JP2008191349A - Method of manufacturing optical communication module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical communication module that can improve the productivity. <P>SOLUTION: A temporary fixing process is performed including a first to a fourth process, and then a solder batch fusion jointing process and a solder cooling process are performed. The first process is for temporarily fixing a light-receiving/emitting element 11 with respect to a substrate 10; the second process is for temporarily fixing a modulation/demodulation IC 12 with respect to the substrate 10; the third process is for temporarily fixing an optical component 13 with respect to the substrate 10, in a manner of covering the temporarily fixed light-receiving/emitting element 11; and the fourth process is for temporarily fixing an optical fiber support component 14 with respect to the substrate 10, in a manner covering the temporarily fixed optical component 13. The solder batch fusion jointing process is a process in which the substrate 10 with each component temporarily fixed is placed in a reflow furnace to fuse the solder altogether, and thereby performing reflow soldering. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical communication module, and more particularly to a method for manufacturing an optical communication module using a self-alignment effect due to surface tension of molten solder.

  2. Description of the Related Art Conventionally, a technique for aligning an optical element (light emitting element or light receiving element) using a self-alignment effect due to the surface tension of molten solder is known. Further, it is known that there are a passive alignment method and an active alignment method in the alignment technique of the optical element. Regarding the passive alignment method, for example, the techniques are disclosed in Patent Documents 1 and 2 below. Further, regarding the active alignment method, for example, the technology is disclosed in Patent Document 1 below.

  The passive alignment method using the self-alignment effect automatically corrects the optical element mounted on the metal pad of the substrate to the normal bonding position by the surface tension when the solder balls arranged in a matrix are melted. Is the method. However, this automatic misalignment correction method using the surface tension of the molten solder is merely a technique capable of aligning the optical element and the metal pad of the substrate on which the optical element is mounted with high accuracy. Thus, there is a problem in that it is not an alignment method that guarantees that even the alignment with other optical components that exchange optical signals is performed with high accuracy.

Patent Document 1 below also discloses a technique that employs an active alignment method for solving the above problems. Specifically, by melting the solder balls and causing the self-alignment effect, the optical device is moved by a small distance in a predetermined correction direction while measuring the amount of light received from the optical component by the measuring device. The optical axis is aligned between the optical element and the optical component to solve the above problem.
Japanese Patent Laid-Open No. 2004-4195 JP-A-10-170769

  In the disclosed technique of Patent Document 1, since the optical axis is aligned using the measuring device, there is a problem that the positional deviation adjustment time using the measuring device affects the productivity. ing. Further, since the measuring device is used, there is a problem that the cost of the product is affected by the occurrence of the equipment cost and the like.

  By the way, in the disclosed technique of Patent Document 1, the positions of the optical components and the optical fiber are already determined before the mounting process of the optical element to the substrate, and the optical element is moved by a small distance toward the determined position. This is considered to be a method in which the optical axis alignment is good. Therefore, the process of fixing support parts for supporting optical parts and optical fibers and the mounting process described above are separate processes, and as a result, manufacturing requires multiple processes. It has a problem of affecting the sex.

  Further, in the technology disclosed in Patent Document 1, there is no description regarding the installation of the modulation / demodulation circuit of the optical element, and it is expected that the number of processes will be further increased for the installation of the modulation / demodulation circuit. Therefore, there is a problem that the productivity is further affected.

  Furthermore, in the disclosed technique of Patent Document 1, there is no description regarding prevention of deterioration due to oxidation, dew condensation, dust adhesion, and the like of the optical element and the light emitting / receiving surface due to the atmosphere, and the number of processes is further increased for countermeasures. It is predicted that. Therefore, there is a problem that the productivity is further affected.

  On the other hand, in the technology disclosed in Patent Document 2 based on the passive alignment method, a support portion for bonding and fixing an optical fiber is integrated with a substrate. The support portion is formed in a V-groove shape, and a portion that abuts the end portion of the optical fiber for positioning is also formed. In the case of the disclosed technique of Patent Document 2, since the support portion is integrated with the substrate, the productivity of the substrate itself is naturally not good, and the strength of the substrate is also difficult.

