JP2013214359A - Method for forming coating film and organic el element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a coating film and an organic EL element, capable of suppressing mixture of an application liquid in mutually adjacent pixel columns and deviation of a film thickness of the coating film from a target value.SOLUTION: A method for forming a coating film includes the steps of: forming a first partition wall and a second partition wall intersecting with each other; and forming a coating film in a pixel region partitioned by the first partition wall and the second partition wall. The first partition wall partitions a pixel column composed of a pixel region of the same color. The second partition wall partitions a pixel region of the same color in the pixel column. The step of forming the first partition wall and the second partition wall determines a ratio of height Ht of the first partition wall to height Hy of the second partition wall on the basis of attributes of the application liquid used to form the coating film.

Description

  The technology of the present disclosure relates to a coating film forming method for forming a coating film by applying a liquid coating solution to a substrate, and an organic EL element.

  In recent years, in a manufacturing process of a display element such as an organic electroluminescence (organic EL) element, an application that becomes a light emitting layer by applying a liquid coating liquid containing a light emitting material on a substrate using an inkjet method or a nozzle printing method. A film is formed. In the display element manufactured as described above, an element structure in which pixels of the same color are arranged in one direction as described in Patent Document 1, for example, is employed for the sake of simplicity in manufacturing.

  FIG. 3 is a diagram showing a part of the element structure in such an organic EL element. FIG. 3A is a plan view showing an organic EL element at a stage before the light emitting layer is formed in the manufacturing process, and FIG. 3B is a cross-sectional view taken along line AA in FIG. FIG.

  As shown in FIG. 3A, in the organic EL element 1, a plurality of pixel columns 2 extending in one arrangement direction, which is one direction, are arranged along a crossing direction orthogonal to the arrangement direction. The pixel column 2 includes a red pixel column 2R, a green pixel column 2G, and a blue pixel column 2B. The red pixel column 2R, the green pixel column 2G, and the blue pixel column 2B are arranged in this order. It is arranged repeatedly. In the red pixel column 2R, red pixel regions 3R are arranged in the arrangement direction, and a red light emitting layer is formed in the red pixel region 3R. In the green pixel row 2G, green pixel regions 3G are arranged in the arrangement direction, and a green light emitting layer is formed in the green pixel region 3G. In the blue pixel row 2B, blue pixel regions 3B are arranged in the arrangement direction, and a blue light emitting layer is formed in the blue pixel region 3B.

  Between the two pixel columns 2 adjacent to each other, a stripe-shaped first partition wall 4 extending in the arrangement direction over the entire arrangement direction in the pixel column 2 is formed. The first partition 4 divides two adjacent pixel columns 2 in the crossing direction. Further, in each of the plurality of pixel columns 2, a stripe-shaped second partition wall 5 extending in the intersecting direction is formed between the adjacent pixel regions 3. The second partition 5 divides two adjacent pixel regions 3 in the arrangement direction.

  As shown in FIG. 3B, the first partition 4 and the second partition 5 are formed on a substrate 6 on which a TFT layer and a pixel electrode are formed. The first partition 4 and the second partition 5 are made of an insulating material. The height Ht of the first partition 4 from the upper surface of the substrate 6 is formed higher than the height Hy of the second partition 5 from the upper surface of the substrate 6.

  In such a configuration, when the light emitting layer is formed, a liquid coating liquid containing a red light emitting material is applied linearly along the red pixel row 2R. That is, the coating liquid is applied to the red pixel row 2R including the second partition 5 in the red pixel row 2R. Similarly, the liquid coating liquid containing the green light emitting material is applied linearly along the green pixel row 2G, and the liquid coating liquid containing the blue light emitting material is linearly applied along the blue pixel row 2B. It is applied to the shape. Thus, the light emitting layer of each color is formed in the pixel region 3 for each color.

JP 2011-113646 A

  By the way, in the organic EL element 1 described above, when the height Ht of the first partition 4 is too low with respect to the height Hy of the second partition 5, the coating liquid applied on the second partition 5 is the first partition 4. May flow into the adjacent pixel row 2 of another color, and color mixture of the coating liquid may occur in the pixel region 3. On the other hand, if the height Ht of the first partition 4 is too high with respect to the height Hy of the second partition 5, the amount of the coating liquid adhering to the side surface of the first partition 4 in the pixel region 3 increases. A coating film having a desired film thickness may not be obtained with respect to the coating amount of the liquid. Therefore, when manufacturing the organic EL element 1, it is required to appropriately set the height Ht of the first partition 4 and the height Hy of the second partition 5.

