JP2008090218A - Optical element module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element module capable of easily performing a highly precise positioning between an optical waveguide and an optical element. <P>SOLUTION: In the optical element module 100, a first region 16 having a liquidphilic property to a material constituting an adhesive 50 is formed at a part of the optical waveguide 10 which transmits light 60, a second region 26 having the liquidphilic property to the material composing the adhesive 50 is formed also on the surface of an optical element 20 on which the light ray 60 transmitted in the optical waveguide 10 is emitted or made incident, and the optical waveguide 10 and the optical element 20 are fixed by the adhesive 50 formed between the first region 16 and the second region 26. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical element module, and more particularly to a module including an optical element optically connected to an optical waveguide.

  In the mobile information home appliances field such as mobile phones, digital cameras, and portable game machines, the amount of data handled is increasing in recent years. As the amount of information handled increases, very high-speed data exchange is required inside the device. However, the electrical wiring using metal has a problem that the transmission speed is low, the electrical signal is transmitted with a delay, and noise is easily generated due to the mutual interference of the electrical signals between the wirings. In particular, in recent years, it has been required to increase the density of wiring in response to demands for smaller and lighter devices, but the higher the density of wiring, the greater the mutual interference of electrical signals between the wirings. This problem becomes more and more serious.

  As a technique for solving this problem, attention has been paid to an optical circuit mounting technique or an optical module using optical wiring. The optical module includes a substrate, an optical element mounted on the substrate, and an optical waveguide, and an optical signal is transmitted from the light emitting element to the light receiving element via the optical waveguide. In an optical module using such an optical signal, transmission at a GHz level is possible, and problems such as delay of the optical signal and mutual interference do not occur. However, unlike an electrical signal, an optical signal has characteristics such as straight travel and diffusion. Therefore, the optical signal is optically connected between the optical element and the optical waveguide so that the optical signal does not leak outside the optical path (optical connection). )Must.

  For optical connection between the optical element and the optical waveguide, it is simplest to connect the light emitting (receiving) surface of the optical element and the end face of the optical waveguide close to each other, but in order to obtain a high optical coupling effect In this case, the relative positional deviation between the two is allowed only on the order of submicron, which is not easy as compared with the case of electrical connection in which conductors need to contact each other.

  Therefore, various methods (for example, Patent Document 1 and Patent Document 2) have been proposed as methods for optically connecting the optical element and the optical waveguide.

  For example, Patent Document 1 discloses an optical signal input / output device that realizes optical connection using a microlens. This optical signal input / output device is composed of a surface emitting (receiving) optical element and an output (input) side optical waveguide that guides an outgoing (input) optical signal, and is further output from the surface emitting (receiving) optical element. Two microlenses are arranged in the optical path of the outgoing (input) force signal light reaching the (input) force-side optical waveguide.

  The beam emitted from the surface light emitting element becomes collimated (collimated) light by the first microlens, and subsequently becomes convergent light by the second microlens, and enters the core of the output side optical waveguide. A similar configuration is also used for input signal light. In this way, the microlenses are interposed therebetween to converge the light, whereby the surface emitting (receiving) light element and the output (input) force side optical waveguide are optically connected.

  On the other hand, Patent Document 2 discloses a configuration of an optical circuit that realizes optical connection by inserting and fixing an optical pin (for example, an optical fiber). This optical circuit is composed of a substrate, an electronic element, a laser diode, and a light emitting IC that drives the laser diode, and further includes an optical waveguide formed inside the substrate, a through-hole penetrating the optical waveguide, And an optical pin to be inserted into the through hole. In the optical pin, one end of the optical fiber is obliquely processed to form a reflection surface, and the optical pin is inserted into the through hole so that the reflection surface exists in the optical waveguide.

An electric signal of the electronic element is converted into an optical signal by a laser diode via a light emitting IC. When the optical signal of the laser diode is incident from one end of the optical pin inserted into the through hole, it travels inside the core of the optical pin and is reflected by the reflecting surface. The optical signal is changed by the reflection of the reflecting surface, passes through the clad of the optical pin, and is emitted to the optical waveguide. A similar configuration is used for input signal light. The optical pin inserted and fixed in this manner is interposed, and the optical element (laser diode) and the optical waveguide are optically connected.
JP 2001-185752 A JP 2004-157438 A

  In the case of the optical signal input / output device of Patent Document 1, it is possible to obtain a large allowable error range with respect to the positional deviation between the optical element and the optical transmission path by interposing the microlens and converging the light. Although possible, the configuration of a device with a microlens is very complex. In addition, since the number of steps for forming the microlens is added, the number of steps is increased, and the material cost and cost are also increased, which causes a problem from the viewpoint of economy.

  In addition, when the position accuracy of the formed microlens itself is low, the optical axes of the optical element and the microlens may be shifted, resulting in a problem that the optical coupling efficiency is lowered. Therefore, even if a microlens is used, in order to realize optical connection, it is indispensable to minimize the positional deviation between the microlens and the optical element, and there is a need for highly accurate alignment. no change.

  Also, in the case of the optical circuit in which the optical pin of Patent Document 2 is inserted, the configuration of the optical circuit having the optical pin inserted and fixed is very complicated, like the device disclosed in Patent Document 1, In addition, there are problems such as an increase in the number of processes and costs.

  Further, although a technique for optically connecting an optical pin and an optical waveguide by a reflecting surface provided on the optical pin is disclosed, a technique for optically connecting an optical pin and an optical element (laser diode) is disclosed. Not. Therefore, even in the case of using an optical pin, in order to realize optical connection, it is indispensable to minimize the positional deviation between the optical pin and the optical element, and high-precision alignment is still required. It does not change to a point.

  The present invention has been made in view of such a point, and a main object thereof is to provide an optical element module capable of easily performing highly accurate alignment between an optical waveguide and an optical element.

  The optical element module of the present invention is an optical element module comprising: an optical waveguide that transmits light; and an optical element that is optically connected to the optical waveguide and that emits or enters light transmitted by the optical waveguide. In addition, a first region having lyophilicity with respect to the material constituting the adhesive is formed in a part of the optical waveguide, and the surface of the optical element is also formed with respect to the material constituting the adhesive. A second region having lyophilicity is formed, and the optical waveguide and the optical element are fixed by the adhesive formed between the first region and the second region.

  In a preferred embodiment, the core located on the end face of the optical waveguide and the emission part or the incident part of the optical element are positioned in a self-aligned manner by the surface tension of the material constituting the adhesive.

  In a preferred embodiment, the adhesive is made of a resin.

  In a preferred embodiment, the adhesive is made of a material that cures a liquid containing a photo-curing or thermosetting resin.

In a preferred embodiment, the optical waveguide and the optical element are disposed on a wiring board,
A part of the optical waveguide is further formed with a third region having lyophilicity with respect to the material constituting the adhesive, and the wiring board is also provided with respect to the material constituting the adhesive. A fourth region having lyophilicity is formed, and the optical waveguide and the wiring board are fixed by the adhesive formed between the third region and the fourth region.

  In a preferred embodiment, the first region is formed in a region surrounded by a liquid repellent layer that repels the material constituting the adhesive.

