JP2013183540A - Inverter device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a floating inductance of a current path where a switching surge voltage is generated.SOLUTION: An inverter device comprises: a first IGBT; a first diode; a second IGBT; a second diode; a first conductor part connected with a collector electrode side of the first IGBT and a cathode electrode side of the first diode via a solder material; a second conductor part connected with an emitter electrode side of the second IGBT and an anode electrode side of the second diode via a solder material, and arranged so as to be adjacent to the first conductor part; and a relay conductor part connecting between the first conductor part and the second conductor part. The first IGBT, the first diode, the second IGBT, and the second diode are arranged so that the respective center parts form apexes of a substantially quadrangular shape. The first IGBT and the second IGBT form apexes on one diagonal of the substantially quadrangular shape. The relay conductor part is formed inside the quadrangular shape.

Description

  The present invention relates to a mounting structure of an inverter device, and more particularly to a mounting structure of an inverter device applied to a power conversion device used in a vehicle.

  Power semiconductor switching elements and diodes are required to reduce switching loss by increasing the switching speed in order to improve the power conversion efficiency of the inverter and simplify the cooling structure. At the time of switching, the switching surge voltage generated by the product of the current change rate di / dt and the wiring stray inductance needs to be equal to or lower than a predetermined voltage determined by the breakdown voltage of the power semiconductor switching element and the diode. Requires a configuration with small wiring stray inductance.

  As an example of this configuration, a configuration in which a positive electrode bus bar for supplying DC power and a negative electrode bus bar are laminated is considered, and according to this configuration, a magnetic flux generated by a current flowing through the positive electrode bus bar and the negative electrode bus bar is considered. As a result, the stray inductance is reduced (eg, Patent Document 1).

  Conventionally, the power semiconductor switching element, the bus bar in the vicinity of the diode, and the wire bonding wiring have difficulty in adopting a laminate structure due to structural limitations, and reduction of stray inductance has not been sufficiently considered.

JP 2006-156476 A

  An object of the present invention is to reduce stray inductance in a current path in which a switching surge voltage is generated.

  In order to solve the above problems, an inverter device according to the present invention includes a first IGBT constituting an upper arm circuit of an inverter circuit, and constituting the upper arm circuit of the inverter circuit and being electrically connected in parallel to the first IGBT. A second diode that constitutes a lower arm circuit of the inverter circuit, a second diode that constitutes the lower arm circuit of the inverter circuit and is electrically connected in parallel to the second IGBT, A first conductor connected to a collector electrode side of the first IGBT and a cathode electrode side of the first diode via a solder material; an emitter electrode side of the second IGBT; an anode electrode side of the second diode; and a solder material A second conductor portion connected to the first conductor portion and adjacent to the first conductor portion, and the first conductor A relay conductor portion connecting the first conductor portion and the second conductor portion, and when the arrangement direction of the first conductor portion and the second conductor portion is defined as a first row, the first IGBT and the second conductor portion The diodes are arranged along the first row, and the first IGBT is arranged along the first row so as to overlap the second diode, and the second IGBT and the first diode are arranged in the first row. Arranged along a second row parallel to the row, and the second IGBT is arranged so as to overlap the first diode along the second row, and the relay conductor portion includes the first row and the first row. Arranged between two rows. As a result, the current path length in which the switching surge voltage is generated can be shortened, and the stray inductance can be reduced.

  In order to solve the above-described problem, an inverter device according to the present invention includes a first IGBT that constitutes an upper arm circuit of an inverter circuit, and an upper arm circuit of the inverter circuit that is electrically parallel to the first IGBT. A first diode connected, a second IGBT constituting a lower arm circuit of the inverter circuit, a second diode constituting the lower arm circuit of the inverter circuit and electrically connected in parallel with the second IGBT; A first conductor portion connected to a collector electrode side of the first IGBT and a cathode electrode side of the first diode via a solder material; an emitter electrode side of the second IGBT; an anode electrode side of the second diode; and a solder A second conductor portion connected via a material and disposed adjacent to the first conductor portion; A relay conductor portion that connects the conductor portion and the second conductor portion, and each of the first IGBT, the first diode, the second IGBT, and the second diode has a substantially rectangular vertex at the center. The first IGBT and the second IGBT form a vertex on one diagonal line of the substantially quadrangular shape, and the relay conductor portion is formed inside the quadrangular shape. As a result, the current path length in which the switching surge voltage is generated can be shortened, and the stray inductance can be reduced.

