JPH05299533A - Electronic part mounting board and electronic part device using the same - Google Patents

Abstract

PURPOSE:To enable the title electronic part mounting board requiring quiring no complicated steps at all to be manufactured as well as the thermal effect, etc., during the actual operation of the board mounted with electronic parts to be minimized. CONSTITUTION:Within a substrate 1 comprising multiple conductive wire rods 2 for electrically connecting electrode parts as well as multiple insulating wire rods 3 supporting and insulating these multiple conductive wire rods 2, the conductive wire rods 2 and insulating wire rods 3 are weaved into a wooven stuff in a netty shape to be formed into a textile as a whole. At this time, any complicated steps such as photoresist, etching steps, etc., can be eliminated. Furthermore, the conductive wire rods 2 and the insulating wire rods 3 can be independently expanded and contracted thereby enabling the inner stress upon the conductive wire rods 2 caused by the heat generation of the electronic parts to be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting an electronic component such as a semiconductor chip, and an electronic component device such as a semiconductor device using this substrate.

[0002]

2. Description of the Related Art Conventionally, a laminate type substrate, a TAB (Tape Automated Bonding) type substrate, and the like have been known as substrates for mounting various electronic components such as semiconductor chips. The laminate type substrate is formed by forming a large number of conductive lead patterns made of copper foil or the like on an insulating flat plate base material made of glass epoxy or ceramic. The TAB substrate is a so-called film carrier in which a large number of conductive lead patterns made of copper foil or the like are formed on an insulating film base made of polyimide resin or the like.

[0003]

However, any of the conventional substrates as described above has a photoresist, an etching or the like for forming a conductive lead pattern, or a copper foil is punched in the TAB method. An extremely complicated process such as bonding and gluing is required. For this reason,
There is a problem that it takes much time to manufacture the substrate.
In addition, since the conventional substrate has a structure in which the conductive lead pattern is fixed on the insulating base material, the conductive lead pattern and the conductive lead pattern are insulated against the thermal expansion and contraction of the substrate due to the heat generated by the semiconductor chip mounted on the substrate. The base material cannot expand and contract independently. Therefore, there is a problem that internal stress is generated in the conductive lead pattern and the lead pattern is unexpectedly broken.

Therefore, according to the present invention, a substrate for mounting electronic components and an electronic component device using this substrate can be manufactured without requiring complicated steps, and the influence of heat can be extremely reduced during actual use. The purpose is to provide.

[0005]

In order to achieve the above object, a substrate for mounting electronic parts according to the present invention is provided with a large number of conductive wires for electrically connecting electronic parts and a large number of these conductive wires. And a plurality of insulative wire rods for supporting and insulating the conductive wire rod. The plurality of conductive wire rods and the plurality of insulative wire rods are woven together to form a woven fabric. Further, the electronic component device according to the present invention,
An electronic component is mounted on the substrate, and terminals of the electronic component are connected to the conductive wire.

[0006]

According to the present invention constructed as described above, a large number of conductive wires and a large number of insulating wires are woven into each other to form a woven fabric. No complicated steps such as pattern photoresist and etching are required. In addition, since the conductive wire and the insulating wire are independent of each other, the conductive wire can be flexibly expanded and contracted against thermal expansion and contraction of the board due to heat generation of electronic components such as semiconductor chips mounted on the board. Become.

[0007]

Embodiments of the present invention applied to a substrate for mounting a semiconductor chip and a semiconductor device using this substrate will be described below with reference to the drawings.

First, the basic structure of this substrate is shown in FIGS.

As shown in FIG. 1, the substrate 1 is composed of a large number of conductive wires 2 and a large number of insulating wires 3, and the conductive wires 2 and the insulating wires 3 are meshed with each other. Woven and formed into a woven fabric as a whole. Although each conductive wire 2 is arranged along one direction, it is also possible to arrange it along two directions.

