JP2013174684A - Laser direct exposure system and classification management method for cam data - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make suitable the amount of CAM data that a CAM system 40 stores through classification management, and to achieve drawing by a laser direct exposure system even when a wiring board 20 expands or contracts exceeding a range of an expansion/contraction limit circle.SOLUTION: A laser direct exposure system sets a first expansion/contraction limit circle as a circular region having its center at a design position of an alignment target of CAM image data and having a radius equal to a limit value of an expansion/contraction amount of a drawable wiring board, arranges a plurality of other expansion/contraction limit circles covering a periphery of the first expansion/contraction limit circle, and generates and draws drawing control image data generated by correcting the CAM image data by expansion and contraction while aligning the design position of the alignment target to the center position of the first expansion/contraction limit circle or other expansion/contraction limit circles including position coordinates of the alignment target as a measurement result.

Description

  The present invention provides a laser direct exposure system that measures the expansion / contraction amount of a substrate by detecting a drawing target pattern, and draws an image of a wiring pattern on the substrate by correcting the expansion / contraction of the drawing pattern according to the expansion / contraction amount of the substrate. And a CAM data classification management method.

  In order to miniaturize the wiring pattern formed on the wiring board, a hard layer with a glass cloth is made on the core board, a thin insulating layer is stacked on top of it, and a build-up layer that forms fine wiring on it is further formed. Build-up multilayer wiring boards to be formed are manufactured.

  When stress and chemical stress due to heat and pressure applied when manufacturing this build-up multilayer wiring board are applied, the wiring substrate 20 is distorted or stretched.

  Since the wiring board 20 is thus deformed, the amount of deviation between the existing wiring pattern on the surface of the wiring board 20 and the drawing design data for drawing the wiring pattern superimposed thereon is measured, and the deviation is measured. A scaling correction value for correcting the drawing design data in order to reduce is calculated. Then, a wiring pattern is drawn on the wiring board 20 using the drawing design data corrected by the scaling correction value.

  In the conventional technique of the laser direct exposure system disclosed in Patent Document 1, this correction processing is performed by imaging the alignment target of the substrate, calculating how much the position of the alignment target is deviated from the drawing design data, The scaling correction value is calculated to correct the drawing design data by calculating the expansion and contraction and distortion. Then, an image of the wiring pattern is drawn on the photosensitive resist on the copper foil on the surface of the wiring board 20 using the drawing design data corrected by the scaling correction value.

  Then, the photosensitive resist of the wiring board 20 is developed to form an etching resist pattern. The copper foil of the wiring board 20 protected by the etching resist pattern is etched to form a wiring pattern.

JP 2004-056068 A

  Here, in the wiring pattern formation process, the CAM system 40 creates the CAM data D43 necessary for manufacturing the wiring board 20 by correcting the expansion and contraction according to the expansion and contraction occurring in the wiring board 20 as follows. A plurality of the CAM data D43 are managed and stored, and the CAM data D43, which is appropriately expanded and contracted, is supplied to the manufacturing apparatus 50 in the manufacturing process of the wiring board 20. The CAM data D43 and the like that need to be classified and managed include CAM image data supplied to the laser direct exposure system 10, hole position data of the wiring board 20, CAM image data of a solder resist printing pattern, wiring board, and the like. There are 20 pieces of data for external processing, and there are other CAM data for processing in which dimensional correction is required for data values due to expansion and contraction of the wiring board. In addition, a plurality of manufacturing equipment such as a printed pattern film, a manufacturing auxiliary tool used for manufacturing, and the like must be prepared and used for manufacturing the wiring board 20.

  In detail, the CAM system 40 uses the CAM data D43 in which the CAM system 40 performs scaling correction by classifying the expansion / contraction amount of the wiring board 20 according to the expansion / contraction amount in the X direction and the expansion / contraction amount in the Y direction. prepare. In the conventional category management, the size of the expansion / contraction amount in the X direction of the wiring board 20 is classified and managed, and the expansion / contraction amount in the Y direction is classified and managed, as shown in FIG. The coordinates and the coordinates of the amount of expansion and contraction in the Y direction are classified into a divided area A40 obtained by dividing the XY two-dimensional coordinate plane into a lattice shape.

  Then, CAM data D43 corrected for expansion / contraction is prepared for each divided region A40 corresponding to the range of expansion / contraction amount of the wiring board 20, and the data is commonly used for the wiring board 20 within the expansion / contraction amount range. In this way, CAM data D43 is prepared for each division area A40, stored in the storage means 41 of the CAM system 40, and division management to be supplied to the manufacturing apparatus 50 is performed.

  For example, when drawing is performed in the laser direct exposure system 10, the expansion / contraction amount of the wiring board 20 to be drawn is grasped by measuring the position of the alignment target 23, and based on the result, the laser direct exposure system 10 performs the CAM. The system is requested for CAM image data classified into the corresponding segmented area A40. Then, the laser direct exposure system 10 draws a wiring pattern on the wiring board 20 using the CAM image data appropriately sent from the CAM system 40.

  When the laser direct exposure system 10 draws a wiring pattern on the wiring board 20, it measures the amount of expansion / contraction of the wiring board 20, and the drawing position on the wiring board 20 deviates greatly from the position indicated by the CAM image data. In this case, the limit deviation amount of the drawing is determined to determine whether or not drawing is possible.

  The determination of whether or not drawing is possible is performed by determining the limit of the amount of deviation of the measured position of the alignment target 23 from the position indicated by the CAM image data received from the CAM system 40. Judgment is made using multiplication. That is, when the sum of the square of the displacement amount in the X direction of the drawing surface and the square of the displacement amount in the Y direction is added and the total value is equal to or less than a predetermined limit value, the laser direct exposure system 10 performs the CAM image. A wiring pattern is drawn on the wiring board 20 based on the data. When the sum of the squares of the deviation amounts exceeds a predetermined limit value, the laser direct exposure system 10 determines that the drawing is not performed on the assumption that the distortion of the wiring board 20 exceeds the limit deviated from the CAM image data.

