JP2013130888A - Method of manufacturing electronic device member and electronic device, and electronic device member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of favorably manufacturing an electronic device member that is capable of suppressing the separation of a seal part and damage to a substrate and is used for manufacturing an electronic device.SOLUTION: In a method of manufacturing an electronic device member, in addition to a seal part provided between a pair of substrates, an adhesion part for adhesion of the pair of substrates is provided separately from the seal part outside the seal part. Thus, when peeling a support structure bonded to the substrate, from the substrate, peeling of the seal part and damage to the pair of substrates are suppressed.

Description

  The present invention relates to an electronic device member, an electronic device manufacturing method, and an electronic device member.

  In recent years, electronic devices such as mobile phones, smartphones, portable information terminals, electronic book terminals, and portable game machines have been downsized, and electronic devices such as liquid crystal display panels, OLEDs (Organic Light Emitting Diodes), and electronic papers used in these devices have been developed. Devices are becoming thinner and lighter, and glass substrates used in these electronic devices are also becoming thinner. However, due to the reduction in the thickness of the glass substrate, there is a problem that the strength of the glass substrate is lowered and the handling property of the glass substrate in the manufacturing process of the electronic device is lowered.

  For this reason, conventionally, after forming various elements using a glass substrate thicker than the final plate thickness, a method of thinning the glass substrate by chemical etching is employed. However, according to such a method, for example, when the thickness of the glass substrate is reduced from 0.7 mm to 0.2 mm or 0.1 mm, most of the original glass substrate material must be removed with an etching solution. In view of productivity and efficiency of use of raw materials, it is not always preferable.

  In addition, in the thinning of the glass substrate by chemical etching, when a fine scratch is present on the surface of the glass substrate, a fine depression (etch pit) starting from the scratch is formed by the etching process, and optically May be defective.

  In order to cope with the above problems, attempts have been made to use a thin glass substrate having a final plate thickness from the beginning. Specifically, a glass substrate is laminated on a support structure called a reinforcing plate to form a laminate, and various elements are formed on the surface of the glass substrate in the state of the laminate. Has been proposed (see, for example, Patent Document 1). The support structure includes a support plate and an adsorbent layer fixed on the support plate, and the glass substrate is detachably adhered to the adsorbent layer. Finally, the support structure is peeled off from the glass substrate, and a new glass substrate is laminated on the peeled support structure and reused.

Japanese Patent Laid-Open No. 8-86993

  Specifically, the liquid crystal display panel member, which is a kind of electronic device member, can be manufactured by the following method using the above laminate. In addition, the case where a liquid crystal dropping bonding system (ODF: One Drop Fill) is employ | adopted is shown below.

  First, two stacked bodies are prepared, and a thin film transistor (TFT) is formed in a predetermined element forming region of one stacked body, and a color filter (CF) is formed in the element forming region of the other stacked body corresponding to the element forming region. ). Next, a resinous sealing material is applied so as to surround an element formation region of one of the stacked bodies, and liquid crystal is dropped inside the frame-shaped sealing material. Then, the laminated body on the TFT side and the laminated body on the CF side are laminated in a reduced-pressure atmosphere and then exposed to atmospheric pressure, whereby these laminated bodies are brought into close contact with each other.

  The sealing material is cured by irradiating ultraviolet rays or the like to form a seal portion. Thereafter, the support structure is peeled off from each laminated body, thereby producing a liquid crystal display panel member having one or more element forming regions to be a liquid crystal display panel. Thereafter, a plurality of liquid crystal display panels are produced by cutting the glass substrate for each element formation region.

  However, in the case of the above method, when the support structure is peeled from the liquid crystal display panel member, the support structure is not necessarily peeled between the liquid crystal display panel member and the support structure. May peel between the glass substrate and the seal portion, and damage such as cracking may occur in the glass substrate. When peeling of the seal portion or damage to the glass substrate occurs in the liquid crystal display panel member, the liquid crystal display panel member cannot be used for manufacturing the liquid crystal display panel.

  The present invention has been made to solve the above-described problems, and can suppress the peeling of the seal portion and the damage of the glass substrate at the time of peeling of the support structure, and can be used for manufacturing an electronic device such as a liquid crystal display panel. It aims at providing the manufacturing method which can manufacture the member for electronic devices favorably. It is another object of the present invention to provide a method for manufacturing an electronic device that does not damage the glass substrate when the support structure is peeled, and a high-quality electronic device member.