  In a preferred embodiment, the second region is an electrode pattern formed on the surface of the optical element.

  In a preferred embodiment, the optical element is accommodated in a recess formed in the wiring board.

  In a preferred embodiment, the emission part or the incident part of the optical element is formed on substantially the same plane as the surface of the wiring board.

  In a preferred embodiment, at least one electrode is formed on the back surface of the optical element, and the electrode is connected to the electric wiring of the wiring board via a conductive adhesive supplied to the wiring board. And are electrically connected.

  An optical element module manufacturing method of the present invention is an optical element module manufacturing method including an optical waveguide that transmits light and an optical element that emits or enters light, and is a lyophilic solution with respect to a first liquid. A step (a) of preparing an optical waveguide in which a first region having a property is formed and an optical element in which a second region having a lyophilic property with respect to the first liquid is formed; A step (b) of supplying the first liquid to at least one of the first region and the second region of the optical element; and the first region and the second region as the first liquid. A step (c) of performing alignment between the optical element and the optical waveguide with the surface tension of the first liquid by contacting with the first optical liquid.

In a preferred embodiment, the first liquid is made of a material constituting an adhesive,
After the step (c), the method further includes a step of curing the adhesive to fix the optical waveguide and the optical element.

  In a preferred embodiment, the adhesive is made of a material that cures a liquid containing a photo-curing resin or a thermosetting resin.

  In a preferred embodiment, the method further includes supplying a second liquid different from the first liquid, and the second liquid is made of an adhesive, and after the step (c), the adhesive Is further cured to fix the optical waveguide and the optical element.

  In a preferred embodiment, in the step (c), the core located on the end face of the optical waveguide and the emission part or the incident part of the optical element are self-aligned by the surface tension of the first liquid. Positioned and optically connected.

  In a preferred embodiment, after the step (c), the method further includes a step of fixing the optical element aligned with the optical waveguide to a wiring board.

  In a preferred embodiment, the optical element in the step (a) is an optical element fixed to a wiring board.

  In a preferred embodiment, the optical element is accommodated in a recess formed in the wiring board.

  In a preferred embodiment, at least one electrode is formed on the back surface of the optical element, and the electrode is electrically connected to the electrical surface of the wiring board via a conductive adhesive supplied to the bottom surface of the recess. It is electrically connected to the wiring.

  In a preferred embodiment, the first region of the optical waveguide prepared in the step (a) is irradiated with light or plasma through a mask having an opening pattern that defines the first region. Formed by.

  In a preferred embodiment, the light or plasma irradiated through the mask is irradiated onto a laminated film laminated on the optical waveguide.

  In a preferred embodiment, the laminated film is a liquid repellent layer that repels the first liquid.

  According to the optical element module of the present invention, a first region having lyophilicity with respect to the material constituting the adhesive is formed in a part of the optical waveguide that transmits light, and the optical waveguide transmits the optical waveguide. A second region having lyophilicity with respect to the material constituting the adhesive is also formed on the surface of the optical element from which light is emitted or incident. The optical waveguide and the optical element include the first region and the second region. Since it is fixed by the adhesive formed between the regions, the alignment between the optical waveguide and the optical element can be performed in a self-aligned manner by the surface tension of the material constituting the adhesive. As a result, highly accurate alignment can be easily performed.

  Embodiments according to the present invention will be described below with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.

  An optical element module according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 schematically shows a cross-sectional configuration of an optical element module 100 of the present embodiment.

  The optical element module 100 according to this embodiment includes an optical waveguide 10 that transmits light 60 and an optical element 20 that emits or enters light 60 transmitted by the optical waveguide 10.

  The optical waveguide 10 is a linear member capable of transmitting the light 60. In the present embodiment, the optical waveguide 10 of an optical fiber is used as the optical waveguide 10. The optical waveguide 10 of an optical fiber includes a core 12 having a high refractive index (portion through which light passes) and a clad 14 having a low refractive index surrounding the core 12 (portion that encloses light). An optical element 20 is disposed below the tip of the optical waveguide 10.

  The optical element 20 is, for example, an optical element 20 that emits light such as a semiconductor laser when the light 60 is emitted, or an optical element 20 that receives light such as a photodiode when the light 60 is incident. . In the illustrated example, a surface emitting laser (VCSEL) is used as the optical element 20. Laser light (light 60) is emitted in the vertical direction (upward in the figure) from the emitting portion 22 of the surface emitting laser.

  The optical element 20 and the optical waveguide 10 are optically connected (optical connection). In the present embodiment, the end face 18 of the optical waveguide 10 is cut obliquely (for example, by 45 °), and the light 60 is reflected by the end face 18 of the optical waveguide to optically connect the optical waveguide 10 and the optical element 20. Yes. The light 60 emitted from the optical element 20 is reflected by the end face 18 of the optical waveguide 10 and travels in the direction of the arrow in the core 12 of the optical waveguide 10 of the optical fiber. In addition, the reflective surface of the end surface 18 is not limited to the formation method by a cut, and naturally surface processing (for example, gold vapor deposition etc.) may be performed in order to improve a reflectance.

  A part of the optical waveguide 10 is formed with a first region 16 that is lyophilic with respect to the material constituting the adhesive 50. A second region 26 having lyophilicity with respect to the material constituting the adhesive 50 is also formed on the surface of the optical element 20.

  An adhesive 50 is provided between the first region 16 and the second region 26. The adhesive 50 is a resin that fixes the optical waveguide 10 and the optical element 20, and is made of, for example, a material that cures a liquid material including photocuring or thermosetting resin.

  In the optical element module 100 of the present embodiment, the first region 16 and the second region 26 that are lyophilic with respect to the material constituting the adhesive 50 are formed on a part of the optical waveguide 10 and the surface of the optical element 20. Is formed. And since the optical waveguide 10 and the optical element 20 are being fixed by the adhesive agent 50 formed between the 1st area | region 16 and the 2nd area | region 26, by the surface tension of the material which comprises the adhesive agent 50, The alignment between the optical waveguide 10 and the optical element 20 can be performed in a self-aligning manner, and therefore, highly accurate alignment can be easily performed.

  Further, the point that the optical waveguide 10 and the optical element 20 can be positioned in a self-aligned manner will be described with reference to FIGS.

  First, as shown in FIG. 2A, the optical waveguide 10 and the optical element 20 are arranged to face each other. Next, as shown in FIG. 2B, an adhesive 50 is supplied to the first region 16 of the optical waveguide 10 to form droplets. The adhesive 50 is in a pre-curing stage, and is, for example, a liquid containing a photo-curing resin before curing. From this state, the optical waveguide 10 is lowered in the direction of the arrow 30 to bring the first region 16 and the second region 26 of the optical element 20 closer to each other. Then, as shown in FIG. 2C, the first region 16 and the second region 26 come into contact with each other through the droplet of the adhesive 50.

  When the first region 16 and the second region 26 come into contact with each other, the optical element 20 is pulled in the direction of the arrow 32 by the surface tension of the liquid material included in the adhesive 50. Then, as shown in FIG. 2D, the optical element 20 moves to a position where the first region 16 and the second region 26 face each other. In this way, alignment between the optical waveguide 10 and the optical element 20 is performed in a self-aligning manner.

