JP2013147767A - Electronic component mounting weave, electronic component mounting body and fabric using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting weave, an electronic component mounting body and a fabric using the same, having durability against tension and folding as much as a conventional fabric has.SOLUTION: The electronic component mounting weave comprises: a plurality of connection areas A formed by weaving warp in which a plurality of electroconductive yarns 2 and insulating yarns 3 arranged in parallel are arranged, and weft in which a plurality of insulating yarns 4 are arranged; and a mounting area B formed by weaving warp in which insulating yarns 5 are arranged between the connection areas A, and weft in which the insulating yarns 4 are arranged and formed so as to create a gap in which an electronic component can be arranged.

Description

  The present invention relates to a woven fabric on which electronic components can be mounted, a mounted body in which electronic components are mounted on the woven fabric, and a fabric in which the mounted bodies are arranged.

  In recent years, electronic components have been mounted on various products due to downsizing of electronic components and progress of mounting technology. Such electronic components are generally mounted inside a product in a state of being mounted on a printed circuit board on which a wiring pattern is formed. By using a flexible synthetic resin sheet as a printed circuit board, it has become possible to place a high-performance printed circuit board inside the device even in the case of small electronic devices such as mobile phones, and equipped with electronic components. The range of products made is expanding.

  Attempts have also been made to mount electronic parts on clothes. For example, in Japanese Patent Application Laid-Open No. 2003-86400, electronic parts are formed on a smooth surface formed by filling and solidifying a thread and a gap between threads on a part of a cloth surface of clothing. Devices, wiring patterns, and electronic circuits are formed by printing, or conductive fibers are included in some of the fibers that make up clothing, and electronic devices consisting of minute electronic chips are directly connected to the conductive fibers and the fiber material. The point which forms the integrated wiring pattern and electronic circuit is described. Patent Document 2 describes a woven fabric formed by weaving a functional yarn in which a conductor and an electronic device are mounted on an insulating strip-like substrate, and warps and wefts composed of a plurality of conductive yarns and insulating yarns. Has been. Patent Document 3 describes a hybrid integrated circuit having a woven structure including a warp-like body on which electrical elements are mounted and a weft-like body knitted so as to be connected to the electrical elements of the warp-like body.

Japanese Patent No. 3723565 Japanese Patent Laid-Open No. 2005-524783 Japanese Patent Laid-Open No. 2003-161844

  As described in Patent Document 1, when a part of clothing is filled and solidified with resin, the properties such as flexibility and tensile strength of the portion solidified with resin are different from those of other portions. There is a difficulty in handling at the time of feeling and processing, and there is a possibility of being damaged by pulling or bending even when worn. In addition, in the case of weaving or knitting a fabric using conductive fibers directly connected to an electronic device such as an electronic chip, the electronic device may peel off, and the electronic device is in a state where the conductive fibers are woven or knitted into a fabric. Is directly connected to the conductive fiber, it is difficult to connect to the conductive fiber woven with a minute electronic chip in terms of mass production.

  In Patent Document 2, a functional yarn in which a conductor and an electronic device are mounted on an insulative strip-like substrate is used. However, a connection portion with the conductive yarn is removed by pulling or bending the fabric, or the functional yarn itself is There is a risk of breakage, and the handling must be restricted. Further, in Patent Document 3, a warp-like body on which an electrical element is mounted is used, but when weaving a fabric using the warp-like body, bending and tension are applied to the warp-like body, There is a risk of damage. Even in a state where warp-like bodies are woven into the woven fabric, there is a drawback in that it does not have sufficient strength against tension and bending applied to the woven fabric.

  Therefore, an object of the present invention is to provide an electronic component mounting fabric, an electronic component mounting body, and a fabric using the same, which have durability similar to that of a conventional fabric against tension and bending. is there.

  The electronic component mounting fabric according to the present invention includes a plurality of connection regions formed by weaving warps in which conductive yarns are arranged at least in part and wefts in which insulating yarns are arranged, and insulation between the connection regions. It includes a mounting region formed by weaving the warp and the weft in which yarns are arranged, and formed so that a gap in which an electronic component is placed can be formed. Furthermore, the conductive yarn is a covering yarn obtained by winding a metal fiber around a core yarn. Further, in the covering yarn, the number of twists of the metal fiber is 1000 T / m to 3500 T / m. Further, the insulating yarn is arranged on both sides of the conductive yarn in the warp of the connection region. Further, the connection region is woven with auxiliary conductive yarn so as to intersect the conductive yarn at least in a part of the range. Further, in the mounting region, a gap is formed in a range where the warp and the weft are not arranged. Further, the mounting area is woven so as to expand between the warps in the weft direction to form a gap.