  Furthermore, in order to solve the above problem, an inverter device according to the present invention includes a third conductor portion connected to the first conductor portion, and a fourth conductor portion connected to the second conductor portion, The third conductor portion is formed in a direction away from the first IGBT, and the fourth conductor portion is formed along a direction in which the third conductor portion is formed and is disposed at a position adjacent to the third conductor portion. The As a result, the third conductor portion and the fourth conductor portion are arranged at adjacent positions, so that the magnetic flux canceling action works and the inductance can be reduced.

  Furthermore, in order to solve the above-described problems, in the inverter device according to the present invention, the fourth conductor portion is connected to the second conductor portion by wire bonding, and a part of the fourth conductor portion is the first conductor. Disposed between the first conductor portion and the second conductor portion.

  In order to solve the above-described problem, an inverter device according to the present invention includes a first connection conductor plate formed so as to face an emitter electrode of the first IGBT and an anode electrode of the first diode, and One connection conductor is formed integrally with the relay conductor portion.

  In order to solve the above-described problems, an inverter device according to the present invention includes a first connection conductor plate formed to face an emitter electrode of the first IGBT and an anode electrode of the first diode, and an emitter of the second IGBT. An electrode and a second connection conductor plate formed to face the anode electrode of the second diode, wherein the first connection conductor is formed integrally with the relay conductor portion, and the second connection conductor plate Is formed integrally with the fourth conductor portion.

  According to the present invention, stray inductance in the inverter device can be reduced.

It is a figure which shows the control block of a hybrid electric vehicle. It is explanatory drawing of the electric circuit structure of the inverter apparatus 140 and the inverter apparatus 142. FIG. It is the perspective view which decomposed | disassembled the whole structure of the power converter device which concerns on embodiment of this invention into each component. FIG. 5 is a layout diagram of the first IGBT 101, the second IGBT 102, the first diode 156, and the second diode 157 according to the present embodiment. This is a path on the circuit where a current change rate di / dt that occurs when the first IGBT 101 according to the present embodiment is switched is generated. This is a path on the layout where a current change rate di / dt that occurs when the first IGBT 101 according to the present embodiment is switched is generated. This is a path on the circuit where a current change rate di / dt generated when the second IGBT 102 according to the present embodiment is switched is generated. This is a path on the layout where the current change rate di / dt that occurs when the second IGBT 102 according to the present embodiment is switched is generated. FIG. 10 is a layout diagram of a first IGBT 101, a second IGBT 102, a first diode 156, and a second diode 157 according to another embodiment.

  The best mode will be described below with reference to the drawings.

  A power converter according to an embodiment of the present invention will be described below in detail with reference to the drawings. The power conversion device according to the embodiment of the present invention can be applied to a hybrid vehicle or a pure electric vehicle. As a representative example, the power conversion device according to the embodiment of the present invention is applied to a hybrid vehicle. The control configuration and the circuit configuration of the power converter will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing a control block of a hybrid vehicle.

  The power conversion device according to the embodiment of the present invention is used in a vehicle-mounted power conversion device for a vehicle-mounted electrical system mounted on an automobile, in particular, a vehicle drive electrical system, and has a very severe mounting environment and operational environment. The inverter device will be described as an example. A vehicle drive inverter device is provided in a vehicle drive electrical system as a control device for controlling the drive of a vehicle drive motor, and a DC power supplied from an onboard battery or an onboard power generator constituting an onboard power source is a predetermined AC power. Then, the AC power obtained is supplied to the vehicle drive motor to control the drive of the vehicle drive motor. Further, since the vehicle drive motor also has a function as a generator, the vehicle drive inverter device also has a function of converting the AC power generated by the vehicle drive motor into DC power according to the operation mode. Yes. The converted DC power is supplied to the on-vehicle battery.

  The configuration of the present embodiment is optimal as a power conversion device for driving a vehicle such as an automobile or a truck. However, other power conversion devices such as a power conversion device such as a train, a ship, and an aircraft, and a factory facility are also included. Applicable to industrial power converters used as drive motor control devices, or household power conversion devices used in home solar power generation systems and motor control devices that drive household appliances It is.

