JP2013141313A - Transducer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric transducer.SOLUTION: A piezoelectric transducer 10 has: a base substrate 14; and a piezoelectric vibration piece 20 where longitudinal one end is supported by a fixing part 34 provided on the base substrate 14 in a cantilever manner. The piezoelectric vibration piece 20 includes: a first extraction electrode 42 which is formed on a first surface 38 at the base substrate 14 side of the piezoelectric vibration piece 20 and has a first connection part 46 at a position connected with the fixing part 34 in a planar view; and a second extraction electrode 52 which is formed on a second surface 46 on the opposite side of the base substrate 14 side and has a second connection part 56 at a position overlapping with the fixing part 34 and the first connection part 46 in the planar view. The second extraction electrode 52 is formed so as to be narrower than the first extraction electrode 42, and the second connection part 56 is connected with a wire line 36.

Description

  The present invention relates to a piezoelectric vibrator, and more particularly to an electrode structure of a piezoelectric vibrating piece mounted on the piezoelectric vibrator.

  2. Description of the Related Art Conventionally, piezoelectric vibrators utilizing the thickness-shear vibration of a quartz AT-cut base plate have been widely used in the field of electronic devices such as communication devices as having high frequency stability. In addition, such a piezoelectric vibrator is required to have less fluctuation due to temperature changes in its frequency characteristics, less fluctuation due to a reflow process (subject to thermal stress), and less fluctuation due to aging degradation. Furthermore, the capacity ratio is required to be small in order to increase the frequency variable range.

  8A (perspective view) and FIG. 8B (cross-sectional view) show a piezoelectric vibrator according to the first prior art (see Patent Document 1). In Patent Document 1, a piezoelectric vibrator 200 according to the first prior art uses an inverted mesa-shaped piezoelectric vibrating piece 202, one of which is a flat surface and the other is a concave surface having a concave portion, and a partial electrode 204 is provided on the flat surface side. The entire surface electrode 206 is disposed on the concave surface side, and one thick portion on the concave surface side is fixed to the package 207 with the conductive adhesive 210 that is disposed on the conduction pad 209 and electrically connected to the external lead 208. It is disclosed that the lead lead 214 of the upper partial electrode 204 is electrically connected to the conductive pad 213 and the external lead 212 on the package 207 side using a wire 215.

  9A (plan view) and FIG. 9B (sectional view) show a piezoelectric vibrator 300 according to the second prior art (see Patent Document 2). In Patent Document 2, the piezoelectric vibrator according to the second conventional technique is provided with a hole in a crystal piece 301 provided in a package 302 to form a vibration region 303 having a thickness smaller than that of the outer peripheral portion. The lead electrodes 305a and 305b extend from the pair of excitation electrodes 304a and 304b formed on both main surfaces to the outer periphery of the crystal piece 301, respectively, and the outer periphery of the crystal piece 301 from which the lead electrode 305b extends from one of the excitation electrodes 304b. Is a fixed end that is electrically and mechanically connected by a eutectic alloy 308 that is disposed on the internal terminal 306a and electrically connected to the external terminal 307a. The crystal piece 301 in which the extraction electrode 305a extends from the excitation electrode 304a. In the holding structure of the piezoelectric vibrator 300 whose outer peripheral portion is electrically connected by wire bonding 311, the excitation electrode 304 The outer peripheral portion of the crystal piece 301 from which the extraction electrode 305a extends is on the fixed end, and the outer peripheral portion of the crystal piece 301 on the fixed end and the internal terminal 306b connected to the external terminal 307b are connected by a wire wire. It is disclosed as a configuration.

  In the first conventional technique, the package surface side of the piezoelectric vibrating piece is bonded at one point with a conductive adhesive, and the opposite surface side is electrically connected to the package by wire bonding, so that the influence of the mounting stress. Is greatly reduced. In addition, by using a conductive adhesive that generates little gas (polyimide, etc.), it is possible to simultaneously reduce aging deterioration due to gas generation.

  In the second prior art, the package and the quartz crystal unit are fixed with a eutectic alloy, which is superior to the conductive adhesive shown in the first prior art in that no gas is generated. Yes.