  This limit range is a circular area in the XY coordinate system centered on the position indicated by the CAM image data and having a radius as the limit value of the expansion / contraction amount of the wiring board 20 that can be drawn. Name it a circle. As described above, the expansion / contraction amount in the X direction and the expansion / contraction amount in the Y direction of the wiring board 20 that can be drawn by the laser direct exposure system 10 using the CAM image data are used as expansion / contraction limit circles that are circular regions in the XY coordinate system. Manage.

  An expansion / contraction limit circle for determining the limit of the amount of deviation of the drawing position from the design position by the laser direct exposure system 10 and a classification management range in which the CAM system separately manages the expansion / contraction amount of the wiring board 20 to prepare CAM image data. The following two management methods for determining the relationship with the segmented area A40 for determining the following have the following problems.

  (1) A classification management system in which the expansion / contraction limit circle determined by the laser direct exposure system is included and managed within the range of the classification area A40 of the CAM image data managed and classified by the CAM system 40 is conceivable.

However, in the case of this division management system, the expansion / contraction amount of the wiring board 20 that protrudes outside the expansion / contraction limit circle that determines the expansion / contraction amount that can be drawn is included in the rectangular division region A40. In the case of the wiring board 20 in which the expansion / contraction amount protrudes outside the expansion / contraction limit circle, there is a problem that the laser direct exposure system 10 determines that laser direct exposure is impossible.

  (2) The laser direct exposure system 10 includes one segmented area A40 within the range of the expansion / contraction limit circle that defines the range of the expansion / contraction amount in the X direction and the expansion / contraction amount in the Y direction that can be drawn with CAM image data. A separate management system can be considered.

  In this case, since the rectangular segmented area A40 is included in the expansion / contraction limit circle, the laser direct exposure system 10 can be drawn with CAM image data prepared and managed according to the expansion / contraction amount of the wiring board 20. .

  However, in this case, since the size of the rectangular divided area A40 is reduced so as to be included in the expansion / contraction limit circle area, the number of the divided areas A40 in which the expansion / contraction amount of the wiring board 20 should be managed separately increases. . That is, the number of CAM data D43 prepared by correcting the expansion and contraction for supply to the manufacturing apparatus 50 in each manufacturing process increases, and the number of man-hours for managing the CAM data D43 increases, and each process of the wiring board 20 is performed. There is a problem of increasing the manufacturing cost.

  An object of the present invention is to solve the above-mentioned problem, optimize a segmented area managed by the CAM system 40, and provide a CAM image prepared even when the wiring board 20 has expansion / contraction outside the expansion limit circle range. An object of the present invention is to provide a laser direct exposure system that enables the laser direct exposure system 10 to draw data.

  In order to solve the above problems, the present invention receives CAM image data from a CAM system, calculates the amount of expansion / contraction of the wiring board by measuring the position of the alignment target of the wiring board, and corrects the expansion / contraction amount. A laser direct exposure system that creates and draws drawing control image data, and has a circular shape having a radius as a limit value of an expansion / contraction amount of a drawable wiring board centering on a design position of an alignment target in the CAM image data A first stretch limit circle which is a region, a plurality of other stretch limit circles surrounding the first stretch limit circle are arranged, and the first stretch limit circle including the position coordinates of the alignment target of the measurement result is included. Stretching correction of the CAM image data so that the design position of the alignment target is aligned with the center position of the stretch limit circle or the other stretch limit circle And a laser direct exposure system, characterized in that drawing to create a drawing control image data.

  Further, the present invention is the laser direct exposure system described above, wherein the first expansion limit circle or the other expansion limit circle including the position coordinates of the alignment target of the measurement result is used as the segmented area in the CAM system. The laser direct exposure system is characterized in that the CAM system classifies and manages the CAM data for manufacturing the wiring board by notifying.

  Further, according to the present invention, the laser direct exposure system measures the position of the alignment target of the wiring board, and the limit value of the expansion / contraction amount of the wiring board that can be drawn around the design position of the alignment target in the CAM image data is defined as the radius. A first expansion limit circle that is a circular region to be arranged, a plurality of other expansion limit circles are arranged around the first expansion limit circle, and the position coordinates of the alignment target of the measurement result are included. A CAM data division management method in which a CAM system performs division management of CAM data for manufacturing a wiring board, using one expansion limit circle or the other expansion limit circle as a unit of division control.

  The present invention sets a first expansion limit circle, which is a circular region having a radius that is a limit value of the expansion / contraction amount of a drawable wiring board centering on the design position of the alignment target in the CAM image data. A plurality of other expansion / contraction limit circles covering the circumference of one expansion / contraction limit circle are arranged. The laser direct exposure system measures the position coordinates of the alignment target. A first expansion limit circle or another expansion limit circle including the measurement position is extracted as a segmented region. Accordingly, the CAM system manages the expansion / contraction of the wiring board 20 by using the expansion / contraction limit circle as a divided region.

  As a result, according to the present invention, the number of CAM data created by performing category management according to the expansion and contraction of the wiring board 20 can be suppressed to an appropriate number, and the segmented area to be managed can be optimized. There is an effect of not increasing the cost required for manufacturing the substrate.

  Even when the amount of expansion / contraction of the wiring board 20 in the XY direction is large and the measurement result of the position of the alignment target 23 exceeds the range of the first expansion / contraction limit circle A21 that defines the drawable limit, other expansion / contraction Since the position of the alignment target 23 of the image of the wiring pattern 22 to be drawn is drawn in accordance with the reference position with the center position of the limit circle as the reference position, the problem that drawing by the laser direct exposure system becomes impossible can be eliminated. There is an effect that can be done.

