JPH09298257A - Semiconductor package connecting socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor package connecting socket which reliably obtains electrical connection and excellent high-frequency characteristic. SOLUTION: A chambering concave member 31, which removably contains a semiconductor package 10, is formed in a socket main body 30. An anisotropic conductive sheet 36 is provided at a bottom opening of the chambering concave member 31 such that the anisotropic conductive sheet 36 can be in contact with a lead 12 of the semiconductor package 10. The socket main body 30 is positioned with a positioning pin 33, and fixed on a circuit board 20 with a bolt or the like, so that the anisotropic conductive sheet 36 is in contact with an electrode terminal 21 of the circuit board 20. Claws 41a of claw members 41 are engaged with concaves 37 at both ends of the socket main body 30, so as to attach a cover 40 to the socket main body 30. An intermediate member 50 where a press member 52 which can press the lead 12 of the semiconductor package 10 is inserted between the cover 40 and the socket main body 30. Then, the press member 52 presses the lead 12 into contact with the anisotropic conductive sheet 36.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package connecting socket used as a semiconductor package inspection jig or the like, and more particularly to a semiconductor package connecting socket suitable for connecting a surface mount type semiconductor package and a circuit board. .

[0002]

2. Description of the Related Art Generally, an IC socket is used for connecting a semiconductor package to an IC inspection board or a circuit board. As such an IC socket, conventionally, a loading portion into which a semiconductor package can be loaded is formed in a socket body, an electrode terminal is formed in the loading portion, and a lead or a lead connected to the electrode terminal by a lead wire is provided on the bottom or side of the body. It is known that a pin is fixed and a lid member that opens and closes the surface side opening of the loading section is attached by a hinge or the like.

In such an IC socket, when the opening of the loading portion is closed by a lid member, the semiconductor package loaded in the loading portion is pressed from the front side by the lid member, and the electrodes of the semiconductor package are connected to the leads and pins in the loading portion. An elastic member such as rubber or a spring is provided on the back side of the lid member so as to be in pressure contact with the lid member, and the elastic member is used to elastically press the semiconductor package against the lead or pin in the loading portion. Such an IC socket is provided with a lead on the side of the main body by connecting the lead to the circuit board by soldering, and for an IC socket provided with a pin on the bottom of the main body, the pin is a through of the circuit board. It is attached to the circuit board by inserting through the hole and connecting.

[0004]

However, in the above-mentioned conventional IC socket, it is necessary to provide an electrode terminal in a mounting portion of the main body and a lead or a pin outside the main body. There is a problem that assembly is complicated. In addition, this conventional IC socket has a problem that soldering to a circuit board is indispensable and the number of steps is increased. In particular, when pins are provided, through holes must be formed in the circuit board. Also, there is a problem that the design of the circuit board becomes complicated.

Further, in this conventional IC socket, a strong insertion / removal force is required when attaching / detaching a semiconductor package having pins arranged on the bottom, for example, PGA.
There is also a problem that the attachment / detachment work is complicated, and the semiconductor package is damaged when attaching / detaching. Furthermore, in this conventional IC socket, a spring or rubber is provided on the bottom of the loading portion of the main body or on the back side of the lid member to stabilize the connection between the leads or electrode terminals of the semiconductor package and the leads or pins in the loading portion. Since it is indispensable to achieve this, there is also a problem that the connection distance between the electrode of the semiconductor package and the electrode of the circuit board becomes long and the high frequency characteristics deteriorate.

Further, in the above-mentioned conventional IC socket, when the semiconductor package is loaded into the loading portion of the socket body and the opening of the loading portion is closed by the lid member attached by the hinge or the like, the IC package faces from the hinge side to the other side. Since the pressing force gradually acts on the electrodes, the pressing load is not evenly distributed to all the electrodes of the semiconductor package, and there is a problem that the connection reliability is poor. This invention has been made in view of the above problems, can be easily manufactured with a small number of parts, does not require soldering to a circuit board, can easily design a circuit board, and can reduce the pressing force of a semiconductor package. It is an object of the present invention to provide a semiconductor package connecting socket that can adjust strength and balance and can obtain excellent high frequency characteristics.