  The technology of the present disclosure has been made in view of such circumstances, and the purpose thereof is that the coating liquid is mixed in the pixel rows adjacent to each other and that the film thickness of the coating film deviates from the target value. An object of the present invention is to provide a coating film forming method and an organic EL element that can be suppressed.

  One aspect of the method for forming a coating film in the present disclosure includes a step of forming a first partition and a second partition that intersect with each other, and a coating film is formed in a pixel region defined by the first partition and the second partition The first barrier ribs divide a pixel column composed of pixel regions of the same color, and the second barrier ribs divide the pixel region of the same color in the pixel columns, In the step of forming one partition wall and the second partition wall, in order to form the coating film when the ratio of the height of the first partition wall to the height of the second partition wall is set as the partition wall height ratio. The partition wall height ratio for retaining the coating liquid in the pixel region is determined based on the attribute of the coating liquid used in the above.

  As described above, when the height of the first partition is too low with respect to the height of the second partition, the coating liquid gets over the first partition. At this time, whether or not the coating solution gets over the first partition varies depending on the contact angle of the coating solution with respect to the first partition, the static viscosity of the coating solution, and the like if the coating solution is in a static state. Further, whether or not the coating liquid gets over the first partition varies depending on the dynamic viscosity of the coating liquid and the like if the coating liquid is in a dynamic state. That is, whether or not the height of the first partition is too low with respect to the height of the second partition depends on the attribute of the coating liquid. Similarly, whether the coating liquid wets the first partition wall also depends on the attribute of the coating liquid.

  In this regard, in one aspect of the coating film forming method of the present disclosure, the ratio of the height of the first partition to the height of the second partition is determined based on the attribute of the coating solution. Therefore, the height of the first partition relative to the height of the second partition is determined in advance within a range in which the color mixing of the coating liquid and the wetting of the coating liquid are suppressed. It is possible to form a coating film having a film thickness to be achieved.

In another aspect of the coating film forming method according to the present disclosure, the attribute of the coating solution includes the viscosity of the coating solution.
If it is said other aspect, since the ratio of the height of the 1st partition with respect to the height of a 2nd partition is determined by the viscosity which is comparatively easy to measure among the attributes of a coating solution, It becomes easy to form a coating film having a target film thickness while suppressing color mixing.

In another aspect of the coating film forming method according to the present disclosure, the attribute of the coating solution includes a contact angle of the coating solution with respect to the first partition.
Examples of the attribute of the coating liquid include a physical property value that is uniquely determined by the coating liquid itself, such as the viscosity, and a physical property value that is determined from a relationship between a target to which the coating liquid is applied and the coating liquid. Whether the coating solution gets over the first partition or the extent to which the coating solution wets the first partition is based on the relationship between the first partition and the coating solution, in addition to the property values that are uniquely determined by the coating solution itself. It varies depending on the physical property values. In this respect, in the case of the other aspect, the ratio of the height of the first partition wall to the height of the second partition wall is determined by the contact angle of the coating solution with respect to the first partition wall. However, it is possible to form a coating film having a desired film thickness with higher accuracy.

  In another aspect of the coating film forming method of the present disclosure, the first partition is made of an insulating resin material, the second partition is made of an insulating inorganic material, and the height of the first partition is 1.0 μm or more. 5.0 μm or less, the height of the second partition wall is 0.4 μm or more and 1.2 μm or less, and the ratio of the height of the first partition wall to the height of the second partition wall is 2 or more. 10 or less.

  One aspect of the organic EL element in the present disclosure includes a first partition wall and a second partition wall that intersect with each other, a coating film that is formed in a pixel region that is partitioned by the first partition wall and the second partition wall, and includes a light emitting layer. The first partition is an organic EL element that partitions a pixel column composed of the same color pixel region, the second partition is an organic EL element that partitions the pixel region of the same color in the pixel column, and the first partition is It is made of an insulating resin material, the second partition is made of an insulating inorganic material, the height of the first partition is 1.0 μm or more and 5.0 μm or less, and the height of the second partition is 0.4 μm. The ratio of the height of the first partition to the height of the second partition is 2 or more and 10 or less.