  In FIG. 1, a hybrid electric vehicle (hereinafter referred to as “HEV”) 110 is one electric vehicle and includes two vehicle drive systems. One of them is an engine system that uses an engine 120 that is an internal combustion engine as a power source. The engine system is mainly used as a drive source for HEV. The other is an in-vehicle electric system using motor generators 192 and 194 as a power source. The in-vehicle electric system is mainly used as an HEV drive source and an HEV power generation source. The motor generators 192 and 194 are, for example, synchronous machines or induction machines, and operate as both a motor and a generator depending on the operation method.

  A front wheel axle 114 is rotatably supported at the front portion of the vehicle body. A pair of front wheels 112 are provided at both ends of the front wheel axle 114. A rear wheel axle (not shown) is rotatably supported on the rear portion of the vehicle body. A pair of rear wheels are provided at both ends of the rear wheel axle. The HEV of this embodiment employs a so-called front wheel drive system in which the main wheel driven by power is the front wheel 112 and the driven wheel to be driven is the rear wheel. You may adopt.

  A front wheel side differential gear (hereinafter referred to as “front wheel side DEF”) 116 is provided at the center of the front wheel axle 114. The front wheel axle 114 is mechanically connected to the output side of the front wheel side DEF 116. The output shaft of the transmission 118 is mechanically connected to the input side of the front wheel side DEF 116. The front wheel side DEF 116 is a differential power distribution mechanism that distributes the rotational driving force that is shifted and transmitted by the transmission 118 to the left and right front wheel axles 114. The output side of the motor generator 192 is mechanically connected to the input side of the transmission 118. The output side of the engine 120 and the output side of the motor generator 194 are mechanically connected to the input side of the motor generator 192 via the power distribution mechanism 122. Motor generators 192 and 194 and power distribution mechanism 122 are housed inside the casing of transmission 118.

  The motor generators 192 and 194 are synchronous machines having permanent magnets on the rotor, and the AC power supplied to the armature windings of the stator is controlled by the inverter device 142 to drive the motor generators 192 and 194. Is controlled. A battery 136 is electrically connected to the inverter device 142, and power can be exchanged between the battery 136 and the inverter device 142.

  In the present embodiment, the first motor generator unit including the motor generator 192 and the inverter device 142 and the second motor generator unit including the motor generator 194 and the inverter device 142 are provided, and they are selectively used according to the operating state. ing. That is, in the case where the vehicle is driven by the power from the engine 120, when assisting the driving torque of the vehicle, the second motor generator unit is operated as the power generation unit by the power of the engine 120 to generate power. The first electric power generation unit is operated as an electric unit by the obtained electric power. Further, in the same case, when assisting the vehicle speed of the vehicle, the first motor generator unit is operated by the power of the engine 120 as a power generation unit to generate power, and the second motor generator unit is generated by the electric power obtained by the power generation. Operate as an electric unit.

  In the present embodiment, the vehicle can be driven only by the power of the motor generator 192 by operating the first motor generator unit as an electric unit by the electric power of the battery 136. Furthermore, in the present embodiment, the battery 136 can be charged by generating power by operating the first motor generator unit or the second motor generator unit as the power generation unit by the power of the engine 120 or the power from the wheels.

  The inverter device 142, the inverter device 43, and the capacitor module 500 are in a close electrical relationship. Furthermore, there is a common point that measures against heat generation are necessary. It is also desired to make the volume of the device as small as possible. The power conversion device 1 includes an inverter device 142 and a capacitor module 500 in the casing of the power conversion device 1. With this configuration, a small and highly reliable device can be realized.

  Further, by incorporating the inverter device 142 and the capacitor module 500 in one housing, it is effective for simplification of wiring and noise countermeasures. In addition, the inductance of the connection circuit between the capacitor module 500, the inverter device 142, and the inverter device 43 can be reduced, the spike voltage can be reduced, heat generation can be reduced, and heat dissipation efficiency can be improved.

  Next, the electric circuit configuration of the inverter device 142 will be described with reference to FIG. In the embodiment shown in FIGS. 1 and 2, the case where the inverter devices 142 are individually configured will be described as an example. Since the inverter device 142 has the same structure and performs the same function and has the same function, the inverter device 142 will be described here as a representative example.