  In any of the conventional techniques, one end of the piezoelectric vibrator in the longitudinal direction is fixed by a fixing means such as a eutectic alloy in a cantilever-supported state, and is formed on a surface opposite to the surface facing the package of the piezoelectric vibrator. The lead electrode is configured to be electrically connected by wire bonding at a position overlapping the fixing means in plan view.

Japanese Patent Laid-Open No. 7-176971 JP 2006-33165 A

  By the way, wire bonding is performed by recognizing the connection location by binarizing the image obtained by imaging the extraction electrode. However, when the extraction electrode is formed wide, the recognition of the connection location varies. May occur. Furthermore, in the above-described prior art configuration, stray capacitance is generated in the wire-bonded region, the equivalent parallel capacitance is increased (capacity ratio is also increased), and the frequency variable amount is reduced when used as a VCXO. As a result of the above-mentioned variations, the wire bonding connection position also varies, resulting in variations in the equivalent parallel capacitance, resulting in variations in the frequency characteristics, and further inconvenience in wire bonding, resulting in the oscillation being impossible. A problem occurs.

  Accordingly, the present invention focuses on the above-described problems, and an object thereof is to provide a piezoelectric vibrator that suppresses variations in connection locations of wire bonding and suppresses stray capacitance generated at the connection locations.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A piezoelectric vibrator having a base substrate and a piezoelectric vibrating piece whose one end in the longitudinal direction is held in a cantilevered state by a fixed portion provided on the base substrate, wherein the piezoelectric vibration The piece is formed on the first surface of the piezoelectric vibrating piece on the base substrate side and has a first extraction electrode having a first connection portion at a position where the piezoelectric vibration piece is connected to the fixing portion in plan view, and a piece opposite to the base substrate side. A second extraction electrode formed on the second surface and having a second connection portion at a position overlapping the fixing portion and the first connection portion in plan view, wherein the second extraction electrode is the first extraction electrode A piezoelectric vibrator, wherein the piezoelectric vibrator is formed to be narrower than an extraction electrode, and the second connection portion is connected to a wire line.

  With the above-described configuration, the connection portion of the wire line and the fixed portion overlap in plan view, so that the connection of the wire line becomes easy. Further, since the second lead electrode is formed thinner than the first lead electrode, positioning during wire bonding is facilitated, and variation in the connection position of the wire line is suppressed, thereby suppressing variation in the frequency characteristics of the piezoelectric vibrator. be able to. Furthermore, since the second lead electrode is formed thinner than the first lead electrode, the stray capacitance generated between the second lead electrode and the first lead electrode can be reduced.

Application Example 2 The first lead electrode includes a first lead portion extending from a first end portion of a first side facing the fixed portion of the first excitation electrode formed on the first surface; The second lead electrode has the first connection portion formed at the tip of the first lead portion, and the second lead electrode is formed on the second side of the second excitation electrode facing the first side in plan view. A second lead portion extending from the second end portion facing the one end portion and opposed to the first lead portion in plan view; and the second connection portion formed at the tip of the second lead portion; The piezoelectric vibrator according to Application Example 1, wherein:
With the above configuration, since the first lead portion and the second lead portion do not overlap in plan view, stray capacitance caused by the first lead portion and the second lead portion can be reduced.

Application Example 3 The piezoelectric vibrator according to Application Example 2, wherein the first connection part or the second connection part is formed to be narrower than the fixing part and overlaps the fixing part in plan view.
As a result, the area of the second connection portion is reduced, so that the stray capacitance between the first connection portion and the second lead portion can be reduced.

Application Example 4 The piezoelectric vibrator according to Application Example 2 or 3, wherein a tip region of the first connection part or the second connection part is in the fixed part in plan view.
As a result, the area of the second connection portion is further reduced, so that the stray capacitance between the first connection portion and the first lead portion can be further reduced.