[0007]

To achieve the above object, the present invention relates to a semiconductor package connecting socket for connecting a lead of a semiconductor package having leads extending laterally and an electrode terminal of a circuit board. A socket body in which a loading recess is formed to allow the semiconductor package to be positioned and detachably mounted, is positioned and attached to the circuit board by a positioning member, and an opening is formed in at least a part of the bottom of the loading recess. With the opening facing the circuit board, a plurality of conductive linear bodies are obliquely penetrated in a thickness direction in a sheet body made of an insulating rubber elastic material to form an anisotropic conductive sheet, The anisotropic conductive sheet is placed in the opening of the loading recess of the socket body so that the leads of the semiconductor package in the loading section can come into contact with the electrode terminals of the circuit board. And a lid member that locks the front side portion of the socket main body at at least two opposing positions of the opening of the loading concave portion to close the front side opening of the loading concave portion, and the lid member and the socket main body. The intermediate member is interposed between the intermediate member and the lid member, the intermediate member having a pressing portion that contacts the lead of the semiconductor package in the loading portion and presses the lead toward the anisotropic conductive sheet,
A biasing member that elastically biases the intermediate member toward the anisotropic conductive sheet when the lid is closed is provided.

In the semiconductor package connecting socket according to claim 1, the intermediate member is provided with a recess corresponding to the thickness of the lead at a portion of the tip of the pressing portion that comes into contact with the lead (claim 2). Can be configured.

According to a third aspect of the present invention, there is provided a semiconductor package connecting socket for connecting an electrode terminal of a semiconductor package having a plurality of electrode terminals provided on its back surface to an electrode terminal of a circuit board, the semiconductor package connecting socket comprising: A socket main body having a loading recess that allows the package to be positioned and detachably mounted is positioned and attached to the circuit board by a positioning member, and an opening is formed in at least a part of the bottom of the loading recess to form the opening. The anisotropic conductive sheet is formed by obliquely penetrating a plurality of conductive linear bodies in a thickness direction through a sheet body made of an insulating rubber elastic material while facing the circuit board. A conductive sheet is provided in the opening of the loading recess of the socket body so that the electrode terminals of the semiconductor package in the loading section can contact the electrode terminals and the electrode terminals of the circuit board. Together, a lid member for closing the front opening of the loading recess engages in two places at least opposite the opening of said loading recess on the front portion of the socket body,
A pressing portion is interposed between the lid member and the socket body and contacts the surface of the semiconductor package in the loading portion to press the electrode terminal on the back surface of the semiconductor package toward the anisotropic conductive sheet. And an urging member that is provided on the lid member and elastically urges the intermediate member toward the anisotropically conductive sheet when the lid is closed.

Further, in the semiconductor package connecting socket according to the above-mentioned claim 1 and claim 3, the plurality of biasing members are provided, and the plurality of biasing members are used as the cover member and the shape of the intermediate member. In a mode (claim 4) in which they are arranged in a corresponding array, and a mode in which the biasing member is attached to the lid member so that the biasing direction position can be adjusted (the biasing force of the biasing member can be adjusted). It can be configured in claim 5).

[0011]

In the semiconductor package connecting socket according to the present invention, the socket body is positioned by the positioning member and attached to the circuit board by bolts or the like, and the electrical characteristics of the semiconductor package loaded in the loading recess and the electrode terminals of the circuit board are set. Since the connection is obtained by the anisotropic conductive sheet, it is not necessary to assemble fine parts such as leads to the socket body,
Achieved with a small number of parts and a simple structure.
It is easy to attach to a circuit board because soldering is not required.

Further, when the loading recess is covered with the lid member after the semiconductor package is housed in the loading recess of the socket body, the semiconductor package in the loading recess has leads (claim 1) or electrode terminals on the back surface (claim 3). ) Is pressed by the pressing portion of the intermediate member that is urged by the urging member and is pressed against the anisotropic conductive sheet, and the leads and the electrode terminals are electrically connected to the electrode terminals of the circuit board through the anisotropic conductive sheet. Therefore, electrical continuity can be reliably obtained, and a short connection distance and excellent high frequency characteristics can be obtained. Since the lid member is locked to the socket body at two opposite positions of the opening of the loading recess to cover the loading recess, that is, since a hinge or the like is not used to support the lid member, the intermediate member and the semiconductor package The contact pressure can be made uniform, and all leads (electrode terminals) can be surely conducted.

