JP2013162295A5 - - Google Patents

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Publication number
JP2013162295A5
JP2013162295A5 JP2012022061A JP2012022061A JP2013162295A5 JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5 JP 2012022061 A JP2012022061 A JP 2012022061A JP 2012022061 A JP2012022061 A JP 2012022061A JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5
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JP
Japan
Prior art keywords
mounting surface
base substrate
electrode
hole
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012022061A
Other languages
English (en)
Japanese (ja)
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JP2013162295A (ja
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Publication date
Application filed filed Critical
Priority to JP2012022061A priority Critical patent/JP2013162295A/ja
Priority claimed from JP2012022061A external-priority patent/JP2013162295A/ja
Publication of JP2013162295A publication Critical patent/JP2013162295A/ja
Publication of JP2013162295A5 publication Critical patent/JP2013162295A5/ja
Withdrawn legal-status Critical Current

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JP2012022061A 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法 Withdrawn JP2013162295A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012022061A JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012022061A JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2013162295A JP2013162295A (ja) 2013-08-19
JP2013162295A5 true JP2013162295A5 (es) 2015-03-26

Family

ID=49174220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012022061A Withdrawn JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP2013162295A (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6591747B2 (ja) * 2014-12-26 2019-10-16 京セラ株式会社 圧電デバイスの製造方法
JP6852569B2 (ja) * 2017-05-30 2021-03-31 セイコーエプソン株式会社 Ｍｅｍｓ素子、電子機器および移動体
CN113228256B (zh) * 2018-12-27 2024-03-22 株式会社大真空 压电振动器件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009225218A (ja) * 2008-03-18 2009-10-01 Citizen Holdings Co Ltd 電極構造、電子デバイス、及び電極構造の製造方法
JP5108579B2 (ja) * 2008-03-21 2012-12-26 シチズンファインテックミヨタ株式会社 電子部品パッケージの製造方法および電子部品パッケージ
JP5447379B2 (ja) * 2008-08-05 2014-03-19 株式会社大真空 圧電振動デバイスの封止部材、及びその製造方法
JP2011124752A (ja) * 2009-12-10 2011-06-23 Seiko Epson Corp 圧電デバイスおよびその封止方法

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