It is a schematic diagram of the piezoelectric vibrator according to the first embodiment. It is a schematic diagram of a piezoelectric vibrator according to a second embodiment. It is a schematic diagram of a piezoelectric vibrator according to a third embodiment. It is a schematic diagram of a piezoelectric vibrator according to a fourth embodiment. It is a schematic diagram of a piezoelectric vibrator according to a fifth embodiment. It is a schematic diagram of a piezoelectric vibrator according to a sixth embodiment. It is a schematic diagram of a piezoelectric vibrator according to a seventh embodiment. It is a schematic diagram of the piezoelectric vibrator according to the first prior art. It is a schematic diagram of the piezoelectric vibrator which concerns on a 2nd prior art.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 is a schematic diagram of the piezoelectric vibrator according to the first embodiment. 1A is a front view, and FIG. 1B is a plan view. The piezoelectric vibrator 10 according to the first embodiment is a piezoelectric vibration in which one end in the longitudinal direction is held in a cantilever-supported state by a base substrate 14 constituting the package 12 and a fixing portion 34 provided on the base substrate 14. The piezoelectric vibrator 10 having the piece 20 includes a first connection portion 46 formed at the first surface 38 of the piezoelectric vibration piece 10 on the base substrate 14 side and connected to the fixing portion 34 in plan view. A second lead formed on the first lead electrode 42 and the second surface 48 opposite to the base substrate 14 side and having a second connecting portion 56 at a position overlapping the fixing portion 34 and the first connecting portion 46 in plan view. The second lead electrode 52 is formed to be narrower than the first lead electrode 42, and the second connection portion 56 is connected to the wire line 38. In the drawings and the following description, an orthogonal coordinate system (X axis, Y axis, Z axis) is used.

  The package 12 is formed by stacking a base substrate 14 made of ceramic or the like, a side plate 16 and a lid 18 made of ceramic or metal to form an internal space, and vacuum-sealing the piezoelectric vibrating piece 20. is there. A first connection electrode 22 and a second connection electrode 28 are formed on the internal space side of the base substrate 14, and the first connection electrode 22 and the second connection electrode 28 are interposed via the first through electrode 24 and the second through electrode 30, respectively. The first external electrode 26 and the second external electrode 32 formed outside the base substrate 14 are electrically connected. A fixing portion 34 is mounted on the first connection electrode 22, and one end 36 a of a wire wire 36 such as an Au wire is connected to the second connection electrode 28.

  The piezoelectric vibrating piece 20 is a thickness-sliding vibrator in which an excitation electrode and an extraction electrode are formed on an AT-cut base plate made of a piezoelectric material such as quartz, lithium niobate, or lithium tantalate. The shape of the piezoelectric vibrating piece is a flat plate structure, a mesa structure with a thick central part and a thin outer periphery of the central part, and a reverse mesa with a thin central part and a thick outer periphery of the central part. There is a thing of structure. The piezoelectric vibrating piece 20 is fixed in a cantilevered state with one end (−X direction) fixed to the fixing portion 34 in the longitudinal direction (± X direction) as a fixed end and the opposite side (+ X direction) as a free end. ing. The cantilever support in this way reduces the mount stress on the piezoelectric vibrating piece 20 from the package 12 side.

  A first excitation electrode 40 and a first extraction electrode 42 are formed on the surface (first surface 38) of the piezoelectric vibrating piece 20 on the base substrate side. The L-shaped first extraction electrode 42 extends from a first end portion 40 b of the first side 40 a facing the fixing portion 34 of the first excitation electrode 40 formed on the first surface 38. And a first connecting portion 46 formed at the tip of the first lead portion 44 and connected to the fixing portion 34. That is, the first lead electrode 42 extends from the first end portion 40b to the fixed end side (−X direction) and is bent in the short side direction (+ Y direction) of the piezoelectric vibrating piece 20 along the way. The first lead portion 44 has a first connection portion 46 formed at a position overlapping with the fixing portion 34 in a plan view in the tip region. The first connection portion 46 is disposed in the vicinity of the center of the piezoelectric vibrating piece 20 in the short side direction (± Y direction).

  The fixing part 34 is made of a conductive material such as a conductive adhesive, eutectic alloy, or solder, and can mechanically fix the piezoelectric vibrating piece 20, but no gas is generated from the material during vacuum sealing and reflow. Things are desirable. The fixed portion 34 has an upper surface connected to the first connection portion 46 and a lower surface connected to the first connection electrode 22. As a result, the first excitation electrode 40 is electrically connected to the first external electrode 26 via the first connection electrode 22 and the first through electrode 24.