  In a typical optical element module, alignment between the optical waveguide and the optical element is mechanically controlled, and alignment is performed using a mounter while checking whether the optical axis is shifted for each chip. Although it is necessary, in the optical element module 100 of this embodiment, since it is self-aligned (positioned in a self-aligned manner) by the surface tension of the material constituting the adhesive 50, precise alignment is realized with high reliability. be able to. In addition, since the optical waveguide 10 and the optical element 20 can be optically connected with a very simple configuration, there is an advantage that the manufacturing cost can be reduced.

  Note that the first region 16 is lyophilic with respect to the material constituting the adhesive 50, that is, the first region 16 is relative to the surrounding region of the lower surface of the optical waveguide 10. It means that it is comprised so that wettability may become high (it will become favorable). Similarly, the second region 26 is also lyophilic with respect to the material constituting the adhesive 50, that is, the second region 26 is relative to the surrounding region of the upper surface 25 of the optical element 20. It means that it is comprised so that wettability may become high.

  An example of a configuration in which the first region 16 has better wettability than the surrounding region will be described using Young's equation. The contact angle θ between the first region 16 and the droplet of the adhesive 50 formed in the first region 16 (the angle formed between the tangent of the droplet drawn from the three-phase contact point and the first region 16) is Using the Young's equation, it can be expressed as:

Young's formula: γs = γws + γw · cos θ
cos θ = (γs−γws) / γw
Here, γw represents the surface tension of the droplet, γws represents the interfacial tension between the first region 16 and the droplet, and γs represents the surface tension of the first region 16.

  The contact angle θ between the first region 16 and the droplet is used as an index representing the “wetting property” of the first region 16. Specifically, as the contact angle θ decreases, the wettability of the first region 16 improves. As the contact angle θ increases, the wettability of the first region 16 decreases. Therefore, in order to improve the wettability of the first region 16, the interface tension γws between the first region 16 and the liquid droplet may be decreased under the condition that the interfacial tension γws is smaller than γs, The surface tension γs of the region 16 may be increased, or the surface tension γw of the droplet may be decreased.

  Further, the configuration of the optical element module 100 of the present embodiment will be described in detail with reference to FIGS. 1 and 2.

  The self-alignment alignment using the surface tension of the adhesive before curing described above is used not only for alignment of the optical waveguide 10 and the optical element 20, but also for alignment of the optical waveguide 10 and the wiring substrate 40. be able to. This point will be described below.

  As shown in FIG. 1, the optical waveguide 10 of the present embodiment is disposed on the upper surface 42 of the wiring board 40. In the lower surface 15 of the optical waveguide 10, a third region 19 having a lyophilic property with respect to the material constituting the adhesive 53 is further formed. A fourth region 49 having lyophilicity with respect to the material constituting the adhesive 53 is also formed on the upper surface 42 of the wiring board 40. The optical waveguide 10 and the wiring board 40 are fixed by an adhesive 53 formed between the third region 19 and the fourth region 49.

  In the above configuration, when the optical waveguide 10 and the wiring substrate 40 are fixed with the adhesive 53, the alignment between the optical waveguide 10 and the wiring substrate 40 is self-aligned by the surface tension of the material constituting the adhesive 53. Since it can be performed, the alignment between the optical waveguide 10 and the wiring board 40 becomes easy.

  2A to 2D, in this embodiment, the supply of the adhesive 50 to the first region 16 of the optical waveguide 10 and the supply of the adhesive 53 to the third region are the same. Therefore, the self-alignment between the optical waveguide 10 and the optical element 20 and the self-alignment between the optical waveguide 10 and the wiring substrate 40 can be performed at the same time.

  Note that the adhesive 53 may be the same as or different from the adhesive 50 that fixes the optical waveguide 10 and the optical element 20, but the same adhesive 50 is used. In addition, the working efficiency can be further increased.

  More specifically, the first region 16 and the third region 19 can be collectively formed on the surface of the optical waveguide 10. In addition, the adhesive (50, 53) can be supplied to the first region 16 and the third region 19 in a lump. Furthermore, the alignment between the optical waveguide 10 and the optical element 20 and the alignment between the optical waveguide 10 and the wiring board 40 can be performed simultaneously. In addition, the optical waveguide 10 and the optical element 20 can be fixed and the optical waveguide 10 can be fixed (mounted) to the wiring board 40 at the same time.

  As described above, by simultaneously performing operations such as pattern formation of the liquid repellent layer, supply and fixing of the adhesive, and alignment between the respective members, not only the work efficiency can be improved, but also the production conditions (working conditions) in each work ) Are the same, it is possible to reduce errors and positional deviations due to differences in manufacturing conditions, as compared with the case where the processing is performed alone, and position accuracy can be further improved.

  When an adhesive different from the adhesive 50 is used as the adhesive 53, the alignment between the optical waveguide 10 and the wiring substrate 40 may be further facilitated. However, these may be appropriately changed depending on the alignment conditions. it can.

  In this embodiment, a multimode fiber is used as the optical waveguide 10 of the optical fiber. The multi-mode fiber is a long-distance optical fiber in which a plurality of light propagation modes in the optical fiber exist, and can have a larger core diameter than a single-mode fiber that can propagate only one mode. For example, when a multimode fiber having a graded core refractive index distribution (GI fiber) is used, the core diameter can be set to 50 μm. The thickness of the optical waveguide 10 is, for example, 100 μm.

  In the present embodiment, a surface emitting laser (VCSEL) is used as the optical element 20. The light emitting surface (emission part 22) of the surface emitting laser and the upper surface 42 of the wiring board 40 on which the surface emitting laser is mounted are arranged substantially in parallel, and are perpendicular to the emitting part 22 (upward in the figure). A laser beam (light 60) is emitted toward. By using the surface emitting laser, the radiation angle of the laser beam (light 60) can be narrowed. As a result, it is not necessary to use a lens for condensing the laser beam (light 60), and the mounting volume can be reduced. The thickness of this surface emitting laser is, for example, 200 μm.

  The optical element 20 and the optical waveguide 10 are optically connected (optical connection). In the present embodiment, the core 13 positioned on the end face 18 of the optical waveguide 10 and the emitting portion 22 of the optical element 20 are positioned in a self-aligned manner by the surface tension of the material constituting the adhesive 50, and the optical axes are aligned. I am letting. In addition, a transparent medium should just exist between the optical waveguide 10 which is the path | route of the light 60, and the optical element 20, and a transparent medium is air, glass, transparent resin etc., for example. In addition, an optical component (for example, a lens) can be disposed between the optical waveguide 10 and the optical element 20.

  In the present embodiment, the photocurable resin may be various types such as an epoxy resin type, an acrylic resin type, a methacrylic resin type, and a urethane resin type, or light such as a dye or a visible light polymerization initiator. A mixture in which a sensitizer is mixed. The thermosetting resin is, for example, an epoxy resin, a phenol resin, a cyanate resin, a polyphenylene ether resin, or a mixture thereof.