  The manufacturing method of the member for electronic devices of this invention has a sealing process and a peeling process. In the sealing step, a seal structure having a first laminate, a second laminate, and a seal portion is manufactured. The first stacked body includes a first substrate and a first support structure that is detachably bonded to the first substrate. The second stacked body is disposed to face the first stacked body, and includes a second substrate and a second support structure that is detachably bonded to the second substrate. The seal portion is provided so as to surround an element formation region serving as an electronic device between the first stacked body and the second stacked body. In the peeling step, the first support structure and the second support structure are peeled from the seal structure. In the manufacturing method of the member for electronic devices of this invention, the adhesion part which adhere | attaches a 1st laminated body and a 2nd laminated body is provided in the outer side of a seal | sticker part. Thereby, peeling of the seal part in the peeling step and damage to the first substrate and the second substrate are suppressed.

  The manufacturing method of the electronic device of this invention has a member manufacturing process and a division | segmentation process. A member manufacturing process manufactures the member for electronic devices by the manufacturing method of the member for electronic devices of this invention. In the dividing step, an electronic device is manufactured by dividing the electronic device member.

  The electronic device member of the present invention has a pair of laminated bodies, a seal portion, and an adhesive portion. The pair of stacked bodies includes a substrate having one or more element formation regions on which electronic devices are formed, and a support structure that is detachably bonded to the substrate, and the substrates are arranged to face each other. . The seal portion is provided around the element formation region between the pair of stacked bodies. The adhesive portion is disposed outside the gathering region of the seal portion.

  According to the present invention, by providing an adhesive portion separately from the seal portion outside the seal portion, it is possible to suppress peeling of the seal portion and breakage of the glass substrate when the support structure is peeled from the seal structure in the peeling step. it can.

The top view which shows one Embodiment of the member for electronic devices. The AA sectional view taken on the line of the member for electronic devices shown in FIG. Explanatory drawing explaining the peeling method of the member for electronic devices shown in FIG. The top view which shows the modification of the member for electronic devices. The top view which shows the other modification of the member for electronic devices.

Hereinafter, embodiments of the present invention will be described.
The manufacturing method of the member for electronic devices of this embodiment has a sealing process and a peeling process.

  The sealing step becomes an electronic device between the first stacked body, the second stacked body disposed opposite to the first stacked body, and the first stacked body and the second stacked body. A seal structure having a seal portion provided so as to surround the element formation region is manufactured.

  The first stacked body includes a first substrate and a first support structure that is detachably bonded to the first substrate. The second stacked body includes a second substrate and a second support structure that is detachably bonded to the second substrate.

  In the peeling step, the first support structure and the second support structure are peeled from the seal structure.

  In the method for manufacturing an electronic device member according to the present embodiment, in particular, by providing an adhesive portion that bonds the first laminate and the second laminate outside the seal portion, the seal portion is peeled and separated in the peeling step. It is characterized by suppressing breakage of the first substrate and the second substrate.

  According to the method for manufacturing an electronic device member of the present embodiment, in the sealing step, a seal portion is provided between a pair of substrates to be the electronic device member, and the seal portion is provided outside the seal portion. An adhesive part is provided. Note that the seal portion and the adhesive portion may be provided in the same process, or may be provided in separate processes.

  When the support structure is peeled from each substrate of the seal structure, an adhesive part is provided in the vicinity of the seal part, so that stress applied locally to the seal part can be reduced. The peeling of the seal portion, that is, the peeling between the substrate and the seal portion can be suppressed. Further, since the adhesive portion is provided in the vicinity of the seal portion in addition to the seal portion, the stress applied locally to the substrate can be reduced, and the substrate can be prevented from being damaged.

  Hereinafter, the manufacturing method of the member for electronic devices of this embodiment is demonstrated with reference to drawings. First, the seal structure manufactured in the sealing process will be described.

  FIG. 1 is a plan view showing an example of a seal structure, and FIG. 2 is a cross-sectional view taken along line AA. Moreover, FIG. 3 is explanatory drawing explaining the peeling method of a seal structure.

