JP5808241B2 - Sputtering target peeling apparatus and peeling method therefor - Google Patents

Description

  The present invention relates to an apparatus for peeling a plate-like sputtering target used for forming a thin film from a backing plate and a peeling method thereof.

  The plate-like sputtering target used for forming a thin film is separated into a sputtering target material and a backing plate. The sputtering target material is recovered and refined and then used as a raw material. The backing plate is subjected to a blasting process and the like. Used.

  For this purpose, there is an operation for peeling the sputtering target material from the backing plate. For the peeling operation, the bonded plate-like sputtering target is placed on a heat source such as a hot plate and bonding for bonding such as In is performed. It is necessary to melt the material.

  In order to confirm that the bonding material for bonding has melted, it is confirmed by hand whether the plate-like sputtering target material and the backing plate move.

  Since the bonding material for bonding is used in an optimal amount between the backing plate and the plate-like sputtering target material, it is difficult to visually confirm that the bonding material for melting has melted.

  In addition, since the time until it is visually observed that the bonding material has been melted depends on the dimensions and materials of the backing plate and the plate-like sputtering target material, it is necessary to confirm that the bonding material has melted at regular intervals. There is.

  Furthermore, after the bonding material for bonding is melted, when the plate-like sputtering target material is peeled off from the backing plate, an impact may be applied with a hammer or the like, and the backing plate may be damaged at that time.

  Therefore, the present invention is such that a pressing plate having a pressing portion at the tip is movably installed on one side of the stage with a spring from behind, and a sputtering target material bonded to a backing plate is disposed on the stage. Then, the pressing portion of the pressing plate is brought into contact with the peripheral side surface of the sputtering target material so that the pressing force is automatically applied to the sputtering target material, and the electrode that is in contact with the stage by the movement of the sputtering target material. And the electrode was wired to a buzzer and / or a lamp so as to notify that the sputtering target material was peeled off from the backing plate and moved.

  By placing the sputtering target material bonded to the backing plate on the hot plate and heating it by the above-described peeling device, the bonding material for melting is melted. The sputtering target material that is automatically moved by the generated force and is pressed by the pressing part automatically moves on the backing plate, and the sputtering target material is peeled off from the backing plate and moved. The buzzer and / or the lamp is activated by contacting the substrate and the sputtering target material is peeled off from the backing plate.

  According to the present invention described above, by heating the stage on which the sputtering target material bonded to the backing plate is placed on the hot plate, the bonding material is melted and the pressed sputtering target material is moved over the backing plate. By automatically moving, the sputtering target material peels off, and the buzzer and / or lamp informs when it comes into contact with the electrode, eliminating the need for the worker to visually confirm the peeling of the sputtering target and automating the peeling. It has the effect which becomes.

Plan view showing an embodiment Side view Side view showing the operating state The top view which shows the Example in the other shape of a sputtering target material Side view Side view showing the operating state

  Examples of the present invention will be described.

  A concave portion 7 is provided at the tip to form two pressing portions 1, a plurality of moving long holes 2 are formed in the middle, and the pressing plate 3 is formed of stainless steel or the like.

  The pressing portion 1 formed at the tip of the pressing plate 3 is formed so as to protrude from the lower surface of the pressing plate 3 so as to be higher than the thickness of a backing plate 15 described later.

  The thus configured pressing plate 3 is installed on one side of the stage 4 so as to be pressed by a spring 5 from behind, and the supporting pin 6 through which the long hole 2 is passed is placed on the stage 4 so that the pressing plate 3 is placed on the stage 4. To be movable.

  Reference numeral 8 denotes a fixing portion, which fixes the position of the backing plate 15 on the stage 4. The electrode 10 is formed on the one fixing portion 8 via the insulating portion 9, and the buzzer 12 and the lamp 13 are formed by the circuit 11. Connect to. Reference numeral 14 denotes a power source. Note that both the buzzer 12 and the lamp 13 are not necessarily installed, and only one of them may be provided. In the present embodiment, the electrode is provided using the fixed portion. However, the electrode may be provided independently of the fixed portion and connected to the buzzer or the lamp.