  For optical connection by the self-alignment function, there is a method using the surface tension of molten solder (for example, AuSn), but in order to mount, it is necessary to heat to a temperature near the solder melting point (for example, AuSn is about 280 ° C.). For this reason, there is a possibility that problems such as remelting of connection parts of surrounding mounting components, deterioration of performance of optical elements and optical waveguides, distortion due to thermal stress of the flexible substrate and the optical waveguide film, and the like may occur. In this embodiment, since optical connection is performed with an adhesive made of a resin material that can be connected at low temperature, high-precision self-alignment effects can be exhibited without the need for high-temperature heating.

  Next, the arrangement configuration of the optical element 20 of the present embodiment will be described. The optical waveguide 10 and the optical element 20 are disposed on the wiring board 40.

  A recess 44 is formed on the upper surface 42 of the wiring substrate 40, and the optical element 20 is accommodated in the recess 44. The concave portion 44 of this embodiment is processed into a substantially rectangular parallelepiped shape, and includes a bottom surface 45 that supports the optical element 20 and an inner peripheral surface 47 that surrounds the optical element 20. In addition, the size of the opening shape of the recess 44 (the shape on the upper surface side of the opening) is configured to be larger than the outer dimension of the optical element 20 so that the optical element 20 can be accommodated.

  By accommodating the optical element 20 in the recess 44 positioned in advance, the positions of the optical element 20 and the optical waveguide 10 can be adjusted to some extent.

  In order to further improve the positional accuracy between the optical element 20 and the optical waveguide 10, the gap between the optical element 20 and the inner peripheral surface 47 of the recess 44 may be configured to be as small as possible. Disadvantages can occur. That is, if alignment is to be performed only by fitting, the recess 44 is formed in the wiring substrate 40 with high positional accuracy, or the optical element 20 is supplied to the recess 44 with high positional accuracy even when the optical element 20 is mounted. Necessity comes out. In addition, since the shape of the optical element that can correspond to the shape of the concave portion 44 of the substrate is also limited, the freedom of layout of the optical element is significantly impaired.

  In the present embodiment, first, after performing alignment in the coarse adjustment stage of fitting the optical element 20 into the recess 44, high-precision alignment is further performed by a self-alignment function using the surface tension of the adhesive 50. Therefore, there may be a certain gap between the optical element 20 and the inner peripheral surface 47 of the recess 44 when the optical element 20 is fitted into the recess 44 of the wiring board 40. Accordingly, when forming the recess 44 on the wiring substrate 40 and mounting the optical element 20 on the recess 44, a certain amount of deviation is allowed, and alignment can be performed very easily.

  The wiring board 40 may be a rigid board or a flexible board. The wiring board 40 is not limited to a single-sided wiring board or a double-sided wiring board, but may be a multilayer wiring board. A wiring board such as a rigid flexible board or a board such as a component built-in board can also be used.

  Further, the emission part 22 or the incident part 22 of the optical element 20 is formed on substantially the same plane as the upper surface 42 of the wiring board 40. In other words, the optical element 20 is embedded in the wiring board 40.

  With the above configuration, the alignment control in the height direction between the optical waveguide 10 and the optical element 20 becomes easy. More specifically, in a typical optical element module, the optical element is disposed on a wiring board, and the optical waveguide 10 is supported in order to adjust the position of the optical waveguide and the optical element in the height direction. Although it is necessary to provide a stage (fixing jig) separately, in this embodiment, since the optical waveguide 20 can be directly arranged on the wiring board 40 by embedding the optical element 20 in the wiring board 40, the stage is Even if it is not used, the alignment in the height direction can be executed with high accuracy.

  When the stage is used, the optical waveguide 10 may be distorted due to a difference in thermal expansion coefficient between the optical waveguide 10 and the stage at the time of heating. However, in this embodiment, the stage may not be used. 10 can be prevented from being distorted.

  Furthermore, since the optical waveguide 10 can be directly arranged on the wiring board 40, when a defect occurs in the manufacturing process, only the optical waveguide 10 can be removed, and convenience is improved. In addition, the degree of freedom in designing the optical waveguide 10 can be increased.

  As an example, when the thickness of the optical element 20 and the depth of the recess 44 are given as an example, when the thickness of the optical element 20 is 200 μm, the depth of the recess 44 is between 180 and 300 μm, preferably 215 μm. Can be set.

  Next, the opening shape of the recess 44 will be described with reference to FIG. FIG. 3 is a top schematic view schematically showing the configuration of the optical element module 100 shown in FIG. 1 as viewed from above.

  The opening shape of the recess 44 in this embodiment is preferably a shape corresponding to the outer shape of the optical element 20. In the illustrated example, the shape of the optical element 20 viewed from above is substantially rectangular, and in this case, the opening shape of the recess 44 is also preferably substantially rectangular. Thereby, the direction (180 degree directionality) of the optical element 20 accommodated in the recessed part 44 can be determined. The dimension of the optical element 20 is, for example, 300 μm × 200 μm, and the dimension of the opening shape of the recess 44 at this time is 285 to 350 μm in the longitudinal direction, preferably 325 μm, and 185 to 250 μm in the lateral direction. In the meantime, it can be preferably set to 225 μm.

  In addition, although the recessed part 44 of this embodiment is made into the substantially rectangular parallelepiped shape according to the external shape of the optical element 20, the cross-sectional shape is not restricted to a substantially rectangular shape, and may be another shape. For example, as shown in FIG. 4, it can also process so that the cross-sectional shape of the recessed part 44 may become a taper shape. In this example, the recess 44 is V-shaped so as to taper from the upper surface side to the lower surface side of the wiring substrate 40. By forming the recess 44 in a V shape in this way, the size of the opening shape of the recess 44 is larger than the size of the bottom surface 45 of the recess 44. Therefore, when the optical element 20 is mounted, There is an advantage that the space allowed for the element 20 is increased, and therefore the optical element 20 can be easily supplied. When the optical element 20 is mounted, the optical element 20 is aligned along the bottom surface 45.

  Next, a method for electrically connecting the optical element 20 and the wiring board 40 will be described with reference to FIG.

  One back surface electrode 28 is formed on the back surface 27 of the optical element 20 of the present embodiment. In addition, electrical wiring 46 is formed on the wiring board 40. Further, a conductive adhesive 52 is supplied to the bottom surface 45 of the recess 44 of the wiring board 40. The conductive adhesive 52 has a role of fixing the optical element 20 accommodated in the recess 44. In this embodiment, a conductive adhesive made of silver powder and an epoxy resin is used as the conductive adhesive 52, but other adhesives such as synthetic rubber, photo-curing resin, thermoplastic resin, thermosetting resin, etc. In the adhesive, conductive filler made of metal (for example, Cu, Ni, Pd, etc.), conductive filler (for example, Ag coated Cu powder, etc.) in which metal, plastic, or resin core is plated with metal was dispersed. A conductive adhesive can be used. In addition to the resin and the conductive filler, additives such as a solvent, a reactive diluent, a thixotropic agent, a coupling agent, and an antioxidant may be added as the conductive adhesive.

  The back electrode 28 of the present embodiment is electrically connected (conducted) with the electrical wiring 46 of the wiring board 40 via the conductive adhesive 52. That is, the back surface electrode 28 and the conductive adhesive 52 are in contact with each other, so that conduction of the optical element 20 is ensured.

