JP2013231728A - Micro-mechanical part incorporated into timepiece mechanism - Google Patents

Micro-mechanical part incorporated into timepiece mechanism Download PDF

Info

Publication number
JP2013231728A
JP2013231728A JP2013118770A JP2013118770A JP2013231728A JP 2013231728 A JP2013231728 A JP 2013231728A JP 2013118770 A JP2013118770 A JP 2013118770A JP 2013118770 A JP2013118770 A JP 2013118770A JP 2013231728 A JP2013231728 A JP 2013231728A
Authority
JP
Japan
Prior art keywords
silicon
micromechanical component
insulating material
micromechanical
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013118770A
Other languages
Japanese (ja)
Other versions
JP5599917B2 (en
Inventor
Marc Lippuner
マーク・リプナー
Thierry Conus
ティエリー・コヌス
Philippe Marmy
フィリップ・マーミィ
Benjamin Kraehenbuehl
ベンジャミン・クレーヘンビュール
Michael Reber
ミヒャエル・レバー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ETA SA Manufacture Horlogere Suisse
Original Assignee
ETA SA Manufacture Horlogere Suisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP06111727A external-priority patent/EP1837721A1/en
Priority claimed from CH00595/06A external-priority patent/CH707669B1/en
Application filed by ETA SA Manufacture Horlogere Suisse filed Critical ETA SA Manufacture Horlogere Suisse
Publication of JP2013231728A publication Critical patent/JP2013231728A/en
Application granted granted Critical
Publication of JP5599917B2 publication Critical patent/JP5599917B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00Mechanisms for stabilising frequency
    • G04B17/04Oscillators acting by spring tension
    • G04B17/06Oscillators with hairsprings, e.g. balance
    • G04B17/063Balance construction
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B1/00Driving mechanisms
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B15/00Escapements
    • G04B15/14Component parts or constructional details, e.g. construction of the lever or the escape wheel
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00Mechanisms for stabilising frequency
    • G04B17/04Oscillators acting by spring tension
    • G04B17/06Oscillators with hairsprings, e.g. balance
    • G04B17/066Manufacture of the spiral spring
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/30Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electric Clocks (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent attraction and adhesion of a moving micro-mechanical part to an adjacent part.SOLUTION: On all or a part of the surface of a micro-mechanical part made of insulating material, such as silicon and compound thereof, diamond, glass, ceramic, or other materials, a thin deposition of a layer of conductive material is conducted, such as non-oxidising and non-magnetic metal, and such as gold, platinum, rhodium or silicon. It makes it possible to remove the risk of attraction and adhesion with respect to an adjacent part.

Description

本発明は、絶縁材でできた微小機械部品に関し、より具体的には、時計仕掛けの固定又は可動部品に関し、該固定又は可動部品が他の部品に近接することによって、直接又は間接的に粒子を引きつけるとことによって可動部品の働きを妨げることがないようにしたものである。   The present invention relates to a micromechanical part made of an insulating material, and more particularly, to a clockwork fixed or movable part, in which particles are directly or indirectly caused by the proximity of the fixed or movable part to another part. The function of the moving parts is not hindered by attracting.

シリコンとその化合物、石英、ダイヤモンド、ガラス、セラミック又はその他の材料の絶縁材は、プレート又は受けのような固定部品用としてだけでなく、例えばひげゼンマイ、てんぷまたは脱進機のような調整システム、又は機構の一部を形成する可動部品用としても、時計製造業が微小機械部品を作るためにより頻繁に使用されている。   Insulating materials of silicon and its compounds, quartz, diamond, glass, ceramic or other materials are used not only for fixed parts such as plates or receivers, but also for adjustment systems such as hairsprings, balances or escapements, Or, for the moving parts that form part of the mechanism, the watchmakers are more frequently used to make micromechanical parts.

