JP2013149917A - Light-emitting device, manufacturing method of the same, lighting equipment using the same, and translucent substrate of light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device having high utilization efficiency realized by reducing multiple reflection in the light-emitting device.SOLUTION: A light-emitting device 1 of the present invention includes: a light-emitting element substrate 4 having a light-emitting element 3 mounted thereon; and a translucent substrate 10a to which wavelength conversion members 6a and translucent intervention members 5a formed around the wavelength conversion members 6a are provided, and which is arranged opposite to the light-emitting element substrate 4. The intervention member 5a has a trapezoidal cross section, and is provided such that of a pair of sides parallel with each other of a trapezoid in cross-sectional view, a short side is on the light-emitting element substrate 4 side, and a long side is on the translucent substrate 10a side.

Description

  The present invention relates to a light emitting device using a semiconductor light emitting element such as a light emitting diode (LED) as a light source, a manufacturing method thereof, and a lighting fixture using the same, and more specifically, a wavelength conversion member that converts a light source wavelength. The present invention relates to a light emitting device including the above, a manufacturing method thereof, a lighting fixture using the same, and a light-transmitting substrate of the light emitting device.

  2. Description of the Related Art A light emitting device has been developed that uses a semiconductor light emitting element such as a blue LED element using a gallium nitride compound semiconductor, converts the wavelength by a wavelength conversion member including a phosphor, and emits light of a color such as white. This light emitting device has features such as small size, light weight, and power saving, and is widely used for various applications.

  Although the light emitting lifetime of a semiconductor light emitting element such as an LED used in this light emitting device is long, deterioration of the resin material constituting the phosphor or the wavelength conversion member containing the phosphor occurs, and the lifetime of the phosphor or the wavelength conversion member causes the There is a problem that the lifetime is determined.

  Accordingly, a light emitting device using a semiconductor light emitting element that can extend the life of the light emitting device by adopting a configuration in which the phosphor or the wavelength conversion member can be replaced has been proposed. The light emitting device includes a light emitting element substrate in which a concave portion is formed in advance and a light emitting element such as an LED is mounted in the concave portion, and a counter substrate that is opposed to the light emitting element substrate and includes a wavelength conversion member. The formed protrusion is configured to be fitted and held in a state where the counter substrate can be exchanged (see, for example, Patent Document 1).

JP 2003-110146 A

  In the light emitting device of Patent Document 1, the light emitted from the light emitting element is subjected to multiple reflection in the light emitting device composed of the light emitting element substrate and the counter substrate. is there.

  The present invention has been made to solve such a problem, and obtains a light-emitting device having a high light utilization efficiency with reduced multiple reflections in the light-emitting device, a manufacturing method thereof, and a lighting fixture using the same. For the purpose.

  The light-emitting device of the present invention is provided with a light-emitting element substrate on which a light-emitting element is mounted, a wavelength conversion member, and a translucent intermediate member formed around the wavelength conversion member, and is disposed to face the light-emitting element substrate. The interposition member has a trapezoidal cross section, and a short side is a light emitting element substrate side and a long side is a light transmitting substrate among a pair of parallel sides of a trapezoid in a sectional view. It is provided to be on the side.

  The method for manufacturing a light emitting device according to the present invention includes a step of forming a translucent interposition member on a transparent substrate, a step of forming a wavelength conversion member inside the interposition member, and a light emitting element on the light emitting element substrate. A mounting step, and a step of superimposing the light-transmitting substrate and the light-emitting element substrate opposite to each other.

  In the light emitting device of the present invention, light incident on the interposition member is reflected within the surface on the side opposite to the light emitting element and directly emitted from the light emitting device, so that multiple reflections can be reduced, and light emission with high light use efficiency is achieved. A device can be obtained.

