WO2014013713A1 - Optical module and method for producing same - Google Patents

Optical module and method for producing same Download PDF

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Publication number
WO2014013713A1
WO2014013713A1 PCT/JP2013/004325 JP2013004325W WO2014013713A1 WO 2014013713 A1 WO2014013713 A1 WO 2014013713A1 JP 2013004325 W JP2013004325 W JP 2013004325W WO 2014013713 A1 WO2014013713 A1 WO 2014013713A1
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WO
WIPO (PCT)
Prior art keywords
connector
optical
optical element
substrate
optical module
Prior art date
Application number
PCT/JP2013/004325
Other languages
French (fr)
Japanese (ja)
Inventor
杉本　宝
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Publication of WO2014013713A1 publication Critical patent/WO2014013713A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features

Definitions

  • the present invention relates to an optical module and a manufacturing method thereof.
  • optical interconnection technology is widely used for inter-node connections and routers of computers.
  • an optical module used for optical interconnection is generally a parallel optical module using a plurality of optical elements and a plurality of optical fibers. In such a parallel optical module, it is necessary to prevent variations in coupling efficiency of individual channels.
  • Patent Document 1 discloses a technique for realizing this.
  • FIG. 19 is a perspective view showing an optical module of this technology.
  • An optical LSI package 102 is mounted on the wiring board 101.
  • the optical LSI package 102 contains an optical element 103.
  • a connector 104 is superimposed on the optical LSI package 102. Both are configured to be detachably fixed by a clamp 105.
  • the connector 104 holds the optical fiber array 106.
  • the optical fiber array 106 is a bundle of optical fibers bundled in a tape shape. Although the detailed structure is left to Patent Document 1, the optical fiber array 106 is accurately positioned with respect to the connector 104.
  • a mirror 107 is provided at the tip of the optical fiber array 106 at an angle of about 45 degrees with respect to the optical axis of the optical fiber array 106.
  • the optical fiber array 106 and the optical element 103 are optically coupled by the action of the mirror.
  • the lower surface of the connector 104 is flat.
  • a positioning hole 108 is formed on the lower surface.
  • the upper surface of the optical LSI package 102 is flat. Above the optical element 103 on the top surface is a window 109 that transmits light. A positioning pin 110 is formed on the upper surface. A clamp claw recess 111 is formed on the side surface.
  • the clamp 105 is an elastic body having a recess at the center and has claws at both ends.
  • the positioning pins 110 are fitted into the positioning holes 108, and the horizontal positioning is performed. Further, when the lower surface of the connector 104 and the upper surface of the optical LSI package 102 are in close contact with each other, positioning in the height direction is performed. As described above, since the optical fiber array 106 is accurately positioned with respect to the connector 104, the optical axis adjustment of the optical system including the optical fiber array 106, the mirror 107, and the optical element 103 is completed by this mounting. Will do.
  • the connector 104 is fixed by attaching the clamp 105 from above.
  • the claw provided at the end portion fits into the clamp claw recess 111 on the side surface of the optical LSI package 102.
  • the concave portion of the clamp 105 pushes the connector 104 downward, the close contact between the connector 104 and the optical LSI package 102 is maintained.
  • Patent Document 2 discloses another technique.
  • FIG. 20 is a perspective view showing an optical module of this technology.
  • This optical module includes an upper structure 203 in which an optical fiber array 201 is held by a holding member 202, an optical element mounting board 205 on which an optical element 204 is mounted, an anisotropic conductive sheet 206, a wiring board 207, a wiring board, and the like. And a fitting member 208 fixed on 207.
  • the holding member 202 corresponds to the connector 104 of Patent Document 1.
  • a tapered shoulder 202 a is provided at the end of the holding member 202.
  • a positioning hole 209 is provided on the lower surface.
  • the optical fiber array 201 is bent into an arc shape by an arc portion 210 inside the holding member 202, and its tip is exposed on the lower surface of the holding member 202.
  • the fitting member 208 is a receptacle for holding the holding member 202 (connector).
  • the fitting member 208 is formed of a member having rigidity and elasticity such as metal.
  • An opening 211 is provided at the bottom, where the wiring of the wiring board 207 is exposed.
  • side plates 212 extending in the vertical direction of the substrate are provided from the four sides of the opening 211, and the tip thereof is a protruding ridge 213 having elasticity.
  • the optical element mounting substrate 205 is a substrate on which the optical element 204 and LSI and other electronic circuits are mounted. Positioning pins 214 are provided on the upper surface.
  • the positioning pins 214 are fitted into the positioning holes 209.
  • the holding member 202 and the optical element mounting substrate 205 are positioned in the horizontal direction. Further, when the flat portion on the outer periphery of the optical element mounting substrate 205 and the lower surface of the holding member 202 are in contact with each other, positioning in the height direction is performed. In this way, alignment of the tip of the optical fiber array 201 and the optical element 204 is performed.
  • the procedure for mounting the upper structure 203 with this optical module is as follows. 1) First, the anisotropic conductive sheet 206 is disposed in the opening 209 of the fitting member 208. 2) The optical element mounting substrate 205 is disposed thereon. 3) The upper structure 203 is vertically fitted from above. At this time, the positioning pin 214 and the positioning hole 209 are fitted. 4) When the upper structure 203 is attached to the fitting member 208, the shoulder portion 202a of the holding member 202 is pressed inward and downward by the protrusion 213. By this pressure, the upper structure 203 is fixed, and the optical element mounting substrate 205 and the wiring substrate 207 are electrically connected via the anisotropic conductive sheet 206.
  • the optical fiber array 201 and the optical element 204 can be aligned and optically connected.
  • the optical element mounting substrate 205 and the wiring substrate 207 can be aligned and electrically connected.
  • the clamp 105 applies pressure to a part of the connector 104 from above. This pressure acts to distort the connector 104 and also applies strain to the optical fiber array 106. For this reason, the reliability of the optical module was lowered, and the lifetime was shortened.
  • Patent Document 2 has a problem that the electrical connection between the wiring of the wiring substrate 207 and the back electrode of the optical element mounting substrate 205 is unstable.
  • An anisotropic conductive sheet 206 is used for connection between the two, but the anisotropic conductive sheet 206 becomes conductive when pressure is applied. For this reason, normally, a sufficiently high pressure is applied, but in the present technology, the shoulder 102a of the holding member 202 (connector) is connected to the protrusion 213 (spring) at the tip of the fitting member 208 (receiver). It just pushes diagonally downward. Therefore, there was a place where the pressure applied below was weak and sufficient pressure was not applied. In such a place, the connection resistance is high, and the connection is unstable as a whole.
  • the present invention has been made in view of the above problems, and an object thereof is to provide an optical module in which the electrical connection between the optical element and the wiring board is stable and the optical fiber array is not stressed. That is.
  • an optical module having a substrate, an optical element connected to the substrate by a conductive adhesive layer, and a receiver provided on the substrate and positioned above the optical element.
  • the receptacle has holding means for holding the connector from the side.
  • the effect of the present invention is that an optical module having stable electrical connection between the optical element and the wiring board and having high reliability can be obtained.
  • FIG. 1 is a perspective view showing a first embodiment of the present invention.
  • a wiring 2 is formed on the optical element mounting substrate 1, and an optical element 4 is connected to the wiring 2 through a conductive adhesive layer 3.
  • the optical element mounting substrate 1 is provided with a back electrode connected to the wiring 2.
  • a receptacle 5 is provided above the optical element 4 and is bonded to the optical element mounting substrate 1 through an adhesive layer 6.
  • the receptacle 5 is a receptacle for fitting the connector 8 holding the optical fiber 7 and optically coupling the optical fiber 7 and the optical element 4.
  • the receptacle 5 is provided with a flat reference surface 9, and a guide 10 extending in a direction perpendicular to the reference surface is provided at the end.
  • the guide 10 is provided with a projection 11 for locking the side surface of the connector 8, and the reference surface 9 is provided with a window 12 for transmitting light and a positioning pin 13 for positioning the connector 8 in the horizontal direction. ing.
  • a space for housing the optical element 4 and other components is provided on the lower surface of the receptacle 5.
  • an LSI 14 that exchanges electrical signals with the optical element 4 may be mounted on the optical element mounting substrate 1.
  • the optical fiber 7 is a tape-shaped optical fiber array composed of a plurality of fibers
  • the optical element 4 is generally an optical element array in which a plurality of elements are arranged in an array.
  • FIG. 1 also shows a configuration for connecting the optical module to the outside.
  • the optical element mounting substrate 1 is connected to an external electronic circuit via the wiring substrate 15.
  • the back electrode (not shown) of the optical element mounting substrate 1 and the external wiring 16 on the wiring substrate 15 are connected.
  • sockets such as LGA (Land Grid Array) and PGA (Pin Grid Array) can also be used for connection.
  • the connector 8 accurately positions and holds the optical fiber 7 and has an optical path changing means inside, so that the path of light entering from the horizontal direction of the optical element mounting substrate 1 can be changed downward.
  • a positioning hole 17 is provided on the lower surface of the connector 8.
  • the positioning pins 13 and the positioning holes 17 are fitted, and the horizontal positioning is performed.
  • the relationship between the positioning pin 13 and the positioning hole 17 may be reversed.
  • a flat surface (not shown) is provided on the lower surface of the connector 8, and the flat surface is brought into close contact with the reference surface 9, whereby positioning in the height direction is performed.
  • a groove 18 that fits into the protrusion 11 is provided on the side surface of the connector 8.
  • FIG. 2 is a plan view showing the optical module of the present embodiment. On the optical element mounting substrate 1, the receptacle 5 and the connector 8 are fitted.
  • FIG. 3 is a cross-sectional view taken along the line A-A ′ of FIG.
  • the optical element 4 has a pad 19 and is connected to the wiring 2 by the conductive adhesive layer 3.
  • a paste or solder containing a conductor such as Ag, Ni, or C can be used.
  • the electrical connection with the wiring 2 is ensured by baking the paste or reflowing the solder.
  • the receptacle 5 is bonded to the optical element mounting substrate 1 by an adhesive layer 6 provided on the wiring 2.
  • the adhesive layer 6 a resin having heat resistance, a double-sided tape, solder or the like can be used.
  • the receptacle 5 is placed on the wiring 2 for accurate positioning, and other marks may be used instead of the wiring 2. If the structure using the same pad 19 and conductive adhesive layer 3 as the optical element 4 is used, the number of steps can be reduced.
  • a lens 20 is bonded to the window 12 of the receptacle 5.
  • a connector 8 is fitted and connected above the receptacle 5.
  • a part of the lower surface of the connector 4 is a recess.
  • the optical fiber 7 is disposed in the recess and is sandwiched between the flat plate 21 and the connector 4.
  • a mirror 22 having an angle with respect to the optical fiber 7 is provided at the end of the recess. The tip of the optical fiber 7 is exposed toward the mirror 22, and the light emitted from the optical fiber 7 is reflected by the mirror 22 so that the path can be changed in the direction of the optical element 4.
  • the lens 20 condenses the light reflected by the mirror 22 on the optical element 4. Further, the light emitted from the optical element 4 is condensed on the end face of the optical fiber 7.
  • the optical system is configured so that the optical fiber 7 and the optical element 4 respectively correspond to the lens 20 as an array.
  • the optical element 4 is a light source such as a VCSEL (vertical cavity surface emitting laser), and a light receiving element such as a PD (photodiode). A plurality of these can be combined.
  • the optical element 4 is not limited to these, and elements having various optical functions can be used.
  • FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG.
  • a protrusion 11 provided on the guide 10 is fitted in a groove 18 provided on a side surface of the connector 8.
  • Positioning pins 13 are fitted into the positioning holes 17 so that the connector 8 and the receptacle 5 are positioned.
  • a separation groove 23 dug below the reference surface 7 is formed between the reference surface 9 at the center of the receptacle 5 and the guide 10. Due to the separation groove 23, even if the guide 10 bends when the connector 8 is attached or detached, the deformation does not affect the reference surface 9.
  • a material having both rigidity and elasticity is used as the material of the receptacle 2.
  • heat-resistant resins such as PEEK (polyether ether ketone), PPS (polyphenylene sulfide), and liquid crystal polymer.
  • Metals such as aluminum and copper can also be used.
  • FIG. 5 is a cross-sectional view showing a state in which the optical fiber 7 is attached to the connector 8 in the present embodiment.
  • a V-shaped groove 24 is formed in the concave portion for housing the optical fiber 7 of the connector 8.
  • One optical fiber 7 is disposed in each groove of the V-shaped groove 24.
  • a flat plate 21 is provided so as to sandwich the optical fiber 7 and holds the optical fiber 7 in a positioned state.
  • a resin such as PET or ABS can be used.
  • glass or ceramic having high hardness and good flatness can be used.
  • a similar material can be used for the flat plate 21.
  • FIG. 6 is a cross-sectional view of the connector 4 in the length direction of the optical fiber 7.
  • a stopper 25 is provided at the end of the V-shaped groove 21, and positioning in the length direction is performed when the tip of the optical fiber 7 abuts against the stopper 25.
  • a slope is formed at the tip of the stopper 22, and a mirror 18 is formed on the slope.
  • FIG. 7 is an enlarged sectional view of the vicinity of the stopper 25.
  • the stopper 25 is in contact with the clad 7b of the optical fiber 7 and is formed so as not to hang on the extension line of the core 7c.
  • the light emitted from the optical fiber 7 is reflected by the mirror 22 and is directed downward in the figure, that is, toward the optical element 4.
  • the mirror 22 is preferably a metal film such as Au, Ag, or Al.
  • the optical element 4 and the receptacle 5 are mounted on the optical element mounting substrate 1 while being accurately positioned.
  • a connector 8 is attached to this from above the receptacle 5.
  • the position of the connector 8 in the horizontal direction is regulated by the guide 10, and the positioning pins 13 and the positioning holes 17 are fitted to position the connector 8 in the horizontal direction.
  • the reference surface 9 of the receptacle 5 and the flat plate 21 on the lower surface of the connector 8 are brought into close contact with each other, thereby positioning in the height direction.
  • the protrusion 11 provided on the guide 10 is fitted into the groove 18 provided on the side surface of the connector 8.
  • the connector 8 is fixed to the receptacle 5 in a state where the optical elements such as the optical fiber 7, the mirror 22, the lens 20, and the optical element 4 are aligned.
  • the fixing pressure is applied to the side surface of the connector 8, no stress is applied to the optical fiber 7.
  • the optical element 4 receives an optical signal
  • the light emitted from the tip of the optical fiber 7 is reflected by the mirror 22, condensed by the lens 20, and enters the optical element 4 (light receiving element).
  • the light receiving element converts light into electricity, and signal processing is performed by the LSI 14 or the like connected by the optical element mounting substrate 1.
  • an electrical signal is sent from the LSI 14 or the like to the optical element 4 (light emitting element).
  • the light emitting element converts an electrical signal into an optical signal and emits light.
  • the light is collected by the lens 20, then reflected by the mirror 22, and then enters the fiber 7.
  • transmission / reception of optical signals and signal processing are performed.
  • FIG. 8 is a cross-sectional view showing a method for manufacturing an optical module in the present embodiment.
  • the wiring 2 is formed on the optical element mounting substrate 1.
  • the optical element mounting substrate 1 one having a high dimensional accuracy and a low coefficient of thermal expansion is suitable. Ceramic, glass ceramic, glass epoxy, glass polyimide, fluororesin, liquid crystal polymer, or the like can be used.
  • a material of the wiring 2 Cu, Ag, Au, Al, an alloy thereof, or the like can be used. Plating with Ni, Au or the like is desirable to prevent corrosion and improve bondability.
  • the conductive adhesive layer 3 is formed on the portion where the wiring 2 and the optical element 4 and other components are connected by screen printing, dispensing method or the like. Alternatively, solder balls may be placed. As described above, the conductive adhesive layer 3 is a paste or solder containing a conductor such as Ag, Ni, or C.
  • the optical element 4 is mounted as shown in FIG. 8C.
  • a treatment such as heating and UV irradiation is performed to cure the conductive adhesive layer 3.
  • an adhesive layer 6 is formed on the wiring 2 on which the receptacle 5 is mounted using screen printing, a dispensing method, or the like.
  • a mark different from the wiring 2 is used.
  • the receptacle 5 on which the lens 20 is mounted is mounted.
  • the adhesive layer 6 is cured by heat treatment, UV irradiation, or the like, and an optical module including the receptacle 5 is completed.
  • FIG. 9 is a cross-sectional view showing another manufacturing method.
  • a pad 26 similar to that of the optical element 4 is provided on the lower surface of the receptacle 5.
  • the wiring 2 is formed on the optical element mounting substrate 1 as shown in FIG. 9A.
  • a conductive adhesive layer 3 is formed on the wiring 2 as shown in FIG. 9B.
  • components such as the optical element 4, the receptacle 5, and the LSI 14 are mounted.
  • the conductive adhesive layer 3 is cured by heat treatment or the like.
  • the optical element 4 and the receptacle 5 are bonded simultaneously, the number of processes can be reduced. Further, when solder is used as the conductive adhesive layer 3, the whole can be baked by reflow, so that productivity is improved.
  • FIG. 10 is a schematic sectional view showing a method for manufacturing the connector 8 holding the optical fiber 7.
  • a concave portion is formed on the lower surface of the connector 8, and a V-shaped groove 24 is formed so that the optical fibers 7 can be accommodated one by one.
  • a stopper 25 is formed at the end of the V-shaped groove 24 so that the clad 7a at the tip of the optical fiber 7 abuts.
  • a mirror 22 is formed on the slope.
  • the mirror 22 can be produced by forming a metal film such as Al or Ag by vapor deposition or sputtering, for example. Alternatively, a reflective member may be attached.
  • the optical fiber 7 is inserted into the V-shaped groove 24, and the tip is abutted against the stopper 25.
  • the flat plate 21 is bonded to the connector 8, and the optical fiber 7 is fixed in a positioned state.
  • the electrical connection between the optical element 4 and the optical element mounting substrate 1 can be firmly established. Further, since the optical element 4, the lens 20, the mirror 22, and the optical fiber 7 are aligned, the optical axis alignment is completed simply by attaching the connector 8 to the receptacle 5.
  • FIG. 11 is a cross-sectional view showing a second embodiment of the present invention.
  • a screw 27 is used as a locking means for the connector 8.
  • the connector 8 is attached, the screw 27 is first removed.
  • the connector 8 is fitted to the receptacle 5.
  • a screw is passed through the screw hole of the guide 10, and the tip is brought into contact with the groove 18 on the side surface of the connector 8 and fixed.
  • the groove 18 may be a hole or a screw hole. According to the present embodiment, since the connector 8 can be fixed without bending the guide 10, the life of the receptacle 5 can be extended.
  • FIG. 12 is a sectional view showing a third embodiment of the present invention.
  • the guide 10 is provided with a through hole.
  • An elastic body 29 that holds the pin 28 is fixed to the side surface of the receptacle 5.
  • the pin 29 is slidable through the through hole.
  • the elastic body 29 is expanded and the tip of the pin 28 is retracted from the inner surface of the guide 10, and the connector 8 is inserted.
  • the pressure applied to the elastic body 29 is released.
  • the pin 28 fits into the groove 18 and the connector 8 is fixed.
  • the groove 18 may be a hole.
  • the elastic body 29 can be fixed to the receptacle 5 by various methods such as adhesion, double-sided tape, and screwing.
  • FIG. 13 is a cross-sectional view showing a second embodiment of the present invention, and is an enlarged view of a fitting portion between a protrusion 11 provided on a guide 8 and a groove 14 provided on a side surface of a connector 4. It is.
  • the tip of the protrusion 11 is disposed below the bottom of the groove 14. With this configuration, even if the position of the groove 12 is shifted due to component tolerances, a downward biasing force acts on the connector 4 and is pressed against the reference surface 7. By this action, the connector 4 can be brought into contact with the reference surface 7 without looseness.
  • the same method can be applied to any of the first, second, and third embodiments.
  • FIG. 14 shows a configuration in which the groove 10 is provided in the guide 10 and the projection 11 is provided in the connector 8.
  • the tip of the protrusion 11 is positioned higher than the bottom of the groove 14.
  • FIG. 15 is a sectional view showing a fifth embodiment of the present invention.
  • a spring 30 that covers from above is provided with the connector 8 mounted on the receptacle 5. Since the guide 10 is pushed inward by the action of the spring 30, the connector 8 and the receptacle 5 are more securely fixed. Further, if the spring 30 completely covers the upper surface of the receptacle 2, it is possible to prevent dust and moisture from entering from the gap between the fitting portions.
  • FIG. 16 is a side view showing a sixth embodiment of the present invention.
  • a base 31 that is directly mounted on the optical element mounting substrate 1 is provided.
  • the receptacle 5 and the lens array 20 are mounted on a pedestal 27.
  • the positioning pin 10 is provided integrally with the pedestal 31.
  • the guide 10 in the present embodiment is provided apart from the positioning pin 10. For this reason, even if the guide 10 is deformed when the connector 8 is attached or detached, no stress is applied to the positioning pin 13. Therefore, positioning can be performed more accurately. In addition, the mechanical life against repeated attachment and detachment can be extended.
  • FIG. 17 is a side view showing a seventh embodiment of the present invention.
  • a pedestal 31 that is directly mounted on the optical element mounting substrate 1 is provided as in the sixth embodiment.
  • the difference is that the positioning pin 10 is provided in the receptacle 2. With this configuration, the optical module can be reduced in size.
  • FIG. 18 is a cross-sectional view showing a seventh embodiment of the present invention.
  • the positioning pin 10 is provided on the connector 4 side, and the positioning hole 13 is provided in the receptacle 2. According to the present embodiment, it becomes easy to arrange the positioning pins 10 in a direction perpendicular to the longitudinal direction of the window. In this case, the width of the connector 4 or the receptacle 2 can be made narrower than when the positioning pins 10 are provided in the longitudinal direction of the window. As a result, the entire optical module can be reduced in size.
  • An optical module comprising: a substrate; an optical element connected to the substrate by a conductive adhesive layer; and a receiver provided on the substrate and positioned above the optical element, wherein the receiver includes the connector
  • An optical module having a holding means for holding from a side surface
  • the optical module according to appendix 1 wherein the receiver has a side plate portion, and has a locking means for locking the side plate portion and a side surface of the connector.
  • the optical module according to appendix 2 The optical module according to appendix 2, wherein the locking means is a convex portion or a concave portion connected to the side plate portion.
  • Appendix 4 4.
  • the apparatus further comprising a positioning unit that positions the optical element with respect to the substrate and a positioning unit that positions the receiver with respect to the substrate. 5.
  • the optical module as described in. (Appendix 5) 5.
  • Appendix 9 The optical module according to any one of appendices 1 to 8, wherein the substrate has a back electrode, and the back electrode is connected to a wiring substrate.
  • Appendix 10 A step of applying a conductive adhesive to a predetermined position of a substrate; a step of mounting an optical element on the conductive adhesive; a step of applying an adhesive to a predetermined position of the substrate; and a connector on the adhesive
  • a method of manufacturing an optical module comprising: mounting a receiver having a holding means for holding the substrate from a side; curing the conductive adhesive; and curing the adhesive.
  • Appendix 15 15. The optical module according to claim 1, further comprising an elastic body that urges the side plate portion from the outside toward the inside.
  • Appendix 16 The optical module according to appendix 15, wherein the elastic body covers an upper surface of the receiver.
  • Appendix 17 The optical module according to any one of appendices 1 to 16, further comprising an LSI electrically connected to the optical element on the substrate.
  • (Appendix 18) Forming a conductive adhesive layer on a predetermined position of a substrate on which wiring is formed; mounting an optical element on the conductive adhesive layer; applying an adhesive on a predetermined position of the substrate;
  • An optical module comprising a step of mounting a receiver having a holding means for holding a connector from the side on an adhesive, a step of curing the conductive adhesive, and a step of curing the adhesive.
  • Manufacturing method (Appendix 19) A step of forming a conductive adhesive layer at a predetermined position of a substrate on which wiring is formed; a step of mounting an optical element on the conductive adhesive layer and a receiver having a holding means for holding the connector from the side surface; And a step of curing the conductive adhesive layer.