  An electronic component mounting body according to the present invention is an electronic component mounting body including a tape-like base body made of the above-mentioned woven fabric and an electronic component mounted on the base body, and the base body is provided on both side portions. A connection region is formed and the mounting region is formed at a central portion, and the electronic component electrically connects a connection terminal portion extending on both sides to the conductive yarn of the connection region and a main body portion Is disposed in the gap formed in the mounting region.

  In the fabric according to the present invention, the electronic component mounting bodies are arranged in the warp direction or the weft direction. Further, a bag woven portion for inserting and holding the electronic component mounting body, and a conductive connecting yarn woven so as to intersect the bag woven portion and electrically connected to the conductive yarn of the electronic component mounting body are provided.

  The woven fabric for mounting electronic parts according to the present invention has the above-described configuration, so that it can have durability similar to that of a conventional fabric against tension and bending.

It is a partially expanded plan view regarding the fabric and electronic component mounting body according to the present invention. It is a partially expanded view regarding a conductive yarn. It is a top view regarding the modification of the woven structure of a woven fabric. It is a top view regarding the modification of the woven structure of a woven fabric. It is a top view regarding the woven structure in the case of connecting to the conductive yarn in the connection region. It is a top view regarding the modification of the woven structure of a woven fabric. It is explanatory drawing regarding the modified example at the time of weaving an auxiliary conductive thread in the connection area. It is a perspective view which shows an example of the electronic component to mount. It is explanatory drawing regarding the process of mounting an electronic component. It is a schematic block diagram regarding the loom which weaves the tape-shaped electronic component mounting body shown in FIG. 9 in a fabric. It is explanatory drawing regarding the cutting | disconnection of an electronic component mounting body. It is a partially expanded perspective view regarding the fabric which woven the electronic component mounting body. It is a schematic diagram regarding the fabric which woven the electronic component mounting body. It is the figure seen from the cross section shown by KK of FIG. It is a table | surface regarding the measurement result of the electrical resistance of a fabric. It is a table | surface regarding the measurement result of the light quantity of an electronic component mounting body.

  Hereinafter, embodiments according to the present invention will be described in detail. The embodiments described below are preferable specific examples for carrying out the present invention, and thus various technical limitations are made. However, the present invention is particularly limited in the following description. Unless otherwise specified, the present invention is not limited to these forms.

  FIG. 1 is a partially enlarged plan view of a fabric and an electronic component mounting body according to the present invention. As shown in FIG. 1A, the fabric 1 includes a connection region A and a mounting region B, and the mounting region B is formed between the connection regions A. The connection region A is formed by weaving using a plurality of conductive yarns 2 and a plurality of insulating yarns 3 arranged in parallel as warps and using a plurality of insulating yarns 4 as wefts. Further, the mounting region B is formed by weaving using a plurality of insulating yarns 5 as warps and using a plurality of insulating yarns 4 as wefts. The insulating yarn 5 that is the warp in the mounting region B is arranged in a part of the center and both sides, and a range in which no warp is arranged is provided between the insulating yarns 5 that are the warp in the center and both sides.

  In the connection region A, it is sufficient that one or more conductive yarns are arranged in at least a part of the warp, and all the warp yarns can be used as conductive yarns. The number of conductive yarns may be set according to the amount of current flowing through the connection region A. When the number of conductive yarns increases, it can be easily dealt with by widening the width of the connection region A in the weft direction. . Further, as shown in FIG. 1, by arranging the insulating yarns on both sides of the conductive yarn, it is possible to prevent the conductive yarn from shifting in the weft direction and improve the insulation of the connection region.

  In the mounting area B, the main body portion of the electronic component to be mounted using the insulating yarn for the warp and the weft is surrounded by the insulating yarn, so that the insulation can be enhanced. In addition, the warp and / or the weft can be easily shifted by forming a woven structure in which the range in which the warp and / or the weft is not arranged is provided, so that a gap for accommodating the main body portion of the electronic component can be formed.

  In order to weave the woven fabric 1 in a tape shape and insert it into a woven or knitted fabric, the conductive yarn is physically and electrically affected by the expansion and contraction of the woven fabric that occurs during the weaving or knitting operation. There is no need to stretch. In normal weaving and knitting operations, even if the elongation of the fabric is 5% or more, if it does not break, it can be handled in the same way as a normal yarn, and until the elongation of the fabric reaches 10%. The fabric can be used for fabrics such as woven fabrics and knitted fabrics as long as it has stretch resistance that can suppress the fluctuation range of the electrical resistance in the connection region to 10% or less.

  The bending resistance of the woven fabric can be evaluated by repeatedly performing a load operation in which the woven fabric is folded and bent so that a fold in the weft direction is formed. If it has bending resistance that allows the fluctuation range of the electrical resistance in the connection region to be suppressed to 5% or less after repeating this load operation 100 times, winding, twisting, bending, etc. are performed in the same manner as a normal fabric. Can be evaluated as having sufficient bending resistance.