  According to the method for manufacturing a light emitting device of the present invention, the light transmitting element and the wavelength converting member are positioned so that the positions of the light transmitting element and the wavelength converting member are substantially the same between the transparent substrate having the transparent interposing member and the wavelength converting member and the light emitting element substrate on which the light emitting element is mounted. By overlapping so that the light incident on the interposition member is reflected on the side surface opposite to the light emitting element and directly emitted from the light emitting device, multiple reflections can be reduced, and illumination with high light use efficiency is achieved. The device can be manufactured.

It is a cross-sectional schematic diagram of the light-emitting device which concerns on Embodiment 1 of this invention. 1 is a top view of a light emitting device according to Embodiment 1 of the present invention. It is a cross-sectional schematic diagram of the translucent board | substrate which concerns on Embodiment 1 of this invention. It is the elements on larger scale of the part enclosed with the broken-line circle of FIG. It is process drawing which shows the manufacturing method of the light-emitting device which concerns on Embodiment 1 of this invention. It is a plane schematic diagram of the translucent board | substrate corresponding to the narrow pitch LED element which concerns on Embodiment 2 of this invention. It is a cross-sectional schematic diagram of the AA cross section of the translucent board | substrate shown in FIG. It is a cross-sectional schematic diagram of the BB cross section of the translucent board | substrate shown in FIG.

  In the description of the embodiments and the respective drawings, the portions denoted by the same reference numerals indicate the same or corresponding portions. In the embodiment, a light emitting element means a semiconductor chip cut out from a semiconductor substrate and packaged so that it can be used alone as an electronic component for illumination. One or a plurality of light-emitting elements are mounted on a circuit board such as a printed wiring board, and are provided with a wavelength conversion layer or the like as necessary to be in a state of operation and function. Furthermore, a luminaire means one that can be operated and used independently for the purpose of illuminating an article by combining one or more light emitting devices.

Embodiment 1 FIG.
<Configuration of light emitting device>
The configuration of the light emitting device 1 of the present invention will be described with reference to FIGS. FIG. 1 is a schematic cross-sectional view of a light-emitting device 1 according to Embodiment 1 of the present invention. 2 is a top view of the light-emitting device 1 according to Embodiment 1 of the present invention, and FIG. 3 is a schematic cross-sectional view of the light-transmitting substrate 10a according to Embodiment 1 of the present invention.

  As shown in FIG. 1, the light emitting element 3 is mounted on the printed wiring board 2, and the light emitting element board | substrate 4 is comprised. The light emitting element 3 is, for example, an InGaN-based blue LED. Opposite to the light emitting element substrate 4, a transparent substrate 10a in which a wall-shaped interposition member 5a and a wavelength converting member 6a are formed on a transparent substrate 7a is substantially the same as the center of the light emitting element 3 and the center of the wavelength converting member 6a. Superimpose to match. The light emitting element substrate 4 and the translucent substrate 10a are sandwiched from above and below, and are fixed by jigs at the substrate ends.

  The wall-shaped interposition member 5a formed on the transparent substrate 7a is transparent, has a ring shape as shown in the top view of FIG. 2, and a wavelength conversion member 6a is formed therein. . In the present embodiment, the inner diameter of the wall-shaped interposed member 5a is 5 mm.

  In the present embodiment, an InGaN-based blue LED is used as the light emitting element 3, and a part of the emitted light of the blue LED is converted to yellow by the phosphor, and the remainder of the emitted light is used as blue as it is. The light-emitting device 1 is formed using a so-called pseudo white method. Therefore, in the present embodiment, the wavelength conversion member 6a is a YAG (yttrium, aluminum, garnet) phosphor that converts blue to yellow and is dispersed in an addition-type silicone resin. The wavelength conversion member 6a has a thickness of 0.3 mm, and a detailed method for forming the wavelength conversion member will be described later.

  The translucent substrate 10a of the present embodiment will be described in more detail with reference to FIG. As described above, the translucent substrate 10a has a configuration in which the ring-shaped wall-shaped interposition member 5a and the wavelength conversion member 6a are formed on the transparent substrate 7a. The wall-shaped interposition member 5a is formed so as to have a substantially trapezoidal cross section in order to smoothly remove the mold at the time of formation.