It is a block diagram which shows the structure of the laser direct exposure system which exposes a wiring pattern to the photosensitive resist of the wiring board of embodiment of this invention. (A) It is sectional drawing of the wiring board produced by embodiment of this invention. (B) It is a top view of the example of the alignment target of the wiring board which draws a wiring pattern by embodiment of this invention. (C) It is a top view of the example of the other alignment target of the wiring board which draws a wiring pattern by embodiment of this invention. It is a figure showing the 1st to the 7th expansion limit circle of the embodiment of the present invention. (A) It is a figure showing the 1st expansion-contraction limit circle A21 of embodiment of this invention. (B) It is a figure showing 2nd expansion-contraction limit circle A22 of embodiment of this invention. (C) It is a figure showing the 3rd expansion-contraction limit circle A23 of embodiment of this invention. (D) It is a figure showing the 4th expansion-contraction limit circle A24 of embodiment of this invention. (E) It is a figure showing the 5th expansion-contraction limit circle A25 of embodiment of this invention. (F) It is a figure showing the 6th expansion-contraction limit circle A26 of embodiment of this invention. (G) It is a figure showing the 7th expansion-contraction limit circle A27 of embodiment of this invention. It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 1). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 2). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 3). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 4). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 5). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 6). It is a flowchart showing the operation | movement of the laser direct exposure system of embodiment of this invention (the 7). It is a figure which shows the position of the expansion-contraction limit circle which carries out division management of the expansion / contraction of a wiring board of embodiment of this invention. It is a figure showing the conventional division area.

<First Embodiment>
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a block diagram of a configuration of a laser direct exposure system (LDI system) 10 according to the first embodiment of the present invention. The laser direct exposure system 10 creates drawing control image data D42 based on the CAM image data D41 received from the CAM system 40, and scans the wiring board 20 with the laser beam L based on the data. An image of the wiring pattern is drawn on the upper photosensitive resist.

  FIG. 2A shows a cross-sectional view of the wiring board 20. As shown in FIG. 2A, the wiring substrate 20 has a conductive metal wiring pattern 22 such as a multilayer copper wiring on an insulating resin substrate 21 such as a glass epoxy substrate or a polyimide substrate.

(Measurement of alignment target position by laser direct exposure system)
When drawing an image of the wiring pattern, the laser direct exposure system 10 measures the position of the alignment target 23 formed on the wiring board 20 using the position measuring means 11 constituted by an imaging means or the like as shown in FIG. To do. The alignment target 23 of the wiring board 20 is placed together with the wiring pattern 22 on the surface of the wiring board 20 as shown in the cross-sectional view of FIG. 2A and the plan views of FIG. 2B and FIG. It is constituted by one via hole formed in the above, or a plurality of micro vias 24 formed in an array.

  The laser direct exposure system 10 performs position correction on the arrangement positions of the four alignment targets 23 measured in this way to remove the parallel movement and rotation effect of the arrangement, and the four alignment targets 23 after the position correction. Are arranged on the XY plane as shown in FIG.

(Category management of CAM data corrected for board expansion / contraction by CAM system)
The CAM system 40 separately manages expansion / contraction correction of the CAM image data D41 subjected to expansion / contraction correction and expansion / contraction correction of the CAM data D43 required by the manufacturing apparatus 50 in each manufacturing process of the wiring substrate 20 in accordance with the expansion / contraction occurring in the wiring substrate 20. The CAM data D43 to be classified and managed includes, for example, the drilling position data of the wiring board 20, the CAM image data of the solder resist printing pattern, the data for external processing of the wiring board 20, and the other by the expansion and contraction of the wiring board. There is CAM data D43 for processing that needs to be subjected to dimension correction on the data value. In addition, a printing pattern film, a manufacturing auxiliary tool used for the manufacturing, and the like are classified and managed by the expansion / contraction limit circle to prepare a plurality of manufacturing equipments for use in manufacturing the wiring board 20.

  In the expansion / contraction correction category management according to the present embodiment, the CAM system 40 classifies whether the expansion / contraction amount of the wiring board 20 corresponds to any of a plurality of expansion / contraction limit circles described below, and the expansion / contraction limit circle is a unit. Thus, the expansion / contraction amount of the wiring board 20 is managed separately.

  For the division management, the laser direct exposure system 10 uses the position measuring means 11 to measure the arrangement positions of the four alignment targets 23 on the wiring board 20 and removes the translational and rotational effects of the arrangement. Position correction is performed, and the positions of the four alignment targets 23 after the correction are arranged on the XY plane as shown in FIG.

The position correction of the four alignment targets 23 thus measured is performed as follows. The measured XY coordinates of the four alignment targets 23 are (X1, Y1) (X2, Y2) (X3, Y3) (X4, Y4). The measured center of gravity of the alignment target 23 is translated in the X direction by the following expression 1 and in the Y direction by the expression 2, so that the amount is corrected.
(Formula 1) (X1 + X2 + X3 + X4) / 4- (X coordinate of design center of gravity)
(Formula 2) (Y1 + Y2 + Y3 + Y4) / 4− (Y coordinate of design center of gravity)

The measured alignment target 23 is approximately rotated in the counterclockwise direction by the angle α radians of Equation 3 below.
(Formula 3) α = ((Y4-Y1) / (X4-X1) + (Y3-Y2) / (X3-X2)
+ (X3-X4) / (Y4-Y3) + (X2-X1) / (Y1-Y2)) / 4
When the rotation amount of the layout of the wiring board 20 is small, the measurement position is corrected only by moving the center of gravity position of the wiring board, and the position coordinate with the center of gravity of the wiring board as the origin is the position of each alignment target 23 whose measurement position is corrected. It becomes position coordinates.

