JP5278644B2 - Photoelectric board and manufacturing method thereof, optical integrated circuit, optical interconnector, optical multiplexer / demultiplexer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical substrate which is suitable for mass production and can simply and highly precisely obtain an optical connection between an optical element and an optical waveguide in manufacturing the optical substrate using the optical waveguide, and to provide a method of manufacturing the optical substrate. <P>SOLUTION: The optical substrate has a base member having translucency and the optical waveguide, wherein the optical waveguide has edge parts projected to both side faces thereof, and guides are provided in parallel to the optical waveguide to support the edge parts from the bottom on the base member. Further, one of the end parts of the optical waveguide supported by the guides is connected by being made in contact with the bottom face of the optical element. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

The present invention relates to an optical substrate manufacturing method used for an optical integrated circuit, an optical interconnector, an optical multiplexer / demultiplexer, or the like used for optical communication and optical information processing.

With the advancement of advanced information technology in recent years, the performance improvement of information processing devices such as routers and servers used for information communication has progressed remarkably, and further speeding up of communication signals is required in these devices. . In this speeding up, the communication quality of the electric wiring in the electronic circuit or the electric circuit affects the performance improvement, so this obstacle cannot be ignored in increasing the communication speed.

Therefore, as a promising technique for solving problems that hinder high-speed communication, such as increasing the processing signal speed and reducing electrical noise, a technique using optical wiring is attracting attention. In particular, in order to realize large-capacity optical interconnection using optical wiring, high density optical wiring and low loss connection are important, and various technical studies for high performance and cost reduction have been conducted. Yes. As a specific method for realizing this optical interconnection, a method using an optical waveguide has been studied. In this optical waveguide, a first clad layer made of a light transmissive material is formed, and a core layer pattern made of a light transmissive material having a refractive index smaller than that of the first clad layer is formed thereon. . Furthermore, a light-transmitting material layer having a refractive index value larger than that of the core layer pattern is formed on the core layer pattern as a second cladding material layer to obtain an optical waveguide.

Various studies have been made on these optical waveguides, and various studies have attracted attention that polymer materials are advantageous in terms of cost and processability, and active development is underway. As an example of a method for forming this optical waveguide, there is a method of forming a desired core pattern of an optical waveguide by applying a photopolymer material having optical transparency and repeating photolithography, or a desired core pattern of an optical waveguide. There is a method of heat-curing by pressure molding using the formed mold. However, the optical waveguide formed by these methods has a problem that the end face of the optical waveguide is likely to be damaged because the resistance to external force is low in handling on mounting.

On the other hand, various manufacturing methods have been studied for mounting optical waveguides and optical connections. For example, as shown in Patent Document 1, a structure has been studied in which the end surface shape of the core portion of the optical waveguide is made convex or concave to facilitate optical joining. However, in this method, when the core portion has a particularly convex shape, it is necessary to connect the fine core portion to the light receiving element in order to perform optical connection. For this purpose, high positional accuracy is required.

Moreover, in Patent Document 2, an optical element and a photoelectric element body provided with a terminal portion on which a solder metal material layer is formed, and the optical element and the solder metal material layer are formed corresponding to the photoelectric element body. An opto-electric composite substrate device including an opto-electric wiring board provided with a terminal portion, an optical waveguide corresponding to the terminal portion, a terminal portion, and an electric wiring is aligned with a desired position facing each other. A manufacturing method in which a terminal portion of a photoelectric composite device is coated and cured with a photocurable resin to fix the position of the photoelectric element body and the photoelectric composite substrate device, and then the solder metal material is heated and melted to fix the terminal portion. Is being considered. The connection of these terminal parts is made by connecting the terminal parts by heating and melting the solder metal material layer, but the positional deviation that occurs in the bonding is corrected by utilizing the self-alignment action by melting the solder metal. However, since the accuracy is ± 50 μm, it is difficult to perform optical connection with high accuracy and simplicity.

