JP2013193270A - Peeling tool and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling tool and a peeling method for speedily and safely peeling a molded body from a sticking base without damaging a microstructure of the molded body which is a thin molded body and has the microstructure molded by transfer.SOLUTION: A peeling tool peels a molded body with a microstructure transfer-molded by a press type microstructure transfer molding device having a pair of an upper mold and a lower mold provided with a stamper with a microstructure, from the stamper, and the upper mold or the lower mold with the molded body adhered thereto. The peeling tool includes: nipping means for nipping an edge of the molded body; peeling means for separating the nipping means from the stamper with the molded body adhered thereto, and the upper mold or the lower mold; and collecting means for receiving and collecting the molded body peeled from the stamper and the upper mold or the lower mold.

Description

  The present invention relates to a peeling treatment in which a molded body on which a microstructure used in a press-type microstructure transfer molding apparatus is transferred is peeled from a stamper, an upper mold or a lower mold (attached substrate) to which the molded body is adhered. The present invention relates to a tool and a peeling method.

  2. Description of the Related Art Press-type microstructure transfer molding apparatuses that transfer and mold a microstructure on a workpiece by cooperation of an upper mold and a lower mold have high molding ability and are widely used. For example, an optical element having a fine structure, a microchemical chip, and the like are manufactured using a press-type fine structure transfer molding apparatus. In such a press-type microstructure transfer molding apparatus, a microstructure is engraved on a stamper, a lower mold, an upper mold, etc., and the microstructure is transferred and molded by being pressed against a workpiece. ing.

  In the press-type microstructure transfer molding apparatus as described above, the molding is performed in a state where the molded body is heated to a temperature higher than the glass transition temperature thereof, and then the molded body that has been transferred and molded is subjected to the glass transition temperature. It must be cooled to the following temperature and peeled off from an adherent substrate such as a stamper. This peeling is not easy, and there is a problem that the fine structure is damaged when the object to be molded is peeled off from the adhesion substrate. On the other hand, if the mold temperature is lowered until the adhesion force between the molded body and the adherent substrate is reduced to such an extent that the molded body can be easily peeled off, there is a problem that the productivity is deteriorated. There is also a problem that the difference in heat shrinkage between the molds becomes large, causing damage to the microstructure.

  In order to solve the problem in peeling off the transfer-molded molded body from the adherent substrate, various proposals using the temperature dependence of the adhesion force and the difference in thermal shrinkage between the molded body and the adherent substrate have been proposed. Has been made. For example, in Patent Document 1, in the method of manufacturing an optical article using a molding die, when the optical article is released from the molding die, a local portion is bonded to the joint between the molding die and the optical article. Producing an optical article characterized in that a temperature difference is applied to locally peel off the joint, and a release area due to the local temperature difference is sequentially expanded to release the entire area to produce an optical article. A method has been proposed.

  Patent Document 2 discloses a transfer method for transferring a microstructure formed on a stamper to a molding member, pressing the microstructure of the stamper against the molding member, and transferring the microstructure to the molding member. A transfer method is proposed in which the microstructure of the stamper is repeatedly cooled and heated at a temperature equal to or lower than the glass transition point of the molding member to promote mold release of the molding member from the stamper. ing.

  Patent Document 3 is characterized in that, in a method of molding an optical disk, when a resin molded product is peeled from a mold after molding, the stamper side peels using a substrate contraction generated by blowing to the molded product. A method for forming an optical disk has been proposed.

  In Patent Document 4, in addition to the use of the temperature dependency of the adhesive force and the difference in thermal shrinkage between the molded body and the adherent substrate, and the promotion of peeling by air blow, the adherent substrate is further deformed to promote the peeling of the molded body. A method to do so has been proposed. That is, a method for removing a polymerized contact lens product from a contact lens mold member, the method comprising: compressing a part of the contact lens mold member that is in contact with the polymerized contact lens product; and inserting a gas toward the polymerized contact lens product. And facilitating separation of the polymerized contact lens product from the portion of the contact lens mold member.

  Patent Document 5 discloses a press-type microstructure transfer molding apparatus that is provided with a mechanism for mechanically peeling a fine structure from an adhesion base using a spring force, and peels using a thermal and mechanical force. Has been proposed. That is, a thermal transfer press that has a press fixed part and a press movable part, and heat-transfers by pressing a stamper on which a desired pattern is formed on a workpiece placed between the press fixed part and the press movable part. In the molding apparatus, at least one of the press fixed portion and the press movable portion has a stamper holding portion to which the stamper can be attached, and the stamper holding portion is configured to transfer the molded object after thermal transfer in contact with the stamper. There has been proposed a thermal transfer press molding apparatus that includes a knockout pin that can be extruded in a direction away from the stamper, and the knockout pin has an air ejection portion that can eject air in the vicinity of a position where the molding can be extruded. Yes.