  On the other hand, a second excitation electrode 50 and a second extraction electrode 52 are formed on the surface (second surface 48) opposite to the surface (first surface 38) on the base substrate side of the piezoelectric vibrating piece 20. The L-shaped second lead electrode 52 has a second side facing the first end 40b in plan view on the second side 50a of the second excitation electrode 50 facing the first side 40a of the first excitation electrode 40. A second lead portion 54 extending from the end portion 50b and facing the first lead portion 44 in plan view; a second connecting portion 56 formed at the tip of the second lead portion 54 and connected to the wire 36; Have That is, the second lead electrode 52 extends from the second end portion 50b to the fixed end side (−X direction) and is bent in the short side direction (−Y direction) of the piezoelectric vibrating piece 20 along the way. And a second connecting portion 56 formed at a position overlapping the fixing portion 34 in a plan view in the tip region of the second lead portion 54. The second connection portion 56 is disposed near the center of the short side direction (± Y direction) on the fixed end side (−X direction) of the piezoelectric vibrating piece 20. And the fixing | fixed part 34, the 1st connection part 46, and the 2nd connection part 56 have overlapped in planar view. Therefore, since the first lead portion 44 and the second lead portion 54 do not overlap in plan view, the stray capacitance between the first lead portion 44 and the second lead portion 54 can be reduced.

  The second connection portion 56 is connected to the other end 36b of a wire wire 36 such as an Au wire. As a result, the second excitation electrode 50 is electrically connected to the second external electrode 32 through the wire 36, the second connection electrode 28, and the second through electrode 30. Therefore, an oscillation circuit (not shown) that oscillates the piezoelectric vibrating piece 20 is connected to the first external electrode 26 and the second external electrode 32, and an AC voltage is applied from the oscillation circuit (not shown), whereby the piezoelectric vibrating piece 20 By generating a thickness shear vibration in a region sandwiched between the first excitation electrode 50 and the second excitation electrode 52, the piezoelectric vibrating piece 20 can be oscillated at a predetermined oscillation frequency.

  In assembling the piezoelectric vibrator 10, the fixing portion 34 is placed on the first connection electrode 22 formed on the base substrate 14 to which the side surface 16 is connected, and the upper end of the fixing portion 34 and the first connection portion 46 of the piezoelectric vibrating piece 20. The piezoelectric vibrating piece 20 is fixed by the fixing portion 34 in a manner in which the lid 18 and the second connecting electrode 28 and the second connecting portion 56 are wire-bonded using the wire wire 36, and the lid 18 is attached to the side plate 16. It is carried out by placing the lid 18 and the package 12 on the upper surface and performing seam welding or the like.

  In wire bonding, a bonding device (not shown) captures the connection location and recognizes the captured image by performing binarization processing or the like, and connects the wire line 36 using the recognition position as the connection location. Here, the second extraction electrode 52 is formed thinner than the first extraction electrode 42. In particular, the second connection portion 56 in the second extraction electrode 52 is formed narrower than the first connection portion 46 in the first extraction electrode 42. Thus, by forming the second connection portion 46 to be thin, the deviation between the recognition position and the actual connection location can be reduced, the accuracy of wire bonding can be increased, and the piezoelectric caused by the variation in the connection location. Variations in the frequency characteristics of the vibrator 10 can be suppressed.

  A schematic diagram of a piezoelectric vibrator according to the second embodiment is shown in FIG. The piezoelectric vibrator according to the second embodiment has the same basic configuration as that of the first embodiment, but the width of the second connection portion 62 is formed to be narrower than the width of the fixed portion 34 in the ± X direction. The fixed portion 34 is arranged so as to protrude in the ± X direction from the two sides 62a, 62b extending in the ± Y direction of the second connection portion 62. As a result, it is possible to suppress the variation in the positioning of the wire wire as compared with the case of the first embodiment, and to suppress the stray capacitance caused by the first connection portion and the second connection portion.