  The insulating yarn that forms the fabric is preferably an electrically insulating one having a relative dielectric constant of 4 or less. Specifically, polyester fibers such as PET (polyethylene terephthalate), PTT (polytrimethylene terephthalate) or PBT (polybutylene terephthalate), nylon (polyamide fiber), aramid (aromatic polyamide fiber), polypropylene or polyethylene, etc. Examples thereof include polyolefin fibers, synthetic fibers such as acrylic, inorganic fibers such as glass fibers, chemical fibers such as rayon and acetate, and natural fibers such as cotton, hemp, wool, and silk. Moreover, you may use the composite fiber which mixed multiple types of these fibers.

  The conductive yarn includes copper fiber, tin-plated copper wire, tin bronze fiber, yarn made of metal fiber such as stainless steel fiber, synthetic fiber and other well-known fibers such as metal plating, etc. Examples of such a thread include a metal fiber covering process. In addition, by allowing a plurality of such yarns to be twisted or organized in a braid shape and used as a conductive yarn, the allowable current amount can be increased. Since the covering yarn has flexibility and stretchability, and also has durability when woven, it is suitable for a woven fabric for mounting electronic components. The electrically conductive yarn desirably has an electrically low resistance. Specifically, an electrically resistant yarn having an electrical resistance of 0.1 Ω / m to 20 Ω / m may be used.

  The covering yarn is obtained by covering metal fibers such as copper fiber, tin-plated copper wire, tin bronze fiber, and stainless fiber around the core yarn. As the core yarn, polyester fiber such as PET (polyethylene terephthalate), PTT (polytrimethylene terephthalate) or PBT (polybutylene terephthalate), nylon (polyamide fiber), aramid (aromatic polyamide fiber), polypropylene or polyethylene, etc. It is recommended to use yarns made of fibers such as polyolefin fibers, synthetic fibers such as acrylic, inorganic fibers such as glass fibers, chemical fibers such as rayon and acetate, natural fibers such as cotton, hemp, wool or silk. You may use the thread | yarn which consists of a composite fiber with which multiple types were mixed. When the electronic component is mounted with solder or the like, a fiber material having heat resistance of 150 ° C. or higher and less heat deformation is preferable.

  As the covering process, there are a single covering process and a double covering process, and FIG. 2 shows a conductive thread that has been subjected to a double covering process in which metal fibers 2a are wound twice around the core thread 2b. Yes. By using such a double covering yarn, the conductive state is maintained even if a part of the metal fiber 2a is disconnected.

  Regarding the mechanical properties of the conductive yarn, the same properties as the core yarn are obtained as the number of twists of the metal fiber to be covered increases. In order to be able to follow the deformation of the fabric 1 without breaking or shifting the conductive yarn 2 even if the fabric 1 is curved or stretched, the number of twists may be set to 500 T / m or more. When the number of twists is less than 500 T / m, it is difficult for the conductive yarn to sufficiently follow the deformation of the fabric, which is not practical. The twist number is more preferably 1000 T / m or more, and when the twist number is 2000 T / m or more, the bending durability of the conductive yarn is remarkably improved.

  Regarding the electrical characteristics of the conductive yarn, when the electronic component is mounted on the connection region of the fabric, the contact resistance of the connection portion decreases as the surface area of the metal fiber exposed on the surface of the conductive yarn increases. As the amount increases, the surface area increases and the contact resistance can be set low. On the other hand, the smaller the number of twists, the lower the electrical resistance of the unit length of the conductive yarn. If the number of twists exceeds 3500 T / m, the electrical resistance of the unit length of the conductive yarn is increased, which is not preferable as the wiring of the electronic component.

  Considering the mechanical properties and electrical properties of the conductive yarn as described above, when using a covering yarn wound with a metal fiber as the conductive yarn, the number of twists of the metal fiber should be 1000 T / m to 3500 T / m. Is preferred.

  As shown in FIG. 1B, when an electronic component is mounted on the fabric 1, a gap for mounting is formed by shifting the insulating yarn 5 that is the central warp of the mounting region B to both sides. The body part 6 of the electronic component is accommodated in the gap. Further, the connection terminal portions 7 extending from both sides of the main body portion 6 are arranged in the connection region A and connected and fixed to the conductive yarn 2 by the connection material 8. As the connection material 8, a conductive material such as solder, a conductive adhesive such as a conductive paste, or a metal part such as caulking can be used.

  The electronic component to be mounted is not particularly limited as long as it is provided with the connection terminal portion 7 extending from the main body portion 6 on both sides. For example, a small element such as a light emitting element such as an LED element, a detection element such as a pressure detection sensor or a biological information detection sensor is mounted on a flexible substrate to form a main body portion, and connection terminals are connected to both sides of the substrate by wiring patterns An electronic component in which a portion is formed can be mounted.