  As the transparent substrate 7a, a polyethylene terephthalate (PET) film (manufactured by Toray Industries Inc., Lumirror) having a thickness of 0.188 mm was used. The wall-shaped interposition member 5a is formed by using an ultraviolet curable polyurethane resin. In the present embodiment, the wall-shaped interposition member 5a has a trapezoidal cross section and a height of about 1.5 mm. The length of the shorter side of the pair of sides of the trapezoid parallel to each other was about 1 mm.

  In the present embodiment, the wall-like interposition member 5a is formed using a polyurethane resin that is transparent and elastic. Therefore, when the light emitting element substrate 4 and the light transmitting substrate 10a are overlapped and fixed by a jig (not shown), the wall-shaped interposition member 5a has a slightly collapsed shape, and the light emitting element substrate 4 and the light transmitting substrate 10a are attached. It can be fixed stably.

  In the present embodiment, the transparent substrate 7a is a PET film having a thickness of 0.188 mm, but is not particularly limited. The thickness may be a thickness capable of self-supporting and within a range in which the weight is not so heavy, and may be 0.05 mm to 5 mm, preferably 0.1 mm to 1 mm. Moreover, the material of the transparent substrate 7a should just be transparent, and plastic materials, such as a polycarbonate resin, an acrylic resin, an ABS resin, and AS resin, can be used.

  In the present embodiment, the wall-shaped interposition member 5a is made of an ultraviolet curable polyurethane resin, but is not particularly limited, and any transparent material can be used. In addition to the polyurethane resin used, an acrylic resin, a silicone resin, an epoxy resin, or the like can be used.

  When the wall-shaped interposition member 5a is formed on the translucent substrate 10a, it is conceivable that the substrate warps. From this point of view, it is effective to use a silicone-based resin that maintains the rubber state at the use temperature for the wall-shaped interposition member 5a.

  When the light emitting element substrate 4 and the light transmitting substrate 10a are overlapped to form the light emitting device 1, the wall-shaped interposition member 5a has a slightly collapsed shape as described above, and also has a function of stabilizing the overlapping of both substrates. . From this viewpoint, it is preferable that the wall-shaped interposition member 5a is a rubber-like resin having flexibility. However, it is not always necessary to form the entire wall-shaped interposition member 5a with a rubber-like resin, and an acrylic resin that forms a rubber-like resin layer such as polyurethane resin on the surface of the transparent substrate 7a and does not exhibit rubber-like properties thereon. Even if the wall-shaped interposition member 5a is formed of resin or the like, the superposition of the light emitting element substrate 4 and the light transmitting substrate 10a can be stabilized.

  In the present embodiment, the height of the wall-shaped interposition member 5a is about 1.5 mm, but is not particularly limited. That is, the height of the wall-shaped interposition member 5a can be determined according to the gap required between the light-emitting element substrate 4 and the light-transmitting substrate 10a when the light-emitting device 1 is used. Therefore, a suitable value is used in the range of about 1 mm to 5 mm.

  In the present embodiment, the wavelength conversion member 6a uses an addition-type silicone resin in which a phosphor is dispersed. However, the type of the resin is not particularly limited, and is a liquid at the time of application, and a solid such as a film by curing. Any resin that can be used can be used. For example, in addition to the liquid addition type silicone resin, a condensation type silicone resin, an acrylic silicone resin, an epoxy resin, a methyl silicone resin, or the like can be used. In particular, silicone resins are suitable in that they have high heat resistance and low elastic modulus, so that they do not give excessive stress to the transparent substrate and do not cause warping.