  In Patent Document 6, air is blown to the edge of a molded body attached to the adherent substrate, so that the parts to be peeled and the order of the peeling are separated when the molded body on which the microstructure has been transferred is peeled from the attached substrate. There has been proposed a peeling jig that can quickly peel the object to be molded from the adherent substrate without damaging the transferred microstructure.

JP 2002-59440 JP JP 2009-274237 A JP 2007-242090 JP 2007-320315 A JP 2008-254353 A JP 2012-35447 A

  However, the method of peeling the molding body from the adhesion substrate using the temperature dependence of the adhesion force between the molding body and the adhesion substrate and the difference in thermal shrinkage gives a local thermal gradient to the molding body and the adhesion substrate. There is a problem that it is not easy to control the part to be originally peeled and the order of the peeling, and there is a possibility that the fine structure of the molded body may be locally damaged.

  Furthermore, the peeling method described in Patent Document 1 or 2 has a problem that it takes time for peeling. The peeling method described in Patent Document 3 has the advantage that acceleration of peeling by air blow to the adhesion portion of the molded body can be promoted, and the peeling method described in Patent Document 4 can further be expected to promote peeling due to deformation of the adhered substrate. There is a need for a peeling method that can rapidly peel without damaging the fine structure formed by one-layer transfer molding.

  The thermal transfer press molding apparatus described in Patent Document 5 uses the temperature dependency of the adhesion force between the molded body and the adhesion substrate and the difference in thermal shrinkage, promotes peeling by air blow to the adhesion portion of the molding object, There is an advantage that peeling of the object to be molded from the adherent substrate can be performed quickly by promoting peeling by use. However, since the spring force acts uniformly on the knockout pin contact part of the molded object, it is not easy to control the part to be peeled off and the order of the peeling, and when peeling starts or when peeling progresses In addition, there is a problem that the balance of the spring force is lost due to the form of the peeling, and local damage is likely to occur in the transferred microstructure. In addition, there is a problem that a knockout pin and its operating mechanism must be provided for each mold. In addition, a hole for a knockout pin must be provided in the stamper or the like, and there is a problem that the resin for the molded body enters into the hole portion to hinder the operation of the knockout pin and impair the product quality. In die design, the product shape, the arrangement of knockout pins, and the like must be taken into consideration, and there are problems that the target products that can be manufactured are limited due to cost problems, and that it is difficult to produce a variety of small quantities.

  In addition, an increasingly thin article is required, and a finer structure is required. For this reason, it is difficult to peel the thin molded body without damaging the fine structure. In the method described in Patent Document 6, in order to hold the molded body and peel it from the adhered substrate, it is necessary to grip a certain size (area) or more, and damage the microstructure of the thin molded body. Therefore, there is a problem that it is not always easy to safely peel off the adhered substrate.

  In view of such conventional problems, the present invention makes it possible to quickly and safely form a molded body without damaging the microstructure of the molded body on which the microstructure is transferred and molded even if it is a thin molded body. It is an object of the present invention to provide a peeling jig and a peeling method capable of peeling from an attached substrate.

  The peeling jig according to the present invention is a molded body in which the microstructure is transferred and molded by a press-type microstructure transfer molding apparatus having a pair of upper and lower molds provided with a stamper having a microstructure. Is a peeling jig for peeling the stamper from the upper die or the lower die, the scissor means for sandwiching the edge of the molded body, and the stamper, the upper mold to which the molded body is attached. A peeling means for separating from the mold or the lower mold; and a collecting means for receiving and recovering the molded object peeled off from the stamper, the upper mold or the lower mold.

  In the above invention, the scissor means is preferably provided with a rubber member on one side or both sides contacting the edge of the molded body.

  Moreover, it is good to have an air injection means which sprays air on the edge of a to-be-molded body. The air injection means can further blow air onto the central portion of the molded body.

  Moreover, it is good for the to-be-molded body to be provided with the overhang | projection part pinched | interposed into a scissors means at the edge.

