JP2013202547A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of uniformly processing both front and back surfaces of a substrate.SOLUTION: A printed circuit board 100 is conveyed in a horizontal direction while end edges on both sides facing each other in a direction orthogonal to the conveyance direction of the printed circuit board 100 are guided by a plurality of guide members 21, in a processing tank 11. The guide members 21 have a shape, such that a first truncated conical shape member 21a whose shaft center is turned to a vertical direction and outer diameter is reduced as approaching a lower part and a second truncated conical shape member 21b whose shaft center is turned to the vertical direction and outer diameter is reduced as approaching an upper part are connected, and is abutted only to end edges on both sides with respect to the conveyance direction of the printed circuit board 100 in a rectangular shape.

Description

  The present invention relates to a substrate processing apparatus for simultaneously processing both surfaces of a substrate by supplying a processing liquid to both surfaces of a rectangular substrate transported in a horizontal direction by a transport mechanism.

  Substrate processing apparatus for processing rectangular substrates such as printed circuit boards, glass substrates for organic EL display devices, glass substrates for liquid crystal display devices, panel substrates for solar cells, glass substrates for PDP, glass substrates for photomasks, optical disk substrates, etc. In the method, the substrate is processed by supplying the processing liquid to the surface of the substrate while supporting the lower surface of the substrate by the conveyance roller and conveying the substrate in the horizontal direction.

  Patent Document 1 discloses a substrate cleaning apparatus that immerses a wafer in an inclined state in a cleaning liquid that generates an upward flow due to overflow, and applies megasonic vibration to the cleaning liquid from the lateral direction of the wafer. .

JP 7-2111684 A

  In the conventional substrate processing apparatus that supports and conveys the lower surface of the substrate by the conveying roller described above, the processing liquid supplied to the substrate wraps around the back side of the substrate and enters between the surface of the conveying roller and the back surface of the substrate. There is a case. In such a case, the processing liquid that has entered between the front surface of the transport roller and the back surface of the substrate also moves along with the movement of the substrate due to the rotation of the transport roller, and this processing liquid streaks on the back surface side of the substrate. Will remain.

  In the case where this substrate processing step is an etching processing step in which, for example, a silicon oxide film formed on the surface of a glass substrate is etched with hydrofluoric acid, the back surface side of the substrate is etched by the processing liquid remaining in this manner. There is a problem of being. When such a phenomenon occurs, etching unevenness occurs on the back surface side of the glass substrate, and the front and back surfaces of the substrate cannot be uniformly etched. In addition, even when this substrate processing process is a process for processing both sides of the printed circuit board, the processing state is non-uniform on the front and back surfaces of the substrate, and it is impossible to process both the front and back surfaces of the substrate uniformly. It becomes.

  The substrate cleaning apparatus described in Patent Document 1 described above is intended to prevent cross-contamination between the cleaning tank and the substrate, but can be used when a large rectangular substrate is transported and processed. Not something.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus capable of uniformly processing both front and back surfaces of a substrate.

  The invention according to claim 1 is the substrate processing apparatus for simultaneously processing both surfaces of the substrate by supplying the processing liquid to both surfaces of the rectangular substrate transported in the horizontal direction by the transport mechanism. The mechanism includes a first frustoconical member whose axis is oriented in the vertical direction and the outer diameter decreases downward, and a second frustoconical member whose axis is oriented in the vertical direction and the outer diameter increases upward; The substrate is conveyed while being guided by a plurality of guide members that are in contact with only edges on both sides facing each other in a direction orthogonal to the conveyance direction of the rectangular substrate. And

  According to a second aspect of the invention, there is provided the processing tank according to the first aspect, wherein the processing tank stores a processing liquid, and the transport mechanism transports the substrate in the processing liquid stored in the processing tank. , Processing both sides of the substrate simultaneously.

  According to a third aspect of the present invention, in the first aspect of the invention, the plurality of treatment liquid ejection nozzles that eject the treatment liquid to both surfaces of the substrate are provided, and the plurality of the plurality of treatment liquid ejection nozzles are conveyed on both surfaces of the substrate conveyed by the conveyance mechanism. Both surfaces of the substrate are processed simultaneously by ejecting the treatment liquid from the treatment liquid ejection nozzle.

