JP2013181177A5 - - Google Patents

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JP2013181177A5
JP2013181177A5 JP2012043508A JP2012043508A JP2013181177A5 JP 2013181177 A5 JP2013181177 A5 JP 2013181177A5 JP 2012043508 A JP2012043508 A JP 2012043508A JP 2012043508 A JP2012043508 A JP 2012043508A JP 2013181177 A5 JP2013181177 A5 JP 2013181177A5
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fine powder
copper fine
cobalt
producing
plating
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JP2012043508A
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JP5912663B2 (en
JP2013181177A (en
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銅微粉の表面にコバルト層を備えることを特徴とするコバルト被覆銅微粉。 Cobalt coated copper fine powder which is characterized in that it comprises a cobalt layer on the surface of the copper fine powder. 平均粒径が０．０１〜１．０μｍであることを特徴とする請求項１記載のコバルト被覆銅微粉。   The cobalt-coated copper fine powder according to claim 1, wherein the average particle diameter is 0.01 to 1.0 µm. コバルト層が無電解コバルトめっき層であることを特徴とする請求項１〜２のいずれか一項に記載のコバルト被覆銅微粉。   The cobalt-coated copper fine powder according to any one of claims 1 to 2, wherein the cobalt layer is an electroless cobalt plating layer. 焼結開始温度（ＴＭＡ値）が４００℃以上であることを特徴とする請求項１〜３のいずれか一項に記載のコバルト被覆銅微粉。   The cobalt-coated copper fine powder according to any one of claims 1 to 3, wherein a sintering start temperature (TMA value) is 400 ° C or higher. 銅微粉が不均化反応により形成された銅微粉であることを特徴とする請求項１〜４のいずれか一項に記載の銅微粉。The copper fine powder according to any one of claims 1 to 4, wherein the copper fine powder is a copper fine powder formed by a disproportionation reaction. コバルト被覆銅微粉の製造方法であって、亜酸化銅の不均化反応により銅微粉を形成し、この銅微粉に無電解置換めっきにより、パラジウム（Ｐｄ）をめっきし、その上に無電解めっきによりコバルトを被覆することを特徴とするコバルト被覆銅微粉の製造方法。   A method for producing cobalt-coated copper fine powder, wherein copper fine powder is formed by a disproportionation reaction of cuprous oxide, palladium (Pd) is plated on the copper fine powder by electroless displacement plating, and electroless plating is formed thereon. A method for producing a cobalt-coated copper fine powder, characterized in that cobalt is coated by: 請求項１〜５のいずれか一項に記載のコバルトめっき銅微粉を用いて製造した導電ペースト。 The electrically conductive paste manufactured using the cobalt plating copper fine powder as described in any one of Claims 1-5 . 表面にめっき層を有する銅微粉の製造方法であって、A method for producing copper fine powder having a plating layer on the surface,
前記めっき層を銅微粉の表面に形成するためのめっき浴に、前記めっき層形成前の銅微粉を、浸漬する工程と、及び、A step of immersing the copper fine powder before forming the plating layer in a plating bath for forming the plating layer on the surface of the copper fine powder; and
前記工程後に、前記めっき浴に還元剤を含む液を噴霧する工程とSpraying a liquid containing a reducing agent on the plating bath after the step;
を含む、製造方法。Manufacturing method. 前記噴霧する工程が、２流体ノズルを用いて行われる請求項８に記載の銅微粉の製造方法。The method for producing copper fine powder according to claim 8, wherein the spraying step is performed using a two-fluid nozzle. 前記還元剤を含む液の液滴の体積は１×１０The volume of the liquid droplet containing the reducing agent is 1 × 10 -4-Four 〜２．６×１０~ 2.6 × 10 -3-3 ｍｍmm 3Three である請求項８又は９に記載の銅微粉の製造方法。The method for producing copper fine powder according to claim 8 or 9. 前記還元剤を含む液の液滴の直径は１０〜５０μｍである請求項８〜１０のいずれか一項に記載の銅微粉の製造方法。The diameter of the droplet of the liquid containing the said reducing agent is 10-50 micrometers, The manufacturing method of the copper fine powder as described in any one of Claims 8-10. 前記還元剤がヒドラジンである請求項８〜１１のいずれか一項に記載の銅微粉の製造方法。The method for producing a copper fine powder according to any one of claims 8 to 11, wherein the reducing agent is hydrazine. めっき層がコバルトを含む請求項８〜１２のいずれか一項に記載の銅微粉の製造方法。The manufacturing method of the copper fine powder as described in any one of Claims 8-12 in which a plating layer contains cobalt.
JP2012043508A 2012-02-29 2012-02-29 Cobalt-plated copper fine powder, conductive paste produced using cobalt-plated copper fine powder, and method for producing cobalt-plated copper fine powder Active JP5912663B2 (en)