  In the present embodiment, the thickness of the wavelength conversion member 6a is 0.3 mm. However, the thickness is not particularly limited, and the wavelength conversion efficiency and the wavelength conversion member 6a depend on the type and concentration of the dispersed phosphor. The thickness of the wavelength conversion member 6a can be adjusted and used in consideration of a decrease in efficiency due to absorption of light.

<Cross-sectional shape of wall-shaped interposition member>
The cross-sectional shape of the wall-shaped interposition member 5a will be described in detail with reference to FIG. 4 in which the portion indicated by the broken-line circle in FIG. 3 is enlarged. FIG. 4 is a cross-sectional view of the wall-shaped interposition member 5a. The wall-shaped interposition member 5a has a ring shape when observed from above, but as described above, the cross section has a trapezoidal shape.

  A wavelength converting member 6a is provided on the right side of the wall-shaped interposition member 5a shown in FIG. 4 (corresponding to the inside of the ring-shaped interposition member 5a), and is mounted on the light-emitting element substrate 4 when the light-emitting device 1 is formed. The light emitting element 3 is disposed at a position facing the wavelength conversion member 6a, that is, on the right side of the wall-shaped interposition member 5a shown in FIG. Therefore, the right surface of the wall-shaped interposition member 5a is referred to as the light emitting element side surface 11 and the left surface is referred to as the anti-light emitting element side surface 12, and the angle at which each surface is inclined inward from the perpendicular direction of the transparent substrate 7a is the light emitting element side surface. 11 and the taper angle 14a of the side surface 12 opposite to the light emitting element.

  In FIG. 4, the cross-sectional shape of the wall-shaped interposition member 5a is shown as a trapezoid formed in a straight line, but the actual wall-shaped interposition member 5a has rounded surfaces and corners. In this case, the taper angle 13a of the light emitting element side surface 11 and the taper angle 14a of the anti-light emitting element side surface 12 are defined as the average angles of the entire surfaces.

<Path of light emitted from light emitting element>
In the present embodiment, a path of light emitted from the light emitting element 3 (not shown) for obtaining high light use efficiency will be described. FIG. 4 shows an example of the light path 17 using a broken line made of a straight line.

  The light emitted from the light emitting element 3 is incident on the light emitting element side surface 11 of the wall-shaped interposition member 5a from the lower right direction in FIG. Thereafter, if the light can finally pass through the transparent substrate 7a and pass upward in FIG. 4, the light emitted from the light emitting element 3 can contribute to the brightness of the light emitting device 1, and the light Utilization efficiency can be increased.

  First, the light that is emitted from the light emitting element 3 (not shown) and enters the light emitting element side surface 11 of the wall-shaped interposition member 5a from the lower right direction is more easily upward in FIG. 4 as it enters from the lower direction. I can escape. That is, the light emitted from the light-emitting element 3 that is most difficult to escape upward in FIG. 4 and difficult to use effectively is parallel to the surface of the light-transmitting substrate 10a (lateral direction in FIG. 4) in a wall shape. It is considered that the light is incident on the light emitting element side surface 11 of the interposed member 5a. On the other hand, since the cross-sectional shape of the wall-shaped interposition member 5a is trapezoidal as shown in FIG. 4, even light parallel to the surface of the light-transmitting substrate 10a can be released upward in FIG. By applying such a shape of the wall-shaped interposition member 5a, it is possible to obtain the light emitting device 1 having excellent light utilization efficiency.

  Therefore, a case where light parallel to the surface of the transparent substrate 10a is incident on the light emitting element side surface 11 of the wall-shaped interposition member 5a will be considered. In this examination, the taper angle 13a of the light emitting element side surface 11 of the wall-shaped interposition member 5a was 5 °. The refractive index of the wall-shaped interposition member 5a and the transparent substrate 7a was assumed to be 1.4. By making the refractive index of the wall-like interposed member 5a and the refractive index of the transparent substrate 7a coincide or close as much as possible, reflection of light at the interface between the wall-like interposed member 5a and the transparent substrate 7a can be suppressed.

