JP2013209671A5 - - Google Patents
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- Publication number
- JP2013209671A5 JP2013209671A5 JP2013138025A JP2013138025A JP2013209671A5 JP 2013209671 A5 JP2013209671 A5 JP 2013209671A5 JP 2013138025 A JP2013138025 A JP 2013138025A JP 2013138025 A JP2013138025 A JP 2013138025A JP 2013209671 A5 JP2013209671 A5 JP 2013209671A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- maleimide
- compound
- molecule
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 maleimide compound Chemical class 0.000 claims 9
- 239000011342 resin composition Substances 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 4
- 230000002378 acidificating effect Effects 0.000 claims 3
- 125000001931 aliphatic group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 125000005843 halogen group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- 125000001424 substituent group Chemical group 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000004593 Epoxy Chemical class 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000001118 alkylidene group Chemical group 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 125000000542 sulfonic acid group Chemical group 0.000 claims 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013138025A JP5682664B2 (ja) | 2013-07-01 | 2013-07-01 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013138025A JP5682664B2 (ja) | 2013-07-01 | 2013-07-01 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007332857A Division JP2009155399A (ja) | 2007-12-25 | 2007-12-25 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013209671A JP2013209671A (ja) | 2013-10-10 |
| JP2013209671A5 true JP2013209671A5 (https=) | 2014-08-07 |
| JP5682664B2 JP5682664B2 (ja) | 2015-03-11 |
Family
ID=49527771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013138025A Active JP5682664B2 (ja) | 2013-07-01 | 2013-07-01 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5682664B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155399A (ja) * | 2007-12-25 | 2009-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
| JP6575151B2 (ja) * | 2015-06-05 | 2019-09-18 | 日立化成株式会社 | 熱硬化性樹脂組成物、並びにそれを用いたプリプレグ、積層板及びプリント配線板 |
| JP6977241B2 (ja) * | 2016-03-01 | 2021-12-08 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001261939A (ja) * | 2000-03-21 | 2001-09-26 | Sumitomo Bakelite Co Ltd | 液状樹脂組成物及びそれを用いた半導体装置。 |
| JP2002284963A (ja) * | 2001-03-26 | 2002-10-03 | Nippon Kayaku Co Ltd | 難燃性エポキシ樹脂組成物及びその用途 |
| TWI278481B (en) * | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
| US8796473B2 (en) * | 2006-06-06 | 2014-08-05 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| JP2009155399A (ja) * | 2007-12-25 | 2009-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
-
2013
- 2013-07-01 JP JP2013138025A patent/JP5682664B2/ja active Active
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