  The peeling method according to the present invention includes a press-type microstructure transfer molding apparatus having a pair of upper mold and lower mold provided with a stamper having a microstructure. This is a peeling method for peeling from an attached stamper, upper mold or lower mold, and after the microstructure is transferred and molded to the molded body, the upper mold or the lower mold is cooled to be molded. The upper and lower molds are opened by adjusting the adhesion force so that the molded body adheres to any of the upper mold, the stamper or the lower mold as the substrate to which the molded body is attached. A step of cooling the workpiece attached to the adherent substrate by cooling the upper mold or the lower die, and sandwiching an edge of the workpiece, and from an edge of the sandwiched workpiece Peel off gradually and peel off the molded object A method, completely receives take peel peeled the molded body, and a, and recovering.

  In the invention of the peeling method, it is preferable that air is blown to the peeling portion when peeling the peel.

  According to the present invention, even if the molded object that has been transferred and molded is thin, the molded object can be quickly peeled off from the adherent substrate without damaging the microstructure. Further, the peeling jig according to the present invention can be easily attached to a press-type fine structure transfer molding apparatus because no work is performed on the mold. Furthermore, the peeling jig | tool which concerns on this invention can respond | correspond also about the molded article of various thickness and a magnitude | size by adjusting the operation position and stroke.

It is explanatory drawing which shows a mode that a fine structure is transcription-molded to a to-be-molded body by a press-type fine structure transfer molding apparatus. It is a schematic diagram which shows the peeling jig | tool which concerns on this invention. It is explanatory drawing which shows the state of the peeling peeling of a to-be-molded body, and the state which receives the to-be-molded body peeled off. It is explanatory drawing which shows the example of the time chart of cooling of a metal mold | die, air injection, and pinching operation | movement in the peeling method which concerns on this invention.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 shows a state in which a microstructure provided in a stamper is transferred and molded on a molded body by a press-type microstructure transfer molding apparatus. FIG. 2 shows an example of a peeling jig according to the present invention. This peeling jig is used for peeling a molded object transferred and molded by a press-type fine structure transfer molding apparatus from a stamper, an upper mold, or a lower mold to which it is attached.

  In the transfer molding, as shown in FIG. 1 (a), the molten resin 8 is applied to the stamper 2 provided in the lower mold 1, and then the upper mold 5 is closed, and then the upper mold 5 and the lower mold 1 are moved. This is done by cooling. Then, a molded body is formed on which the microstructure 2a of the stamper 2 is transfer molded. In order to peel off the molded body, when the upper and lower molds are opened after the transfer molding, the upper mold, the stamper or the lower mold, which is easy to perform the peeling operation of the molded body, is determined as the adhesion base, and the molded body It is preferable that the upper and lower molds be opened with the material attached to the attached substrate. Thereby, peeling operation can be performed mechanically and work efficiency can be improved.

  In the example of FIG. 1, as shown in FIG. 1 (b), the upper and lower molds are opened with the molded body 9 peeled off from the stamper 2 and attached to the mirror plate 6 of the upper mold 5. It has become. That is, the mirror surface plate 6 is an adhesion base. In this way, in order to open the upper and lower molds with the molded body 9 attached to the attachment base, for example, when cooling the upper and lower molds, the temperature of the mirror plate 6 is set to the temperature of the stamper 2. By making it higher, the adhesion force of the molded body 9 to the mirror plate 6 is made larger than the adhesion force to the stamper 2, and the upper and lower molds are attached to the mirror plate 6 as shown in FIG. Make it open. Such adjustment of the adhesion force can also be performed by a process for adjusting the adhesion force of the upper mold, the stamper or the lower mold, for example, a plasma discharge irradiation process or a photo-ozone process. The fine structure can be provided in the lower mold or the upper mold itself, and a stamper having a fine structure can be provided in both the lower mold and the upper mold. In such a case, depending on the shape of the fine structure, the magnitude of the adhesion force is generated, so that the adhesion substrate can be determined by the magnitude.

  In the present invention, as shown in FIG. 1 (b), an overhanging portion 9a is provided on the edge of the molded body 9 in order to facilitate the sandwiching of the molded body with the peeling jig described below. Good. The overhanging portion 9a can have a portion and a shape suitable for being sandwiched by the peeling jig, and does not necessarily have to protrude from the mirror plate 6 to the outside. For example, in the case where there is a cut in the mirror surface plate 6, that portion can be a portion corresponding to the overhang portion. The overhanging portion 9a of the molded body 9 functions effectively when the molded body 9 is transported or stored after the stripping of the molded body 9 is completed. This is because by bringing only the overhanging portion 9a into contact with a conveying surface such as a conveyor, the fine structure portion of the molded body 9 can be transferred or stored in a non-contact manner.