Abstract

This optical module is provided with: a substrate; an optical element that is connected to the substrate by means of a conductive adhesive layer; and a receptor that is provided on the substrate so as to be positioned above the optical element. The receptor comprises a holding means that holds a connector from the sides.

Description

光モジュールおよびその製造方法Optical module and manufacturing method thereof
　本発明は、光モジュールおよびその製造方法に関する。 The present invention relates to an optical module and a manufacturing method thereof.
　近年のコンピュータの計算性能の向上に伴い、データ通信速度に対する要求も急速に高くなっている。このため、コンピュータのノード間接続やルータには光インターコネクション技術が広く用いられている。 With the recent improvement in computer computing performance, the demand for data communication speed is rapidly increasing. For this reason, optical interconnection technology is widely used for inter-node connections and routers of computers.
　現在、光インターコネクションに用いる光モジュールは複数の光素子と複数の光ファイバとを用いたパラレル光モジュールが一般的である。このようなパラレル光モジュールでは、個々のチャンネルの結合効率にばらつきが出ないようにする必要がある。 Currently, an optical module used for optical interconnection is generally a parallel optical module using a plurality of optical elements and a plurality of optical fibers. In such a parallel optical module, it is necessary to prevent variations in coupling efficiency of individual channels.
　これを実現する技術が、例えば特許文献１に開示されている。 For example, Patent Document 1 discloses a technique for realizing this.
　図１９はこの技術の光モジュールを示す斜視図である。配線基板１０１上に光ＬＳＩパッケージ１０２が搭載されている。光ＬＳＩパッケージ１０２は光素子１０３を内蔵している。光ＬＳＩパッケージ１０２上にはコネクタ１０４が重畳されている。この両者をクランプ１０５で着脱自在に固定する構造となっている。 FIG. 19 is a perspective view showing an optical module of this technology. An optical LSI package 102 is mounted on the wiring board 101. The optical LSI package 102 contains an optical element 103. A connector 104 is superimposed on the optical LSI package 102. Both are configured to be detachably fixed by a clamp 105.
　コネクタ１０４は光ファイバアレイ１０６を保持している。光ファイバアレイ１０６は光ファイバをテープ状に束ねたものである。詳細な構造は特許文献１に譲るが、光ファイバアレイ１０６はコネクタ１０４に対して正確に位置決めされている。また光ファイバアレイ１０６先端の先には光ファイバアレイ１０６の光軸に対して略４５度の角度をなすミラー１０７が設けられている。ミラーの作用により、光ファイバアレイ１０６と光素子１０３が光学的に結合されている。またコネクタ１０４の下面は平坦になっている。下面には位置決め穴１０８が形成されている。 The connector 104 holds the optical fiber array 106. The optical fiber array 106 is a bundle of optical fibers bundled in a tape shape. Although the detailed structure is left to Patent Document 1, the optical fiber array 106 is accurately positioned with respect to the connector 104. A mirror 107 is provided at the tip of the optical fiber array 106 at an angle of about 45 degrees with respect to the optical axis of the optical fiber array 106. The optical fiber array 106 and the optical element 103 are optically coupled by the action of the mirror. The lower surface of the connector 104 is flat. A positioning hole 108 is formed on the lower surface.
　光ＬＳＩパッケージ１０２の上面は平坦になっている。上面の光素子１０３の上方は光を透過する窓１０９となっている。また上面には位置決めピン１１０が形成されている。また側面にはクランプ爪用窪み１１１が形成されている。 The upper surface of the optical LSI package 102 is flat. Above the optical element 103 on the top surface is a window 109 that transmits light. A positioning pin 110 is formed on the upper surface. A clamp claw recess 111 is formed on the side surface.
　クランプ１０５は中央に凹部を持つ弾性体であり、両端に爪を有している。 The clamp 105 is an elastic body having a recess at the center and has claws at both ends.
　次に光モジュールの組立てについて説明する。 Next, the assembly of the optical module will be described.
　コネクタ１０４を光ＬＳＩパッケージ１０２上に配置すると、位置決めピン１１０が位置決め穴１０８に嵌合し、水平方向の位置決めなされる。またコネクタ１０４の下面と、光ＬＳＩパッケージ１０２の上面が密着することにより、高さ方向の位置決めがなされる。前述したように、光ファイバアレイ１０６はコネクタ１０４に対して正確に位置決めされているため、この装着により、光ファイバアレイ１０６、ミラー１０７、光素子１０３で構成される光学系の光軸調整が完了することになる。 When the connector 104 is disposed on the optical LSI package 102, the positioning pins 110 are fitted into the positioning holes 108, and the horizontal positioning is performed. Further, when the lower surface of the connector 104 and the upper surface of the optical LSI package 102 are in close contact with each other, positioning in the height direction is performed. As described above, since the optical fiber array 106 is accurately positioned with respect to the connector 104, the optical axis adjustment of the optical system including the optical fiber array 106, the mirror 107, and the optical element 103 is completed by this mounting. Will do.
　コネクタ１０４の固定は、上方からクランプ１０５を装着することによってなされる。クランプ１０５を装着すると端部に設けられた爪が、光ＬＳＩパッケージ１０２側面のクランプ爪用窪み１１１に嵌合する。このときクランプ１０５の凹部がコネクタ１０４を下方へ押すため、コネクタ１０４と光ＬＳＩパッケージ１０２の密着が保たれることになる。 The connector 104 is fixed by attaching the clamp 105 from above. When the clamp 105 is attached, the claw provided at the end portion fits into the clamp claw recess 111 on the side surface of the optical LSI package 102. At this time, since the concave portion of the clamp 105 pushes the connector 104 downward, the close contact between the connector 104 and the optical LSI package 102 is maintained.
　また特許文献２には別の技術が開示されている。 Further, Patent Document 2 discloses another technique.
　図２０はこの技術の光モジュールを示す斜視図である。この光モジュールは、光ファイバアレイ２０１が保持部材２０２により保持された上部構造体２０３と、光素子２０４を搭載した光素子搭載基板２０５と、異方導電シート２０６と、配線基板２０７と、配線基板２０７上に固定された嵌合部材２０８とを有する。 FIG. 20 is a perspective view showing an optical module of this technology. This optical module includes an upper structure 203 in which an optical fiber array 201 is held by a holding member 202, an optical element mounting board 205 on which an optical element 204 is mounted, an anisotropic conductive sheet 206, a wiring board 207, a wiring board, and the like. And a fitting member 208 fixed on 207.
　保持部材２０２は特許文献１のコネクタ１０４に相当する。保持部材２０２の端にはテーパー状の肩部２０２ａが設けられている。また下面には位置決め穴２０９が設けられている。 The holding member 202 corresponds to the connector 104 of Patent Document 1. A tapered shoulder 202 a is provided at the end of the holding member 202. A positioning hole 209 is provided on the lower surface.
　光ファイバアレイ２０１は、保持部材２０２内部の円弧部２１０によって、円弧状に曲げられ、その先端が保持部材２０２の下面に露出するようになっている。 The optical fiber array 201 is bent into an arc shape by an arc portion 210 inside the holding member 202, and its tip is exposed on the lower surface of the holding member 202.
　嵌合部材２０８は保持部材２０２（コネクタ）を保持するための受容器である。嵌合部材２０８は金属等の剛性と弾性を有する部材で形成されている。底部には開口部２１１が設けられ、そこで配線基板２０７の配線が露出している。また開口部２１１の４辺からは基板の鉛直方向に延びる側板部２１２が設けられ、その先端は弾性を有する突条部２１３となっている。 The fitting member 208 is a receptacle for holding the holding member 202 (connector). The fitting member 208 is formed of a member having rigidity and elasticity such as metal. An opening 211 is provided at the bottom, where the wiring of the wiring board 207 is exposed. Further, side plates 212 extending in the vertical direction of the substrate are provided from the four sides of the opening 211, and the tip thereof is a protruding ridge 213 having elasticity.
　光素子搭載基板２０５は光素子２０４とＬＳＩその他の電子回路を搭載した基板である。上面に位置決めピン２１４が設けられている。 The optical element mounting substrate 205 is a substrate on which the optical element 204 and LSI and other electronic circuits are mounted. Positioning pins 214 are provided on the upper surface.
　次に光モジュールの組立てについて説明する。 Next, the assembly of the optical module will be described.
　光素子搭載基板２０５に保持部材２０２を重畳すると、位置決めピン２１４は、位置決め穴２０９と嵌合する。嵌合により保持部材２０２と光素子搭載基板２０５との水平方向における位置決めがなされる。また光素子搭載基板２０５外周の平坦部と、保持部材２０２の下面が当接することにより、高さ方向の位置決めがなされる。このようにして、光ファイバアレイ２０１先端と光素子２０４の位置合わせが行われる。 When the holding member 202 is superimposed on the optical element mounting substrate 205, the positioning pins 214 are fitted into the positioning holes 209. By the fitting, the holding member 202 and the optical element mounting substrate 205 are positioned in the horizontal direction. Further, when the flat portion on the outer periphery of the optical element mounting substrate 205 and the lower surface of the holding member 202 are in contact with each other, positioning in the height direction is performed. In this way, alignment of the tip of the optical fiber array 201 and the optical element 204 is performed.
　この光モジュールで上部構造体２０３を装着する手順は下記の通りである。１）まず嵌合部材２０８の開口部２０９に、異方導電シート２０６を配置する。２）その上に光素子搭載基板２０５を配置する。３）その上から上部構造体２０３を垂直に嵌め込む。このとき位置決めピン２１４と、位置決め穴２０９を嵌合させる。４）嵌合部材２０８に上部構造体２０３が装着されると、突条部２１３によって、保持部材２０２の肩部２０２ａが内側および下方に押圧される。この圧力により、上部構造体２０３が固定され、異方導電シート２０６を介して光素子搭載基板２０５と配線基板２０７とが電気的に接続される。 The procedure for mounting the upper structure 203 with this optical module is as follows. 1) First, the anisotropic conductive sheet 206 is disposed in the opening 209 of the fitting member 208. 2) The optical element mounting substrate 205 is disposed thereon. 3) The upper structure 203 is vertically fitted from above. At this time, the positioning pin 214 and the positioning hole 209 are fitted. 4) When the upper structure 203 is attached to the fitting member 208, the shoulder portion 202a of the holding member 202 is pressed inward and downward by the protrusion 213. By this pressure, the upper structure 203 is fixed, and the optical element mounting substrate 205 and the wiring substrate 207 are electrically connected via the anisotropic conductive sheet 206.
　以上のように特許文献２の技術を用いれば、光ファイバアレイ２０１と光素子２０４を位置合わせして光学的に接続できる。同時に、光素子搭載基板２０５と配線基板２０７を位置合わせして電気的に接続することができる。 As described above, if the technique of Patent Document 2 is used, the optical fiber array 201 and the optical element 204 can be aligned and optically connected. At the same time, the optical element mounting substrate 205 and the wiring substrate 207 can be aligned and electrically connected.
特開２００６－６５３５８号公報JP 2006-65358 A 特開２００９－５３２８１号公報JP 2009-53281 A
　しかしながら、公知の技術には下記の問題点があった。 However, the known techniques have the following problems.
　特許文献１の技術では、クランプ１０５がコネクタ１０４の一部に上方から圧力をかけている。この圧力はコネクタ１０４を歪ませるように作用し、光ファイバアレイ１０６にも歪みを加える。このため、光モジュールの信頼性が低下し、寿命が短くなっていた。 In the technique of Patent Document 1, the clamp 105 applies pressure to a part of the connector 104 from above. This pressure acts to distort the connector 104 and also applies strain to the optical fiber array 106. For this reason, the reliability of the optical module was lowered, and the lifetime was shortened.