  According to the first aspect of the present invention, since the substrate is conveyed while being guided by the plurality of guide members that are in contact with only the edge of the rectangular substrate, the conveyance mechanism such as the conveyance roller contacts both the front and back surfaces of the substrate. The front and back surfaces of the substrate can be uniformly processed at the same time.

  According to the second aspect of the present invention, both the front and back surfaces of the substrate can be simultaneously and uniformly processed by bringing both surfaces of the substrate into contact with the processing liquid stored in the processing tank.

  According to the third aspect of the present invention, both surfaces of the substrate can be simultaneously and uniformly processed by bringing both surfaces of the substrate into contact with the treatment liquid ejected from the treatment liquid ejection nozzle.

It is a side surface schematic diagram of the substrate processing apparatus concerning a 1st embodiment of this invention. 3 is a schematic front view showing an arrangement relationship between a printed circuit board 100 and a guide member 21. FIG. 3 is a schematic plan view showing an arrangement relationship between a printed circuit board 100 and a guide member 21. FIG. 3 is a schematic front view showing an arrangement relationship between a printed circuit board 100 and a guide member 21. FIG. It is a side surface schematic diagram of the substrate processing apparatus concerning a 2nd embodiment of this invention. 3 is a schematic front view showing an arrangement relationship between a printed circuit board 100 and a guide member 21. FIG. It is explanatory drawing which shows the modification of a guide member.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic front view showing the positional relationship between the printed circuit board 100 and the guide member 21. Further, FIG. 3 is a schematic plan view showing the positional relationship between the printed circuit board 100 and the guide member 21. In FIG. 2, illustration of a processing liquid ejection nozzle 31 and a processing liquid ejection nozzle 32 described later is omitted.

  This substrate processing apparatus is for processing both the front and back surfaces of a rectangular printed circuit board 100 carried in and out by a plurality of transport rollers 22 simultaneously with a processing liquid. The processing tank 11 for storing the processing liquid, the recovery tank 12 for the processing liquid, and the storage tank 41 for storing the processing liquid. In addition, the substrate processing apparatus includes a plurality of processing liquid ejection nozzles 31 that supply processing liquid from above the printed circuit board 100 toward the surface of the printed circuit board 100, and from below the printed circuit board 100 toward the back surface of the printed circuit board 100. And a plurality of processing liquid ejection nozzles 32 for supplying the processing liquid.

  The printed circuit board 100 is transported in the processing tank 11 in the horizontal direction while being guided by the plurality of guide members 21 at opposite edges on opposite sides in the direction orthogonal to the transport direction of the printed circuit board 100. As shown in FIG. 2, the guide member 21 includes a first truncated cone-shaped member 21a whose axis is oriented in the vertical direction and whose outer diameter is reduced downward, and whose axial center is oriented in the vertical direction and whose outer diameter is upward. It has the shape which connected the 2nd truncated cone-shaped member 21b which becomes small as it goes. That is, the guide member 21 has a so-called “drum shape”. The guide member 21 abuts only on both edges facing each other in a direction orthogonal to the conveyance direction of the rectangular printed board 100.

  The plurality of guide members 21 rotate in synchronism with each other around an axis oriented in the vertical direction by driving a drive shaft 24 oriented in the vertical direction connected to a motor (not shown). As shown in FIGS. 2 and 3, the printed circuit board 100 is supported while being guided by the edges of both sides thereof by the guide members 21 as the plurality of guide members 21 rotate.

  As shown in FIG. 1, a carry-in port 15 and a carry-out port 16 for the printed circuit board 100 are formed in the processing tank 11, a shutter 13 that opens and closes the carry-in port 15, and a shutter 14 that opens and closes the carry-out port 16. Is arranged. Further, a treatment liquid supply pipe 19 and a treatment liquid discharge pipe 17 are attached to the lower surface of the treatment tank 11. The supply pipe 19 is connected to the storage tank 41 through a pipe line 37 and a pump 38 disposed therein. Moreover, the discharge pipe 17 is connected with the storage tank 41 via the pipe line 42 and the on-off valve 44 arrange | positioned there. Further, each processing liquid jet nozzle 31 is connected to the storage tank 41 via a pipe line 35, a pump 36 and a pipe line 33, and each processing liquid jet nozzle 32 is connected to the pipe line 34, the pump 36 and the pipe line 33. It is connected with the storage tank 41 via.

