JP2013175285A5 - - Google Patents
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- JP2013175285A5 JP2013175285A5 JP2012037549A JP2012037549A JP2013175285A5 JP 2013175285 A5 JP2013175285 A5 JP 2013175285A5 JP 2012037549 A JP2012037549 A JP 2012037549A JP 2012037549 A JP2012037549 A JP 2012037549A JP 2013175285 A5 JP2013175285 A5 JP 2013175285A5
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- JP
- Japan
- Prior art keywords
- substrate
- layer
- organic
- light
- electrode
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- 239000000758 substrate Substances 0.000 claims 25
- 239000010410 layer Substances 0.000 claims 14
- 150000002894 organic compounds Chemical class 0.000 claims 8
- 239000012044 organic layer Substances 0.000 claims 8
- 239000011368 organic material Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Claims (4)
支持基板の一面上に、有機物層を設ける工程と、
前記有機物層を加熱して溶融させた状態で、前記第１の基板の他方の面と、前記有機物層とを密着させる工程と、
前記有機物層を冷却して固化させ、前記第１の基板と前記支持基板とを前記有機物層を介して接着する工程と、
前記第１の電極上に、発光性の有機化合物を含む層を形成する工程と、
前記発光性の有機化合物を含む層上に、第２の電極を形成する工程と、
前記有機物層を加熱して溶融させた状態で、前記支持基板から前記第１の基板を剥離する工程と、を有し、
前記有機物層に、融点が３０℃以上１５０℃以下の有機化合物を含む材料を用いることを特徴とする発光装置の作製方法。 Forming a first electrode on one surface of a flexible first substrate;
Providing an organic layer on one surface of the support substrate;
In a state of being melted by heating the organic layer, and the other surface of said first substrate, a step of Ru is in close contact with the organic material layer,
Solidified by cooling the organic material layer, and a step of said supporting substrate and said first substrate is bonded through the organic material layer,
Forming a layer containing a light-emitting organic compound on the first electrode;
On the layer containing the light-emitting organic compound, and forming a second electrode,
Peeling the first substrate from the support substrate in a state where the organic layer is heated and melted, and
A method for manufacturing a light-emitting device, wherein a material containing an organic compound having a melting point of 30 ° C. to 150 ° C. is used for the organic layer.
支持基板の一面上に、有機物層を設ける工程と、
前記有機物層を加熱して溶融させた状態で、前記第１の基板の他方の面と、前記有機物層とを密着させる工程と、
前記有機物層を冷却して固化させ、前記第１の基板と前記支持基板とを前記有機物層を介して接着する工程と、
前記第１の電極上に、発光性の有機化合物を含む層を形成する工程と、
前記発光性の有機化合物を含む層上に、第２の電極を形成する工程と、
前記第１の基板の前記一方の面と対向し、且つ可とう性を有する第２の基板と、前記第１の基板とを封止層を介して接着する工程と、
前記有機物層を加熱して溶融させた状態で、前記支持基板から前記第１の基板を剥離する工程と、を有し、
前記有機物層に、融点が３０℃以上１５０℃以下の有機化合物を含む材料を用いることを特徴とする発光装置の作製方法。 Forming a first electrode on one surface of a flexible first substrate;
Providing an organic layer on one surface of the support substrate;
In a state of being melted by heating the organic layer, and the other surface of said first substrate, a step of Ru is in close contact with the organic material layer,
Solidified by cooling the organic material layer, and a step of said supporting substrate and said first substrate is bonded through the organic material layer,
Forming a layer containing a light-emitting organic compound on the first electrode;
On the layer containing the light-emitting organic compound, and forming a second electrode,
The opposite to the one surface of the first substrate and a second substrate having flexibility, a step of bonding the first substrate via the sealing layer,
Peeling the first substrate from the support substrate in a state where the organic layer is heated and melted, and
A method for manufacturing a light-emitting device, wherein a material containing an organic compound having a melting point of 30 ° C. to 150 ° C. is used for the organic layer.
前記第１の基板または前記第２の基板の一方に、金属材料または合金材料を用い、
前記第１の基板または前記第２の基板の他方に、前記発光性の有機化合物からの発光を透過する材料を用いることを特徴とする発光装置の作製方法。 In claim 2,
While the said first substrate or said second substrate, using a metal material or alloy material,
A method for manufacturing a light-emitting device, wherein a material that transmits light emitted from the light-emitting organic compound is used for the other of the first substrate and the second substrate .
前記第１の基板または前記第２の基板の一方に、金属材料または合金材料を用い、
前記第１の基板または前記第２の基板の他方に、前記第１の電極に近い側からガラス層と有機樹脂層とが順に積層され、且つ前記発光性の有機化合物からの発光を透過する積層体を用いることを特徴とする発光装置の作製方法。 In claim 2,
While the said first substrate or said second substrate, using a metal material or alloy material,
A laminated layer in which a glass layer and an organic resin layer are sequentially laminated on the other side of the first substrate or the second substrate from the side close to the first electrode, and transmits light emitted from the light-emitting organic compound. A method for manufacturing a light-emitting device using a body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012037549A JP2013175285A (en) | 2012-02-23 | 2012-02-23 | Light-emitting device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012037549A JP2013175285A (en) | 2012-02-23 | 2012-02-23 | Light-emitting device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013175285A JP2013175285A (en) | 2013-09-05 |
| JP2013175285A5 true JP2013175285A5 (en) | 2015-04-02 |
Family
ID=49268036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012037549A Withdrawn JP2013175285A (en) | 2012-02-23 | 2012-02-23 | Light-emitting device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013175285A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102062353B1 (en) * | 2013-10-16 | 2020-01-06 | 엘지디스플레이 주식회사 | Organic light emitting device and method of fabricating the same |
| CN115719570A (en) * | 2016-11-30 | 2023-02-28 | 株式会社半导体能源研究所 | Display device and electronic device |
| KR102555383B1 (en) * | 2016-12-07 | 2023-07-12 | 엘지디스플레이 주식회사 | Lighting apparatus using organic light emitting diode and method of fabricating the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW507258B (en) * | 2000-02-29 | 2002-10-21 | Semiconductor Systems Corp | Display device and method for fabricating the same |
| JP4869471B2 (en) * | 2000-07-17 | 2012-02-08 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| JP2003255863A (en) * | 2002-03-06 | 2003-09-10 | Sanyo Electric Co Ltd | Method for manufacturing large display |
| JP2005100895A (en) * | 2003-09-26 | 2005-04-14 | Seiko Epson Corp | Manufacturing method of electro-optical device, electro-optical device manufactured by the same, electronic equipment with electro-optical device mounted, and droplet discharge device |
| WO2011030716A1 (en) * | 2009-09-08 | 2011-03-17 | 旭硝子株式会社 | Glass/resin laminate, and electronic device using same |
| JP5208227B2 (en) * | 2010-03-29 | 2013-06-12 | パナソニック株式会社 | Manufacturing method of planar warmer and manufacturing apparatus of planar warmer |
-
2012
- 2012-02-23 JP JP2012037549A patent/JP2013175285A/en not_active Withdrawn
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