JP2013185892A - Socket, socket board and electronic component testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket that enables low-cost DUT testing, and realizes pitch narrowing of a conductive portion while securing desired thickness.SOLUTION: A socket 7A comprises: a first insulation member 10A that has multiple first through-holes 11A; and multiple anisotropic conductive members 20A that are inserted into the first through-holes 11A in a detachable manner and electrically connect a solder ball 9 of a DUT 8 with a pad 41 of a wiring board 40. The first through-hole 11A includes: a first aperture 114 that is formed on a first principal surface 12 of the first insulation member 10A; and a second aperture 115 that is formed on a second principal surface 13 closer to the wiring board 40 than the first principal surface 12 in the first insulation member 10A. A width R4 of the first aperture 114 is narrower than a maximum width R2 of the anisotropic conductive member 20A (R4<R2), and a width R5 of the second aperture 115 is equal to or wider than the maximum width R2 of the anisotropic conductive member 20A (R2≤R5).

Description

  The present invention relates to a socket used for testing an electronic component such as a semiconductor integrated circuit element (hereinafter referred to as DUT (Device Under Test)), a socket board including the socket, and an electronic component testing apparatus. .

  In the manufacturing process of the DUT, the performance and function of the DUT are tested using an electronic component testing apparatus. In this electronic component testing apparatus, the DUT is pressed against the socket of the test head, and the DUT terminal and the conductive member of the socket are in electrical contact with each other by an electronic component testing apparatus main body (hereinafter also referred to as a tester). The DUT is tested by inputting / outputting test signals to / from the DUT.

  As a conductive member of such a socket, for example, an anisotropic conductive sheet having conductivity only in the thickness direction is known (see, for example, Patent Document 1).

  Such an anisotropic conductive sheet is manufactured as follows. That is, while forming a polymer material or the like in which conductive particles are densely packed into a sheet shape, a magnetic field is applied in the thickness direction to a plurality of portions imparting conductivity in the sheet, thereby An anisotropic conductive sheet is manufactured by collecting the conductive particles at the plurality of sites.

Japanese Patent Laid-Open No. 7-105741

  However, the use of a socket having such an anisotropic conductive sheet may cause the following adverse effects. In other words, the part where the DUT on the anisotropic conductive sheet is pressed during the test is formed integrally with the other part of the sheet, so the entire anisotropic conductive sheet must be replaced during replacement. This is one cause that hinders the cost reduction of the socket.

  Further, in the socket provided with the anisotropic conductive sheet as described above, it is difficult to reduce the pitch of the conductive portions in the anisotropic conductive sheet while maintaining the sheet thickness. That is, when an anisotropic conductive sheet is used for a socket, the anisotropic conductive sheet is a predetermined sheet in order to apply an appropriate pressing force to the terminal of the DUT or absorb a height error of the terminal. It preferably has a thickness. However, the thicker the sheet, the stronger the magnetic field applied when forming the conductive site. On the other hand, in order to narrow the pitch of the conductive parts in the sheet, a magnetic field must be applied at a narrow pitch. Therefore, if the pitch of the magnetic field is narrowed while ensuring a predetermined sheet thickness, adjacent magnetic fields may interfere with each other, making it difficult to collect conductive particles at a desired site in the sheet.

  The problem to be solved by the present invention is to provide a socket capable of performing a DUT test at a low cost and capable of narrowing a conductive portion while ensuring a desired thickness.

  [1] A socket according to the present invention includes a first insulating member having a plurality of first through holes and a terminal of the electronic component to be tested and a wiring board inserted into the first through hole in a detachable manner. A plurality of anisotropically conductive members that electrically connect the pads, and the first through hole is formed of a first opening formed on a first main surface of the first insulating member. A second opening formed in a second main surface closer to the wiring board than the first main surface in the first insulating member, and the width of the first opening is It is smaller than the maximum width of the anisotropic conductive member, and the width of the second opening is not less than the maximum width of the anisotropic conductive member.

[2] In the above invention, the anisotropic conductive member has a flange portion protruding in a radial direction,
The first through hole may have a step surface between the first opening and the second opening, and the flange portion and the step surface may be in contact with each other.