  In addition, in the disclosed technique of Patent Document 2, there is no description about installing an optical component between the optical element and the optical fiber, and it is predicted that the number of processes will be further increased for the installation of the optical component. . Accordingly, there is a problem that productivity is affected.

  This invention is made | formed in view of the situation mentioned above, and makes it a subject to provide the manufacturing method of the optical communication module which makes it possible to aim at productivity improvement.

  According to a first aspect of the present invention, there is provided a method of manufacturing an optical communication module according to the present invention, wherein the substrate side first metal pad provided on the substrate surface and the light emitting / receiving element are provided on the substrate surface based on the reference point of the substrate. A first step of temporarily fixing the light emitting / receiving element to the substrate surface with solder interposed between the light receiving / emitting element side metal pad, an electronic component provided on the substrate side second metal pad provided on the substrate surface A second step of temporarily fixing the electronic component to the substrate surface with solder interposed between the electronic component-side metal pad and the outer side of the substrate-side first metal pad based on the reference point. In a state where solder is interposed between the substrate-side third metal pad and the optical component-side metal pad provided on the optical component, the optical component is temporarily mounted on the substrate surface so as to cover the light receiving and emitting element in the temporarily fixed state. A third step of fixing, and the group Temporarily fixed state with solder interposed between the substrate-side fourth metal pad provided outside the substrate-side third metal pad and the support component-side metal pad provided on the optical fiber support component based on the point A temporary fixing step of each component to the substrate including a fourth step of temporarily fixing the optical fiber supporting component to the substrate so as to cover the optical component of the optical component; It is characterized by performing a solder batch melting and joining step for melting and reflow joining and a solder cooling step.

  According to the present invention having such a feature, the components in a temporarily fixed state with respect to the substrate are collectively reflow-bonded in the solder batch fusion bonding step. Each component is positioned with high accuracy by the self-alignment effect due to the surface tension of the molten solder. Each component is completely fixed to the substrate in the solder cooling process. When each component is positioned and fixed, the manufacture of the optical communication module is completed. According to the present invention, the substrate, the light emitting / receiving element, the optical component, the electronic component, and the optical fiber supporting component are collectively positioned and fixed, and a process of aligning and fixing individually is unnecessary.

  A method for manufacturing an optical communication module according to a second aspect of the present invention is the method for manufacturing an optical communication module according to the first aspect, wherein at least the third step and the fourth step are performed in an inert gas atmosphere, The periphery of the light emitting / receiving element covered with the optical component is sealed with solder of the optical component, or is sealed with the solder and a thermosetting resin applied to the optical component or a filled underfill. Yes.

  According to the present invention having such characteristics, the third step and the fourth step are performed in an inert gas atmosphere, and the light emitting and receiving element is sealed with the inert gas when the manufacture is completed. The optical communication module is manufactured in a state where the light emitting / receiving element does not touch the atmosphere. The optical component has a function as a component for sealing the light emitting / receiving element.

  As the solder, solder paste or solder bumps are used. The solder bump includes spherical solder balls, and includes various shapes of bulk solder. In particular, regarding solder corresponding to light emitting / receiving elements and electronic components, all forms of solder used for flip chip bonding can be cited. In addition, examples of the inert gas include nitrogen gas and argon gas.

  According to the first aspect of the present invention, it is possible to provide a manufacturing method capable of improving the productivity of the optical communication module.

  According to the second aspect of the present invention, there is an effect that it is possible to prevent deterioration of the light emitting / receiving element and the light emitting / receiving surface due to the atmosphere due to oxidation, dew condensation, dust adhesion, and the like.