　また特許文献２の技術には、配線基板２０７の配線と、光素子搭載基板２０５の裏面電極との電気的接続が不安定であるという問題点があった。両者の接続には異方導電シート２０６が用いられているが、異方導電シート２０６は圧力が掛かることによって導通状態となる。このため通常は十分に高い圧力を掛けて使用されるが、本技術では、保持部材２０２（コネクタ）の肩部１０２ａを、嵌合部材２０８（受容器）先端の突条部２１３（バネ）で斜め下方向に押し付けているだけである。したがって、下方に加えられる圧力が弱く、十分な圧力が加わらない場所が存在した。このような場所では接続抵抗が高くなり、全体として接続が不安定になっていた。 Further, the technique of Patent Document 2 has a problem that the electrical connection between the wiring of the wiring substrate 207 and the back electrode of the optical element mounting substrate 205 is unstable. An anisotropic conductive sheet 206 is used for connection between the two, but the anisotropic conductive sheet 206 becomes conductive when pressure is applied. For this reason, normally, a sufficiently high pressure is applied, but in the present technology, the shoulder 102a of the holding member 202 (connector) is connected to the protrusion 213 (spring) at the tip of the fitting member 208 (receiver). It just pushes diagonally downward. Therefore, there was a place where the pressure applied below was weak and sufficient pressure was not applied. In such a place, the connection resistance is high, and the connection is unstable as a whole.
　本発明は上記の問題点に鑑みてなされたものであり、その目的は、光素子と配線基板の電気的な接続が安定していて、かつ光ファイバアレイにストレスを加えない光モジュールを提供することである。 The present invention has been made in view of the above problems, and an object thereof is to provide an optical module in which the electrical connection between the optical element and the wiring board is stable and the optical fiber array is not stressed. That is.
　上記目的を達成するため、本発明では、基板と、導電性の接着層によって前記基板に接続された光素子と、前記基板上に設けられ前記光素子の上方に位置する受容器を有する光モジュールであって、前記受容器は前記コネクタを側面から保持する保持手段を有している。 In order to achieve the above object, in the present invention, an optical module having a substrate, an optical element connected to the substrate by a conductive adhesive layer, and a receiver provided on the substrate and positioned above the optical element. The receptacle has holding means for holding the connector from the side.
　本発明の効果は、光素子と配線基板の電気的な接続が安定していて、かつ信頼性の高い光モジュールが得られることである。 The effect of the present invention is that an optical module having stable electrical connection between the optical element and the wiring board and having high reliability can be obtained.
第１の実施の形態を示す斜視図である。It is a perspective view which shows 1st Embodiment. 第１の実施の形態を示す平面図である。It is a top view which shows 1st Embodiment. 第１の実施の形態を示す断面図である。It is sectional drawing which shows 1st Embodiment. 第１の実施の形態の別の断面を示す断面図である。It is sectional drawing which shows another cross section of 1st Embodiment. 第１の実施の形態のコネクタを示す断面図である。It is sectional drawing which shows the connector of 1st Embodiment. 第１の実施の形態のコネクタの別の断面を示す断面図である。It is sectional drawing which shows another cross section of the connector of 1st Embodiment. 第１の実施の形態のコネクタの光ファイバ先端近傍を示す断面図である。It is sectional drawing which shows the optical fiber front-end | tip vicinity of the connector of 1st Embodiment. 第１の実施の形態の製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of 1st Embodiment. 第１の実施の形態の製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of 1st Embodiment. 第１の実施の形態の製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of 1st Embodiment. 第１の実施の形態の製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of 1st Embodiment. 第１の実施の形態の製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of 1st Embodiment. 第１の実施の形態の別の製造方法を示す断面図である。It is sectional drawing which shows another manufacturing method of 1st Embodiment. 第１の実施の形態の別の製造方法を示す断面図である。It is sectional drawing which shows another manufacturing method of 1st Embodiment. 第１の実施の形態の別の製造方法を示す断面図である。It is sectional drawing which shows another manufacturing method of 1st Embodiment. 第１の実施の形態のコネクタの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of the connector of 1st Embodiment. 第１の実施の形態のコネクタの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of the connector of 1st Embodiment. 第１の実施の形態のコネクタの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of the connector of 1st Embodiment. 第１の実施の形態のコネクタの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of the connector of 1st Embodiment. 第２の実施の形態を示す断面図である。It is sectional drawing which shows 2nd Embodiment. 第３の実施の形態を示す断面図である。It is sectional drawing which shows 3rd Embodiment. 第４の実施の形態を示す断面図である。It is sectional drawing which shows 4th Embodiment. 第４の実施の形態の別の例を示す断面図である。It is sectional drawing which shows another example of 4th Embodiment. 第５の実施の形態を示す断面図である。It is sectional drawing which shows 5th Embodiment. 第６の実施の形態を示す側面図である。It is a side view which shows 6th Embodiment. 第７の実施の形態を示す側面図である。It is a side view which shows 7th Embodiment. 第８の実施の形態を示す断面図である。It is sectional drawing which shows 8th Embodiment. 特許文献１の技術を示す斜視図である。It is a perspective view which shows the technique of patent document 1. FIG. 特許文献２の技術を示す斜視図である。It is a perspective view which shows the technique of patent document 2. FIG.
　次に、本発明の実施形態について図面を参照して説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
　〔第１の実施形態〕図１は、本発明の第１の実施形態を示す斜視図である。光素子搭載基板１上に配線２が形成され、配線２には導電性接着層３を介して光素子４が接続されている。図示はしていないが、光素子搭載基板１には配線２に接続する裏面電極が設けられている。光素子４の上方にはレセプタクル５が設けられ、接着層６を介して光素子搭載基板１に接合されている。レセプタクル５は光ファイバ７を保持したコネクタ８を嵌合し、光ファイバ７と光素子４を光学的に結合させるための受容器である。レセプタクル５には平坦な基準面９が設けられ、端部には基準面から垂直な方向に延伸するガイド１０が設けられている。ガイド１０にはコネクタ８の側面を係止するための突起１１が設けられ、基準面９には光を透過させるための窓１２とコネクタ８の水平方向を位置決めするための位置決めピン１３が設けられている。図示はしていないが、レセプタクル５の下面には、光素子４や、その他の部品を収納するためのスペースが設けられている。なお光素子搭載基板１には、光素子４と電気信号をやり取りするＬＳＩ１４を搭載しても良い。なお光ファイバ７は複数のファイバからなる例えばテープ状の光ファイバアレイ、光素子４は複数の素子がアレイ状に配列した光素子アレイとするのが一般的である。 [First Embodiment] FIG. 1 is a perspective view showing a first embodiment of the present invention. A wiring 2 is formed on the optical element mounting substrate 1, and an optical element 4 is connected to the wiring 2 through a conductive adhesive layer 3. Although not shown, the optical element mounting substrate 1 is provided with a back electrode connected to the wiring 2. A receptacle 5 is provided above the optical element 4 and is bonded to the optical element mounting substrate 1 through an adhesive layer 6. The receptacle 5 is a receptacle for fitting the connector 8 holding the optical fiber 7 and optically coupling the optical fiber 7 and the optical element 4. The receptacle 5 is provided with a flat reference surface 9, and a guide 10 extending in a direction perpendicular to the reference surface is provided at the end. The guide 10 is provided with a projection 11 for locking the side surface of the connector 8, and the reference surface 9 is provided with a window 12 for transmitting light and a positioning pin 13 for positioning the connector 8 in the horizontal direction. ing. Although not shown, a space for housing the optical element 4 and other components is provided on the lower surface of the receptacle 5. Note that an LSI 14 that exchanges electrical signals with the optical element 4 may be mounted on the optical element mounting substrate 1. In general, the optical fiber 7 is a tape-shaped optical fiber array composed of a plurality of fibers, and the optical element 4 is generally an optical element array in which a plurality of elements are arranged in an array.
　図１では、光モジュールを外部と接続する構成も示している。光素子搭載基板１は配線基板１５を介して外部の電子回路と接続される。このとき光素子搭載基板１の裏面電極（図示せず）と配線基板１５上の外部配線１６が接続される。接続にはハンダバンプやＢＧＡ（Ｂａｌｌ　Ｇｒｉｄ　Ａｒｒａｙ）などを用いたハンダ付けのほか、ＬＧＡ（Ｌａｎｄ　Ｇｒｉｄ　Ａｒｒａｙ）やＰＧＡ（Ｐｉｎ　Ｇｒｉｄ　Ａｒｒａｙ）などのソケットを利用することも出来る。 FIG. 1 also shows a configuration for connecting the optical module to the outside. The optical element mounting substrate 1 is connected to an external electronic circuit via the wiring substrate 15. At this time, the back electrode (not shown) of the optical element mounting substrate 1 and the external wiring 16 on the wiring substrate 15 are connected. In addition to soldering using solder bumps or BGA (Ball Grid Array), sockets such as LGA (Land Grid Array) and PGA (Pin Grid Array) can also be used for connection.
　コネクタ８は光ファイバ７を正確に位置決めして保持するとともに、内部に光進路変更手段を有し、光素子搭載基板１の水平方向から入ってきた光の進路を下方に変えることが出来る。コネクタ８の下面には位置決め穴１７が設けられている。コネクタ８をレセプタクル５に装着すると、位置決めピン１３と位置決め穴１７が嵌合し、水平方向の位置決めがなされる。なお位置決めピン１３と位置決め穴１７の関係は逆であっても良い。またコネクタ８の下面には平坦面（図示せず）が設けられており、この平坦面が基準面９に密着することにより、高さ方向の位置決めがなされる。またコネクタ８の側面には突起１１に嵌合する溝１８が設けられている。 The connector 8 accurately positions and holds the optical fiber 7 and has an optical path changing means inside, so that the path of light entering from the horizontal direction of the optical element mounting substrate 1 can be changed downward. A positioning hole 17 is provided on the lower surface of the connector 8. When the connector 8 is attached to the receptacle 5, the positioning pins 13 and the positioning holes 17 are fitted, and the horizontal positioning is performed. The relationship between the positioning pin 13 and the positioning hole 17 may be reversed. Further, a flat surface (not shown) is provided on the lower surface of the connector 8, and the flat surface is brought into close contact with the reference surface 9, whereby positioning in the height direction is performed. A groove 18 that fits into the protrusion 11 is provided on the side surface of the connector 8.
　図２は本実施の形態の光モジュールを示す平面図である。光素子搭載基板１上で、レセプタクル５とコネクタ８が嵌合している。 FIG. 2 is a plan view showing the optical module of the present embodiment. On the optical element mounting substrate 1, the receptacle 5 and the connector 8 are fitted.
　図３は、図２のＡ－Ａ’における断面図である。光素子４はパッド１９を有し、導電性接着層３によって配線２に接続されている。導電性接着層３としてはＡｇ、Ｎｉ、Ｃ等の導電体を含有するペーストやハンダなどを用いることが出来る。ペーストを焼成したり、ハンダをリフローしたりすることにより、配線２との電気的な接続が確保される。レセプタクル５は、配線２の上に設けられた接着層６により、光素子搭載基板１に接着されている。接着層６としては耐熱性を有する樹脂、両面テープ、ハンダ等を用いることができる。レセプタクル５を配線２上に設置するのは、正確に位置決めするためであり、配線２ではなく他のマークであっても良い。また光素子４と同じパッド１９と導電性接着層３を用いる構造とすれば、工程を削減することが出来る。またレセプタクル５の窓１２には、レンズ２０が接着されている。 FIG. 3 is a cross-sectional view taken along the line A-A ′ of FIG. The optical element 4 has a pad 19 and is connected to the wiring 2 by the conductive adhesive layer 3. As the conductive adhesive layer 3, a paste or solder containing a conductor such as Ag, Ni, or C can be used. The electrical connection with the wiring 2 is ensured by baking the paste or reflowing the solder. The receptacle 5 is bonded to the optical element mounting substrate 1 by an adhesive layer 6 provided on the wiring 2. As the adhesive layer 6, a resin having heat resistance, a double-sided tape, solder or the like can be used. The receptacle 5 is placed on the wiring 2 for accurate positioning, and other marks may be used instead of the wiring 2. If the structure using the same pad 19 and conductive adhesive layer 3 as the optical element 4 is used, the number of steps can be reduced. A lens 20 is bonded to the window 12 of the receptacle 5.