When the conductive wires 2 are arranged along two directions, there is a possibility that each of the conductive wires 2 may be short-circuited at the intersection. Therefore, the substrate 1 having the structure shown in FIG. 2 can be formed. That is, the diameter of the conductive wire 2 is configured to be sufficiently smaller than the diameter of the insulating wire 3, and the conductive wire 2 extends along one side surface of the insulating wire 3. Although the conductive wire 2 is partially fixed to the insulating wire 3 by the insulating binding yarn 4, the conductive wire 2 may be fixed to the insulating wire 3 in advance. According to this substrate 1, even if the conductive wires 2 are arranged along two intersecting directions, the conductive wires 2 do not come into contact with each other, and a short circuit can be prevented.

Further, in the substrate 1 of FIG. 3, the conductive wire 2 is covered with the insulating wire 3, and the insulating wire 3 is woven with each other. Further, in the substrate 1 of FIG. 4, the plurality of conductive wire rods 2a, 2b, 2c and the conductive wire rods 2a, 2b, 2c, 2d are respectively insulated wire rods 3.
Therefore, they are covered, and these insulating wires 3 are woven together.

In each of the above examples, the conductive wire 2 does not necessarily have to be woven between the insulating wires 3 and can be arranged at any interval. The cross-sectional shapes of the conductive wire 2 and the insulating wire 3 are not limited to circular shapes, and may be rectangular shapes or polygonal shapes. Further, it is possible to reinforce the substrate 1 by backing it with a thin plate made of polyimide resin or the like.

According to the substrate 1 configured as described above,
Since a large number of conductive wires 2 and a large number of insulating wires 3 are woven together to form a woven fabric, complicated steps such as photoresist and etching of the conductive lead pattern in the conventional substrate fabrication are not required. .. Therefore, the substrate 1 can be manufactured very easily in a short time.

Next, FIGS. 5 and 6 show a semiconductor device in which a semiconductor chip is mounted on the substrate as described above.

The substrate 1 is formed in a substantially square shape, and a device hole 5 is formed in the center thereof. In FIG. 5, a predetermined number of conductive wire rods 2 are woven in parallel from each side of the device hole 5 toward the outer circumference, and in FIG. 6, a predetermined number of conductive wire rods 2 are wound from each side of the device hole 5 to the outer circumference. It is woven in a radial pattern. In this radial case,
The conductive wire 2 may be woven obliquely with respect to the mesh of the insulating wire 3.

In the device hole 5, one end of each conductive wire 2 is joined to a large number of electrodes of the semiconductor chip 6, the semiconductor chip 6 is electrically connected to each conductive wire 2, and Retained. Then, the other end of each conductive wire 2 is connected to a predetermined pattern such as an external circuit board. That is, one end and the other end of the conductive wire 2 function as an inner lead and an outer lead in the TAB method.

According to the semiconductor device in which the semiconductor chip 6 is mounted on the substrate 1 as described above, since the conductive wire 2 and the insulating wire 3 are independent of each other in the substrate 1, the semiconductor chip 6 and the like are formed. The conductive wire 2 can flexibly expand and contract with respect to thermal expansion and contraction of the substrate 1 due to heat generation. Therefore, no internal stress is generated in the conductive wire 2 and it is possible to prevent the conductive wire 2 from being unexpectedly broken.

In addition, in this substrate 1, a large number of conductive wires 2 are insulated and supported by a large number of insulating wires 3. In other words, by weaving the conductive wires 2 and the insulating wires 3 together, The conductive wire 2 is arranged in the space formed by the insulating wire 3. Therefore, the electromagnetic characteristics of the substrate 1 can be improved by the physical properties of the gas (usually air) which is excellent in the insulating property and the relative dielectric constant that fill this space.

Next, a linear member for heat dissipation can be woven into the substrate 1. For example, as shown in FIG. 5, a thin tube 7 for flowing a heat medium is woven in the vicinity of the semiconductor chip 6 and a component such as a resistor that easily generates heat, and both ends of this thin tube 7 are extended to the outer peripheral portion of the substrate 1. ing. By causing the heat medium to flow in the thin tube 7, the heat generated from the semiconductor chip 6 and the resistor can be efficiently carried away to the outside.