  In order to secure the electrical connection, it is sufficient that the back electrode 28 and the electrical wiring 46 are in contact with each other. Therefore, it is not always necessary to interpose the conductive adhesive 52. For example, the back electrode 28 can be grounded on the electric wiring 46 without the conductive adhesive 52 interposed therebetween. When the back electrode 28 is grounded on the electrical wiring 46, an adhesive for fixing the optical element 20 to the wiring board 40 may be supplied separately or not. When the adhesive for fixing the optical element 20 to the wiring board 40 is not supplied, it is possible to prevent the position of the optical element 20 from shifting due to the curing / condensation of the adhesive.

  In the present embodiment, the optical element 20 and the wiring board 40 are further electrically connected by a wire bonding method using the wire 29. That is, an electrode for wire bonding (see, for example, the electrode 89 in FIG. 11) is formed on the upper surface of the optical element 20, and is electrically connected to the electric wiring of the wiring board 40 through the wire 29. Yes. Instead of the wire 29, a conductive adhesive may be supplied separately. Alternatively, it is possible to prepare two back electrodes on the back surface 27 of the optical element 20 and to be electrically connected to the electrical wiring 46 of the wiring board 40 respectively. When two backside electrodes are used, the wire 29 is not necessary, so that the wiring board 40 can be mounted with high density.

  In the present embodiment, the alignment between the optical waveguide 10 and the wiring substrate 40 is performed in a self-aligned manner by the surface tension of the material constituting the adhesive 53 interposed between the third region 19 and the fourth region 49. However, it can be executed by various methods other than this method. In the example illustrated in FIG. 6, the optical waveguide 10 is positioned on the wiring board 40 using a pair of electrode guides (for example, electrode patterns). That is, a pair of guide electrodes (84a, 84b) for positioning the optical waveguide 10 is formed on the upper surface of the wiring board 40, and the optical waveguide 10 is guided and positioned between the pair of guide electrodes (84a, 84b). . At this time, the optical element 20 is embedded in the recess 44 having no gap with the optical element 20. The thickness of the guide electrode may be 12 to 105 μm, and preferably 35 μm, but can be appropriately adjusted depending on the thickness of the guided member. Such guide electrodes may be provided in at least two places on the wiring board 40. This is because the optical waveguide 10 can be prepared at a predetermined position in the short direction of the optical element 20 by being along the guide electrode, and is prepared at a predetermined position in the longitudinal direction by moving the optical element 20 by a predetermined distance in the longitudinal direction of the optical element 20. Because it can. FIG. 6A is a top view in this embodiment, and FIG. 6B is a cross-sectional view.

  Moreover, the optical element 20 can also be mounted on the wiring board 40. In this case, the optical element 20 is positioned by the first guide electrodes (84a, 84b, 84c). Specifically, it is as shown to Fig.7 (a) and (b). In other words, the optical element 20 is guided between the two guide electrodes (84a, 84b) and positioned by coming into contact with the other guide electrode 84c.

  On the wiring board 40, a stage 81 (made of, for example, quartz glass) that supports the optical waveguide 10 is separately provided in order to adjust the height position of the optical waveguide 10 and the optical element 20. The optical waveguide 10 is fixed on the stage 81 with the adhesive 50, and the stage 81 is also positioned by the second guide electrodes (84a, 84b, 84c).

  Thus, by positioning using the guide electrode, the optical waveguide 10 and the optical element 20 can be mounted on the wiring board 40 with high positional accuracy. In addition, since the positions are mechanically aligned, it is very simple. Can be executed. 7A is a top view in this embodiment, and FIG. 7B is a cross-sectional view.

  As shown in FIG. 7C, if the optical element 20 and the stage 81 are positioned in contact with the guide electrode in the same direction (for example, the direction of the arrow 92), the optical waveguide 10 and the guide electrode of the optical element 20 are positioned. The positional deviation with respect to is relatively canceled out, and can be mounted on the wiring board 40 with higher positional accuracy. In this case, at least two guide electrodes are sufficient. In the case of the optical element 20, for example, the guide electrode (84a, 84c) can be used for positioning, and at this time, the stage 81 is moved to the guide electrode (84a, 84c). ), The alignment direction becomes the same direction.

  The electrical wiring of the wiring board 40 can also be used as a guide electrode. In the example shown in FIG. 7, the electrical connection of the optical element 20 can be ensured by arranging the guide electrode 84c and the electrode of the optical element 20 (for example, the side electrode 21) in surface contact. That is, the guide electrode plays two roles of alignment and conduction. Electrical connection may be ensured via a conductive adhesive.

  Moreover, the guide electrode should just be the structure protruded on the wiring board 40 so that the optical waveguide 10 and the optical element 20 can be guide | induced to a predetermined place. Therefore, the guide electrode is not limited to the electrode pattern, but may have other protrusion shapes. As an example of the protrusion shape, it is also possible to insert a rod-like body (for example, a pin) into a hole formed on the upper surface of the wiring board 40 and use it as a guide electrode.

  Next, the configuration of the first region 16 of the optical waveguide 10 will be described with reference to FIG. FIG. 8A schematically shows an example of the lower surface configuration of the optical waveguide 10 of the present embodiment, and FIGS. 8B and 8C schematically show an example of the cross-sectional configuration of the optical waveguide 10. Show.

  As shown in FIG. 8A, the first region 16 is formed in a region surrounded by a liquid repellent layer 17 that repels the material constituting the adhesive 50. In the illustrated example, the first region 16 has four substantially rectangular patterns.

  The liquid repellent layer 17 is made of, for example, a photosensitive water / oil repellent resin. The liquid repellent layer 17 in the present embodiment is made of a UV curable resist film made by Nippon Paint. This material is made of silicone and an acrylic block polymer, and more specifically, has a sea-island structure (so-called silicone island) of silicone and acrylic. Here, silicone has the characteristics of low surface tension, and acrylic plays a role in controlling the modification, hardness, adhesion, and UV curability of the resin.

  As shown in FIG. 8B, the first region 16 can be, for example, a region whose wettability is enhanced by UV irradiation in the liquid repellent film 11 applied to the entire lower surface of the optical waveguide 10. .

  The formation of the first region 16 is, for example, as shown in FIG. First, as shown in FIG. 9A, the material constituting the liquid repellent layer 17 is applied to the entire lower surface (upper surface in the figure) of the optical waveguide 10 to form a laminated film (liquid repellent film 11). The applied material is then baked for a predetermined time. Finally, as shown in FIG. 9B, when UV is irradiated only on the first region 16 through a mask 90 having an opening pattern that defines the first region 16, the first region 16 having high wettability is formed. can get.

  Alternatively, as shown in FIG. 8C, the first region 16 may be a region where a part of the lower surface of the optical waveguide 10 is exposed. In this case, the first region 16 is defined by the pattern of the liquid repellent layer 17. That is, the region where the pattern of the liquid repellent layer 17 is not formed becomes the first region 16.

  The pattern of the liquid repellent layer 17 can be formed using a photolithography process. More specifically, first, a material is applied to the entire lower surface of the optical waveguide 10. Next, the applied material is pre-baked and then exposed through a mask so as to form a predetermined pattern. The exposure can be performed using UV. Next, baking is performed, and development is performed by immersing in a developing solution (for example, toluene) for 1 to 2 minutes. When post baking is finally performed, the liquid repellent layer 17 is obtained.