  Hereinafter, description will be given with reference to the drawings. 1A and 1B are schematic views showing an embodiment of a method for manufacturing an optical communication module of the present invention. FIG. 1A is a configuration diagram of an optical connector including the optical communication module, and FIG. 1B is a perspective view of the optical communication module. FIG. 2 is a diagram related to the manufacturing process of the optical communication module, (a) is a flowchart, (b) is a schematic diagram of the manufacturing process, FIG. 3 is a perspective view of the substrate, and FIG. 4 is the first in the temporary fixing process. FIG. 5 is an explanatory view of the third step in the temporary fixing step, FIG. 6 is an explanatory view of the fourth step in the temporary fixing step, and FIG. 7 is a perspective view of the optical communication module immediately after manufacturing. is there.

  In FIG. 1, reference numeral 1 indicates an optical communication module manufactured by the manufacturing method of the present invention. Reference numeral 2 indicates an optical connector as an example of an apparatus including the optical communication module 1. The optical connector 2 includes an optical communication module 1 and an optical connector housing 3. The optical connector 2 is electrically connected to, for example, the mother board 4 via the optical communication module 1. The optical connector 2 is fixed to the mother board 4 via the optical connector housing 3.

  The optical connector 2 is structured such that the optical connector 5 and the optical communication module 1 are optically connected when the optical connector 5 to be connected is fitted. The optical connector 5 to be connected includes a ferrule 7 provided at the end of the optical fiber 6, an optical connector housing 8 that houses the ferrule 7, and an elastic member 9 that biases the ferrule 7. .

  Hereinafter, the optical communication module 1 will be described with reference to FIGS. First, an example of the configuration will be described, and then a method for manufacturing the optical communication module 1 will be described.

  The optical communication module 1 of the present embodiment is not particularly limited, but enables single-core bidirectional optical communication, and includes a substrate 10, light emitting / receiving elements 11 and 11, and a modulation / demodulation IC (electronic component) 12. And an optical component 13 and an optical fiber support component 14. The light receiving and emitting elements 11 and 11 of this embodiment are VCSEL (vertical cavity surface emitting laser) on the left side in the drawing and PD (photodiode) on the right side (assumed as an example). Moreover, the optical component 13 of this embodiment is an optical multiplexing / demultiplexing element (assumed as an example).

  The substrate 10 serves as a platform and a TRX substrate. In this embodiment, a general printed circuit board (a glass epoxy substrate (FR4 substrate) or the like) is used. A printed pattern serving as a desired path is provided on the surface of the substrate 10. The printed pattern includes a VCSEL pad (substrate-side first metal pad) indicated by reference numeral 15, a PD pad (substrate-side first metal pad) indicated by reference numeral 16, and an electronic component pad (substrate) indicated by reference numeral 17 Side second metal pads), optical component pads (substrate side third metal pads) indicated by reference numeral 18, and optical fiber support component pads (substrate side fourth metal pads) indicated by reference numeral 19 are provided at a plurality of locations. It has been.

  The optical component pad 18 is arranged and formed so as to substantially surround the VCSEL pad 15 and the PD pad 16 outside. The optical component pad 18 in this embodiment is formed in a state where it is partially cut off due to the wiring between the light emitting / receiving elements 11, 11 and the modem IC 12 (the wiring from the light receiving / emitting element 11 is connected). When there is no wiring on the substrate surface, such as when it is provided in the inner layer of the substrate 10, there is no need to divide the optical component pad 18). The optical fiber support component pads 19 are arranged and formed near the four corners of the substrate 10 outside the optical component pads 18 and the electronic component pads 17.

  The printed pattern is formed in accordance with the shape and width of various metal pads (16 to 19). On the surface of the substrate 10, reference numeral 20 denotes an operation transmission circuit, and reference numeral 21 denotes an interface pin connection portion.

  The print pattern is dimensionally designed with reference point A (point A serving as the optical axis) serving as the optical axis as a reference. The printed pattern is dimensioned so that the dimensional error with respect to the optical axis is small. Naturally, the various metal pads (16 to 19) provided in such a printed pattern are dimensionally designed based on the reference point A so that a dimensional error with respect to the optical axis is reduced.

