JP2013178348A - Optical module mounted circuit board, optical module mounted system, optical module evaluating kit system and communication system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module mounted circuit board with high productivity, an optical module mounted system, an optical module evaluating kit system and communication system.SOLUTION: The optical module mounted circuit board comprises: an optical module for emitting or receiving an optical signal; an optical coupling member optically coupled with the optical module; and a circuit board mounted with the optical module and the optical coupling member, having an opening on a main surface thereof and electrically connected with the optical module. Positioning of the optical module and the optical coupling member in at least a horizontal direction of the main surface of the circuit board is performed through the opening.

Description

  The present invention relates to an optical module mounting circuit board, an optical module mounting system, an optical module evaluation kit system, and a communication system.

  Optical interconnections between boards are being researched to realize exascale computing. In the optical interconnection, an optical module that is an optical transmitter or an optical receiver transmits and receives an optical signal through an optical transmission path. Patent Documents 1 to 4 describe a configuration in which an optical module and an optical transmission line are formed on a circuit board.

JP 2004-29621 A JP 2000-98153 A JP 2002-189137 A JP 2003-139799 A

  In the conventional structure, when the optical module including the optical element and the optical coupling member such as the MT connector, the organic waveguide, and the PLC are optically aligned, the optical coupling portion is a shade of the housing or the circuit board. Therefore, conventionally, after the optical module is fixed, the optical module and the optical coupling member are aligned by active alignment for detecting the light output propagating through the coupling system. However, in this case, there is a problem that the alignment cannot be performed when it takes a very long time or the position is greatly shifted. Conventionally, optical alignment of the optical coupling member has been performed on the optical module both in the horizontal direction and in the vertical direction, and it has taken much time for alignment. Productivity was very low due to these factors.

  Moreover, when evaluating an optical module, it is preferable to perform evaluation in a state close to actual use after mounting on a circuit board. However, if the optical module is actually mounted on the circuit board by soldering or the like, there is a problem that it is difficult to remove the optical module from the circuit board after that, and the optical module may be damaged when it is removed. In addition, in order to accurately evaluate the high-frequency characteristics of the optical module, it is necessary to establish an optical coupling between the optical module and the evaluation system with high accuracy. However, the optical waveguide coupled with the optical module in actual use is formed on the circuit board or built in the circuit board. As the optical waveguide, ridge type optical waveguides such as silicon fine wire waveguides, optical fiber sheets, PLC chips, and the like having different sizes are assumed. Therefore, the optical coupling between the optical module and the optical waveguide used in the evaluation system needs to be established with high accuracy for any of the optical modules used in combination with optical waveguides of various installation forms and structures. .

  Furthermore, in a system including an optical module, since there are many failures in the optical module among the components of the system, it is necessary to use a circuit board that can replace only the optical module when the optical module fails. Although it is convenient, when the optical module is configured to be replaceable, the optical path formed on the circuit board and the optical element included in the optical module may be misaligned, resulting in loss.

  The present invention has been made in view of the above, and an object thereof is to provide an optical module mounting circuit board, an optical module mounting system, an optical module evaluation kit system, and a communication system with high productivity.

  In order to solve the above-described problems and achieve the object, an optical module-mounted circuit board according to the present invention includes an optical module that emits or receives an optical signal, an optical coupling member that optically couples to the optical module, and the light A circuit board mounted with the module and the optical coupling member, having an opening on a main surface thereof, and electrically connected to the optical module; and at least the circuit board of the optical module and the optical coupling member Positioning in the horizontal direction of the main surface is performed through the opening.

  The optical module mounting circuit board according to the present invention is characterized in that the horizontal positioning is performed by combining positioning means provided in the optical module and the optical member.

  The circuit board mounted with an optical module according to the present invention is characterized in that the horizontal positioning means has a fitting structure of a guide pin and a guide pin hole.

  The optical module mounting circuit board according to the present invention further includes a fixing means for positioning a height in a vertical direction with respect to the circuit board of the optical connection portion of the optical coupling member.

  In the optical module mounting circuit board according to the present invention, the fixing means is disposed on the side opposite to the optical module with respect to the circuit board, and supports the optical coupling member against the circuit board. The optical coupling member is fixed between a member and a support portion that receives the optical coupling member on a circuit board side.

  In the optical module mounting circuit board according to the present invention, the optical coupling member has a jaw part, and the optical coupling support member is connected to the circuit board so as to press the jaw part of the optical coupling member toward the connection part side. The support part is a member having rigidity so as to be sandwiched between the jaw part and the circuit board.

  The optical module mounting circuit board according to the present invention is characterized in that the optical module is fixed by soldering to a circuit pattern provided on the circuit board.

  The optical module mounting circuit board according to the present invention is characterized in that the optical module is detachably fixed to a circuit pattern provided on the circuit board.

  Moreover, the optical module mounting circuit board according to the present invention is characterized in that the optical module can be attached and detached by being built in and fixed to a socket provided on the circuit board.

