JP2013132757A - 複合部材 - Google Patents
複合部材 Download PDFInfo
- Publication number
- JP2013132757A JP2013132757A JP2011282622A JP2011282622A JP2013132757A JP 2013132757 A JP2013132757 A JP 2013132757A JP 2011282622 A JP2011282622 A JP 2011282622A JP 2011282622 A JP2011282622 A JP 2011282622A JP 2013132757 A JP2013132757 A JP 2013132757A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- composite member
- oxide glass
- member according
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 66
- 239000000075 oxide glass Substances 0.000 claims abstract description 135
- 229920005989 resin Polymers 0.000 claims abstract description 65
- 239000011347 resin Substances 0.000 claims abstract description 65
- 229920001971 elastomer Polymers 0.000 claims abstract description 30
- 239000005060 rubber Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000001678 irradiating effect Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 56
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 36
- 239000000843 powder Substances 0.000 claims description 25
- 239000011521 glass Substances 0.000 claims description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- 230000007704 transition Effects 0.000 claims description 11
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 6
- 229910000314 transition metal oxide Inorganic materials 0.000 claims description 6
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 4
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims description 3
- 229910001392 phosphorus oxide Inorganic materials 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 3
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001935 vanadium oxide Inorganic materials 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 2
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001950 potassium oxide Inorganic materials 0.000 claims description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 abstract description 17
- 239000010408 film Substances 0.000 description 69
- 239000010410 layer Substances 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 229920000515 polycarbonate Polymers 0.000 description 16
- 239000004417 polycarbonate Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 13
- 239000002002 slurry Substances 0.000 description 11
- 238000005507 spraying Methods 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 9
- 238000004455 differential thermal analysis Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 230000035699 permeability Effects 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 150000002894 organic compounds Chemical class 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 2
- 238000004017 vitrification Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 108010049264 Teriparatide Proteins 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229940053641 forteo Drugs 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001290 polyvinyl ester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- OGBMKVWORPGQRR-UMXFMPSGSA-N teriparatide Chemical compound C([C@H](NC(=O)[C@H](CCSC)NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@@H](NC(=O)[C@H](CCC(O)=O)NC(=O)[C@H](CO)NC(=O)[C@@H](NC(=O)[C@@H](N)CO)C(C)C)[C@@H](C)CC)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC=1N=CNC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCSC)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C2=CC=CC=C2NC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CC=1N=CNC=1)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(O)=O)C1=CNC=N1 OGBMKVWORPGQRR-UMXFMPSGSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910001456 vanadium ion Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/12—Applying particulate materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