  The seal structure 10 is used for manufacturing the electronic device member 20, and has a portion that becomes the electronic device member 20 in a part thereof as shown in FIG. 2. The seal structure 10 includes a first laminate 11, a second laminate 12, a seal portion 13, and an adhesive portion 14.

  Although not shown, the inside of the electronic device member 20 is filled with a filling material as necessary, for example, liquid crystal when the electronic device member 20 is a liquid crystal display panel member. Further, when the electronic device member 20 is a liquid crystal display panel member, at the stage of the seal structure 10, liquid crystal may be filled inside the frame-shaped seal portion 13 according to the manufacturing method. The liquid crystal may not be filled. Further, spacers may be dispersed inside the seal portion 13. For example, when the liquid crystal dropping and bonding method is employed, the liquid crystal is filled inside the seal portion 13 in the seal structure 10. When the liquid crystal injection method is employed, the liquid crystal is generally not filled inside the seal portion 13 in the seal structure 10 and the liquid crystal is injected at a predetermined stage after the electronic device member 20 is formed.

  The first stacked body 11 and the second stacked body 12 are arranged to face each other with a space therebetween. The plurality of seal portions 13 are provided between the first stacked body 11 and the second stacked body 12 so as to surround an element forming region R to be an electronic device such as a liquid crystal display panel. In the seal structure 10 shown in FIG. 1, six frame-shaped seal portions 13 are provided corresponding to the six element formation regions R.

  The first stacked body 11 includes a first substrate 111 and a first support structure 112 that is detachably bonded to the first substrate 111. The first support structure 112 further includes a first support plate 113 and a first adsorption layer 114 provided on one main surface of the first support plate 113. The first support structure 112 is detachably bonded to the first substrate 111 by the first adsorption layer 114.

  In addition, although the support structure 112 of this embodiment is comprised with the support plate 113 and the adsorption layer 114, you may be comprised only with the support plate 113. FIG. For example, the support plate 113 and the first substrate 111 may be detachably coupled by van der Waals force acting between the support plate 113 and the first substrate 111. In addition, when the support plate 113 and the first substrate 111 are heated, an inorganic thin film such as ITO, SiN, SiC, or the like may be formed on the surface of the support plate 113 so that they do not adhere at high temperatures. . In addition, by providing regions with different surface roughnesses on the surface of the support plate 113, regions with different bonding forces may be provided at the interface between the support plate 113 and the first substrate 111. In addition, the support structure 112 according to the present embodiment includes one support plate 113 and one adsorption layer 114, but there may be a plurality of support plates 113. Similarly, there may be a plurality of adsorption layers 114. May be.

  The second stacked body 12 includes a second substrate 121 and a second support structure 122 that is detachably bonded to the second substrate 121. The second support structure 122 further includes a second support plate 123 and a second adsorption layer 124 provided on one main surface of the second support plate 123. The second support structure 122 is detachably bonded to the second substrate 121 by the second adsorption layer 124. Also about the 2nd laminated body 12, it may be comprised only with the support plate 123, inorganic thin films, such as ITO, SiN, SiC, may be formed, and the area | region where surface roughness differs may be provided. .

  Note that portions of the seal structure 10 excluding the first support structure 112 and the second support structure 122, that is, the first substrate 111, the second substrate 121, and the portion between them are arranged. The seal part 13, the adhesive part 14, and the like serve as an electronic device member 20 used for manufacturing an electronic device such as a liquid crystal display panel.

  The 1st laminated body 11 and the 2nd laminated body 12 are arrange | positioned so that the 1st board | substrate 111 and the 2nd board | substrate 121 may oppose. In the case where the electronic device member 20 is a liquid crystal display panel member, although not shown in the element formation region to be a liquid crystal display panel on the surface of the first substrate 111 and the second substrate 121, depending on the liquid crystal display method, Further, an insulating film, a transparent electrode film, a switching element such as a thin film transistor (TFT) or a thin film diode (TFD), a color filter (CF), or the like is formed as necessary.

  The seal portion 13 is provided in a frame shape between the first stacked body 11 and the second stacked body 12 so as to surround an element forming region R that becomes an electronic device such as a liquid crystal display panel. The stacked body 11 and the second stacked body 12 are bonded. The seal portion 13 is formed according to the number of element formation regions R. As shown in the figure, a plurality of seal formations 13 are formed when there are a plurality of element formation regions R, and one seal portion 13 is formed when there is only one element formation region R. Only formed.