  The light parallel to the surface of the light transmitting substrate 10a incident on the light emitting element side surface 11 is refracted at a constant refraction angle 15 according to the taper angle 13a and the refractive index of the wall-shaped interposition member 5a. Next, the light passes through the wall-shaped interposition member 5a and reaches the side surface 12 on the side opposite to the light emitting element of the wall-shaped interposition member 5a from the inside.

  This light is incident at a predetermined incident angle 16 from the normal of the side surface 12 opposite to the light emitting element, and is emitted at the same angle as the incident angle 16 in the opposite direction with respect to the vertical line of the side surface 12 opposite to the light emitting element. The light is transmitted and emitted upward in FIG.

  At this time, if the internal reflection on the side surface 12 on the side opposite to the light emitting element satisfies the total reflection condition and the reflection at the interface when transmitting from the transparent substrate 7a to the air layer can be reduced, multiple reflections can be suppressed and efficient. Light can be emitted upward, and the light emitting device 1 with high light use efficiency can be obtained.

  When the taper angle 14a of the side surface 12 on the side opposite to the light emitting element 12 is changed and variously studied, when the taper angle 14a is gradually increased from 0 °, the transparent substrate 7a and the air layer All of the light incident on the wall-shaped interposition member 5a at the interface is reflected, and the light cannot escape upward. When the taper angle 14a is further increased, when the taper angle 14a is about 45 °, the internal reflection of the side surface 12 on the side opposite to the light emitting element becomes total reflection, and the light that passes upward is maximized.

  When the taper angle 14a was further increased, the internal reflection at the interface between the transparent substrate 7a and the air gradually increased. When the taper angle 14a was about 68 °, total reflection again occurred.

  If at least 50% of the light incident on the wall-shaped interposition member 5a and parallel to the translucent substrate 10a can be emitted from the transparent substrate 7a to the air layer, it is considered that the light utilization efficiency is high. From the above consideration, the taper angle 14a of the side surface 12 on the side opposite to the light emitting element of the wall-shaped interposition member 5a needs to be 35 ° or more and 55 ° or less, and more preferably 40 ° or more and 50 ° or less. By setting the angle close to 45 °, high light utilization efficiency can be ensured.

  When the same examination is performed on the taper angle 13a of the light emitting element side surface 11 of the wall-shaped interposition member 5a, in order to use 50% or more of the light incident on the wall-shaped interposition member 5a, 0 ° or more, It is necessary to make the angle 10 ° or less, and it has been found that the light utilization efficiency can be further increased and it is preferable that the angle is 0 ° or more and 5 ° or less and close to 0 °.

  Light emitted from the light emitting element 3 and incident on the interposition member 5a can be reflected from the inner surface of the side surface 12 on the side opposite to the light emitting element and directly emitted from the light emitting device 1, so that multiple reflections can be reduced and light utilization efficiency can be reduced. High light emitting device 1 can be obtained.

<Method for manufacturing light emitting device>
A method for manufacturing the light emitting device 1 of the present embodiment will be described with reference to FIG. FIG. 5 is a process diagram showing the method for manufacturing the light-emitting device 1 according to Embodiment 1 of the present invention.

  First, a continuous wall-shaped interposition member 5a is formed on the transparent substrate 7a (FIGS. 5A and 5B). The wall-shaped interposition member 5a was formed using a mold printing method. Next, the phosphor powder is dispersed in a liquid addition type silicone resin (TSE3033 manufactured by Momentive Performance Material Japan), and a predetermined amount is poured into the inside of the continuous wall-shaped interposition member 5a using a dispenser. And leveled to a thickness of 0.3 mm. At this time, the wall-shaped interposition member 5a functions as a wall (dam) for accumulating the liquid addition type silicone resin in which the phosphor powder is dispersed inside. This was cured in an oven to form the wavelength conversion member 6a (FIG. 5C).