  According to another aspect of the coating film forming method or one aspect of the organic EL element, the formation material and size of the first partition, the formation material and size of the second partition, and the ranges thereof are determined. A ratio of the height of the first partition to the height of the second partition is determined. Therefore, it is possible to realize a coating film having a target film thickness with higher accuracy while suppressing color mixing of the coating liquid between the pixel columns.

  According to the coating film forming method and the organic EL element of the present disclosure, it is possible to form a coating film having a target film thickness while suppressing color mixing of the coating liquid.

The block diagram which shows the structure of the coating film formation system used by one Embodiment of the coating film formation method and organic EL element in this indication. The figure which shows an example of the map which shows the relationship between the viscosity of the coating liquid used in the embodiment, and the ratio of the height of the 1st partition with respect to the height of the 2nd partition. (A) is a top view which shows a part of planar structure of an organic EL element, (b) is sectional drawing in the AA of (a).

  Hereinafter, an embodiment of a coating film forming method and an organic EL element according to the present disclosure will be described with reference to FIGS. In addition, the coating film formed by the coating film formation method of this embodiment is a coating film used as the light emitting layer of an organic EL element. The coating film forming method according to the present embodiment is characterized by a method for setting the height Ht of the first partition 4 and the height Hy of the second partition 5, and therefore, hereinafter, the height Ht of the first partition 4 and the first The method for setting the height Hy of the two partition walls 5 will be mainly described, and for the sake of convenience of description, the members described above are denoted by the same reference numerals, and redundant description thereof will be omitted. First, the coating film formation system 10 used for the coating film formation method of this embodiment is demonstrated.

  As shown in FIG. 1, the coating film forming system 10 includes a design unit 11 that designs the height of the partition and a manufacturing unit 12 that forms the partition and the coating film. Each of the design unit 11 and the manufacturing unit 12 is mainly configured by a microcomputer having a central processing unit (CPU), a nonvolatile memory (ROM), and a volatile memory (RAM).

  The design unit 11 includes an input unit 11a that performs input processing of various input signals, an output unit 11b that performs output processing of a control signal to the manufacturing unit 12, a calculation unit 11c that calculates the height of the partition, and a calculation unit And a storage unit 11d for storing information used for setting the calculation result of 11c and the height of the partition wall.

  An operation unit 20 composed of various buttons, a touch panel, and the like is connected to the input unit 11a. The operation unit 20 outputs the application volume Q of the application liquid to the pixel region 3, the dynamic viscosity (viscosity μ) of the application liquid used for forming the application film, and the like to the input unit 11a. The coating capacity Q of the coating solution is appropriately set according to the concentration of the functional material contained in the coating solution, the thickness of the coating film, and the size of the pixel region 3.

  The storage unit 11d stores partition design information that is information used for setting the height of the partition. The partition design information is information that associates the partition wall height ratio Ht / Hy, which is the ratio of the height Ht of the first partition 4 with respect to the height Hy of the second partition 5, and the viscosity μ of the coating liquid, It is stored as a map indicating the relationship between the thickness ratio Ht / Hy and the viscosity μ of the coating solution.

  As shown in FIG. 2, in the above map, the minimum value and the maximum value of the partition wall height ratio Ht / Hy are defined according to the viscosity μ of the coating liquid based on various experiments performed in advance. Yes. Such a map is created for each coating volume Q of different coating liquids based on experimental results, and stored in the storage unit 11d in a state linked to the coating volume Q.

  When the height Ht of the first partition 4 is close to the height Hy of the second partition 5, the coating liquid applied on the second partition 5 easily gets over the first partition 4. The minimum value of the partition wall height ratio Ht / Hy is a threshold value as to whether or not the coating liquid applied on the second partition wall 5 passes over the first partition wall 4 and flows into the adjacent pixel row 2 of another color. Is the value. If the partition wall height ratio Ht / Hy is equal to or greater than the minimum value for each viscosity μ, the height Ht of the first partition wall 4 is not too low with respect to the height Hy of the second partition wall 5, so that the coating liquid is adjacent. It is possible to suppress the flow into the pixel row 2 of another color.