  By mounting the main body portion 6 of the electronic component in the gap between the tissues formed in the fabric 1 in this way, the main body portion 6 is held in a stable state by warp and weft. In addition, since the yarn density of the connection region A of the fabric 1 is larger than that of the mounting region B, the main body portion 6 is embedded between the connection regions A and the main body portion 6 is protected by the fabric 1. When the electronic component is mounted and handled in the same manner as a normal woven fabric, damage to the electronic component can be reduced. In particular, when a plurality of electronic components are mounted with a predetermined interval in the warp direction, if they are mounted with a space greater than the width of the main body portion 6 in the warp direction, the same flexibility as that of a normal fabric is provided. be able to. In addition, in the mounting area B, since the area where the warp is not arranged is provided, it has a structure with excellent air permeability, and the heat generated when the electronic component is energized can be quickly dissipated. .

  In the connection region A of the woven fabric 1, since the plurality of conductive yarns 2 are arranged in parallel, electrical connection with the connection terminal portion 7 of the electronic component can be ensured. Even if peels off, it is possible to maintain a conductive state. Further, in the connection region A, the warp and the weft are densely arranged so that the conductive yarn 2 is not easily displaced, and a stable conduction state with the connection terminal portion 7 can be ensured. In this case, the insulating yarn 4 used for the weft is made thicker than the conductive yarn 2 used for the warp so that the thin conductive yarn 2 is tightly wound around the thick insulating yarn 4 at the intersection of the warp and the weft. It will be in the curved state and the conductive yarn 2 will be more difficult to shift. Further, since the conductive yarn 2 is in a curved state, durability against deformation such as expansion and contraction and bending of the fabric 1 can be enhanced.

  When the fabric 1 is bent or twisted, it is considered that the connection areas A on both sides come into contact with each other, but the structure is such that the insulating yarn 4 protrudes from the conductive yarn 2 at the intersection of the warp and weft in the connection area A. Thus, contact between the conductive yarns 2 can be prevented. Further, if the entire woven fabric 1 is coated with an insulating coating, the contact between the conductive yarns 2 in the connection region A can be reliably prevented. Examples of such insulating coating materials include polyurethane resins, polyester resins, polyester-based elastomers, polyimide resins, silicon-based resins, fluorine-based resins, etc. In addition to these resin materials, they have electrical insulation and are insulated. Any material that does not impair the flexibility of the fabric when the coating is formed can be used.

  3 and 4 are plan views relating to modifications of the woven structure of the fabric 1. In the drawing, the conductive yarn is drawn with a thick line, and the insulating yarn is drawn with a thin line. The vertical direction is the warp direction, and the horizontal direction is the weft direction. In FIG. 3A, a plurality of conductive yarns are arranged in parallel in the connection area A on both sides, and the warp is not arranged on both sides except for the both sides in the mounting area B, and the thickness of the mounting area is reduced. It has become. In FIG. 3B, in the mounting region B, the warp is not arranged in the central portion, and further, the weft is not arranged at the mounting position of the electronic component, so that a gap S where no warp and weft are present is formed. It is like that. Therefore, the mounting area B can be reduced and even a thick electronic component can be easily mounted.

  In FIG. 4A, two sets of conductive yarns are arranged at an interval of 3 sets in the connection region A on one side of the fabric shown in FIG. Therefore, if each set of conductive yarns is used as a different signal line, a plurality of mounted electronic components can be operated individually. In FIG. 4B, three sets of conductive yarns are arranged in the connection region A on one side of the fabric shown in FIG. 3B, and a plurality of the same implementations as in the example shown in FIG. Electronic components can be operated individually.

  FIG. 5 is a plan view relating to the woven structure when connecting to the conductive yarn in the connection region. In FIG. 5A, the conductive yarn is woven so as to be exposed on the front side or the back side in a partial range T of the connection region A. That is, in the connection region A on the left side, the conductive yarn that is the warp in the range T is exposed to the front side without being entangled with the weft, and the insulating yarn that is the weft is hidden on the back side. In the connection region A on the right side, In the range T, the conductive yarn which is the warp is hidden behind the back side, and the insulating yarn which is the weft is exposed on the front side. Therefore, when the power supply line contacts from the front side in the range T, the power supply line and the conductive yarn are in a conductive state in the left connection region A, and the power supply line and the conductive yarn are in a conductive state in the right connection region A. Must not. Further, when the power line comes into contact with the range T from the back side, the power line and the conductive yarn are in a conductive state in the right connection region A, and the power line and the conductive yarn are in a conductive state in the left connection region A. Must not. In this way, the power supply line can be selectively connected to the two connection regions A.