  When the electronic device member 20 is a liquid crystal display panel member, the seal portion 13 may be filled with liquid crystal or may not be filled. When manufactured by the liquid crystal dropping and bonding method, the seal portion 13 in the seal structure 10 is filled with liquid crystal, and the shape of each seal portion 13 does not have an opening to hold the liquid crystal inside. It is a continuous frame. On the other hand, when manufactured by the liquid crystal injection method, the seal portion 13 in the seal structure 10 is generally not filled with liquid crystal, and the shape of each seal portion 13 is for injecting liquid crystal into the interior in a later step. It is made into the frame shape which has the opening part used as an injection port.

  The bonding portion 14 bonds the first stacked body 11 and the second stacked body 12 outside the seal portion 13, and connects the first support structure 112 and the second support structure 122 from the seal structure 10. At the time of peeling, the shape and the arrangement are such that damage to the portion that becomes the electronic device member 20, specifically, peeling of the seal portion 13 and damage to the first substrate 111 and the second substrate 121 can be suppressed. That is, the shape, arrangement, and the like of the bonding portion 14 are not particularly limited as long as damage to the portion that becomes the electronic device member 20 at the time of peeling can be suppressed.

  For example, as shown in FIG. 1, the bonding portion 14 is provided linearly along the seal portion 13 and along the outer circumferences of the first stacked body 11 and the second stacked body 12. For example, when the seal structure 10 is rectangular, the seal structure 10 is provided so as to extend in the long side direction of the seal structure 10 between the long side of the seal structure 10 and the seal portion 13 adjacent thereto. The seal structure 13 is provided between the seal portions 13 in the short side direction of 10 so as to extend in the long side direction of the seal structure 10.

  In such a seal structure 10, for example, as shown in FIG. 3, the first support structure 112 is peeled from one end side. Specifically, the seal structure 10 is gradually peeled from one corner to the opposite corner. At this time, since the adhesive portion 14 is provided in the vicinity of the seal portion 13, the separation boundary line L between the already peeled portion and the portion to be peeled and which is subject to stress is applied to the seal portion. 13 is located on the adjacent bonding portion 14 at the same time. Thereby, it can suppress that stress is locally applied only to a part of seal part 13, peeling of seal part 13, specifically peeling of the 1st substrate 111 and seal part 13, and the 2nd board The peeling between 121 and the seal portion 13 can be suppressed. Similarly, local stress can be suppressed from being applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed.

  When the frame-shaped sealing material that becomes the frame-shaped seal portion 13 is placed under reduced pressure and then returned to atmospheric pressure, the inside of the frame is crushed by atmospheric pressure. As a result, the width of the linear portion of the sealing material is increased, and the first substrate 111 and the second substrate 121 are firmly bonded. Further, since the inside of the frame is crushed, the first substrate 111 and the second substrate 121 are partially separated at the time of separation, or the first substrate 111 or the second substrate 121 is deformed and cracked. Can be prevented. Therefore, as shown in FIG. 3, when the support structures 112 and 122 are peeled off, peeling / breaking of the seal portion 13 can be suppressed.

  Note that the second support structure 122 can be peeled basically in the same manner, and the same effect can be obtained. Moreover, as a peeling method of the support structures 112 and 122, the method disclosed in WO2011 / 024689 can be used.

  When the linear bonding portion 14 is provided, in the long side direction of the seal structure 10, it is provided in the same region as the region where the seal portion 13 is provided, or in a region longer than that. It is preferred that Specifically, as shown in FIG. 1, when three seal portions 13 are provided in the long side direction of the seal structure 10, a region similar to the region where these three seal portions 13 are provided. It is preferable that the same length or longer than that is provided. By providing in such a region and length, for example, when the second support structure 122 is peeled from one corner as shown in FIG. 3, the peeling boundary line L is positioned on the seal portion 13. At the same time, it is also located on the bonding portion 14, and it is possible to suppress local stress from being applied only to a part of the seal portion 13, peeling of the seal portion 13, and the first glass substrate 111 and the second glass substrate 121. Can be prevented from being damaged.

