of the inorganic molded body 1. For example, in the case of the inorganic phosphor 4 having low heat resistance, it is not preferable to use a configuration having a process of heating at the time of manufacture.

An example of a manufacturing method will be specifically described below for each of the main structural aspects of the substrate 2 described above.
(1) A substrate made of a polycrystalline phosphor produced by sintering only an inorganic phosphor. A YAG phosphor powder is compacted by using a pressing device, a cold isostatic pressing device (CIP: Cold Isostatic Pressing) or the like. Thus, a green body before sintering is obtained. This molded body is put into a hot isostatic pressing (HIP) device or the like, and sintered at a temperature of 1500 ° C. or higher while applying pressure. By setting the temperature and pressure to high, the surface of the phosphor powder is melted and the particles are fused to form a bulk phosphor sintered body. The sintered body is cut into a predetermined thickness, cut, polished, and then annealed in a weakly reducing atmosphere to obtain a YAG phosphor sintered plate substrate. By changing the composition of the YAG phosphor, substrates having various emission colors can be obtained. As a sintering method, various methods such as spark plasma sintering (SPS), vacuum sintering, and hot press sintering can be used in addition to HIP. By changing the temperature, atmosphere, and pressure, oxide phosphors and phosphor substrates having other compositions can be produced.

(2) Substrate made of inorganic phosphor single crystal prepared by melt growth method Czochralski method, Bridgman method and the like are used as a method for producing a single crystal of YAG phosphor. First, a melt containing a component of a YAG phosphor is prepared, and a single crystal is prepared by a pulling method using a seed crystal as a nucleus. Thereafter, a substrate made of a YAG phosphor single crystal can be obtained by processing into a desired shape and size in consideration of the crystal orientation. By adding alumina, silica, or the like excessively to the melt, it is also possible to obtain a crystal substrate in which the YAG phosphor and the excess component are uniformly mixed and combined.

(3) Substrate made of a material in which phosphor fine particles are dispersed in a transparent inorganic material YAG phosphor powder and glass powder such as borosilicate glass or phosphoric acid low melting point glass using a press device or CIP device Press to solidify to obtain a green body before sintering. This molded body is put into a vacuum furnace and heated to a temperature equal to or higher than the softening point of the glass material under reduced pressure to be sintered. A sintered body in which voids between the particles are filled by decompression is obtained. By processing this into a desired shape and size, a substrate can be obtained.

(4) Substrate made of luminescent glass A rare earth element serving as an luminescent center and a glass component serving as a base are mixed, a melt is prepared, and then cooled and solidified to prepare glass. A luminescent glass is prepared by heat treatment while controlling the temperature and atmosphere as necessary. By processing this into a desired shape and size, a substrate can be obtained.

(5) A substrate having a phosphor thin film on the surface of a transparent substrate A transparent alumina substrate is placed in a vapor deposition apparatus, and vapor deposition is performed using SrS, Eu ₂ S ₃ , and Ga ₂ S ₃ as raw materials for vapor deposition. Then, an SrGaS ₄ : Eu phosphor deposition layer is formed on the surface of the alumina substrate. After vapor deposition, heat treatment is performed under predetermined conditions to grow and crystallize the phosphor particles, thereby obtaining an alumina substrate having a thin phosphor layer formed on the surface. The method for forming the thin film can be selected from sputtering, thermal spraying, MBE, CVD, etc., depending on the type of phosphor.

(6) Substrate made of a material in which a layer made of an inorganic phosphor is sandwiched between layers made of a transparent inorganic compound In the case of a phosphor material having low durability against the external environment, such as nano-sized phosphor fine particles, the material concerned Can be diffused and mixed in an inorganic adhesive or the like, sandwiched between two transparent inorganic compound plates such as two glass plates, hermetically sealed and encapsulated.

  The translucent substrate 2 can have light controllability. That is, functions such as selective light transmission, light diffusion, light absorption, and light shielding can be provided. For example, in a light emitting device in which an LD (laser diode) that outputs ultraviolet light is used as a light source, the inorganic molded body 1 is disposed on the upper surface of the LD, and the side on which the phosphor layer 3 is provided is an incident surface of light from the LD A configuration example for reducing leakage of light emitted from the LD will be described. When light emitted from the LD is incident on the phosphor layer 3, both the light whose color has been converted by the phosphor layer 3 and the light which has not been color-converted by the phosphor layer 3 are incident on the substrate 2. . At this time, light that has been color-converted by the phosphor layer 3 is transmitted through the substrate 2 and light emitted from the LD that has not been color-converted by the phosphor layer 3 is shielded or absorbed by the substrate 2. The material of the substrate 2 can be selected so as to have a function having wavelength selectivity. With such a configuration, it is possible to prevent light emitted from the LD from being emitted directly from the opposite surface (substrate 2 side). As a specific example of such a configuration, for example, Pyrex (registered trademark) glass that does not transmit ultraviolet rays is used as the material of the substrate 2, or a dielectric reflection film that reflects ultraviolet rays is provided on the surface of the substrate 2. it can.

Moreover, the inside or the surface of the light-transmitting substrate 2 can be provided with light diffusibility by containing, for example, an inorganic filler that diffusely reflects light. With such a configuration, the uniformity of color conversion can be further improved. Here, it is desirable that the inorganic filler for irregularly reflecting light has a large refractive index difference from the substrate 2, is translucent, and has a small particle size. Specifically, when using a glass refractive index of approximately 1.5 as the substrate 2, a refractive index and the like Ti0 ₂ of 2.5 to 2.7. When SiO ₂ is used as the substrate 2, TiO ₂ , Al ₂ 0 ₃ , C (diamond), and the like can be given.

  The light-transmitting material is generally electrically insulative, but a film made of a light-transmitting conductive material is provided on the surface of the substrate 2 or the substrate 2 is formed of a light-transmitting conductive material. In the case where the substrate 2 is made conductive by adding a translucent conductive filler to the substrate 2, an electro-deposition method or an electrostatic method is used in the phosphor layer 3 forming step described later. The painting method etc. can be used.

  Further, the substrate 2 is made of a material having high thermal conductivity so that heat generated by Stokes loss of the light color-converted in the substrate 2 or the phosphor layer 3 can be efficiently radiated through the substrate 2. preferable. Specifically, the thermal conductivity of the material used for the substrate 2 is preferably 5 W / m · K or more, and more preferably 100 W / m · K or more. As such a translucent material having high thermal conductivity, for example, AlN can be cited. Moreover, you may improve the heat conductivity of the board | substrate 2 by adding an inorganic filler etc. with high heat conductivity. Specific examples of the inorganic filler having high thermal conductivity include AlN, SiC, C (diamond), and the like.

  Furthermore, the shape of the substrate 2 is not limited to a plate shape, and the phosphor layer 3 can be held as a structural member, and a three-dimensional structure for providing an assembling function and a condensing function of the light emitting device can be taken. For example, after processing the glass substrate 2 to provide a lens function, the phosphor layer 3 is directly formed on the lens-shaped substrate 2, and the lens and the phosphor layer 3 that is a color conversion member are formed. It can also be set as the color conversion inorganic molded object 1 of the structure which was united. With such a configuration, it becomes easier to control light.

(Phosphor layer (inorganic particle layer))
The phosphor layer 3 is an inorganic particle layer in which an aggregate of particles of an inorganic phosphor 31 made of a second inorganic material is coated with a coating layer 32 made of an inorganic material. In the present embodiment, the phosphor layer 3 is provided so as to cover the upper surface of the substrate 2. The phosphor layer 3 is a layer having a color conversion function of absorbing part or all of light incident from above or below and emitting light of a color different from the incident light.

  As shown in FIG. 1B, the phosphor layer 3 is formed by covering particles of the granular inorganic phosphor 31 with a coating layer 32 made of an inorganic material, and the coating layer 32 covers the inorganic phosphor 31. The particles 2 and the substrate 2 and the particles are fixed to each other to form a molded body in which the granular inorganic phosphor 31 is integrated. Further, the surface of the phosphor layer 3 is formed with unevenness due to the particle size of the inorganic phosphor 31. Further, voids 33 are formed between the particles of the inorganic phosphor 31 inside the phosphor layer 3.

  The light incident on the phosphor layer 3 is scattered by the gap 33 and is efficiently absorbed by the inorganic phosphor 31 contained in the phosphor layer 3, so that it has a higher color than that without the gap 33. Conversion efficiency can be obtained. For this reason, in order to obtain the same color conversion rate, the thickness of the phosphor layer 3 can be made thinner than when the gap 33 is not provided.

  In addition, since the surface of the phosphor layer 3 has irregularities due to the particle size of the inorganic phosphor 31, particularly when light is incident from the substrate 2 side of the inorganic molded body 1, total reflection at the interface is reduced. Thus, light can be efficiently extracted from the phosphor layer 3. For this reason, when this inorganic molded object 1 is used as a color conversion molding member and a light-emitting device is comprised, high luminous efficiency can be obtained.

  Further, the phosphor layer 3 may include an inorganic binder (not shown) made of a translucent alkaline earth metal salt. The inorganic binder binds the inorganic phosphor 31 and / or the inorganic phosphor 31 to each other. This inorganic binder is added in the manufacturing process of laminating the inorganic phosphor 31 on the substrate 2, and between the particles of the inorganic phosphor 31 and the substrate 2 by the coating layer 32 made of an inorganic material, And until the coating layer 32 which coat | covers the particle | grains of the inorganic fluorescent substance 31 is formed, it has the function to make it bind | conclude so that the particle | grains of the inorganic fluorescent substance 31 may not dissipate.

The phosphor layer 3 may include an inorganic filler. For example, by adding an inorganic filler, light incident on the phosphor layer 3 can be scattered and diffused, or heat generated by the Stokes loss can be efficiently conducted to the substrate 2 to improve heat dissipation. it can. Moreover, the content rate of the inorganic fluorescent substance 31 in the fluorescent substance layer 3 can be adjusted by addition of an inorganic filler. Moreover, the shape of the space | gap 33, the porosity, and the uneven | corrugated shape of the surface of the fluorescent substance layer 3 can be adjusted with the particle size and shape of the inorganic filler to add.
Further, the phosphor layer 3 may include conductive particles such as metal powder. By adding conductive particles, heat generated by the Stokes loss can be efficiently conducted to the substrate 2 to improve heat dissipation.

Examples of the inorganic filler include aluminum nitride, barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, silver, silica (fume silica, precipitated silica, etc.), titanic acid Examples include potassium, barium silicate, glass fiber, carbon, diamond and the like, and combinations of two or more thereof.
Alternatively, a light-transmitting material such as tantalum oxide, niobium oxide, or a rare earth oxide, or an inorganic compound that reflects or absorbs light with a specific wavelength can be used.
In addition, an inorganic filler having the same particle size as the inorganic phosphor 31 described later can be used.