  The solder paste 22 is printed on the various metal pads (16 to 19) by silk printing or solder jet printer. In the present invention, after mounting the corresponding parts on the various metal pads (16 to 19), by using the self-alignment effect described later, each part and the optical axis are matched with high accuracy. Yes.

  The light emitting / receiving element 11 is a known element that can be flip-chip mounted, and has a plurality of light receiving / emitting element side metal pads 23. Since the light emitting / receiving element 11 is a known element (VCSEL, PD) as described above, detailed description thereof is omitted here. In the figure, solder bumps 24 are provided on the light emitting / receiving element side metal pads 23.

  The modem IC 12 is a known electronic component that can be flip-chip mounted, and has a plurality of electronic component side metal pads 25. Since the modulation / demodulation IC 12 is related to the light emitting / receiving element 11 and is a known electronic component, a detailed description thereof will be omitted here. In the figure, the electronic component side metal pads 25 are provided with solder bumps 24 in the same manner as the light emitting / receiving element 11.

  The optical component 13 is a transparent component that is interposed between the light emitting / receiving elements 11 and 11 and the optical fiber 6 and transmits an optical signal. The main body 26 of the optical component 13 has an optical waveguide 27 inside. is doing. The optical waveguide 27 has two 45 ° mirrors as shown in the figure, although no reference numerals are given. The optical component 13, in other words, the main body 26 is formed in, for example, the shape shown in the figure so as to cover the light emitting / receiving elements 11 and 11.

  The main body 26 is provided with an optical component side metal pad 28. Solder bumps 29 are provided on the optical component side metal pads 28. The solder bumps 29 are adjusted to a desired amount of solder so that the height of the optical component 13 after mounting can be determined. That is, by adjusting the amount of solder, a safe distance from the light emitting / receiving element 11 and a distance with the best optical coupling are ensured. A modified example of the optical component 13 will be described later. The optical component 13 may be, for example, a lens or a configuration having a lens.

  The optical fiber support component 14 includes a sleeve 30 that guides the ferrule 7 at the end of the optical fiber 6 to a predetermined position, and a sleeve support base 31 that is coupled to the base end portion of the sleeve 30. The sleeve 30 and the sleeve support base 31 are integrally formed. Four leg portions 32 are formed on the sleeve support base 31. Each leg portion 32 is provided with a metal pad 33 for supporting parts. In the figure, solder bumps 34 are provided on the support component metal pads 33. The sleeve support 31 is formed in, for example, the shape shown in the figure so as to cover the light emitting / receiving elements 11, 11, the modulation / demodulation IC 12, and the optical component 13.

  Next, manufacture of the optical communication module 1 will be described. In the optical communication module 1, the substrate 10, the light emitting / receiving element 11, the optical component 13, the modulation / demodulation IC 12, and the optical fiber support component 14 are positioned and fixed collectively, thereby eliminating the need for individual alignment and fixing. It is manufactured using the manufacturing method.

  As shown in the flowchart of FIG. 2A, the method for manufacturing the optical communication module 1 includes a solder (solder paste) printing process, a temporary fixing process including a first process to a fourth process, and then a solder batch melting and bonding process. And a solder cooling process.

  The solder (solder paste) printing step, the temporary fixing step including the first step to the fourth step, and the solder batch melting and bonding step are performed in a nitrogen gas atmosphere (from the third step to the solder batch melting and bonding step). Up to nitrogen gas atmosphere).

  The solder (solder paste) printing process is a process of patterning the substrate 10 and printing the solder paste 22. In this step, the solder paste 22 is printed on various metal pads (16 to 19) by silk printing or a solder jet printer. Although not specifically explained, it is assumed that the manufacture of solder bumps for each component is performed at a necessary time.

  The first step is a step of temporarily fixing the light emitting / receiving elements 11, 11 to the substrate 10. In this first step, the light emitting / receiving element side metal pads 23 of the light emitting / receiving elements 11, 11 and the VCSEL of the substrate 10. The light emitting / receiving elements 11 and 11 are temporarily fixed (mounted) to the substrate 10 with the solder bumps 24 and the solder paste 22 interposed between the pad 15 for PD and the pad 16 for PD. Note that a dedicated mounter is used for temporarily fixing each component including the light emitting and receiving elements 11 and 11.