　レセプタクル５の上方にはコネクタ８が嵌合接続されている。コネクタ４下面の一部は凹部になっている。凹部には光ファイバ７が配置され、平板２１とコネクタ４によって挟持されている。凹部の端には光ファイバ７に対して角度を持つミラー２２が設けられている。光ファイバ７の先端はミラー２２に向かって露出しており、光ファイバ７から出射された光はミラー２２によって反射され、光素子４の方向に進路を変えられるようになっている。 A connector 8 is fitted and connected above the receptacle 5. A part of the lower surface of the connector 4 is a recess. The optical fiber 7 is disposed in the recess and is sandwiched between the flat plate 21 and the connector 4. A mirror 22 having an angle with respect to the optical fiber 7 is provided at the end of the recess. The tip of the optical fiber 7 is exposed toward the mirror 22, and the light emitted from the optical fiber 7 is reflected by the mirror 22 so that the path can be changed in the direction of the optical element 4.
　レンズ２０は、ミラー２２で反射された光を光素子４上に集光する。また、光素子４から出射された光を光ファイバ７の端面に集光する。光ファイバ７と光素子４がアレイであるときは、レンズ２０もアレイとして光ファイバ７と光素子４のそれぞれが対応するよう光学系を構成する。 The lens 20 condenses the light reflected by the mirror 22 on the optical element 4. Further, the light emitted from the optical element 4 is condensed on the end face of the optical fiber 7. When the optical fiber 7 and the optical element 4 are an array, the optical system is configured so that the optical fiber 7 and the optical element 4 respectively correspond to the lens 20 as an array.
　光素子４は、例えばＶＣＳＥＬ（垂直共振器型面発光レーザ）などの光源であり、また例えばＰＤ（フォトダイオード）などの受光素子である。これらを複数組み合わせることもできる。また光素子４は、これらに限られるものではなく、種々の光学機能を有する素子を用いることができる。 The optical element 4 is a light source such as a VCSEL (vertical cavity surface emitting laser), and a light receiving element such as a PD (photodiode). A plurality of these can be combined. The optical element 4 is not limited to these, and elements having various optical functions can be used.
　図４は図２のＢ－Ｂ’における断面図である。コネクタ８の側面に設けられた溝１８に、ガイド１０に設けられた突起１１が嵌合している。位置決め穴１７には位置決めピン１３が嵌合し、コネクタ８とレセプタクル５の位置決めがなされている。またレセプタクル５中央の基準面９とガイド１０の間には、基準面７より下方に掘り込まれた分離溝２３が形成されている。分離溝２３あることによって、コネクタ８の着脱時にガイド１０が撓んでも変形が基準面９に影響しなくなる。 FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG. A protrusion 11 provided on the guide 10 is fitted in a groove 18 provided on a side surface of the connector 8. Positioning pins 13 are fitted into the positioning holes 17 so that the connector 8 and the receptacle 5 are positioned. Further, a separation groove 23 dug below the reference surface 7 is formed between the reference surface 9 at the center of the receptacle 5 and the guide 10. Due to the separation groove 23, even if the guide 10 bends when the connector 8 is attached or detached, the deformation does not affect the reference surface 9.
　コネクタ８を確実に保持するために、レセプタクル２の材料には、剛性と弾性を併せ持つ材料が用いられる。また後の工程で、ハンダリフローが使えるように、２６０℃程度の耐熱性を有することが望ましい。この条件を満たすものとしては、例えばＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＰＳ（ポリフェニレンサルファイド）、液晶ポリマーなどの耐熱性樹脂がある。またアルミや銅などの金属も用いることが出来る。 In order to securely hold the connector 8, a material having both rigidity and elasticity is used as the material of the receptacle 2. In addition, it is desirable to have heat resistance of about 260 ° C. so that solder reflow can be used in the subsequent process. Examples of satisfying this condition include heat-resistant resins such as PEEK (polyether ether ketone), PPS (polyphenylene sulfide), and liquid crystal polymer. Metals such as aluminum and copper can also be used.
　次にコネクタ８について説明する。図５は本実施の形態におけるコネクタ８に光ファイバ７を装着した状態を示す断面図である。コネクタ８の光ファイバ７を収納する凹部にはＶ字溝２４が形成されている。Ｖ字溝２４のそれぞれの溝には、光ファイバ７が１本ずつ配置される。さらに光ファイバ７を挟むように平板２１が設けられ、光ファイバ７を位置決めした状態で保持している。コネクタ８の材料は、例えばＰＥＴ、ＡＢＳなどの樹脂を用いることができる。また硬度が高く平坦性の良いガラスやセラミックなども用いることができる。平板２１にも同様の材料を用いることができる。 Next, the connector 8 will be described. FIG. 5 is a cross-sectional view showing a state in which the optical fiber 7 is attached to the connector 8 in the present embodiment. A V-shaped groove 24 is formed in the concave portion for housing the optical fiber 7 of the connector 8. One optical fiber 7 is disposed in each groove of the V-shaped groove 24. Further, a flat plate 21 is provided so as to sandwich the optical fiber 7 and holds the optical fiber 7 in a positioned state. As the material of the connector 8, for example, a resin such as PET or ABS can be used. Further, glass or ceramic having high hardness and good flatness can be used. A similar material can be used for the flat plate 21.
　図６は光ファイバ７の長さ方向におけるコネクタ４の断面図である。Ｖ字溝２１の終端にはストッパ２５が設けられており、光ファイバ７の先端がストッパ２５に突き当たることにより長さ方向の位置決めがなされる。ストッパ２２の先には斜面が形成され、斜面上にはミラー１８が形成されている。 FIG. 6 is a cross-sectional view of the connector 4 in the length direction of the optical fiber 7. A stopper 25 is provided at the end of the V-shaped groove 21, and positioning in the length direction is performed when the tip of the optical fiber 7 abuts against the stopper 25. A slope is formed at the tip of the stopper 22, and a mirror 18 is formed on the slope.
　図７はストッパ２５近傍を拡大した断面図である。ストッパ２５は光ファイバ７のクラッド７ｂに当接し、コア７ｃの延長線上には掛からないように形成されている。光ファイバ７から出射された光は、ミラー２２で反射され、図の下方、すなわち光素子４の方向に向かうようになっている。ミラー２２としてはＡｕ、Ａｇ、Ａｌなどの金属膜が好適である。 FIG. 7 is an enlarged sectional view of the vicinity of the stopper 25. The stopper 25 is in contact with the clad 7b of the optical fiber 7 and is formed so as not to hang on the extension line of the core 7c. The light emitted from the optical fiber 7 is reflected by the mirror 22 and is directed downward in the figure, that is, toward the optical element 4. The mirror 22 is preferably a metal film such as Au, Ag, or Al.
　次にコネクタ８をレセプタクル５に装着する時の動作について説明する（図４参照）。光素子搭載基板１には、光素子４およびレセプタクル５が、正確に位置決めされて実装されている。これにコネクタ８をレセプタクル５の上方から装着する。コネクタ８は、ガイド１０によって水平方向の位置を規制されるとともに、位置決めピン１３と位置決め穴１７が嵌合し、コネクタ８の水平方向の位置決めがなされる。また、レセプタクル５の基準面９と、コネクタ８下面の平板２１が密着することにより高さ方向の位置決めがなされる。さらに、ガイド１０に設けられた突起１１が、コネクタ８側面に設けられた溝１８と嵌合する。これらの動作により、光ファイバ７、ミラー２２、レンズ２０、光素子４の各光学要素が位置合わせされた状態で、コネクタ８がレセプタクル５に固定される。以上のように、本実施の形態では、固定のための圧力が、コネクタ８の側面に対して加えられるため、光ファイバ７にストレスが加わらない。 Next, the operation when the connector 8 is attached to the receptacle 5 will be described (see FIG. 4). The optical element 4 and the receptacle 5 are mounted on the optical element mounting substrate 1 while being accurately positioned. A connector 8 is attached to this from above the receptacle 5. The position of the connector 8 in the horizontal direction is regulated by the guide 10, and the positioning pins 13 and the positioning holes 17 are fitted to position the connector 8 in the horizontal direction. Further, the reference surface 9 of the receptacle 5 and the flat plate 21 on the lower surface of the connector 8 are brought into close contact with each other, thereby positioning in the height direction. Further, the protrusion 11 provided on the guide 10 is fitted into the groove 18 provided on the side surface of the connector 8. By these operations, the connector 8 is fixed to the receptacle 5 in a state where the optical elements such as the optical fiber 7, the mirror 22, the lens 20, and the optical element 4 are aligned. As described above, in the present embodiment, since the fixing pressure is applied to the side surface of the connector 8, no stress is applied to the optical fiber 7.
　次に本実施の形態の光モジュールの動作について説明する（図３参照）。まず光素子４が光信号を受信する場合について説明する。光ファイバ７の先端から出射された光はミラー２２で反射され、レンズ２０で集光され、光素子４（受光素子）に入射する。受光素子は光を電気に変換し、光素子搭載基板１によって接続されたＬＳＩ１４等によって信号処理される。 Next, the operation of the optical module of the present embodiment will be described (see FIG. 3). First, the case where the optical element 4 receives an optical signal will be described. The light emitted from the tip of the optical fiber 7 is reflected by the mirror 22, condensed by the lens 20, and enters the optical element 4 (light receiving element). The light receiving element converts light into electricity, and signal processing is performed by the LSI 14 or the like connected by the optical element mounting substrate 1.
　次に光素子４が光信号を発信する場合について説明する。まずＬＳＩ１４等から電気信号が光素子４（発光素子）に送られる。発光素子は電気信号を光信号に変換し光を出射する。光はレンズ２０によって集光され、次いでミラー２２によって反射され、次いでファイバ７に入射する。以上のようにして光信号の送受信および信号処理が行われる。 Next, the case where the optical element 4 transmits an optical signal will be described. First, an electrical signal is sent from the LSI 14 or the like to the optical element 4 (light emitting element). The light emitting element converts an electrical signal into an optical signal and emits light. The light is collected by the lens 20, then reflected by the mirror 22, and then enters the fiber 7. As described above, transmission / reception of optical signals and signal processing are performed.
　次に本実施の形態における光モジュールの製造方法について説明する。図８は本実施の形態における、光モジュールの製造方法を示す断面図である。 Next, a method for manufacturing the optical module in the present embodiment will be described. FIG. 8 is a cross-sectional view showing a method for manufacturing an optical module in the present embodiment.
　まず図８Ａのように、光素子搭載基板１の上に配線２を形成する。光素子搭載基板１としては、寸法精度が高く、熱膨張率の低いものが好適である。セラミック、ガラスセラミック、ガラスエポキシ、ガラスポリイミド、フッ素樹脂、液晶ポリマーなどを用いることができる。配線２の材料としてはＣｕ、Ａｇ、Ａｕ、Ａｌやその合金などを用いることができる。腐食防止と、接合性向上のためにＮｉやＡｕなどでめっきすることが望ましい。 First, as shown in FIG. 8A, the wiring 2 is formed on the optical element mounting substrate 1. As the optical element mounting substrate 1, one having a high dimensional accuracy and a low coefficient of thermal expansion is suitable. Ceramic, glass ceramic, glass epoxy, glass polyimide, fluororesin, liquid crystal polymer, or the like can be used. As a material of the wiring 2, Cu, Ag, Au, Al, an alloy thereof, or the like can be used. Plating with Ni, Au or the like is desirable to prevent corrosion and improve bondability.