  Further, when the linear adhesive portion 14 is provided, the adhesive portion 14 provided between the long side of the seal structure 10 and the seal portion 13 adjacent to the long side has a distance from the seal portion 13 of 10 mm. It is preferable to be provided inside. By shortening the distance from the seal part 13 to the adhesion part 14, peeling of the seal part 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the seal portion 13 is more preferably within a range of 5 mm, and further preferably within a range of 3 mm. Note that the distance between the adhesive portion 14 and the seal portion 13 is not necessarily constant, and may be different in the length direction of the linear adhesive portion 14, but as a whole is within the above range. preferable. Further, the shorter the distance from the seal portion 13 to the adhesive portion 14, the better. However, the adhesive portion 14 is preferably provided so as not to contact the seal portion 13. Here, the distance from the seal part 13 to the adhesive part 14 is a distance between the side part of the seal part 13 and the side part of the adhesive part 14.

  In the case where the linear bonding portion 14 is provided, it is preferably provided at least between the long side of the seal structure 10 and the seal portion 13 adjacent to the long side, but the seal portion 13 in the short side direction of the seal structure 10 is provided. It is preferable to provide them between each other. When three or more seal portions 13 are provided in the short side direction of the seal structure 10, it is preferably provided between all the seal portions 13. The adhesive part 14 provided between the seal parts 13 in the short side direction of the seal structure 10 is the center of the seal parts 13 from the viewpoint of equalizing stress on the seal parts 13 located on both sides of the adhesive part 14. It is preferable to be provided in the part.

  The width of the linear bonding portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded to each other by the bonding portion 14, and the seal portion 13 is peeled off and the first substrate 111 and the second substrate are bonded. 121 can be effectively prevented from being damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. If the width is usually about 0.1 mm, the first substrate 111 and the second substrate 121 can be sufficiently bonded to each other. From the viewpoint of productivity, the width is preferably 5 mm or less, and more preferably 3 mm or less.

  FIG. 4 is a plan view showing a modification of the seal structure 10, and in particular, a plan view showing a modification of the bonding portion 14.

  About this seal structure 10, the structure of those other than the adhesion part 14, ie, the structure of the 1st laminated body 11, the 2nd laminated body 12, and the seal part 13, is the seal structure 10 shown in FIG. It is the same. The seal structure 10 is different in that the adhesive portion 14 is provided along the peripheral edge portions of the first stacked body 11 and the second stacked body 12 so as to surround the entire plurality of seal portions 13. Here, a frame-like region including the entirety of the plurality of seal portions 13 is a collective region.

  Also by providing a frame-shaped adhesive portion 14 so as to surround the whole of the plurality of seal portions 13, that is, the gathering region, the separation boundary line L as shown in FIG. 3 is located on the seal portion 13 and at the same time the adhesive portion 14. It is also located on the top, and it is possible to suppress local stress from being applied only to a part of the seal portion 13, and peeling of the seal portion 13, specifically, between the first glass substrate 111 and the seal portion 13. Peeling and peeling between the second glass substrate 121 and the seal portion 13 can be suppressed. Similarly, local stress can be suppressed from being applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed.

  When the frame-shaped adhesive portion 14 is provided, the adhesive portion 14 provided between the long side of the seal structure 10 and the seal portion 13 adjacent to the long side is within a distance of 10 mm from the seal portion 13. It is preferable to be provided. By shortening the distance from the seal part 13 to the adhesion part 14, peeling of the seal part 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the seal portion 13 is more preferably within a range of 5 mm, and further preferably within a range of 3 mm. Note that the distance between the bonding portion 14 and the seal portion 13 is not necessarily constant, and may be different in the length direction of the bonding portion 14, but it is preferable that the distance is within the above range as a whole.

  Moreover, it is preferable that the adhesion part 14 provided between the short side of the seal structure 10 and the seal part 13 adjacent to the short side is provided within a range of 10 mm from the seal part 13. By reducing the distance from the seal part 13 to the adhesive part 14, peeling of the seal part 13 and damage to the first substrate 111 and the second substrate 121 can be effectively suppressed. The distance from the seal portion 13 is more preferably within a range of 5 mm, and further preferably within a range of 3 mm. It should be noted that the distance from the seal portion 13 is not necessarily constant, and may be different in the length direction of the bonding portion 14, but is preferably within the above range as a whole.