  When a fluorine / acrylic block polymer manufactured by Asahi Glass Co., Ltd. is used as the photosensitive water / oil repellent resin, the water / oil repellent liquid repellent layer 17 can be formed by a photolithographic process using i-line.

  In the example described above, the region surrounded by the liquid repellent layer 17 is the first region 16. However, as shown in FIG. 10A, the laminated film 70 that is an lyophilic electrode pattern is formed on the optical waveguide 10. You may form directly. Specifically, an electrode pattern (for example, made of Ti / Pd / Au) having a shape protruding from the surface of the optical waveguide 10 is formed on a part of the optical waveguide 10, and this region is used as the first region 16. Thus, the adhesive 50 may be supplied only on the electrode pattern.

  Alternatively, the lower surface 15 of the optical waveguide 10 may be irradiated with plasma through a mask, and a region where wettability is increased by the plasma irradiation may be defined as the first region 16. In addition, a region in which wettability is relatively higher than the surrounding region by performing physical surface treatment such as surface roughening at a predetermined position on the surface of the optical waveguide 10 may be used as the first region 16.

  The first region 16 only needs to be configured so as to be able to hold the liquid material contained in the adhesive 50, and therefore can hold the liquid material due to the difference in affinity between the lyophilic property and the liquid repellency. In addition to the configuration, it is possible to hold the liquid material in the first region by changing the shape of the first region 16 (for example, forming a projection surface). Alternatively, a region where the liquid material can be held using surface tension or capillary action can be used as the first region 16.

  For example, in the example shown in FIG. 10B, a region in which the microhole 72 is formed in a part of the optical waveguide 10 and the liquid material is sucked and held by capillary action corresponds to the first region 16. Further, in the example shown in FIG. 10C, a region where the protrusion 74 is formed in a part of the optical waveguide 10 and the liquid material is fastened by the surface tension is defined as the first region 16.

  Next, the configuration of the second region 26 of the optical element 20 will be described with reference to FIG. FIG. 11 schematically shows an example of the top surface configuration of the optical element 20 of the present embodiment.

  As shown in FIG. 11, the second region 26 is an electrode pattern formed on the upper surface 25 of the optical element 20. The electrode pattern is made of, for example, Ti / Pd / Au. In the illustrated example, the electrode pattern is four substantially rectangular patterns, and is formed in a region facing the first region 16. As an example, the dimensions of this electrode pattern are 50 × 50 μm.

  Note that the second region 26 only needs to have relatively higher wettability than the surrounding region, and therefore is not limited to the electrode pattern. For example, the second region 26 can also be a region surrounded by a liquid repellent layer, like the first region 16 described above.

  In the illustrated example, the shape of the electrode pattern is substantially rectangular, but may be other shapes (for example, an ellipse, an ellipse, a polygon, etc.). Further, the number of electrode patterns is not limited to four, and alignment can be performed if at least one electrode pattern is formed. However, the number of electrode patterns is preferably two or more from the viewpoint of suppressing a shift in the θ direction (phase shift) between the optical waveguide 10 and the optical element 20. The shape, number, dimensions, etc. of the electrode pattern can be appropriately set according to the conditions used. Further, the pattern shape of the first region 16 and the pattern shape of the second region are preferably substantially the same as the pattern of the first region 16 and the pattern of the second region 26.

  In the present embodiment, the first region 16 is composed of a liquid repellent layer pattern, and the second region 26 is composed of an electrode pattern. However, the present invention is not limited to this. For example, both the first region 16 and the second region 26 can be configured by a liquid repellent layer pattern. In this case, there are the following advantages compared with the configuration using the electrode pattern.

  In the configuration using the electrode pattern, for example, when the supplied adhesive 50 flows to the side surface of the electrode pattern, a part of the adhesive 50 that flows to the side surface moves to the surface of the electrode pattern by its surface tension. The other part of the adhesive 50 that has flowed cannot move to the surface of the electrode pattern only by its surface tension, but flows out to the surroundings as it is, so that an appropriate amount of adhesive 50 is reliably supplied only to the surface of the electrode pattern. Must. That is, in the configuration using the electrode pattern, it is required to supply the adhesive 50 with high accuracy. In particular, as the miniaturization of the optical element progresses, the allowable size of the first region 16 and the second region 26 that can be formed becomes smaller. Therefore, a technique for supplying a minute amount of the adhesive 50 with high accuracy is increasingly required.

  On the other hand, in the configuration using the liquid repellent layer pattern, for example, even if the supplied adhesive 50 protrudes from the first region 16, it is repelled by the liquid repellency of the liquid repellent layer 17 formed around the first region 16. Therefore, the adhesive 50 can be reliably supplied only to the first region 16. That is, in the configuration using the liquid repellent layer pattern, a very small amount of the adhesive 50 can be accurately applied without supplying the adhesive 50 with high accuracy. Therefore, the configuration using the liquid repellent layer pattern has an advantage that the optical element can be easily reduced in size than the configuration using the electrode pattern because the adhesive 50 can be supplied easily and accurately.

  However, the second region 26 is preferably constituted by an electrode pattern. As described above, it is possible to configure the second region 26 with a liquid repellent layer pattern, but it is necessary to increase the surface area of the optical element by the area of the water repellent layer surrounding the second region 26. Therefore, there may be a case where the optical element cannot be reduced in size. In the case where the second region 26 is constituted by an electrode pattern, it is a great advantage that the electrode pattern can be simultaneously produced at the same time when the electrode 89 is formed on the optical element.

  When the second region 26 is formed of an electrode pattern, the adhesive 50 is preferably supplied not to the second region 26 on the optical element side but to the first region 16 on the optical waveguide side. Since the first region 16 is composed of a liquid repellent layer pattern, not only the supply of the adhesive 50 is facilitated, but also a process of forming bumps such as solder on the optical element side is not required, This is also advantageous for downsizing.

  Hereinafter, a method for manufacturing the optical element module 100 of the present embodiment will be described with reference to FIGS. 12A to 12E are process diagrams for explaining a method for manufacturing the optical element module 100. FIG.

  First, as shown in FIG. 12A, the optical waveguide 10 in which the first region 16 having lyophilicity with respect to the first liquid 54 is formed, and the lyophilicity with respect to the first liquid 54. The optical element 20 having the second region 26 is prepared. The first liquid 54 is made of a material constituting the adhesive 50, for example. The first region 16 is a region surrounded by the liquid repellent layer 17, for example. The second region 26 is, for example, an electrode pattern formed on the optical element 20.

  Next, as shown in FIG. 12B, the first liquid 54 is supplied to at least one of the first region 16 of the optical waveguide 10 and the second region 26 of the optical element 20. In the present embodiment, the first liquid 54 is applied to the first region 16. However, the first liquid 54 may be supplied to the second region 26, or may be supplied to both regions.