  As shown in FIG. 2, the peeling jig 10 includes a base 11, and the base 11 is provided with a support base 12 and a support member 13. The base 11 is provided with an actuator 15, and by this actuator 15, the base 11, that is, the entire peeling jig 10 can be moved up and down, or moved to the work area or outside the work area.

  On the base 11, an opening / closing frame 21 that is opened / closed left / right by an opening / closing actuator 23 via a rod 22 is provided, and an opening / closing frame 21 is provided on the opening / closing frame 21 by an abutment actuator 25. A rubber member is provided at the tip of the abutting member 28. A receiving member 27 is provided on the top of the opening / closing frame 21 so as to face the abutting member 28. As shown in FIG. 2 (b), the receiving member 27 is provided at both ends of the protruding portion 9 a of the molded body 9. By the operation of the butting actuator 25, the receiving member 27 and the butting member 28 can cooperate to sandwich the overhanging portion 9a of the molded body 9. Even if the protruding portion 9a of the molded body 9 has some unevenness, the protruding portion 9a of the molded body 9 can be securely sandwiched by the elastic force and frictional force of the rubber member provided on the abutting member 28. .

  Further, the peeling jig 10 has an air injection means 30 that can blow air to the edge of the molded body 9. The air injection means 30 can inject air from the nozzles 35 (35A, 35B) by an air compressor (not shown). The nozzle 35A can inject air to the edge of the molded body 9, and the nozzle 35B can inject air to the center of the molded body 9. Further, the ejection of the nozzle 35A and the nozzle 35B can be controlled independently.

  This peeling jig 10 is used as follows. When the upper and lower molds are opened with the transfer molded object to be adhered to the adherent substrate as shown in FIG. 1, the peeling jig 10 is moved from outside the work area to the work area below the object to be molded. Insertion is started and peeling operation is started. As shown in FIG. 3A, the peeling operation is preferably performed by first blowing air to the edge of the molded body 9 by the air injection means 30. Thereby, peeling from the edge of the molded body 9 is promoted.

  Next, the open / close actuator 23 is operated to open the open / close frame 21, and the actuator 15 is operated to set the height of the receiving member 27 so that the lower surface of the receiving member 27 comes to the upper surface of the overhanging portion 9a of the molded body 9. To control. Then, the opening / closing actuator 23 and the abutting actuator 25 are actuated to close the opening / closing frame 21 and sandwich the overhanging portion 9a by the receiving member 27 and the abutting member 28 as shown in FIG. That is, in the case of this example, the actuator 15, the opening / closing actuator 23, the abutting actuator 25, the receiving member 27, and the abutting member 28 constitute scissors means for sandwiching the edge of the molded body 9.

  Next, as shown in FIG. 3 (c), the actuator 15 is operated to move the receiving member 27 and the abutting member 28 sandwiching the overhanging portion 9a downward, so that the overhanging portion 9a is attached. Peel off from the substrate (upper die 5 or mirror plate 6). In this peeling, the speed of the actuator 15 is controlled so that peeling is performed. That is, in the case of this example, the peeling means is constituted by the receiving member 27 sandwiching the protruding portion 9a of the molded body 9, the abutting member 28, and the actuator 15 that moves them in the direction of peeling them from the adhesion base. The Even during peel peeling, it is preferable to perform air injection so that air is injected between the adherent substrate and the peeled molded body 9. Thereby, peeling of the molded body 9 is promoted. Further, when air is also injected into the central portion of the molded body 9, peeling is further promoted.

  When the molded body 9 is completely peeled from the adherent substrate, the molded body 9 is supported in a state where the overhanging portion 9a is sandwiched between the receiving member 27 and the abutting member 28, as shown in FIG. Supported by member 13. The support member 13 has a size and a height position that do not damage the molded body 9 that has been completely peeled off, and an appropriate dimension is selected depending on the size, material, and the like of the molded body 9. It is also possible to support the peeled molded body 9 on the top of the support base 12 without providing the support member 13. After the molded body 9 is supported and received in this manner, the peeling jig 10 is moved to the outside of the work area by operating the actuator 15, and the molded body 9 is recovered as a finished product. That is, in the case of this example, the receiving means 27 and the abutting member 28 that sandwich the peeled molded body 9, the support member 13, and the actuator 15 constitute a recovery means.

