JP2013133532A - Sputtering target peeling apparatus and method for peeling sputtering target - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that it is necessary to make sure that a joint material for bonding has melted at regular time intervals since the time to visually confirm that the joint material for bonding a backing plate and a sputtering target material differs depending on dimensions and quality of the backing plate and the sputtering target material.SOLUTION: A pressure plate with a pressure part formed at its front edge is movably placed on one side of a stage, and pressed by springs from the rear side. The sputtering target material bonded to the backing plate is placed on the stage. The pressure part of the pressure plate is brought into contact with the periphery side of the sputtering target material so that pressure is automatically applied to the sputtering target material.

Description

  The present invention relates to an apparatus for peeling a plate-like sputtering target used for forming a thin film from a backing plate and a peeling method thereof.

  The plate-like sputtering target used for forming a thin film is separated into a sputtering target material and a backing plate. The sputtering target material is recovered and refined and then used as a raw material. The backing plate is subjected to a blasting process and the like. Used.

  For this purpose, there is an operation for peeling the sputtering target material from the backing plate. For the peeling operation, the bonded plate-like sputtering target is placed on a heat source such as a hot plate and bonding for bonding such as In is performed. It is necessary to melt the material. In order to confirm that the bonding material for bonding has melted, it is confirmed by hand whether the plate-like sputtering target material and the backing plate move.

  Since the bonding material for bonding is used in an optimal amount between the backing plate and the plate-like sputtering target material, it is difficult to visually confirm that the bonding material for melting has melted.

  In addition, since the time until it is visually observed that the bonding material has been melted depends on the dimensions and materials of the backing plate and the plate-like sputtering target material, it is necessary to confirm that the bonding material has melted at regular intervals. There is.

  Furthermore, after the bonding material for bonding is melted, when the plate-like sputtering target material is peeled off from the backing plate, an impact may be applied with a hammer or the like, and the backing plate may be damaged at that time.

  Therefore, the present invention is such that a pressing plate having a pressing portion at the tip is movably installed on one side of the stage with a spring from behind, and a sputtering target material bonded to a backing plate is disposed on the stage. Then, a sputtering target peeling apparatus was configured in which the pressing portion of the pressing plate was brought into contact with the peripheral side surface of the sputtering target material so that the pressing force was automatically applied to the sputtering target material.

  In the above-described peeling device, the stage on which the sputtering target material bonded to the backing plate is placed and heated on the hot plate, so that the bonding material for melting is melted. The sputtering target material that is automatically moved by the generated force and is pressed by the pressing portion is automatically moved on the backing plate so that the sputtering target material can be peeled from the backing plate.

  According to the present invention described above, by heating the stage on which the sputtering target material bonded to the backing plate is placed on the hot plate, the bonding material is melted and the sputtering target material pressed by the pressing portion is backed. In order to peel off the sputtering target material by automatically moving on the plate, it is necessary to check the peeling of the sputtering target from the backing plate without damaging the backing plate with a jig or the like during the peeling operation. And the sputtering target can be automatically peeled off.

Plan view showing an embodiment Side view Side view showing the operating state The top view which shows the Example in the other shape of a sputtering target material The top view which shows the other shape of a press part The top view which shows the Example in the other shape of a sputtering target material The top view which shows the other shape of a press part The top view which shows the other shape of a press part

  Examples of the present invention will be described.

  A concave portion 8 is provided at the tip to form two pressing portions 1, and a plurality of long holes 2 for movement are formed in the middle to form a pressing plate 3 made of stainless steel or the like.

  The pressing portion 1 formed at the tip of the pressing plate 3 is formed so as to protrude from the lower surface of the pressing plate 3 so as to be higher than the thickness of a backing plate 10 described later.

  Moreover, if R is given to the inner side edge part of the press part 1, a contact part with a sputtering target material will not be damaged.