  With respect to the measured position of the alignment target 23, position coordinates obtained by correcting the translation and rotation are obtained. The position coordinates of the alignment target 23 whose position has been corrected in this way are represented on the XY plane. The positional displacement of each alignment target 23 in the X direction and the Y direction is radially displaced from the center of gravity of the four alignment targets 23. The amount of misalignment of the alignment target 23 represents the amount of expansion / contraction of the wiring substrate 20 in the X direction and the amount of expansion / contraction in the Y direction.

  As shown in FIG. 3B, the expansion / contraction amount of the wiring board 20 is represented by the amount of deviation from the reference position of the position on the XY plane where the position of the alignment target 23 is corrected for the measurement result. It can be shown. Then, as shown in FIG. 3B, the expansion / contraction amount is classified and managed by making the coordinate area on the XY plane correspond to the expansion / contraction limit circle of the circular area.

  That is, the laser direct exposure system 10 calculates the design position of the alignment target 23 from the CAM image data D41 received from the CAM system 40, sets the position as the first standard position, and sets the first standard position as the reference position. To do. Next, the laser direct exposure system 10 calculates a first expansion / contraction limit circle A21 centered on the reference position.

  The first expansion / contraction limit circle A21 is a circular region centered on the reference position, and the laser direct exposure system 10 creates the drawing control image data D42 without correcting the expansion / contraction with respect to the CAM image data D41. 22 is a circular area that defines the range of the limit of the amount of deviation in the X direction and the amount of deviation in the Y direction of the center position of the alignment target 23 that allows the image 22 to be drawn on the wiring board 20. . The first expansion / contraction limit circle A21 is assumed to be one of the divided areas for managing the amount of expansion / contraction of the wiring board 20 in a divided manner.

  In the case of FIG. 3B, the measurement position of the alignment target 23 enters the first expansion / contraction limit circle A21. In this case, the expansion / contraction of the wiring board 20 is made to correspond to the first expansion / contraction limit circle A21. Manage quantity separately.

  The laser direct exposure system 10 determines whether or not the position coordinates of the alignment target 23 whose position is corrected for the measurement result is included in the range of the first expansion / contraction limit circle A21. When the position coordinate of the alignment target 23 whose position is corrected in the measurement result is not within the range of the first expansion / contraction limit circle A21, a second expansion / contraction limit circle A22 indicated by a circular broken line in FIG. Then, it is determined whether or not the position of the alignment target 23 whose position has been corrected for the measurement result is included in the range of the second expansion / contraction limit circle A22. The center of the second expansion limit circle A22 is the second standard position, and the second standard position is the reference position.

Similarly, the third expansion limit circle A23 indicated by a circular broken line in FIG. 3B is calculated, and the position of the alignment target 23 obtained by correcting the position of the measurement result within the range of the third expansion limit circle A23 is calculated. Determine whether it is included. Sequentially, the determination based on the fourth expansion limit circle A24, the determination based on the fifth expansion limit circle A25, the determination based on the sixth expansion limit circle A26, and the determination based on the seventh expansion limit circle A27 are performed.

  Here, the second expansion limit circle A22 to the seventh expansion limit circle A27 are set to the same size as the first expansion limit circle A21.

  Next, the laser direct exposure system 10 determines the expansion / contraction limit circle (from the first expansion / contraction limit circle A21 to the seventh expansion limit circle determined to include the position of the alignment target 23 from the first standard position according to the determination result. The center position (any one of the first standard position to the seventh standard position) of the expansion limit circle A27) is set as the reference position. Then, drawing control image data D42 in which the arrangement position of the wiring pattern 22 is expanded and contracted so that the design position of the alignment target 23 matches the reference position is created.

  Then, the expansion / contraction limit circle (any one of the first expansion / contraction limit circle A21 to the seventh expansion / contraction limit circle A27) determined to include the position of the alignment target 23 is used as a divided region for separately managing the expansion / contraction amount of the substrate. , Notify the CAM system 40. Then, the CAM system 40 stores in the storage means 41 data recorded by associating and recording the expansion / contraction limit circle that gives the range of expansion / contraction amount to which the wiring board 20 belongs to each wiring board 20, and is used for manufacturing the wiring board 20 The data D43 is classified and managed by the expansion / contraction limit circle and stored in the storage means 41.

  The laser direct exposure system 10 performs switching control of the laser beam L emitted from the laser light source 13 while scanning the laser beam L on the wiring substrate 20 on the basis of the drawing control image data D42 thus created. An image of the wiring pattern 22 is drawn on 20 resists.

  Accordingly, the laser direct exposure system 10 draws an image of a new wiring pattern to be superimposed on the wiring pattern 22 already formed on the wiring board 20 on the resist on the wiring board 20.

(Alignment target position determination procedure)
In the following, with reference to the conceptual diagram of the expansion / contraction limit circle that defines the range of expansion / contraction amount of the category management of FIG. 4 and the flowcharts of FIG. 5 to FIG. A procedure for drawing the wiring pattern 22 on the wiring board 20 by creating drawing control image data D42 subjected to expansion / contraction correction from the CAM image data D41 based on the position 23 will be described.

(Step S1)
First, the laser direct exposure system 10 receives the CAM image data D41 from the CAM system of FIG. 1, and calculates the first standard position of the alignment target 23 from the data. The first standard position is set as a reference position. Here, a first expansion limit having a radius as an amount of expansion / contraction that allows the laser direct exposure system 10 to draw an image of the wiring pattern 22 on the wiring board 20 without correcting the expansion / contraction about the first standard position. A circle A21 is indicated by a circular halftone dot mark in FIGS. 3 and 4A.