  In FIG. 5 (b), a plurality of signal lines obtained by dividing a plurality of conductive yarns by insulating yarns are arranged in the right connection region A, and a range T is set corresponding to the number of signal lines in the longitudinal direction. ing. In each range T, the conductive yarn is exposed on the back side of only one signal line. Therefore, by bringing the supply line corresponding to the signal line into contact with each range T, one signal line can be conducted to one supply line in each range T. Therefore, by selectively supplying a signal to the supply line, it is possible to selectively operate electronic components connected to each signal line. In this manner, the wiring pattern can be formed so as to selectively connect the power supply line or the supply line to the conductive yarn in the connection region by the woven structure.

  In the example described above, the connection areas are arranged on both sides of one mounting area. However, a plurality of mounting areas may be arranged to form a woven fabric in which connection areas are arranged on both sides of each mounting area. It is possible to mount electronic components in a two-dimensional arrangement.

  FIG. 6 is a plan view relating to a modified example of the woven structure of the woven fabric 1. In this example, two wefts are woven twice by a shuttle loom, and at the place where the electronic component is mounted, the two wefts are folded back halfway so that the warp yarns are moved to both sides. A space S is formed at the position where the warp is moved to both sides. If the gap S is formed in this way, the yarn density on both sides of the gap S is increased, the main body portion accommodated in the gap S can be protected, and the warp yarn is gathered by the weft, so that the warp yarn is stable without being broken. It will be in the state.

  FIG. 7 is an explanatory diagram relating to a modified example in which auxiliary conductive yarn is woven into the connection region. FIG. 7A shows a woven fabric shown in FIG. 3A in which one conductive yarn 2 in the connection region is woven and auxiliary conductive yarn 9 is woven so as to intersect the conductive yarn 2. And in the connection site | part U with the connection terminal part of an electronic component, the contact area of the conductive yarn of the connection site | part U is enlarged by weaving the auxiliary | assistant conductive thread 9 inward in the weft direction. The auxiliary conductive yarn 9 is woven separately from the warp yarn by jacquard weaving or the like, so that the position where the auxiliary conductive yarn 9 is woven can be appropriately changed according to the connection part of the electronic component. Further, since the auxiliary conductive yarn 9 can be woven separately from the conductive yarn 2 which is a warp, even when there are a plurality of conductive yarns 2, it is possible to interweave all the conductive yarns 2 and weave the auxiliary conductive yarn 9 so that the connection is possible. The conductive yarn in the region can be formed in a planar shape. As the auxiliary conductive yarn 9, a yarn similar to the conductive yarn 2 can be used, and the above-described covering yarn is preferable.

  FIG. 7 (b) shows that in the woven fabric shown in FIG. 3 (b), the auxiliary conductive yarn 9 is woven in the same manner as in FIG. 7 (a), and the auxiliary conductive yarn 9 is moved inward in the weft direction at a position where a gap is formed. The contact area of the conductive yarn at the connection portion U is increased by weaving in the direction. Further, FIG. 7 (c) enlarges the contact area of the conductive yarn at the connection portion U by weaving the auxiliary conductive yarn 9 in the weft direction at the place where the warp is approached in the fabric shown in FIG. In this example, the auxiliary conductive thread 9 is woven so as to intersect the conductive thread 2 in the connection region A, and the auxiliary conductive thread 9 is woven in the weft direction at the connection part of the electronic component, thereby making contact with the connection terminal portion of the electronic component. By increasing the area, it is possible to improve the mountability and lower the contact resistance. The auxiliary conductive yarn may be woven so as to cross the conductive yarn in at least a part of the connection region, and may be woven only in the connection portion, for example.

  FIG. 8 is a perspective view showing an example of an electronic component to be mounted. In the electronic component 10, the LED element 12 and the current adjusting resistor 13 are mounted on the upper surface of the flexible substrate 11, and connection pads 14 that are electrically connected to these components by a wiring pattern are formed on both sides. FIG. 9 is an explanatory diagram regarding a process of mounting the electronic component 10. The woven fabric 1 is formed in a narrow tape shape and is transported in the longitudinal direction by a transport device (not shown). And the electronic component 10 is arrange | positioned by the mounting apparatus 20 in the connection location formed in the connection area | region A of the fabric 1 at predetermined intervals, and the connection pad 14 is connected and fixed to the connection area | region A with a connection material. Thus, an electronic component mounting body on which the electronic component is mounted can be manufactured.

  A fabric carrying the electronic component mounting body can be configured by weaving the electronic component mounting body using a part of the warp and / or the weft. When the fabric is a knitted fabric, the fabric can be configured by knitting as a warp insertion yarn and / or a weft insertion yarn.

