JPS64718A - Base metal powder for ceramic capacitor electrode - Google Patents
Base metal powder for ceramic capacitor electrodeInfo
- Publication number
- JPS64718A JPS64718A JP62154364A JP15436487A JPS64718A JP S64718 A JPS64718 A JP S64718A JP 62154364 A JP62154364 A JP 62154364A JP 15436487 A JP15436487 A JP 15436487A JP S64718 A JPS64718 A JP S64718A
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- electrode
- metal powder
- powder
- grain size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 title abstract 11
- 239000000843 powder Substances 0.000 title abstract 8
- 239000003985 ceramic capacitor Substances 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Ceramic Capacitors (AREA)
Abstract
PURPOSE: To obtain low-cost base metal powder easy to be treated by plating the surfaces of first base metal powder as nuclei with a second base metal having a composition different from a first base metal through an electrolytic or electroless method.
CONSTITUTION: The surfaces of first base metal powder having mean grain size of 0.1W20μm are plated with a second base metal having a composition different from first base metal powder through an electrolytic or electroless method. Cu or a Cu-Ni alloy is used as the first base metal. Ni is employed as the second base metal, and Ni is used through electroless nickel plating. The quantity of adhesion of Ni is increased exceedingly when the grain size of Cu powder extends over 0.1μm or less, a burning temperature as an electrode is displaced to a higher temperature, and the breaking of the electrode is generated. When the grain size of Cu powder exceeds 20μm, screen printing is made difficult while the continuity of the electrode after sintering is also deteriorated. Accordingly, base metal powder is not oxidized even through a degreasing process in air, and the title electrode sufficiently displays a function as an internal electrode on the main baking of a reducing atmosphere (such as nitrogen), thus acquiring a continuous electrode film.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62154364A JPS64718A (en) | 1987-06-23 | 1987-06-23 | Base metal powder for ceramic capacitor electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62154364A JPS64718A (en) | 1987-06-23 | 1987-06-23 | Base metal powder for ceramic capacitor electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01718A JPH01718A (en) | 1989-01-05 |
JPS64718A true JPS64718A (en) | 1989-01-05 |
Family
ID=15582542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62154364A Pending JPS64718A (en) | 1987-06-23 | 1987-06-23 | Base metal powder for ceramic capacitor electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS64718A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4236035A1 (en) * | 1992-03-31 | 1993-10-07 | Ntn Toyo Bearing Co Ltd | Roller bearing assembly |
JP2004217991A (en) * | 2003-01-14 | 2004-08-05 | Dowa Mining Co Ltd | Nickel-coated fine copper powder, and production method therefor |
WO2006009097A1 (en) * | 2004-07-22 | 2006-01-26 | Mitsui Mining & Smelting Co., Ltd. | Nickel coated copper powder and process for producing the same |
JP2013181177A (en) * | 2012-02-29 | 2013-09-12 | Jx Nippon Mining & Metals Corp | Cobalt plated copper fine power, conductive paste produced by using the same, and method of producing the same |
KR101314990B1 (en) * | 2011-09-19 | 2013-10-04 | 장신우 | Manufacturing method of conductive copper powder |
WO2014140430A2 (en) | 2013-03-15 | 2014-09-18 | Inkron Ltd | Multi shell metal particles and uses thereof |
WO2017057231A1 (en) * | 2015-09-28 | 2017-04-06 | 住友金属鉱山株式会社 | Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER |
-
1987
- 1987-06-23 JP JP62154364A patent/JPS64718A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4236035A1 (en) * | 1992-03-31 | 1993-10-07 | Ntn Toyo Bearing Co Ltd | Roller bearing assembly |
US5320433A (en) * | 1992-03-31 | 1994-06-14 | Nin Corporation | Rolling contact bearing assembly |
DE4236035C2 (en) * | 1992-03-31 | 1997-01-02 | Ntn Toyo Bearing Co Ltd | Rolling bearing assembly |
JP2004217991A (en) * | 2003-01-14 | 2004-08-05 | Dowa Mining Co Ltd | Nickel-coated fine copper powder, and production method therefor |
WO2006009097A1 (en) * | 2004-07-22 | 2006-01-26 | Mitsui Mining & Smelting Co., Ltd. | Nickel coated copper powder and process for producing the same |
JP2006028630A (en) * | 2004-07-22 | 2006-02-02 | Mitsui Mining & Smelting Co Ltd | Nickel-coated copper powder and method for producing nickel-coated copper powder |
JP4494108B2 (en) * | 2004-07-22 | 2010-06-30 | 三井金属鉱業株式会社 | Nickel-coated copper powder manufacturing method, nickel-coated copper powder and conductive paste |
KR101186945B1 (en) * | 2004-07-22 | 2012-09-28 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Nickel coated copper powder and process for producing the same |
KR101314990B1 (en) * | 2011-09-19 | 2013-10-04 | 장신우 | Manufacturing method of conductive copper powder |
JP2013181177A (en) * | 2012-02-29 | 2013-09-12 | Jx Nippon Mining & Metals Corp | Cobalt plated copper fine power, conductive paste produced by using the same, and method of producing the same |
WO2014140430A2 (en) | 2013-03-15 | 2014-09-18 | Inkron Ltd | Multi shell metal particles and uses thereof |
WO2017057231A1 (en) * | 2015-09-28 | 2017-04-06 | 住友金属鉱山株式会社 | Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER |
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