特に例えばひげ持ちに留めたり、非導電性接着剤によって結合することによって、他の部品から完全に絶縁されたひげゼンマイに関して、シリコンの使用が1つの欠点を有することが観察された。確かに、一定の操作時間後、ひげゼンマイの外部終端曲線や内部終端曲線の間に位置する幾らかのコイルは、てんぷ受けに付着する傾向があり、そのことは、調整システムの等時性に必然的に有害である。同じ現象が、シリコン又は他の絶縁材でできた他の部品に関しても観察でき、そのことはまた、等時性に有害な影響を最終的に与える。   It has been observed that the use of silicon has one drawback, particularly with respect to a hairspring that is completely insulated from other components, for example by being held in a beard or bonded by a non-conductive adhesive. Certainly, after a certain operating time, some coils located between the outer end curve and the inner end curve of the hairspring tend to stick to the balance, which makes the adjustment system isochronous. Inevitably harmful. The same phenomenon can be observed for other parts made of silicon or other insulating material, which also ultimately has a detrimental effect on isochronism.

従って、表面処理によって付着する危険性が回避される、絶縁材でできた固定又は可動微小機械部品を提供することによって、前述の課題の解決策を提供することが、本発明の目的である。   Accordingly, it is an object of the present invention to provide a solution to the aforementioned problem by providing a fixed or movable micromechanical part made of an insulating material that avoids the risk of adhesion due to surface treatment.

それ故に、本発明は、表面全部又は一部が金属材料又は非金属導電性材料のような導電性材料の薄い堆積で被覆された、シリコンとその化合物、ダイヤモンド、ガラス、セラミック又はその他の材料のような絶縁材でできた微小機械部品に関する。好ましくは導電性堆積は、50nm未満の厚さを有する。肉眼では見えないが、電流分析手段によって知覚できるこの非常に薄い堆積は、隣接部品による引きつけ(この引きつけは、部品内に静電荷を作りがちな摩擦又は張力による)や付着の危険性を取り除く。   Therefore, the present invention relates to silicon and its compounds, diamond, glass, ceramic or other materials, all or part of which is coated with a thin deposit of conductive material, such as metallic or non-metallic conductive material. The present invention relates to a micro mechanical part made of such an insulating material. Preferably the conductive deposit has a thickness of less than 50 nm. This very thin deposit that is not visible to the naked eye but is perceptible by means of current analysis removes the risk of attraction by adjacent parts (this attraction is due to friction or tension that tends to create an electrostatic charge in the part) and adhesion.

この堆積は、絶縁材の、すなわち少なくとも外面が絶縁材でできた、一体鋳造又は複合部品に実行することができる。   This deposition can be carried out on a monolithic cast or composite part of insulating material, ie at least the outer surface being made of insulating material.

前述の目的を達成することが可能な材料の中から、金、白金、ロジウム、パラジウムのような非酸化かつ非磁性金属が、好ましくは選択される。   Of the materials capable of achieving the aforementioned objectives, non-oxidizing and non-magnetic metals such as gold, platinum, rhodium, palladium are preferably selected.

非金属導電性材料の中から、黒鉛、炭素、ドープシリコン、導電性高分子が、好ましくは選択される。   Of the non-metallic conductive materials, graphite, carbon, doped silicon, and conductive polymer are preferably selected.

これらの金属は、操作条件を調節することによって厚さの制御を可能にする公知の方法によって、例えばスパッタリング、PVD、ドーピング、イオン注入又は電解法によって堆積できる。同じ技術が、非導電性金属材料を堆積させるために使用できた。   These metals can be deposited by known methods that allow for thickness control by adjusting the operating conditions, for example by sputtering, PVD, doping, ion implantation or electrolysis. The same technique could be used to deposit non-conductive metallic materials.

