JP2013144613A - 半導体デバイス貫通電極形成用のガラス基板の製造方法 - Google Patents

半導体デバイス貫通電極形成用のガラス基板の製造方法 Download PDF

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Publication number
JP2013144613A
JP2013144613A JP2010097226A JP2010097226A JP2013144613A JP 2013144613 A JP2013144613 A JP 2013144613A JP 2010097226 A JP2010097226 A JP 2010097226A JP 2010097226 A JP2010097226 A JP 2010097226A JP 2013144613 A JP2013144613 A JP 2013144613A
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JP
Japan
Prior art keywords
glass substrate
excimer laser
laser light
hole
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010097226A
Other languages
English (en)
Japanese (ja)
Inventor
Motoji Ono
元司 小野
Akio Koike
章夫 小池
Ryota Murakami
亮太 村上
Shinya Kikukawa
信也 菊川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2010097226A priority Critical patent/JP2013144613A/ja
Priority to PCT/JP2011/059318 priority patent/WO2011132601A1/ja
Priority to TW100113793A priority patent/TW201200284A/zh
Publication of JP2013144613A publication Critical patent/JP2013144613A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Glass Compositions (AREA)
JP2010097226A 2010-04-20 2010-04-20 半導体デバイス貫通電極形成用のガラス基板の製造方法 Pending JP2013144613A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010097226A JP2013144613A (ja) 2010-04-20 2010-04-20 半導体デバイス貫通電極形成用のガラス基板の製造方法
PCT/JP2011/059318 WO2011132601A1 (ja) 2010-04-20 2011-04-14 半導体デバイス貫通電極形成用のガラス基板の製造方法
TW100113793A TW201200284A (en) 2010-04-20 2011-04-20 Method for manufacturing glass substrate used for forming through-electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010097226A JP2013144613A (ja) 2010-04-20 2010-04-20 半導体デバイス貫通電極形成用のガラス基板の製造方法

Publications (1)

Publication Number Publication Date
JP2013144613A true JP2013144613A (ja) 2013-07-25

Family

ID=44834122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010097226A Pending JP2013144613A (ja) 2010-04-20 2010-04-20 半導体デバイス貫通電極形成用のガラス基板の製造方法

Country Status (3)

Country Link
JP (1) JP2013144613A (zh)
TW (1) TW201200284A (zh)
WO (1) WO2011132601A1 (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015166759A1 (ja) * 2014-05-02 2015-11-05 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
JP2015202039A (ja) * 2014-04-04 2015-11-12 ヤングバッグス シーエム カンパニー リミテッドＹｏｕｎｇｂａｇｓ Ｃｍ Ｃｏ．，Ｌｔｄ． ブラシレス直流振動モータ
JPWO2017038075A1 (ja) * 2015-08-31 2018-06-14 日本板硝子株式会社 微細構造付きガラスの製造方法
JP2020196665A (ja) * 2013-12-17 2020-12-10 コーニング インコーポレイテッド ガラスおよびガラス製品への高速レーザ穴あけ方法
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106795044A (zh) * 2014-10-03 2017-05-31 日本板硝子株式会社 带贯通电极玻璃基板的制造方法以及玻璃基板
WO2016125815A1 (ja) * 2015-02-03 2016-08-11 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク製造装置、レーザー用マスクおよび有機半導体素子の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4405761B2 (ja) * 2002-07-24 2010-01-27 日本板硝子株式会社 レーザ加工用ガラス
DE112004000123T5 (de) * 2003-01-10 2005-11-10 Nippon Sheet Glass Co., Ltd. Glas für die Laserbearbeitung
JP2005088045A (ja) * 2003-09-17 2005-04-07 Sumitomo Heavy Ind Ltd レーザ穴あけ方法及び装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
JP7213852B2 (ja) 2013-12-17 2023-01-27 コーニング インコーポレイテッド ガラスおよびガラス製品への高速レーザ穴あけ方法
JP2020196665A (ja) * 2013-12-17 2020-12-10 コーニング インコーポレイテッド ガラスおよびガラス製品への高速レーザ穴あけ方法
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
JP2015202039A (ja) * 2014-04-04 2015-11-12 ヤングバッグス シーエム カンパニー リミテッドＹｏｕｎｇｂａｇｓ Ｃｍ Ｃｏ．，Ｌｔｄ． ブラシレス直流振動モータ
TWI669181B (zh) * 2014-05-02 2019-08-21 日商Ｖ科技股份有限公司 光束塑形遮罩、雷射加工裝置及雷射加工方法
JP2015211978A (ja) * 2014-05-02 2015-11-26 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
WO2015166759A1 (ja) * 2014-05-02 2015-11-05 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
JPWO2017038075A1 (ja) * 2015-08-31 2018-06-14 日本板硝子株式会社 微細構造付きガラスの製造方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates

Also Published As

Publication number Publication date
WO2011132601A1 (ja) 2011-10-27
TW201200284A (en) 2012-01-01

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