  The shape of the sputtering target has a circular shape, a rectangular shape, a polygonal shape, and the like, and the shape of the pressing surface 1 formed at the tip of the pressing plate 3 is the above-described shape, so that the outer peripheral shape of the sputtering target can be any shape. Although it can respond | correspond, what kind of shape may be sufficient if it is a shape which can respond to the outer periphery shape of the sputtering target to peel.

  In addition, the structure of the long hole and the support pin is not limited to the above structure. For example, the support plate may be moved by placing support pins on both sides of the press plate or providing guides to sandwich the press plate. In short, any structure may be used as long as the pressing plate can move linearly.

  The operation example of the above apparatus will be described below.

  As shown in FIGS. 1, 2, and 3, a sputtering target material 16 (material 99.99) is formed on a backing plate 15 (material 99.9 mass% Cu, φ250 mm × plate thickness 3 mm, stepped φ200 mm × height 1.5 mm). (Mass% Ag, φ200 mm × plate thickness 5 mm) was prepared by bonding with an In bonding material.

  Therefore, as shown in FIG. 1, the sputtering target material 16 bonded on the backing plate 15 is placed on the stage 4, and the end of the backing plate 15 is fixed by the fixing portion 8 provided on the stage 4, An end surface of the pressing portion 1 of the pressing plate 3 is applied to the side surface of the sputtering target material 16, and thereby a pressing force is applied by the force generated by the spring 5.

  When the stage 4 in such a state is placed on a hot plate (not shown) and heated, In which is the bonding material 17 for bonding is melted. By this melting, the pressing plate 3 is automatically moved in the direction of the arrow along the long hole 2 by the force of the spring 5, whereby the sputtering target material 16 moves on the backing plate 15 as shown in FIG. Then, the sputtering target material 16 is peeled off.

  Due to the movement of the sputtering target material 16, the sputtering target material 16 comes into contact with the electrode 10, whereby the movement is notified by the buzzer 12 and the lamp 13. Although not shown, it is also possible to automatically control the contact signal to the electrode 10 by connecting it to a counter or the like.

  The above description has been given for the case of the disk-shaped sputtering target material 16, but as shown in FIG. 4, it can be performed in the same manner for the rectangular sputtering target material 16, and further, sputtering of other shapes not shown. The same applies to the target material.

  Moreover, also in the press part 1 of the other press plate 3 shown in figure, the sputtering target material 16 can be peeled from the backing plate 15 by the effect | action similar to the above.

DESCRIPTION OF SYMBOLS 1 Press part 2 Long hole 3 Press plate 4 Stage 5 Spring 6 Support pin 7 Concave part 8 Fixed part 9 Insulation part 10 Electrode 11 Circuit 12 Buzzer 13 Lamp 14 Power supply 15 Backing plate 16 Sputtering target material 17 Bonding material for bonding

Claims (3)

    A pressing plate having a pressing part at the tip is movably installed on one side of the stage with a spring from behind, a sputtering target material bonded to a backing plate is placed on the stage, and the sputtering target The pressing portion of the pressing plate is brought into contact with the peripheral side surface of the material so that the sputtering target material is automatically pressed, and an electrode that is in contact with the movement of the sputtering target material is provided on the stage. A sputtering target peeling apparatus characterized in that a sputtering target material is peeled off from a backing plate and moved by wiring a buzzer and / or a lamp.   2. The sputtering target peeling apparatus according to claim 1, wherein two pressing portions are formed at a distance from the tip of the pressing plate. 2. The peeling apparatus according to claim 1, wherein a stage on which a sputtering target material bonded to a backing plate is placed is placed on a hot plate and heated to melt the bonding material, whereby a pressing plate Is automatically moved by the spring force, and the sputtering target material pressed by the pressing portion is automatically moved on the backing plate. The movement of the sputtering target material brings the sputtering target material into contact with the electrode. A method of peeling a sputtering target, characterized in that the movement of the sputtering target material is notified by a buzzer and / or a lamp so that peeling of the sputtering target material can be known.