好ましい応用態様において、前記微小機械部品は、ひげゼンマイ、パレット、がんぎ車又は歯車のような時計仕掛けの機構における部品、又は可動部品のアーバベアリングを形成することが可能な他の固定部品である。以下の詳細な説明において、本発明は、時計仕掛けの最も敏感な部品であるひげゼンマイによって特に説明される。
本発明は、このタイプの微小機械部品を組み入れた時計にも関する。
In a preferred application, the micromechanical part is a part in a clockwork mechanism such as a hairspring, pallet, escape wheel or gear, or other fixed part capable of forming an arbor bearing of a movable part. is there. In the following detailed description, the present invention is particularly illustrated by the hairspring, which is the most sensitive part of a clockwork.
The invention also relates to a timepiece incorporating a micromechanical part of this type.

本発明に従って処理されたひげゼンマイを与えられたばねてんぷの部分的に引き剥がされた平面図を示す。Fig. 3 shows a partially peeled plan view of a spring balance provided with a hairspring treated according to the invention. 引き剥がされた部分の略図を有する、図1の線II−IIに沿った断面図である。FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 with a schematic illustration of the portion that has been peeled away.

本発明の他の特徴及び利点は、添付図面を参照して、非限定的な説明として与えられる実施例の以下の記載においてより明瞭に現れるであろう。   Other features and advantages of the present invention will appear more clearly in the following description of embodiments given by way of non-limiting description with reference to the accompanying drawings.

本発明は、ひげゼンマイ1が、集積回路又は加速度計の製造で用いられるマイクロマシニング技術を適用して、シリコン又は他の非晶質若しくは結晶質絶縁材のプレートから、例として、シリコンでできた図1に示すばねてんぷ調整装置が説明される。例えば、ひげゼンマイに望ましい輪郭に適したマスクを使用して、ウェットエッチング、ドライプラズマ加工又は反応性イオンエッチング(RIE)を行うことができる。   The present invention is a hairspring 1 made of, for example, silicon from a plate of silicon or other amorphous or crystalline insulating material, applying micromachining techniques used in the manufacture of integrated circuits or accelerometers The spring balance adjusting apparatus shown in FIG. 1 will be described. For example, wet etching, dry plasma processing, or reactive ion etching (RIE) can be performed using a mask suitable for the contour desired for the hairspring.

小さな面積を考えれば、同じシリコンプレートから、一群のひげゼンマイを製造することができ、その形状は、プレートの厚さとマスクの形状によって決定され、前記形状は、一平面で作動するひげゼンマイに対して計算される。   Given the small area, a group of hairsprings can be manufactured from the same silicon plate, the shape of which is determined by the thickness of the plate and the shape of the mask, said shape being for a hairspring that operates in one plane. Is calculated.

断面が、ひげゼンマイ1とてんぷ受け9に限定される図2を今度は参照すると、コイル11が、いかなる処理も受けなかった時に、一定の操作時間後のコイル11の行動は、左側部分に示される。見られるように、コイル11は、点線で示すその正常位置から離れ、てんぷ受け9によって引きつけられ、かつてんぷ受け9に付着することもあるが、そのことは正常な働き、すなわち一平面内での唯一の伸長/収縮運動による働きを妨げる。   Referring now to FIG. 2 where the cross-section is limited to the hairspring 1 and balance 9, the behavior of the coil 11 after a certain operating time is shown in the left part when the coil 11 has not undergone any treatment. It is. As can be seen, the coil 11 moves away from its normal position, indicated by the dotted line, and is attracted by the balance 9 and can also adhere to the balance 9, which is normal, i.e. in one plane. Interfering with the only stretching / contraction movement.