  [3] In the above invention, the flange portion may have a maximum width of the anisotropic conductive member.

  [4] In the above invention, the anisotropic conductive member has a first small diameter portion having a width equal to or smaller than a width of the first opening, and the first small diameter portion is formed in the first opening. It may be inserted.

  [5] In the above invention, a part of the first small diameter portion may protrude from the first main surface of the first insulating member.

  [6] In the above invention, the anisotropic conductive member has a first tapered shape that tapers toward the terminal of the electronic device under test, and the first through hole is formed by the first through hole. A second taper shape corresponding to the taper shape may be provided, and the first taper shape and the second taper shape may be in contact with each other.

  [7] In the above invention, the end portion close to the wiring board in the first tapered shape may be the maximum width of the anisotropic conductive member.

  [8] In the above invention, the anisotropic conductive member includes a second insulating member having a second through hole having a width relatively smaller than a maximum width of the anisotropic conductive member. A second small diameter portion inserted in the two through holes, and may be sandwiched between the first insulating member and the second insulating member.

  [9] In the above invention, the first through hole has a step surface between the first opening and the second opening, and the anisotropic conductive member is below the step surface. The anisotropic conductive member and the step surface may be in contact with each other.

  [10] A socket board according to the present invention includes the socket according to the present invention and a wiring board having pads arranged so as to correspond to the anisotropic conductive member.

  [11] An electronic component testing apparatus according to the present invention includes a test head having the socket board and a tester to which the test head is electrically connected.

  According to the present invention, a plurality of through holes are provided in a single insulating member, and anisotropic conductive members are inserted into the respective through holes in a detachable state. Therefore, it is possible to replace the individual members individually and to reduce the cost of the socket.

  Further, according to the present invention, the anisotropic conductive member is inserted into the plurality of through holes provided in the single insulating member, so that the thickness of the socket is kept constant, while the conductive portion is kept constant. The distance between the electrodes can be reduced, and the pitch of the electrode under test can be reduced.

FIG. 1 is a schematic cross-sectional view showing the overall configuration of an electronic component testing apparatus in an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the overall structure of the socket in the embodiment of the present invention. FIG. 3 is an exploded cross-sectional view of the socket in the embodiment of the present invention. FIG. 4 is a view showing a first modification of the socket in the embodiment of the present invention. FIG. 5 is a view showing a second modification of the socket in the embodiment of the present invention. FIG. 6 is a view showing a third modification of the socket in the embodiment of the present invention. FIG. 7 is a view showing a fourth modification of the socket in the embodiment of the present invention. FIG. 8 is a cross-sectional view of the socket during the DUT test in the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing the overall configuration of the electronic component testing apparatus in the present embodiment.

  As shown in FIG. 1, an electronic component testing apparatus 1 according to the present embodiment includes a handler 2 for handling a DUT 8 (see FIG. 2), a test head 4 electrically connected to the DUT 8 during a test, and a test head 4, a tester body (main frame) 3 that transmits a test signal to the DUT 8 via the DUT 8 and executes the test of the DUT 8. The electronic component testing apparatus 1 tests the electrical characteristics of the DUT 8 with high temperature or low temperature thermal stress applied to the DUT 8, and classifies the DUT 8 according to the test result.

  As shown in FIG. 1, a high fidelity tester access fixture (HIFIX) 5 that relays an electrical connection between the DUT 8 and the test head 4 is attached to the top of the test head 4. Further, on the upper part of the HiFix 5, a socket board 6 and a socket 7 A fixed to the socket board 6 are provided.

  The socket 7A faces the inside of the handler 2 through the opening 2a formed in the handler 2, and the DUT 8 conveyed in the handler 2 is pressed against the socket 7A, and the DUT 8 is electrically connected to the socket 7A. Is done. In FIG. 1, only two sockets 7A are shown, but in reality, a large number of sockets 7A such as 64 and 128 are provided. As the handler 2, a heat plate type or a chamber type can be used.

  FIG. 2 is a sectional view of the socket 7A in the present embodiment, and FIG. 3 is an exploded sectional view of the socket 7A in the present embodiment.