　次に図８Ｂのように、配線２と、光素子４その他の部品を接続する部分に、導電性接着層３をスクリーン印刷やディスペンス法などを用いて形成する。あるいはハンダボールを載せても良い。前記したように、導電性接着層３はＡｇ、Ｎｉ、Ｃ等の導電体を含有するペーストやハンダなどである。 Next, as shown in FIG. 8B, the conductive adhesive layer 3 is formed on the portion where the wiring 2 and the optical element 4 and other components are connected by screen printing, dispensing method or the like. Alternatively, solder balls may be placed. As described above, the conductive adhesive layer 3 is a paste or solder containing a conductor such as Ag, Ni, or C.
　次に、図８Ｃのように光素子４を搭載する。次で加熱、ＵＶ照射などの処理を行い、導電性接着層３を硬化させる。 Next, the optical element 4 is mounted as shown in FIG. 8C. Next, a treatment such as heating and UV irradiation is performed to cure the conductive adhesive layer 3.
　次に、図８Ｄのようにレセプタクル５を搭載する配線２の上に、接着層６をスクリーン印刷やディスペンス法などを用いて形成する。ここで配線２とは異なるマークを用いても問題ない。 Next, as shown in FIG. 8D, an adhesive layer 6 is formed on the wiring 2 on which the receptacle 5 is mounted using screen printing, a dispensing method, or the like. Here, there is no problem even if a mark different from the wiring 2 is used.
　次に、図８Ｅのようにレンズ２０を装着したレセプタクル５を搭載する。次いで、接着層６を熱処理、ＵＶ照射などによって硬化し、レセプタクル５を含む光モジュールが完成する。 Next, as shown in FIG. 8E, the receptacle 5 on which the lens 20 is mounted is mounted. Next, the adhesive layer 6 is cured by heat treatment, UV irradiation, or the like, and an optical module including the receptacle 5 is completed.
　図９は、別の製造方法を示す断面図である。この例では、レセプタクル５の下面に光素子４と同様なパッド２６を設けておく。まず図９Ａのように光素子搭載基板１に配線２を形成する。 FIG. 9 is a cross-sectional view showing another manufacturing method. In this example, a pad 26 similar to that of the optical element 4 is provided on the lower surface of the receptacle 5. First, the wiring 2 is formed on the optical element mounting substrate 1 as shown in FIG. 9A.
　次に図９Ｂのように、配線２上に導電性接着層３を形成する。 Next, a conductive adhesive layer 3 is formed on the wiring 2 as shown in FIG. 9B.
　次に図９Ｃのように、光素子４、レセプタクル５、およびＬＳＩ１４等の部品を搭載する。次いで、熱処理などにより導電性接着層３を硬化させる。 Next, as shown in FIG. 9C, components such as the optical element 4, the receptacle 5, and the LSI 14 are mounted. Next, the conductive adhesive layer 3 is cured by heat treatment or the like.
　この例では、光素子４とレセプタクル５を同時に接着しているので工程が削減できる。さらに導電性接着層３としてハンダを用いた場合は、全体をリフローで焼成できるので、生産性が向上する。 In this example, since the optical element 4 and the receptacle 5 are bonded simultaneously, the number of processes can be reduced. Further, when solder is used as the conductive adhesive layer 3, the whole can be baked by reflow, so that productivity is improved.
　次にコネクタ８の製造方法について説明する。図１０は光ファイバ７を保持したコネクタ８の製造方法を示す断面模式図である。 Next, a method for manufacturing the connector 8 will be described. FIG. 10 is a schematic sectional view showing a method for manufacturing the connector 8 holding the optical fiber 7.
　まず図１０Ａのようにコネクタ８本体を作製する。コネクタ８の下面には凹部が形成され、さらに光ファイバ７が１本ずつ収まるようなＶ字溝２４を形成する。Ｖ字溝２４の終端には光ファイバ７先端のクラッド７ａが当接するストッパ２５を形成する。これらの加工は、射出成形、スタンピング、切削等で行うことができる。 First, as shown in FIG. A concave portion is formed on the lower surface of the connector 8, and a V-shaped groove 24 is formed so that the optical fibers 7 can be accommodated one by one. A stopper 25 is formed at the end of the V-shaped groove 24 so that the clad 7a at the tip of the optical fiber 7 abuts. These processes can be performed by injection molding, stamping, cutting, or the like.
　次に図１０Ｂのように、斜面にミラー２２を形成する。ミラー２２は、例えば蒸着やスパッタなどによって、ＡｌやＡｇなどの金属膜を形成することにより作製できる。あるいは反射性の部材を貼付しても良い。 Next, as shown in FIG. 10B, a mirror 22 is formed on the slope. The mirror 22 can be produced by forming a metal film such as Al or Ag by vapor deposition or sputtering, for example. Alternatively, a reflective member may be attached.
　次に図１０Ｃのように光ファイバ７をＶ字溝２４に挿入し、先端をストッパ２５に突き当てる。 Next, as shown in FIG. 10C, the optical fiber 7 is inserted into the V-shaped groove 24, and the tip is abutted against the stopper 25.
　次に図１０Ｄのように平板２１をコネクタ８に接着し、光ファイバ７を位置決めされた状態で固定する。 Next, as shown in FIG. 10D, the flat plate 21 is bonded to the connector 8, and the optical fiber 7 is fixed in a positioned state.
　以上説明したように、本実施の形態によれば、レセプタクル５を含む光モジュールにおいて、光素子４と光素子搭載基板１との電気的な接続が堅固に確立できる。また、光素子４、レンズ２０、ミラー２２、光ファイバ７が、それぞれ位置合わせされているため、コネクタ８をレセプタクル５に装着するだけで光軸合わせも完了することになる。 As described above, according to the present embodiment, in the optical module including the receptacle 5, the electrical connection between the optical element 4 and the optical element mounting substrate 1 can be firmly established. Further, since the optical element 4, the lens 20, the mirror 22, and the optical fiber 7 are aligned, the optical axis alignment is completed simply by attaching the connector 8 to the receptacle 5.
　〔第２の実施形態〕図１１は本発明第２の実施の形態を示す断面図である。本実施の形態ではコネクタ８の係止手段としてネジ２７を用いている。コネクタ８を装着する場合は、まずネジ２７を外しておく。この状態でレセプタクル５にコネクタ８を嵌合する。次にガイド１０のネジ穴にネジを通し、先端部をコネクタ８側面の溝１８に当接して固定する。なお、溝１８は穴や、ネジ穴であってもよい。本実施の形態によれば、ガイド１０を撓ませずにコネクタ８を固定できるので、レセプタクル５の寿命を延ばすことができる。 [Second Embodiment] FIG. 11 is a cross-sectional view showing a second embodiment of the present invention. In this embodiment, a screw 27 is used as a locking means for the connector 8. When the connector 8 is attached, the screw 27 is first removed. In this state, the connector 8 is fitted to the receptacle 5. Next, a screw is passed through the screw hole of the guide 10, and the tip is brought into contact with the groove 18 on the side surface of the connector 8 and fixed. The groove 18 may be a hole or a screw hole. According to the present embodiment, since the connector 8 can be fixed without bending the guide 10, the life of the receptacle 5 can be extended.
　〔第３の実施形態〕図１２は本発明第３の実施の形態を示す断面図である。本実施の形態ではガイド１０に貫通口が設けられている。レセプタクル５の側面にはピン２８を保持する弾性体２９が固定されている。ピン２９は前記貫通口を介してスライド可能となっている。コネクタ８を装着する場合は、弾性体２９を押し広げ、ピン２８の先端をガイド１０の内面よりも引っ込んだ状態にして、コネクタ８を挿入する。次に弾性体２９に加えている圧力を解除する。するとピン２８が溝１８に嵌合し、コネクタ８が固定される。なお、溝１８は穴であってもよい。本実施の形態によれば、ネジ２７を螺合させる必要がないので、摩擦による粉塵の発生を防ぐことができる。またピン２８がレセプタクルと一体になっているため、ピン２８を紛失することがない。なお、レセプタクル５への弾性体２９の固定は、接着、両面テープ、ネジ止め等種々の方法を用いることができる。 [Third Embodiment] FIG. 12 is a sectional view showing a third embodiment of the present invention. In the present embodiment, the guide 10 is provided with a through hole. An elastic body 29 that holds the pin 28 is fixed to the side surface of the receptacle 5. The pin 29 is slidable through the through hole. When attaching the connector 8, the elastic body 29 is expanded and the tip of the pin 28 is retracted from the inner surface of the guide 10, and the connector 8 is inserted. Next, the pressure applied to the elastic body 29 is released. Then, the pin 28 fits into the groove 18 and the connector 8 is fixed. The groove 18 may be a hole. According to the present embodiment, since it is not necessary to screw the screw 27, generation of dust due to friction can be prevented. Further, since the pin 28 is integrated with the receptacle, the pin 28 is not lost. The elastic body 29 can be fixed to the receptacle 5 by various methods such as adhesion, double-sided tape, and screwing.
　〔第４の実施形態〕図１３は本発明第２の実施の形態を示す断面図であり、ガイド８に設けられた突起１１とコネクタ４側面に設けられた溝１４の嵌合部分の拡大図である。本実施の形態では、突起１１の先端は、溝１４の底よりも下に配置される。この構成とすれば、部品の公差により溝１２の位置がずれても、コネクタ４には下方に向かう付勢力が働き、基準面７に押し付けられる。この作用により、コネクタ４を基準面７に緩み無く当接することができる。同様の方法は、実施の形態１、２，３いずれの場合も適用することが出来る。 [Fourth Embodiment] FIG. 13 is a cross-sectional view showing a second embodiment of the present invention, and is an enlarged view of a fitting portion between a protrusion 11 provided on a guide 8 and a groove 14 provided on a side surface of a connector 4. It is. In the present embodiment, the tip of the protrusion 11 is disposed below the bottom of the groove 14. With this configuration, even if the position of the groove 12 is shifted due to component tolerances, a downward biasing force acts on the connector 4 and is pressed against the reference surface 7. By this action, the connector 4 can be brought into contact with the reference surface 7 without looseness. The same method can be applied to any of the first, second, and third embodiments.
　図１４はガイド１０に溝１８、コネクタ８に突起１１を設けた場合の構成を示している。この場合は、突起１１の先端を溝１４の底より高い位置とする。この構成により図１３の場合と同様の効果が得られる。
〔第５の実施形態〕図１５は本発明第５の実施の形態を示す断面図である。本実施の形態ではコネクタ８をレセプタクル５に装着した状態で、上からカバーするバネ３０を設けている。バネ３０の作用によりガイド１０が内側に押されるため、コネクタ８とレセプタクル５の固定はより確実なものとなる。またバネ３０が、レセプタクル２の上面を完全に覆うようにしておけば、嵌合部の隙間から埃や水分が浸入するのを防ぐことができる。 FIG. 14 shows a configuration in which the groove 10 is provided in the guide 10 and the projection 11 is provided in the connector 8. In this case, the tip of the protrusion 11 is positioned higher than the bottom of the groove 14. With this configuration, the same effect as in the case of FIG. 13 can be obtained.
[Fifth Embodiment] FIG. 15 is a sectional view showing a fifth embodiment of the present invention. In the present embodiment, a spring 30 that covers from above is provided with the connector 8 mounted on the receptacle 5. Since the guide 10 is pushed inward by the action of the spring 30, the connector 8 and the receptacle 5 are more securely fixed. Further, if the spring 30 completely covers the upper surface of the receptacle 2, it is possible to prevent dust and moisture from entering from the gap between the fitting portions.
　〔第６の実施形態〕図１６は本発明第６の実施の形態を示す側面図である。本実施の形態では光素子搭載基板１に直接実装される台座３１を設けている。レセプタクル５およびレンズアレイ２０は、台座２７上に搭載される。位置決めピン１０は台座３１と一体に設けられている。図１６に示すように、本実施の形態におけるガイド１０は、位置決めピン１０とは離間して設けられている。このため、コネクタ８の着脱時にガイド１０が変形しても、位置決めピン１３にストレスが加わらない。したがって、より正確に位置決めをすることが可能になる。また着脱の繰り返しに対する機械的な寿命も延ばすことが出来る。 [Sixth Embodiment] FIG. 16 is a side view showing a sixth embodiment of the present invention. In this embodiment, a base 31 that is directly mounted on the optical element mounting substrate 1 is provided. The receptacle 5 and the lens array 20 are mounted on a pedestal 27. The positioning pin 10 is provided integrally with the pedestal 31. As shown in FIG. 16, the guide 10 in the present embodiment is provided apart from the positioning pin 10. For this reason, even if the guide 10 is deformed when the connector 8 is attached or detached, no stress is applied to the positioning pin 13. Therefore, positioning can be performed more accurately. In addition, the mechanical life against repeated attachment and detachment can be extended.