Next, FIG. 7 shows a structure in which a plurality of substrates are laminated on each other. That is, a plurality of device holes 5 are provided in the substrate 1, and a large number of conductive wires 2 are woven between these device holes 5 and the outer peripheral portion. Further, the substrate 1'is provided with a device hole 5 ', and a large number of conductive wires 2'weave from the device hole 5'to the outer peripheral portion. The conductive wires 2 and 2'opposing each other on the substrates 1 and 1'are arranged in directions substantially orthogonal to each other.

Then, the semiconductor chip 6 is bonded to the conductive wire 2 in each device hole 5 of the substrate 1, and
The semiconductor chip 6'is bonded to the conductive wire 2'in the device hole 5'of the substrate 1 ', and the substrate 1 is laminated on the substrate 1'. Then, the predetermined conductive wire 2 and the predetermined conductive wire 2'which are opposed to each other by this lamination are AA and B-.
As shown by B, C-C, and D-D, they are selectively joined.
As a result, the respective semiconductor chips 6 and 6'can be connected to each other by the compact substrates 1 and 1 '.

The above-mentioned substrates 1, 1'can be manufactured by a weaving machine with a programmable controller, and the conductive wire 2, 2'and the insulating material can be produced only by changing the soft program of the weaving machine. The wire rods 3, 3'can be woven into various shapes. Therefore, it is possible to produce a wide variety of substrates without changing the equipment.

The embodiments of the present invention have been described above.
The present invention is not limited to the above embodiments, and various effective modifications and applications are possible based on the technical idea of the present invention. For example, various electronic components other than semiconductor chips can be mounted on this substrate, and the shape of the substrate can be changed arbitrarily. When laminating the substrates, the substrate according to the present invention and the conventional substrate may be laminated, or the laminating may be partially performed.

[0024]

As described above, according to the present invention,
By forming a woven fabric by weaving a large number of conductive wires and a large number of insulating wires, complicated steps such as photoresist and etching in a conventional board are not required when manufacturing a board. The time required for manufacturing can be significantly reduced, and the working efficiency can be improved and the cost can be reduced. In addition, since the conductive wire and the insulating wire can expand and contract independently, the internal expansion due to the difference in the thermal expansion coefficient between the conductive wire and the insulating wire against the thermal expansion and contraction of the substrate caused by the heat generation of the semiconductor chip, etc. No stress is generated, unexpected breakage of the conductive wire can be prevented, and reliability can be significantly improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part showing a basic configuration of a substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part showing a basic configuration of a substrate.

FIG. 3 is a perspective view of a main part showing a basic configuration of a substrate.

FIG. 4 is a perspective view of a main part showing a basic configuration of a substrate.

FIG. 5 is a plan view of a semiconductor device having a semiconductor chip mounted on a substrate according to an embodiment of the present invention.

FIG. 6 is a plan view of a semiconductor device in which a semiconductor chip is mounted on a substrate.

FIG. 7 is a perspective view when stacking two substrates in an example of the present invention.

[Explanation of symbols]

 1, 1'Substrate 2, 2 ', 2a to 2d Conductive wire rod 3, 3'Insulating wire rod 4 Bundling yarn 5, 5'Device hole 6, 6'Semiconductor chip 7 Heat medium flow thin tube

Claims (6)

[Claims] 1. A large number of conductive wire rods for electrically connecting electronic parts and a large number of insulating wire rods for supporting and insulating the large number of conductive wire rods. A substrate for mounting an electronic component, which is formed by weaving a conductive wire and a large number of insulating wires into a woven fabric. 2. The electronic wire according to claim 1, wherein the conductive wire is formed to have a diameter smaller than that of the insulating wire, and the conductive wire is extended along one side surface of the insulating wire. Substrate for mounting components. 3. The board for mounting electronic components according to claim 1, wherein the conductive wire is covered with the insulating wire. 4. The board for mounting electronic components according to claim 1, wherein a linear member for heat dissipation is woven. 5. A substrate for mounting an electronic component, which is obtained by laminating a plurality of the substrates according to claim 1 and bonding predetermined conductive wires of the plurality of substrates to each other. 6. An electronic component device in which an electronic component is mounted on the substrate according to claim 1 or 5, and terminals of the electronic component are connected to the conductive wire.