  As shown in FIG. 2, the socket 7A in this embodiment includes a large number of anisotropic conductive members 20A that are in contact with the solder balls 9 of the DUT 8, a first insulating member 10A that holds the anisotropic conductive members 20A, and And a second insulating member 30A.

  As shown in FIG. 3, the anisotropic conductive member 20 </ b> A includes a first small diameter portion 21 that contacts the solder ball 9 of the DUT 8, a second small diameter portion 23 that contacts the pad 41 on the wiring substrate 40, And a flange portion 22 positioned between the first small diameter portion 21 and the second small diameter portion 23.

  The first small diameter portion 21 has a cylindrical shape with an outer diameter R1, and the second small diameter portion 23 has a cylindrical shape with an outer diameter R3. On the other hand, the flange portion 22 has a disk shape, and the anisotropic conductive member 20 </ b> A has a maximum outer diameter R <b> 2 at the flange portion 22. The two small diameter portions 21 and 23 and the flange portion 22 are arranged coaxially, and the outer diameter R2 of the flange portion 22 is larger than the outer diameters R1 and R3 of the two small diameter portions 21 and 23 (R2 > R1, R2> R3). Therefore, the anisotropic conductive member 20 </ b> A has a shape protruding in the radial direction at the flange portion 22. The “outer diameter” in the present embodiment corresponds to an example of “width” in the present invention.

  Although this anisotropic conductive member 20A is not particularly illustrated, the anisotropically conductive member 20A is insulated by disposing a particle dispersed portion in which conductive particles are locally dispersed in an insulator and a periphery of the particle dispersed portion. And an insulating part composed only of the body. When the particle-dispersed portion is compressed in the thickness direction, conductive particles adjacent to each other in the thickness direction come into contact with each other, so that conduction can be achieved only in the thickness direction.

  In the present embodiment, the anisotropic conductive member 20 </ b> A is compressed by the solder balls 9 of the DUT 8, whereby the solder balls 9 of the DUT 8 and the pads 41 on the wiring board 40 are electrically connected.

  Examples of the conductive particles constituting the particle dispersion portion include iron, copper, zinc, chromium, nickel, silver, aluminum, or alloys thereof. Moreover, as an insulator which comprises a particle | grain dispersion | distribution part and an insulation part, the insulating material which has elasticity, such as silicon rubber, urethane rubber, natural rubber, can be mentioned, for example. Note that the conductive particles of the anisotropic conductive member 12A may be uniformly dispersed in the insulator. As an anisotropic conductive member having these characteristics, for example, PCR (registered trademark) manufactured by JSR Corporation can be exemplified.

  The anisotropic conductive member 20A has a structure in which, for example, a bundle of conductive fibers such as metal fibers and carbon fibers is held in an insulating material having elasticity such as silicon rubber, urethane rubber, and natural rubber. You may have.

  The anisotropic conductive member 20A preferably protrudes upward from the first main surface of the first insulating member 10A. As a result, the electrical conductivity of the anisotropic conductive member 20 </ b> A due to the pressing of the solder ball 9 is improved. The length of the anisotropic conductive member 20 </ b> A in the height direction is appropriately set based on the pressing force of the solder balls 9 and the like.

  The contact portion between the anisotropic conductive member 20A and the solder ball 9 on the DUT 8, and the contact portion between the anisotropic conductive member 20A and the pad 41 on the wiring substrate 40 may be in contact with each other at a plurality of contacts. As the tip shape of the anisotropic conductive member 20A that realizes such a plurality of contacts, for example, a shape having a plurality of cusps, a shape having a plurality of hemispherical protrusions, or a shape having a plurality of hemispherical recesses Etc.

  The first insulating member 10A is a flat plate member having a first main surface 12 and a second main surface 13, and is made of a resin material or the like having electrical insulation. The first insulating member 10A has a plurality of first through holes 11A penetrating in the thickness direction. The number and arrangement of the first through holes 11A are set in accordance with the number and arrangement of the solder balls 9 included in the DUT 8, and the anisotropic conductive member 20A with respect to each first through hole 11A. Are inserted one by one.