　〔第７の実施形態〕図１７は本発明第７の実施の形態を示す側面図である。本実施の形態では、実施の形態６と同様に光素子搭載基板１に直接実装される台座３１を設けている。違いは位置決めピン１０をレセプタクル２に設けていることである。この構成とすることにより、光モジュールを小型化することが出来る。 [Seventh Embodiment] FIG. 17 is a side view showing a seventh embodiment of the present invention. In the present embodiment, a pedestal 31 that is directly mounted on the optical element mounting substrate 1 is provided as in the sixth embodiment. The difference is that the positioning pin 10 is provided in the receptacle 2. With this configuration, the optical module can be reduced in size.
　〔第８の実施形態〕図１８は、本発明第７の実施の形態を示す断面図である。本実施の形態では位置決めピン１０をコネクタ４側に、位置決め穴１３をレセプタクル２に設けている。本実施の形態によれば、位置決めピン１０を、窓の長手方向に対して直角な方向に並べることが容易になる。この場合は、窓の長手方向に位置決めピン１０を設けた場合よりも、コネクタ４やレセプタクル２の幅を狭くすることができる。その結果、光モジュール全体を小型化することが出来る。
（付記１）
　基板と、導電性の接着層によって前記基板に接続された光素子と、前記基板上に設けられ前記光素子の上方に位置する受容器を有する光モジュールであって、前記受容器は前記コネクタを側面から保持する保持手段を有する、ことを特徴とする光モジュール
（付記２）
　前記受容器が側板部を有し、前記側板部と前記コネクタの側面を係止する係止手段を有することを特徴とする付記１に記載の光モジュール。
（付記３）
　前記係止手段が、前記側板部に連結する凸部または凹部である、ことを特徴とする付記２に記載の光モジュール。
（付記４）
　前記光素子を前記基板に対して位置決めする位置決め手段と、前記受容器を前記基板に対して位置決めする位置決め手段を有している、ことを特徴とする請求項１乃至請求項３いずれか一項に記載の光モジュール。
（付記５）
　前記受容器が、複数の前記側板部の間に平坦面を有する、ことを特徴とする付記１乃至付記４いずれか一項に記載の光モジュール。
（付記６）
　前記受容器が、前記コネクタに嵌合する位置決め手段を有する、ことを特徴とする付記１乃至付記５いずれか一項に記載の光モジュール。
（付記７）
　前記光素子が、複数の光素子がアレイ状に配列した光素子アレイである、ことを特徴とする付記１乃至付記６いずれか一項に記載の光モジュール。
（付記８）
　前記光素子が半導体レーザまたはフォトダイオード、あるいはその両方を含むことを特徴とする付記１乃至付記７いずれか一項に記載の光モジュール。
（付記９）
　前記基板が裏面電極を有し、前記裏面電極が配線基板に接続されている、ことを特徴とする付記１乃至付記８いずれか一項に記載の光モジュール。
（付記１０）
　基板の所定位置に導電性接着剤を塗布する工程と、光素子を前記導電性接着剤上に搭載する工程と、前記基板の所定位置に接着剤を塗布する工程と、前記接着剤上にコネクタを側面から保持する保持手段を有する受容器を搭載する工程と、前記導電性接着剤を硬化する工程と、前記接着剤を硬化する工程を有する、ことを特徴とする光モジュールの製造方法。
（付記１１）
　前記側板部に設けられた前記凸部の先端から前記平坦面までの距離が、前記コネクタに設けられた凹部の底から前記コネクタ下面までの距離より短い、ことを特徴とする付記３に記載の光モジュール。
（付記１２）
　前記側板部に設けられた前記凹部の底から前記基準面までの距離が、前記コネクタに設けられた凸部の先端から前記コネクタ下面までの距離より短い、ことを特徴とする付記３に記載の光モジュール。
（付記１３）
　前記受容器の前記側板部と前記平坦面との間に、基準面より下方に掘り込まれた溝を有する、ことを特徴とする付記１乃至付記１２いずれか一項に記載の光モジュール。
（付記１４）
　前記平坦面と前記コネクタの下面の、どちらか一方に凸部を有し、他方にこれに嵌合する凹部を有する、ことを特徴とする付記１乃至付記１３に記載の光モジュール。
（付記１５）
　前記側板部を外側から内側に向かって付勢する弾性体を有する、ことを特徴とする付記１乃至付記１４いずれか一項に記載の光モジュール。
（付記１６）
　前記弾性体が前記受容器の上面を覆っている、ことを特徴とする付記１５に記載の光モジュール。
（付記１７）
　前記基板上に前記光素子と電気的に接続されたＬＳＩを有する、ことを特徴とする付記１乃至付記１６いずれか一項に記載の光モジュール。
（付記１８）
　配線の形成された基板の所定位置に導電性接着層を形成する工程と、前記導電性接着層上に光素子を搭載する工程と、前記基板の所定位置に接着剤を塗布する工程と、前記接着剤上にコネクタを側面から保持する保持手段を有する受容器を搭載する工程と、前記導電性接着剤を硬化する工程と、前記接着剤を硬化する工程を有する、ことを特徴とする光モジュールの製造方法。
（付記１９）
　配線の形成された基板の所定位置に導電性接着層を形成する工程と、前記導電性接着層上に、光素子と、コネクタを側面から保持する保持手段を有する受容器を搭載する工程と、前記導電性接着層を硬化する工程とを有する、ことを特徴とする光モジュールの製造方法。
（付記２０）
　前記導電性接着層がハンダである、ことを特徴とする付記１９記載の光モジュールの製造方法。
（付記２１）
　前記ハンダをリフローする工程を有する、ことを特徴とする付記２０記載の光モジュールの製造方法。 [Eighth Embodiment] FIG. 18 is a cross-sectional view showing a seventh embodiment of the present invention. In the present embodiment, the positioning pin 10 is provided on the connector 4 side, and the positioning hole 13 is provided in the receptacle 2. According to the present embodiment, it becomes easy to arrange the positioning pins 10 in a direction perpendicular to the longitudinal direction of the window. In this case, the width of the connector 4 or the receptacle 2 can be made narrower than when the positioning pins 10 are provided in the longitudinal direction of the window. As a result, the entire optical module can be reduced in size.
(Appendix 1)
An optical module comprising: a substrate; an optical element connected to the substrate by a conductive adhesive layer; and a receiver provided on the substrate and positioned above the optical element, wherein the receiver includes the connector An optical module having a holding means for holding from a side surface (Appendix 2)
The optical module according to appendix 1, wherein the receiver has a side plate portion, and has a locking means for locking the side plate portion and a side surface of the connector.
(Appendix 3)
The optical module according to appendix 2, wherein the locking means is a convex portion or a concave portion connected to the side plate portion.
(Appendix 4)
4. The apparatus according to claim 1, further comprising a positioning unit that positions the optical element with respect to the substrate and a positioning unit that positions the receiver with respect to the substrate. 5. The optical module as described in.
(Appendix 5)
5. The optical module according to claim 1, wherein the receiver has a flat surface between the plurality of side plate portions.
(Appendix 6)
The optical module according to any one of Supplementary Note 1 to Supplementary Note 5, wherein the receiver includes positioning means that fits into the connector.
(Appendix 7)
The optical module according to any one of appendix 1 to appendix 6, wherein the optical element is an optical element array in which a plurality of optical elements are arranged in an array.
(Appendix 8)
8. The optical module according to claim 1, wherein the optical element includes a semiconductor laser, a photodiode, or both.
(Appendix 9)
The optical module according to any one of appendices 1 to 8, wherein the substrate has a back electrode, and the back electrode is connected to a wiring substrate.
(Appendix 10)
A step of applying a conductive adhesive to a predetermined position of a substrate; a step of mounting an optical element on the conductive adhesive; a step of applying an adhesive to a predetermined position of the substrate; and a connector on the adhesive A method of manufacturing an optical module, comprising: mounting a receiver having a holding means for holding the substrate from a side; curing the conductive adhesive; and curing the adhesive.
(Appendix 11)
The distance from the tip of the convex part provided in the side plate part to the flat surface is shorter than the distance from the bottom of the concave part provided in the connector to the connector lower surface. Optical module.
(Appendix 12)
The distance from the bottom of the concave portion provided in the side plate portion to the reference surface is shorter than the distance from the tip of the convex portion provided in the connector to the lower surface of the connector. Optical module.
(Appendix 13)
The optical module according to any one of appendices 1 to 12, further comprising a groove dug below the reference plane between the side plate portion of the receiver and the flat surface.
(Appendix 14)
14. The optical module according to appendix 1 to appendix 13, wherein a convex portion is provided on one of the flat surface and the lower surface of the connector, and a concave portion fitted to the other is provided on the other.
(Appendix 15)
15. The optical module according to claim 1, further comprising an elastic body that urges the side plate portion from the outside toward the inside.
(Appendix 16)
The optical module according to appendix 15, wherein the elastic body covers an upper surface of the receiver.
(Appendix 17)
The optical module according to any one of appendices 1 to 16, further comprising an LSI electrically connected to the optical element on the substrate.
(Appendix 18)
Forming a conductive adhesive layer on a predetermined position of a substrate on which wiring is formed; mounting an optical element on the conductive adhesive layer; applying an adhesive on a predetermined position of the substrate; An optical module comprising a step of mounting a receiver having a holding means for holding a connector from the side on an adhesive, a step of curing the conductive adhesive, and a step of curing the adhesive. Manufacturing method.
(Appendix 19)
A step of forming a conductive adhesive layer at a predetermined position of a substrate on which wiring is formed; a step of mounting an optical element on the conductive adhesive layer and a receiver having a holding means for holding the connector from the side surface; And a step of curing the conductive adhesive layer.
(Appendix 20)
20. The method for manufacturing an optical module according to appendix 19, wherein the conductive adhesive layer is solder.
(Appendix 21)
The method of manufacturing an optical module according to appendix 20, further comprising a step of reflowing the solder.
　この出願は、２０１２年７月２０日に出願された日本出願特願２０１２－１６１１６２を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2012-161162 filed on July 20, 2012, the entire disclosure of which is incorporated herein.
　１　　光素子搭載基板
　２　　配線
　３　　導電性接着層
　４　　光素子
　５　　レセプタクル
　６　　接着層
　７　　光ファイバ
　８　　コネクタ
　９　　基準面
　１０　　ガイド
　１１　　突起
　１２　　窓
　１３　　位置決めピン
　１４　　ＬＳＩ
　１５　　配線基板
　１６　　外部配線
　１７　　位置決め穴
　１８　　溝
　１９　　パッド
　２０　　レンズ
　２１　　平板
　２２　　ミラー
　２３　　分離溝
　２４　　Ｖ字溝
　２５　　ストッパ
　２６　　パッド
　２７　　ネジ
　２８　　ピン
　２９　　弾性体
　３０　　バネ
　３１　　台座
　１０１　　配線基板
　１０２　　光ＬＳＩパッケージ
　１０３　　光素子
　１０４　　コネクタ
　１０５　　クランプ
　１０６　　光ファイバアレイ
　１０７　　ミラー
　１０８　　位置決め穴
　１０９　　窓
　１１０　　位置決めピン
　１１１　　クランプ爪用窪み
　２０１　　光ファイバアレイ
　２０２　　保持部材
　２０３　　上部構造体
　２０４　　光素子
　２０５　　光素子搭載基板
　２０６　　異方導電シート
　２０７　　配線基板
　２０８　　嵌合部材
　２０９　　位置決め穴
　２１０　　円弧部
　２１１　　開口部
　２１２　　側板部
　２１３　　突条部
　２１４　　位置決めピン DESCRIPTION OF SYMBOLS 1 Optical element mounting board 2 Wiring 3 Conductive adhesive layer 4 Optical element 5 Receptacle 6 Adhesive layer 7 Optical fiber 8 Connector 9 Reference plane 10 Guide 11 Protrusion 12 Window 13 Positioning pin 14 LSI
15 Wiring Board 16 External Wiring 17 Positioning Hole 18 Groove 19 Pad 20 Lens 21 Flat Plate 22 Mirror 23 Separating Groove 24 V-shaped Groove 25 Stopper 26 Pad 27 Screw 28 Pin 29 Elastic Body 30 Spring 31 Base 101 Wiring Board 102 Optical LSI Package 103 Light Element 104 Connector 105 Clamp 106 Optical fiber array 107 Mirror 108 Positioning hole 109 Window 110 Positioning pin 111 Clamp claw depression 201 Optical fiber array 202 Holding member 203 Upper structure 204 Optical element 205 Optical element mounting substrate 206 Anisotropic conductive sheet 207 Wiring Board 208 Fitting member 209 Positioning hole 210 Arc part 211 Opening part 212 Side plate part 213 Projection part 214 Positioning pin