In the semiconductor package connecting socket according to a second aspect of the present invention, since the stepped concave portion is formed in the contact portion of the pressing portion of the intermediate member with the lead, the anisotropic conductive sheet is locally excessively large. It is possible to prevent the force from acting. Further, since the semiconductor package connecting socket according to claim 4 is provided with a plurality of biasing members and arranged according to the shape of the semiconductor package, the contact pressure between the intermediate member and the semiconductor package can be made more uniform. In the semiconductor package connecting socket according to the item 5, since the biasing force of the biasing member is adjustable, an appropriate pressing force can be selected for each semiconductor package, and higher reliability can be obtained.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 show a semiconductor package connecting socket according to a first embodiment of the invention described in claim 1, FIG. 1 is an exploded perspective view, FIG. 2 is a sectional view in an exploded state, and FIG. 4A is a plan view of the socket body, FIG. 4A is a plan view of the intermediate member, and FIG. 4B is a sectional view of the intermediate member.
5A is an enlarged cross-sectional view of the main part, and FIG. 5B is a cross-sectional view showing another aspect of the main part.

In the figure, 10A is a square plane type (QFP (Quad
Flat Pack-type) semiconductor package, 20 is a circuit board, 30 is a socket body, 40 is a lid member, and 50 is an intermediate member. As is well known, in the semiconductor package 10A, a plurality of leads (electrode terminals) 12 are provided at a predetermined pitch on each of four sides of a square plate-shaped mold portion 11. These leads 12 extend laterally from the mold part 11,
The tip portion is bent into a substantially hook shape, and the tip portion is the mold portion 11
Extends parallel to.

The circuit board 20 is formed by etching or the like in which a plurality of electrode terminals 21 are separated into four groups of rectangular four sides corresponding to each side in a rectangular area on the surface corresponding to a loading recess described later of the socket body 30. Further, the mounting holes 22 are formed at the corners of the rectangular area, and the positioning holes 23 are formed at the center positions on the pair of opposing sides. Electrode terminal 2
1 has a linear shape with a predetermined length and is arranged in parallel in each group.

The socket body 30, the lid member 40, and the intermediate member 50 are made of epoxy resin, acrylic resin, polyester resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, or the like by injection molding or cutting of resin blocks. It is formed by processing. The socket body 30 has a rectangular frame plate shape in which a substantially rectangular loading concave portion 31 penetrating the front and back is formed. Protrusions described below are formed at the four corners of the loading recess 31, and an opening 31a (see FIG. 3) is formed between these protrusions. The spacing between the opposing side walls of the loading recess 31 is substantially equal to the dimension between the tips of the leads 12 on the opposite sides of the mold portion 11 of the semiconductor package 10A, and these side walls function as a positioning surface to position the semiconductor package 10A. And detachably accommodate.

Mounting holes 32 are formed at the four corners of the socket body 30, and two positioning pins 33 are planted on the back surface (surface on the side of the circuit board 20) of a pair of opposite sides. A lid locking recess 37 is formed on the outer side. Bolts for mounting the socket body 30 on the circuit board 20 are inserted into the mounting holes 32, the positioning pins 33 are fitted into the positioning holes 23 of the circuit board 20, and the socket body 30 is positioned by the positioning pins 33 and the mounting holes 32 and the circuit. The circuit board 20 is formed by bolts passing through the mounting holes 22 of the board 20.
Attached to. The lid locking recess 37 is formed by cutting out a rear surface side portion of an outer portion of the socket body 30, and a locking claw described later is locked when the lid member 40 is closed.

The socket body 30 has positioning protrusions 3 each having a square shape in plan view at the four corners of the loading recess 31.
4, stepped portions 35 (see FIG. 2) are formed at the four sides of the opening of the loading recess 31 on the back surface side. Each of the positioning protrusions 34 has a thickness substantially equal to that of the socket body 30, and the guide surface 34 is inclined toward the front side portions of the surfaces facing each other.
a is a positioning surface 34b that is perpendicular to the back side portion and extends approximately 90 degrees in the thickness direction at the corner toward the center of the loading recess 31.
A positioning notch 34c (see FIG. 3) having a square surface of 90 ° is formed. As will be described later, the guide surface 34a guides the lead 12 when the semiconductor package 10A is loaded, the alignment surface 34b defines the position of the lead 12, and the positioning notch 34c is fitted to a corner portion of the mold portion 11. The position of the mold part 11 is defined.