  The optical module mounting circuit board according to the present invention is characterized in that the optical module is pressed and fixed by a lid in the socket.

  In the circuit board mounted with the optical module according to the present invention, the electrical interface is made of a pin with a spring or an anisotropic conductive film.

  Further, the optical module mounting circuit board according to the present invention has an optical glass, a lens, or a spot size converting means in the opening.

  In addition, a communication system according to the present invention includes the above-described optical module mounting circuit board.

  In addition, an optical module evaluation kit system according to the present invention includes the above-described optical module mounting circuit board for evaluating the optical module.

  According to the present invention, there is an effect that productivity is high.

FIG. 1 is a schematic perspective view of an optical module mounted in the mounting system according to the first embodiment. FIG. 2 is a plan view of the optical module shown in FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. FIG. 4 is a diagram showing an example of another optical module configuration. FIG. 5 is a diagram illustrating an optical module mounted on a circuit board. FIG. 6 is a schematic perspective view of the mounting system according to the first embodiment. FIG. 7 is a side view of FIG. FIG. 8 is a front view of FIG. FIG. 9 is a plan view of FIG. 10 is a perspective view of the circuit board and the socket shown in FIG. 11 is a perspective view of the MT connector support member shown in FIG. 12 is a partial cross-sectional view of FIG. FIG. 13 is a partial cross-sectional view of FIG. FIG. 14 is a diagram showing a good example of the spacer. FIG. 15 is a partial cross-sectional view of the evaluation kit according to the second embodiment. FIG. 16 is a schematic diagram of the spacer and the organic optical waveguide shown in FIG. FIG. 17 is a schematic diagram of an optical module mounting circuit board on which an optical module is mounted using the components of the evaluation kit. FIG. 18 is a schematic diagram of an organic optical waveguide having a guide hole. FIG. 19 is a schematic diagram of an optical module mounting circuit board according to the third embodiment. FIG. 20 is a schematic diagram of an optical module mounting circuit board according to the fourth embodiment.

  Hereinafter, embodiments of an optical module mounting circuit board, an optical module mounting system, an optical module evaluation kit system, and a communication system according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. Moreover, in each drawing, the same code | symbol is attached | subjected suitably to the same or corresponding element. Furthermore, it should be noted that the drawings are schematic, and dimensional relationships between elements may differ from actual ones. Even between the drawings, there are cases in which portions having different dimensional relationships and ratios are included.

(Embodiment 1)
First, an example of the optical module mounting system (hereinafter abbreviated as mounting system) according to Embodiment 1 will be described.

  FIG. 1 is a schematic perspective view of an optical module mounted on the optical module mounting system according to the first embodiment. FIG. 2 is a plan view of the optical module shown in FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. Hereinafter, the optical module will be described with reference to FIGS.

  The optical module 100 includes a housing 10, a VCSEL (Vertical Cavity Surface Emitting Laser) array element 20, a driver IC 30, a microlens array element 40, a lens array element holder 50, and a spacer 60.

  The housing 10 includes a rectangular plate member 11 and a U-shaped frame member 12. The plate member 11 has a laminated substrate structure in which, for example, a dielectric such as a resin and a copper foil for forming a wiring pattern are alternately laminated, for example, five layers. The frame member 12 has a structure of a laminated substrate in which, for example, a dielectric such as a resin and a copper foil forming a wiring pattern are alternately laminated, for example, nine layers. The plate member 11 and the frame member 12 are joined by solder, Au bumps, or the like in the joining layer 13 so as to ensure the conduction of the wiring pattern between the plate member 11 and the frame member 12. By joining the plate member 11 and the frame member 12, an internal space 14, an element mounting surface 11 a, and a waveguide inlet 15 are formed in the housing 10. The internal space 14 has an opening 14 a on the board mounting surface 12 a opposite to the surface joined to the plate member 11 of the frame member 12, and is surrounded by the frame member 12. The element mounting surface 11 a is the surface of the plate member 11 to which the frame member 12 is not joined, and constitutes a part of the inner surface of the internal space 14. The waveguide introduction port 15 is formed by the opening of the frame member 12 on the side surface intersecting with the substrate mounting surface 12 a and is connected to the opening 14 a and the internal space 14.

  A recess 11ab for mounting the IC driver 30 is formed on the element mounting surface 11a. On the substrate mounting surface 12a, a land grid array is formed in which planar electrode pads 16 having a diameter of 450 μm, for example, are arranged in a grid pattern with a pitch of 1 mm, for example. The planar electrode pad 16 includes, for example, a planar electrode pad 16a for power supply, a planar electrode pad 16b for differential high frequency signal, a planar electrode pad 16c for ground, and a planar electrode pad 16d for control signal. In the figure, the same type of planar electrode pads are indicated by the same type of hatching.

  The housing 10 has three guide holes 17 for alignment that are formed so as to penetrate from the frame member 12 to the plate member 11. The guide holes 17 are arranged so as to form an isosceles triangle in FIG.