右側部分は、処理後のひげゼンマイ1を示し、点線は、コイル11が、処理がない場合に占めるであろう位置を表す。見られるように、ひげゼンマイは、完全に一平面内に留まる。実際に、驚くべきことに、コイル表面の全部又は一部への金属材料のような導電性材料の非常に薄い堆積からなる処理を実行することによって、ひげゼンマイの固有の機械的性質をそれにより変えることなく、前述の有害な影響が消滅することが観察された。「非常に薄い堆積」は、50nm未満、好ましくは10〜20nmの厚さを有する堆積を意味する。堆積が50nm未満である時、部品の固有の機械的性質は、変えられず、かつ堆積は、肉眼では見えないが、それにもかかわらず電流分析技術によって知覚できる。導電性金属材料が使用される時、使用される材料は、好ましくは金、白金、ロジウム、パラジウムのような非酸化かつ非磁性金属である。この堆積は、スパッタリング、PVD、イオン注入又は電解析出のような種々の公知の方法によって実行できる。   The right part shows the hairspring 1 after processing, and the dotted line represents the position that the coil 11 will occupy when there is no processing. As can be seen, the hairspring remains completely in one plane. In fact, surprisingly, by carrying out a process consisting of a very thin deposition of a conductive material, such as a metallic material, on all or part of the coil surface, the inherent mechanical properties of the hairspring are thereby reduced. Without change, it was observed that the aforementioned detrimental effects disappeared. “Very thin deposition” means a deposition having a thickness of less than 50 nm, preferably 10-20 nm. When the deposit is less than 50 nm, the inherent mechanical properties of the part are not changed and the deposit is not visible to the naked eye but is nevertheless perceivable by current analysis techniques. When a conductive metal material is used, the material used is preferably a non-oxidizing and non-magnetic metal such as gold, platinum, rhodium, palladium. This deposition can be performed by various known methods such as sputtering, PVD, ion implantation or electrolytic deposition.

例として15nmの金の堆積が、15秒間、60mAの電流を加えることにより、スパッタリングによって実行された。   As an example, a 15 nm gold deposition was performed by sputtering by applying a 60 mA current for 15 seconds.

非金属導電性材料が堆積する時、それは好ましくは、黒鉛、炭素、ドープシリコン、導電性高分子からなる群から選択され、かつ前述の堆積技術及び厚さが使用される。   When the non-metallic conductive material is deposited, it is preferably selected from the group consisting of graphite, carbon, doped silicon, conductive polymers, and the aforementioned deposition techniques and thicknesses are used.

我々は、今までシリコンひげゼンマイを記載したが、前記のような、他の非晶質又は結晶質非導電性材料も使用でき、かつ引きつけや付着の危険性を回避する、表面金属化によって処理できる。   We have described a silicon hairspring so far, but other amorphous or crystalline non-conductive materials as described above can also be used and treated by surface metallization to avoid the risk of attraction and adhesion it can.

シリコンコアと、例えば、導電性材料の薄い堆積が作られる厚い二酸化ケイ素コーティングを有するひげゼンマイとを作るために、複合材料を使用することも可能である。   It is also possible to use a composite material to make a silicon core and, for example, a hairspring with a thick silicon dioxide coating from which a thin deposit of conductive material is made.

「複合材料」は、絶縁材に埋設された金属コアを含んでも良い。   The “composite material” may include a metal core embedded in an insulating material.

同様に、本発明は、ひげゼンマイに限定されず、パレット、がんぎ車又は歯車のような他の移動部品、及び時計仕掛けの他の固定又は移動部品に適用できる。   Similarly, the present invention is not limited to a hairspring, but can be applied to other moving parts such as pallets, escape wheels or gears, and other fixed or moving parts of a clockwork.

1 ひげゼンマイ
9 てんぷ受け
11 コイル
1 Hairspring 9 Balance holder 11 Coil

Claims (7)