  The phosphor layer 3 is a layer in which the aggregate of particles of the inorganic phosphor 31 is continuously covered and integrated with the coating layer 32, and a protective layer, an antireflection layer, and the like are further laminated. Also good. In this case, the total film thickness of the phosphor layer 3, which is the film thickness from the upper surface of the substrate 2 to the upper surface of the phosphor layer 3 including the protective layer and the antireflection layer, is preferably about 10 to 300 μm. .

In addition, since the phosphor layer 3 is an aggregate of particles of the inorganic phosphor 31, the film thickness is influenced by the particle size, but the thickness of the phosphor layer 3 that substantially contributes to color conversion is small. 1 to 150 μm can be used, preferably 5 to 70 μm, and more preferably 10 to 50 μm. The “phosphor layer that substantially contributes to color conversion” means that the aggregate of particles of the inorganic phosphor 31 is continuously covered with the coating layer 32 and integrated, except for the protective layer and the reflective layer. Refers to the layer.
The thickness of the phosphor layer 3 (the thickness and total thickness of the phosphor layer that substantially contributes to color conversion) can be measured using a scanning electron microscope.

  Further, in the embodiment of the present invention, the content of the inorganic phosphor 31 in the phosphor layer 3 can be increased and the presence of the voids 33 as compared with a phosphor molded body made of a conventional sintered ceramic or the like. Thus, the thickness of the phosphor layer 3 for obtaining the same color conversion rate can be reduced. For this reason, the heat generated by the Stokes loss generated in the inorganic phosphor 31 contained in the phosphor layer 3 can be quickly conducted to the substrate 2 having a heat dissipation function. That is, it can be set as the inorganic molded object 1 excellent in heat dissipation.

(Inorganic phosphor (color conversion member))
The inorganic phosphor 4 (not shown) contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 each absorb light and emit light having a color different from the color of the absorbed light. A color conversion member made of an inorganic material or a second inorganic material.
The phosphor material used as the inorganic phosphor 31 may be any material that absorbs incident light that is excitation light and performs color conversion (wavelength conversion) to light of a different color (wavelength).
The inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 may be the same type or different types.
When the inorganic phosphor is of the same type, the inorganic molded body 1 has the same type of inorganic phosphor on both the substrate 2 and the phosphor layer 3. For this reason, the light incident on the inorganic molded body 1 from a light source or the like has a high probability of being irradiated on the inorganic phosphor in either the substrate 2 or the phosphor layer 3, and the color of light by the same type of inorganic phosphor It is possible to increase the conversion efficiency.

On the other hand, when the inorganic phosphors are of different types, the inorganic molded body 1 has different types of inorganic phosphors on the substrate 2 and the phosphor layer 3, respectively. Therefore, some of the light incident on the inorganic molded body 1 from a light source or the like is irradiated to the inorganic phosphor 4 contained in the substrate 2, and the other part of the light is inorganic fluorescence contained in the phosphor layer 3. The body 31 is irradiated. And both the light emitted from the inorganic phosphor 4 contained in the substrate 2 and the light emitted from the inorganic phosphor 31 contained in the phosphor layer 3 are mixed and emitted from the inorganic molded body 1. Become. In some cases, a part of the light emitted from either the inorganic phosphor 4 contained in the substrate 2 or the inorganic phosphor 31 contained in the phosphor layer 3 is irradiated to another type of inorganic phosphor. In addition, light of a different color may be emitted.
Accordingly, when the inorganic phosphors are of different types, a plurality of colors of light are mixed and emitted from the inorganic molded body 1 including a part of incident light emitted without being irradiated to the inorganic phosphor. The Rukoto.

Since the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 can be independently changed, the type, particle diameter, and content of the respective inorganic phosphors. Various combinations of inorganic molded bodies 1 with different amounts, inclusion forms, and the like can be designed. As a result, light having various spectra can be freely developed. Depending on the purpose and application, it is possible to select and apply the optimum combination from these various combinations.
For example, blue light is used as light source light, and the substrate 2 is made of a material in which LAG (lutetium / aluminum / garnet) phosphor fine particles that convert blue light into green light are dispersed in transparent glass. If the inorganic phosphor 31 contained in the phosphor layer 3 using a substrate is an inorganic phosphor that converts blue light into red light, these three colors including the light source are mixed to produce white light. can do.

In the inorganic molded body 1 of this embodiment, a plurality of types of phosphors can be used in combination as the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3, respectively. Mixing and using a plurality of types of phosphors is effective for producing a special color or making a simple structure.
In addition, the inorganic molded body 1 of the present embodiment may have a configuration having a plurality of phosphor layers 3. For example, two phosphor layers 3 may be provided on the front side and the back side of the substrate 2, or two or more phosphor layers 3 may be provided on one side of the substrate 2. By setting it as such a structure, it can be set as the inorganic molded object 1 which has 3 or more types of fluorescent substance with the inorganic fluorescent substance 4 which the board | substrate 2 contains.

In the present embodiment, unlike the conventional case, it is not necessary to take a complicated configuration by combining a plurality of light emitting elements of different colors or combining a plurality of color conversion phosphors. By the inorganic molded body 1, it is possible to mix and emit a plurality of colors of light different from the incident light.
Conventionally, a plurality of types of color conversion phosphors are bonded together with a resin-based adhesive, or a plurality of types of color conversion phosphors are dispersed in a resin. However, in this embodiment, it is not necessary to use a resin-based material mainly composed of inorganic materials and inferior in thermal conductivity, heat resistance, and light resistance, so that heat dissipation and durability are improved. It is possible.

  Here, the advantage of being able to use a plurality of types of phosphors in one inorganic molded body 1 will be further described from the three viewpoints of luminous efficiency, durability, and color mixing.

(Luminescence efficiency)
In a conventional color conversion molding containing a plurality of phosphors, light from a phosphor having a short emission wavelength is absorbed by the phosphor having a long emission wavelength, and the light is gradually converted into light. There is a problem of loss due to secondary absorption in which the energy of the LED is lost, the total amount of light emitted from the LED is substantially reduced, and the energy conversion efficiency of the LED is reduced.
The problem of loss due to secondary absorption is, for example, close to the light source when a plurality of types of phosphors are mixed in the same phosphor layer of the inorganic molded body or from the characteristics of the phosphors. This occurs when a phosphor with a short emission wavelength is arranged in the phosphor layer on the side and a phosphor with a long emission wavelength is arranged in the phosphor layer on the side far from the light source.

  However, in the present embodiment, a phosphor having a long emission wavelength (long absorption wavelength) is disposed on the substrate 2 or phosphor layer 3 on the side close to the light source, and the substrate 2 or phosphor layer 3 on the side far from the light source. In addition, since a phosphor having a short emission wavelength (short absorption wavelength) can be disposed, the loss due to the secondary absorption is reduced, and the light emission efficiency can be improved. In general, the amount of phosphor used for color conversion is as small as possible, and the number of times of color conversion is as small as possible improves the luminous efficiency of the LED.

(durability)
Conventionally, as a structure of a color conversion molded body containing a plurality of phosphors, a resin in which a phosphor of a type different from the phosphor contained in the substrate is dispersed on both sides or one side of the substrate having a color conversion function There was a molded article for color conversion having a structure in which layers were arranged. However, the phosphor dispersed in the resin is not provided with a heat dissipation path, and since the gas barrier property of the resin is not high, the phosphor and the resin are easily deteriorated by the external environment, and there is a problem in durability. There was something.
On the other hand, in the configuration of the present embodiment, the phosphor layer 3 containing the inorganic phosphor 31 is continuously connected to the substrate 2 having a color conversion function, so that the inorganic phosphor 31 can be easily dissipated. It will be excellent in durability. In addition, since the inorganic phosphor 31 is protected by the uniform coating layer 32 made of an inorganic material and having excellent gas barrier properties, the inorganic phosphor 31 is not easily deteriorated by the external environment and has excellent durability. .

  Further, conventionally, for example, phosphoric acid-based low-melting glass having a melting point of about 400 ° C. has not been used as a color conversion molding because of its deliquescence property. However, in the present embodiment, not only the inorganic phosphor 31 but also the substrate 2 is protected from the external environment by the coating layer 32 made of an inorganic material, so that the durability as the inorganic molded body 1 is improved. Low melting glass and phosphors having low heat resistance that could not be used can be used as the constituent material of the inorganic molded body 1, and the types of phosphors that can be selected are increasing.

(Color mixing)
Conventionally, in order to improve the uniformity of the color mixture of the inorganic molded body 1, a filler for light diffusion has been added to the glass serving as the substrate. There were restrictions on the selection of the type of phosphor and filler added to the inside.
However, in this embodiment, the surface of the substrate 2 having a color conversion function has the inorganic particle layer 3 having the voids 33, and the surface of the inorganic particle layer 3 has an uneven shape. Thus, it is possible to improve the uniformity of the color mixture without greatly reducing the light emission efficiency.

Further, as the structure of the inorganic particle layer 3, the uniformity of color mixing can be improved by controlling the abundance ratio of the voids 33, the thickness of the layer, the type of the inorganic phosphor 31, the particle diameter, the content, the shape, and the like. Is possible.
Furthermore, by providing a reflective layer partially or entirely on the side of the substrate 2 opposite to the side on which incident light from the light emitting element is incident, the color mixing property can be improved.

  As can be seen from the above, the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3, that is, the first inorganic material and the second inorganic material are of different types. Therefore, it is possible to express various excellent effects, which is preferable.

The average particle diameter of the particles of the inorganic phosphor 31 contained in the phosphor layer 3 is not particularly limited, but those having a size of about 0.1 to 100 μm can be used from the viewpoint of light color conversion efficiency. From the viewpoint of ease of handling, it is preferably 1 to 50 μm, more preferably 2 to 30 μm.
In addition, the value of an average particle diameter is the air permeation method or F.I. S. S. S. No (Fisher-SubSieve-Sizers-No.) (A value represented by a so-called D bar (bar above D)).

  Further, the central particle size Dm measured by a laser diffraction type particle size distribution measuring device (for example, SALD series manufactured by Shimadzu Corporation) or an electric resistance type particle size distribution device (for example, Coulter counter manufactured by Coulter COULTER). When the ratio of (Median Diameter) to the above-described average particle diameter D bar is (Dm / D bar) as an index indicating the dispersibility of the particles of the inorganic phosphor 31, the index value is closer to 1 preferable. That is, the closer the index value is to 1, the higher the dispersibility of the particles, the less the particles are aggregated, and the phosphor layer 3 with less stress can be formed. Thereby, generation | occurrence | production of the crack in the fluorescent substance layer 3 can be suppressed.

  The inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 may be used by mixing not only one type but also a plurality of types of inorganic phosphors. In the case of the inorganic phosphor 31 contained in the phosphor layer 3, a plurality of types of inorganic phosphor 31 particles may be mixed and used, or a plurality of types of inorganic phosphor 31 particle layers may be sequentially stacked. May be created.