  The first through hole 11A has an upper portion 111 and a lower portion 112 having different inner diameters. The upper part 111 of the first through hole 11A has a cylindrical shape with an inner diameter R4, and has a first opening 114 that opens at the first main surface 12 of the first insulating member 10A. On the other hand, the lower portion 112 has a columnar shape with an inner diameter R5 and has a second opening 115 that opens at the second main surface 13 of the first insulating member 10A.

  The inner diameter R5 of the lower part 112 of the first through-hole 11A is larger than the inner diameter R4 of the upper part 11 1 (R4 <R5), so that the first through-hole 11A is located between the upper part 111 and the lower part 112. Has a stepped surface 113. The “inner diameter” in the present embodiment corresponds to an example of “width” in the present invention.

  In the present embodiment, the outer diameter R1 of the first small diameter portion 21 of the anisotropic conductive member 20A is smaller than the inner diameter R4 of the upper portion 111 of the first through hole 11A in the first insulating member 10A ( R1 <R4).

  In the present embodiment, the outer diameter R2 of the flange portion 22 of the anisotropic conductive member 20A is larger than the inner diameter R4 of the upper portion 111 in the first through hole 11A of the first insulating member 10A and the lower portion 112. The inner diameter is less than R5 (R4 <R2 <R5).

  Therefore, the first small diameter portion 21 of the anisotropic conductive member 20A is inserted into the upper portion 111 of the first through hole 11A without any particular load, and the flange portion 22 of the anisotropic conductive member 20A is connected to the first through hole. It is inserted into the lower portion 112 of 11A without any particular load. Then, when the flange portion 22 of the anisotropic conductive member 20A comes into contact with the step surface 113, the anisotropic conductive member 20A is locked in the first through hole 11A.

  Note that the outer diameter R1 of the first small diameter portion 21 of the anisotropic conductive member 20A and the inner diameter R4 of the upper portion 111 of the first through hole 11A may be approximately the same (R1 = R4). Alternatively, the outer diameter R2 of the flange portion 22 of the anisotropic conductive member 20A and the inner diameter R5 of the lower portion 112 of the first through hole may be approximately the same (R2 = R5). In this case, the anisotropic conductive member 20A is difficult to come off from the first insulating member 10A.

  When the anisotropic conductive member 20A is inserted into the first through hole 11A from the second main surface 13 side of the first insulating member 10A, the anisotropic conductive member 20A and the first through hole 11A are engaged. If there is a relationship to be stopped, the shapes of the anisotropic conductive member 20A and the first through-hole 11A are not particularly limited to the above shapes.

  For example, the shape of the first small diameter portion 21 of the anisotropic conductive member 20A may be a polygonal column shape, a frustum shape, or the like, and the flange portion 22 is a rectangular plate shape, a polygonal plate shape, or a frustum shape. Alternatively, a tapered shape or the like may be used. Note that the shape of the first through hole 11A in the first insulating member 10A is preferably a shape corresponding to the first small diameter portion 21 and the flange portion 22.

  On the other hand, the second insulating member 30A is also made of a resin material having electrical insulation. The second insulating member 30A is a flat plate member having the third main surface 32 on the upper side and the fourth main surface 33 on the lower side, and is a second through-hole penetrating in the thickness direction. A plurality of 31 are provided. The number and arrangement of the second through holes 31 included in the second insulating member 30A are set according to the number and arrangement of the anisotropic conductive members 20A (that is, the number and arrangement of the pads 41 on the wiring board 40). The second small diameter portion 23 of the anisotropic conductive member 20 </ b> A is inserted into each second through hole 31 one by one.

  The second through hole 31 has a cylindrical shape with an inner diameter R6. The inner diameter R6 is larger than the outer diameter R3 of the second small diameter portion 23 of the anisotropic conductive member 20A and smaller than the outer diameter R2 of the flange portion 22 of the anisotropic conductive member 20A (R3 <R6 < R2).

  Therefore, the second small-diameter portion 23 of the anisotropic conductive member 20A is not required to load the second through-hole 31 in the second insulating member 30A from the third main surface 32 side. Inserted. The second insulating member 30A is arranged in a state where the third main surface 32 of the second insulating member 30A and the second main surface 13 of the first insulating member 10A face each other. .