少なくとも1種の絶縁材でできた、時計仕掛けの機構に組み入れられる微小機械部品であって、
前記少なくとも1種の絶縁材が、
表面の全部又は一部が、金属の堆積によって形成された被覆層で被覆されている
ことを特徴とする微小機械部品。
A micromechanical part made of at least one insulating material and incorporated into a clockwork mechanism,
The at least one insulating material is
A micromechanical component characterized in that all or part of the surface is coated with a coating layer formed by metal deposition .
金属の堆積が、50nm未満、好ましくは10〜20nmの厚さを有することを特徴とする請求項1に記載の微小機械部品。   2. Micromechanical component according to claim 1, characterized in that the metal deposit has a thickness of less than 50 nm, preferably 10-20 nm. 絶縁材が、シリコン及びシリコン化合物、ダイヤモンド、ガラス、セラミックから選択されることを特徴とする請求項1に記載の微小機械部品。   The micromechanical component according to claim 1, wherein the insulating material is selected from silicon and a silicon compound, diamond, glass, and ceramic. 二酸化ケイ素コーティングが、50nmを超える厚さで上に形成されるシリコンコアを含むことを特徴とする請求項3に記載の微小機械部品。   4. The micromechanical component of claim 3, wherein the silicon dioxide coating comprises a silicon core formed thereon with a thickness greater than 50 nm. 堆積を実行するために使用される金属が、非酸化材料非磁性材料であることを特徴とする請求項1〜4のいずれか1項に記載の微小機械部品。   The micromechanical component according to any one of claims 1 to 4, wherein the metal used to perform the deposition is a non-oxidizing material or a non-magnetic material. 金属が、金、白金、ロジウム、パラジウムから選択されることを特徴とする請求項5に記載の微小機械部品。   The micromechanical component according to claim 5, wherein the metal is selected from gold, platinum, rhodium, and palladium. ひげゼンマイ、パレット、がんぎ車、歯車のような脱進機若しくはばねてんぷシステムの構成部品、又は他の固定若しくは移動部品からなることを特徴とする請求項1から6のいずれかに記載の微小機械部品。   7. A balance spring, a pallet, a escape wheel, an escapement such as a gear, or a component part of a spring balance system, or another fixed or moving part. Micro machine parts.
JP2013118770A 2006-03-24 2013-06-05 Micro mechanical parts incorporated into the clockwork mechanism Active JP5599917B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP06111727.1 2006-03-24
EP06111727A EP1837721A1 (en) 2006-03-24 2006-03-24 Micro-mechanical piece made from insulating material and method of manufacture therefor
CH00595/06 2006-04-10
CH00595/06A CH707669B1 (en) 2006-04-10 2006-04-10 micro-mechanical part of electrically insulating material or silicon or its compounds and its manufacturing process.

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007076624A Division JP5378654B2 (en) 2006-03-24 2007-03-23 Micromechanical part made of insulating material and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JP2013231728A true JP2013231728A (en) 2013-11-14
JP5599917B2 JP5599917B2 (en) 2014-10-01

Family

ID=38630650

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007076624A Active JP5378654B2 (en) 2006-03-24 2007-03-23 Micromechanical part made of insulating material and method of manufacturing the same
JP2013118770A Active JP5599917B2 (en) 2006-03-24 2013-06-05 Micro mechanical parts incorporated into the clockwork mechanism

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007076624A Active JP5378654B2 (en) 2006-03-24 2007-03-23 Micromechanical part made of insulating material and method of manufacturing the same

Country Status (5)

Country Link
US (1) US7824097B2 (en)
JP (2) JP5378654B2 (en)
KR (1) KR20070096834A (en)
HK (1) HK1113948A1 (en)
TW (1) TWI438588B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015179067A (en) * 2014-02-26 2015-10-08 シチズンホールディングス株式会社 Manufacturing method of balance spring
US10274897B2 (en) 2015-06-15 2019-04-30 Citizen Watch Co., Ltd. Speed governor for timepiece