  On the other hand, when the height Ht of the first partition 4 becomes too high, the amount of the coating liquid that wets the wall surface of the first partition 4 increases, and the thickness of the coating film formed in the pixel region is larger than the desired thickness. getting thin. The maximum value of the partition wall height ratio Ht / Hy is a value that is a threshold value as to whether or not the amount of the coating liquid adhering to the side surface of the first partition wall 4 keeps the thickness of the coating film within a desired range. If the partition wall height ratio Ht / Hy is equal to or less than the maximum value for each viscosity μ, the height Ht of the first partition wall 4 is not too high with respect to the height Hy of the second partition wall 5. A coating film having a desired film thickness can be formed without increasing the amount. That is, for each viscosity μ, if the partition wall height ratio Ht / Hy is not less than the minimum value and not more than the maximum value, the coating liquid is mixed in the pixel rows adjacent to each other, and the coating film thickness deviates from the target value. Can be suppressed.

  Note that the height Hy of the second partition wall 5 is a level difference formed according to the thickness of wiring such as signal lines and scanning lines in the TFT layer formed on the substrate 6 in the first place. The height Hy is usually restricted by the underlying wiring structure and its peripheral structure. For example, regardless of the partition wall height ratio Ht / Hy, when the height Hy of the second partition wall 5 is too low, depending on the driving method of the organic EL element, the electrodes formed on the second partition wall 5 and the like The parasitic capacitance of the second partition 5 is not negligible between the wiring formed under the two partitions 5 and the like.

  Therefore, when the heights Ht and Hy of each partition wall are calculated from the partition wall height ratio Ht / Hy, a range in which the parasitic capacitance is ignored is determined in advance as the height Hy of the second partition wall 5. It is preferred that Alternatively, it is preferable that at least one of the range of the height Ht of the first partition 4 and the range of the height Hy of the second partition 5 is determined in advance by the above map.

  Further, the above-described wet-up of the coating solution can occur not only in the first partition 4 but also in the second partition 5. For example, regardless of the partition wall height ratio Ht / Hy, when the height Ht of the second partition wall 5 is too high, the amount of the coating liquid that wets the second partition wall 5 increases, and the coating formed in the pixel region. The film thickness becomes thinner than the desired thickness.

  Therefore, similarly to the parasitic capacitance described above, when the height Ht, Hy of each partition wall is calculated from the partition wall height ratio Ht / Hy, the height Hy of the second partition wall 5 is used as the height of the second partition wall 5. It is preferable that a range to be ignored is determined in advance. Alternatively, it is preferable that at least one of the range of the height Ht of the first partition 4 and the range of the height Hy of the second partition 5 is determined in advance by the above map.

In the case where the forming material of the first partition 4, the forming material of the second partition 5, and the viscosity μ of the coating liquid are the following conditions, the range of the height Ht of the first partition 4 and the second partition 5 A specific example of the map in which the range of the height Hy is predetermined is shown in Table 1.
-Forming material of the first partition 4: Polyimide (PI) which is an insulating resin material
The material for forming the second partition wall 5: silicon nitride (SiN) which is an insulating inorganic material
・ Viscosity μ of coating solution: 20 mPa or less

上記表１にて、「＊」の付された水準は、目的とする膜厚の塗布膜を形成する上で、下記（ａ）から（ｄ）のいずれかの状態に該当するものである。
（ａ）第１隔壁４の側面への濡れ上がりにより膜厚が不足している状態
（ｂ）第２隔壁５上の電極とＴＦＴ層との間の寄生容量が過大な状態
（ｃ）第１隔壁４の乗り越えにより塗布液が混色している状態
（ｄ）第２隔壁５の側面への濡れ上がりにより膜厚が不足している状態
なお、上記（ａ）に示される現象は、第１隔壁４の高さＨｔが高くなるに従って顕著になる。上記（ｂ）に示される現象は、第２隔壁５の高さＨｙが低くなるに従って顕著になる。上記（ｃ）に示される現象は、第１隔壁４の高さＨｔが低く、且つ、第２隔壁５の高さＨｙが高くなるに従って顕著になる。上記（ｄ）に示される現象は、第２隔壁５の高さＨｙが高くなるに従って顕著になる。