Furthermore, the socket body 30 is provided with strip-shaped anisotropic conductive sheets 36 on the four sides of the opening of the loading recess 31 on the back side. Anisotropically conductive sheet 36
Is bonded to the step portion 35 on the back surface with an adhesive or the like, contacts the electrode terminal 21 of the circuit board 20, and also contacts the lead 12 of the semiconductor package 10A loaded in the loading recess 31. Japanese Patent Application No. 7-164504 previously filed by the applicant
As described in the specification, etc., the anisotropic conductive sheet 36 has a front surface and a back surface formed by inclining a plurality of conductive linear bodies such as gold wires to a sheet body made of an insulating material having rubber elasticity at a predetermined angle. It is also possible that the conductive linear body is embedded by penetrating and protrudes from the front and back surfaces of the sheet body, and spherical terminal portions are formed on both ends of the projected conductive linear body by laser processing or the like.

The lid member 40 has a substantially rectangular flat plate shape, and the pair of side edges facing each other have substantially rectangular flat plate-like locking claws 41.
Is attached. The locking claw 41 has a substantially rectangular flat plate shape, and an intermediate portion thereof is rotatably supported by the support pin 42.
, And a claw portion 41a that can be engaged with the recess 37 of the socket body 30 described above is formed on the back surface side edge portion, and an anti-slip projection 41b is formed on the opposite side edge portion (front surface side edge portion). Each of the locking claws 41 is biased by a torsion spring 49 (see FIG. 1) provided around the support pin 42 in the direction in which the claw portion 41a approaches.

Further, the cover member 40 is provided with four spring pins (biasing members) 43 that penetrate the front and back sides and are screwed together so as to adjust the protruding length to the back side, and two guide pins 44 on the back side.
Is planted. The spring pin 43 is configured by accommodating a plunger biased by a spring in a shell body with a hexagonal hole screwed into the lid member 40, and the plunger is the intermediate member 5
The protrusion length of the plunger is adjusted by projecting 0 toward the back surface so that 0 can be pressed, and changing the screwing length of the shell using a wrench or the like. These spring pins 43 are used for the lid member 4
0 arranged at a predetermined interval, in other words, the intermediate member 5
It is arranged so as to evenly abut the 0 surface. The load exerted by the spring pins 43 on the intermediate member 50 is the anisotropic conductive sheet 36 and the leads 1 of the semiconductor package 10A.
It is preferable to set a value obtained by multiplying the contact area with 2 by 30 g to 250 g. Since the spring pin 43 may be a well-known spring pin or the like, description and illustration thereof will be omitted.

The guide pin 44 is made of a metal pin or the like,
The lid member 40 is symmetrically arranged on the back surface of the lid member 40 with an appropriate interval with respect to the intermediate member 50. These guide pins 44 are screwed into later-described guide holes of the intermediate member 50, and the intermediate member 50
The movement of the cover member 40 with respect to the cover member 40 is guided. Needless to say, the spring pins 43 and the guide pins 44 can be provided in a larger number.

As shown in FIG. 4, the intermediate member 50 is formed by integrally projecting four rectangular plate-shaped pressing portions 52 on the back surface of a rectangular flat plate-shaped flange portion 51, and as described above, injection molding or the like. Is molded in. The base portion 51 has a similar shape having a size larger than the opening of the loading recess 31, and guide holes 51a are formed in a pair of opposing side portions. Pressing part 52
Are inserted between the protrusions 34 in the loading recess 31 and the tips press the leads 12 of the semiconductor package 10A in the loading recess 31. In these pressing portions 52, the length (vertical) dimension L is equal to the distance between the outer surfaces of the leads 12 at both ends of each side of the semiconductor package 10A, and the width (width, thickness) dimension W is 0.1 mm to.
The height H is about 5 mm, and the flange 12 is formed to a value that does not contact the surface of the socket body 30 when the lead 12 is pressed.

Further, as shown in FIG. 5 (a), the pressing portion 52 has a notch 52a formed in a stepped shape in a predetermined range inside the tip surface. The notch 52a has a width f corresponding to the parallel portion of the tip of the lead 12 and a height d substantially equal to the thickness of the lead 12. As shown in FIG. 5B, the pressing portion 52 has a slightly larger width W so that the inner edge of the tip is chamfered 5 at an angle corresponding to the bent inclined portion of the lead 12.
It is also possible to form 2b.