(Step S2)
Next, the laser direct exposure system 10 measures the positions of the alignment targets 23 formed at the four corners of the wiring board 20 by the position measuring means 11 of FIG.

(Step S3)
Next, the laser direct exposure system 10 calculates the center of gravity of the measured positions of the four alignment targets 23 and calculates the rotation angle from the reference position of the alignment target 23 around the center of gravity. Thereby, the position coordinates obtained by correcting the center of gravity positions of the measured positions of the four alignment targets 23 and the rotation angles of the arrangement positions are calculated, and the position coordinates are used as the first standard of the alignment target 23 in the CAM image data D41. Compare with position.

(Step S4)
Next, in the laser direct exposure system 10, the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the first standard position of the alignment target 23 in the CAM image data D41 is a predetermined amount (for example, 65 μm) or less. It is determined whether or not. If the deviation amount is less than or equal to the predetermined amount, the process proceeds to step S5, and if the deviation amount exceeds the predetermined amount, the process proceeds to step S12.

(Step S5)
The laser direct exposure system 10 creates standard drawing control image data D42 that does not expand or contract the drawing pattern from the CAM image data D41 on the surface of the wiring board 20, and uses the drawing control image data D42 to set the drawing position to an alignment target. The image of the wiring pattern 22 is drawn on the photosensitive resist on the copper foil on the surface of the wiring board 20 by correcting according to the parallel movement amount of the center of gravity of the measurement position 23 and the rotation amount of the arrangement. Then, the first expansion limit circle A21 is notified to the CAM system 40 as a divided area for managing the expansion / contraction amount of the substrate.

(Step S6)
Next, the wiring board 20 is turned over and installed in the laser direct exposure system 10. Then, the laser direct exposure system 10 measures the positions of the alignment targets 23 formed at the four corners of the back surface of the wiring board 20 with respect to the back surface of the wiring board 30 by the position measuring unit 11 of FIG.

(Step S7)
Next, the laser direct exposure system 10 calculates the center of gravity of the measured positions of the four alignment targets 23 and calculates the rotation angle from the reference position of the alignment target 23 around the center of gravity.

(Step S8)
Next, the laser direct exposure system 10 calculates position coordinates obtained by correcting the center of gravity positions of the measured positions of the four alignment targets 23 and the rotation angle of the arrangement positions, and uses the position coordinates as the CAM on the back surface of the wiring board 20. A comparison is made with the first standard position of the alignment target 23 in the image data D41.

(Step S9)
Next, the laser direct exposure system 10 determines the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the first standard position of the alignment target 23 in the CAM image data D41 on the back surface of the wiring board 20. It is determined whether it is below a fixed amount (for example, 65 μm). When the deviation amount is equal to or smaller than the predetermined amount, the process proceeds to step S11, and when the deviation amount exceeds the predetermined amount, the process proceeds to step S10.

(Step S10)
When the amount of deviation exceeds a predetermined amount, the laser direct exposure system 10 notifies the CAM system and records a production history indicating that the deviation of the back surface of the wiring board 20 exceeds the predetermined amount. Then, the process proceeds to the next step S11.

(Step S11)
The laser direct exposure system 10 creates standard drawing control image data D42 that does not expand or contract the drawing pattern from the CAM image data D41 on the back surface of the wiring board 20, and uses the drawing control image data D42 to set the drawing position to an alignment target. The image of the wiring pattern 22 is drawn on the photosensitive resist on the copper foil on the back surface of the wiring board 20 by correcting according to the parallel movement amount of the center of gravity of the measurement position 23 and the rotation amount of the arrangement.

(Step S12)
The laser direct exposure system 10 creates second drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, the center position of the circular first expansion / contraction limit circle A <b> 21 indicated by the halftone dot mark in FIGS. 3 and 4A is set as the first standard position of the alignment target 23. Then, a circular second expansion / contraction limit circle A22 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4B and its center position (second standard position) are calculated. The second standard position is set as a reference position. The laser direct exposure system 10 extends and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the second standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S13)
Next, the laser direct exposure system 10 compares the measured coordinates of the center of gravity of the four positions of the alignment target 23 and the position coordinates obtained by correcting the rotation angle of the arrangement position with the second standard position of the alignment target 23.

(Step S14)
Next, the laser direct exposure system 10 determines the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the second standard position of the alignment target 23 in the CAM image data D41 on the surface of the wiring board 20. It is determined whether it is below a fixed amount (for example, 65 μm). When the deviation amount is equal to or smaller than the predetermined amount, the process proceeds to step S15, and when the deviation amount exceeds the predetermined amount, the process proceeds to step S22.

(Step S15)
The laser direct exposure system 10 creates second drawing control image data D42 by correcting the position of the alignment target 23 to the second standard position by expanding and contracting the drawing pattern from the CAM image data D41 on the surface of the wiring board 20. Then, using the second drawing control image data D42, the drawing position is corrected according to the parallel movement amount of the center of gravity of the measurement position of the alignment target 23 and the rotation amount of the arrangement, and the copper on the surface of the wiring board 20 is corrected. An image of the wiring pattern 22 is drawn on the photosensitive resist on the foil. Then, the second expansion / contraction limit circle A22 is notified to the CAM system 40 as a divided area for managing the expansion / contraction amount of the substrate.

(Step S16)
Next, the wiring board 20 is turned over and installed in the laser direct exposure system 10. Then, the laser direct exposure system 10 measures the positions of the alignment targets 23 formed at the four corners of the back surface of the wiring board 20 with respect to the back surface of the wiring board 30 by the position measuring unit 11 of FIG.