  A schematic diagram of the piezoelectric vibrator according to the third embodiment is shown in FIG. The piezoelectric vibrator 70 according to the third embodiment has the same basic configuration as that of the second embodiment, but the width of the first connection portion 72 in the ± X direction is formed narrower than the width of the fixed portion 34 in the ± X direction. The fixed portion 34 is disposed so as to protrude in the ± X direction from two sides 72a and 72b extending in the ± Y direction of the first connection portion 72 in plan view. However, the width of the first joint portion 72 is formed wider than the width of the second joint portion 62. Accordingly, the stray capacitance caused by the first joint portion 72 and the second joint portion 62 is suppressed, and the fixing portion 34 can be visually recognized in a plan view. Therefore, when mounting the piezoelectric vibrating piece 20, It is possible to easily identify the connection position with the connection portion 72 to suppress the variation in the mount position, and to suppress the variation in the frequency characteristics of the piezoelectric vibrator 70.

  A schematic diagram of the piezoelectric vibrator according to the fourth embodiment is shown in FIG. 4. The piezoelectric vibrator 80 according to the fourth embodiment has the same basic configuration as that of the second embodiment, but the second lead portion 84 has the same basic configuration. The distal end region of the second connection portion 82 to be connected is configured to fit within the fixed portion 34 in plan view. As a result, the second connection portion 82 is shortened, so that the stray capacitance caused by the second connection portion 82 and the first connection portion 46 (first connection portion 72) can be reduced.

  A piezoelectric vibrator 90 according to a fifth embodiment is shown in FIGS. The piezoelectric vibrator 90 according to the fifth embodiment has the same basic configuration as the fourth embodiment, but the second lead portion 92 extends in a straight line from the second end portion 50b toward the second connection portion 94. Is formed. That is, the second lead portion 92 is formed to extend obliquely toward the second connection portion 94. Accordingly, the area of the second lead portion 92 can be reduced by shortening the second lead portion 92, so that the floating caused by the second lead portion 92, the first lead portion 44, and the first connection portions 46 and 72. The capacity can be reduced.

  Further, as shown in FIG. 5B, the first lead portion 96 is also in a straight line from the first end portion 40 b toward the first connection portion 98, that is, the first connection portion 99, similarly to the second lead portion 92. It can be formed to extend obliquely toward. At this time, the tip region of the second connection part 98 can also be formed so as to be accommodated in the fixing part 34 in plan view. Accordingly, the area of the first lead portion 96 can be reduced by shortening the first lead portion 96 in the same manner as the second lead portion 98, so that the first lead portion 96, the second lead portion 92, and the second connection are connected. The stray capacitance resulting from the portion 94 can be reduced. In FIG. 5B, both the first lead portion 96 and the second lead portion 92 are obliquely extended, but only the first lead portion 96 may be obliquely extended.

  6A and 6B are schematic views of the piezoelectric vibrator according to the sixth embodiment. The piezoelectric vibrator 100 according to the sixth embodiment has the same basic configuration as the first embodiment, but a third lead portion 106 is formed between the first lead portion 102 and the first connection portion 104. The third lead portion 106 is formed thinner than the first lead portion 102. As shown in FIG. 6A, when the sixth embodiment is applied to the first and second embodiments, the third lead portion 106 is located on the fixed end side (−X direction) of the piezoelectric vibrating piece 20. It is desirable to form it in a close-up state. Since the third lead portion 106 is a member thinner than the first lead portion 102, the area of the first extraction electrode 108 is smaller than that in the case where the same portion is constituted by the first lead portion 102. Therefore, the first surface 38 (FIG. 1) and the stray capacitance caused by the second lead portion 92 (54) and the second connection portion 94 (56) on the second surface 48 (see FIG. 1) are reduced, and Since the width of the one lead portion 102 can be widened, good conduction of the first lead portion 102 can be maintained.

  Further, as shown in FIG. 6B, in the sixth embodiment, a fourth lead portion 114 is formed between the second lead portion 110 and the second connection portion 112, and the fourth lead portion 114 is the second lead portion 114. It is formed thinner than the lead part 110. Since the fourth lead portion 114 is a member thinner than the second lead portion 110, the area of the second extraction electrode 116 is smaller than that in the case where the same portion is constituted by the second lead portion 110. Since the stray capacitance caused by the fourth lead portion 114 and the first lead portion 102, the first connection portion 104, and the third lead portion 106 on the first surface 38 is reduced, the width of the second lead portion can be increased. Good conduction of the second lead part 110 can be maintained. In FIG. 6B, the third lead portion 106 and the fourth lead portion 114 are formed together, but only the fourth lead portion 114 may be formed.