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2215531B1 (en) * 2007-11-28 2011-03-09 Manufacture et fabrique de montres et chronomètres Ulysse Nardin Le Locle SA Mechanical oscillator having an optimized thermoelastic coefficient
EP2104005A1 (en) * 2008-03-20 2009-09-23 Nivarox-FAR S.A. Composite balance and method of manufacturing thereof
EP2104008A1 (en) * 2008-03-20 2009-09-23 Nivarox-FAR S.A. Single-body regulating organ and method for manufacturing same
EP2105807B1 (en) 2008-03-28 2015-12-02 Montres Breguet SA Monobloc elevated curve spiral and method for manufacturing same
CH700059A2 (en) * 2008-12-15 2010-06-15 Montres Breguet Sa Curve elevation hairspring i.e. Breguet hairspring, for movement of timepiece, has elevation device placed between external spire and terminal curve, and two unique parts integrated for increasing precision of development of hairspring
US20100150418A1 (en) 2008-12-15 2010-06-17 Fujifilm Corporation Image processing method, image processing apparatus, and image processing program
US20120141800A1 (en) * 2009-06-09 2012-06-07 The Swatch Group Research And Development Ltd. Method for coating micromechanical components of a micromechanical system, in particular a watch and related micromechanical coated component
GB201001897D0 (en) * 2010-02-05 2010-03-24 Levingston Gideon Non magnetic mateial additives and processes for controling the thermoelastic modulus and spring stiffness within springs for precision instruments
CH705724B9 (en) 2011-11-03 2016-05-13 Sigatec Sa micromechanical component, in particular for watches.
JP5840043B2 (en) * 2012-03-22 2016-01-06 セイコーインスツル株式会社 Balance, watch movement, and watch
WO2014075859A1 (en) * 2012-11-16 2014-05-22 Nivarox-Far S.A. Resonator that is less sensitive to climatic variations
EP2781968A1 (en) * 2013-03-19 2014-09-24 Nivarox-FAR S.A. Resonator that is less sensitive to climate variations
EP2804054B1 (en) * 2013-05-17 2020-09-23 ETA SA Manufacture Horlogère Suisse Anti-adhesion device of a spiral on a bridge
EP2884347A1 (en) * 2013-12-16 2015-06-17 ETA SA Manufacture Horlogère Suisse Hairspring with device for ensuring the separation of the turns
HK1209578A2 (en) * 2015-02-17 2016-04-01 Master Dynamic Ltd Silicon hairspring
EP3181515A1 (en) * 2015-12-15 2017-06-21 CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement Composite timepiece and method for manufacturing same
EP3502289B1 (en) * 2017-12-21 2022-11-09 Nivarox-FAR S.A. Manufacturing method of a hairspring for a timepiece movement
EP3742237A1 (en) * 2019-05-23 2020-11-25 Nivarox-FAR S.A. Component, in particular for a timepiece, with a surface topology and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383677U (en) * 1986-11-19 1988-06-01
JP2002192499A (en) * 2000-11-09 2002-07-10 Robert Bosch Gmbh Micromachining structure and method for manufacturing micromachining structure
JP2002276771A (en) * 2001-03-21 2002-09-25 Seiko Epson Corp Gear device, power transmitting device having it, and equipment having power transmitting device
JP2002542495A (en) * 1999-04-21 2002-12-10 コンセイユ エ マニュファクチュール ヴェエルジェ ソシエテ アノニム Wristwatch mechanism with small generator and test method for this wristwatch mechanism
JP2005097647A (en) * 2003-09-22 2005-04-14 Seiko Epson Corp Film deposition method and sputtering system
JP2006507454A (en) * 2002-11-25 2006-03-02 セーエスエーエム サントル スイス ドュレクトロニック エ ドゥ ミクロテクニック エスアー Clock balance spring and manufacturing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242711A (en) * 1991-08-16 1993-09-07 Rockwell International Corp. Nucleation control of diamond films by microlithographic patterning
FR2731715B1 (en) * 1995-03-17 1997-05-16 Suisse Electronique Microtech MICRO-MECHANICAL PART AND METHOD FOR PRODUCING THE SAME
WO1999036941A2 (en) 1998-01-15 1999-07-22 Cornell Research Foundation, Inc. Trench isolation for micromechanical devices
US6173612B1 (en) * 1998-11-05 2001-01-16 Alliedsignal Inc. Stable metallization for electronic and electromechanical devices
US6329066B1 (en) * 2000-03-24 2001-12-11 Montres Rolex S.A. Self-compensating spiral for a spiral balance-wheel in watchwork and process for treating this spiral
EP1237058A1 (en) * 2001-02-28 2002-09-04 Eta SA Fabriques d'Ebauches Usage of a non-magnetic coating for covering parts in a horological movement
DE10127733B4 (en) * 2001-06-07 2005-12-08 Silicium Energiesysteme E.K. Dr. Nikolaus Holm Screw or spiral spring elements of crystalline, in particular monocrystalline silicon
KR100468853B1 (en) 2002-08-30 2005-01-29 삼성전자주식회사 MEMS comb actuator materialized on insulating material and method of manufacturing thereof
WO2004029733A2 (en) 2002-09-25 2004-04-08 Fore Eagle Co Ltd Mechanical parts
DE60333191D1 (en) * 2003-09-26 2010-08-12 Asulab Sa Spiral spring balance resonator with thermal compensation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383677U (en) * 1986-11-19 1988-06-01
JP2002542495A (en) * 1999-04-21 2002-12-10 コンセイユ エ マニュファクチュール ヴェエルジェ ソシエテ アノニム Wristwatch mechanism with small generator and test method for this wristwatch mechanism
JP2002192499A (en) * 2000-11-09 2002-07-10 Robert Bosch Gmbh Micromachining structure and method for manufacturing micromachining structure
JP2002276771A (en) * 2001-03-21 2002-09-25 Seiko Epson Corp Gear device, power transmitting device having it, and equipment having power transmitting device
JP2006507454A (en) * 2002-11-25 2006-03-02 セーエスエーエム サントル スイス ドュレクトロニック エ ドゥ ミクロテクニック エスアー Clock balance spring and manufacturing method thereof
JP2005097647A (en) * 2003-09-22 2005-04-14 Seiko Epson Corp Film deposition method and sputtering system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015179067A (en) * 2014-02-26 2015-10-08 シチズンホールディングス株式会社 Manufacturing method of balance spring
US10274897B2 (en) 2015-06-15 2019-04-30 Citizen Watch Co., Ltd. Speed governor for timepiece