Specific examples of the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 include the following.
For example, nitride phosphors / oxynitride phosphors / sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid elements such as Eu, and transition metal elements such as Mn. Activated alkaline earth metal halide apatite phosphor, alkaline earth metal halogen borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate phosphor, alkaline earth metal sulfide Phosphor, alkaline earth metal thiogallate phosphor, thiosilicate phosphor, alkaline earth metal silicon nitride phosphor, germanate phosphor, alkali metal halogen silicate phosphor, alkali metal germanate phosphor, or , At least one selected from rare earth aluminate phosphors, rare earth silicate phosphors and the like mainly activated by a lanthanoid element such as Ce It is preferable that. As specific examples, the following phosphors can be used, but are not limited thereto.

Nitride-based phosphors mainly activated with lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, MAlSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg, Zn) At least one or more). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).

Eu, sialon phosphors activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).

For alkaline earth metal halogen apatite phosphors mainly activated by lanthanoid elements such as Eu and transition metal elements such as Mn, M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br, I. R is any one of Eu, Mn, Eu and Mn. .)and so on.

In the alkaline earth metal halogen borate phosphor, M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, And at least one selected from Cl, Br, and I. R is Eu, Mn, Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is any one of Eu, Mn, Eu and Mn).

Examples of the alkaline earth metal silicate phosphor include M ₂ SiO ₄ : Eu (M is at least one selected from Ca, Sr, Ba, Mg, and Zn).

Examples of the alkaline earth metal sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

The alkali metal halogen silicate phosphor includes MSix ₆ : Mn (M is one or more selected from Li, Na and K, and X is one or more selected from F, Cl, Br and I). In addition, there is a phosphor represented by a composition formula of Li ₂ SiF ₆ : Mn, K ₂ (SiGe) F ₆ : Mn.

Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ There are YAG phosphors represented by the composition formula of (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce. Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.

Other phosphors include MS: Eu, Zn ₂ GeO ₄ : Mn, 0.5MgF ₂ .3.5MgO · GeO ₂ , MGa ₂ S ₄ : Eu (M is Sr, Ca, Ba, Mg, Zn) At least one selected from the above). These phosphors contain at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti in place of or in addition to Eu as desired. You can also

  Further, phosphors other than the above-described phosphors and having the same performance and effect can be used.

  These phosphors can be used with those having emission spectra of yellow, red, green and blue by the excitation light from the light emitting element, and also have emission spectra in the intermediate colors such as yellow, blue green and orange. It can also be used. By using these phosphors in various combinations, light emitting devices having various emission colors can be manufactured.

For example, using a GaN-based or InGaN-based compound semiconductor light emitting element that emits blue light as a light source, the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 may be Y ₃ Al ₅ O _12. : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : A phosphor that converts blue light of Ce into yellow is used for color conversion, and the light from the light emitting element and the fluorescence A light-emitting device that emits white light by a mixed color with light from the body can be provided.

For example, the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3 may be CaSi ₂ O ₂ N ₂ : Eu or SrSi ₂ O ₂ N ₂ : Eu that emits light from green to yellow, By using three types of phosphors consisting of (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu emitting blue light, Ca ₂ Si ₅ N ₈ : Eu emitting light red or CaAlSiN ₃ : Eu Thus, a light emitting device that emits white light with excellent color rendering can be provided. Further, in this configuration, since the three primary colors of light, red, blue, and green, are used, visible light having a wide range of colors can be emitted only by changing the blending ratio of the phosphors.

  As specific examples of the inorganic phosphor 4 contained in the substrate 2 and the inorganic phosphor 31 contained in the phosphor layer 3, the phosphors described above include, for example, sulfide-based phosphors that are non-oxide phosphors. Some phosphors, halogen silicate phosphors, nitride phosphors, oxynitride phosphors, and the like, are easily decomposed by heat and deactivate the activator. In addition, some fluoride phosphors are deteriorated depending on the atmosphere, such as deliquescence by moisture.

In the present embodiment, when the phosphor layer 3 is formed, a high temperature is not applied unlike the sintering method or the molding method by glass sealing, so that the inorganic phosphor 31 contained in the phosphor layer 3 is used. For example, nitride phosphors such as CASN and SCASN, which are non-oxide phosphors, are easily deteriorated by heat.
Further, in the present embodiment, the inorganic phosphor 31 is preferably densely covered with a coating layer 32 formed by an atomic layer deposition method to be described later, and thus is easily deliquescent by moisture, such as LiSiF ₄ : Mn. Fluoride phosphors can be used.

  From the above, the phosphor 4 contained in the substrate 2 is preferably a phosphor that does not decrease the efficiency of the phosphor when the substrate 2 is manufactured and processed, and is generally a rare earth aluminate phosphor or rare earth silicic acid. In many cases, oxide phosphors having relatively excellent heat resistance, such as salt phosphors and alkaline earth metal aluminate phosphors, are selected. On the other hand, as the inorganic phosphor 31 contained in the phosphor layer 3, heat is hardly applied when the phosphor layer 3 is produced and processed, and after the production, the phosphor layer 3 is protected by the coating layer 32. It is possible to select from a relatively wide range of phosphors, including phosphors with inferior.

(Coating layer)
The coating layer 32 is a light-transmitting film that covers the particles of the granular inorganic phosphor 31 and fixes the particles, the substrate 2, and the particles together. That is, the coating layer 32 has a function as a protective layer of the inorganic phosphor 31, a function as a binder, and a function as a heat conduction path.

The coating layer 32 is made of Al ₂ O ₃ , SiO ₂ , ZrO ₂ , HfO ₂ , TiO ₂ , ZnO, Ta ₂ O ₅ , Nb ₂ O ₅ , In ₂ O ₃ , SnO ₂ , TiN, AlN, or the like. At least one compound selected from the group described above can be suitably used.
The coating layer 32 is formed by an ALD (Atomic Layer Deposition) method, a MOCVD (Metal Organic Chemical Vapor Deposition) method, or a PECVD (Plasma-Enhanced Chemical Vapor Deposition) method. It can be formed by an atmospheric pressure plasma film formation method or the like.

  In particular, the ALD method is preferable because a film to be formed is dense, a shape having a step (unevenness) is high, and a film with a uniform thickness can be formed. In addition, the coating layer 32 formed by the ALD method can satisfactorily cover the particles of the inorganic phosphor 31 and integrate the aggregates of the particles of the inorganic phosphor 31 even if the film thickness is thin. The thickness of the phosphor layer 3 can be further reduced. For this reason, the heat generated by the Stokes loss generated by the particles of the inorganic phosphor 31 can be quickly conducted to the substrate 2 having a heat dissipation function through the thin coating layer 32. Thereby, the inorganic molded object 1 excellent in heat dissipation can be formed. In order to obtain good heat dissipation, the thickness of the phosphor layer 3 is preferably set in the above-described range, and the thickness of the coating layer 32 is preferably set in the range described later.

In addition, as a raw material for the coating layer 32 formed by the ALD method, an organometallic material having a vapor pressure from room temperature to 300 ° C., a metal halide, or the like is used. In particular, a film made of Al ₂ O ₃ formed by the ALD method is preferable because it has a high barrier property against an atmosphere such as moisture. TMA (trimethylaluminum) and water are used as raw materials for forming the Al ₂ O ₃ film.

Moreover, the film thickness of the coating layer 32 can be 10 nm-50 micrometers by average thickness, Preferably it is 50 nm-30 micrometers, More preferably, it can be 100 nm-10 micrometers.
The film thickness of the coating layer 32 is the thickness of the portion uniformly covering the particles of the inorganic phosphor 31 (in the case where an inorganic filler or the like is added, particles such as the inorganic phosphor 31 and the inorganic filler). Point to.

  The covering layer 32 can be formed as a single layer made of the above-described compound, or can be formed as a multilayer film made of different materials. In the case of forming with a multilayer film, for example, a dense layer by ALD method is formed as the first layer (layer in contact with the inorganic phosphor 31), and then PECVD method or atmospheric pressure plasma film forming method is used as the second layer. It is also possible to form a film by a method having a high film formation speed.

(Void)
The gap 33 is formed as a gap between particles of the inorganic phosphor 31 laminated on the substrate 2. That is, the gap 33 is a space surrounded by any of the substrate 2, the inorganic phosphor 31, and the coating layer 32. When the phosphor layer 3 includes particles other than the inorganic phosphor 31 such as an inorganic filler or conductive particles, the void 33 is formed as a gap between these particles including the inorganic phosphor 31. The

  The air gap 33 can scatter light incident on the phosphor layer 3 and efficiently absorb the incident light in the inorganic phosphor 31. The porosity is preferably about 1 to 50%, more preferably 5 to 30%. The optimum value of the porosity depends on the particle diameter of the inorganic phosphor 31 and the film thickness of the coating layer 32. By setting the porosity to 1% or more, incident light can be effectively scattered, By setting it to 50% or less, even when the phosphor layer 3 is thinned, the content of the inorganic phosphor 31 sufficient for color conversion can be obtained.

  In addition, by providing the gap 33 in the above-described range of the porosity, even when the difference in linear expansion coefficient between the substrate 2 and the phosphor layer 3 is large, the molding is performed due to a temperature rise during use in the manufacturing process or after manufacturing. The strain applied to the body can be absorbed and the occurrence of cracks can be prevented.

  Note that the porosity in the phosphor layer 3 can be controlled by adjusting the average particle diameter of the inorganic phosphor 31 and the film thickness of the coating layer 32 within the above-described ranges. That is, by determining the film thickness of the coating layer 32 according to the average particle diameter of the inorganic phosphor 31, the void 33 having a desired porosity can be formed. In addition, when an inorganic filler is added to the phosphor layer 3, the porosity can be controlled by the average particle diameter of the inorganic phosphor 31 particles and the inorganic filler particles combined with the film thickness of the coating layer 3. it can. In controlling the porosity, it is preferable to further consider the shape of the particles and the dispersibility of the particles.

(Void filling)
Alternatively, the gap 33 may be filled with a filler. As the filler, a gas such as an air layer (mixed gas of N ₂ , O ₂ , CO _2, etc.) is preferable. However, the present invention is not limited thereto, and an inorganic compound (for example, AlOOH, SiOx, etc.), an inorganic raw material (for example, polysilazane, etc.), a solid such as glass or nano-inorganic particles occupies a part or all of the packing. Also good. As a raw material for such a solid filler, a liquid containing an inorganic compound such as a liquid glass material or a sol-gel material can be given. Further, as the liquid solvent containing the inorganic compound as described above, water, an organic solvent, or a resin mainly composed of an inorganic substance such as silicone or a fluororesin can be used.