In this embodiment, the socket body 30 is fixed to the circuit board 20 by the bolts inserted into the mounting holes 32 of the circuit board 20 and the mounting holes 22 of the circuit board 20, and the positioning pins 33 of the circuit board 20. The electrode terminal 2 of the circuit board 20 of the anisotropic conductive sheet 36 which is fitted into the positioning hole 23
1 is aligned with the anisotropic conductive sheet 36.
Contacts the electrode terminal 21. And the socket body 30
The semiconductor package 10A is positioned and loaded in the loading recess 31 of the
Comes into contact with the anisotropic conductive sheet 36, and the anisotropic conductive sheet 36
It is electrically connected to the electrode terminal 21 via.

Here, the socket body 30 is aligned with the circuit board 20 by the positioning pins 33,
The anisotropic conductive sheet 36 is attached to the circuit board by bolts that pass through the attachment holes 22 and 32, and its electrical connection is made.
Obtained by Therefore, it is not necessary to provide a lead or the like in the socket body 30, it is not necessary to form a through hole in the circuit board 20, and soldering is not required when mounting the socket body 30. For this reason, the structure of the socket body 30 can be simplified, its mounting is easy, and the manufacturing cost can be reduced.

When the semiconductor package 10A is loaded, the leads 12 of the semiconductor package 10A have the protrusions 3.
4 is guided by the guide surface 34a, and the alignment of the lead 12 is performed by the alignment surface 34b.
The alignment of 1 is made by the notch 34c. Therefore, the loading operation of the semiconductor package 10A is easy,
The number of inspection steps of the semiconductor package 10A is reduced.

Next, after placing the intermediate member 50 on the semiconductor package 10A in the loading recess 31 of the socket body 30, the lid member 40 is attached to the socket body 30 and the intermediate member 50 is attached to the semiconductor package 1 by the spring pin 43.
Press to the 0A side. Then, the semiconductor package 10A
The lead 12 is pressed by the pressing portion 52 of the intermediate member 50 and comes into pressure contact with the anisotropic conductive sheet 36. Therefore, the electrical connection between the leads 12 and the anisotropic conductive sheet 36 can be reliably obtained, and high reliability can be obtained.

Here, the lid member 40 is attached to the socket body 30 by engaging the claw portions 41a of the locking claws 41 on both sides with the recesses 37 of the socket body 30, and is also implanted in the lid member 40. The guide pin 44 is slidably inserted into the guide hole 51a of the intermediate member 50 to guide the movement of the intermediate member 50. Therefore, the force acting from each spring pin 43 to the intermediate member 50 is made uniform, and all the leads 12 are
The contact pressure with which the anisotropic conductive sheet 36 contacts is also made uniform.

In particular, in this embodiment, since the notch 52a is formed in a step shape on the tip surface of the pressing portion 52 of the intermediate member 50, the compressive load between the lead 12 of the semiconductor package 10A and the anisotropic conductive sheet 36 is increased. Is anisotropic conductive sheet 3
6 becomes substantially equal to the compressive load of the circuit board 20, variation in contact resistance is reduced, stable connection is obtained, and high reliability is achieved.

6 to 9 show a socket for connecting a semiconductor package according to a second embodiment of the invention described in claim 1, FIG. 6 is an exploded perspective view, FIG. 7 is a sectional view in an exploded state, FIG. 8 is a plan view of a socket body which is a main component, and FIG. 9 is a front view of an intermediate member which is another main component. In this embodiment and the embodiments described below, the same parts as those in the first embodiment described above are designated by the same reference numerals, and description and part of the drawings are omitted.

In the second embodiment, the SOP (Small O
1 shows a semiconductor package connecting socket applied to the utline package) type semiconductor package 10B. In the semiconductor package 10B, a plurality of leads 12 are provided on a pair of opposing sides of a mold part 11 having a rectangular (square) shape in plan view. The leads 12 bend like the QFP type semiconductor package 10A described above.

The socket main body 30 is provided with an anisotropic conductive sheet 36 at a pair of side edges facing each other at the bottom of the loading recess 31, and the dimension between the side walls on the anisotropic conductive sheet 36 side. Are formed to be slightly larger than the dimension between the tips of the leads 12 on both sides of the semiconductor package 10B. The circuit board 20 is provided with a plurality of electrode terminals 21 on opposite sides of the rectangular area.