  FIG. 7 shows a schematic diagram of a piezoelectric vibrator according to the seventh embodiment. In the piezoelectric vibrator 120 according to the seventh embodiment, a fifth lead portion 126 is formed between the second lead portion 122 and the second connection portion 124, and the fifth lead portion 126 is thicker than the second lead portion 122. Is formed. The fifth lead portion 126 overlaps the first lead portion 102 (44, 96), the second connection portion 112 (56, 62, 82, 94), and the third lead portion 106 of the sixth embodiment in plan view. Therefore, the generation of stray capacitance due to the fifth lead portion 126 on the second surface 48 and the first lead portion 44 and the second connection portion 56 on the first surface 38 can be suppressed low, and the fifth lead Since 126 is formed thicker than the second lead 124, the conduction resistance of the entire second lead electrode 128 can be reduced.

  As described above, as described in the first embodiment, the piezoelectric vibrator 10 (60, 70, 80, 90, 100, 120) according to the present embodiment is connected to the connection portion (second connection portion) of the wire 38. 56) and the fixing portion 34 overlap in plan view, so that the wire wire 34 can be easily connected. In addition, since the second lead electrode 52 (116, 128) is formed thinner than the first lead electrode 42 (108), positioning during wire bonding is facilitated, and variation in the connection position of the wire line 38 is suppressed. Thus, variation in frequency characteristics of the piezoelectric vibrator 10 can be suppressed. Further, since the second extraction electrode 52 is formed to be narrower than the first extraction electrode 44, the stray capacitance generated between the second extraction electrode 52 and the first extraction electrode 44 can be reduced.

  Since the first lead portion 44 (96, 102) and the second lead portion 54 (92, 110, 122) do not overlap in plan view, floating caused by the first lead portion 44 and the second lead portion 54 occurs. The capacity can be reduced.

  As described in the second embodiment, the second connection portion 62 is formed to be thinner than the fixing portion 34 and overlaps the fixing portion 34 in plan view, so that the area of the second connection portion 62 is reduced. The stray capacitance between the connection part 46 and the second lead part 44 can be reduced.

  As described in the fourth embodiment, since the tip region of the second connection portion 82 is in the fixed portion 34 in plan view, the area of the second connection portion 82 is further reduced, and thus the first connection portion 46 is. In addition, the stray capacitance between the first lead portion 44 and the first lead portion 44 can be further reduced.

  As described in the fifth embodiment, since the second lead portion 92 is formed to extend straight from the second end portion 50b toward the second connection portion 94, the second lead portion 92 can be shortened by shortening the second lead portion 92. Since the area of the two lead portions 92 is reduced, the stray capacitance between the first lead portion 96 (54) and the first connection portion 94 (46) can be reduced.

  As described in the third embodiment, the first connection portion 72 is formed thinner than the fixing portion 34 and overlaps with the fixing portion 34 in plan view. The stray capacitance between the connection part 46 and the second lead part 44 can be reduced.

  As described in the fifth embodiment, since the distal end region of the first connection portion 98 is in the fixed portion 34 in plan view, the area of the first connection portion 98 is further reduced, and thus the second connection portion 94. The stray capacitance between (56, 62, 82) and the second lead portion 92 (54) can be further reduced. Further, since the first lead portion 96 is formed to extend in a straight line toward the first connection portion 98, the area of the first lead portion 96 is reduced by shortening the first lead portion 96, and thus the second lead portion 96 The stray capacitance between the second connection portion 94 and the second connection portion 94 can be reduced.

  As described in the sixth embodiment, the third lead portion 106 is formed between the first lead portion 102 and the first connecting portion 104, and the third lead portion 106 is formed to be narrower than the first lead portion 102. The stray capacitance between the third lead portion 106 and the second connecting portion 112 (56, 62, 82, 94) and the second lead portion 110 (54, 92) is reduced, and the first lead portion 102 is electrically connected. Sex can be secured. Further, the fourth lead portion 114 is formed between the second lead portion 110 and the second connection portion 112, and the fourth lead portion 114 is formed to be narrower than the second lead portion 110. The stray capacitance between the first connecting portion 104 (46, 72, 98) and the first lead portion 102 (54, 96) can be reduced, and the conductivity of the second lead portion 110 can be ensured.