Note that these solid fillers provided in the gaps 33 may include the same material as that of the coating layer 32. In this case, it is preferable that the coating layer 32 and the filling of the gap 33 have different physical properties such as refractive index and transmittance. For this purpose, for example, the coating layer 32 can be Al ₂ O ₃ formed by the ALD method, and the filling of the gap 33 can be Al ₂ O ₃ formed by the sol-gel method. Thus, by different formation methods, crystallinity and density are different, and the above-described physical properties can be made different.
In this way, by filling the gap 33 with a material having physical properties different from those of the coating layer 32, diffusion and extraction of light incident on the phosphor layer 3 can be controlled.

(Translucent layer)
The translucent layer 5 is an electrode for forming the particle layer 34 of the inorganic phosphor 31 on the substrate 2 by an electrodeposition method or an electrostatic coating method in a phosphor layer forming step S11 (see FIG. 2) described later. The conductive layer 6 (see FIG. 3B) formed for use as a transparent layer or a transparent conductive layer. Therefore, the light-transmitting layer 5 can be made of a material that has conductivity in the above-described manufacturing process and can be made transparent thereafter, or a light-transmitting material having conductivity.

Examples of the material that has conductivity and can be made transparent later include a metal material containing at least one selected from Al, Si, Zn, Sn, Mg, and In. For example, Al can be oxidized by being exposed to hot water at about 90 ° C., and can be changed to translucent Al ₂ O ₃ . In addition, Al is preferable because it can be oxidized and transparentized at a relatively low temperature. In this case, an Al ₂ O ₃ film is formed as the translucent layer 5. Furthermore, when an Al ₂ O ₃ film is formed as the covering layer 32, since the same material is used, the covering layer 32 and the translucent layer 5 are well adhered. For this reason, the inorganic phosphor 31 is well protected from an atmosphere such as moisture, and the peeling of the phosphor layer 3 from the substrate 2 is prevented. Also for materials other than Al, it is preferable that the light-transmitting layer 5 and the covering layer 32 be made of the same material so that good adhesion between the light-transmitting layer 5 and the covering layer 32 can be obtained. .

As another method for converting the conductor layer 6 into the translucent layer 5, treatment with ammonia water can be used. For example, when Al or Zn is used as the material of the conductor layer 6, light-transmitting Al (OH) ₃ (aluminum hydroxide) and Zn (OH) ₂ (hydroxylation) are obtained by treating with ammonia water. Zinc). Moreover, since these are produced | generated as a gel-like substance, the effect as a binding material of the particle | grains of the inorganic fluorescent substance 31 can also be anticipated.

In addition, as the translucent material having conductivity, for example, at least one selected from the group consisting of Zn (zinc), In (indium), Sn (tin), Ga (gallium), and Mg (magnesium) And conductive metal oxides containing these elements. Specifically, ZnO, AZO (Al-doped ZnO), IZO (In-doped ZnO), GZO (Ga-doped ZnO), In ₂ O ₃ , ITO (Sn-doped In ₂ O ₃ ), IFO (F-doped In ₂ O ₃ ), conductive metal oxides such as SnO ₂ , ATO (Sb-doped SnO ₂ ), FTO (F-doped SnO ₂ ), CTO (Cd-doped SnO ₂ ), and MgO.
In addition, when the translucent material which has electroconductivity is used, the conductor layer transparency process S12 (refer FIG. 2) can be abbreviate | omitted in the manufacturing method mentioned later.

[Method for producing inorganic molded body]
Next, the manufacturing method of the inorganic molded object which concerns on 1st Embodiment of this invention is demonstrated with reference to FIG.
As shown in FIG. 2, the method for manufacturing an inorganic molded body according to the first embodiment includes a conductor layer forming step S10, a phosphor layer forming step S11, a conductor layer transparentizing step S12, and a covering layer forming step. S13, and in this order.
Hereinafter, each step will be described in detail with reference to FIG. 3 (refer to FIGS. 1 and 2 as appropriate).

(Conductor layer forming process)
First, in the conductor layer forming step S10, as shown in FIG. 3A, a conductor layer 6 made of a conductor material is formed on the upper surface of the substrate 2, which is a region where the phosphor layer 3 is formed. .
Here, the board | substrate 2 is a translucent board | substrate containing the inorganic fluorescent substance 4 which consists of a 1st inorganic material.
As the conductor layer 6, for example, Al can be used as a material that can be made transparent in the conductor layer transparency step S <b> 12, which is a subsequent step. The conductor layer 6 can be formed by, for example, a sputtering method, a vapor deposition method, a plating method, or the like. In addition, before forming the conductor layer 6, masking is performed using a tape, a photoresist, or the like except for the region where the phosphor layer 3 is provided.

  Further, the conductive layer 6 is made of the above-described light-transmitting material such as ITO or ZnO as the conductive material, and the conductive layer 6 is formed by, for example, a physical method such as a sputtering method or a vapor deposition method, or a spray method or a CVD (Chemical method). It can be formed by a chemical method such as a Vapor Deposition method. In addition, when the conductor layer 6 is formed using a translucent material, the conductor layer transparency step S12 can be omitted.

(Phosphor layer forming step (inorganic particle layer forming step))
Next, in the phosphor layer forming step S <b> 11, as shown in FIG. 3B, a particle layer 34 that is an aggregate of particles of the inorganic phosphor 31 is formed on the upper surface of the substrate 2. In the present embodiment, a case where the particle layer 34 of the inorganic phosphor 31 is formed by an electrodeposition (electrodeposition) method will be described.
In addition, when adding inorganic particles, such as an inorganic filler and electroconductive particle, to the fluorescent substance layer 3, the particle layer 34 becomes an aggregate of the particles of the inorganic fluorescent substance 31 and these particles.

According to the electro-deposition method, the substrate 2 provided with the conductor layer 6 serving as one electrode in the electrodeposition tank containing the solution in which the granular inorganic phosphor 31 is suspended at room temperature, and the other electrode The counter electrode to be is immersed, and a voltage is applied between the electrodes. Note that a voltage having a polarity different from the polarity with which the inorganic phosphor 31 is charged is applied to the substrate 2 side. As a result, the particles of the inorganic phosphor 31 are electrophoresed and adhere to the substrate 2 via the conductor layer 6. The thickness of the particle layer 34 of the inorganic phosphor 31 can be controlled by adjusting the amount of coulomb determined by the current and time passed between the electrodes.
Although the solvent used for this electrodeposition method is not specifically limited, Alcohol solvents, such as IPA (isopropyl alcohol), can be used conveniently.

  Moreover, it is preferable to add an inorganic binder for binding particles of the inorganic phosphor 31 and the substrate 2 and particles of the inorganic phosphor 31 to the solution. The inorganic binder is for preventing the particles of the inorganic phosphor 31 laminated by the electro-deposition method from being dissipated until the coating layer 32 is formed in the coating layer forming step S13 which is a subsequent step. As the inorganic binder, for example, alkaline earth metal ions such as Mg ions, Ca ions, and Sr ions can be used. The added alkaline earth metal ions are precipitated as hydroxides and carbonates and exhibit binding power. Since these hydroxides and carbonates are colorless and transparent, even if they remain in the phosphor layer 3 after manufacture, the color conversion efficiency does not decrease. Further, since it is an inorganic substance, the color conversion efficiency is not lowered due to a change with time.

  In order to efficiently perform the electrophoresis of the inorganic phosphor 31, it is preferable to add a charge control agent such as a metal salt to the solution. In addition, the charge control agent may be coated on the particles of the inorganic phosphor 31 without being added to the solution.

  In the present embodiment, the particle layer 34 of the inorganic phosphor 31 is formed by the electrodeposition method in the phosphor layer forming step S11. However, the present invention is not limited to this. For example, the electrostatic coating method can be used with the substrate 2 provided with the conductor layer 6 as one electrode. Further, when the phosphor layer 3 is formed on the upper surface, a centrifugal sedimentation method can also be used. In addition, a pulse spray method can also be used. Moreover, it can also use combining the above-mentioned method.

  In addition, when forming the particle layer 34 of the inorganic fluorescent substance 31 using a centrifugal sedimentation method or a pulse spray method, formation of the conductor layer 6 is unnecessary. In this case, the conductor layer forming step S10 and the conductor layer transparency step S12 can be omitted. In this case, in the inorganic molded body 1 shown in FIG. 1, the phosphor layer 3 is directly provided on the non-conductive translucent substrate 2 without the translucent layer 5. An inorganic molded body is formed.

(Conductor layer transparency process)
Next, in the conductor layer transparentization step S <b> 12, as shown in FIG. 3C, the conductor layer 6 is made transparent and changed to the translucent layer 5. When the conductor layer 6 is formed of an Al film, for example, the Al can be oxidized by being exposed to hot water at about 90 ° C. to be changed to a light-transmitting Al ₂ O ₃ film.
Further, when the conductor layer 6 is formed of an Al film, it can be treated with ammonia water to change the Al to translucent Al (OH) ₃ .

Further, the metal forming the conductor layer 6 may be dissolved and removed. As a method for removing the conductor layer 6, a dissolution reaction with an acid can be used. As the acid, for example, HCl (hydrochloric acid), H ₂ SO ₄ (sulfuric acid), HNO ₃ (nitric acid), an aqueous solution of other inorganic acids or organic acids can be used. For example, in the case of using Al as the material of the conductor layer 6, by immersion in acid solution, it is removed by dissolving the Al ³⁺ next acid solution.

Further, when an amphoteric metal such as Al, Zn or Sn is used as the material of the conductor layer 6, NaOH (sodium hydroxide), KOH (potassium hydroxide) or other methods can be used as a method of removing the conductor layer 6. A dissolution reaction with an aqueous alkali solution can be used. For example, when Al, Zn, or Sn is used as the material of the conductor layer 6, Na [Al (OH) ₄ ] and Na ₂ [Zn (OH) ₄ ]] are reacted with a sodium hydroxide aqueous solution, respectively. , Na ₂ [Sn (OH) ₄ ] and the like are generated and dissolved in an alkaline aqueous solution to be removed.

  In addition, when removing the conductor layer 6, in the inorganic molded object 1 shown in FIG. 1, it does not have the translucent layer 5, but on the board | substrate 2 which has nonelectroconductive translucency, a fluorescent substance layer An inorganic molded body having a configuration in which 3 is directly provided is formed.

(Coating layer forming process)
Next, in the coating layer forming step S13, as shown in FIG. 3D, a coating layer 32 that covers the particles of the inorganic phosphor 31 is formed. The particles of the inorganic phosphor 31 are covered with the coating layer 32, and the particles of the inorganic phosphor 31 and the translucent layer 5 and the particles of the inorganic phosphor 31 are fixed to each other, so that the integrated inorganic molded body 1 is obtained. can get. In the coating layer forming step S13, the coating layer 32 can be formed by an ALD method, an MOCVD method, or the like.