【解決手段】樹脂或いはゴムを含む基材1に酸化物ガラス2を層状かつ緻密に形成した複合部材であって、前記酸化物ガラスに電磁波を照射し、軟化流動させることによって、前記酸化物ガラスが前記基材へ接着されている。
【選択図】 図1
Description
2、4、6、32 酸化物ガラス
3 電磁波
5 樹脂或いはゴムの層
11 複合部材
12 太陽電池セル
13 バックシート
14 EVAシート
15 アルミニウム枠
21 裏面複合部材
22 有機発光ダイオード(OLED)
23 表面複合部材
24 封止材料
31 風力発電機用ブレード
41 樹脂キャップ
42 樹脂基板
43 素子
44 接合部
Claims (19)
- 樹脂或いはゴムを含む基材に酸化物ガラスを層状かつ緻密に形成した複合部材において、前記酸化物ガラスに電磁波を照射し、軟化流動させることによって、前記酸化物ガラスが前記基材へ接着されていることを特徴とする複合部材。
- 請求項1に記載された複合部材において、前記電磁波が、400〜1100nmの波長範囲にあるレーザであることを特徴とする複合部材。
- 請求項1に記載された複合部材において、前記電磁波が、0.1〜1000mmの波長範囲にあるマイクロ波であることを特徴とする複合部材。
- 請求項1ないし3のいずれかに記載された複合部材において、前記酸化物ガラスが前記基材を介して多層化されたことを特徴とする複合部材。
- 請求項1ないし4のいずれかに記載された複合部材において、前記酸化物ガラスの1層の平均膜厚が50μm以下であることを特徴とする複合部材。
- 請求項5に記載された複合部材において、前記酸化物ガラスの1層の平均膜厚が3〜20μmであることを特徴とする複合部材。
- 請求項1ないし6のいずれかに記載された複合部材において、前記酸化物ガラスが遷移金属酸化物を含み、転移点が330℃以下であることを特徴とする複合部材。
- 請求項1ないし7のいずれかに記載された複合部材において、前記酸化物ガラスが酸化バナジウム、酸化テルル及び酸化リンを含み、次の酸化物換算でV2O5、TeO2及びP2O5の合計が70〜95質量%であり、しかもV2O5>TeO2≧P2O5(質量%)であることを特徴とする複合部材。
- 請求項8に記載された複合部材において、前記酸化物ガラスがさらに酸化鉄、酸化タングステン、酸化モリブデン、酸化マンガン、酸化アンチモン、酸化ビスマス、酸化バリウム、酸化カリウム及び酸化亜鉛のうちいずれか1種以上を含むことを特徴とする複合部材。
- 請求項9に記載された複合部材において、前記酸化物ガラスが次の酸化物換算でV2O5が35〜55質量%、TeO2が15〜35質量%、P2O5が4〜20質量%、及びFe2O3、WO3、MoO3、MnO2、Sb2O3、Bi2O3、BaO、K2O、ZnOのうち1種以上が5〜30質量%であることを特徴とする複合部材。
- 樹脂或いはゴムを含む基材に、酸化物ガラスの粉末を塗布する工程と、電磁波を照射する工程と、前記酸化物ガラスの粉末を軟化流動させて層状かつ緻密な塗膜を前記基材上に形成する工程とを有し、前記酸化物ガラスは遷移金属酸化物を含み、転移点が330℃以下であることを特徴とする複合部材の製法。
- 請求項11に記載された複合部材の製法において、さらに前記塗膜上に前記樹脂或いはゴムの層を被覆する工程と、前記樹脂或いはゴムの層上に前記酸化物ガラスの粉末を塗布する工程と、前記電磁波を照射する工程と、前記酸化物ガラスの粉末を軟化流動させて層状かつ緻密な塗膜を前記樹脂或いはゴムの層上に形成する工程とを有することによって、前記塗膜と前記樹脂或いはゴムの層を多層化することを特徴とする複合部材の製法。
- 請求項11または12に記載された複合部材の製法において、前記電磁波が400〜1100nmの波長範囲にあるレーザであることを特徴とする複合部材の製法。
- 請求項2に記載された複合部材を備え、前記基材が透明な樹脂であり、前記塗膜の平均膜厚が3〜20μmであることを特徴とする窓。
- 請求項2に記載された複合部材を備え、前記基材が透明な樹脂であり、前記塗膜の平均膜厚が3〜20μmであることを特徴とする太陽電池モジュール。
- 請求項2に記載された複合部材を備え、前記基材が透明な樹脂であり、前記塗膜の平均膜厚が3〜20μmであることを特徴とする画像表示装置。
- 風力発電機に使用するブレードに請求項2に記載された複合部材を備え、前記塗膜の平均膜厚が10〜50μmであることを特徴とする風力発電機用ブレード。
- 基板とキャップとで形成された空間に素子が設けられ、前記基板と前記キャップとの接触部分に請求項2に記載された複合部材を備え、前記塗膜の平均膜厚が13〜20μmであり、前記レーザを前記複合部材に照射して前記空間が密封されていることを特徴とするパッケージ電子部品。
- 食糧庫内に設置された樹脂パネルに請求項2に記載された複合部材を備え、前記塗膜の平均膜厚が3〜20μmであることを特徴とする食糧庫用パネル。
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JP2011282622A JP5487193B2 (ja) | 2011-12-26 | 2011-12-26 | 複合部材 |
US14/367,744 US20150017409A1 (en) | 2011-12-26 | 2012-11-21 | Composite member |
CN201280062511.5A CN103998235A (zh) | 2011-12-26 | 2012-11-21 | 复合部件 |
PCT/JP2012/080119 WO2013099478A1 (ja) | 2011-12-26 | 2012-11-21 | 複合部材 |
TW101144462A TW201343271A (zh) | 2011-12-26 | 2012-11-28 | 複合構件 |
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JP2011282622A JP5487193B2 (ja) | 2011-12-26 | 2011-12-26 | 複合部材 |
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JP5487193B2 JP5487193B2 (ja) | 2014-05-07 |
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US (1) | US20150017409A1 (ja) |
JP (1) | JP5487193B2 (ja) |
CN (1) | CN103998235A (ja) |
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WO (1) | WO2013099478A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9708460B2 (en) | 2011-12-26 | 2017-07-18 | Hitachi, Ltd. | Composite material |
US9796821B2 (en) | 2011-12-26 | 2017-10-24 | Hitachi, Ltd. | Composite material |
Families Citing this family (5)
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JP2015063445A (ja) * | 2013-08-29 | 2015-04-09 | セントラル硝子株式会社 | 無鉛ガラス及び封着材料 |