Further, as shown in Patent Document 3, an insertion hole for inserting an optical element module is formed in an optoelectric wiring board having an optical waveguide, and an insertion portion of the optical element module is formed in the insertion hole. After insertion into the insertion hole, the optical element module is heated to melt the solder on the surface of the module, and alignment using the surface tension generated by the molten solder is also being studied. In the case of this method, the optical element module and the photoelectric wiring board are exposed to a high temperature by heating to melt the solder. Therefore, physical properties such as a thermal expansion coefficient of the optical element module and the photoelectric wiring board. When the values are not the same, distortion due to heating occurs, and it becomes difficult to perform alignment with high accuracy.

JP 2004-86185 A JP-A-2005-64303 JP 2007-134446 A

The present invention has been made in view of the above problems, it is an object of the present invention, in the production of optoelectronic substrate using an optical waveguide, an optical connection of the optical element and the optical waveguide An object of the present invention is to provide a photoelectric substrate suitable for mass production that can be obtained with high accuracy and simply, and a method for producing the same.

The photoelectric substrate according to the present invention comprises:
A first cladding layer made of a light-transmissive first resin material, a core pattern made of a light-transmissive second resin material, and a light-transmissive third layer formed on a light-transmissive substrate. An optoelectric substrate in which an optical waveguide of an optical substrate obtained from a laminate of a second clad layer made of a resin material is used,
Light board, said forming a rectangular opening in parallel to a position between the core pattern formed in the product Sotai, is divided into individual desired light substrate at a central position in the width of the opening, each optical substrate, the edge projecting on both sides respectively are cross sectional shape having a rectangular-shaped step,
On the surface of the printed wiring board on which the circuit pattern of the optoelectric board is formed, a guide for supporting the edge of the optical board from below on the printed wiring board is provided for alignment with the optical element. Is provided in parallel to correspond to
The divided light board is supported by the guide at the stepped portion of the side edge portions, one end portion of the optical substrate, optoelectronic substrate, characterized by being bonded in contact with the lower surface of the optical element It is.

The invention according to claim 2 of the present invention includes a step of forming a first cladding layer made of a first resin material having light transmittance on a substrate having light transmittance;
Forming a core pattern made of a second resin material having optical transparency on the first cladding layer, and forming a second cladding layer made of a third resin material having optical transparency on the core pattern; And a process of
To form an optical substrate made of a laminate,
Next, a step of forming a rectangular opening at a position parallel to the core pattern of the laminated body, and a step of dividing each optical substrate at the center position of the width of the opening, are used for each desired light. Forming the substrate ,
Said optical substrate is inserted into the formed optoelectric substrate guide, one end of the optical substrate supported by said guide, optoelectronic substrate, characterized in that the bonding contact with a bottom surface of the optical element This is a manufacturing method.

According to the present invention, in the production of optoelectronic substrate using an optical substrate having an optical waveguide, high-precision optical connection of the optical element and the optical waveguide optoelectronic substrate and and suitable for mass production which can be conveniently obtained, A manufacturing method thereof is provided. In particular,
(1) Since the side surface direction of the optical waveguide is fixed by the guide on the substrate on which the optical waveguide is formed in parallel, the installation of the optical waveguide is facilitated and the positional accuracy is improved.
(2) Since the height of the optical waveguide can be controlled by the guide and the edge of the optical waveguide, connection with the optical element is facilitated.
(3) The manufacturing method of the present invention is excellent in productivity because an optical waveguide suitable for manufacturing a plurality of the photoelectric substrates can be formed at a time by a simple process.
It has such an effect.

An example of the configuration of the optical substrate of the present invention is shown in FIG. 1A is a cross-sectional view in a plane parallel to the optical waveguide and perpendicular to the substrate, and FIG. 1B is a cross-sectional view in a plane perpendicular to the optical waveguide and perpendicular to the substrate. An optical element 12 including a light emitting / receiving element such as a surface emitting laser (VCSEL) or a photodiode is installed on the photoelectric substrate 11 on which an electrode pattern or the like is formed, and is further optically bonded to this optical element. An optical waveguide 9 is installed in the front. The optical waveguide is held by a guide 13 formed on the substrate 11 in parallel with the optical waveguide. Further, the end face of the optical waveguide on the optical element joining side has a mirror structure for optical connection with the optical element. A known method such as total reflection at the end face interface or reflection by forming a metal film can be used.