  The position of the bonding portion 14 is preferably closer to the outer periphery (end surface of the substrate) of the substrates 111 and 121. In addition, the bonding portion 14 is preferably a continuous linear pattern extending along the outer periphery of the substrates 111 and 121 rather than a discontinuous dot pattern. By doing in this way, it can control that seal part 13 exfoliates from glass substrates 111 and 121, or substrate 111 and 121 are damaged at the time of exfoliation of support structures 112 and 122. It is preferable that the distance L1 between the outer periphery of the substrates 111 and 121 and the linear portion of the bonding portion 14 is 10 mm or less in the state before the lamination in the lamination step.

  The width of the frame-shaped adhesive portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded to each other by the bonding portion 14, and the seal portion 13 is peeled off and the first substrate 111 and the second substrate are bonded. 121 can be effectively prevented from being damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. If the width is usually about 0.1 mm, the first substrate 111 and the second substrate 121 can be sufficiently bonded to each other. From the viewpoint of productivity, the width is preferably 5 mm or less, and more preferably 3 mm or less.

  FIG. 5 is a plan view showing another modified example of the seal structure 10, and in particular, a plan view showing a modified example of the bonding portion 14.

  Also for this seal structure 10, the configuration other than the adhesive portion 14, that is, the configuration of the first laminate 11, the second laminate 12, and the seal portion 13 is the same as that of the seal structure 10 shown in FIGS. It is the same. The seal structure 10 is different in that the adhesive portion 14 is provided so as to surround each of the plurality of seal portions 13.

  Also by providing the frame-shaped adhesive portion 14 so as to surround each of the plurality of seal portions 13, the separation boundary line L as shown in FIG. 3 is located on the seal portion 13 and at the same time on the adhesive portion 14. As a result, it is possible to suppress local stress from being applied only to a part of the seal portion 13, peeling of the seal portion 13, specifically, peeling between the first substrate 111 and the seal portion 13, Peeling between the substrate 121 and the seal portion 13 can be suppressed. Similarly, local stress can be suppressed from being applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed. In particular, by providing the frame-shaped adhesive portion 14 so as to surround each of the plurality of seal portions 13, the seal portion 13 is peeled off and the first substrate 111 and Damage to the second substrate 121 can be effectively suppressed.

  When providing the above-mentioned frame-shaped adhesion part 14, it is preferable that the adhesion part 14 is provided in the range whose distance from the seal part 13 is 10 mm. By reducing the distance from the seal part 13 to the adhesive part 14, peeling of the seal part 13 and damage to the first substrate 111 and the second substrate 121 can be effectively suppressed. The distance from the seal portion 13 is more preferably within a range of 5 mm, and further preferably within a range of 3 mm. It should be noted that the distance from the seal portion 13 is not necessarily constant and may be different in the length direction (circumferential direction) of the bonding portion 14, but is preferably within the above range as a whole.

  The width of the frame-shaped adhesive portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded to each other by the bonding portion 14, and the seal portion 13 is peeled off and the first substrate 111 and the second substrate are bonded. 121 can be effectively prevented from being damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. If the width is usually about 0.1 mm, the first substrate 111 and the second substrate 121 can be sufficiently bonded to each other. From the viewpoint of productivity, the width is preferably 5 mm or less, and more preferably 3 mm or less.

  The representative shape and the like of the bonding portion 14 have been described above. The shape and the like of the bonding portion 14 is not limited to the electronic structure when the first support structure 112 and the second support structure 122 are peeled from the seal structure 10. There is no particular limitation as long as the shape and arrangement can prevent damage to the device member 20, specifically, peeling of the seal portion 13 and damage to the first substrate 111 and the second substrate 121.

  For example, the bonding portion 14 is not limited to a portion surrounding the whole of the plurality of seal portions 13 as shown in FIG. 4 or a portion surrounding each of the seal portions 13 as shown in FIG. Of these, only a part of the adjacent seal portions 13 may be surrounded, or a lattice shape may be provided between each of the plurality of seal portions 13, and if necessary, the seal portion Each shape as described above can be combined according to the number and arrangement of the thirteen. Moreover, the linear or frame-shaped adhesion part 14 does not necessarily need to be comprised from the continuous linear part, and may be comprised from discontinuous linear parts, such as dotted line shape.