  The VCSEL array element 20 that is an optical element is an element in which a plurality of (for example, 12) VCSEL elements are arranged in a one-dimensional array, and is mounted in the vicinity of the recess 11ab of the element mounting surface 11a. The IC driver 30 which is an electronic element is for driving the VCSEL array element 20 and is mounted in the recess 11ab of the element mounting surface 11a. The microlens array element 40 is arranged corresponding to the VCSEL array element 20, and for example, twelve microlenses corresponding to the number of VCSEL elements of the VCSEL array element 20 are arranged in a one-dimensional array. It is a configured element. Each microlens of the microlens array element 40 receives and collects the laser light signal output from each VCSEL element, and realizes predetermined optical coupling with, for example, an external optical component. The microlens array element 40 is made of a light-transmitting material with respect to light emitted from the VCSEL array element such as glass such as quartz glass or resin.

  The lens array element holder 50 holds the microlens array element 40 through the holding hole 52 so that the optical axis of each microlens of the microlens array element 40 coincides with the optical axis of each corresponding VCSEL element of the VCSEL array element 20. . The lens array element holder 50 has guide holes 53 that are formed on both sides of the holding holes 52 and serve as alignment guide mechanisms. By using the guide hole 53, the MT type optical connector can be fitted into the optical module 100, and the characteristics of the optical module 100 can be easily tested. The MT type optical connector refers to an optical connector having guide pin holes into which fitting pins can be inserted at both ends of a connection end face, and an optical fiber arranged between them, like an MT connector defined in JIS C5981.

  The spacer 60 is interposed between the element mounting surface 11 a of the plate member 11 and the lens array element holder 50. When the thickness of the spacer 60 is changed, the distance between the microlens array element 40 and the VCSEL array element 20 changes. Accordingly, the condensing position of the laser light emitted from the VCSEL array element 20 through the microlens array element 40 also changes. Accordingly, it is possible to correct so as to reduce the variation in the distance from the substrate mounting surface 12a to the condensing point of the microlens array element 40, which is caused by the height tolerance of the internal space 14 of the housing 10. The lens array element holder 50 is chamfered so that a part of the side surface 54 facing the frame member 12 is inclined with respect to the main surface. The lens array element holder 50 and the spacer 60 are preferably made of a metal material having high thermal conductivity such as copper.

  The alignment between the VCSEL array element 20 and the microlens array element 40 is performed by observing the state of light transmitted through the microlens array element 40 in a state where the VCSEL array element 20 is operated to output laser light. Can be performed by so-called active alignment. The observation of the state of the light transmitted through the microlens array element 40 may be performed using, for example, a microscope, or the MT connector of a known optical fiber array with an MT connector is opposed to the microlens array element 40. The intensity of the laser beam output from the optical fiber array may be measured. In this embodiment, the MT connector is used for explanation, but any optical fiber built-in member having a positioning structure can be used. The guide hole 53 is provided for positioning with the MT connector for evaluation via the guide pin. In this case, if the guide pin is inserted into the guide hole of the MT connector and the guide hole 53 of the lens array element holder 50, the MT connector can be easily fitted to the lens array element holder 50. Thus, the MT connector and the microlens array element 40 can be aligned with high accuracy, and the characteristics of the optical module 100 can be easily evaluated. Thereby, active alignment with higher positional accuracy is realized.

  FIG. 4 shows an example of another optical module configuration. In the figure, 100A is an optical module, 10A is a package, 18 is a waveguide (optical fiber), 20 is an optical element, and 19 is an optical connector. Here, the waveguide 18 is an optical fiber bent at 90 degrees, but the optical path may be bent by a 90-degree bending mirror or the like. The 90-degree bent optical connector 19 and the package 10A are fixed with an adhesive R so as to be optically connected.

  FIG. 5 is a diagram illustrating an optical module mounted on a circuit board. When the optical module 100 is mounted on the circuit board 200, for example, a known flip chip bonder can be used. In this case, the back surface of the optical module 100 is attracted and lifted by the head of the flip chip bonder, the optical module 100 is moved to a predetermined position on the circuit board 200 and mounted, and heat is transferred from the head through the housing 10. Is applied to each planar electrode pad 16 of the optical module 100 and the electrode pad on the circuit board 200 by soldering. Thereby, the optical module mounting circuit board 1000 on which the optical module 100 is mounted is completed.

  An organic optical waveguide 210 is mounted on the circuit board 200 by adhesion. One end of the organic optical waveguide 210 is processed into a wedge-shaped wedge portion 211. The VCSEL array element 20 is electrically connected to the IC driver 30 by bonding wires 101. The IC driver 30 is electrically connected to an electrode pad (not shown) on the element mounting surface 11a by a bonding wire 102. Further, as shown by the electrical path DL, the electrode pads are formed on the circuit board from the wiring pattern formed on the element mounting surface 11a via the plate member 11, the bonding layer 13, the frame member 12, and each planar electrode pad 16. It is electrically connected to 200 wiring patterns.