As shown in FIG. 1 (B), edge portions (ridge portions) protruding on both side surfaces of the optical waveguide are formed and held by guides 13. As a general form of the optical waveguide in the present invention, a rectangular projecting edge is formed on the upper end of both sides of the optical waveguide in a rectangular optical waveguide cross section, but is not limited thereto. . As is clear from the figure, the installation position of the optical waveguide in the direction orthogonal to the extending direction of the optical waveguide is fixed by the guide, so that it can be easily inserted at the time of manufacture and the positional accuracy can be improved. Further, in relation to the optical element 12, the height of the optical waveguide can be controlled by the protruding edges of the guide and both sides of the optical waveguide, so that the lower surface of the optical element and the height of the connection position of the optical waveguide can be easily set. Since they can be matched, the light receiving / emitting surface of the optical element and the optical waveguide can be easily joined.

Next, the manufacturing method of the optical board | substrate of this invention is demonstrated. First, a base material having optical transparency is prepared. Since this base material serves as a protective layer and support for the optical waveguide, a glass substrate having a smooth surface, a resin film material having a smooth surface, and the like can be used. In particular, polyethylene terephthalate, polyethylene naphthalate, polyimide and the like are suitable as the resin film material having a smooth surface.

Next, a light-transmissive first cladding layer is formed on the surface of the light-transmissive substrate. This first cladding layer is formed over the entire surface of the substrate. As the first cladding layer, a liquid material can be mainly used, and a solid material such as a film-like substrate can be used depending on the selection of the material to be used. When the first cladding layer material is a liquid, roll coating, die coating, dip coating, spin coating, and the like are suitable. The roll coating method is a method in which a first clad layer material having a constant film thickness is formed on a coating roll, and then the coating roll is brought into contact with a substrate to transfer and apply the material on the coating roll to a support. The die coating method is a method in which a coating material is formed on a base material by projecting a material to be applied from a metal head (die) that maintains a constant distance between the base material and a coating film thickness.

The dip coating method is a method in which a support is immersed in the first clad layer material and pulled up at a constant speed to form a coating film on the support. The spin coating method is a method in which a liquid material is dropped on a support and the support is rotated at a constant rotation number to form a coating film having a constant film thickness on the support. In addition, when a material formed by previously applying a liquid material to a film substrate is used as the first cladding material, the first cladding is obtained by laminating (bonding) the film substrate on the substrate. Layers can be formed. After forming the first cladding on the substrate, the coating film is cured as necessary. As the curing method, curing by ultraviolet rays, curing by heat, or the like can be applied, and the means can be selected depending on the curing form of the material. Note that a generally used polymer material can be used for the first cladding. The same applies to the core layer and the second cladding material layer.

Next, a desired core pattern made of a second resin material having optical transparency is formed on the upper surface of the first cladding layer. The desired core pattern is selectively formed on the first cladding layer, and various means can be selected. For example, after applying the second resin material on the first cladding layer and drying the coating surface, the core pattern is formed using photolithography, that is, the desired pattern formed on the photomask is irradiated with ultraviolet rays. After the exposure, the method of forming a desired core pattern by development can be used (FIGS. 2A to 2D). Alternatively, instead of ultraviolet irradiation, a desired core pattern can be formed by development after pattern drawing (exposure) with a laser beam based on design data. Alternatively, the desired core pattern can be formed (molded) using a mold in which the desired core pattern is formed in a groove shape. After filling the groove of the desired core pattern formed in the mold with the second resin material, overlaying the base material on which the first cladding layer is formed, and curing the second resin material inside the mold groove, Is peeled (released) from the surface of the first cladding layer to form a desired core pattern made of the second resin material. Curing of the second resin material in the mold can be appropriately selected from curing by high-temperature heating, curing by ultraviolet rays, and the like depending on the curing conditions of the second resin material. Alternatively, after the second resin layer is applied, the concave portion of the mold having the same shape is aligned with a predetermined position and pressed to form a core pattern (press processing) (FIGS. 3C and 3D). )). Also in this case, curing by high-temperature heating, curing by ultraviolet rays, or the like can be appropriately selected depending on the curing conditions of the second resin material.