  Further, when the translucent layer 5 and the covering layer 32 are formed of the same material, the adhesion between the phosphor layer 3 and the translucent layer 5 is good, and the inorganic phosphor 31 in contact with the translucent layer 5 is formed. Good barrier properties against an atmosphere such as moisture can be obtained, and the phosphor layer 3 can be made difficult to peel from the substrate 2.

Further, after performing the coating layer forming step S13, a layer made of an inorganic material such as a SiO ₂ film may be further formed on the surface of the phosphor layer 3 as a protective layer or a non-reflective coating layer. This layer can be formed by, for example, a sputtering method, a CVD method, an ALD method, an atmospheric pressure plasma method, or the like.

  Moreover, when providing solid as a filler other than an air layer in the space | gap 33, it can carry out as it demonstrates below, following coating layer formation process S13. It should be noted that the air gap 33 after the coating layer forming step S13 is filled with air.

  The solid filler can be provided by filling the void 33 with a solution (solid-containing liquid) in which a solid is dispersed in a solvent, volatilizing the solvent, and solidifying by heating at a low temperature. For example, a solid-containing liquid, such as liquid glass or a sol-gel material, is applied to the phosphor layer 3 by dropping or coating to create a vacuum. As a result, the air filling the gap 33 can be removed from the gap 33 and the solid-containing liquid can be filled in the gap 33 instead. Then, the solid filling can be provided in the gap 33 by setting the temperature at which the solvent of the solid-containing liquid volatilizes. In addition, it is preferable that the temperature heated in order to volatilize a solvent is a comparatively low temperature of about 300 degrees C or less.

(Coating layer formation process by ALD method)
Here, with reference to FIG. 4, the coating layer forming step S13 when the ALD method is used will be described in detail. As shown in FIG. 4, the coating layer forming step S13 in the present embodiment includes a pre-baking step S131, a sample setting step S132, a pre-deposition storage step S133, a first raw material supply step S134, and a first exhaust step S135. The second raw material supply step S136 and the second exhaust step S137, and the first raw material supply step S134 to the second exhaust step S137 are repeatedly performed a predetermined number of times.

(Pre-baking process)
First, in the pre-baking step S131, a baking process is performed in which a sample in which the particle layer 34 of the inorganic phosphor 31 is formed on the upper surface and side surfaces of the substrate 2 is heated using an oven.
In this embodiment, H ₂ O (water) is used as the first raw material, TMA (trimethylaluminum) is used as the second raw material, and the Al ₂ O ₃ film is formed as the coating layer 32. For this reason, in order to form a film satisfactorily, it is preferable to remove as much as possible by evaporating moisture contained in the sample before film formation.
The baking treatment can be performed, for example, by heating the sample in an oven at 120 ° C. for about 2 hours.

(Sample setting process)
Next, in the sample setting step S132, in order to form the coating layer 32, the sample is put into a reaction container (not shown). The reaction vessel is connected to a first raw material supply line, a second raw material supply line, a nitrogen gas supply line, a vacuum line (all not shown), and the like.

(Storage process before film formation)
Next, in the pre-deposition storage step S133, the inside of the reaction vessel in which the sample is stored is brought into a low pressure state through, for example, a vacuum line connected to a rotary pump, and the state in the reaction vessel is stabilized. At this time, nitrogen gas is introduced into the reaction vessel, and unnecessary substances such as air are exhausted from the reaction vessel.

The pressure in the reaction vessel is, for example, about 0.1 to 10 torr (133 to 13332 Pa), the flow rate of nitrogen gas is about 20 sccm (33 × 10 ⁻³ Pa · m ³ / s), and this state is maintained for stabilization. The maintaining time can be about 10 minutes.
Moreover, although the temperature in reaction container can be about 100 degreeC, for example, the film-forming temperature can be freely set within the range of 50-500 degreeC. During the subsequent film formation, this temperature is generally maintained, but the present invention is not limited to this, and the temperature may be changed midway.

  The temperature during film formation can be set as appropriate, but is preferably set in the range of about 50 to 500 ° C., taking into consideration the heat resistance of the inorganic phosphor 31 to be used, and is set to 100 to 200 ° C. More preferably. Film formation by the ALD method can be performed at a lower temperature than molding by the sintering method or film formation by the MOCVD method. For this reason, the inorganic molded object 1 using the inorganic fluorescent substance 31 which light-emits red, such as CASN and SCASN with especially low heat resistance, can be produced.

(First raw material supply process)
Next, in the first raw material supply step S134, H ₂ O as the first raw material is introduced into the reaction vessel. H ₂ O is introduced as normal temperature steam. After introduction of the H 2 _O, it introduced H _{2 O} is then waits for a predetermined time to spread over the entire surface of the sample, is reacted with the entire surface of the sample. Incidentally, introduction of _{H 2} O, to the duration of the first feed step S134, the vapor of _{H 2} O, for example, be introduced in a short time into the reaction vessel, such as 0.001 seconds.
However, the introduction time of the raw material can be determined according to the surface area of the sample, the volume of the apparatus, and the raw material supply amount per unit time. After introducing the raw material H ₂ O, a sufficient time is required for the reaction of the entire surface of the sample.

(First exhaust process)
Next, in the first evacuation step S135, a vacuum line is connected to the reaction vessel, nitrogen gas is introduced, and excess H ₂ O and by-products that have not contributed to the reaction are exhausted from the reaction vessel. In addition, the by-product in this process is methane gas.

(Second raw material supply process)
Next, in the second raw material supply step S136, TMA as the second raw material is introduced into the reaction vessel. TMA is introduced as normal temperature steam. After introducing the TMA, the system waits for a predetermined time until the introduced TMA reaches the entire surface of the sample. The introduction of TMA can be performed in the same manner as the introduction of H ₂ O described above.
However, the introduction time of the raw material can be determined according to the surface area of the sample, the volume of the apparatus, and the raw material supply amount per unit time. After introducing the raw material TMA, a sufficient time is required for the reaction of the entire surface of the sample.

(Second exhaust process)
Next, in the second evacuation step S137, a vacuum line is connected to the reaction vessel, nitrogen gas is introduced, and excess TMA and by-products that have not contributed to the reaction are exhausted from the reaction vessel.

  The film forming process in the present embodiment is to repeat a predetermined number of cycles using the first raw material supply process S134 to the second exhaust process S137 as a basic film forming cycle. Therefore, after the end of the second exhaust process S137, it is determined whether this cycle has been performed a predetermined number of times (Step S138). If the predetermined number of times has not been completed (No in Step S138), the process returns to the first raw material supply process S134, and Repeat the cycle. On the other hand, when the predetermined number of times is completed (Yes in step S138), the coating layer forming process is terminated.

According to the ALD method, the coating layer 32 is stacked in units of atomic layer level by performing the basic cycle of film formation once. For this reason, the thickness of the coating layer 32 can be freely controlled according to the number of cycles to be executed.
Further, since the covering layer 32 is laminated in units of atomic layer level, the covering layer 32 has a high step coverage such as a concavo-convex shape, and forms a dense and uniform film with very few pinholes. Can do.
In addition, by forming the covering layer 32 having an appropriate thickness, the gap between the particles of the inorganic phosphor 31 is not completely filled, and the gap 33 (see FIG. 1B) is left in the phosphor layer 3. Can do.
Moreover, according to the ALD method, since the particles of the inorganic phosphor 31 are densely and uniformly coated, a fluoride phosphor that is easily deteriorated by moisture can be used.

  In addition, when processing the fluorescent substance which is easy to deteriorate with moisture like the fluoride fluorescent substance into the inorganic molded object 1, it is preferable to do as follows. First, the surface of the particles of the inorganic phosphor 31 is water-resistant coated in advance by various coating methods. Next, the particle layer 34 is formed on the surface of the substrate 2 by an electro-deposition method, an electrostatic coating method, or the like within a short time using the inorganic phosphor 31 having a water-resistant coating. Then, by forming the coating layer 32 by the ALD method, the substrate 2 and the particle layer 34 are integrated and molded into a bulk body. Thereby, the inorganic molded object 1 can be produced, preventing the influence of the water | moisture content in a manufacturing process. Moreover, it can be set as the inorganic molded object 1 which is protected from atmosphere, such as a water | moisture content, by the coating layer 32 after manufacture, and hardly deteriorates.

<Modification of First Embodiment>
Next, with reference to FIG. 5, the structure of the inorganic molded body which concerns on the modification of 1st Embodiment is demonstrated.
The inorganic molded body 1 according to the first embodiment shown in FIG. 1 is obtained by providing a phosphor layer 3 on a flat substrate 2 with a translucent layer 5 interposed therebetween. In the present invention, the phosphor layer 3 is formed by adhering the granular inorganic phosphor 31 to the substrate 2 through the translucent layer 5 and fixing it with the coating layer 32, so that the shape of the substrate 2 is greatly restricted. Absent.

For example, an inorganic molded body 1 </ b> A ₁ shown in FIG. 5A is obtained by providing a phosphor layer 3 on a surface of a dome-shaped (hemispherical) substrate 2 with a translucent layer 5 interposed therebetween. In addition, an inorganic molded body 1A ₂ shown in FIG. 5B is obtained by providing a phosphor layer 3 on the surface of a tube-shaped substrate 2 with a light-transmitting layer 5 interposed therebetween. In addition, an inorganic molded body 1A ₃ shown in FIG. 5C is obtained by providing a phosphor layer 3 on a convex surface of a convex lens-shaped substrate 2 with a translucent layer 5 interposed therebetween. The shape of the substrate 2 is not limited to these examples, and a substrate 2 having a more complicated shape can also be used. In the example shown in FIG. 5, the description of the gap 33 is omitted. Here, the board | substrate 2 is a translucent board | substrate containing the inorganic fluorescent substance 4 which consists of a 1st inorganic material.
In addition, the phosphor layer 3 can be formed on a wire-like or net-like substrate (base).

In addition, since the inorganic molded bodies 1A _{1 to} 1A _{3 according} to this modification can be manufactured in the same manner as the inorganic molded body 1 according to the first embodiment except that the shape of the substrate 2 is different, the manufacturing method Description of is omitted.

  As another modification, a substrate on which a semiconductor light emitting element is formed can be used as the substrate 2. For example, the phosphor layer 3 can be formed in contact with the substrate on the surface and side surface opposite to the surface on which the semiconductor layer is provided of the substrate of the LED element. Thus, a light emitting device having a phosphor layer can be formed without using an adhesive. Here, the substrate is a translucent substrate containing the inorganic phosphor 4 made of the first inorganic material.

Second Embodiment
Next, the inorganic molded body according to the second embodiment will be described.
[Configuration of inorganic molded body]
First, with reference to FIG. 6, the structure of the inorganic molded body which concerns on 2nd Embodiment is demonstrated. As shown in FIG. 6, in the inorganic molded body 1B according to the second embodiment, the phosphor layer 3 is provided on the upper surface of the conductive translucent substrate 2B.