  Thereafter, the second region 26 of the optical element 20 is brought close to the first liquid 54 formed on the first region 16. Then, as shown in FIG. 12C, the first region 16 and the second region 26 are brought into contact with each other through the first liquid 54. Then, due to the surface tension of the first liquid 54, the second region 26 of the optical element 20 moves to a location facing the first region 16 (in the illustrated example, the direction of the arrow 55). That is, the alignment between the optical waveguide 10 and the optical element 20 is performed in a self-aligning manner.

  Finally, as shown in FIG. 12D, when the first region 16 and the second region 26 are arranged to face each other, the alignment between the optical waveguide 10 and the optical element 20 is completed.

  In this way, alignment between the optical waveguide 10 and the optical element 20 is executed, and the core 13 located on the end face 18 of the optical waveguide 10 and the emission part 22 or the incident part 22 of the optical element 20 are optically connected. is doing.

  In the case where the first liquid 54 is made of a material constituting the adhesive 50 (for example, a material that cures a liquid material including photocuring or thermosetting resin), the state shown in FIG. It is also possible to cure the adhesive 50 and fix the optical waveguide 10 and the optical element 20 as they are. Specifically, when the adhesive 50 is a material containing a photo-curing resin, as shown in FIG. 12E, the light-curing resin is cured by irradiating light 62, and the optical waveguide 10 and the optical element are cured. 20 can be fixed. When the adhesive 50 is a material containing a thermosetting resin, the optical waveguide 10 and the optical element 20 can be fixed by heating in the state shown in FIG.

  FIG. 13A shows a method for supplying the first liquid 54 to the first region 16. First, the first liquid 54 is dropped on the entire lower surface of the optical waveguide 10, and then the bar coder 86 is moved in the direction of the arrow to be stretched and applied to the entire lower surface of the optical waveguide 10. Accordingly, the first liquid 54 can be supplied to the first region 16 (for example, a place other than the liquid repellent layer 17).

  Further, as shown in FIG. 13B, it is also possible to supply by dip coating instead of application by a bar coder. For example, the entire optical waveguide is immersed vertically in the first liquid 54 stored in the container 87. Then, after the first liquid 54 spreads over the entire surface of the optical waveguide, the optical waveguide 10 is moved at a predetermined speed. By pulling up, the first liquid 54 can be supplied to the first region 16.

  Alternatively, the first liquid 54 may be supplied by spraying the first liquid 54 on the entire optical waveguide 10 by spraying, or the lower surface of the optical waveguide 10 onto which the first liquid 54 has been dropped. It may be supplied by pressing the glass slide onto the glass substrate and then sliding the glass slide through a predetermined gap. As other coating methods, metal plate printing, screen printing, dispenser, ink jet method and the like can be used.

  Furthermore, the manufacturing method of the optical element module 100 of this embodiment is explained in full detail. The alignment jig 80 used in this embodiment is as shown in FIG. The alignment jig 80 includes two support parts (stage 81 and support part 82) on which the optical waveguide 10 is placed, and a drive part 83 sandwiched between the two support parts (stage 81 and support part 82), An outer shape matching portion 88 that matches the outer shape of the optical waveguide 10 is formed. The drive unit 83 is configured to be movable up and down, and the wiring board 40 is placed on the upper surface thereof. A vacuum hole 85 for adsorbing the wiring board 40 is formed on the upper surface of the drive unit 83.

  In the present embodiment, mechanical alignment is performed in advance before the optical waveguide 10 and the optical element 20 are self-aligned. Specifically, the optical waveguide 10 is mounted on the upper surface of the support portion 82 of the alignment jig 80 using a mounter. At this time, the optical waveguide 10 is placed along the outer shape matching portion 88. In addition, the wiring board 40 is placed on the upper surface of the drive unit 83, and the wiring board 40 is sucked and fixed by vacuum. Then, the optical element 20 is accommodated in the recess 44 of the wiring board 40. The optical waveguide 10 and the optical element 20 can be aligned to a certain degree by placing the optical waveguide 10 along the outer shape matching portion 88 and accommodating the optical element 20 in the recess 44. As described above, by first performing mechanical alignment and then performing self-alignment, precise alignment can be realized with high reliability.

  In the present embodiment, the alignment between the optical waveguide 10 and the optical element 20 and the mounting on the wiring board 40 can be performed simultaneously. That is, in the step shown in FIG. 12B, the adhesive 50 is supplied to the third region in addition to the first region 16, and in the step shown in FIG. 12C, the optical waveguide 10 and the optical element 20 are supplied. In addition, the optical waveguide 10 and the wiring board 40 are also aligned. Then, as shown in FIG. 12E, when the optical waveguide 10 and the optical element 20 are fixed with the adhesive 50, the optical waveguide 10 and the wiring board 40 are also fixed together.

  In the above configuration, since the alignment of the optical waveguide 10 and the optical element 20 and the mounting on the wiring board 40 can be performed simultaneously, the process of mounting on the wiring board 40 using the mounter can be reduced.

  In the present embodiment, the alignment of the optical waveguide 10 and the optical element 20 and the mounting on the wiring board 40 are performed at the same time. However, the present invention is not limited to this. For example, the optical waveguide 10 and the optical element 20 are First, alignment may be performed, and then mounting on the wiring board 40 may be performed. Alternatively, mounting on the wiring board 40 may be performed first, and alignment may be performed later. FIG. 15 shows an example of the former, and FIG. 16 shows an example of the latter. In FIG. 15, first, the aligned optical waveguide 10 and optical element 20 are prepared, and then the optical element 20 is fixed to the wiring board 40 and mounted on the wiring board 40. On the other hand, in FIG. 16, first, the wiring substrate 40 on which the optical element 20 is fixed and mounted is prepared, and then the alignment between the optical element 20 mounted on the wiring substrate 40 and the optical waveguide 10 is performed. Yes.

  In the embodiment described above, the first liquid 54 has a role of self-aligning the optical waveguide 10 and the optical element 20 and a role of fixing the optical waveguide 10 and the optical element 20. It is not limited. For example, as shown in FIG. 17, the optical waveguide 10 and the optical element 20 can be fixed using a second liquid 56 different from the first liquid 54.

  When the second liquid 56 is used, the first liquid 54 is not the adhesive 50 but, for example, a volatile liquid (for example, water). At this time, the first liquid 54 has only a role of self-aligning the optical waveguide 10 and the optical element 20 by surface tension. The first liquid 54 can be evaporated by heating, for example, after the self-alignment is completed.

  The second liquid 56 is an adhesive (for example, the adhesive 50 of the present embodiment). The second liquid 56 is formed between the lower surface of the optical waveguide 10 and the upper surface of the optical element 20 as shown in FIG. 17A, or the lower surface of the optical waveguide 10 as shown in FIG. And between the side surfaces of the optical element 20. Then, after the self-alignment between the optical waveguide 10 and the optical element 20 is completed, the optical waveguide 10 and the optical element 20 are fixed. The second liquid 56 may be supplied before the self-alignment between the optical waveguide 10 and the optical element 20 is completed, or may be supplied before the self-alignment is completed.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course various modifications are possible.

  According to the present invention, it is possible to provide an optical element module 100 that can easily perform highly accurate alignment between an optical waveguide and an optical element.