After that, a third resin material having optical transparency is applied to the desired core pattern made of the second resin material layer, and the coating film is dried and cured to cover the desired core pattern, thereby providing the second cladding. Layers are formed, and an optical substrate made of an integrated laminate is formed (FIG. 2E). Curing of the third resin material after coating the desired core pattern can be appropriately selected from curing by heating, curing by ultraviolet rays, and the like depending on the curing conditions of the third resin material.

Furthermore, a rectangular opening (first cutting line region) having a predetermined width provided for separating the desired optical substrate pattern in the thickness direction of the laminate is parallel to the desired core pattern between the core patterns of the laminate. By forming from the surface of the second clad layer covering the desired core pattern to a position less than the thickness of the first clad layer of the laminate, and further cutting (cutting) the laminate between the openings. Then, the laminated body is divided into individual desired optical substrates, and a rectangular stepped portion corresponding to the protruding edge of the optical waveguide 9 is formed as shown in FIG. The first cut line region and the second cut line region are formed by cutting a laminated body formed by curing into a desired shape and size by using a cutting means such as a dicing saw. Can be formed. In cutting, in order to make the edge of the cross section of the optical substrate into a rectangular step shape, the width of the opening is widened, and the second cutting line region is provided in the first cutting line region portion to provide a desired optical substrate. Can be cut. When a dicing saw is used as the cutting means for this cutting line area, a die-sinking blade having a blade thickness of the dicing blade for processing the second cutting line area thinner than the blade thickness of the dicing blade for processing the first cutting line area is applied. . As a result, when processing is performed at the same processing coordinate position, a rectangular step is formed at the edge of the cut optical substrate.

Moreover, as a formation method of the rectangular-shaped opening part formed in the said laminated body, it can also form simultaneously with the process of coat | covering the desired core pattern which consists of a 2nd resin material with a 3rd resin material. For example, after coating the third resin material on the desired core pattern formed of the second resin material, the second resin material is applied to the second resin using a mold formed in a convex shape so as to correspond to the opening region. It is possible to form the openings of the second clad layer and the second clad layer by covering the desired core pattern made of the resin material so that the convex portions of the mold coincide with each other and bonding the pattern of the third resin material. By providing the second cutting line region between the openings and cutting the laminated body into a desired optical substrate, it is possible to provide a stepped portion having a rectangular edge on the section of the optical substrate. Alternatively, after applying the third resin material on the core pattern, the convex part of the mold having the same shape can be formed by pressing in the center between the core patterns (pressing process). In these cases, as in the formation of the core pattern, curing by high-temperature heating, curing by ultraviolet rays, or the like can be appropriately selected depending on the curing conditions of the third resin material.

On the other hand, as a method for forming a guide for joining the optical waveguide of the optical substrate onto the photoelectric substrate , known processing methods and installation methods can be used. Specific examples include a method of forming a guide by printing or laminating a photosensitive solder resist at a predetermined position so that a desired film thickness is obtained, then exposing and developing the necessary pattern shape, and then heat-curing to form a guide. It is possible to use a method in which a spacer in which the step portion and the insertion pin are molded is inserted into a through-hole formed at a desired position on the substrate, fixed, and arranged as a guide.

After forming the guide and the optical waveguide, an optical substrate is inserted horizontally into the guide, aligned with the optical element in the extending direction of the optical waveguide, and the position of the optical element and the optical waveguide is fixed with an adhesive or the like.

As described above, since the edge portion of the optical waveguide created in the above process has a rectangular step shape, the optical element and the optical substrate are joined on the photoelectric substrate on which the optical element is mounted. By inserting and aligning the optical substrate along the guide portion provided in the optical substrate bonding portion of the optical substrate, it is possible to accurately connect the optical element without bringing the optical substrate surface into contact with the photoelectric substrate surface. Can be set. And about the direction perpendicular | vertical to the desired pattern in the laminated body finally laminated | stacked and hardened, it cuts into a desired shape and size using cutting means, such as a dicing saw, and forms an optical substrate. be able to. In particular, it is possible to form a mirror that refracts light propagating through the core layer by not only forming a cross section at right angles to the stacking direction but also cutting at an inclination angle with respect to the stacking direction.