  The inorganic molded body 1B according to the second embodiment differs from the inorganic molded body 1 according to the first embodiment shown in FIG. 1 in place of the translucent substrate 2 and has a conductive translucent substrate 2B. Is different from the fact that there is no translucent layer 5 and the phosphor layer 3 is provided directly on the upper surface of the substrate 2B. Similar to the inorganic molded body 1 according to the first embodiment, the inorganic molded body 1B according to the second embodiment color-converts light incident from the phosphor layer 3 side or the substrate 2B side and is opposite to the incident surface. It is used as a transmissive color conversion molding member that emits light from the side surface.

(Substrate (base))
The substrate 2B is a plate-like support member having translucency for supporting the phosphor layer 3, and contains an inorganic phosphor 4 made of a first inorganic material that emits light of a color different from incident light. (Not shown). As the substrate 2B, a material having conductivity in addition to translucency is used. Examples of such a material include a conductive metal containing at least one element selected from the group consisting of Zn (zinc), In (indium), Sn (tin), Ga (gallium), and Mg (magnesium). An oxide is mentioned. Specifically, ZnO, AZO (Al-doped ZnO), IZO (In-doped ZnO), GZO (Ga-doped ZnO), In ₂ O ₃ , ITO (Sn-doped In ₂ O ₃ ), IFO (F-doped In ₂ O ₃ ), conductive metal oxides such as SnO ₂ , ATO (Sb-doped SnO ₂ ), FTO (F-doped SnO ₂ ), CTO (Cd-doped SnO ₂ ), and MgO.
Further, the substrate 2B may be the entire substrate 2B, or as described above, the substrate 2B is provided with a light-transmitting conductor layer such as ITO or ZnO on the upper surface. May be.

The shape of the substrate 2B is not limited to a flat plate shape, and a substrate having an arbitrary shape can be used as shown in FIG.
The internal structure of the phosphor layer 3 is the same as that of the phosphor layer 3 of the inorganic molded body 1 according to the first embodiment shown in FIG. In FIG. 6, the description of the gap 33 is omitted.

[Method for producing inorganic molded body]
Next, the manufacturing method of the inorganic molded object which concerns on 2nd Embodiment is demonstrated with reference to FIG.
As shown in FIG. 7, the method for producing an inorganic molded body according to the second embodiment includes a masking step S20, a phosphor layer forming step S21, a coating layer forming step S22, and a masking removing step S23. This is done in this order.
Hereinafter, each step will be described in detail with reference to FIG. 8 (see FIGS. 6 and 7 as appropriate).

(Masking process)
First, in the masking step S20, as shown in FIG. 8A, the substrate 2B is covered with the masking member 20 except for the place where the phosphor layer 3 is formed. In the present embodiment, the lower surface and side surfaces of the substrate 2B are covered.

  As the masking member 20, for example, an adhesive tape or an adhesive sheet made of a resin such as polyimide, polytetrafluoroethylene, or polyolefin can be used. Moreover, it can mask by apply | coating resin materials, such as an acrylic resin, a silicone resin, and an epoxy resin. Furthermore, the resin-based masking member 20 may be patterned using a photoresist. Masking using a photolithographic technique is useful for coating in a fine shape. These masking materials and construction methods can be selected according to the temperature, atmosphere and purpose of use.

  In this embodiment, since the phosphor layer 3 is provided on the upper surface of the substrate 2B, the lower surface and the side surface of the substrate 2B are covered with the masking member 20. However, by changing the region covered with the masking member 20, it is optional. The phosphor layer 3 can be provided in this area.

(Phosphor layer forming process)
Next, in the phosphor layer forming step S21, as shown in FIG. 8B, a particle layer 34 in which particles of the inorganic phosphor 31 are laminated on the upper surface of the substrate 2B is formed. Since the phosphor layer forming step S21 can be performed in the same manner as the phosphor layer forming step S11 in the first embodiment, detailed description thereof is omitted.

(Coating layer forming process)
Next, in the coating layer forming step S22, as shown in FIG. 8C, the particle layer 34 (see FIG. 8B) of the inorganic phosphor 31 formed in the phosphor layer forming step S21 is coated, and the particles A covering layer 32 is formed to fix them together. Since the coating layer forming step S22 can be performed in the same manner as the coating layer forming step S13 in the first embodiment, detailed description thereof is omitted.

(Masking removal process)
Finally, in the masking removal step S23, as shown in FIG. 8D, the masking member 20 (see FIG. 8C) is removed. Thereby, the inorganic molded body 1B in which the phosphor layer 3 is formed on the upper surface of the substrate 2B is obtained.

<Third Embodiment>
Next, an inorganic molded body according to the third embodiment will be described.
[Configuration of inorganic molded body]
First, with reference to FIG. 9, the structure of the inorganic molded body which concerns on 3rd Embodiment is demonstrated. As shown in FIG. 9, in the inorganic molded body 1C according to the third embodiment, the phosphor layer 3 and the translucent layer 5 are provided on the upper surface of the translucent substrate 2C. A reflective layer 7 is provided on the lower surface of the translucent substrate 2C.

  The inorganic molded body 1C according to the third embodiment is different from the inorganic molded body 1 according to the first embodiment shown in FIG. 1 in that a reflective layer 7 is provided on the lower surface of the substrate 2C. Unlike the inorganic molded body 1 according to the first embodiment, the inorganic molded body 1C according to the third embodiment performs color conversion on light incident from the phosphor layer 3 side and emits the light from the same surface as the incident surface. It is used as a reflection type color conversion molding member.

In the inorganic molded body 1C according to the present embodiment, part of the incident light is converted into light having a color different from the color of the incident light by the first inorganic material present in the substrate 2C, and the other part of the incident light. Is converted to light of a color different from the color of incident light by the granular second inorganic material in the phosphor layer 3, and is present on the surface opposite to the side irradiated with the incident light of the substrate 2C. The light is reflected by the layer 7 and is emitted from the same surface as the surface on which the incident light is incident.
Therefore, it can be used as an inorganic molded body for reflection type color conversion.
The reflective layer 7 may exist on the entire surface of the substrate 2C opposite to the side irradiated with the incident light, or may exist on a specific part thereof.

[Method for producing inorganic molded body]
The reflective layer 7 is a metal layer having a high reflectance on the surface of the substrate 2C opposite to the phosphor layer 3 with respect to incident light and light of a color color-converted by the phosphor in the phosphor layer 3 and the substrate 2C. Can be formed. As the metal having a high reflectance in the visible light region, Al, Ag, or an alloy containing these metals can be suitably used.
In addition, a layer made of a dielectric may be provided between the substrate 2C and the reflective layer 7. By disposing a layer made of a dielectric, it is more efficiently reflected by the reflective layer 7, and the light extraction efficiency from the inorganic molded body 1C can be improved. As the dielectric, it is preferable to use one or more materials selected from SiO ₂ , Al ₂ O ₃ , Nb ₂ O ₅ , ZrO ₂ , AlN, TiO ₂ , SiON, SiN and the like.

The reflective layer 7 can be formed by laminating a metal material such as Al or Ag on the substrate 2C by sputtering or vapor deposition.
The reflective layer 7 can be manufactured by providing a reflective layer forming step prior to the phosphor layer forming step in the flowchart showing the flow of the method for manufacturing the inorganic molded body shown in FIG. 2 and FIG. Moreover, it is desirable to manufacture before a masking process or a conductor layer forming process.
Since the reflective layer 7 functions as a reflective surface, it is preferable that the surface of the substrate 2 </ b> C on the side where the reflective layer 7 is formed is processed in advance before the reflective layer 7 is formed.

The inorganic molded body 1C according to the present embodiment has the same configuration as the inorganic molded body 1 according to the first embodiment or the inorganic molded body 1B according to the second embodiment, except that the substrate 2C has the reflective layer 7. Therefore, the description of the constituent members other than the reflective layer 7 is omitted.
Further, the inorganic molded body 1C according to the present embodiment is the same as the inorganic molded body 1 according to the first embodiment or the inorganic molded body 1B according to the second embodiment, except that the substrate 2C forms the reflective layer 7. Therefore, description of the manufacturing method is also omitted.

In the present embodiment, incident light passes through the substrate 2C and the inorganic particle layer 3 at least twice after incident and after reflection. Therefore, it is possible to obtain mixed color light that is superior in color mixing uniformity. Moreover, the utilization efficiency of inorganic fluorescent substance is improved and it can be set as the thinner inorganic molded object 1C, As a result, it becomes the thing excellent in heat dissipation. Furthermore, by making the area for forming the reflective layer 7 a part of the area of the substrate 2C, the amount of reflected light can be controlled, and the color tone can be finely adjusted.
As a modification of the third embodiment, in the inorganic molded body 1B that does not have the translucent layer 5 according to the second embodiment (FIG. 6), the surface of the substrate 2B opposite to the phosphor layer 3 is provided. It can be set as the structure which provided the reflection layer in.

<Fourth embodiment>
Next, a light emitting device according to a fourth embodiment will be described.
The light emitting device according to the fourth embodiment is a light emitting device using the inorganic molded body 1 according to the first embodiment as a color conversion molding member.

[Configuration of light emitting device]
First, the configuration of the light emitting device 10 will be described with reference to FIG. As shown in FIG. 10A, the light emitting device 10 includes a light source 11, a color conversion molding member 12, and a submount 15. The light emitting device 10 is configured by using the inorganic molded body 1 according to the first embodiment as the transmissive color conversion molding member 12.

(light source)
As the light source 11, for example, an LD (laser diode) or an LED (light emitting diode) which is a semiconductor light emitting element can be used. The semiconductor material and element structure used for the semiconductor light emitting element are not particularly limited, but a semiconductor light emitting element using a nitride semiconductor such as a gallium nitride-based material emits light with high brightness in a wavelength region from ultraviolet light to blue light. Therefore, it can be suitably used.

  The light source 11 may include an optical system that appropriately collects, diffuses, or reflects light emitted from the light emitting element, in addition to the light emitting element such as an LD and an LED. Also, other types of light sources such as a high-pressure mercury lamp and a xenon lamp can be used.

  The light source 11 in the present embodiment is provided in the recess 15a of the submount 15 and makes light (L1) incident on the color conversion molding member 12 provided in the opening above the recess 15a.

(Color conversion molding member (color conversion inorganic molding))
The color conversion molding member 12 is provided so as to close the opening of the recess 15a of the submount 15, and converts the incident light L1 from the light source 11 incident from the lower surface into light of a color different from the incident light L1. This is a transmissive color conversion molding member that emits the transmitted light L2 from the upper surface. In the present embodiment, the inorganic molded body 1 according to the first embodiment shown in FIG. 1 is used.

  Further, the transmissive inorganic molded body 1 which is the color conversion molding member 12 has the surface provided with the phosphor layer 3 facing downward (inside the submount 15) as shown in FIG. 10B. Or may be arranged toward the upper side (outside of the submount 15) as shown in FIG.