  The power conversion device 1 according to this embodiment includes an inverter device 140 and a capacitor module 500, and the inverter device 140 includes an inverter device 140 and a control unit 170. The inverter device 140 includes a plurality of upper and lower arm series circuits 150 including a first IGBT 101 (insulated gate bipolar transistor) and a first diode 156 that operate as an upper arm, and a second IGBT 102 and a second diode 157 that operate as a lower arm. And it is the structure connected with the alternating current power line (alternating current bus bar) to the motor generator 192 through the alternating current terminal from the middle point part of each upper and lower arm series circuit. In addition, the control unit 170 includes a driver circuit 174 that drives and controls the inverter circuit, and a control circuit 172 that supplies a control signal to the driver circuit 174 via the signal line 176.

  The first arm 101 of the upper arm 101 and the second IGBT 102 of the lower arm are switching power semiconductor elements that operate in response to the drive signal output from the control unit 170 and convert the DC power supplied from the battery 136 into three-phase AC power. To do. The converted electric power is supplied to the armature winding of the motor generator 192.

  The inverter device 140 is configured by a three-phase bridge circuit, and the upper and lower arm series circuits for three phases are respectively connected between the positive DC terminal and the negative DC terminal that are electrically connected to the positive electrode side and the negative electrode side of the battery 136. Are electrically connected in parallel.

  In the present embodiment, the use of IGBT as the switching power semiconductor element is exemplified. A first diode 156 is electrically connected between the collector electrode and the emitter electrode of the upper arm first IGBT 101 as shown. A second diode 157 is electrically connected between the collector electrode and the emitter electrode of the lower arm second IGBT 102 as shown. The first diode 156 and the second diode 157 have two electrodes, a cathode electrode and an anode electrode, and the first diode 156 has a forward direction from the emitter electrode of the first IGBT 101 toward the collector electrode, The cathode electrode is electrically connected to the collector electrode of the first IGBT 101, and the anode electrode is electrically connected to the emitter electrode of the first IGBT 101.

  In the second diode 157, the cathode electrode is electrically connected to the collector electrode of the second IGBT 102 and the anode electrode is electrically connected to the emitter electrode of the second IGBT 102 so that the direction from the emitter electrode of the second IGBT 102 to the collector electrode is the forward direction. ing. As the switching power semiconductor element, a MOSFET (metal oxide semiconductor field effect transistor) may be used. In this case, the first diode 156 and the second diode 157 are unnecessary.

  The upper and lower arm series circuits are provided for three phases corresponding to each phase winding of the armature winding of the motor generator 192. Each of the three upper and lower arm series circuits 150 forms a U phase, a V phase, and a W phase to the motor generator 192 via an intermediate electrode and an AC terminal that connect the emitter electrode of the first IGBT 101 and the collector electrode of the second IGBT 102, respectively. . The upper and lower arm series circuits are electrically connected in parallel.

  The collector electrode of the first IGBT 101 of the upper arm is connected to the positive capacitor electrode of the capacitor module 500 via the positive terminal (P terminal), and the emitter electrode of the second IGBT 102 of the lower arm is connected to the capacitor module 500 via the negative terminal (N terminal). Each is electrically connected to the negative electrode capacitor electrode (connected by a DC bus bar). The intermediate electrode corresponding to the middle point of each arm (the connection portion between the emitter electrode of the first IGBT 101 of the upper arm and the collector electrode of the second IGBT 102 of the lower arm) is connected to the corresponding phase winding of the armature winding of the motor generator 192. Electrical connection is made via a connector 188.

  The capacitor module 500 is for configuring a smoothing circuit that suppresses fluctuations in the DC voltage generated by the switching operation of the first IGBT 101 and the second IGBT 102. A positive electrode side of the battery 136 is electrically connected to the positive electrode side capacitor electrode of the capacitor module 500 and a negative electrode side of the battery 136 is electrically connected to the negative electrode side capacitor electrode of the capacitor module 500 via a DC connector. As a result, the capacitor module 500 is connected between the collector electrode of the upper arm first IGBT 101 and the positive electrode side of the battery 136, and between the emitter electrode of the lower arm second IGBT 102 and the negative electrode side of the battery 136. Electrically connected in parallel to the arm series circuit.