As described above, the manufacturing method of the present invention is formed so that the edge of the cross section of the optical substrate that is the laminate has a rectangular step. Therefore, in joining the optical element and the optical substrate, the optical substrate is inserted and positioned along a guide or the like provided at the optical substrate joint portion on the photoelectric substrate on which the optical element is mounted. Since the surface of the optical substrate and the surface of the optoelectric substrate are not in direct contact with each other, it is possible to manufacture an optical substrate in which a precise bonding position with the optical element can be set. In addition, the manufacturing method described above can provide an optical substrate with no damage on the surface of the optical substrate. Furthermore, by using such an opto-electric substrate, an optical integrated circuit, an optical interconnector, an optical coupler with a small optical transmission loss can be provided. A duplexer can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this specification, the same code | symbol is attached | subjected about the same member. 2A to 2G are cross-sectional views showing the base material of the optical substrate, the first cladding layer, the core pattern made of the second resin material, and the formation of the second cladding layer according to Example 1 of the present invention. .

(Guide formation)
As a guide for the optical waveguide on the surface of the printed wiring board on which the circuit pattern of the four-layer photoelectric board is formed, a photosensitive solder resist is screen-printed so as to have a film thickness of 120 μm and a hot air oven at 80 ° C. After repeating the drying process for 20 minutes, the photomask pattern was UV-exposed at an exposure amount of 800 mJ / cm ² using a photomask in which a pattern having a width of 1 mm and a length of 3 mm was formed in pairs at an interval of 4.6 mm. A pattern was formed by development with an aqueous solution of sodium hydrogen carbonate having a liquid temperature of 30 ° C. and a concentration of 1 part by weight, and then heat curing at 170 ° C. for 1 hour to form a guide for joining the optical waveguide and the light emitting / receiving element.

(Formation of optical waveguide)
A method for manufacturing an optical substrate according to Embodiment 1 of the present invention will be described. In order to form the first cladding layer 2 on the support 1 using a polyethylene terephthalate film having a thickness of 100 μm as the support, a photosensitive epoxy resin material having a refractive index of 1.55 was applied by 25 μm with a die coater. The parallel light ultraviolet irradiation device was used to irradiate the parallel light ultraviolet light with an exposure amount of 500 mJ / cm ² to form the first cladding layer 2 on the support 1 (see FIG. 2A).

Next, in order to form a striped core pattern 8 having a width of 50 μm and a height of 50 μm on the cladding layer, a photosensitive epoxy resin material having a refractive index of 1.53 is used using a die coater in the same manner as the first cladding layer 2. After coating 50 μm, the surface of the coating film was dried in a warm air oven at a temperature of 80 ° C. (see FIG. 2B). Then, using a photomask on which 4 ch optical waveguide patterns having a line width of 50 μm, a length of 100 mm, and a pitch of 250 μm are formed, parallel light ultraviolet rays having an exposure amount of 500 mJ / cm ² are irradiated with a parallel light ultraviolet irradiation device (FIG. 2 ( C)), pattern exposure was performed. Thereafter, γ-butyrolactone was used as a developing solution, immersed for 30 seconds, and rinsed with 2-propanol for 20 seconds to obtain a desired core pattern 8 (see FIG. 2D).

Next, the same photosensitive epoxy material as the first cladding layer 2 was applied as a second cladding layer on the core pattern using a die coater. The application is performed so that a 25 μm coating film is formed on the core pattern. After the application, a parallel light ultraviolet ray irradiation device is used to irradiate parallel light ultraviolet rays at an exposure amount of 500 mJ / cm ^2. A first cladding layer 2 was formed in close contact with the body 1 (see FIG. 2E).