(Step S17)
Next, the laser direct exposure system 10 calculates the center of gravity of the positions of the four alignment targets 23 measured, and the rotation angle from the reference position (second standard position) of the alignment target 23 around the center of gravity. Calculate

(Step S18)
Next, the laser direct exposure system 10 calculates position coordinates obtained by correcting the center of gravity positions of the measured positions of the four alignment targets 23 and the rotation angle of the arrangement positions, and uses the position coordinates as the CAM on the back surface of the wiring board 20. It is compared with the second standard position of the alignment target 23 in the image data D41.

(Step S19)
Next, the laser direct exposure system 10 determines the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the second standard position of the alignment target 23 in the CAM image data D41 on the back surface of the wiring board 20. It is determined whether it is below a fixed amount (for example, 65 μm). When the deviation amount is equal to or smaller than the predetermined amount, the process proceeds to step S21, and when the deviation amount exceeds the predetermined amount, the process proceeds to step S20.

(Step S20)
When the amount of deviation exceeds a predetermined amount, the laser direct exposure system 10 notifies the CAM system and records a production history indicating that the deviation of the back surface of the wiring board 20 exceeds the predetermined amount. Then, the process proceeds to next Step S21.

(Step S21)
The laser direct exposure system 10 creates the second drawing control image data D42 by correcting the position of the alignment target 23 to the second standard position by expanding and contracting the drawing pattern from the CAM image data D41 on the back surface of the wiring board 20. Then, using the second drawing control image data D42, the drawing position is corrected according to the parallel movement amount of the center of gravity of the measurement position of the alignment target 23 and the rotation amount of the arrangement, and the copper on the back surface of the wiring board 20 is corrected. An image of the wiring pattern 22 is drawn on the photosensitive resist on the foil.

(Step S22)
The laser direct exposure system 10 creates third drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, the center position of the circular first expansion / contraction limit circle A <b> 21 indicated by the halftone dot mark in FIGS. 3 and 4A is set as the first standard position of the alignment target 23. Then, a circular third expansion / contraction limit circle A23 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4C and its center position (third standard position) are calculated. The third standard position is set as a reference position. The laser direct exposure system 10 extends and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the third standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S23)
Next, the laser direct exposure system 10 compares the position coordinates obtained by correcting the center of gravity positions of the measured positions of the four alignment targets 23 and the rotation angle of the arrangement position with the third standard position of the alignment target 23.

(Step S24)
Next, the laser direct exposure system 10 determines the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the third standard position of the alignment target 23 in the CAM image data D41 on the surface of the wiring board 20. It is determined whether it is below a fixed amount (for example, 65 μm). If the deviation amount is equal to or smaller than the predetermined amount, the process proceeds to step S25, and if the deviation amount exceeds the predetermined amount, the process proceeds to step S32.

(Step S25)
The laser direct exposure system 10 creates third drawing control image data D42 by correcting the position of the alignment target 23 to the third standard position by expanding and contracting the drawing pattern from the CAM image data D41 on the surface of the wiring board 20. Then, using the third drawing control image data D42, the drawing position is corrected according to the parallel movement amount of the center of gravity of the measurement position of the alignment target 23 and the rotation amount of the arrangement, and the copper on the surface of the wiring board 20 is corrected. An image of the wiring pattern 22 is drawn on the photosensitive resist on the foil. Then, the third expansion limit circle A23 is notified to the CAM system 40 as a divided area for managing the expansion / contraction amount of the substrate.

(Step S26)
Next, the wiring board 20 is turned over and installed in the laser direct exposure system 10. Then, the laser direct exposure system 10 measures the positions of the alignment targets 23 formed at the four corners of the back surface of the wiring board 20 with respect to the back surface of the wiring board 30 by the position measuring unit 11 of FIG.

(Step S27)
Next, the laser direct exposure system 10 calculates the center of gravity of the measured positions of the four alignment targets 23, and the rotation angle from the reference position (third standard position) of the alignment target 23 around the center of gravity. Calculate

(Step S28)
Next, the laser direct exposure system 10 calculates position coordinates obtained by correcting the center of gravity positions of the measured positions of the four alignment targets 23 and the rotation angle of the arrangement positions, and uses the position coordinates as the CAM on the back surface of the wiring board 20. A comparison is made with the third standard position of the alignment target 23 in the image data D41.

(Step S29)
Next, in the laser direct exposure system 10, the amount of deviation of the position coordinates of the alignment target 23 corrected in this way from the third standard position of the alignment target 23 in the CAM image data D41 is a predetermined amount (for example, 65 μm) or less. It is determined whether or not. When the deviation amount is equal to or smaller than the predetermined amount, the process proceeds to step S31, and when the deviation amount exceeds the predetermined amount, the process proceeds to step S30.

(Step S30)
When the amount of deviation exceeds a predetermined amount, the laser direct exposure system 10 notifies the CAM system and records a production history indicating that the deviation of the back surface of the wiring board 20 exceeds the predetermined amount. Then, the process proceeds to next Step S31.

(Step S31)
The laser direct exposure system 10 creates third drawing control image data D42 by correcting the position of the alignment target 23 to the third standard position by expanding and contracting the drawing pattern from the CAM image data D41 on the back surface of the wiring board 20. Then, using the third drawing control image data D42, the drawing position is corrected according to the parallel movement amount of the center of gravity of the measurement position of the alignment target 23 and the rotation amount of the arrangement, and the copper on the back surface of the wiring board 20 is corrected. An image of the wiring pattern 22 is drawn on the photosensitive resist on the foil.