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JP2012043508A JP5912663B2 (en) 2012-02-29 2012-02-29 Cobalt-plated copper fine powder, conductive paste produced using cobalt-plated copper fine powder, and method for producing cobalt-plated copper fine powder

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JP2012043508A JP5912663B2 (en) 2012-02-29 2012-02-29 Cobalt-plated copper fine powder, conductive paste produced using cobalt-plated copper fine powder, and method for producing cobalt-plated copper fine powder

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JP2013181177A JP2013181177A (en) 2013-09-12
JP2013181177A5 true JP2013181177A5 (en) 2014-11-27
JP5912663B2 JP5912663B2 (en) 2016-04-27

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JP6241929B2 (en) * 2013-11-29 2017-12-06 学校法人東京理科大学 Preparation method of heterogeneous composite metal nanoparticles
CN109908961A (en) * 2019-03-04 2019-06-21 合肥学院 A kind of photocatalysis cuprous oxide/polymer compound powder body method
US11152160B1 (en) 2020-09-15 2021-10-19 United Arab Emirates University High-rate hybrid supercapacitor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64718A (en) * 1987-06-23 1989-01-05 Toshiba Corp Base metal powder for ceramic capacitor electrode
JP3527854B2 (en) * 1998-09-30 2004-05-17 京セラ株式会社 Conductive paste composition, method for manufacturing multilayer ceramic capacitor using the same, and multilayer ceramic capacitor
JP2002275511A (en) * 2001-03-15 2002-09-25 Murata Mfg Co Ltd Method for manufacturing metal powder, metal powder, conductive paste and laminated ceramic electronic parts
JP2003013103A (en) * 2001-06-26 2003-01-15 Murata Mfg Co Ltd Method for manufacturing electroconductive powder, electroconductive powder, electroconductive paste and laminated ceramic electronic component
JP4182234B2 (en) * 2002-09-20 2008-11-19 Ｄｏｗａエレクトロニクス株式会社 Copper powder for conductive paste and method for producing the same
JP4261973B2 (en) * 2003-04-28 2009-05-13 日本化学工業株式会社 Method for producing conductive electroless plating powder
JP4494108B2 (en) * 2004-07-22 2010-06-30 三井金属鉱業株式会社 Nickel-coated copper powder manufacturing method, nickel-coated copper powder and conductive paste
JP4853152B2 (en) * 2006-07-19 2012-01-11 住友金属鉱山株式会社 Nickel-coated copper fine particles and manufacturing method thereof, dispersion using the same, manufacturing method thereof, and paste using the same
US7749300B2 (en) * 2008-06-05 2010-07-06 Xerox Corporation Photochemical synthesis of bimetallic core-shell nanoparticles
JP4685145B2 (en) * 2008-09-10 2011-05-18 ニホンハンダ株式会社 Method for manufacturing metal member assembly and metal member assembly
JP2010100899A (en) * 2008-10-23 2010-05-06 Japan Science & Technology Agency Silver-rhodium alloy fine particle and method for producing the same
KR101671049B1 (en) * 2010-03-17 2016-10-31 신닛테츠 수미킨 가가쿠 가부시키가이샤 Nickel-cobalt nanoparticle and manufacturing method therefor
JP5571435B2 (en) * 2010-03-31 2014-08-13 Ｊｘ日鉱日石金属株式会社 Method for producing silver-plated copper fine powder
JP5832731B2 (en) * 2010-08-10 2015-12-16 株式会社東芝 Semiconductor element
JP2011094236A (en) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd Copper powder for low temperature firing, or copper powder for conductive paste

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