Claims (10)

  1. 　基板と、導電性の接着層によって前記基板に接続された光素子と、前記基板上に設けられ前記光素子の上方に位置する受容器を有する光モジュールであって、前記受容器は前記コネクタを側面から保持する保持手段を有する、ことを特徴とする光モジュール。 An optical module comprising: a substrate; an optical element connected to the substrate by a conductive adhesive layer; and a receiver provided on the substrate and positioned above the optical element, wherein the receiver includes the connector An optical module comprising holding means for holding from a side.
  2. 　前記受容器が側板部を有し、前記側板部と前記コネクタの側面を係止する係止手段を有することを特徴とする請求項１に記載の光モジュール。 The optical module according to claim 1, wherein the receiver has a side plate portion, and has a locking means for locking the side plate portion and a side surface of the connector.
  3. 　前記係止手段が、前記側板部に連結する凸部または凹部である、ことを特徴とする請求項２に記載の光モジュール。 3. The optical module according to claim 2, wherein the locking means is a convex portion or a concave portion connected to the side plate portion.
  4. 　前記光素子を前記基板に対して位置決めする位置決め手段と、前記受容器を前記基板に対して位置決めする位置決め手段を有している、ことを特徴とする請求項１乃至請求項３いずれか一項に記載の光モジュール。 4. The apparatus according to claim 1, further comprising a positioning unit that positions the optical element with respect to the substrate and a positioning unit that positions the receiver with respect to the substrate. 5. The optical module as described in.
  5. 　前記受容器が、複数の前記側板部の間に平坦面を有する、ことを特徴とする請求項１乃至請求項４いずれか一項に記載の光モジュール。 The optical module according to any one of claims 1 to 4, wherein the receiver has a flat surface between the plurality of side plate portions.
  6. 　前記受容器が、前記コネクタに嵌合する位置決め手段を有する、ことを特徴とする請求項１乃至請求項５いずれか一項に記載の光モジュール。 The optical module according to any one of claims 1 to 5, wherein the receiver includes positioning means for fitting into the connector.
  7. 　前記光素子が、複数の光素子がアレイ状に配列した光素子アレイである、ことを特徴とする請求項１乃至請求項６いずれか一項に記載の光モジュール。 The optical module according to any one of claims 1 to 6, wherein the optical element is an optical element array in which a plurality of optical elements are arranged in an array.
  8. 　前記光素子が半導体レーザまたはフォトダイオード、あるいはその両方を含む、ことを特徴とする請求項１乃至請求項７いずれか一項に記載の光モジュール。 The optical module according to any one of claims 1 to 7, wherein the optical element includes a semiconductor laser, a photodiode, or both.
  9. 　前記基板が裏面電極を有し、前記裏面電極が配線基板に接続されている、ことを特徴とする請求項１乃至請求項８いずれか一項に記載の光モジュール。 The optical module according to any one of claims 1 to 8, wherein the substrate has a back electrode, and the back electrode is connected to a wiring substrate.
  10. 　基板の所定位置に導電性接着剤を塗布する工程と、光素子を前記導電性接着剤上に搭載する工程と、前記基板の所定位置に接着剤を塗布する工程と、前記接着剤上にコネクタを側面から保持する保持手段を有する受容器を搭載する工程と、前記導電性接着剤を硬化する工程と、前記接着剤を硬化する工程を有する、ことを特徴とする光モジュールの製造方法。 A step of applying a conductive adhesive to a predetermined position of a substrate; a step of mounting an optical element on the conductive adhesive; a step of applying an adhesive to a predetermined position of the substrate; and a connector on the adhesive A method of manufacturing an optical module, comprising: mounting a receiver having a holding means for holding the substrate from a side; curing the conductive adhesive; and curing the adhesive.
PCT/JP2013/004325 2012-07-20 2013-07-16 Optical module and method for producing same WO2014013713A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-161162 2012-07-20
JP2012161162 2012-07-20