Next, in order to cut a desired optical substrate pattern in the thickness direction of the optical substrate as a laminate, first, the opening region was cut with a dicing saw. Here, as the dicing blade, a blade having a blade thickness of 60 μm was applied, and a cutting line region having a depth of 75 μm from the upper surface was processed at a position where the second cladding layer was the upper surface. At this time, the opening is stopped at the boundary position between the first cladding layer and the second cladding layer, and the laminate is not completely divided.

Next, a dicing blade having a blade thickness of 25 μm is applied so that the dividing position overlaps the center position of the width of the opening, and the depth of 125 μm is processed on the surface on which the opening is formed. It was divided. After obtaining these steps, a core pattern having a width of 50 μm and a height of 50 μm is incident and emitted at a pitch of 250 μm by cutting with a dicing saw so that the length becomes 100 mm. An optical substrate having a thickness of 100 μm was formed, and the insertion loss was 3.0 dB (see FIG. 2F).

Next, a method for manufacturing an optical substrate according to Embodiment 2 of the present invention will be described. 3 (A) to 3 (G) show the substrate of the optical substrate, the first cladding layer, the core pattern made of the second resin material, the formation of the second cladding layer, and the optical substrate according to the second embodiment of the present invention. It is sectional drawing which shows the photoelectric board | substrate which carried out. About the guide on a board | substrate, it produced in the process similar to Example 1. FIG.

(Formation of optical waveguide)
Similar to Example 1 described above, a polyethylene terephthalate film having a thickness of 100 μm is used as a support, and the first cladding layer 2 is formed on the support 1, so that a photosensitive epoxy resin having a refractive index of 1.55 is used. After coating the material with a die coater to a thickness of 25 μm, the first clad layer 2 was formed in close contact with the support 1 by irradiating it with parallel light ultraviolet rays at an exposure amount of 500 mJ / cm ² using a parallel light ultraviolet irradiation device (FIG. 3). (See (A)).

Next, in order to form a striped core pattern 8 having a width of 50 μm and a height of 50 μm on the cladding layer, a photosensitive epoxy resin material having a refractive index of 1.53 is used using a die coater in the same manner as the first cladding layer 2. After coating 50 μm, the surface of the coating film was dried in a warm air oven at a temperature of 80 ° C. (see FIG. 3B). Then, using a mold in which an optical waveguide pattern 4ch having a line width of 50 μm, a length of 100 mm, and a pitch of 250 μm is formed with a depth of 50 μm, it is pressure-bonded to the first cladding layer 2 with a pressure of 0.3 MPa. Heated to 120 ° C. and held for 30 minutes. Thereafter, the mold was peeled off from the first cladding layer 2 to obtain a desired core pattern (see FIGS. 3C and 3D).

Next, the same photosensitive epoxy material as that of the first cladding layer 2 is applied as a second cladding layer on the first cladding layer and the core pattern, and then the first cutting line region has a height of 75 μm and a width of 60 μm. Using the mold formed in the mold, the first cutting line region is aligned with a predetermined position so as to be parallel to the core pattern, and then pressure-bonded with a pressure of 0.3 MPa, and heated to 120 ° C. in that state. Hold for 30 minutes. Thereafter, the mold was peeled off from the first cladding layer 2 to obtain a laminated body in which rectangular openings were formed (see FIG. 3E).

Next, a blade with a blade thickness of 25 μm is applied between the openings formed in the laminate so as to overlap with the center position of the width of the opening, and the depth on the surface where the opening is formed is applied. 125 μm was processed and each optical waveguide was divided. After obtaining these steps, a pattern with a core width of 50 μm and a height of 50 μm is formed at a pitch of 250 μm by cutting with a dicing saw so that the end angle of the optical waveguide is 45 degrees with a length of 100 mm. An optical substrate having a thickness of 100 μm that is incident and exited on was formed on a support having a thickness of 100 μm. The insertion loss was 3.0 dB (see FIG. 3F).