  FIG. 10 is a schematic configuration diagram relating to a loom for weaving the tape-shaped electronic component mounting body shown in FIG. 9 into a fabric. Such a loom is a known one as described in Japanese Patent Application Laid-Open No. 2011-042897. In the loom, a plurality of warps C are arranged from the beam 100, the warp C is opened by the opening mechanism 101, the weft D is fed from the bobbin 102, and the weft C is inserted between the opened warps C by the rapier head 103. D is woven by warp with warp 104 between warps C. After weaving a predetermined number of wefts D, an electronic component mounting body E in which a plurality of electronic components are mounted at predetermined intervals in the longitudinal direction is fed from the reel 105 and inserted between the opened warps C by the rapier head 106. The electronic component mounting body E is driven and driven by the gripper 107. At this time, the electronic component of the electronic component mounting body E to be fed is detected by the detection sensor 108, and the yarn feeding control is performed so that the electronic component of the electronic component mounting body E is set at a predetermined position in the yarn feeding path. In this example, in order to arrange a predetermined number of electronic components F mounted on the electronic component mounting body E in the weft direction of the fabric, as shown in FIG. Cut and weave into the fabric with a loom. FIG. 12 is a partially enlarged perspective view of the fabric G in which the electronic component mounting body E is woven. The electronic component mounting body E is woven in a state of being accommodated inside a carrier portion H formed by bag weaving.

  By thus weaving the electronic component mounting body E into the fabric, the electronic component is hardly damaged when weaving. Moreover, since it is protected by bag weaving, it is possible to reduce the damage received even in a state of being woven into the fabric. Further, when a light-emitting component such as an LED element is mounted on the electronic component mounting body E woven inside the bag weave, the light can be transmitted almost unobstructed by finishing the fabric thin. .

  FIG. 13 is a schematic diagram relating to a fabric G in which a plurality of electronic component mounting bodies E are woven. In this example, a plurality of electronic component mounting bodies E are woven into a bag-supported portion H in the weft direction, and supply lines I and J are provided at one end of the electronic component mounting body E. FIG. 14 is a view as seen from the cross-section indicated by KK in FIG. 13 and shows the intersection between the electronic component mounting body E and the supply lines I and J.

  The supply lines I and J are formed by weaving conductive connecting yarns similar to the conductive yarns used in the fabric 1 in the warp direction. In the carrying portion H, the conductive yarns of the supply line J are on the upper side of the bag weave. The conductive yarn of the supply line I is woven under the bag weave. Then, in the connection regions A1 and A2 on both sides of the fabric of the electronic component mounting body E, the conductive yarn of the connection region A1 is exposed on the upper side of the fabric in the range intersecting the supporting portion H, and the conductive yarn of the connection region A2 Is woven so as to be exposed under the fabric. Therefore, the connection area A1 and the supply line J are set to be in contact with each other on the upper side of the fabric G, and the connection area A2 and the supply line I are set to be in contact with each other on the lower side of the cloth G. When the crossing part of the connection region A1 and the supply line J and the crossing part of the connection region A2 and the supply line I are always in contact with each other and a stable conduction state can be maintained, a power source is connected to the supply lines I and J. Thus, power can be supplied to the electronic component mounting body E.

  Further, a connecting material is applied from the upper side of the fabric G to the intersecting portion of the connection area A1 and the supply line J, and the connecting material is applied from the lower side of the fabric G to the intersecting portion of the connecting area A2 and the supply line I. By connecting the supply lines I and J to the power supply, it is possible to reliably supply the power to the electronic component mounting body E. When a signal supply line is required outside the power supply line, it is only necessary to add a supply line in parallel with the supply lines I and J, and easily form a wiring pattern such as a supply line as necessary. Can do. As the connection material for connecting the connection region and the supply line, a conductive material such as solder, a conductive adhesive such as a conductive paste, and a metal component such as caulking can be used as in the case of the connection material described above.

  As described above, the electronic component mounting body is woven and the conductive line is also woven into the cloth to form the cloth so as to carry the electronic component and have the same flexibility and durability as a normal cloth. be able to.

[Example 1]
The woven fabric shown in FIG. 1 was woven using a needle loom. The following yarns were used for the warp. As the weft, the same yarn as the insulating yarn used for the warp was used. A polyester false twisted yarn (56 dtex / 24f) was used as a catch thread (binder thread) of the needle loom.
<Insulation thread>
Glass fiber covering yarn (core yarn: long fiber yarn made of glass fiber, fineness 225 dtex, sheath yarn: long fiber yarn made of polyethylene terephthalate (PET) fiber, fineness 56 dtex / 24f × 2 (double covering processing, Twist number set to 1000T / m)))
<Conductive yarn>
Aramid fiber covering yarn (core yarn; spun yarn made of aramid fiber, thickness 30/1, sheath yarn; tin-plated copper wire (diameter 0.05 mm) x 2 pieces (double covering processing, twist number 3500 T / m) )
The electrical resistance of the conductive yarn was 11 Ω / m as a result of measurement by a four-terminal method using a measuring instrument (manufactured by Advantest Corporation; digital multimeter R6552). The width of the woven fabric was about 16 mm. Five conductive yarns were arranged on both sides to form a connection region, and a mounting region in which a range in which warp yarns were not arranged was formed in the central portion.