  The control unit 170 is for operating the IGBT, and generates a timing signal for controlling the switching timing of the first IGBT 101 and the second IGBT 102 based on input information from other control devices or sensors. And a driver circuit 174 that generates a drive signal for switching the first IGBT 101 and the second IGBT 102 based on the timing signal output from the control circuit 172.

  The control circuit 172 includes a microcomputer (hereinafter referred to as “microcomputer”) for calculating the switching timing of the first IGBT 101 and the second IGBT 102. The microcomputer receives as input information a target torque value required for the motor generator 192, a current value supplied to the armature winding of the motor generator 192 from the upper and lower arm series circuit 150, and a magnetic pole of the rotor of the motor generator 192. The position has been entered. The target torque value is based on a command signal output from a host controller (not shown). The current value is detected based on a detection signal output from a current sensor (not shown). The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) provided in the motor generator 192. In the present embodiment, the case where the current values of three phases are detected will be described as an example, but the current values for two phases may be detected.

  The microcomputer in the control circuit 172 calculates the d and q axis current command values of the motor generator 192 based on the target torque value, and the calculated d and q axis current command values and the detected d and q The voltage command values for the d and q axes are calculated based on the difference from the current value of the shaft, and the calculated voltage command values for the d and q axes are calculated based on the detected magnetic pole position. Convert to W phase voltage command value. Then, the microcomputer generates a pulse-like modulated wave based on the comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U-phase, V-phase, and W-phase, and the generated modulation The wave is output to the driver circuit 174 as a PWM (pulse width modulation) signal.

  The driver circuit 174 amplifies the PWM signal when driving the lower arm, and drives the upper arm to the gate electrode of the corresponding second IGBT 102 of the lower arm as a drive signal when driving the lower arm. Is shifted to the reference potential level of the upper arm and then the PWM signal is amplified and output as a drive signal to the gate electrode of the corresponding first IGBT 101 of the upper arm. Thereby, each 1st IGBT101 and 2nd IGBT102 perform switching operation | movement based on the input drive signal.

  FIG. 3 is a perspective view in which the entire configuration of the power conversion device according to the embodiment of the present invention is disassembled into components.

  As shown in FIG. 3, a cooling water channel 19 is provided in the middle of the housing 12, and two sets of openings are formed in the upper part of the cooling water channel 19 side by side in the flow direction. The two inverter devices 140 and the inverter devices 142 are fixed to the upper surface of the cooling water passage 19 so that the two sets of openings are closed by the inverter devices 140 and 142, respectively. Each inverter device 140 and inverter device 142 are provided with fins for heat dissipation, and the fins of each inverter device 140 and inverter device 142 protrude from the opening of the cooling water flow path 19 into the cooling water flow. Yes.

  An opening 404 for facilitating aluminum casting is formed below the cooling water channel 19, and the opening is closed by a cover 420.

  In addition, a lower case 16 is provided in the lower part of the cooling water flow path 19 so as to dissipate heat. It is fixed to the surface of the lower case 16 so as to face the surface. With this structure, cooling can be efficiently performed using the upper surface and the lower surface of the cooling water channel 19, which leads to downsizing of the entire power conversion device.

  When the cooling water from the inlet / outlet pipes 13 and 14 flows through the cooling water flow path 19, the heat dissipating fins of the two inverter devices 140 and the inverter device 142 provided are cooled, and the two inverter devices 140 and 140 The entire inverter device 142 is cooled.

  Further, the casing 12 provided with the cooling water flow path 19 is cooled, whereby the lower case 16 provided at the lower portion of the casing 12 is cooled, and by this cooling, the heat of the capacitor module 500 is transferred to the lower case 16 and the casing. The capacitor module 500 is cooled by being thermally conducted to the cooling water through the body 12.