(Step S32)
The laser direct exposure system 10 creates fourth drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, FIGS. 3 and 4
The center position of the circular first expansion / contraction limit circle A21 indicated by the halftone dot mark in (a) is set as the first standard position of the alignment target 23. Then, a circular fourth expansion limit circle A24 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4D and its center position (fourth standard position) are calculated. The fourth standard position is set as a reference position. The laser direct exposure system 10 extends and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the fourth standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S33 to Step S41)
In step S33 to step S41, the same processing as in step S23 to step S31 is performed on the fourth standard position and the fourth drawing control image data D42, and the photosensitive on the copper foil on the front and back surfaces of the wiring board 20 is performed. An image of the wiring pattern 22 is drawn on the conductive resist.

(Step S42)
The laser direct exposure system 10 creates fifth drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, the center position of the circular first expansion / contraction limit circle A <b> 21 indicated by the halftone dot mark in FIGS. 3 and 4A is set as the first standard position of the alignment target 23. Then, a circular fifth expansion limit circle A25 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4E and its center position (fifth standard position) are calculated. The fifth standard position is set as a reference position. The laser direct exposure system 10 extends and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the fifth standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S43 to Step S51)
In step S43 to step S51, the same processing as in step S23 to step S31 is performed on the fifth standard position and the fifth drawing control image data D42, and photosensitive on the copper foil on the front and back surfaces of the wiring board 20 is performed. An image of the wiring pattern 22 is drawn on the conductive resist.

(Step S52)
The laser direct exposure system 10 creates sixth drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, the center position of the circular first expansion / contraction limit circle A <b> 21 indicated by the halftone dot mark in FIGS. 3 and 4A is set as the first standard position of the alignment target 23. Then, a circular sixth expansion limit circle A26 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4F and its center position (sixth standard position) are calculated. The sixth standard position is set as a reference position. The laser direct exposure system 10 extends and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the sixth standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S53 to Step S61)
In step S53 to step S61, the same processing as that in step S23 to step S31 is performed on the sixth standard position and the sixth drawing control image data D42, and photosensitive on the copper foil on the front and back surfaces of the wiring board 20 is performed. An image of the wiring pattern 22 is drawn on the conductive resist.

(Step S62)
The laser direct exposure system 10 creates sixth drawing control image data D42 in which expansion / contraction is corrected from the CAM image data D41 on the surface of the wiring board 20. Here, the center position of the circular first expansion / contraction limit circle A <b> 21 indicated by the halftone dot mark in FIGS. 3 and 4A is set as the first standard position of the alignment target 23. Then, a circular seventh expansion limit circle A27 indicated by a circular broken line in FIG. 3B and indicated by a halftone dot mark in FIG. 4G and its center position (seventh standard position) are calculated. The seventh standard position is set as a reference position. The laser direct exposure system 10 expands and contracts the wiring pattern 22 so that the first standard positions of the four alignment targets 23 are aligned with the seventh standard positions (reference positions) of the four alignment targets 23. The correction value data for creating the drawing control image data D42 is created.

(Step S63 to Step S71)
In step S63 to step S71, the same processing as in step S23 to step S31 is performed on the seventh standard position and the seventh drawing control image data D42, and photosensitive on the copper foil on the front and back surfaces of the wiring board 20 is performed. An image of the wiring pattern 22 is drawn on the conductive resist.

  Among them, particularly in step S64, when the deviation of the position coordinates of the alignment target 23 from the seventh standard position of the alignment target 23 in the CAM image data D41 on the surface of the wiring board 20 exceeds a predetermined amount, an alarm is generated. Is determined. In the case of an alarm, it is determined that the wiring board 20 is abnormal in size, drawing on the wiring board 20 is stopped, and the wiring board 20 is discharged out of the apparatus.

  According to the present embodiment, the laser direct exposure system 10 measures the amount of expansion / contraction of the wiring substrate 20, calculates whether the amount of expansion / contraction corresponds to any of a plurality of expansion / contraction limit circles, and sends the result to the CAM system 40. Notice. As a result, the CAM system 40 determines the expansion / contraction limit circle of the wiring board 20 as the segmented region, based on the expansion / contraction limit circle within which the expansion / contraction amount is within the expansion / contraction limit circle. By classifying, the amount of expansion / contraction of the wiring board 20 is managed separately.

  Then, when the position of the alignment target 23 is included in the range of the first expansion / contraction limit circle A21, the laser direct exposure system 10 creates the first drawing control image data D42 that does not correct the expansion / contraction. In other cases, when the position of the alignment target 23 is included in the range of the second expansion limit circle A22 to the seventh expansion limit circle A27, the center position of the expansion limit circle is used as a reference position. Drawing control image data D42 in which expansion / contraction is corrected so that the position of the alignment target 23 of the image of the wiring pattern 22 to be drawn matches the reference position is created.

  In this way, the laser direct exposure system 10 receives from the CAM system 40 the CAM image data D41 created by the CAM system 40 according to the expansion / contraction limit circle and created in accordance with the expansion / contraction amount of the wiring board 20. Then, the laser direct exposure system 10 measures the position of the alignment target 23 of the wiring board 20 using the position measuring means 11 and calculates the expansion / contraction amount of the wiring board 20 by calculating the measurement data. Next, the expansion / contraction of the CAM image data D41 is corrected based on the calculation result and converted into the drawing control image data D42. Then, the image of the wiring pattern 22 is drawn on the photosensitive resist on the wiring board 20 by the drawing control image data D42. Further, the laser direct exposure system 10 calculates which expansion limit circle of the plurality of expansion limit circles the expansion amount of the wiring board 20 obtained by the calculation is, and the result is the CAM system 40. Notify The CAM system 40 classifies and manages the amount of expansion / contraction for each wiring board 20 by using the expansion / contraction expansion / contraction limit circle that includes the expansion / contraction amount within the range as a classification region.