  The obtained woven fabric was cut at a length of 106 mm and set in a tensile tester (manufactured by Shimadzu Corporation; Autograph AGS-1kNG), and a tensile test in the longitudinal direction of the woven fabric was performed. The electrical resistance in the connection region of the fabric stretched by the tensile test was measured using a measuring instrument (HIOKI 3801 DIGITAL HITESTER). The measurement results are shown in FIG. As a result of the measurement, the electrical resistance of the fabric before the tensile test was 0.3Ω, and no change was observed in the electrical resistance even when the elongation ratio was 10% or more. Therefore, it can be seen that even when weaving in a state where the woven fabric is stretched, sufficient durability is provided.

  The obtained woven fabric was cut at 1.5 m, folded into two at the center portion, and a durability test was performed in which the folded portion was pressed by hand. As a result of measuring the electric resistance between both ends of the conductive yarn of the woven fabric by a four-terminal method using a measuring instrument (manufactured by Advantest Co., Ltd .; Digital Multimeter R6552), the electric resistance before folding is 1.85Ω / m. The electric resistance after repeating the folding operation 100 times was 1.87 Ω / m. Therefore, it can be seen that the obtained woven fabric has sufficient bending durability against folding and the like.

[Example 2]
An electronic component as shown in FIG. 8 (flexible substrate; width 5 mm × length 15 mm × thickness 1.2 mm, LED element mounted on the fabric obtained in Example 1; width 1.2 mm × length 1. 5 mm × thickness 1.1 mm) was mounted as shown in FIG. 1 and connected and fixed to the conductive yarns in the connection region with commercially available solder. When the conductive yarns in the connection regions on both sides were connected to the power source, it was confirmed that the LED element emitted light and was in a conductive state through the connection regions.

  Next, the same tensile test was performed on the electronic component mounting body in which the electronic component described above was mounted on the obtained woven fabric. The electronic component mounting body is cut at a length of 100 mm, and the two mounted electronic components are set in the same tensile tester as in the case of the woven fabric, and the longitudinal tensile test is performed. Was supplied with a power source to bring the LED element into a light emitting state, and the light quantity of the LED element was measured with a color illuminometer (Konica Minolta Sensing Co., Ltd .; CL-200). The measurement results are shown in FIG. Looking at the measurement results, even when the elongation rate exceeds 10%, the amount of light is reduced only slightly, and even when the electronic component mounting body is pulled, power is supplied with almost no decrease in the amount of current. It can be seen that it has sufficient durability.

  An endurance test was performed in which the electronic component mounting body cut to a length of 100 mm was set in a tensile tester, stretched 5%, held for 10 seconds, and then returned to a state without elongation 20 times. During the durability test, the LED element was in a light emitting state. After the test, the appearance of the electronic component mounting body was observed, but no particular shape change was observed. Further, no change was observed in the light emitting state of the LED element during the test. The electronic component mounting body cut to a length of 100 mm was folded in half, and a durability test was performed in which the bent portion was pressed by hand, but the electronic component mounting body was not marked, and the LED element emitted light. There was no change in state.

[Comparative example]
The electronic component described above was mounted on a flexible substrate film (manufactured by Sanhayato Co., Ltd .; thickness: 50 μm), cut into the same size as the electronic component mounting body, and a tensile test was performed. Immediately after applying a tensile force to the film, the LED element stopped emitting light, and it was confirmed that the wiring pattern formed on the film was disconnected. Therefore, it is considered technically difficult to weave a fabric by weaving a conventional film-like substrate.

[Example 3]
A fabric in which the electronic component mounting body obtained in Example 2 was woven using a loom shown in FIG. 10 was woven. As the warp and weft, a long fiber yarn (167 decitex / 48f) made of polyester fiber was used and woven at a warp density of 110 yarns / inch and a weft density of 65 yarns / inch. The supporting part for weaving the electronic component mounting body was formed of flat bag weave, and the electronic component mounting body was woven in the weft direction. A conductive connecting thread was woven into one end of the electronic component mounting body as shown in FIG. 13 to obtain a fabric carrying the electronic component. The conductive connecting yarn used was a double covering yarn similar to the conductive yarn of Example 1.