  The recovery tank 12 is for recovering the processing liquid flowing down from the carry-in port 15 and the carry-out port 16 in the treatment tank 11. A treatment liquid recovery pipe 18 is attached to the lower surface of the recovery tank 12. The recovery pipe 18 is connected to the storage tank 41 via a pipe line 43. In addition, a pair of upper and lower air knives 23 for removing the processing liquid adhering to the printed circuit board 100 is disposed at a position facing the carry-out port 16 of the processing tank 11 and above the recovery tank 12. .

  When the printed circuit board 100 is processed by the substrate processing apparatus, first, the processing liquid is supplied from the storage tank 41 to the processing tank 11, and the processing liquid is stored in the processing tank 11. Prior to the supply of the treatment liquid, the on-off valve 44 is closed and the treatment liquid in the storage tank 41 is sent to the treatment tank 11 via the pipe line 37 by the action of the pump 38, thereby The position is higher than the printed board 100 conveyed by the plurality of guide members 21. In this processing liquid supply step, the carry-in port 15 is closed by the shutter 13, and the carry-out port 16 is closed by the shutter 14.

  When the processing liquid is stored in the processing tank 11, as shown in FIG. 1, the printed circuit board 100 is transported by a plurality of transport rollers 22 and guide members 21, and the printed circuit board 100 is transported into the processing tank 11. The printed circuit board 100 transported into the processing tank 11 is supported and transported by the guide member 21 that contacts only the edge. That is, the guide member 21 rotates according to the conveyance speed of the printed circuit board 100 in a state in which the guide member 21 is in contact with only a pair of edges facing the conveyance direction of the printed circuit board 100. To the horizontal direction.

  In this substrate loading process, the shutter 13 at the loading port 15 is opened. For this reason, the processing liquid in the processing tank 11 flows down to the recovery tank 12 from the carry-in port 15 and is recovered in the storage tank 41 via the pipe line 43. Even in this case, the liquid level of the processing liquid in the processing tank 11 can be maintained constant by maintaining the supply amount of the processing liquid by the pump 38 at a certain level or more.

  When the printed circuit board 100 is completely stored in the processing tank 11, the carry-in port 15 is closed by the shutter 13. Then, the processing liquid is ejected from the processing liquid ejection nozzle 31 and the processing liquid ejection nozzle 32 to both surfaces of the printed circuit board 100 supported by the plurality of guide members 21 by the action of the pump 36, whereby both the front and back surfaces of the printed circuit board 100. Is treated with a treatment solution. When the processing liquid is ejected from the processing liquid ejection nozzles 31 and 32, the printed circuit board 100 is supported by the guide members 21 only at the edges on both sides thereof, thereby preventing unevenness in the printed circuit board 100. Thus, the entire front and back surfaces of the printed circuit board 100 can be processed uniformly.

  When processing the printed circuit board 100, the rotation of the plurality of guide members 21 may be stopped to stop the conveyance of the printed circuit board 100. The plurality of guide members 21 may cause the printed circuit board 100 to move into the processing tank 11. You may make it reciprocate by. During processing of the printed circuit board 100, the liquid level of the processing liquid may be maintained constant by using an overflow pipe (not shown) or the open / close valve 44 is controlled to be opened and closed. The liquid level may be kept constant.

  When the printed circuit board 100 is sufficiently processed, the supply of the processing liquid from the processing liquid ejection nozzle 31 and the processing liquid ejection nozzle 32 is stopped. Then, the shutter 14 of the carry-out port 16 is opened. The treatment liquid that has flowed down from the carry-out port 16 by opening the shutter 14 is received by the collection tank 12 and collected in the storage tank 41 via the conduit 43. Even in this case, the liquid level of the processing liquid in the processing tank 11 can be maintained constant by maintaining the supply amount of the processing liquid by the pump 38 at a certain level or more.