In Table 1 above, the level marked with “*” corresponds to one of the following states (a) to (d) in forming a coating film having a target film thickness.
(A) A state in which the film thickness is insufficient due to wetting to the side surface of the first partition 4 (b) a state in which the parasitic capacitance between the electrode on the second partition 5 and the TFT layer is excessive (c) a first State where coating liquid is mixed due to overcoming partition wall 4 (d) State where film thickness is insufficient due to wetting on side surface of second partition wall 5 The phenomenon shown in (a) above is As the height Ht of 4 increases, it becomes more prominent. The phenomenon shown in (b) becomes more prominent as the height Hy of the second partition wall 5 becomes lower. The phenomenon shown in (c) becomes more prominent as the height Ht of the first partition 4 is lower and the height Hy of the second partition 5 is higher. The phenomenon shown in (d) above becomes more prominent as the height Hy of the second partition wall 5 increases.

  The calculation unit 11c reads a map associated with the input value of the application volume Q from the map stored in the storage unit 11d in accordance with the application volume Q of the application liquid input by the input unit 11a. The calculation unit 11c calculates the minimum value and the maximum value of the partition wall height ratio Ht / Hy corresponding to the input value of the viscosity μ from the read map according to the viscosity μ of the coating liquid input by the input unit 11a. Ask. The design unit 11 outputs a signal corresponding to the minimum value and the maximum value of the partition wall height ratio Ht / Hy from the output unit 11b to the manufacturing unit 12. At this time, when a map in which the range of the height Ht of the first partition 4 and the range of the height Hy of the second partition 5 is used in advance is used, the value of the partition wall height ratio Ht / Hy is used. Are output as combinations of heights Ht and Hy.

  The manufacturing unit 12 includes a first partition forming unit 12a that performs control related to the formation of the first partition 4, a second partition forming unit 12b that performs control related to the formation of the second partition 5, and a control related to formation of the coating film. A coating film forming unit 12c that performs the above and a storage unit 12d that stores a coating film forming program. In the manufacturing unit 12, the height Ht of the first partition 4 and the height Hy of the second partition 5 are determined based on the range of the partition wall height ratio Ht / Hy output from the output unit 11b.

  For example, in the manufacturing unit 12, a relatively low height Ht is selected from the range of the partition wall height ratio Ht / Hy so that the formation time of the first partition wall 4 and the formation time of the second partition wall 5 are minimized. , Hy combination is selected. For example, when the map shown in Table 2 is used, 1.0 μm is selected as the height Ht, and 0.4 μm is selected as the height Hy.

  Alternatively, for example, in the manufacturing unit 12, a high median value is selected from the range of the partition wall height ratio Ht / Hy so that the processing accuracy of the first partition wall 4 and the processing accuracy of the second partition wall 5 are ensured. A combination of Ht and Hy is selected. For example, when the map shown in Table 2 is used, 2.5 μm is selected as the height Ht, and 0.6 μm is selected as the height Hy.

  In addition, when the predetermined map is not used for the range of the height Ht of the first partition 4 and the range of the height Hy of the second partition 5, the first partition as shown in Table 1 above is used. Information regarding the range of the height Ht of 4 and the range of the height Hy of the second partition wall 5 is preferably used separately in the manufacturing unit 12.

  The first partition forming part 12a generates and outputs a control signal corresponding to the determined height Ht of the first partition 4, thereby driving the mechanism for forming the first partition 4 to cause the first partition 4 to move. Form. For example, the first partition forming part 12a forms a coating film made of polyimide with a film thickness corresponding to the input value of the height Ht, and the input value of the height Ht through an etching process corresponding to the input value of the height Ht. The first partition 4 is formed at a height corresponding to.

  The second partition wall forming unit 12b generates and outputs a control signal corresponding to the determined height Hy of the second partition wall 5, thereby driving a mechanism for forming the second partition wall 5 so that the second partition wall 5 is moved. Form. For example, the second barrier rib forming part 12b forms an insulating film made of SiN with a film thickness that can provide an input value of height Hy, and forms the second barrier rib 5 at a height corresponding to the input value of height Hy. To do.

  The coating film forming unit 12c generates and outputs a control signal according to the coating film forming program stored in the storage unit 12d, thereby driving a mechanism for forming the coating film to form the coating film. For example, the coating film forming unit 12c scans the nozzle along the pixel row 2 and applies the coating liquid having the viscosity μ of the input value so that the coating liquid having the coating capacity Q is applied to each pixel region 3. Discharge without any break from the nozzle.