  In the conventional phosphor molded body using a resin, when the phosphor layer 3 is arranged toward the inner side of the submount 15 as in the example shown in FIG. Is irradiated with light in a sealed state, the resin may be colored and deteriorated. Further, as in the example shown in FIG. 10C, when the phosphor layer 3 is arranged toward the outside of the submount 15, the resin deteriorates due to oxidation or humidity due to the outside air, and the color conversion efficiency decreases. There is a fear.

  Since the color conversion molding member 12 (inorganic molded body 1) according to the present invention is composed entirely of an inorganic material, there is no risk of deterioration as in the case of using a resin material. The arrangement of the molding member 12 can be freely selected according to the functions of the light emitting device 10 and the substrate 2. Therefore, the light emitting device 10 with high color conversion efficiency can be configured according to the purpose of use.

For example, in the configuration shown in FIG. 10C, in which the surface having the phosphor layer 3 having an uneven shape caused by the particles of the inorganic phosphor 31 is the light emitting side, the color conversion molding member Since the light extraction efficiency from 12 improves, it is preferable. When the light-emitting element as the light source 11 is an ultraviolet LD, a dielectric layer that reflects ultraviolet rays is provided on the upper surface of the substrate 2 that is the light emitting surface of the light-emitting device 10 as the configuration shown in FIG. Thus, leakage of light of the color emitted from the light source 11 from the light emitting device 10 can be reduced, and the light emitting device 10 that is safe for the eyes can be obtained.
In addition, the color conversion molding member 12 may be disposed away from the light source 11 or may be disposed in close contact with the light source 11 because the color conversion molding member 12 is excellent in heat dissipation.

(Submount)
The submount 15 is a mounting substrate for mounting the light source 11 such as an LD or LED. The submount 15 has a recess 15a for mounting the light source 11, and the upper portion of the recess 15a is open. Further, the color conversion molding member 12 is provided in the opening of the recess 15a so as to close the opening.

[Operation of light emitting device]
Next, referring to FIG. 10A (refer to FIG. 6 as appropriate), the operation of the light emitting device 10 will be described.
In the present embodiment, a case where a semiconductor light emitting element that emits blue light is used as the light source 11 will be described. In addition, as the color conversion molding member 12, the substrate 2 contains an inorganic phosphor that converts blue light into green light, and the phosphor layer 3 contains an inorganic phosphor 31 that converts blue light into red light. The body 1 shall be used.

  The light source 11 makes blue light incident as incident light L1 on the surface of the color conversion molding member 12 (inorganic molded body 1) on which the phosphor layer 3 is provided. The blue incident light L <b> 1 propagates through the phosphor layer 3 while being scattered by the gap 33 (see FIG. 1B) of the phosphor layer 3, propagates through the substrate 2, and is emitted from the upper surface. The transmitted light L2 is output from the light emitting device 10 as output light.

  Part of the blue light incident on the color conversion molding member 12 is absorbed by the inorganic phosphor 31 in the phosphor layer 3 until it passes through the phosphor layer 3 and the substrate 2 and is emitted. . Another part is absorbed by the inorganic phosphor in the substrate 2. The inorganic phosphor 31 is excited by the absorbed blue light and emits (emits) red light. That is, the inorganic phosphor 31 performs color conversion from blue light to red light. Further, the inorganic phosphor in the substrate 2 is excited by the absorbed blue light and emits (emits) green light. That is, the inorganic phosphor in the substrate 2 converts blue light into green light.

  Red light emitted from the inorganic phosphor 31, green light emitted from the inorganic phosphor in the substrate 2, and blue light transmitted through the phosphor layer 3 and the substrate 2 without being absorbed by any inorganic phosphor are incident The light L1 is emitted as transmitted light L2 from the surface opposite to the surface on which the light L1 is incident. At this time, the transmitted light L2 includes red light that has undergone color conversion in the phosphor layer 3, green light that has undergone color conversion in the substrate 2, and blue light that has not undergone color conversion. , These lights are mixed colors. The film thickness of the inorganic phosphor 31 in the phosphor layer 3, the ratio of the gaps 33 (see FIG. 1B), and the inorganic fluorescence in the substrate 2 so that blue light, green light, and red light are in appropriate ratios. By adjusting the body content or the like, the output light of the light emitting device 10 can be white light.

In addition, this invention is not limited to white light, All the incident light L1 can be color-converted into yellow light, and can also be comprised so that it may output as yellow light. Further, for example, the color may be converted to green or red.
Further, different types of inorganic phosphors are contained in the substrate 2 and the phosphor layer 3, or a plurality of types of inorganic phosphors are laminated on the substrate 2 and the phosphor layer 3, or mixed and contained. Therefore, it can be configured to convert the light into various spectrum light and output it.

  In addition, in the light-emitting device 10 shown to Fig.10 (a), it replaces with the inorganic molded object 1 as the color conversion molding member 12, and comprises using the inorganic molded object 1B which concerns on 2nd Embodiment shown in FIG. You can also

Next, examples of the present invention will be described.
<Example 1>
As Example 1, a production example of the inorganic molded body 1 according to the first embodiment shown in FIG. 1 will be described.

  A ceramic sintered plate containing a LAG phosphor is used as the substrate. This substrate is formed by subjecting a bulk sintered body obtained by high-pressure molding of LAG phosphor powder to a bulk body, and then annealing the bulk sintered body that has been sintered at a high temperature and high pressure by HIP (hot isostatic press; hot isostatic press). It is a substrate having a thickness of about 100 μm that has been sliced, cut and polished.

(Conductor layer forming process)
In order to give conductivity to one side of the substrate, an Al layer having a thickness of about 0.1 μm is formed by sputtering.

(Phosphor layer forming process)
Thereafter, the substrate on which the conductor layer is formed is used as an inorganic phosphor. S. S. S. It is immersed together with a counter electrode in an electrodeposition bath of about 25 ° C. in which CASN particles having an average particle diameter of 7 μm by No method are dispersed, and an inorganic phosphor is electrodeposited on the conductive layer forming part of the substrate by electrophoretic deposition. Let Mg ion is added to the electrodeposition tank as an inorganic binder, and this precipitates as magnesium hydroxide and / or magnesium carbonate, thereby obtaining a binding force. The thickness of the inorganic phosphor particle layer is controlled to a thickness of 30 μm by controlling the amount of coulomb applied between the electrodes.
After cleaning and drying, a substrate on which the inorganic phosphor particle layer is laminated through the Al layer as the conductor layer is obtained.

(Conductor layer transparency process)
After washing and drying, the Al layer is treated with hot water at 90 ° C., and the Al layer as the conductor layer is oxidized to form an Al ₂ O ₃ layer, thereby making the conductor layer transparent.

(Coating layer forming process)
After drying, a SiO ₂ layer having a thickness of about 3 μm is formed as a coating layer by ALD.
Note that TTBS (Tris (tert-Buthoxy) Silanol) is used as the first raw material for film formation by the ALD method, and TMA is used as the second raw material.

[Coating layer forming step]
The coating layer forming step by the ALD method of Example 1 will be described in more detail.
Note that the inner diameter of the reaction vessel of the ALD apparatus in the present example is φ300 mm.

(Pre-baking process)
First, a sample in which a particle layer of an inorganic phosphor is formed on a substrate is placed in an oven and heated at 120 ° C. for 2 hours to evaporate moisture in the sample.
(Sample setting process)
Next, a sample is placed in the reaction vessel of the ALD apparatus, and the reaction vessel lid is closed.
(Storage process before film formation)
Next, the inside of the reaction vessel is brought into a low pressure state using a rotary pump. The pressure setting in the reaction vessel is 10 torr (13332 Pa). In addition, a nitrogen gas flow is introduced into the reaction vessel. The flow rate of nitrogen gas is 20 sccm (33 × 10 ⁻³ Pa · m ³ / s), and this state is maintained for about 60 minutes for stabilization and final moisture removal.
The temperature of the reaction vessel is 150 ° C., and this temperature is maintained during the subsequent film formation.

(First raw material supply process)
TTBS is introduced into the reaction vessel as a first raw material for 1 second.
In order to react the sample and TTBS, the stop valve, which is a valve connecting the reaction vessel and the vacuum line, is closed, and the sample is exposed to TTBS for 15 seconds.
(First exhaust process)
The stop valve is opened, and unreacted TTBS and by-products are exhausted from the reaction vessel with a nitrogen gas flow for 60 seconds.

(Second raw material supply process)
TMA is introduced into the reaction vessel as the second raw material for 1 second.
In order to react the sample with TMA, the stop valve of the reaction vessel is closed and the sample is exposed to TMA for 15 seconds.
(Second exhaust process)
The stop valve is opened, and unreacted TMA and by-products are exhausted from the reaction vessel with a nitrogen gas flow for 60 seconds.

The cycle from the first raw material supply process to the second exhaust process is set as one cycle, and this cycle is repeated so that the SiO ₂ film has a desired thickness.
After the film formation is completed, the stop valve is closed, the flow of nitrogen gas is set to 100 sccm (169 × 10 ⁻³ Pa · m ³ / s), and the pressure in the reaction vessel is brought to normal pressure, and then the sample is taken out.

By the above procedure, a color conversion inorganic molded body having a configuration of a LAG phosphor plate on which a particle layer of CASN phosphor coated with a SiO ₂ layer as a coating layer is laminated can be obtained. The inorganic molded body of the present example can be used as a color conversion molding member by being mounted on the LED / LD from any of the LAG phosphor plate side and the CASN phosphor side. Further, since the maximum temperature during the process is 150 ° C. or less, a nitride phosphor that is weak against heat, such as CASN, can be used as the inorganic phosphor.
The light-emitting device using the inorganic material for color conversion obtained in the present invention is highly efficient and has a long life even when used with high-power excitation, and exhibits excellent performance as a light source for illumination.

<Example 2>
As Example 2, another example of manufacturing the inorganic molded body 1 according to the first embodiment shown in FIG. 1 will be described.

As the substrate, a sintered body containing 80% by mass of inorganic phosphor Y ₃ Al ₅ O ₁₂ : Ce is used.
This sintered body can be manufactured by the following method. First, 240 g of inorganic phosphor YAG having an average particle diameter of 10 μm and 60 g of alumina particles having an average particle diameter of 2 μm are uniformly mixed to obtain a cylindrical bulk molded body using a high-pressure press. A bulk sintered body is obtained by firing this molded body in a discharge plasma sintering furnace in a vacuum atmosphere at 1400 ° C. to 2000 ° C. for 1 to 60 minutes. Thereafter, the obtained bulk sintered body is annealed, sliced, cut and polished to obtain a substrate having a thickness of about 100 μm.
A conductor layer made of ITO is formed on one side of the substrate. On this substrate, a particle layer of fluoride phosphor Li ₂ SiF ₆ : Mn having an average particle diameter of about 20 μm, which has been subjected to water resistance in advance, is laminated in the same manner as in Example 1. After washing and drying, an Al ₂ O ₃ layer having a thickness of about 1 μm is formed by ALD.
Since the conductor layer in this example has translucency, an inorganic molded body used as a transmissive color conversion molding member can be produced without performing the conductor layer clarification step.