  The organic optical waveguide 210 is introduced into the internal space 14 from the waveguide introduction port 15, so that it does not physically interfere with the optical module 100. Further, the organic optical waveguide 210 is not physically interfered with the microlens array element 40 and the lens array element holder 50 by appropriately setting the thickness of the frame member 12. At this time, the waveguide inlet 15 may be closed with grease or resin so that dust or the like does not enter the internal space 14.

  When the optical module 100 is used, the IC driver 30 is supplied with a power supply voltage, a differential high-frequency signal, a control signal, and the like from the circuit board 200 via the planar electrode pad 16. The VCSEL array element 20 is driven by the IC driver 30 and outputs a laser light signal L having a wavelength of 1.1 to 1.5 μm including a differential high-frequency signal from each VCSEL element. Each microlens of the microlens array element 40 receives the laser light signal L output from each VCSEL element, and condenses the laser light signal L on the organic optical waveguide 210 from above the organic optical waveguide 210. The wedge portion 211 reflects the collected laser light signal L and couples it to the organic optical waveguide 210. The organic optical waveguide 210 transmits the laser light signal L to, for example, another circuit board.

  As described above, the spacer 60 has a variation in the distance from the substrate mounting surface 12a to the condensing point of the microlens array element 40 caused by the effect of suppressing the deformation of the plate member 11 and the tolerance of the thickness of the frame member 12. As a result, a suitable coupling of the laser light signal L to the organic optical waveguide 210 is realized.

  Here, the circuit board 200 has substantially the same configuration as that of the optical module 100, but a photodiode array element as a light receiving element is mounted instead of the VCSEL array element 20, and a transimpedance amplifier is replaced instead of the IC driver 30. And a receiving optical module on which a limiting amplifier and the like are mounted. The receiving optical module can receive a laser light signal transmitted from another circuit board through another organic optical waveguide. This realizes optical interconnection between boards.

  In the optical module mounting circuit board described above, the light condensing position of the microlens array element 40 and the optical coupling between the organic waveguide 210 and the organic waveguide 210 determine the approximate position of each other, and then the light from the element 20 is organically guided. The light was received by the waveguide 210 and was determined by active alignment while observing the output of the detector connected to the other end of the organic waveguide 210.

Next, the optical module mounting system of the present invention will be described. FIG. 6 is a schematic perspective view of the mounting system according to the first embodiment. 7, 8, and 9 are a side view, a front view, and a plan view of FIG. 6, respectively.
As shown in FIGS. 6 to 9, the mounting system 2000 includes a circuit board 300 including electronic components for operating an optical module and the like, a socket 400, a lid 500, and an MT connector support member 600. FIG. 10 is a perspective view of the circuit board 300 and the socket 400. FIG. 11 is a perspective view of the MT connector support member 600. 12 is a partial cross-sectional view of FIG. FIG. 13 is a partial cross-sectional view of FIG. As shown in FIGS. 12 and 13, the mounting system 2000 further includes a spacer 700. The spacer 700 is made of a metal such as copper having rigidity.

  The circuit board 300 includes a wiring pattern 301 for supplying power and electric signals for driving the optical module 100 to the optical module 100, and an insertion hole 302 for inserting the MT connector C (FIG. 12, 13).

  The socket 400 is a frame that is placed on the circuit board 300 and is formed so as to accommodate the optical module 100. The socket 400 is provided with an opening 401, a placement part 402 for placing the optical module 100, and the circuit board 300. And four screw portions 403 that are inserted through through holes provided in. The mounting portion 402 is made of a dielectric material, for example, a resin such as polyetherimide. In the mounting portion 402, a pin 402a with a spring, which is a conductive member for ensuring electrical connection with the wiring pattern 301 of the circuit board 300, is incorporated as an interface (see FIGS. 12 and 13).

  The lid 500 includes four coiled springs 502 provided in an internal space 501 formed in the main body, a pressing plate 503 provided at the tip of the spring 502, and two latches provided on the front side. A structure 504 and a coiled spring 505 that biases the latch structure 504 are provided. The lid 500 is locked to the socket 400 when the latch structure 504 biased by the spring 505 engages the socket 400. The spring 502 and the pressing plate 503 constitute a pressing mechanism.

  The MT connector support member 600 protrudes from the plate-shaped main body, and supports four support columns 601 made of an elastic body such as rubber, and an MT connector C that is a light receiving member (optical coupling member) optically coupled to the optical module 100. An MT connector support hole 602 for introducing the MT connector C, an opening 603 for introducing the MT connector C into the MT connector support hole 602, and a nut 604. The support pillar 601 is provided with a through hole 601a. At this time, it is convenient that the width of the opening 603 has a size and a shape that allow an optical fiber tape connected to the MT connector C to be introduced in order to introduce the MT connector C from the side. In this embodiment, the support column 601 uses a member made of an elastic body. However, instead of this, a spring or the like may be inserted between the MT connector support member 600 and the circuit board.