  The outer diameter R3 of the second small diameter portion 23 of the anisotropic conductive member 20A may be approximately the same as the inner diameter R6 of the second through hole 31 (R3 = R6). At this time, the anisotropic conductive member 20A is held more stably during the test.

  The shape of the second small diameter portion 23 in the anisotropic conductive member 20A may be another shape as long as it does not hinder the insertion of the second insulating member 30A into the second through hole 31.

  For example, the shape of the second small diameter portion 23 in the anisotropic conductive member 20 </ b> A may be a polygonal column shape, a truncated cone shape, a tapered shape, or the like. In addition, it is preferable that the 2nd through-hole 31 in 30 A of 2nd insulating members is a shape corresponding to the shape of these 2nd small diameter parts 23. FIG.

  The socket 7A in this embodiment is assembled as follows.

  That is, the first small diameter portion 21 of the anisotropic conductive member 20A is inserted into the upper portion 111 of the first through hole 11A of the first insulating member 10A, and the flange portion 22 of the anisotropic conductive member 20A is The first insulating member 10A is inserted into the lower portion 112 of the first through hole 11A. Further, the second insulating member 10A and the second insulating member 10A are inserted into the second through hole 31 of the second insulating member 30A, and the second insulating member 10A and the second insulating member 10A are in contact with the second insulating member 10A. The member 30A is fixed with, for example, screws.

  As shown in FIG. 2, the socket board 6 in the present embodiment includes the socket 7A described above and a wiring board 40 on which the socket 7A is implemented. The socket board 6 is assembled as follows. That is, the second small diameter portion 23 of the anisotropic conductive member 20A and the pad 41 on the wiring substrate 40 in a state where the fourth main surface 33 of the second insulating member 30A and the wiring substrate 40 face each other. The socket 7A is fixed on the wiring board 40 through the guide 50 using, for example, screws.

  Note that the structure of the socket is not particularly limited to the above.

  For example, FIGS. 4-7 is a figure which shows the modification of the socket in embodiment of this invention.

  As shown in FIG. 4, the socket 7B of the first modified example in the present embodiment is such that the second small diameter portion 23 of the anisotropic conductive member 20A and the second insulating member 30A are omitted. This is different from the socket 7A described above. In this case, the anisotropic conductive member 20 </ b> B is directly placed on the pad 41 on the wiring substrate 40. The configuration of the anisotropic conductive member 20B is the same as the configuration of the anisotropic conductive member 20A described above except for the second small diameter portion 23.

  Further, as shown in FIG. 5, the socket 7C of the second modified example of the socket 7A in the present embodiment is such that the entire anisotropic conductive member 20C is in the first through hole 11C of the first insulating member 10C. Is located.

  The anisotropic conductive member 20 </ b> C has a columnar shape with an outer diameter R <b> 8, and the first insulating member 10 </ b> C is a flat plate member having a first main surface 12 and a second main surface 13. The first insulating member 10C has a plurality of first through holes 11C penetrating in the thickness direction. The number and arrangement of the first through holes 11C are set in accordance with the number and arrangement of the solder balls 9 included in the DUT 8, and the anisotropic conductive member 20C with respect to each first through hole 11C. Are inserted one by one.

  The first through-hole 11C has a cylindrical shape with an inner diameter R7, and has a protruding portion 116 that protrudes toward the inside of the first through-hole 11C at the top thereof. Due to the protruding portion 116, the inner diameter of the upper portion of the first through hole 11C is R9. The outer diameter R8 of the anisotropic conductive member 20C is larger than the inner diameter R9 and smaller than the inner diameter R7 (R9 <R8 <R7). For this reason, when the anisotropic conductive member 20C is inserted into the first through-hole 11C from the second main surface 13 side of the first insulating member 10C, the projecting portion in the first through-hole 11C. 116 contacts and locks.

  At this time, R7 may be approximately the same as R8 (R7 = R8). Thereby, the anisotropic conductive member 20C is held more stably during the test.

  Also in the second modified example, the anisotropic conductive member 20 </ b> C is directly placed on the pad 41 on the wiring substrate 40. In this example, the anisotropic conductive member 20C can be formed relatively easily, and the test cost can be further reduced.