<Example 3>
As Example 3, as a substrate, instead of the ceramic sintered plate containing the LAG phosphor of Example 1, a ceramic sintered plate containing a YAG-based phosphor was used in the same manner as in Example 1, An Al ₂ O ₃ layer was formed as a coating layer by the ALD method to produce an inorganic molded body. About this inorganic molded object, the porosity of the fluorescent substance layer was measured with the image-analysis method from the photograph image which image | photographed the cross section of the fluorescent substance layer. Hereinafter, the procedure for measuring the porosity will be described.

  The average particle size of the inorganic phosphor used in this example is F.R. S. S. S. The measurement by the No method was 3.6 μm. In addition, the center particle size by volume distribution obtained from the particle size distribution measured using a Coulter counter was 6.2 μm.

First, as shown in FIG. 11, the produced inorganic molded body is divided, and the cross section of the phosphor layer is photographed with a scanning electron microscope. In FIG. 11, the light gray portion of the granular lump is the inorganic phosphor 31, and the dark gray portion at the outer edge of the granular lump is the coating layer 32.
In addition, the scale displayed on the lower right side of FIG. 11 indicates 1 μm, and the film thickness of the coating layer 32 is about 300 nm.

Next, a region A to be measured is cut out from the photographic image shown in FIG. 11, and the portion of the coating layer 32 is blacked out as shown in FIG.
Next, using the particle analysis software, the region surrounded by the black-coated layer 32 is painted black as shown in FIG. 13, and this black-painted region is the region of the inorganic phosphor including the coating layer 32 ( 31 + 32). Here, the void 33 is defined as a region other than the region painted black. Then, the content ratio of the inorganic phosphor (31 + 32) including the coating layer 32 is obtained by dividing the area (number of pixels) of the blacked area by the area (number of pixels) of the area A, and the remaining portion The porosity is required as follows.

  In this example, the content of the inorganic phosphor was 75.4%. Therefore, the porosity was 24.6%.

<Example 4>
In Example 4, a glass substrate containing a LAG phosphor is used as the substrate. The glass substrate contains 10 to 30 wt% of a LAG phosphor mainly composed of glass containing BaO, CaO, ZnO, SiO ₂ , B ₂ 0 ₃ and Al ₂ 0 ₃ and having an average particle diameter of about 10 μm. ing. The manufacturing method of this glass substrate is as follows. The LAG phosphor and glass powder particles are mixed and molded, and sintered in a vacuum to produce a flat glass with a LAG phosphor, which is then polished to obtain a glass substrate having a thickness of 100 μm. On this glass substrate, a particle layer of SCASN phosphor is formed using the same method as in Example 1, and then a coating layer made of transparent SiO ₂ is formed by a CVD method. And

  On the sapphire surface of a GaN-based light emitting device flip-chip mounted on a ceramic substrate with conductive wiring, the above-mentioned inorganic molded body for color conversion is placed on the sapphire surface with the inorganic particle layer side up and the LAG phosphor-containing glass side down. Mounting is performed using a silicone-based resin adhesive to obtain an LED that is an amber light emitting device.

  As a comparison, two types of phosphors, a LAG phosphor and a SCASN phosphor, are mixed and sintered at the same content as in Example 4 to produce a phosphor-containing glass substrate. Thereafter, an LED which is an amber-colored light emitting device on which two kinds of phosphor-containing glass substrates are mounted is obtained by using a method similar to the above without forming an inorganic particle layer.

  The amber color LED having the inorganic conversion body for color conversion of the present invention had a light emission output of about 10 to 20% higher than that of the amber color LED having a glass substrate containing a comparative phosphor. This is probably because the amber LED of the present invention has a gap and the SCASN phosphor is not deteriorated by heat.

1, 1A ₁ , 1A ₂ , 1A ₃ , 1B, 1C Inorganic molded body (inorganic molded body for color conversion)
2, 2B, 2C substrate (base)
3 Phosphor layer (inorganic particle layer)
31 Inorganic phosphor (color conversion member)
32 Coating layer 33 Void 34 Particle layer (aggregate)
DESCRIPTION OF SYMBOLS 5 Translucent layer 6 Conductor layer 7 Reflective layer 10 Light-emitting device 11 Light source 12 Color conversion molding member (color conversion inorganic molding)
15 Submount 15a Recess 20 Masking member

Claims (27)

A translucent substrate containing a color conversion member made of a first inorganic material that absorbs light and emits light of a color different from the color of the absorbed light;
An inorganic particle layer that is provided on the substrate and contains particles of a color conversion member made of a second inorganic material that absorbs light and emits light of a color different from the color of the absorbed light;
The inorganic particle layer is
Aggregates in which the particles are continuously connected by contacting the particles or the substrate;
A coating layer made of an inorganic material that continuously covers the surface of the substrate and the surface of the particles;
A void surrounded by any of the substrate, the particles and the coating layer;
An inorganic molded article for color conversion characterized by comprising:   The inorganic molded body for color conversion according to claim 1, wherein the voids in the inorganic particle layer have a porosity of 1 to 50%. The average particle diameter of the color conversion member particles contained in the inorganic particle layer is 0.1 to 100 μm,
The inorganic molded body for color conversion according to claim 1 or 2, wherein an average thickness of the coating layer is 10 nm to 50 µm.   The surface of the said inorganic particle layer is formed with the uneven | corrugated shape resulting from the particle size of the particle | grains of the color conversion member contained in the said inorganic particle layer. An inorganic molded article for color conversion as described in the item.   The inorganic molding for color conversion according to any one of claims 1 to 4, wherein the coating layer is formed by an atomic layer deposition method. The coating layer is made of Al ₂ O ₃ , SiO ₂ , ZrO ₂ , HfO ₂ , TiO ₂ , ZnO, Ta ₂ O ₅ , Nb ₂ O ₅ , In ₂ O ₃ , SnO ₂ , TiN, and AlN. The inorganic molded body for color conversion according to any one of claims 1 to 5, comprising at least one compound selected from the group.   The color conversion member contained in the inorganic particle layer is at least one selected from the group consisting of sulfide phosphors, halogen silicate phosphors, nitride phosphors, and oxynitride phosphors. The inorganic molded product for color conversion according to any one of claims 1 to 6, comprising a compound.   8. The inorganic molded body for color conversion according to claim 1, wherein the color conversion member contained in the inorganic particle layer contains a fluoride fluorescent material. 9.   9. The color conversion member particles contained in the inorganic particle layer are bound to each other and to the substrate by an inorganic binder. 9. The inorganic molded body for color conversion as described.   The inorganic substrate for color conversion according to any one of claims 1 to 9, wherein the substrate is made of an inorganic material.   The inorganic molded body for color conversion according to any one of claims 1 to 10, wherein the substrate has a thermal conductivity of 5 W / m · K or more.   The inorganic molded body for color conversion according to any one of claims 1 to 11, wherein a translucent layer having translucency is provided between the substrate and the inorganic particle layer. .   The inorganic molded body for color conversion according to claim 12, wherein the translucent layer and the coating layer are formed of the same material.   The inorganic molded body for color conversion according to any one of claims 1 to 11, wherein the substrate is made of a conductive material.   The inorganic molded body for color conversion according to any one of claims 1 to 14, wherein the first inorganic material and the second inorganic material are of different types.   A light emitting device comprising a light source and the color conversion inorganic molded body according to any one of claims 1 to 15.   The light-emitting device according to claim 16, wherein the light-emitting device outputs light obtained by mixing a part of light emitted from the light source and light emitted from the color conversion inorganic molded body. A light-transmitting substrate containing a color conversion member made of a first inorganic material that absorbs light and emits light of a color different from the color of the absorbed light; An inorganic particle layer forming step of forming an aggregate containing particles of a color conversion member made of a second inorganic material that emits light of different colors;
A coating layer forming step of forming a coating layer made of an inorganic material that continuously covers the surface of the substrate and the surface of the particles;
A method for producing an inorganic molded body for color conversion, comprising:   2. The inorganic particle layer forming step, wherein the aggregate is formed on the substrate by an electrodeposition method, an electrostatic coating method, a pulse spray method, a centrifugal sedimentation method, or a combination of these methods. A method for producing an inorganic molded body for color conversion as described in Item 18.   The substrate is made of a conductive material, and in the inorganic particle layer forming step, the aggregate is formed on the substrate by an electrodeposition method or an electrostatic coating method using the substrate as one electrode. The method for producing an inorganic molded body for color conversion according to claim 19. The base is made of an insulating material,
Prior to the inorganic particle layer forming step, a conductor layer forming step of forming a conductor layer made of metal on the substrate is performed,
After the inorganic particle layer forming step and before the coating layer forming step, perform a conductor layer transparentizing step of oxidizing and transparentizing the conductor layer,
In the inorganic particle layer forming step, the aggregate is formed on the substrate via the conductor layer by an electro-deposition method or an electrostatic coating method using the conductor layer as one electrode. The manufacturing method of the inorganic molded object for color conversion of Claim 19 to do.   The method for producing an inorganic molded body for color conversion according to claim 21, wherein the transparent conductor layer is made of the same material as the coating layer. The base is made of an insulating material,
Prior to the inorganic particle layer forming step, a conductor layer forming step of forming a conductive layer made of a light-transmitting conductive material on the substrate is performed.
In the inorganic particle layer forming step, the aggregate is formed on the substrate via the conductor layer by an electro-deposition method or an electrostatic coating method using the conductor layer as one electrode. The manufacturing method of the inorganic molded object for color conversion of Claim 19 to do.   The method for producing an inorganic molded body for color conversion according to any one of claims 18 to 23, wherein in the coating layer forming step, the coating layer is formed by an atomic layer deposition method.   25. The compound according to claim 18, wherein a compound containing at least an alkaline earth metal element as a component is used as the inorganic binder when forming the aggregate in the inorganic particle layer forming step. A method for producing an inorganic molded body for color conversion according to claim 1. The average particle diameter of the color conversion member particles contained in the inorganic particle layer is 0.1 to 100 μm,
The average thickness of the said coating layer is 10 nm-50 micrometers, The manufacturing method of the inorganic molded object for color conversion as described in any one of Claim 18 thru | or 25 characterized by the above-mentioned. The coating layer is made of Al ₂ O ₃ , SiO ₂ , ZrO ₂ , HfO ₂ , TiO ₂ , ZnO, Ta ₂ O ₅ , Nb ₂ O ₅ , In ₂ O ₃ , SnO ₂ , TiN, and AlN. 27. The method for producing an inorganic molded body for color conversion according to any one of claims 18 to 26, comprising at least one compound selected from the group.