  The MT connector support member 600 is disposed on the opposite side of the socket 400 with respect to the circuit board 300. The socket 400 and the MT connector support member 600 introduce the MT connector C into the MT connector support hole 602 from the opening 603 and insert the screw portion 403 of the socket 400 into the through hole 601a of the support column 601 with the circuit board 300 interposed. The nut 604 is screwed into the screw portion 403 and fixed to the circuit board 300.

  The MT connector C is connected to an external device.

  A step 602a is provided in the MT connector support hole 602 (see FIGS. 11 and 12). When the MT connector C is introduced into the MT connector support hole 602 from the opening 603, at least a part of the end of the MT connector C opposite to the optical connection end face is placed on the step 602a. The step 602a restricts the movement of the MT connector C downward in the drawing (in the direction away from the optical module).

  In addition, a spacer 700 having a height slightly lower than the support column 601 is inserted between the MT connector support member 600 and the circuit board 300 in a state where the MT connector C is inserted into the insertion hole 701 (nut 604). By tightening, the height of the support column 601 becomes substantially equal to the spacer). The spacer 700 is engaged with the thickened jaw portion of the MT connector C, and the upward movement of the MT connector C is restricted. Therefore, the upward and downward movement of the MT connector C is restricted by the step 602a and the spacer 700. The MT connector support member 600 and the spacer 700 constitute a height direction positioning mechanism of the MT connector C that is a light receiving member. That is, regarding the positioning of the optical coupling between the optical module and the MT connector in the optical axis direction, the position of the MT connector C is set with respect to the circuit board. At this time, the MT connector support member 600 and the spacer 700 are positioned in the vertical direction. However, if the size of the insertion hole 302 is determined so as to have some play on the side, the horizontal direction is determined. The optical axis can be adjusted, which is convenient.

  FIG. 14 shows a good example of the spacer. The spacer 700 </ b> A has a guide portion 703 and a plate portion 702. The guide portion 703 restricts insertion of the MT connector C. The plate portion 702 is in surface contact with the circuit board 300. It is convenient if the insertion hole 302 is 0.5 mm to 1 mm larger than the outer shape of the guide portion 703. As a result, the MT connector C can be moved in the plane, and horizontal alignment is further facilitated. The shape of the plate portion 702 may be a rectangle, a square, an ellipse, or the like. The shapes of the insertion hole 302 and the guide portion 703 are not limited to the present embodiment, and can be set as appropriate.

  An example of a process for mounting the optical module 100 on the mounting system 2000 will be described. First, the socket 400 is placed on the circuit board 300. Next, the MT connector C is introduced into the MT connector support hole 602 from the opening 603 of the MT connector support hole 602. Next, the MT connector C is inserted into the insertion hole 701 of the spacer 700, and the nut 604 is attached to the screw portion 403 of the socket 400 with the spacer 700 interposed between the MT connector support member 600 and the circuit board 300. The socket 400 and the MT connector support member 600 are fixed to the circuit board 300 by screwing.

  Next, the optical module 100 is mounted on the mounting portion 402 so that the substrate mounting surface 12 a contacts the mounting portion 402 and is accommodated in the socket 400. After that, after positioning the guide pin hole C1 of the MT connector C and the guide hole 53 of the optical module 100 while finely adjusting the MT connector C in the insertion hole 302, the fitting pin is inserted. Thereby, the relative position in the in-plane direction between the MT connector C and the optical module 100 with respect to the in-plane direction of the circuit board 300 is accurately positioned. That is, the guide pin hole C1 and the guide hole 53 constitute an in-plane direction positioning mechanism. In this embodiment, the case where the guide pin is inserted later is illustrated, but the position of the optical module 100 and the position of the MT connector C may be finely adjusted using the MT connector C having the guide pin. Further, the guide pin hole C1 and the guide hole 53 are visually aligned from below in the insertion direction of the MT connector C without using the guide pin, or an alignment mark (not shown) provided on the optical connection surface of the optical module. Alignment marks (not shown) provided on the MT connector C may be aligned.

  Next, the latch structure 504 of the lid 500 is engaged with the socket 400, and the lid 500 is fixed to the socket 400. As a result, the pressing plate 503 is urged by the spring 502 to press the optical module 100 against the mounting portion 402. As a result, the height of the optical module 100 with respect to the circuit board 300 is fixed. The thickness of the optical module 100 varies within a tolerance range. By pressing with the spring 502 and the pressing plate 503, the optical module 100 is pressed with a stable pressure regardless of the variation in the thickness of the optical module 100. The In particular, the pressure applied to the optical module 100 by the pressing plate 503 is uniform, which is preferable. In this embodiment, an example is shown in which the lid is fixed after the horizontal positioning. However, the present invention is not limited to this, and the lid 500 may be fixed to the socket before the horizontal positioning.

  At this time, the pin 402 a with a spring built in the mounting portion 402 is provided corresponding to the planar electrode pad 16 formed on the substrate mounting surface 12 a of the optical module 100. These spring-attached pins 402a ensure electrical connection between the wiring pattern 301 of the circuit board 300 and the planar electrode pad 16 of the optical module 100.