  Further, as shown in FIG. 6, the socket 7 </ b> D of the third modified example in the present embodiment has a first tapered surface 24 in which the shape of the anisotropic conductive member 20 </ b> D is tapered upward, The shape of the through hole 11 </ b> D is different from the above-described socket 10 </ b> A in that it has a second tapered surface 117 corresponding to the first tapered surface 24.

  Since the anisotropic conductive member 20D has the first tapered surface 24, when removing the anisotropic conductive member 20D, the anisotropic conductive member 20D is bent and the fragments are in the first through hole 11D. The fear of remaining is reduced. Moreover, it becomes easy to set the anisotropic conductive member 20D used after replacement to the first through hole 11D, and the handleability at the time of replacement of the anisotropic conductive member 20D is improved.

  In addition, as shown in FIG. 7, the socket 7 </ b> E according to the fourth modification example of the present embodiment has the second insulating portion having the second small diameter portion 23 of the anisotropic conductive member 20 </ b> E and the second through hole 31. It differs from the socket 7D of the third modified example in that a member 30E is added. The first insulating member 10E has the same configuration as the above-described first insulating member 10D. The second insulating member 30E has the same configuration as the above-described second insulating member 30A.

  By having such a structure, when the anisotropic conductive member 20E is replaced, it becomes easier to capture the anisotropic conductive member 20E with tweezers and the like, and the handleability when replacing the anisotropic conductive member 20E is further improved. To do. In addition, energization stability is improved.

  Next, the operation of the socket 7A during the test will be described with reference to FIG.

  When the socket 7A is mounted on the socket board 6, as shown in FIG. 8, the flange portion 22 is sandwiched between the first insulating member 10A and the second insulating member 30A. The conductive member 20 </ b> A is disposed in contact with the pad 41. In this state, when the anisotropic conductive member 20A is pressed by the solder balls 9 of the DUT 8, the conductive particles in the anisotropic conductive member 20A come into contact with each other, and the anisotropic conductive member 20A conducts in the height direction. Be sexual. As a result, the solder balls 9 of the DUT 8 and the pads 41 on the wiring board 40 are electrically connected, and the test of the DUT 8 is executed.

  Then, when the energization stability of the anisotropic conductive member 20A deteriorates due to the adhesion of solder to the anisotropic conductive member 20A due to the repetition of the test, the anisotropic conductive member 20A is replaced by the following procedure. That is, first, the socket 7A is removed from the wiring board 40, and then the first insulating member 10A and the second insulating member 30A are removed. Thereafter, the anisotropic conductive member 20A to be replaced is lifted from the first through hole 11A with tweezers or the like, for example, and the anisotropic conductive member 20A is removed from the first insulating member 10A. At this time, the other anisotropic conductive member 20A is left as it is in the first insulating member 10A without being replaced.

  Note that the anisotropic conductive member 20A may be removed from the first insulating member 10A by protruding the anisotropic conductive member 10A from the first through hole 11A using the tip of the needle or the like. Further, when the anisotropic conductive member 20A to be replaced remains in the second through hole 31 when the first insulating member 10A and the second insulating member 30A are removed, the second through hole The same operation is performed for the hole 31.

  Next, the first small diameter portion 21 of the new anisotropic conductive member 20A is inserted into the first through hole 11A using, for example, tweezers, and the second small diameter portion 23 of the anisotropic conductive member 20A is inserted. Is inserted into the second through hole 31, and in this state, the first insulating member 10A and the second insulating member 30A are fixed with, for example, screws.

Thereafter, the second small diameter portion 23 of the anisotropic conductive member 20 </ b> A and the pad 41 on the wiring substrate 40 are arranged on the wiring substrate 40 so as to face each other, and a screw or the like is placed on the wiring substrate 40 through the guide 50. The anisotropic conductive member 20A is exchanged by fixing using

  Conventionally, when the energization stability deteriorated, the entire anisotropic conductive sheet had to be replaced. However, in the present embodiment, as described above, the anisotropic conductive member 20A having deteriorated energization stability is individually provided. Can be replaced. For this reason, it is possible to significantly reduce the cost of the DUT test, and furthermore, it is possible to reduce waste by minimizing the number of replacement members.