  The second step is a step of temporarily fixing the modulation / demodulation IC 12 to the substrate 10. In this second step, soldering is performed between the electronic component side metal pad 25 of the modulation / demodulation IC 12 and the electronic component pad 17 of the substrate 10. The modem IC 12 is temporarily fixed to the substrate 10 with the bumps 24 and the solder paste 22 interposed.

  The third step is a step of temporarily fixing the optical component 13 to the substrate 10 so as to cover the light receiving and emitting elements 11 and 11 in the temporarily fixed state. In this third step, the optical component side metal of the optical component 13 is used. The optical component 13 is temporarily fixed to the substrate 10 with the solder bumps 29 and the solder paste 22 interposed between the pads 28 and the optical component pads 18 of the substrate 10.

  The optical component pad 18 has a portion that is partially cut as described above. With respect to the partially cut portion, the optical component 13 is coated with a thermosetting resin 35 at a position corresponding to the partially cut portion (instead of the thermosetting resin 35, an underfill may be filled. Suppose). The optical component 13 is temporarily fixed to the substrate 10 in a state where the thermosetting resin 35 is applied. When the optical component 13 is temporarily fixed to the substrate 10, the thermosetting resin 35 is in a state of filling a partially cut portion of the substrate 10.

  The fourth step is a step of temporarily fixing the optical fiber support component 14 to the substrate 10 so as to cover the optical component 13 in the temporarily fixed state. In this fourth step, the support component for the optical fiber support component 14 is used. The optical fiber support component 14 is temporarily fixed to the substrate 10 with the solder bumps 34 and the solder paste 22 interposed between the metal pad 33 and the optical fiber support component pad 19 of the substrate 10.

  When a series of temporary fixing processes are completed, the process proceeds to a solder batch melting and joining process which is the next process. The solder batch fusion bonding step is a step in which the substrate 10 on which each component is temporarily fixed is placed in a reflow furnace (not shown), and solder (solder bumps or solder paste) is melted in a lump, thereby reflow bonding. In the solder batch melting and joining step, the self-alignment effect by the surface tension of the melted solder is obtained, and positioning is performed with high accuracy without alignment.

  After that, when the solder is cooled in the solder cooling process, each component is completely fixed to the substrate 10 in a highly accurate positioning state. When each component is positioned and fixed, the manufacture of the optical communication module 1 is completed. In addition, when said thermosetting resin 35 hardens | cures, sealing by the said nitrogen gas of the light emitting / receiving elements 11 and 11 will also be completed. The optical communication module 1 is manufactured in a state in which the light emitting / receiving elements 11 and 11 do not come into contact with the atmosphere, in other words, in a state in which deterioration is prevented.

  Through the above steps, the components are positioned and fixed together. Therefore, the optical communication module 1 can be manufactured by a manufacturing method with good productivity. In addition to these effects, the characteristic is related to optical axis alignment by the self-alignment effect during reflow, and the accuracy required for optical axis alignment is the category of component mounting processes on general printed circuit boards (print pattern formation, soldering). The amount of the metal pad pattern on the component side), thereby eliminating the alignment work step such as the active alignment method.

  According to the present invention, since the optical communication module 1 can be manufactured only by solder printing on a printed circuit board that can be automated, component mounting, and a reflow process, the productivity can be significantly improved as compared with the prior art.

  FIG. 8 shows a modification of the optical communication module. The optical communication module 1 'shown in FIG. 8 includes an optical component 13' having a shape as shown in the figure capable of bending by 90 °, and an optical fiber support component in which the orientation of the sleeve 30 is changed so as to correspond to the optical component 13 '. 14 '. The optical communication module 1 'can change the electrical connection direction with respect to the mother board 4 (see FIG. 1).