  That is, in this mounting system 2000, the optical module 100 is evaluated by securing the electrical connection between the circuit board 300 and the optical module 100 without permanently mounting the optical module 100 on the circuit board 300 by solder or the like. be able to. Further, since it can be easily removed, maintenance can be easily performed.

  Since the optical module 100 is combined with optical waveguides having various installation forms and structures in actual use, the height of the condensing position of the laser light emitted from the VCSEL array element 20 of the optical module 100 through the microlens array element 40. Are designed at different heights corresponding to the optical waveguides to be combined.

  In this mounting system 2000, the height direction positioning mechanism formed by the MT connector support member 600 and the spacer 700 is configured such that the end face height of the optical fiber arranged in the MT connector C and the condensing position of the microlens array element 40. The relative height is determined, and the light receiving surface of the MT connector C and the condensing position of the microlens array element 40 can be accurately matched in the height direction. Further, by changing to the MT connector support member 600 having the spacer 700 having a thickness corresponding to the height of the light collecting position of the microlens array element 40 and the support pillar 601 having the corresponding height, various installation forms and structures are possible. Since the height of the light receiving surface of the MT connector C can be accurately positioned with respect to the optical module 100 combined with the optical waveguide, the optical module 100 can be applied to a plurality of optical modules. Furthermore, when an elastic body is used for the spacer 700, the relative distance between the circuit board and the connection end face of the MT connector C can be changed. According to this embodiment, the connection end face of the MT connector C and the optical module do not come into contact with each other, so that even when an unexpected force is applied to the MT connector, the optical module is prevented from being damaged by the force.

  Further, the optical module mounting system of the present embodiment is optimal for use as an optical module evaluation kit because the optical module can be easily removed. In this case, the MT connector C is connected to an external device of a transmission characteristic evaluation apparatus that evaluates the transmission characteristics (bit error rate, jitter, etc.) of the optical module 100 via an optical fiber multicore cable.

  As an example of a specific evaluation method, a power supply voltage, a differential high-frequency signal, a control signal, and the like are supplied from the wiring pattern 301 of the circuit board 300 to the optical module 100 via the planar electrode pad 16, and the optical module 100 is actually used. Operate in a state close to. The laser light signal L output from the optical module 100 is received by the MT connector C, and the laser light signal L is transmitted to the transmission characteristic evaluation device via the optical fiber multi-core cable. Evaluate with.

  As described above, according to the mounting system 2000 according to the first embodiment, the optical coupling member can be easily aligned through the insertion hole 302, so that productivity is improved. Further, since the optical module can be positioned and fixed with high precision without being mounted on the circuit board 300 by soldering or the like, the maintainability is also improved. Furthermore, if the mounting system 2000 of this embodiment is used for an evaluation kit, the optical module 100 can be accurately evaluated including high-frequency characteristics.

(Embodiment 2)
FIG. 15 is a partial cross-sectional view of the mounting system according to the second embodiment. In the mounting system 2000A according to the second embodiment, the MT connector C is replaced with the waveguide support member 620 in the mounting system 2000 according to the first embodiment, and the optical module 100 is optically coupled to the upper portion of the waveguide support member 620. An organic optical waveguide W that is a light receiving member (optical coupling member) is added. FIG. 16 is a schematic diagram of the waveguide support member 620 and the organic optical waveguide W. In this embodiment, the waveguide support member 620 disposed only in the vicinity of the optical coupling portion is shown. However, a longitudinal shape along the lower surface of the organic optical waveguide W may be used.

  One end of the organic optical waveguide W is formed at 45 degrees and processed into W1. The waveguide support member 620 and the organic optical waveguide W are bonded with an adhesive or the like. The waveguide support member 620 has a guide hole 620A. The organic optical waveguide W is connected to a transmission characteristic evaluation apparatus via an optical fiber multicore cable.

  In this mounting system 2000, the organic optical waveguide W is positioned in the height direction by the waveguide support member 620 as in the first embodiment. The horizontal positioning is performed by fine adjustment in the opening 602 so that the guide hole 620A and the guide pin hole provided in the optical module are adjusted by the guide pin.

  As described above, according to the mounting system 2000A according to the second embodiment, the optical coupling member can be easily aligned through the insertion hole 302, so that productivity is improved. Further, since the optical module can be positioned and fixed with high precision without being mounted on the circuit board 300 by soldering or the like, the maintainability is also improved. Furthermore, if the mounting system 2000 of this embodiment is used for an evaluation kit, the optical module 100 can be accurately evaluated including high-frequency characteristics.

  In the mounting systems 2000 and 2000A according to the first and second embodiments, the socket 400 and the lid 500 are mounted on the circuit board by using a fixing method using screws or the like without using the latch structure. You may comprise the circuit board actually used. Further, in applications where the convenience of replacing the optical module is unnecessary, a means for fixing the optical module directly to the circuit pattern provided on the circuit board without using a socket or a lid may be taken.