In the intermediate member 50, the height H of the pressing portion 52A corresponding to the side without the leads 12 of the semiconductor package 10B and the height H of the pressing portion 52B pressing the leads 12 are different (difference δ). The pressing portion 52A has a height H such that the pressing portion 52B does not contact the bottom surface of the loading recess 31 when the pressing portion 52B presses the lead 12, and the length L is equal to the mold portion 11 of the semiconductor package 10B. It has

Also in the second embodiment, the semiconductor package 10B is placed in the loading recess 31 of the socket body 30.
After mounting the intermediate member 50 on the socket body 30 and closing the front side opening of the loading recess 31 with the lid member 40 on the intermediate member 50, the circuit board 2 of the socket body 30 is closed.
The mounting to 0 is easy because soldering or the like is not required, the structure of the socket body 30 can be simplified without the need to provide electrodes such as leads, and the loading of the semiconductor package 10B is also aligned by the protrusions 34. Because it is easy.

Then, in the state where the semiconductor package 10B is loaded in the loading recess 31, the intermediate member 50 serves as the lid member 4.
0 is urged by the spring pin 43 and the intermediate member 50
The pressing portion 52 presses the lead 12 of the semiconductor package 10B toward the anisotropic conductive sheet 36. Therefore, the electrical connection between the lead 12 and the anisotropic conductive sheet 36, that is, the connection with the electrode 21 of the circuit board 20 can be reliably obtained.

10 and 11 show a semiconductor package connecting socket according to an embodiment of the invention described in claim 2, FIG. 10 is an exploded perspective view, and FIG. 11 is a sectional view in an exploded state. In this embodiment, BGA (Ball G
A semiconductor package connecting socket used for a lid array type semiconductor package 10C. The semiconductor package 10C is provided with a plurality of spherical electrode terminals 17 arranged on the back surface of the mold portion 11, and the circuit board 20 is a socket. A plurality of electrode terminals 25 are provided in a corresponding rectangular area in an array corresponding to the electrode terminals 17 of the semiconductor package 10C.

The socket body 30 is formed with a loading concave portion 31 having a shape corresponding to the mold portion 11 of the semiconductor package 10C penetrating through the front and back, and a C chamfer 31f at the front opening edge of the through hole 31 at the time of loading. It is formed as a guide surface. The loading concave portion 31 has a cross-sectional shape corresponding to the mold portion 11 of the semiconductor package 10C, and the anisotropic conductive sheet 36 is provided on the entire rear surface side opening.

The intermediate member 50 has a substantially columnar pressing portion 52 integrally provided in the center of the back surface. The pressing portion 52 has a flat tip, and the molding portion 11 of the semiconductor package 10C.
It has a cross-sectional shape with a small size similar to the planar shape of. In the intermediate member 50, the pressing portion 52 has the semiconductor package 10
The semiconductor package 10C is pressed symmetrically against the surface of the mold portion 11 of C to the anisotropic conductive sheet 36.

Also in this embodiment, it is not necessary to provide electrodes such as leads, which are fine parts, on the socket body 30, and the socket body 30 can be attached to the circuit board 20 without soldering or the like. You can Therefore, the circuit board 20 can be easily mounted and the manufacturing cost can be reduced.

Since the semiconductor package 10C is guided by the chamfer 31f of the loading recess 31 when loading into the loading recess 31, loading is easy. Further, the semiconductor package 10C loaded in the loading recess 31 of the socket body 30 is pressed by the pressing portion 52 of the intermediate member 50 which is biased by the spring pin 43 of the lid member 40, and the electrode terminal 17 is anisotropic. The conductive sheet 36 is pressed. Therefore, the electrode terminals 17 of the semiconductor package 10C are
The electrical connection between the electrode terminal 25 of the circuit board 20 and the circuit board 20 can be reliably obtained.

12 and 13 show a semiconductor package connecting socket according to a second embodiment of the invention described in claim 2, and FIG. 12 is a perspective view showing a state where FIG. 12 is disassembled.
FIG. 3 is a cross-sectional view in a state where FIG. In this embodiment, P
1 shows a semiconductor package connection socket applied to a GA (Pin Glid Array) type semiconductor package 10D. The semiconductor package 10D is provided with a plurality of pin-shaped electrodes 18 arranged on the back surface of the mold portion 11.