  The control circuit board 20 and the drive circuit board 22 are disposed above the inverter device 140 and the inverter device 142, the driver circuit 174 is mounted on the drive circuit board 22, and the control circuit board 172 has a CPU. Is installed. Further, a metal base plate 11 is disposed between the drive circuit board 22 and the control circuit board 20, and the metal base plate 11 functions as an electromagnetic shield for a circuit group mounted on both the boards 22 and 20, and also the drive circuit board. The heat generated by the control circuit board 20 and the control circuit board 20 is released and cooled. In this way, the cooling water channel 19 is provided in the central portion of the housing 19, the inverter device 142 for driving the vehicle is arranged on one side thereof, and the inverter device 43 for auxiliary machines is arranged on the other side. Thus, cooling can be efficiently performed in a small space, and the entire power conversion device can be downsized. Further, by making the main structure of the cooling water channel 19 at the center of the casing by casting an aluminum material integrally with the casing 12, the cooling water channel 19 has the effect of increasing the mechanical strength in addition to the cooling effect. Further, by making the aluminum casting, the housing 12 and the cooling water flow path 19 are integrated with each other, heat conduction is improved, and cooling efficiency is improved.

  The drive circuit board 22 is provided with an inter-board connector 23 that passes through the metal base plate 11 and is connected to a circuit group of the control circuit board 20. The control circuit board 20 is provided with a connector 21 for electrical connection with the outside.

  The connector 21 transmits a signal to, for example, a lithium battery module mounted on the vehicle as the battery 136, for example, outside the power conversion device, and a signal indicating the state of the battery from the lithium battery module or a charging state of the lithium battery. A signal is sent. The inter-board connector 23 is provided in order to exchange signals with the control circuit 172 held on the control circuit board 20, and a signal line 176 is provided although not shown. The inverter circuit switching timing signal is transmitted from the control circuit board 20 to the drive circuit board 22 through the connector 176 and the board-to-board connector 23, and the drive circuit board 22 generates a gate drive signal which is a drive signal. Applied to each electrode.

  FIG. 4 is a top view showing a layout of IGBTs and diodes for one phase of the inverter device 140 according to the present embodiment. In this figure, the inverter device 140 is described as a representative example, but the inverter device 142 has the same configuration. In this figure, only the first IGBT 101, the second IGBT 102, the first diode 156, and the second diode 157 to be driven are displayed, and the thermistor for detecting the load and temperature connected to the IGBT and the resin or gel for sealing the bus bar, etc. The configuration of the IGBT device is omitted.

  The collector electrode of the first IGBT 101 and the cathode electrode of the first diode 156 are soldered to the first conductor portion 203. The collector electrode of the second IGBT 102 and the cathode electrode of the second diode 157 are soldered to the second conductor portion 204.

  The first conductor portion 203 and the second conductor portion 204 have a wiring pattern laid out on the upper surface of the silicon nitride insulating substrate 213, and the lower surface of the silicon nitride insulating substrate 213 has a solid pattern (not shown) wired on the entire surface of the substrate. Therefore, the effect of reducing stray inductance due to the generation of eddy current can be obtained.

  In the present embodiment, the case where the first conductor portion 203 and the second conductor portion 204 are laid out on the upper surface of the silicon nitride insulating substrate 213 is described as a wiring pattern. Other members may be used as long as they are obtained.

  The emitter electrode of the first IGBT 101 and the anode electrode of the first diode 156 are electrically connected to the second conductor portion 204 by wire bonding, and the emitter electrode of the second IGBT 102 and the anode electrode of the second diode 157 are wire bonded to the fourth conductor 205. Are electrically connected.

  The first IGBT 101 constitutes the upper arm circuit of the inverter circuit. The first diode 156 forms an upper arm circuit of the inverter circuit and is electrically connected to the first IGBT 101 in parallel. The second IGBT 102 constitutes a lower arm circuit of the inverter circuit. The second diode 157 forms a lower arm circuit of the inverter circuit and is electrically connected in parallel with the second IGBT 102.

  The second conductor portion 204 is connected to the emitter electrode side of the second IGBT 102 and the anode electrode side of the second diode 157 via a solder material and is disposed adjacent to the first conductor portion 203. The relay conductor portion 280 connects the first conductor portion 203 and the second conductor portion 204. The relay conductor part 280 may be configured by wire bonding, a part of the second conductor part 204 or a part of the first conductor part 203, or any one of them.