Also Published As

Publication number Publication date
KR20070096834A (en) 2007-10-02
JP2007256290A (en) 2007-10-04
JP5599917B2 (en) 2014-10-01
TW200801867A (en) 2008-01-01
JP5378654B2 (en) 2013-12-25
US7824097B2 (en) 2010-11-02
HK1113948A1 (en) 2008-10-17
US20080037376A1 (en) 2008-02-14
TWI438588B (en) 2014-05-21

Similar Documents

Publication Publication Date Title
JP5599917B2 (en) Micro mechanical parts incorporated into the clockwork mechanism
CN101042570B (en) Micro-mechanical piece made from insulating material and method of manufacture therefor
EP1837722B1 (en) Micro-mechanical component in an insulating material and method of manufacture thereof
CN103097968B (en) Reduced-contact or contactless force transmission in a clock movement
US8550699B2 (en) Composite balance and method of manufacturing the same
US8557506B2 (en) Method of fabricating a metallic microstructure and microstructure obtained via the method
CN111868637B (en) Method for manufacturing silicon timepiece component
CN110244543B (en) Method for producing a metal decoration on a dial and dial obtained by said method
JP2014152400A (en) Method for producing single piece micro-machine constitution parts having at least two different functions in height direction
US10214831B2 (en) One-piece electroformed metal component
JP5632893B2 (en) Heat treatment method for micromechanical watch parts
JP5658344B2 (en) Manufacturing method of machine parts
CH705724B1 (en) Micromechanical part, especially for watchmaking.
JP6231644B2 (en) Timer component with improved tribology
JP5596991B2 (en) Machine part, method for manufacturing machine part and watch
JP2017096925A (en) Component for timepiece
CN112189063B (en) Method for producing a metallic ornament on a dial and dial obtained according to the method
EP3839625A1 (en) Method for manufacturing a timepiece component and component produced by this method
CH707669B1 (en) micro-mechanical part of electrically insulating material or silicon or its compounds and its manufacturing process.
TW201332881A (en) Thermal treatment method for micromechanical horological parts

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140304

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140527

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140729

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140813

R150 Certificate of patent or registration of utility model

Ref document number: 5599917

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250