Also in the second embodiment, the semiconductor package 10D can be easily loaded into the loading recess 31 and the loaded semiconductor package 10D can be moved to the intermediate member 50 by the spring pin 43 of the lid member 40. The pin-shaped electrode 18 and the electrode terminal 25 of the circuit board 20 can be reliably connected because they are pressed via the.

The above-mentioned FIGS. 10 and 11 (FIG. 12, 1
The semiconductor package connecting socket according to the embodiment of 3) can also be applied to an LGA (Land Glid Array) in which a plurality of dot electrodes are arranged on the back surface of the mold part.
In addition, PL can be changed only by changing the arrangement of the electrode terminals on the circuit board.
It can also be applied to CC (Plastic Leaded Chip Carrier).

Further, in each of the above-described embodiments, the intermediate member 50 and the lid member 40 are separated, but the intermediate member 5
0 can be assembled to the lid member 40 while allowing the displacement, and the intermediate member 50 can be assembled to the socket body 30 while allowing the displacement with guide pins or the like.
It is also possible to urge it with a tension spring or the like stretched between and.

[0047]

As described above, according to the semiconductor package connecting socket of the present invention, the socket body is provided with the loading recess for removably accommodating the semiconductor package, and the bottom opening of the loading recess is different. The anisotropic conductive sheet is provided so as to be able to contact the leads (electrode terminals) of the semiconductor package, the socket body is positioned by the positioning member, and attached to the circuit board with bolts or the like to bring the anisotropic conductive sheet into contact with the electrode terminals of the circuit board. The electrical connection between the semiconductor package loaded in the loading recess and the electrode terminal of the circuit board is obtained by the anisotropic conductive sheet. Therefore, it is not necessary to assemble small parts such as leads to the socket body, and it is possible to achieve with a small number of parts and a simple structure. Moreover, soldering etc. is not required when mounting to the circuit board, and mounting is easy. is there.

In the semiconductor package loaded in the loading recess of the socket body, the leads and the electrode terminals on the back surface are pressed by the pressing portion of the intermediate member that is biased by the biasing member and are pressed against the anisotropic conductive sheet. , The leads and the electrode terminals are electrically connected to the electrode terminals of the circuit board through the anisotropic conductive sheet.
Therefore, electrical continuity can be reliably obtained, and a short connection distance and excellent high frequency characteristics can be obtained. Since the lid member is locked to the socket body at two opposite positions of the opening of the loading recess to cover the loading recess, that is, since a hinge or the like is not used to support the lid member, the intermediate member and the semiconductor package The contact pressure can be made uniform, and all leads and electrode terminals can be surely conducted.

In the semiconductor package connecting socket according to a second aspect of the present invention, since the stepped concave portion is formed in the contact portion of the pressing portion of the intermediate member with the lead, the anisotropic conductive sheet is locally excessively large. It is possible to prevent the force from acting. Further, since the semiconductor package connecting socket according to claim 4 is provided with a plurality of biasing members and arranged according to the shape of the semiconductor package, the contact pressure between the intermediate member and the semiconductor package can be made more uniform. In the semiconductor package connecting socket according to the item 5, since the biasing force of the biasing member is adjustable, an appropriate pressing force can be selected for each semiconductor package, and higher reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing an exploded state of a semiconductor package connecting socket according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the socket for connecting the semiconductor package in a disassembled state.

FIG. 3 is a plan view of a socket body of the semiconductor package connecting socket.

FIG. 4 shows an intermediate member of the same semiconductor package connecting socket, in which a is a plan view and b is a sectional view.

FIG. 5 is a cross-sectional view enlarging a part of the intermediate member, showing a
Shows one embodiment and b shows the other embodiment.

FIG. 6 is a perspective view of a semiconductor package connecting socket according to a second embodiment of the present invention in a disassembled state.

FIG. 7 is a cross-sectional view of the same semiconductor package connection socket in a disassembled state.

FIG. 8 is a plan view of a socket body of the same semiconductor package connecting socket.

FIG. 9 is a side view of an intermediate member of the semiconductor package connecting socket.