  FIG. 15 is a schematic diagram of a circuit board on which an optical module is mounted using components of the mounting system. An optical module mounting circuit board 3000 shown in FIG. 15 is configured by mounting the optical module 100 on the circuit board 200 shown in FIG. 4 using a socket 400 and a lid 500. Since the mounting system according to the first and second embodiments can evaluate an optical module in a state close to actual use, it can be used when the optical module is mounted on a circuit board actually used. Such an optical module mounting circuit board 3000 is a circuit board suitable for long-term use since the optical module 100 can be easily replaced.

  In the optical module mounting circuit board 3000 shown in FIG. 15, an organic optical waveguide 210 </ b> A having guide holes 211 </ b> A as shown in FIG. 16 may be used instead of the organic optical waveguide 210. In this organic optical waveguide 210, the relative position between the organic optical waveguide 210A and the optical module 100 in the surface direction of the circuit board 200 is determined by inserting a fitting pin into the guide hole 211A and the guide hole 53 of the optical module 100. Accurate positioning.

  Further, the springs 502 and 505 provided in the lid 500 are not limited to coil-like ones, and may be leaf springs, for example. Further, it is preferable that the pressing plate 503 is made of a material having high thermal conductivity such as aluminum because heat generated during operation of the optical module 100 can be dissipated.

  Moreover, it is good also as a structure which does not have a mounting part for a socket. In this case, instead of the pin as the conductive member, a solder ball having a substantially uniform height is used as a member for ensuring electrical connection between the planar electrode pad 16 of the optical module 100 and the wiring pattern 301 of the circuit board 300. What was arrange | positioned on 301 may be used. Alternatively, an anisotropic conductive film may be disposed between the optical module 100 and the circuit board 300. When the anisotropic conductive film is pressed by the planar electrode pad 16 protruding from the substrate mounting surface 12a, conductivity is generated only in the pressed portion. Therefore, only the opposing planar electrode pad 16 and the wiring pattern 301 are conducted, and the planar electrode pad 16 and the wiring pattern 301 that are not opposed, the planar electrode pads 16, and the wiring pattern 301 are not conducted.

  Moreover, it is good also as a structure which provided the coil-shaped or plate-shaped spring instead of the support pillar in MT connector support member.

  In the first embodiment, a spacer may be disposed between the lens array element holder 50 of the optical module 100 and the MT connector C. Further, instead of the MT connector C, other types of optical connectors may be used.

  In addition, the mounting system according to the above embodiment can be a receiving optical module. In this case, the MT connector C and the organic optical waveguide W are connected to the array signal light source via an optical fiber multi-core cable as a light emitting member (optical coupling member) optically coupled to the receiving optical module. The receiving optical module receives an optical signal from the array signal light source and outputs an electrical signal. It is possible to use this system as an evaluation kit as well, and when it is used, the output electric signal is transmitted to the transmission characteristic evaluation apparatus via the wiring pattern of the circuit board and the characteristic is measured. Thereby, the receiving optical module can be evaluated.

  In the first embodiment, instead of the MT connector C, a light receiving module including a photodiode array element and an amplifier may be directly arranged. In this case, the characteristics of the optical module 100 itself that does not include the characteristics of the MT connector C and the optical fiber multicore cable can be more accurately evaluated. If the optical module to be evaluated is a receiving optical module, a light emitting module including a VCSEL array element and an IC driver may be directly arranged instead of the MT connector C.

  In the circuit board, a ridge type optical waveguide such as a silicon fine wire waveguide, an optical fiber sheet, a PLC chip, or the like may be used instead of the organic optical waveguide to be optically coupled.

(Embodiments 3 and 4)
FIG. 19 is a schematic diagram of an optical module mounting circuit board according to the third embodiment. FIG. 20 is a schematic diagram of an optical module mounting circuit board according to the fourth embodiment.
The optical module mounting circuit boards 4000 and 5000 include the optical module 100, the circuit board 200, and the organic waveguide 210. The difference between the optical module mounting circuit boards 4000 and 5000 according to the third and fourth embodiments and the optical module mounting circuit boards of the first and second embodiments is that in the first and second embodiments, the optical module is a circuit via a socket. Although mounted on the substrate, in the third and fourth embodiments, the optical module 100 is directly fixed and electrically connected to the wiring pattern 201 on the circuit substrate 200 by soldering or the like. The difference is that the organic waveguide 210, which is a member, is fixed directly to the circuit board 200 by adhesion or the like (via a spacer if necessary). The difference between the third embodiment and the fourth embodiment is an optical coupling member. The organic waveguide 210 is fixed on the circuit board between the optical module and the circuit board, or the organic waveguide 210 is the lower surface of the circuit board. However, the difference is whether the circuit board is configured to be sandwiched between the optical module and the organic waveguide. According to these methods, after the optical module 100 is fixed, the organic waveguide 210 in the horizontal direction on the surface of the circuit board 200 is visually observed from the opening 202 provided in the same shape as the insertion hole 302 of the circuit board 300. By aligning the alignment mark (not shown) provided on the optical module and the alignment mark (not shown) provided on the optical module together, it is possible to easily perform precise positioning of the optical coupling, thereby improving productivity. To do. As the alignment mark, a method of using the above-described guide pin hole or a method of matching the outer diameter of the organic waveguide with the mark provided on the optical module can be used. In the third and fourth embodiments, the optical module may be fixed so as to be electrically removable using a socket instead of soldering.

