JP2013222772A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013222772A5 JP2013222772A5 JP2012092386A JP2012092386A JP2013222772A5 JP 2013222772 A5 JP2013222772 A5 JP 2013222772A5 JP 2012092386 A JP2012092386 A JP 2012092386A JP 2012092386 A JP2012092386 A JP 2012092386A JP 2013222772 A5 JP2013222772 A5 JP 2013222772A5
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- frame
- package according
- substrate
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000006059 cover glass Substances 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012092386A JP2013222772A (ja) | 2012-04-13 | 2012-04-13 | 撮像素子パッケージおよび撮像装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012092386A JP2013222772A (ja) | 2012-04-13 | 2012-04-13 | 撮像素子パッケージおよび撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013222772A JP2013222772A (ja) | 2013-10-28 |
JP2013222772A5 true JP2013222772A5 (zh) | 2015-03-19 |
Family
ID=49593558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012092386A Pending JP2013222772A (ja) | 2012-04-13 | 2012-04-13 | 撮像素子パッケージおよび撮像装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2013222772A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5904957B2 (ja) * | 2013-02-28 | 2016-04-20 | キヤノン株式会社 | 電子部品および電子機器。 |
US10580811B2 (en) * | 2015-11-24 | 2020-03-03 | Sony Corporation | Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus |
JP2021093429A (ja) | 2019-12-09 | 2021-06-17 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子パッケージおよび撮像素子パッケージの製造方法 |
JP7505207B2 (ja) | 2020-03-04 | 2024-06-25 | 株式会社サタケ | 固体撮像素子の取付け構造、撮像装置、固体撮像素子の取付け方法及び撮像装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08237554A (ja) * | 1995-02-28 | 1996-09-13 | Canon Inc | 撮像装置 |
JP2004173031A (ja) * | 2002-11-21 | 2004-06-17 | Iwate Toshiba Electronics Co Ltd | イメージセンサモジュール |
JP2007147729A (ja) * | 2005-11-24 | 2007-06-14 | Alps Electric Co Ltd | カメラモジュール |
JP2008245244A (ja) * | 2007-02-26 | 2008-10-09 | Sony Corp | 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置 |
JP2009232159A (ja) * | 2008-03-24 | 2009-10-08 | Nikon Corp | 固体撮像装置及びカメラ、並びにそれらの製造方法 |
JP5550380B2 (ja) * | 2010-02-25 | 2014-07-16 | キヤノン株式会社 | 固体撮像装置及び撮像装置 |
-
2012
- 2012-04-13 JP JP2012092386A patent/JP2013222772A/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2012181545A5 (zh) | ||
JP2010219210A5 (ja) | 半導体装置 | |
JP2014032960A5 (ja) | 表示装置の作製方法 | |
JP2015166856A5 (zh) | ||
JP2009076480A5 (zh) | ||
JP2017501388A5 (zh) | ||
JP2013175984A5 (zh) | ||
JP2012168362A5 (zh) | ||
JP2011210248A5 (zh) | ||
JP2013222772A5 (zh) | ||
JP2013070233A5 (zh) | ||
JP2016015617A5 (zh) | ||
TW201144886A (en) | Imaging module and manufacturing method thereof | |
JP2013036766A5 (zh) | ||
JP2014139659A5 (zh) | ||
NL1033000A1 (nl) | Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid. | |
JP2011180325A5 (zh) | ||
JP2012127698A5 (zh) | ||
EP2863190A3 (en) | Optical sensor module | |
JP2011176224A5 (zh) | ||
JP2011023595A5 (zh) | ||
JP2014048090A5 (zh) | ||
JP2011165774A5 (zh) | ||
JP2015191896A5 (zh) | ||
TWI456314B (zh) | 背光模組 |