  Next, a coating film forming method using the coating film forming system 10 will be described. In the following, a mode in which a map in which the range of the height Ht of the first partition 4 and the range of the height Hy of the second partition 5 are determined in advance is used will be exemplified.

  First, in the design unit 11, the coating volume Q of the coating liquid for each pixel region 3 and the viscosity μ of the coating liquid used for forming the coating film are input to the input unit 11 a through the operation of the operation unit 20. Next, a map associated with the input value of the application volume Q is read from the storage unit 11d by the calculation process of the calculation unit 11c. Subsequently, the range of the partition wall height ratio Ht / Hy corresponding to the viscosity μ is obtained by the calculation process of the calculation unit 11c from the read map. The obtained partition wall height ratio Ht / Hy is output to the manufacturing unit 12 together with the coating capacity Q as a combination of the heights Ht and Hy.

  Next, in the manufacturing unit 12, after the height Ht of the first partition 4 and the height Hy of the second partition 5 are determined, the first partition formation part 12a and the second partition formation part 12b are driven, Thus, the first partition 4 having a height Ht and the second partition 5 having a height Hy are formed.

That is, when the map shown in Table 1 is used, the first partition 4 and the second partition 5 having the following structure are formed.
The height Ht of the first partition 4: 1.0 μm to 5.0 μm The height Hy of the second partition 5: 0.4 μm to 1.2 μm The height ratio Hy / Ht: 2 to 10 The coating film forming unit 12 c is driven based on the input value of the coating capacity Q, whereby the coating liquid having a viscosity μ is applied with the coating capacity Q for each pixel region 3. Here, when the coating liquid having a viscosity μ is applied, the height Ht of the first partition 4 is not too low with respect to the height Hy of the second partition 5, so that the pixels of other colors adjacent to the coating liquid are present. The flow into the row 2 is suppressed. In addition, when the coating liquid having a viscosity μ is applied, the height Ht of the first partition 4 is not too high with respect to the height Hy of the second partition 5, so that the object can be achieved without increasing the coating amount of the coating liquid. A coating film having a thickness to be formed is formed.

Thus, in this embodiment, the ratio of the height Ht of the first partition 4 to the height Hy of the second partition 5 is set based on the viscosity μ of the coating liquid.
As described above, according to the coating film forming method and the organic EL element of the present embodiment, the effects listed below can be obtained.

  (1) Since the ratio of the height Ht of the first partition 4 to the height Hy of the second partition 5 is set based on the viscosity μ of the coating solution, the target film is suppressed while preventing color mixing of the coating solution. A thick coating film can be formed. In particular, the ratio is appropriately set by considering the viscosity μ of the coating solution.

  (2) The minimum value of the ratio is set as a threshold value as to whether or not the coating liquid applied on the second partition wall 5 flows into the adjacent pixel row 2 of another color. It is possible to suppress the flow into the adjacent pixel row 2 of another color.

  (3) Since the maximum value of the ratio is set as a threshold value as to whether or not the amount of the coating liquid adhering to the side surface of the first partition wall 4 is an amount that does not affect the film thickness of the coating film to be formed. Thus, it is possible to form a coating film having a desired film thickness appropriately with respect to the coating amount of the coating liquid.

In addition, the said embodiment can also be implemented with the following forms, for example.
In the above embodiment, the ratio of the height Ht of the first partition 4 to the height Hy of the second partition 5 is set as the attribute of the coating liquid based on the viscosity μ. Instead of this, as an attribute of the coating liquid, for example, water repellency with respect to the partition wall may be used. For example, when xylene is used as the solvent of the coating solution, a contact angle θ1 between the first partition 4 made of polyimide and xylene and a contact angle θ2 between the second partition 5 made of silicon nitride and xylene are used.

  In this case, the map stored in the storage unit 11d of the design unit 11 is created as information associating the partition wall height ratio Ht / Hy with the contact angles θ1 and θ2. Then, the design unit 11 receives the application volume Q of the application liquid and the contact angles θ1 and θ2 from the operation unit 20 to obtain the minimum value and the maximum value of the partition wall height ratio Ht / Hy from the map. It is done.