  As shown in FIGS. 19 and 20, the opening 202 is conveniently a through-hole provided in the circuit board 200, but an optical window in which an optical glass 203 or the like is embedded in the hole may be used. In addition, an optical via or a spot size conversion mechanism in which a lens is embedded may be provided.

  Also in this embodiment, the optical coupling member is not limited to the organic waveguide 210, and may be a planar waveguide such as a PLC or a 90-degree bent optical connector having a connection end face on the optical module side.

  In the first to fourth embodiments, after positioning in the horizontal direction, further alignment is performed by performing active alignment while viewing the output of a photodetector provided at the other end of the organic waveguide or the like. You can also

  It is most convenient if the openings 302 and 202 are provided in the vicinity of the optical coupling part. However, if the relative positions of the optical module and the optical coupling member can be adjusted through the opening, the openings 302 and 202 are provided in the vicinity of the optical coupling part. Also good.

  Further, the present invention is not limited by the above embodiment. What was comprised combining each component mentioned above suitably is also contained in this invention. Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspect of the present invention is not limited to the above-described embodiment, and various modifications can be made.

DESCRIPTION OF SYMBOLS 10 Housing | casing 11 Plate member 11a Element mounting surface 11ab Recessed part 12 Frame member 12a Board mounting surface 13 Bonding layer 14,501 Internal space 14a, 401, 603 Opening 15 Waveguide introduction port 16, 16a, 16b, 16c, 16d Planar electrode pad 17, 53, 211A, 701A Guide hole 20 VCSEL array element 30 IC driver 40 Micro lens array element 50 Lens array element holder 52 Holding hole 54 Side surface 60, 700, 70A Spacer 100 Optical module 101, 102 Bonding wire 200, 300 Circuit board 210, 210A, W Organic optical waveguide 211, W1 Wedge part 301 Wiring pattern 302, 701 Insertion hole 400 Socket 402 Mounting part 402a Pin 403 Screw part 500 Lid 502, 505 Spring 503 Pressing plate 50 Latch structure 600 MT connector support members 601 support posts 601a through hole 602 MT connector support hole 602a stepped 604 nut 4000, 5000 optical module mounting circuit board 2000,2000A mounting system C MT connector C1 guide pin holes DL electric path L laser light signal

Claims (14)

An optical module for emitting or receiving optical signals;
An optical coupling member optically coupled to the optical module;
The optical module and the optical coupling member are mounted, the main surface has an opening, and a circuit board that is electrically connected to the optical module,
An optical module-mounted circuit board, wherein at least the main surface of the circuit board is positioned in the horizontal direction through the opening between the optical module and the optical coupling member.   The optical module mounting circuit board according to claim 1, wherein the horizontal positioning is performed by combining positioning means provided in the optical module and the optical member.   3. The optical module mounting circuit board according to claim 2, wherein the horizontal positioning means has a fitting structure of a guide pin and a guide pin hole.   4. The optical module mounting circuit board according to claim 1, further comprising fixing means for positioning a vertical height of the optical connection portion of the optical coupling member with respect to the circuit board. 5. .   The fixing means is disposed on the opposite side to the optical module with respect to the circuit board and receives the optical coupling member on the circuit board side, and an optical coupling member support member for pressing and supporting the optical coupling member on the circuit board. The optical module mounting circuit board according to claim 4, wherein the optical coupling member is fixed to a support portion.   The optical coupling member has a jaw part, and the optical coupling support member is a plate with an elastic body interposed between the circuit board and the circuit board so as to press the jaw part of the optical coupling member toward the connection part side, and The optical module mounting circuit board according to claim 5, wherein the part is a member having rigidity so as to be sandwiched between the jaw part and the circuit board.   The optical module mounting circuit board according to any one of claims 1 to 6, wherein the optical module is fixed by soldering to a circuit pattern provided on the circuit board.   The optical module mounting circuit board according to claim 1, wherein the optical module is electrically detachably fixed to a circuit pattern provided on the circuit board. .   The optical module mounting circuit board according to claim 8, wherein the optical module is detachable by being incorporated and fixed in a socket provided on the circuit board.   The optical module mounting circuit board according to claim 9, wherein the optical module is pressed and fixed by a lid in the socket.   The optical module mounting circuit board according to any one of claims 8 to 10, wherein the electrical interface comprises a pin with a spring or an anisotropic conductive film.   The optical module mounting circuit board according to any one of claims 1 to 4, or 7 to 11, wherein an optical glass, a lens, or a spot size converting means is provided in the opening. .   A communication system comprising the optical module mounting circuit board according to any one of claims 1 to 12.   An optical module evaluation kit system comprising the optical module mounting circuit board according to claim 1 for evaluating an optical module.

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