Publications (1)

Publication Number Publication Date
WO2014013713A1 true WO2014013713A1 (en) 2014-01-23

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662561U (en) * 1993-01-31 1994-09-02 第一電子工業株式会社 Optical semiconductor module
JP2008191349A (en) * 2007-02-05 2008-08-21 Yazaki Corp Method of manufacturing optical communication module
JP2008250350A (en) * 2008-07-07 2008-10-16 Fujikura Ltd Optical connector
JP2009103998A (en) * 2007-10-24 2009-05-14 Fujikura Ltd Optical connector
JP2009192834A (en) * 2008-02-14 2009-08-27 Tomoegawa Paper Co Ltd Optical fiber and optical connection structure
JP2011059484A (en) * 2009-09-11 2011-03-24 Fujikura Ltd Optical path change member

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662561U (en) * 1993-01-31 1994-09-02 第一電子工業株式会社 Optical semiconductor module
JP2008191349A (en) * 2007-02-05 2008-08-21 Yazaki Corp Method of manufacturing optical communication module
JP2009103998A (en) * 2007-10-24 2009-05-14 Fujikura Ltd Optical connector
JP2009192834A (en) * 2008-02-14 2009-08-27 Tomoegawa Paper Co Ltd Optical fiber and optical connection structure
JP2008250350A (en) * 2008-07-07 2008-10-16 Fujikura Ltd Optical connector
JP2011059484A (en) * 2009-09-11 2011-03-24 Fujikura Ltd Optical path change member

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