  When the arrangement direction of the first conductor portion 203 and the second conductor portion 204 is defined as the first row 281, the first IGBT 101 and the second diode 157 are arranged along the first row 281, and the first IGBT 101 is Arranged so as to overlap the second diode 157 along one row 281. The second IGBT 102 and the first diode 156 are arranged along a second row 282 parallel to the first row 281, and the second IGBT 102 is arranged so as to overlap the first diode 156 along the second row 282. The The relay conductor portion 280 is disposed between the first row 281 and the second row 282.

  In other words, the first IGBT 101, the first diode 156, the second IGBT 102, and the second diode 157 are arranged so that the respective central portions form a substantially quadrangular vertex, and the first IGBT 101 and the second IGBT 102 are arranged in a substantially rectangular shape. One apex on the diagonal line is formed, and the relay conductor portion 280 is formed inside the substantially rectangular shape.

  With such a configuration, current flows in the order of the first IGBT 101, the second diode 157 or the first diode 156, and the second IGBT 102, and the current path can be further shortened. In addition, since the current flows in a circular arc shape, an eddy current can be induced in the solid pattern (not shown) of the silicon nitride insulating substrate 213 or a metal cooler, so that magnetic flux cancellation occurs. Therefore, the wiring inductance can be reduced.

  In addition, in a quadrilateral connecting a region where the first IGBT 101 is soldered, a region where the second IGBT 102 is soldered, a region where the first diode 156 is soldered, and a region where the second diode 157 is soldered, a region where the first IGBT 101 is soldered The area where the second IGBT 102 is soldered is laid out diagonally, and the area where the first diode 156 is soldered and the area where the second diode 157 is soldered are similarly laid out diagonally.

  In the present embodiment, the first IGBT 101, the second IGBT 102, the first diode 156, and the second diode 157 are each described as one chip. However, the area where the first IGBT 101 is soldered and the area where the second IGBT 102 is soldered are diagonal lines. As long as the region where the first diode 156 is soldered and the region where the second diode 157 is soldered are similarly laid out diagonally, a plurality of chips may be laid out in parallel. I do not care.

  The third conductor portion 206 is connected to the first conductor portion 203 and formed in a direction away from the first IGBT 101. The fourth conductor portion 205 is connected to the second conductor portion 204, is formed along the direction in which the third conductor portion 206 is formed, and is disposed at a position adjacent to the third conductor portion 206. As a result, the third conductor portion 206 and the fourth conductor portion 205 are arranged at adjacent positions, so that the magnetic flux canceling action works and the wiring inductance can be reduced. The fourth conductor portion 205 is connected by the second conductor portion 204, the second diode 157 and the wire bonding 283, and a part of the fourth conductor portion 205 is connected to the first conductor portion 203 and the second conductor portion 204. It is arranged between.

  FIG. 5 is a circuit diagram showing a path in which a time change di / dt of a current occurs when a turn-off surge that occurs when the first IGBT 101 is turned off and a recovery surge that occurs in the lower arm when the first IGBT 101 is turned on. ing.

  FIG. 6 shows the path of the time change di / dt of the current when the turn-off surge generated when the first IGBT 101 is turned off and the recovery surge generated in the lower arm when the first IGBT 101 is turned on. This is shown in the layout diagram. By adopting the configuration of the present embodiment, the current path in which the time change di / dt of the current flowing through the first IGBT 101 and the second diode 157 occurs is shortened.

  FIG. 7 is a circuit diagram showing a path in which a time change di / dt of a current is generated when a turn-off surge generated when the second IGBT 102 is turned off and a recovery surge generated in the upper arm when the second IGBT 102 is turned on. ing.

  FIG. 8 shows a path through which a time change di / dt of current occurs when a turn-off surge that occurs when the lower arm second IGBT 102 is turned off and a recovery surge that occurs in the upper arm when the lower arm second IGBT 102 is turned on. The layout of IGBTs and diodes is shown.

  By adopting the configuration of the present embodiment, the path through which the time change di / dt of the current flowing through the second IGBT 102 and the first diode 156 occurs is shortened.

  FIG. 9 is a layout of IGBTs and diodes for one phase according to another embodiment. In this figure, only the first IGBT 101, the second IGBT 102, the first diode 156, and the second diode 157 to be driven are displayed, and the thermistor for detecting the load and temperature connected to the IGBT and the resin or gel for sealing the bus bar, etc. The configuration of the IGBT device is omitted.