  Next, the light emitting element 3 was mounted on the printed wiring board 2. As described above, the light emitting element 3 is a blue LED. The light-emitting element substrate 4 on which the light-emitting element 3 is mounted and the light-transmitting substrate 10a on which the wall-shaped interposition member 5a and the wavelength conversion member 6a are formed are overlapped so that the centers of the light-emitting element 3 and the wavelength conversion member 6a coincide. Then, the light emitting device 1 was obtained by fixing with a jig (not shown) at the edge of the substrate (FIG. 5E).

  As described above, the manufactured light-emitting device 1 can be manufactured at a low cost because the process is simple, and a bright light-emitting device 1 can be obtained because the use efficiency of light emitted from the light-emitting element 3 is high. It was.

  In the present embodiment, the wall-shaped interposition member 5a is formed by using a mold printing method, but is not particularly limited, and a molding method such as an insert molding method or a bonding method by adhesion can be used. Further, the transparent substrate 7a and the wall-shaped interposition member 5a can be integrally formed using an injection molding method.

  A plurality of the light emitting devices 1 described in this embodiment can be arranged in an array and fixed to a housing, and used as a lighting fixture. This luminaire has an excellent characteristic of low power consumption because it is easy to manufacture the light-emitting device 1 to be used and is inexpensive, and the light utilization efficiency is high.

  Further, since the light-transmitting substrate 10a constituting the light-emitting device 1 described in the present embodiment is fixed to the light-emitting element substrate 4 and the substrate end using a jig, the light-transmitting substrate 10a can be removed by simply removing the jig. In the light emitting device 1 according to the embodiment, the translucent substrate 10a can be easily replaced.

Embodiment 2. FIG.
In the first embodiment, the plurality of wall-shaped interposition members 5a are provided apart from the plurality of light-emitting elements. However, in the second embodiment, the plurality of light-emitting elements 3 are arranged at a narrow pitch and the plurality of walls are arranged. The present embodiment is different from the first embodiment in that the intermediate members are formed so that the respective parts overlap each other, and otherwise the same as in the first embodiment. Since the plurality of wall-shaped interposition members are formed so as to partially overlap each other, the luminance of the emitted light from the light emitting device 1 can be increased.

  6-8, the structural example of the light-emitting device 1 mounted in the narrow pitch is shown using the some light emitting element 3 side by side. FIG. 6 is a schematic plan view of a light transmitting substrate 10b corresponding to the light emitting elements 3 arranged at a narrow pitch according to the second embodiment of the present invention. FIG. 7 is a schematic cross-sectional view taken along the line AA of the light-transmitting substrate 10b shown in FIG. FIG. 8 is a schematic cross-sectional view of the translucent substrate 10b shown in FIG.

  In the present embodiment, a blue LED (not shown) is used as the light emitting element 3 and three blue LEDs are continuously mounted with a narrow gap. However, the number of blue LEDs is particularly limited. It is not a thing, but if it is plural, it can be used.

  The wall-shaped interposition member 5b formed on the transparent substrate 7b is formed in a ring shape around the wavelength conversion member 6b formed at a position facing the blue LED when the light-emitting device 1 is assembled. Are mounted at a narrow pitch, the ring-shaped wall-shaped interposition member 5b was formed in a shape in which a part thereof overlapped.

  In the portion where the ring-shaped wall-shaped interposition member 5b overlaps, the cross-sectional shape becomes the left and right objects as shown in FIG. 7, and thus the light incident on the wall-shaped interposition member 5b does not necessarily reflect efficiently. I can't. However, at the outer peripheral portion of the overlapped wall-shaped interposition member 5b, as described with reference to FIG. 4 of Embodiment 1, the taper angle 13b of the light emitting element side surface 11 is small and the taper of the anti-light emitting element side surface 12 is small. The angle 14b can be increased, and the light emitting device 1 having high light use efficiency can be obtained by setting the taper angle similar to that of the first embodiment.