  As described in the seventh embodiment, the fifth lead portion 126 is formed between the second lead portion 122 and the second connection portion 124, and the fifth lead portion 126 is formed thicker than the second lead portion 122. The fifth lead portion 126 is not at a position overlapping the first connecting portion 46 (72, 98, 104) in plan view, so there is almost no influence of an increase in stray capacitance, and the fifth lead portion 126 is the second lead. Since the portion 122 (54, 92, 110) is formed thicker, the conduction resistance of the entire second extraction electrode 128 can be reduced.

  10 ......... piezoelectric vibrator, 12 ......... package, 14 ......... base substrate, 16 ......... side plate, 18 ......... lid, 20 ......... piezoelectric vibrating piece, 22 ......... first connection electrode, 24... First through electrode, 26... First external electrode, 28... Second connection electrode, 30... Second through electrode, 32. , Wire line, 38 ......... first surface, 40 ......... first excitation electrode, 42 ......... first extraction electrode, 44 ......... first lead portion, 46 ......... first Connection part 48 ......... Second surface 50 ......... Second excitation electrode 52 ... Second extraction electrode 54 ... Second lead part 56 ... Second connection part 60 ... ... Piezoelectric vibrator 62 ......... Second connection portion 70 ......... Piezoelectric vibrator 72 ......... First connection portion 80 ...... Piezoelectric vibrator 82 ......... Second connection , 90... Piezoelectric vibrator, 92... Second lead portion, 94... Second connection portion, 96... First lead portion, 98. Resonator, 102 ......... First lead part, 104 ......... First connection part, 106 ......... Third lead part, 108 ......... First extraction electrode, 110 ......... Second lead part, 112 ... …… Second connection portion 114 ...... Fourth lead portion 116 ...... Second extraction electrode 120 ...... Piezoelectric vibrator 122 …… Second lead portion 124 …… Second connection portion , 126..., The fifth lead portion, 128, the second extraction electrode, 200, the piezoelectric vibrator, 202, the piezoelectric vibrating piece, 204, the partial electrode, 206, the entire electrode, 207 ……… Package, 208 ……… External pad, 209 ……… Passing pad, 210 ……… Conductive Adhesive, 212... External lead, 213... Conductive pad, 214... Drawer lead, 215... Wire wire, 300 ... Piezoelectric vibrator, 301. ... Package 303 ......... Vibration region 304a ... Excitation electrode 304b ... Excitation electrode 305a ... Extraction electrode 305b ... Extraction electrode 306a ... Internal terminal 306b ... Internal Terminal, 307a... External terminal, 307b... External terminal, 308... Eutectic alloy, 311.

Claims (4)

A piezoelectric vibrator having a base substrate, and a piezoelectric vibrating piece whose one end in the longitudinal direction is held in a cantilever-supported state by a fixed portion provided on the base substrate,
The piezoelectric vibrating piece is
A first lead electrode formed on a first surface of the piezoelectric vibrating piece on the base substrate side and having a first connection portion at a position to be connected to the fixing portion in plan view, and a second surface on the opposite side of the base substrate side And a second extraction electrode having a second connection portion at a position overlapping the fixed portion and the first connection portion in plan view,
The piezoelectric vibrator is characterized in that the second lead electrode is formed thinner than the first lead electrode, and the second connection portion is connected to a wire line. The first lead electrode is
A first lead portion extending from a first end of a first side facing the fixed portion of the first excitation electrode formed on the first surface; and the first lead portion formed at a tip of the first lead portion. Has one connection,
The second lead electrode is
A second side of the second excitation electrode that faces the first side extends from a second end that faces the first end in plan view and faces the first lead in plan view. The piezoelectric vibrator according to claim 1, further comprising: a second lead portion; and the second connection portion formed at a tip of the second lead portion.   3. The piezoelectric vibrator according to claim 2, wherein the first connection part or the second connection part is formed to be narrower than the fixed part and overlaps the fixed part in plan view.   4. The piezoelectric vibrator according to claim 2, wherein a tip region of the first connection portion or the second connection portion is in the fixed portion in plan view.