  Then, the printed circuit board 100 is transported in the horizontal direction by the plurality of guide members 21 and is withdrawn from the processing tank 11. Compressed air is jetted from the air knife 23 onto both sides of the printed circuit board 100 that has passed through the carry-out port 16 in the processing tank 11. Thereby, the processing liquid adhering to both surfaces of the printed circuit board 100 is removed and dropped into the collection tank 12. Thereby, it is possible to reduce the amount of the processing liquid taken out to the subsequent processing step.

  As described above, according to the substrate processing apparatus of the first embodiment of the present invention, the printed circuit board 100 is conveyed while being guided by the plurality of guide members 21 that are in contact with only the edge of the rectangular printed circuit board 100. Therefore, both the front and back surfaces of the printed circuit board 100 can be processed simultaneously and uniformly without contacting both the front and back surfaces of the printed circuit board 100.

  The guide member 21 described above has a first truncated cone-shaped member 21a whose axis is oriented in the vertical direction and the outer diameter is reduced downward, and is reduced as the axis is directed in the vertical direction and the outer diameter is directed upward. In the case of processing a plurality of types of printed circuit boards 100 having various dimensions with respect to the size in the width direction, which is a direction orthogonal to the transport direction, since the second truncated cone-shaped member 21b is connected. Such a plurality of types of printed circuit boards 100 can be transported and processed. FIG. 4 is a schematic front view showing the positional relationship between the printed circuit board 100 and the guide member 21 in such a case.

  As shown in FIG. 4, when the size in the width direction of the printed circuit board 100 is smaller than the printed circuit board 100 shown in FIG. 2, the printed circuit board 100 includes the second frustoconical member 21 b constituting the guide member 21. The edge is supported by the inclined surface of the sheet and conveyed. Even in this case, the printed circuit board 100 can be conveyed while being guided by the plurality of guide members 21 contacting only the edge of the rectangular printed circuit board 100, and the printed circuit board 100 can be printed without contacting both the front and back surfaces. It becomes possible to treat the front and back surfaces of the substrate 100 uniformly at the same time.

  Next, another embodiment of the present invention will be described. FIG. 5 is a schematic side view of a substrate processing apparatus according to the second embodiment of the present invention. FIG. 6 is a schematic front view showing the positional relationship between the printed circuit board 100 and the guide member 21. In addition, about the member similar to embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the embodiment described above, the processing liquid is stored in the processing tank 1, and the printed board 100 is immersed in the processing liquid for processing. On the other hand, in the substrate processing apparatus according to the second embodiment, the processing liquid ejection nozzle 31 and the processing liquid ejection nozzle 32 directly apply to the front and back surfaces of the printed circuit board 100 conveyed by the plurality of guide members 21. A configuration is adopted in which the processing liquid is ejected for processing. For this reason, in the substrate processing apparatus according to this embodiment, the supply pipe 19, the pipe line 37, and the pump 38 in the substrate processing apparatus shown in FIG. 1 are omitted. Further, the on-off valve 44 disposed in the pipe line 42 is also omitted.

  When the printed circuit board 100 is processed by the substrate processing apparatus according to the second embodiment, the shutter 13 is opened and the carry-in port 15 is opened. In this state, as shown in FIG. 5, the printed circuit board 100 is transported by the plurality of transport rollers 22 and the guide member 21, and the printed circuit board 100 is transported into the processing tank 11. The printed circuit board 100 transported into the processing tank 11 is supported and transported by the guide member 21 that contacts only the edge.

  When the printed circuit board 100 is completely stored in the processing tank 11, the carry-in port 15 is closed by the shutter 13. Then, the processing liquid is ejected from the processing liquid ejection nozzle 31 and the processing liquid ejection nozzle 32 to both surfaces of the printed circuit board 100 supported by the plurality of guide members 21 by the action of the pump 36, whereby the front and back sides of the printed circuit board 100. Both sides are treated with the treatment liquid.

  Even in this case, since the printed circuit board 100 is supported by the guide members 21 only at the edges on both sides of the printed circuit board 100, the printed circuit board 100 is prevented from being uneven and the entire front and back surfaces of the printed circuit board 100 are uniform. Can be processed. During processing of the printed circuit board 100, the rotation of the plurality of guide members 21 may be stopped to stop the conveyance of the printed circuit board 100, and the printed circuit board 100 is reciprocated in the processing tank 11 by the plurality of guide members 21. You may make it move.