  The thus configured pressing plate 3 is installed on one side of the stage 4 so as to be pressed by a spring 5 from behind, and the supporting pin 6 through which the long hole 2 is passed is placed on the stage 4 so that the pressing plate 3 is placed on the stage 4. To be movable.

  The shape of the pressing portion 1 is not limited to the above shape. For example, as shown in FIGS. 5 and 6, the pressing portion 1 is formed with a concave portion 8 between the pressing portions 1. The shape which extended the outer side so that right and left may become a straight line may be sufficient.

  The shape of the sputtering target has a circular shape, a rectangular shape, a polygonal shape, and the like, and the shape of the pressing surface 1 formed at the tip of the pressing plate 3 is the above-described shape, so that the outer peripheral shape of the sputtering target can be any shape. Although it can correspond, it may be in a shape that matches a part of the outer peripheral shape of each of the sputtering targets 11 to be peeled off. For example, as shown in FIGS. But you can.

  In addition, the structure of the long hole and the support pin is not limited to the above structure. For example, the support plate may be moved by placing support pins on both sides of the press plate or providing guides to sandwich the press plate. In short, any structure may be used as long as the pressing plate can move linearly.

  The operation example of the above apparatus will be described below.

  As shown in FIGS. 1, 2, and 3, a sputtering target material 11 (material 99.99) is formed on a backing plate 10 (material 99.9 mass% Cu, φ250 mm × plate thickness 3 mm, stepped φ200 mm × height 1.5 mm). (Mass% Ag, φ200 mm × plate thickness 5 mm) was prepared by bonding with an In bonding material.

  Therefore, as shown in FIG. 1, the sputtering target material 11 bonded on the backing plate is placed on the stage 4, and the end of the backing plate 10 is fixed by the fixing portion 7 provided on the stage 4, and pressed. An end face of the pressing portion 1 of the plate 3 is applied to the side surface of the sputtering target material 11, whereby a pressing force is applied by the force generated by the spring 5.

  When the stage 4 in such a state is placed on a hot plate (not shown) and heated, In as the bonding material 9 for bonding is melted. By this melting, the pressing plate 3 is automatically moved in the direction of the arrow along the long hole 2 by the force of the spring 5, whereby the sputtering target material 11 moves on the backing plate 10 as shown in FIG. Then, the sputtering target material 11 is peeled off.

  No scratches or the like were observed on the backing plate 10 after peeling.

  The above description has been given for the case of the disk-like sputtering target material 11, but as shown in FIG. 4, the same can be applied to the rectangular sputtering target material 11, and further sputtering of other shapes not shown in the figure. The same applies to the target material.

  Moreover, also in the press part 1 of the other press plate 3 shown in figure, the sputtering target material 11 can be peeled from the backing plate 10 by the effect | action similar to the above.

DESCRIPTION OF SYMBOLS 1 Press part 2 Elongate hole 3 Press plate 4 Stage 5 Spring 6 Support pin 7 Fixed part 8 Recess 9 Bonding bonding material 10 Backing plate 11 Sputtering target material

Claims (3)

  A pressing plate having a pressing part at the tip is movably installed on one side of the stage with a spring from behind, a sputtering target material bonded to a backing plate is placed on the stage, and the sputtering target A sputtering target peeling apparatus, wherein a pressing force is automatically applied to a sputtering target material by bringing a pressing portion of the pressing plate into contact with a peripheral side surface of the material.   2. The sputtering target peeling apparatus according to claim 1, wherein a concave portion is provided at the tip of the pressing plate to form two pressing portions. 2. The peeling apparatus according to claim 1, wherein a stage on which a sputtering target material bonded to a backing plate is placed is placed on a hot plate and heated to melt the bonding material, whereby a pressing plate The sputtering target peeling method, wherein the sputtering target material is automatically moved by the spring force, and the sputtering target material pressed by the pressing portion is automatically moved on the backing plate to peel off the sputtering target material.