  Further, both the viscosity μ and the contact angles θ1 and θ2 may be used as attributes of the coating liquid. In this case, the map stored in the storage unit 11d of the design unit 11 is created as information associating the partition wall height ratio Ht / Hy with the viscosity μ and the contact angles θ1 and θ2. In the design unit 11, the minimum and maximum values of the partition wall height ratio Ht / Hy are calculated from the map by inputting the application volume Q, the viscosity μ, and the contact angles θ1 and θ2 from the operation unit 20. Is required.

  In the above embodiment, the design unit 11 and the production unit 12 are systematized. For example, the design unit 11 is a design device, the production unit 12 is a production device, and the first partition wall output from the design device. The user may input the height Ht of 4 and the height Hy of the second partition wall 5 to the manufacturing apparatus. Further, the design apparatus outputs the minimum value and the maximum value of the partition wall height ratio Ht / Hy, and the user can determine the height of the first partition wall 4 based on the minimum value and the maximum value of the partition wall height ratio Ht / Hy. You may set Ht and the height Hy of the 2nd partition 5. In short, the ratio of the height Ht of the first partition 4 to the height Hy of the second partition 5 is output based on the attribute of the coating liquid, and each partition is formed at heights Ht and Hy corresponding to the output values. Any method can be used.

  In the above embodiment, the first partition 4 is formed from polyimide and the second partition 5 is formed from silicon nitride. However, the first partition is made of any appropriate material as long as it has insulating properties. 4 and the second partition 5 can be formed. At this time, the map stored in the storage unit 11d of the design unit 11 is created according to the material. In the organic EL element, if the second partition wall 5 is formed of a material having a lower water repellency than the first partition wall 4, the coating amount is uneven when the liquid coating liquid is applied linearly. Can be suppressed.

  The element for forming the coating film is not limited to the organic EL element, and any element may be used as long as the coating film is formed by applying a liquid coating solution to the region partitioned by the first partition wall 4 and the second partition wall 5. .

  DESCRIPTION OF SYMBOLS 1 ... Organic EL element, 2 ... Pixel row, 3 ... Pixel region, 4 ... 1st partition, 5 ... 2nd partition, 6 ... Substrate, 10 ... Coating film formation system, 11 ... Design part, 11a ... Input part, 11b ... output part, 11c ... calculation part, 11d ... storage part, 12 ... manufacturing part, 12a ... first partition formation part, 12b ... second partition formation part, 12c ... coating film formation part, 12d ... storage part.

Claims (5)

Forming a first partition and a second partition that intersect each other;
Forming a coating film on a pixel region partitioned by the first partition and the second partition,
The first partition partitions a pixel row composed of pixel regions of the same color,
The second partition wall is a coating film forming method for partitioning pixel regions of the same color in the pixel column,
In the step of forming the first partition and the second partition,
When the ratio of the height of the first partition to the height of the second partition is set as the partition height ratio, the coating solution is based on the attribute of the coating solution used to form the coating film. A coating film forming method for determining the height ratio of the partition wall for retaining the inside of the pixel region. The coating film forming method according to claim 1, wherein the attribute of the coating solution includes a viscosity of the coating solution. The coating film forming method according to claim 1, wherein the attribute of the coating liquid includes a contact angle of the coating liquid with respect to the first partition. The first partition is made of an insulating resin material,
The second partition wall is made of an insulating inorganic material,
The height of the first partition wall is 1.0 μm or more and 5.0 μm or less,
The height of the second partition wall is 0.4 μm or more and 1.2 μm or less, and
The coating film forming method according to claim 1, wherein a ratio of a height of the first partition to a height of the second partition is 2 or more and 10 or less. A first partition and a second partition intersecting each other;
A coating film including a light emitting layer formed in a pixel region partitioned by the first partition and the second partition;
The first partition partitions a pixel row composed of pixel regions of the same color,
The second partition wall is an organic EL element that partitions pixel regions of the same color in the pixel column,
The first partition is made of an insulating resin material,
The second partition wall is made of an insulating inorganic material,
The height of the first partition wall is 1.0 μm or more and 5.0 μm or less,
The height of the second partition wall is 0.4 μm or more and 1.2 μm or less, and
The ratio of the height of the first partition to the height of the second partition is 2 or more and 10 or less.

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