  In both Embodiment 1 and Embodiment 2, the shape of the wall-shaped interposition member is a ring shape, but the same effect can be obtained if it is circular, oval, or elliptical. Needless to say. Furthermore, substantially the same effect can be obtained even with a polygonal frame shape such as a rectangular frame shape or a triangular frame shape. In that case, the angle relationship between the light emitting element side side surface 11 and the anti-light emitting element side side surface 12 of the wall-shaped interposition member and the light varies particularly in the corner portion of the frame, and the light utilization efficiency is somewhat reduced. Compared to the case where the present invention is not applied, sufficiently high light utilization efficiency can be obtained.

DESCRIPTION OF SYMBOLS 1 Light emitting device, 2 Printed wiring board, 3 Light emitting element, 4 Light emitting element board | substrate, 5a Interposition member, 5b Interposition member, 6a Wavelength conversion member, 6b Wavelength conversion member, 7a Transparent substrate, 7b Transparent substrate, 10a Translucent substrate, 10b Translucent substrate, 11 Light emitting element side surface, 12 Counter light emitting element side surface, 13a Taper angle of light emitting element side surface, 13b Taper angle of light emitting element side surface, 14a Taper angle of anti light emitting element side surface, 14b Anti light emitting element side Side taper angle, 15 refraction angle of incident light, 16 internal reflection angle on side surface opposite to light emitting element, 17 light path.

Claims (11)

A light emitting element substrate on which the light emitting element is mounted;
A translucent substrate provided with a wavelength converting member and a translucent intervening member formed around the wavelength converting member, and a translucent substrate disposed facing the light emitting element substrate;
Have
The interposition member has a trapezoidal cross section, and a short side is provided on the light emitting element substrate side and a long side is provided on the light transmitting substrate side in a pair of sides of the trapezoid parallel to each other in a cross sectional view. A light-emitting device. 2. The light emitting device according to claim 1, wherein the taper angle of the side surface of the interposition member on the light emitting element side is 0 ° or more and smaller than the taper angle of the side surface of the anti-light emitting element side. The taper angle on the light emitting element side surface of the interposition member and the repulsion are so that light that travels in the direction parallel to the light emitting element substrate and is incident on the interposition member is totally reflected on the inner surface of the interposition member on the side opposite to the light emitting element. The light emitting device according to claim 1, wherein a taper angle of the side surface of the optical element is set. The taper angle on the light emitting element side surface of the interposed member is 0 ° or more and 10 ° or less, and the taper angle on the anti-light emitting element side surface of the interposed member is 35 ° or more and 55 ° or less. Item 4. The light emitting device according to any one of Items 1 to 3. Forming a translucent interposition member on the translucent substrate;
Forming a wavelength conversion member inside the interposition member;
Mounting the light emitting element on the light emitting element substrate;
A step of overlapping the light-transmitting substrate and the light-emitting element substrate facing each other;
A method for manufacturing a light emitting device. The interposition member has a trapezoidal cross section, and is provided such that a short side is on the light emitting element substrate side and a long side is on the translucent substrate side among a pair of sides of the trapezoid parallel to each other in a cross sectional view. The method for manufacturing a light-emitting device according to claim 5. The process of forming a light-transmitting intervening member on a transparent substrate is any one of a mold printing method, an insert molding method, and a bonding method by adhesion. The manufacturing method of the light-emitting device of description. The method for manufacturing a light-emitting device according to claim 5 or 6, wherein the step of forming the translucent intervening member on the transparent substrate is a step of integrally molding using an injection molding method. 9. The step of forming a wavelength conversion member inside the interposition member is a step of pouring a liquid resin in which phosphor powder is dispersed inside the interposition member and curing after leveling. 2. A method for manufacturing a light emitting device according to item 1. A lighting fixture comprising one or a plurality of the light emitting devices according to claim 1.   The translucent board | substrate of the light-emitting device shown in any one of Claims 1 thru | or 4.

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