JP2013188970A5 - - Google Patents

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Publication number
JP2013188970A5
JP2013188970A5 JP2012057668A JP2012057668A JP2013188970A5 JP 2013188970 A5 JP2013188970 A5 JP 2013188970A5 JP 2012057668 A JP2012057668 A JP 2012057668A JP 2012057668 A JP2012057668 A JP 2012057668A JP 2013188970 A5 JP2013188970 A5 JP 2013188970A5
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JP
Japan
Prior art keywords
silicon substrate
anisotropic etching
production
function
plate according
Prior art date
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Application number
JP2012057668A
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English (en)
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JP2013188970A (ja
JP5725664B2 (ja
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Priority to JP2012057668A priority Critical patent/JP5725664B2/ja
Priority claimed from JP2012057668A external-priority patent/JP5725664B2/ja
Publication of JP2013188970A publication Critical patent/JP2013188970A/ja
Publication of JP2013188970A5 publication Critical patent/JP2013188970A5/ja
Application granted granted Critical
Publication of JP5725664B2 publication Critical patent/JP5725664B2/ja
Expired - Fee Related legal-status Critical Current
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Claims (1)

  1. 前記結晶異方性エッチング工程では、前記第２シリコン基板が前記第１シリコン基板を
    結晶異方性エッチングする際のエッチングストッパとして機能する請求項１から４のいず
    れか１項記載のノズルプレートの製造方法。
JP2012057668A 2012-03-14 2012-03-14 ノズルプレートの製造方法 Expired - Fee Related JP5725664B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012057668A JP5725664B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012057668A JP5725664B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法

Publications (3)

Publication Number Publication Date
JP2013188970A JP2013188970A (ja) 2013-09-26
JP2013188970A5 true JP2013188970A5 (ja) 2014-08-21
JP5725664B2 JP5725664B2 (ja) 2015-05-27

Family

ID=49389743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012057668A Expired - Fee Related JP5725664B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法

Country Status (1)

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JP (1) JP5725664B2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6388389B2 (ja) * 2014-08-29 2018-09-12 キヤノン株式会社 液体吐出ヘッドの製造方法
CN109689373B (zh) * 2016-09-12 2021-10-22 柯尼卡美能达株式会社 液滴排出头和液滴排出装置
JP7028178B2 (ja) * 2016-09-28 2022-03-02 コニカミノルタ株式会社 インクジェットヘッドおよびその製造方法と、インクジェットプリンタ
JP7119943B2 (ja) * 2018-11-26 2022-08-17 コニカミノルタ株式会社 ノズルプレートの製造方法及びインクジェットヘッドの製造方法
EP4316855A4 (en) * 2021-03-31 2024-05-22 Konica Minolta, Inc. NOZZLE PLATE MANUFACTURING PROCESS, NOZZLE PLATE AND LIQUID EJECTION HEAD

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001260355A (ja) * 2000-03-21 2001-09-25 Nec Corp インクジェットヘッドおよびその製造方法
US7347532B2 (en) * 2004-08-05 2008-03-25 Fujifilm Dimatix, Inc. Print head nozzle formation
JP4660683B2 (ja) * 2005-07-28 2011-03-30 セイコーエプソン株式会社 ノズルプレートの製造方法及び液滴吐出ヘッドの製造方法
JP2008114462A (ja) * 2006-11-02 2008-05-22 Seiko Epson Corp ノズル基板の製造方法、液滴吐出ヘッドの製造方法、液滴吐出装置の製造方法、ノズル基板、液滴吐出ヘッド及び液滴吐出装置
US20110020966A1 (en) * 2009-07-23 2011-01-27 Canon Kabushiki Kaisha Method for processing silicon substrate and method for producing substrate for liquid ejecting head
JP2011037053A (ja) * 2009-08-07 2011-02-24 Seiko Epson Corp ノズルプレートの製造方法
KR20120002688A (ko) * 2010-07-01 2012-01-09 삼성전기주식회사 노즐 플레이트 및 그 제조 방법, 그리고 상기 노즐 플레이트를 구비하는 잉크젯 프린터 헤드

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