JP6022070B2 (ja) * | 2014-10-02 | 2016-11-09 | Yejガラス株式会社 | 局所加熱封着用バナジウム系ガラス材とこれを用いたフラットディスプレイ及び該ディスプレイの製造方法 |
JP2018507836A (ja) * | 2015-01-28 | 2018-03-22 | コーニング インコーポレイテッド | ガラスフリット及びガラスフリットを用いて封止されたガラス組立体 |
CN107949903B (zh) | 2015-09-18 | 2022-10-14 | 国立大学法人北陆先端科学技术大学院大学 | 复合部件及复合部件的制造方法及含有脂肪族聚碳酸酯的层 |
CN114015961A (zh) * | 2021-11-05 | 2022-02-08 | 陕西科技大学 | 一种双金属氧化物润滑复合涂层及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5621737B2 (ja) * | 1974-02-21 | 1981-05-21 | ||
JP2006269984A (ja) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
JP2006299145A (ja) * | 2005-04-22 | 2006-11-02 | Konica Minolta Holdings Inc | ガスバリア性フィルム、ガスバリア性フィルムを用いた有機エレクトロルミネッセンス用樹脂基材および有機エレクトロルミネッセンス素子 |
JP2006527649A (ja) * | 2003-06-17 | 2006-12-07 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | マイクロ波付着による金属酸化物コーティド有機材料の製造方法 |
JP2010184852A (ja) * | 2009-01-16 | 2010-08-26 | Hitachi Powdered Metals Co Ltd | 低融点ガラス組成物、それを用いた低温封着材料及び電子部品 |
WO2011055856A1 (ja) * | 2009-11-05 | 2011-05-12 | 住友金属鉱山株式会社 | 透明導電膜の製造方法及び透明導電膜、それを用いた素子、透明導電基板並びにそれを用いたデバイス |
JP2011116619A (ja) * | 2009-11-07 | 2011-06-16 | Ohara Inc | 複合体及びその製造方法、光触媒機能性部材、及び親水性成部材 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
CN101384952B (zh) * | 2006-02-09 | 2010-08-25 | 旭硝子株式会社 | 光学部件及其制造方法 |
KR100787463B1 (ko) * | 2007-01-05 | 2007-12-26 | 삼성에스디아이 주식회사 | 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법 |
JP5793302B2 (ja) * | 2007-10-05 | 2015-10-14 | コーニング インコーポレイテッド | ガラスパッケージを封止する方法および装置 |
JP2010052990A (ja) * | 2008-08-28 | 2010-03-11 | Yamato Denshi Kk | 封着用無鉛ガラス材とこれを用いた有機elディスプレイパネル |
US20100095705A1 (en) * | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
WO2011114335A1 (en) * | 2010-03-17 | 2011-09-22 | Hanita Coatings R.C.A. Ltd | Polymeric substrate with laminated glass layer |
-
2011
- 2011-12-26 JP JP2011282622A patent/JP5487193B2/ja not_active Expired - Fee Related
-
2012
- 2012-11-21 CN CN201280062511.5A patent/CN103998235A/zh active Pending
- 2012-11-21 US US14/367,744 patent/US20150017409A1/en not_active Abandoned
- 2012-11-21 WO PCT/JP2012/080119 patent/WO2013099478A1/ja active Application Filing
- 2012-11-28 TW TW101144462A patent/TW201343271A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5621737B2 (ja) * | 1974-02-21 | 1981-05-21 | ||
JP2006527649A (ja) * | 2003-06-17 | 2006-12-07 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | マイクロ波付着による金属酸化物コーティド有機材料の製造方法 |
JP2006269984A (ja) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
JP2006299145A (ja) * | 2005-04-22 | 2006-11-02 | Konica Minolta Holdings Inc | ガスバリア性フィルム、ガスバリア性フィルムを用いた有機エレクトロルミネッセンス用樹脂基材および有機エレクトロルミネッセンス素子 |
JP2010184852A (ja) * | 2009-01-16 | 2010-08-26 | Hitachi Powdered Metals Co Ltd | 低融点ガラス組成物、それを用いた低温封着材料及び電子部品 |
WO2011055856A1 (ja) * | 2009-11-05 | 2011-05-12 | 住友金属鉱山株式会社 | 透明導電膜の製造方法及び透明導電膜、それを用いた素子、透明導電基板並びにそれを用いたデバイス |
JP2011116619A (ja) * | 2009-11-07 | 2011-06-16 | Ohara Inc | 複合体及びその製造方法、光触媒機能性部材、及び親水性成部材 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9708460B2 (en) | 2011-12-26 | 2017-07-18 | Hitachi, Ltd. | Composite material |
US9796821B2 (en) | 2011-12-26 | 2017-10-24 | Hitachi, Ltd. | Composite material |
Also Published As
Publication number | Publication date |
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US20150017409A1 (en) | 2015-01-15 |
JP5487193B2 (ja) | 2014-05-07 |
WO2013099478A1 (ja) | 2013-07-04 |
TW201343271A (zh) | 2013-11-01 |
CN103998235A (zh) | 2014-08-20 |
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