  When the manufacturing apparatus 50 processes the wiring board 20 in the subsequent manufacturing process, the CAM system 40 matches the CAM data D43 required by the manufacturing apparatus 50 with the expansion / contraction expansion / contraction limit circles classified by the division management. Then, the CAM data D43 created by correcting the expansion and contraction and appropriately corrected for expansion and contraction is supplied to the manufacturing apparatus 50 of the wiring board 20.

  The CAM data D43 to be managed in such a manner includes, for example, CAM image data supplied to the laser direct exposure system 10 in a later process, hole position data of the wiring board 20, CAM image data of a solder resist printing pattern, wiring board, and the like. There are 20 pieces of data for external processing, and there are other CAM data for processing in which dimensional correction is required for data values due to expansion and contraction of the wiring board. In addition, a printing pattern film, a manufacturing auxiliary tool used for the manufacturing, and the like are classified and managed by the expansion / contraction limit circle to prepare a plurality of manufacturing equipments for use in manufacturing the wiring board 20.

  The expansion / contraction limit circle, which is a unit for separately managing the expansion / contraction amount of the wiring board 20, is defined as the second expansion / contraction limit circle A22 to the seventh expansion / contraction limit circle A27 relative to the first expansion / contraction limit circle A21. In this way, for each of the second to seventh expansion limit circles, the second to seventh expansion limit circles for the expansion / contraction limit circle are defined. FIG. 12 shows an example of expansion / contraction limit circles other than the first to seventh expansion / contraction limit circles for separately managing expansion / contraction of the wiring board 20. For example, with respect to the second expansion / contraction limit circle A22, the expansion / contraction limit circles having the same relative relationship as the second to seventh expansion / contraction limit circles with respect to the first are the expansion / contraction limit circles A28, A21, A29, A30, A24, A25.

  In this way, by managing the unit of correction of expansion / contraction of the wiring board 20 by the expansion / contraction limit circle, the number of CAM image data created by performing the classification management according to the expansion / contraction of the wiring board 20 in the XY direction can be an appropriate number. It can be suppressed. Thereby, the management man-hour for managing the CAM data D43 can be optimized, and there is an effect that the division management can be appropriately performed without increasing the manufacturing cost in each process of the wiring board 20.

  Even if the amount of expansion / contraction of the wiring board 20 in the XY direction is large and the measurement result of the position of the alignment target 23 exceeds the range of the first expansion / contraction limit circle A21 that defines the drawable limit, laser direct exposure is performed. The system 10 determines that the measurement result of the position of the alignment target 23 is within the range of the second to seventh expansion / contraction limit circles, and the drawing control image data D42 in which the expansion / contraction is corrected according to the positions of the expansion / contraction limit circles. Can be created and drawn. As a result, the laser direct exposure system 10 can create and draw the drawing control image data D42 subjected to expansion / contraction correction from the CAM image data D41 transmitted from the CAM system 40, and the conventional problem, from the CAM system 40, can be drawn. There is an effect that it is possible to eliminate a problem that rendering by the laser direct exposure system 10 is impossible due to inconsistency with the transmitted CAM image data D41.

  The number of stretch limit circles arranged around the first stretch limit circle A21 is not limited to six from the second stretch limit circle A22 to the seventh stretch limit circle A27. That is, if the expansion / contraction limit circle arranged around the first expansion / contraction limit circle A21 covers the region outside the first expansion / contraction limit circle A21 without a gap and expands the range covered by the expansion / contraction limit circle, the first The number of expansion / contraction limit circles arranged around the expansion / contraction limit circle A21 may be less than six.

DESCRIPTION OF SYMBOLS 10 ... Laser direct exposure system 11 ... Position measuring means 12 ... Control part 13 ... Laser light source 20 ... Wiring board 21 ... Insulating board 22 ... Wiring pattern 23 ... Alignment target 24 ... micro via 40 ... CAM system 41 ... storage means 50 ... manufacturing device A21 ... first expansion / contraction limit circle A22 ... second expansion / contraction limit circle A23 ... 3rd expansion limit circle A24 ... 4th expansion limit circle A25 ... 5th expansion limit circle A26 ... 6th expansion limit circle A27 ... 7th expansion limit circle A40 ... Division area D23 ... Position data D41 ... CAM image data D42 ... Drawing control image data D43 ... CAM data L ... Laser beam

Claims (3)

  Laser direct exposure that receives CAM image data from the CAM system, calculates the amount of expansion / contraction of the wiring substrate by measuring the position of the alignment target of the wiring substrate, creates drawing control image data in which the expansion / contraction amount is corrected, and draws it A first stretch limit circle, which is a circular region having a radius as a limit value of a stretchable amount of a drawable wiring board centering on a design position of an alignment target in the CAM image data, A center position of the first stretch limit circle or the other stretch limit circle, including a plurality of other stretch limit circles surrounding the first stretch limit circle and including the position coordinates of the alignment target of the measurement result Next, drawing control image data in which the CAM image data is stretched and corrected so as to match the design position of the alignment target is created and drawn. Laser direct exposure system, characterized in that.   2. The laser direct exposure system according to claim 1, wherein the first expansion limit circle or the other expansion limit circle including the position coordinate of the alignment target of the measurement result is notified to the CAM system as a segmented region. A laser direct exposure system characterized in that the CAM system is configured to separately manage CAM data for manufacturing a wiring board.   The laser direct exposure system measures the position of the alignment target on the wiring board, and is a circular area having a radius that is the limit value of the expansion / contraction amount of the wiring board that can be drawn, centered on the design position of the alignment target in the CAM image data. A first stretching limit circle, a plurality of other stretching limit circles are arranged around the first stretching limit circle, and the first stretching limit circle including the position coordinates of the alignment target of the measurement result A CAM data division management method, wherein the CAM system performs division management of CAM data for manufacturing a wiring board, using the other expansion / contraction limit circle as a unit of division division management.

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