The figure which showed typically the cross-sectional structure of the optical element module 100 Process drawing explaining that optical waveguide 10 and optical element 20 can be positioned in a self-aligning manner Schematic top view schematically showing the configuration of the optical element module 100 shown in FIG. The figure which showed typically an example of the cross-sectional structure of the optical element module 100 The figure explaining the method of electrically connecting the optical element 20 and the wiring board 40 The figure which shows an example of the optical element module positioned by the electrode guide The figure which shows an example of the optical element module positioned by the electrode guide It is a figure explaining the structure of the 1st area | region 16 of the optical waveguide 10, (a) is a figure which shows an example of a lower surface structure typically, (b) and (c) are examples of the cross-sectional structure of the optical waveguide 10. FIG. Schematic illustration (A) And (b) is a figure explaining the formation method of the 1st field 16. (A)-(c) is a figure for demonstrating another embodiment of the 1st area | region 16. FIG. The figure which shows an example of the upper surface structure of the optical element 20 typically. (A)-(e) is process drawing explaining the manufacturing method of the optical element module 100 (A) And (b) is a figure explaining the method to supply the 1st liquid 54 to the 1st field 16. Schematic appearance of alignment jig 80 used in this embodiment Process drawing explaining the method of mounting the optical element module 100 on the wiring board 40 Process drawing explaining the method of mounting the optical element module 100 on the wiring board 40 Cross-sectional schematic diagram explaining the case of using the second liquid 56

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Optical waveguide 11 Liquid repellent film 12 Core 13 Core located in the end surface 18 Cladding 15 Lower surface 16 1st area | region 17 Liquid repellent layer 18 End surface 19 3rd area | region 20 Optical element 22 Output part or incident part 25 Upper surface 26 2nd area | region 27 Back surface 28 Back surface electrode 29 Wire 40 Wiring substrate 42 Upper surface 44 Recess 45 Bottom surface 46 Electric wiring 49 Fourth region 50 Adhesive 52 Conductive adhesive 53 Adhesive 54 First liquid 56 Second liquid 62 Light 70 Laminating film 72 Minute Hole 74 Projection portion 80 Alignment jig 81 Stage 82 Support portion 83 Drive portion 84a, 84b, 84c Guide electrode 85 Vacuum hole 86 Bar coder 87 Container 88 Outline matching portion 89 Electrode 90 Mask 100 Optical element module

Claims (24)

An optical element module comprising: an optical waveguide that transmits light; and an optical element that is optically connected to the optical waveguide and that emits or enters light transmitted by the optical waveguide,
A first region having lyophilicity with respect to the material constituting the adhesive is formed in a part of the optical waveguide,
A second region having lyophilicity with respect to the material constituting the adhesive is also formed on the surface of the optical element,
The optical element module, wherein the optical waveguide and the optical element are fixed by the adhesive formed between the first region and the second region. 2. The light according to claim 1, wherein the core located on the end face of the optical waveguide and the emitting part or the incident part of the optical element are positioned in a self-aligning manner by a surface tension of a material constituting the adhesive. Element module. The optical element module according to claim 1, wherein the adhesive is made of resin. The optical element module according to any one of claims 1 to 3, wherein the adhesive is made of a material that cures a liquid material including a photo-curing or thermosetting resin. The optical waveguide and the optical element are disposed on a wiring board,
A part of the optical waveguide is further formed with a third region having lyophilicity with respect to the material constituting the adhesive,
A fourth region having lyophilicity with respect to the material constituting the adhesive is also formed on the wiring board,
5. The optical element according to claim 1, wherein the optical waveguide and the wiring board are fixed by the adhesive formed between the third region and the fourth region. module. The optical waveguide and the optical element are disposed on a wiring board,
The optical element is positioned by a first guide electrode formed on the wiring board,
5. The optical element module according to claim 1, wherein the first guide electrode is in contact with the optical element at at least two locations. 6. The optical waveguide is disposed on the wiring board via a stage,
The stage is positioned by a second guide electrode formed on the wiring board,
The second guide electrode is in contact with the stage in at least two places,
The optical element module according to claim 6, wherein the optical element and the stage have the same contact direction with respect to the first and second guide electrodes. The optical element module according to any one of claims 1 to 7, wherein the first region is formed in a region surrounded by a liquid repellent layer that repels a material constituting the adhesive. 9. The optical element module according to claim 1, wherein the second region is an electrode pattern formed on a surface of the optical element. The optical element module according to claim 5, wherein the optical element is accommodated in a recess formed in the wiring board. The optical element module according to claim 10, wherein an emission part or an incident part of the optical element is formed on substantially the same plane as the surface of the wiring board. At least one electrode is formed on the back surface of the optical element,
12. The optical element module according to claim 1, wherein the electrode is electrically connected to an electrical wiring of the wiring board via a conductive adhesive supplied to the wiring board. . A method of manufacturing an optical element module comprising an optical waveguide for transmitting light and an optical element for emitting or entering light,
A step of preparing an optical waveguide in which a first region having lyophilicity with respect to the first liquid is formed, and an optical element in which a second region having lyophilicity with respect to the first liquid is formed. (A) and
Supplying the first liquid to at least one of the first region of the optical waveguide and the second region of the optical element;
By bringing the first region and the second region into contact with each other via the first liquid, alignment between the optical element and the optical waveguide is performed with the surface tension of the first liquid. Step (c) to perform,
A method for manufacturing an optical element module, comprising: The first liquid is made of a material constituting an adhesive,
The method of manufacturing an optical element module according to claim 13, further comprising a step of curing the adhesive and fixing the optical waveguide and the optical element after the step (c). The said adhesive agent is a manufacturing method of the optical element module of Claim 14 comprised from the material which the liquid body containing a photocurable resin or a thermosetting resin hardens | cures. Supplying a second liquid different from the first liquid;
The light according to claim 13, wherein the second liquid is made of an adhesive, and further includes a step of fixing the optical waveguide and the optical element by curing the adhesive after the step (c). Manufacturing method of element module. In the step (c), the core located on the end face of the optical waveguide and the emitting part or the incident part of the optical element are positioned in a self-aligned manner and optically connected by the surface tension of the first liquid. The method of manufacturing an optical element module according to any one of claims 13 to 16. 18. The method of manufacturing an optical element module according to claim 13, further comprising a step of fixing the optical element aligned with the optical waveguide to a wiring board after the step (c). The method of manufacturing an optical element module according to claim 13, wherein the optical element in the step (a) is an optical element fixed to a wiring board. The method of manufacturing an optical element module according to claim 18 or 19, wherein the optical element is accommodated in a recess formed in the wiring board. At least one electrode is formed on the back surface of the optical element,
21. The method of manufacturing an optical element module according to claim 20, wherein the electrode is electrically connected to the electrical wiring of the wiring board via a conductive adhesive supplied to the bottom surface of the recess. The first region of the optical waveguide prepared in the step (a) is:
The method of manufacturing an optical element module according to any one of claims 13 to 21, wherein the optical element module is formed by irradiating light or plasma through a mask having an opening pattern that defines the first region. 23. The method of manufacturing an optical element module according to claim 22, wherein the light or plasma irradiated through the mask is irradiated onto a laminated film laminated on the optical waveguide. 24. The method of manufacturing an optical element module according to claim 23, wherein the laminated film is a liquid repellent film that repels the first liquid.

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