  A time chart in the peeling operation is shown in FIG. As shown in FIG. 4, when the transfer molding is finished by cooling the upper and lower molds, the upper and lower molds are opened, and the peeling jig is inserted into the lower part of the object to be molded. And air injection is performed to the edge part and center part of a to-be-molded body, and peel peeling operation is started. When the peeling is completed, the peeled molded body is supported by the support member in a state in which the overhanging portion is sandwiched, transferred to the outside of the work area, and recovered, and the next cycle is started. In addition, it can also be made not to perform air blowing to the edge part or center part of a to-be-molded body. Moreover, the magnitude | size of the air injection pressure of the edge part and center part in FIG. 4 is for description, and does not show each actual air injection pressure.

  The present peeling jig 10 has been described above. According to the present peeling jig 10, it is possible to safely and quickly peel off a molded object that is thin and difficult to peel off. The peeling jig which concerns on this invention is not limited to said Example. For example, the scissor means for sandwiching the protruding portion of the molded body may be configured such that both the receiving member and the abutting member can move up and down. Further, the receiving member and the abutting member may be sandwiched by one receiving member and one abutting member, instead of being sandwiched between both ends of the overhang portion of the molded body. Moreover, when performing peel peeling operation | movement, it can also be made to move the receiving member and the butting member which pinched | interposed the overhang | projection part to the center direction of a metal mold | die.

  A production test of the molded body was performed using a peeling jig composed of the peeling jig shown in FIG. Peeling was performed by the above peel peeling. Styrenic resin (GPPS) manufactured by Toyo Styrene Co., Ltd. was used as the resin material of the molded body. The size of the object to be molded by transfer molding was 102 × 133 mm and the thickness was 500 μm. The microstructure provided in the stamper was a lattice shape with a line width of 30 μm and a line width of 10 μm. The size of the mirror plate was 102 × 128.6 mm. The protruding length of the molded body from the mirror plate (length of the protruding portion) was 2 to 5 mm. The transfer molding was performed at an upper mold temperature of 155 ° C., a lower mold temperature of 155 ° C., and a pressure of 9.9 MPa. Under the above conditions, 330 moldings were produced by performing transfer molding and peeling for 7 hours per day, and continued for 6 days. All of the manufactured molded articles had good quality, and no problem occurred in peeling.

1 Lower mold
2 Stamper
2a microstructure
5 Upper mold
6 Mirror plate
8 Molten resin
9 Molded body
9a Overhang
10 Peeling jig
11 base
12 Support base
13 Support member
15 Actuator
21 Open / close frame
22 Rod
23 Open / close actuator
25 Contact actuator
27 Receiving member
28 Abutting member
30 Air injection means
35, 35A, 35B nozzle

Claims (7)

A stamper and an upper die to which a workpiece to which the fine structure is transferred is attached by a press-type fine structure transfer molding device having a pair of upper and lower molds provided with a stamper having a fine structure. Or a peeling jig for peeling from the lower mold,
Scissor means for sandwiching the edge of the molded body, and a peeling means for separating the scissor means from the stamper, upper mold or lower mold to which the molded body is attached,
A stripping jig comprising: a collecting unit that receives and collects the molded body stripped from the stamper, the upper mold, or the lower mold.   The peeling jig according to claim 1, wherein the scissor means is provided with a rubber member on one side or both sides contacting the edge of the molded body.   The peeling jig according to claim 1, further comprising an air injection unit that blows air to an edge of the molded body.   The peeling jig according to claim 3, wherein the air jetting unit is further capable of blowing air to a central portion of the molded body.   The peeling jig according to any one of claims 1 to 4, wherein the molded body is provided with an overhanging portion sandwiched between scissor means at an edge thereof. A stamper and an upper die to which a workpiece to which the fine structure is transferred is attached by a press-type fine structure transfer molding device having a pair of upper and lower molds provided with a stamper having a fine structure. Or a peeling method for peeling from the lower mold,
After the fine structure is transferred and molded on the molded body, the upper mold or the lower mold is cooled to cool and solidify the molded body, and the upper mold is used as an adhesion base of the molded body, Opening the upper and lower molds by adjusting the adhesion force so that the molded object adheres to either the stamper or the lower mold; and
Cooling the molded body attached to the adherent substrate by cooling the upper mold or the lower mold, and sandwiching the edge of the molded body;
Gradually peeling off from the edge of the sandwiched molded object, peeling the molded object peel,
Receiving and recovering the molded article that has been completely peeled and peeled.   The peeling method according to claim 6, wherein air is blown onto the peeling portion when peel peeling.

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