  In addition, since the conductive portion and the insulating portion of the socket 7A are formed separately, the anisotropic conductive member 20A can ensure a predetermined height even when the pitch between the solder balls 9 of the DUT 8 is further narrowed. Therefore, it is possible to perform a test without short-circuiting adjacent anisotropic conductive members 20A while obtaining good current-carrying stability.

  In the present embodiment, since the flange portion 22 of the anisotropic conductive member 20A has a structure that engages with the step surface 113 of the first through hole 11A, the anisotropic conductive member 20A is the first in the test. Is stably held in the through hole 11A.

  Further, as shown in FIG. 4 in the present embodiment, the socket 7A includes the second insulating member 30A provided with the second through-hole 31, so that the anisotropic conductive member 20A becomes more stable. Retained.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 2 ... Handler 3 ... Tester body 4 ... Test head 6 ... Socket board 40 ... Wiring board 41 ... Pad 7A, 7B, 7C, 7D, 7E: Socket 10A, 10B, 10C, 10D, 10E ... First insulating member 11A, 11B, 11C, 11D, 11E ... First through hole 113 ... Stepped surface 114 ... 1st opening 115 ... 2nd opening 116 ... Protrusion 117 ... 2nd taper shape 12 ... 1st main surface 13 ... 2nd main surface 20A, 20B, 20C , 20D, 20E ... anisotropic conductive member 21 ... first small diameter portion 22 ... flange portion 23 ... second small diameter portion 24 ... second taper surface 30A, 30E. Second insulating member 31 ... second through hole 32 - the third major surface 33 ... fourth of the main surface 8 ··· DUT
9 ... Solder ball (terminal)

Claims (11)

A first insulating member having a plurality of first through holes;
A plurality of anisotropically conductive members that are detachably inserted into the first through holes and electrically connect the terminals of the electronic device under test and the pads of the wiring board,
The first through hole is
A first opening formed in a first main surface of the first insulating member;
A second opening formed in a second main surface closer to the wiring board than the first main surface in the first insulating member,
The width of the first opening is smaller than the maximum width of the anisotropic conductive member,
The socket characterized in that the width of the second opening is not less than the maximum width of the anisotropic conductive member. The socket according to claim 1, wherein
The anisotropic conductive member has a flange portion protruding in a radial direction,
The first through hole has a step surface between the first opening and the second opening,
The socket, wherein the flange portion and the stepped surface are in contact with each other. The socket according to claim 2,
The socket, wherein the flange portion has a maximum width of the anisotropic conductive member. The socket according to any one of claims 1 to 3,
The anisotropic conductive member has a first small diameter portion having a width equal to or less than the width of the first opening,
The socket, wherein the first small diameter portion is inserted into the first opening. The socket according to claim 4,
A part of said 1st small diameter part protrudes from said 1st main surface of said 1st insulating member, The socket characterized by the above-mentioned. The socket according to any one of claims 1 to 5,
The anisotropic conductive member has a first tapered shape that tapers toward the terminal of the electronic device under test,
The first through hole has a second taper shape corresponding to the first taper shape,
The socket, wherein the first tapered shape and the second tapered shape are in contact with each other. The socket according to claim 6,
In the first taper shape, the end close to the wiring board is the maximum width of the anisotropic conductive member. The socket according to any one of claims 1 to 7,
A second insulating member having a second through hole having a width relatively smaller than the maximum width of the anisotropic conductive member;
The anisotropic conductive member has a second small diameter portion inserted into the second through hole,
The socket, wherein the anisotropic conductive member is sandwiched between the first insulating member and the second insulating member. The socket according to claim 1,
The first through hole has a step surface between the first opening and the second opening,
The anisotropic conductive member is located below the step surface,
The socket, wherein the anisotropic conductive member and the stepped surface are in contact with each other. A socket according to any of claims 1 to 9,
And a wiring board having a pad disposed so as to correspond to the anisotropic conductive member. A test head comprising the socket board according to claim 10;
An electronic component testing apparatus comprising: a tester to which the test head is electrically connected.

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