FIG. 10 is an exploded perspective view of the semiconductor package connecting socket according to the first embodiment of the present invention.

FIG. 11 is a sectional view of the socket for connecting the semiconductor package in a disassembled state.

FIG. 12 is a perspective view of a semiconductor package connecting socket according to a second embodiment of the present invention in a disassembled state.

FIG. 13 is a cross-sectional view of the same semiconductor package connection socket in a disassembled state.

[Explanation of symbols]

 10A Semiconductor Package 10B Semiconductor Package 10C Semiconductor Package 10D Semiconductor Package 11 Molded Part 12 Lead (Electrode Terminal) 17 Electrode Terminal 18 Pin-Shaped Electrode 20 Circuit Board 21 Electrode Terminal 22 Mounting Hole 23 Positioning Hole 30 Socket Body 31 Loading Recess 32 Mounting Hole 33 Positioning pin 34 Positioning protrusion 34a Guide surface 34b Positioning surface 34c Positioning notch 35 Positioning pin 36 Anisotropic conductive sheet 37 Lid locking recess 40 Lid member 41 Locking claw 41a Claw 41b Non-slip projection 42 Support pin 43 spring pin (biasing member) 44 guide pin 50 intermediate member 51 flange part 51a guide hole 52 pressing part 52a notch

Claims (5)

[Claims] 1. A semiconductor package connecting socket for connecting a lead of a semiconductor package having leads extending laterally to an electrode terminal of a circuit board, wherein the semiconductor package is positioned and detachably mountable. The socket body in which the recess is formed is positioned and attached to the circuit board by a positioning member, and an opening is formed in at least a part of the bottom of the loading recess so that the opening faces the circuit board. A sheet body made of an elastic material is formed into an anisotropic conductive sheet by obliquely penetrating a plurality of conductive linear bodies in the thickness direction, and the anisotropic conductive sheet is formed in the opening of the loading recess of the socket body. The lead of the semiconductor package in the loading portion is provided in contact with the electrode terminal of the circuit board, and the front side portion of the socket body is provided. A lid member that locks at least two opposing openings of the loading recess to close the front opening of the loading recess; and a semiconductor in the loading unit that is interposed between the lid member and the socket body. An intermediate member having a pressing portion that contacts the lead of the package and presses the lead toward the anisotropically conductive sheet; and the lid member, the intermediate member being provided with the anisotropically conductive member when the lid is closed. A semiconductor package connecting socket, comprising: a biasing member that elastically biases toward a sheet. 2. The socket for connecting a semiconductor package according to claim 1, wherein the intermediate member is provided with a recess corresponding to the thickness of the lead at a portion of the tip of the pressing portion that comes into contact with the lead. 3. A semiconductor package connecting socket for connecting an electrode terminal of a semiconductor package having a plurality of electrode terminals provided on a back surface thereof to an electrode terminal of a circuit board, wherein the semiconductor package is positioned and detachably mounted. A socket body having a possible loading portion is positioned and attached to the circuit board by a positioning member, and an opening is formed in at least a part of a bottom portion of the loading recess so that the opening faces the circuit board. A sheet body made of elastic rubber made of elastic material to form an anisotropic conductive sheet by obliquely penetrating a plurality of conductive linear bodies in the thickness direction, and the anisotropic conductive sheet is loaded into the socket main body. The electrode terminal of the semiconductor package in the loading portion can be brought into contact with the opening of the socket and is provided in contact with the electrode terminal of the circuit board. A lid member that locks the front side portion of the loading concave portion at least at two positions facing each other to close the front side opening of the loading concave portion, and is interposed between the lid member and the socket body. An intermediate member formed with a pressing portion that comes into contact with the surface of the semiconductor package in the portion and presses the electrode terminals on the back surface of the semiconductor package toward the anisotropic conductive sheet; A semiconductor package connecting socket, comprising: a biasing member that elastically biases the intermediate member toward the anisotropic conductive sheet. 4. The method according to claim 1, wherein a plurality of the biasing members are provided, and the plurality of biasing members are provided on the lid member in an array corresponding to the shape of the intermediate member. 2. A semiconductor package connecting socket according to item 1. 5. The urging member according to claim 1, wherein the urging member is attached to the lid member so that the urging direction position can be adjusted, and the urging force of the urging member can be adjusted. Socket for semiconductor package connection.