  The difference between the above-described embodiment and this embodiment is that a first connection conductor plate 208 formed so as to face the emitter electrode of the first IGBT 101 and the anode electrode of the first diode 156 is provided. The first connection conductor plate 208 constitutes a part of the relay conductor portion 280. Also, a second connection conductor plate 210 is provided so as to face the emitter electrode of the second IGBT 102 and the anode electrode of the second diode 157. The second connection conductor plate 210 is formed integrally with the fourth conductor portion 205 described in the other embodiments described above. By using a plate-like conductor instead of wire bonding, the conductor cross-sectional area can be increased and the inductance can be reduced.

101 1st IGBT
102 2nd IGBT
140, 142 Inverter device 156 First diode 157 Second diode 203 First conductor portion 204 Second conductor portion 205 Fourth conductor portion 206 Third conductor portion 208 First connection conductor plate 210 Second connection conductor plate 213 Silicon nitride insulating substrate 280 Relay conductor portion 281 First row 282 Second row 283 Wire bonding

Claims (6)

A first IGBT constituting the upper arm circuit of the inverter circuit;
A first diode constituting the upper arm circuit of the inverter circuit and electrically connected in parallel with the first IGBT;
A second IGBT constituting a lower arm circuit of the inverter circuit;
A second diode constituting the lower arm circuit of the inverter circuit and electrically connected in parallel with the second IGBT;
A first conductor portion connected to the collector electrode side of the first IGBT and the cathode electrode side of the first diode via a solder material;
A second conductor portion connected to the emitter electrode side of the second IGBT and the anode electrode side of the second diode via a solder material and disposed adjacent to the first conductor portion;
A relay conductor portion connecting the first conductor portion and the second conductor portion,
When the arrangement direction of the first conductor part and the second conductor part is defined as a first row,
The first IGBT and the second diode are arranged along the first row, and the first IGBT is arranged along the first row so as to overlap the second diode,
The second IGBT and the first diode are arranged along a second row parallel to the first row, and the second IGBT is arranged along the second row so as to overlap the first diode,
The relay conductor portion is an inverter device arranged between the first row and the second row. A first IGBT constituting the upper arm circuit of the inverter circuit;
A first diode constituting the upper arm circuit of the inverter circuit and electrically connected in parallel with the first IGBT;
A second IGBT constituting a lower arm circuit of the inverter circuit;
A second diode constituting the lower arm circuit of the inverter circuit and electrically connected in parallel with the second IGBT;
A first conductor portion connected to the collector electrode side of the first IGBT and the cathode electrode side of the first diode via a solder material;
A second conductor portion connected to the emitter electrode side of the second IGBT and the anode electrode side of the second diode via a solder material and disposed adjacent to the first conductor portion;
A relay conductor portion connecting the first conductor portion and the second conductor portion,
The first IGBT, the first diode, the second IGBT, and the second diode are arranged such that their center portions form a substantially rectangular vertex,
The first IGBT and the second IGBT form vertices on one diagonal of the substantially quadrilateral,
The relay conductor portion is an inverter device formed inside the square. The inverter device according to claim 1 or 2,
A third conductor portion connected to the first conductor portion;
A fourth conductor portion connected to the second conductor portion,
The third conductor portion is formed in a direction away from the first IGBT,
The fourth conductor portion is an inverter device that is formed along a formation direction of the third conductor portion and disposed at a position adjacent to the third conductor portion. The inverter device according to claim 3,
The inverter device, wherein the fourth conductor portion is connected to the second diode by wire bonding, and a part of the fourth conductor portion is disposed between the first conductor portion and the second conductor portion. The inverter device according to claim 1 or 2,
A first connection conductor plate formed to face the emitter electrode of the first IGBT and the anode electrode of the first diode;
The inverter device, wherein the first connection conductor is formed integrally with the relay conductor portion. The inverter device according to claim 3,
A first connection conductor plate formed to face the emitter electrode of the first IGBT and the anode electrode of the first diode;
A second connection conductor plate formed to face the emitter electrode of the second IGBT and the anode electrode of the second diode, and the first connection conductor is formed integrally with the relay conductor portion, The second connection conductor plate is an inverter device formed integrally with the fourth conductor portion.