  When the power supply is connected to the conductive connecting thread woven into the fabric, all the LED elements mounted on the electronic component mounting body are in a light emitting state, and the weaving operation by the loom has little effect on the electronic component mounting body. confirmed. Moreover, when the light quantity of the LED element of the electronic component mounting body before and after weaving the fabric was compared, almost no change was observed. Therefore, by manufacturing a fabric using the electronic component mounting body, the fabric can be woven into the fabric with almost no damage to the electronic component, and a fabric having the same flexibility and durability as before can be obtained. .

  The woven fabric according to the present invention can be mounted with various electronic parts having flexibility and a connection terminal portion, like an ordinary woven fabric. For example, an LED element, a pressure detection sensor, a biological information detection sensor, etc. By mounting, clothes and interior materials (floor surface sheet material, wall surface sheet material, ceiling sheet material, etc.) can have various functions. By attaching LED elements to clothing, it is possible to add decorativeness. By incorporating biological information detection sensors into clothing, it is possible to constantly detect biological information such as pulse and blood pressure. In the case of clothing, since it has the same flexibility as conventional clothing, it can be worn without a sense of incongruity and has sufficient durability against deformation applied when worn. In the case of clothing for special purposes such as fire fighting clothing, it is possible to improve functionality by attaching a sensor (heat detection sensor) according to the usage.

  When the LED element is attached to the interior material, various lighting effects and decoration effects that are not found in conventional lighting fixtures can be obtained, and moreover, conventional floor sheet materials, wall sheet materials and ceiling sheet materials can be applied. It can be handled similarly. Moreover, the passage of a pedestrian or the like can be detected by incorporating a pressure detection sensor into the floor sheet material.

  For industrial materials used in agriculture, forestry and fisheries, civil engineering and construction, etc., functionality can be improved by attaching a sensor or the like according to the application. For example, it is possible to detect the indoor environment by attaching a temperature detection sensor etc. to a sheet material placed in a room such as a greenhouse, a house, a vehicle or a container, and use it for monitoring the indoor environment of a building or a vehicle. Can do. In addition, a change in ground subsidence or the like can be detected by attaching a strain sensor to a sheet material buried underground in civil engineering work or the like.

  Moreover, the advertisement effect by light emission can be taken into account by attaching an LED element to a sheet material such as an advertising banner or a bag. In addition, by attaching an electronic component having a GPS function to a sheet material such as clothing or packaging material, it is possible to provide a security function capable of constantly checking position information.

A ... Connection area, B ... Mounting area, C ... Warp, D ... Weft, E ... Electronic component mounting body, F ... Electronic component, G ... Fabric, H ..Supporting part, I ... supply line, J ... supply line, S ... gap, 1 ... texture, 2 ... conductive yarn, 3 ... insulating yarn, 4 ... insulation Thread, 5 ... Insulating thread, 6 ... Body part, 7 ... Connection terminal part, 8 ... Connection material, 9 ... Auxiliary conductive thread, 10 ... Electronic component, 11 ... Flexible substrate, 12 ... LED element, 13 ... resistance for current adjustment, 14 ... connection pad, 20 ... mounting device

Claims (10)

  A plurality of connection regions formed by weaving warps in which conductive yarns are arranged at least in part and wefts in which insulation yarns are arranged, and warps and wefts in which insulation yarns are arranged between the connection regions A woven fabric for mounting electronic components, comprising a mounting region formed so as to be able to form a gap in which electronic components are arranged while being woven.   The woven fabric according to claim 1, wherein the conductive yarn is a covering yarn obtained by winding a metal fiber around a core yarn.   The woven fabric according to claim 2, wherein the covering yarn has a metal fiber twist number of 1000 T / m to 3500 T / m.   The woven fabric according to any one of claims 1 to 3, wherein the warp yarn in the connection region has the insulating yarn arranged on both sides of the conductive yarn.   The woven fabric according to any one of claims 1 to 4, wherein an auxiliary conductive yarn is woven into the connection region so as to cross the conductive yarn in at least a part of the range.   The woven fabric according to any one of claims 1 to 5, wherein a gap is formed in the mounting region in a range where the warp and the weft are not arranged.   The woven fabric according to any one of claims 1 to 5, wherein the mounting region is woven so as to expand between the warps in the weft direction to form a gap.   An electronic component mounting body comprising: a tape-like base body made of the woven fabric according to any one of claims 1 to 7; and an electronic component mounted on the base body, wherein the base body is connected to both sides. An area is formed and the mounting area is formed in a central portion, and the electronic component electrically connects the connection terminal portions extending on both sides to the conductive yarns in the connection area and the body portion. The electronic component mounting body arrange | positioned in the space | gap formed in the said mounting area | region.   A fabric in which the electronic component mounting body according to claim 8 is arranged in a longitudinal direction or a weft direction.   10. A bag weaving portion for inserting and holding the electronic component mounting body, and a conductive connecting yarn woven so as to intersect the bag weaving portion and electrically connected to a conductive yarn of the electronic component mounting body. The fabric described in 1.

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