  When the printed circuit board 100 is sufficiently processed, the ejection of the processing liquid from the processing liquid ejection nozzle 31 and the processing liquid ejection nozzle 32 is stopped. Then, the shutter 14 of the carry-out port 16 is opened. Then, the printed circuit board 100 is transported in the horizontal direction by the plurality of guide members 21 and is withdrawn from the processing tank 11. Compressed air is jetted from the air knife 23 onto both sides of the printed circuit board 100 that has passed through the carry-out port 16 in the processing tank 11. Thereby, the processing liquid adhering to both surfaces of the printed circuit board 100 is removed and dropped into the collection tank 12. Thereby, it is possible to reduce the amount of the processing liquid taken out to the subsequent processing step.

  As described above, also in the substrate processing apparatus according to the second embodiment of the present invention, the printed board 100 is conveyed while being guided by the plurality of guide members 21 contacting only the edge of the rectangular printed board 100. The front and back surfaces of the printed circuit board 100 can be processed simultaneously and uniformly without contacting the front and back surfaces of the printed circuit board 100.

  FIG. 7 is an explanatory view showing a modification of the guide member.

  The guide member 21 according to the first and second embodiments described above includes the first truncated cone-shaped member 21a whose axial center is directed in the vertical direction and the outer diameter is decreased downward, and the axial center is directed in the vertical direction, and the outer diameter. The cone surface (side surface) with the second frustoconical member 21b that becomes smaller as it goes upward is a flat surface, and the cross-sectional shape of the cone surface is a straight line. However, the cone surface may be curved as shown in FIG. The truncated cone shape described in this specification is a concept including such a shape.

  Here, in the guide member 51 shown in FIG. 7A, only one recess for supporting and guiding the edges on both sides of the printed circuit board 100 is formed, whereas FIG. In the guide member 61 shown in b), a plurality of recesses having different shapes are formed. According to the guide member 61 shown in FIG. 7B, it is possible to transport the printed circuit boards 100 having different sizes.

  In the above-described embodiment, the case where the printed circuit board 100 is processed with the processing liquid has been described. However, the present invention may be applied to a substrate processing apparatus that processes other rectangular substrates. For example, the present invention can also be applied to a substrate processing apparatus for etching a rectangular glass substrate with an etching solution.

DESCRIPTION OF SYMBOLS 11 Treatment tank 12 Collection tank 13 Shutter 14 Shutter 15 Carry-in port 16 Carry-out port 17 Discharge pipe 19 Supply pipe 21 Guide member 21a 1st truncated cone-shaped member 21b 2nd truncated cone-shaped member 22 Conveyance roller 23 Air knife 24 Drive shaft 31 Processing liquid Jet nozzle 32 Treatment liquid jet nozzle 36 Pump 38 Pump 41 Storage tank 51 Guide member 61 Guide member 100 Printed circuit board

Claims (3)

In the substrate processing apparatus for simultaneously processing both surfaces of the substrate by supplying the processing liquid to both surfaces of the rectangular substrate transported in the horizontal direction by the transport mechanism,
The transport mechanism includes a first truncated cone-shaped member whose axis is oriented in the vertical direction and decreases as the outer diameter decreases downward, and a second truncated cone shape whose axis is in the vertical direction and whose outer diameter increases upward. The substrate is conveyed while being guided by a plurality of guide members having a shape connected to the members and contacting only the edges on both sides facing each other in the direction orthogonal to the conveyance direction of the rectangular substrate. A substrate processing apparatus. The substrate processing apparatus according to claim 1,
A treatment tank for storing the treatment liquid;
The said conveyance mechanism is a substrate processing apparatus which processes both surfaces of the said board | substrate simultaneously by conveying a board | substrate in the processing liquid stored in the said processing tank. The substrate processing apparatus according to claim 1,
A plurality of treatment liquid ejection nozzles for ejecting treatment liquid on both surfaces of the substrate;
The substrate processing apparatus which processes both surfaces of the said board | substrate simultaneously by ejecting a process liquid to the both surfaces of the board | substrate conveyed by the said conveyance mechanism from these process liquid ejection nozzles.

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