JPS64718A - Base metal powder for ceramic capacitor electrode - Google Patents

Base metal powder for ceramic capacitor electrode

Info

Publication number
JPS64718A
JPS64718A JP62154364A JP15436487A JPS64718A JP S64718 A JPS64718 A JP S64718A JP 62154364 A JP62154364 A JP 62154364A JP 15436487 A JP15436487 A JP 15436487A JP S64718 A JPS64718 A JP S64718A
Authority
JP
Japan
Prior art keywords
base metal
electrode
metal powder
powder
grain size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62154364A
Other languages
Japanese (ja)
Other versions
JPH01718A (en
Inventor
Osamu Furukawa
Motomasa Imai
Keizo Shimamura
Hideo Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62154364A priority Critical patent/JPS64718A/en
Publication of JPH01718A publication Critical patent/JPH01718A/en
Publication of JPS64718A publication Critical patent/JPS64718A/en
Pending legal-status Critical Current

Links

Landscapes

  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Ceramic Capacitors (AREA)

Abstract

PURPOSE: To obtain low-cost base metal powder easy to be treated by plating the surfaces of first base metal powder as nuclei with a second base metal having a composition different from a first base metal through an electrolytic or electroless method.
CONSTITUTION: The surfaces of first base metal powder having mean grain size of 0.1W20μm are plated with a second base metal having a composition different from first base metal powder through an electrolytic or electroless method. Cu or a Cu-Ni alloy is used as the first base metal. Ni is employed as the second base metal, and Ni is used through electroless nickel plating. The quantity of adhesion of Ni is increased exceedingly when the grain size of Cu powder extends over 0.1μm or less, a burning temperature as an electrode is displaced to a higher temperature, and the breaking of the electrode is generated. When the grain size of Cu powder exceeds 20μm, screen printing is made difficult while the continuity of the electrode after sintering is also deteriorated. Accordingly, base metal powder is not oxidized even through a degreasing process in air, and the title electrode sufficiently displays a function as an internal electrode on the main baking of a reducing atmosphere (such as nitrogen), thus acquiring a continuous electrode film.
COPYRIGHT: (C)1989,JPO&Japio
JP62154364A 1987-06-23 1987-06-23 Base metal powder for ceramic capacitor electrode Pending JPS64718A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62154364A JPS64718A (en) 1987-06-23 1987-06-23 Base metal powder for ceramic capacitor electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62154364A JPS64718A (en) 1987-06-23 1987-06-23 Base metal powder for ceramic capacitor electrode

Publications (2)

Publication Number Publication Date
JPH01718A JPH01718A (en) 1989-01-05
JPS64718A true JPS64718A (en) 1989-01-05

Family

ID=15582542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62154364A Pending JPS64718A (en) 1987-06-23 1987-06-23 Base metal powder for ceramic capacitor electrode

Country Status (1)

Country Link
JP (1) JPS64718A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4236035A1 (en) * 1992-03-31 1993-10-07 Ntn Toyo Bearing Co Ltd Roller bearing assembly
JP2004217991A (en) * 2003-01-14 2004-08-05 Dowa Mining Co Ltd Nickel-coated fine copper powder, and production method therefor
WO2006009097A1 (en) * 2004-07-22 2006-01-26 Mitsui Mining & Smelting Co., Ltd. Nickel coated copper powder and process for producing the same
JP2013181177A (en) * 2012-02-29 2013-09-12 Jx Nippon Mining & Metals Corp Cobalt plated copper fine power, conductive paste produced by using the same, and method of producing the same
KR101314990B1 (en) * 2011-09-19 2013-10-04 장신우 Manufacturing method of conductive copper powder
WO2014140430A2 (en) 2013-03-15 2014-09-18 Inkron Ltd Multi shell metal particles and uses thereof
WO2017057231A1 (en) * 2015-09-28 2017-04-06 住友金属鉱山株式会社 Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4236035A1 (en) * 1992-03-31 1993-10-07 Ntn Toyo Bearing Co Ltd Roller bearing assembly
US5320433A (en) * 1992-03-31 1994-06-14 Nin Corporation Rolling contact bearing assembly
DE4236035C2 (en) * 1992-03-31 1997-01-02 Ntn Toyo Bearing Co Ltd Rolling bearing assembly
JP2004217991A (en) * 2003-01-14 2004-08-05 Dowa Mining Co Ltd Nickel-coated fine copper powder, and production method therefor
WO2006009097A1 (en) * 2004-07-22 2006-01-26 Mitsui Mining & Smelting Co., Ltd. Nickel coated copper powder and process for producing the same
JP2006028630A (en) * 2004-07-22 2006-02-02 Mitsui Mining & Smelting Co Ltd Nickel-coated copper powder and method for producing nickel-coated copper powder
JP4494108B2 (en) * 2004-07-22 2010-06-30 三井金属鉱業株式会社 Nickel-coated copper powder manufacturing method, nickel-coated copper powder and conductive paste
KR101186945B1 (en) * 2004-07-22 2012-09-28 미쓰이 긴조꾸 고교 가부시키가이샤 Nickel coated copper powder and process for producing the same
KR101314990B1 (en) * 2011-09-19 2013-10-04 장신우 Manufacturing method of conductive copper powder
JP2013181177A (en) * 2012-02-29 2013-09-12 Jx Nippon Mining & Metals Corp Cobalt plated copper fine power, conductive paste produced by using the same, and method of producing the same
WO2014140430A2 (en) 2013-03-15 2014-09-18 Inkron Ltd Multi shell metal particles and uses thereof
WO2017057231A1 (en) * 2015-09-28 2017-04-06 住友金属鉱山株式会社 Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER

Similar Documents

Publication Publication Date Title
GB1496994A (en) Pastes for forming electrically conductive films on non-conductive substrates
AU538714B2 (en) Compacting, sintering rolling and annealing cu base-ni-sn spinodal alloy powders
JPS64718A (en) Base metal powder for ceramic capacitor electrode
TW429180B (en) Nickel powder, process for preparing the same, conductor paste comprising the same, multilayer ceramic electronic component and multilayer ceramic substrate
JPS54157296A (en) Electrode structure and the manufacturing method
DE69925429D1 (en) Nickel composite powder and method of its production
US2418265A (en) Process for providing aluminum and aluminum alloys with metal coatings
JPS57126960A (en) Ultrathin aluminum plated steel plate and preparation thereof
JPH0354847B2 (en)
JPS583962A (en) Stress free nickel layer formation
JPS53122790A (en) Aluminum terminal and preparation
JPS5481777A (en) Lead frame structure with intermediate layer
JPH05226515A (en) Aluminum nitride substrate having metallized layer and the metallizing method thereof
JP3376717B2 (en) Conductive composition for external electrode of electronic component and ceramic electronic component formed using the same
JPS53125913A (en) Method of producing aluminium alloy low density sintered parts
Gajbhiye et al. Ohmic Contacts by Electroless Nickel Plating
JPS6369786A (en) Manufacture of aluminum nitride base sheet with metallized layer
AT151639B (en) Process for the application of dense and solderable metal layers on completely fired ceramic bodies.
JPS53129156A (en) Plating method for carbonaceous powder
JPS64788A (en) Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same
JPS57152499A (en) Production of electric contact
SU870383A1 (en) Paste for metallizing ceramics
JPS62113783A (en) Method of metallizing silicon nitride sintered body
JPS57152438A (en) Thermal expansion regulating material
Filonenko et al. Electrochemical Deposition of Metals on High Resistance Semiconductors