  FIG. 9 shows a modification of the optical component. The optical component 41 in FIG. 9 is a modification of the optical component 13 in FIG. 1, and the shape of the optical waveguide 42 is different. The optical waveguide 42 has two 45 ° mirrors 43 and has a substantially crank-like elongated path shown in the figure. The main body 26 and the optical component side metal pad 28 are basically the same as described above. The portion indicated by the reference sign B is a portion filled with, for example, an underfill after the solder is fixed.

  In FIG. 9B, regarding the substrate 10 on which the optical component 41 is mounted, the light receiving and emitting elements 11 and 11 here are a VCSEL (vertical cavity surface emitting laser) on the right side and a PD (photodiode) on the left side. It has become. The portion indicated by the reference character C is a portion that is filled with, for example, an underfill after the solder is fixed due to the presence of the transmission path 44.

  The manufacture of the optical component 41 will be described with reference to FIGS. As shown in FIG. 10, a convex mold 52 having a convex pattern 51 is used to form a transparent substrate portion 53 and a concave pattern 54 that forms an optical waveguide. Next, as shown in FIG. 11A, a core agent and an adhesive having a refractive index higher than that of the substrate portion 53, such as a UV curable adhesive 55, are poured into the concave pattern 54 more than the volume of the concave pattern 54. . Next, as shown in FIG. 11B, another substrate portion 56 having no pattern is pressure-bonded to cure the UV curing adhesive 55. As a result, a substrate block 58 having a plurality of optical waveguides 57 as shown in FIG. Next, cutting is performed as shown in FIG. 12B, and the surface having the end face of the optical waveguide 57 is polished as shown in FIG. Then, as shown in FIGS. 13B and 13C, when the optical component side metal pads 28 and the solder bumps 29 are provided, a series of manufacturing steps is completed.

  The optical component 61 in FIG. 14 is an example corresponding to the optical component 13 ′ in FIG. It has an optical waveguide 62 that can be bent by 90 °. In addition, the part shown with the quotation mark B differs from the said other example. The optical component 63 is an example in which a wavelength selection filter 64 is inserted in the middle of the optical waveguide 62 when a signal serving as a noise component is large enough to adversely affect RX when wavelength division multiplexing communication is realized.

  FIG. 15 shows an example of optical components 71 and 72 that enable two-core bidirectional optical communication. The pair of optical waveguides 73 of the optical component 71 are formed straight. The pair of optical waveguides 74 of the optical component 72 has a 45 ° mirror 75 and is formed in an L shape.

  In addition, it goes without saying that the present invention can be variously modified without departing from the spirit of the present invention.

  The optical connector 2 described above is configured to perform only optical communication. However, the present invention is not limited to this, and for example, even a hybrid connector configured such that an electrical connector and an optical connector are integrated. Be good. The optical connector 5 to be connected may be configured to be a pigtail portion of the optical connector. Furthermore, regarding the optical communication module 1 ′ of FIG. 8, it may be configured to correspond to the pigtail portion of the optical connector with the configuration as shown in the figure.

  Here, a supplementary explanation regarding the present invention will be given. In recent years, it has been pointed out that alignment work processes and wire bonding take time and increase costs. In recent years, a higher-speed communication band is required, and it is predicted that a circuit design capable of high-speed transmission will be required. Therefore, low-cost optical communication modules with high communication bandwidth (including FOT. (1) High productivity, (2) Good optical coupling, (3) Small size, (4) About 50-150 Mbps of current products On the other hand, it is considered that a high-speed communication band of 2.5 Gbps or more, for example, will be required in the future.