Next, the obtained optical substrate is placed on a convex guide of the photoelectric junction portion of the photoelectric substrate on which a surface emitting laser (VCSEL), which is an optical element, a photodiode or the like is mounted, horizontally with respect to the photoelectric substrate. The light emitting part of the surface emitting laser and the incident part of the core of the optical substrate were aligned, and the position was fixed using an adhesive in the aligned state. Alignment here is that carried out by utilizing the guide portion, because the spacing between the optical substrate and the optoelectric substrate there is no contact provided, damage to the optical substrate surface not, be carried out alignment conveniently did it. When a signal is transmitted so that the surface emitting laser emits light, the end mirror of the non-joined portion is reflected through the core pattern of the optical substrate, and the emission of the signal is confirmed.

According to the manufacturing method according to an embodiment of the present invention, an optical substrate that is less likely to be damaged can be manufactured in the joining of the photoelectric substrate and the optical substrate, and an optical integrated circuit, optical An interconnector or an optical multiplexer / demultiplexer can be mass-produced at a high yield rate, and can be expected to be used at a low cost.

It is sectional drawing which shows an example of the photoelectric board | substrate of this invention. It is sectional drawing in the formation process of the optical board | substrate which concerns on Example 1 of this invention. It is sectional drawing in the formation process of the optical board | substrate which concerns on Example 2 of this invention.

Explanation of symbols

1: Support (base material having optical transparency)
2: first cladding layer 3: core layer 4: photomask 5: second cladding layer 6: first cutting line region 7: second cutting line region 8: dicing blade 9: optical substrate 10: mold 11: photoelectric substrate 12: Optical element (VCSEL)
13: Guide
14: Clad
15: Core

Claims (10)

A first cladding layer made of a light-transmissive first resin material, a core pattern made of a light-transmissive second resin material, and a light-transmissive third layer formed on a light-transmissive substrate. An optoelectric substrate in which an optical waveguide of an optical substrate obtained from a laminate of a second clad layer made of a resin material is used,
Light board, said forming a rectangular opening in parallel to a position between the core pattern formed in the product Sotai, is divided into individual desired light substrate at a central position in the width of the opening, each optical substrate, the edge projecting on both sides respectively are cross sectional shape having a rectangular-shaped step,
On the surface of the printed wiring board on which the circuit pattern of the optoelectric board is formed, a guide for supporting the edge of the optical board from below on the printed wiring board is provided for alignment with the optical element. Is provided in parallel to correspond to
The divided light board is supported by the guide at the stepped portion of the side edge portions, one end portion of the optical substrate, optoelectronic substrate, characterized by being bonded in contact with the lower surface of the optical element . Forming a first cladding layer made of a light-transmissive first resin material on a light-transmissive substrate;
Forming a core pattern made of a second resin material having optical transparency on the first cladding layer, and forming a second cladding layer made of a third resin material having optical transparency on the core pattern; And a process of
To form an optical substrate made of a laminate,
Next, a step of forming a rectangular opening at a position parallel to the core pattern of the laminated body, and a step of dividing each optical substrate at the center position of the width of the opening, are used for each desired light. Forming the substrate ,
Said optical substrate is inserted into the formed optoelectric substrate guide, one end of the optical substrate supported by said guide, optoelectronic substrate, characterized in that the bonding contact with a bottom surface of the optical element Manufacturing method. 3. The method of manufacturing an optoelectric substrate according to claim 2, wherein in the step of forming the core pattern, the core pattern is formed by photolithography. The core pattern is formed by molding using a mold having a concave shape corresponding to the core pattern or pressing using the mold in the step of forming the core pattern. Photoelectric substrate manufacturing method. The step of forming the opening in the rectangular shape is characterized in that the opening is formed by molding using a mold having a convex shape corresponding to the opening or pressing using the mold. 3. A method for producing an optoelectric substrate according to 2. 3. The method of manufacturing an optoelectric board according to claim 2, wherein, in the step of forming the opening in the rectangular shape, the opening is formed by cutting a laminated body between the core patterns. Wherein in the step of independently of each optical substrate, method of manufacturing the opto-electric substrate according to claim 2, characterized in that forming each optical substrate by cutting the laminate between the openings. An optical integrated circuit comprising at least the optoelectric substrate according to claim 1. An optical interconnector comprising at least the optoelectric board according to claim 1. An optical multiplexer / demultiplexer comprising at least the photoelectric substrate according to claim 1.