  In the present invention, among the surface mounting processes generally considered to have high productivity, the reflow process is provided with an optical alignment function, a component fixing function, and a light emitting / receiving element sealing function. , Satisfying (2) and designing circuit patterns capable of high-speed and high-speed communication on a printed circuit board generally used for surface mounting, and satisfying (3) and (4) above, An optical communication module that satisfies the above can be manufactured at high speed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows one Embodiment of the manufacturing method of the optical communication module of this invention, (a) is a block diagram of the optical connector containing an optical communication module, (b) is a perspective view of an optical communication module. . It is a figure which concerns on the manufacturing process of an optical communication module, (a) is a flowchart, (b) is a schematic diagram of a manufacturing process. It is a perspective view of a board | substrate. It is explanatory drawing of the 1st process in a temporary fixing process, and a 2nd process. It is explanatory drawing of the 3rd process in a temporary fixing process. It is explanatory drawing of the 4th process in a temporary fixing process. It is a perspective view of the optical communication module immediately after manufacture. It is a typical block diagram which shows the modification of an optical communication module. It is a typical figure which shows the modification of an optical component, (a) is a perspective view of an optical component, (b) is a perspective view of the state containing a board | substrate. It is manufacturing explanatory drawing (process 1) of an optical component. It is manufacturing explanatory drawing (process 2) of an optical component (process 3). It is manufacturing explanatory drawing (process 4) of an optical component (process 5). It is manufacturing explanatory drawing (process 6), (process 7), and (process 8) of an optical component. It is a schematic diagram which shows the modification of an optical component, (a) is a perspective view of an optical component, (b) is a perspective view of the optical component containing a filter. It is a schematic diagram which shows the modification of an optical component, (a) is a perspective view of an optical component with a straight optical waveguide, (b) is a perspective view of the optical component which can be bent 90 degree | times.

Explanation of symbols

A reference point 1 optical communication module 2 optical connector 3 optical connector housing 4 motherboard 5 optical connector 6 optical fiber 7 ferrule 8 optical connector housing 9 elastic member 10 substrate 11 light emitting / receiving element 12 modulation / demodulation IC (electronic component)
13 Optical Component 14 Optical Fiber Support Component 15 VCSEL Pad (Substrate Side First Metal Pad)
16 Pad for PD (first metal pad on substrate side)
17 Pad for electronic parts (second metal pad on substrate side)
18 Optical component pads (third metal pads on the substrate side)
19 Optical fiber support component pad (substrate side fourth metal pad)
20 Actuation Transmission Circuit 21 Interface Pin Connection 22 Solder Paste (Solder)
23 Light emitting / receiving element side metal pad 24 Solder bump (solder)
25 Electronic Component Side Metal Pad 26 Body 27 Optical Waveguide 28 Optical Component Side Metal Pad 29 Solder Bump (Solder)
30 Sleeve 31 Sleeve support base 32 Leg 33 Metal pad for support part 34 Solder bump (solder)
35 Thermosetting resin

Claims (2)

The light emitting / receiving element is placed on the substrate surface with solder interposed between the first metal pad on the substrate side provided on the substrate surface based on the reference point of the substrate and the metal pad on the light emitting / receiving element side provided on the light emitting / receiving element. The first step of temporarily fixing to,
A second step of temporarily fixing the electronic component to the substrate surface in a state where solder is interposed between the substrate-side second metal pad provided on the substrate surface and the electronic component-side metal pad provided on the electronic component;
Temporarily fixed state with solder interposed between the substrate-side third metal pad provided outside the substrate-side first metal pad and the optical component-side metal pad provided on the optical component based on the reference point A third step of temporarily fixing the optical component to the substrate surface so as to cover the light emitting / receiving element of
In a state where solder is interposed between the substrate-side fourth metal pad provided outside the substrate-side third metal pad based on the reference point and the support component-side metal pad provided in the optical fiber support component, After performing a temporary fixing step on the substrate of each component, including a fourth step of temporarily fixing the optical fiber support component to the substrate so as to cover the optical component in a fixed state,
A method of manufacturing an optical communication module, comprising: performing a solder batch melting and joining step of melting the solder on the whole substrate at once and performing reflow joining; and a solder cooling step. In the manufacturing method of the optical communication module according to claim 1,
At least the third step and the fourth step are performed in an inert gas atmosphere, and the periphery of the light emitting / receiving element covered with the optical component is sealed with solder of the optical component, or the solder and the optical component are sealed Sealing with applied thermosetting resin or filled underfill. A method for manufacturing an optical communication module.

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