  As the first substrate 111 and the second substrate 121, glass plates having a plate thickness of 0.3 mm or less are preferably used. By setting the plate thickness to 0.3 mm or less, the liquid crystal display panel can be effectively reduced in weight. The sizes of the first substrate 111 and the second substrate 121 are not particularly limited. For example, the size is preferably 100 mm or more × 100 mm or more, and more preferably 500 mm or more × 500 mm or more. In particular, a size of 730 mm or more in length × 920 mm or more in width is preferable. By setting it as such a magnitude | size, a some liquid crystal display panel can be manufactured efficiently. Moreover, in the case of such a size, the effect by providing the adhesion part 14 separately from the seal part 13 is large. As such a 1st board | substrate 111 and the 2nd board | substrate 121, the well-known glass plate used for manufacture of a liquid crystal display panel is used.

  The glass plate is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a molding method may be a common one, and for example, a float method, a fusion method, a slot down draw method, a full call method, a rubber method, or the like is used. In particular, a thin glass plate can be obtained by suitably forming a glass plate that has been once formed into a plate shape by heating it to a moldable temperature and stretching and thinning it by means such as stretching (redraw method).

  The kind of glass plate is not necessarily limited, and non-alkali borosilicate glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide are preferable. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

Since elution of the alkali metal component tends to affect the liquid crystal, glass (alkali-free glass) substantially not containing the alkali metal component is particularly preferable. The alkali-free glass, in mass percentage based on _{oxides, SiO 2: 50~66%, Al} 2 O 3: 10.5~24%, B 2 O 3: 0~12%, MgO: 0~8 %, CaO: 0 to 14.5%, SrO: 0 to 24%, BaO: 0 to 13.5%, MgO + CaO + SrO + BaO: 9 to 29.5%, and ZnO: 0 to 5%.

When the content of SiO ₂ is less than 50%, the strain point cannot be sufficiently increased, the chemical durability is deteriorated, and the thermal expansion coefficient is increased. When it exceeds 66%, meltability will fall and devitrification temperature will rise. Preferably, it is 58-66 mol%.

Al ₂ O ₃ suppresses the phase separation of the glass, lowers the thermal expansion coefficient, and increases the strain point. If the content is less than 10.5%, this effect does not appear. If the content exceeds 24%, the meltability of the glass is deteriorated. Preferably, it is 15 to 22%.

B ₂ O ₃ is not essential, but can improve the chemical durability against various chemicals used for semiconductor formation, and can achieve a reduction in thermal expansion coefficient and density without increasing the viscosity at high temperature. When the content exceeds 12%, the acid resistance is deteriorated and the strain point is lowered. Preferably, it is 5 to 12%.

  MgO has a low coefficient of thermal expansion and does not lower the strain point among alkaline earth metal oxides. When the content exceeds 8%, chemical durability against various chemicals used for semiconductor formation is lowered, and glass phase separation tends to occur.

  Although CaO is not essential, the melting property of glass can be improved by containing CaO. On the other hand, if it exceeds 14.5%, the thermal expansion coefficient increases and the devitrification temperature also increases. Preferably, it is 0 to 9%.

  SrO is not essential, but is a useful component for suppressing the phase separation of glass and improving chemical durability against various chemicals used for semiconductor formation. When the content exceeds 24%, the expansion coefficient increases. Preferably, it is 3 to 12.5%.

  BaO is not essential, but is a useful component from the viewpoint of low density and low thermal expansion coefficient. Its content is 0 to 13.5%, preferably 0 to 2%.

  If MgO + CaO + Sr + BaO is less than 9%, melting becomes difficult, and if it exceeds 29.5%, the density increases. MgO + CaO + Sr + BaO is preferably 9 to 18%.

  ZnO is not essential, but can be added to improve the meltability, clarity and formability of the glass. The content is preferably 0 to 5%, more preferably 0 to 2%.

In addition to the above components, SO ₃ , F, and Cl can be added to the alkali-free glass in a total amount of 5% or less in order to improve the meltability, clarity, and moldability of the glass.

The alkali-free glass, preferably, by mass percentage based on _{oxides, SiO 2: 58~66%, Al} 2 O 3: 15~22%, B 2 O 3: 5~12%, MgO: 0~ Examples include 8%, CaO: 0 to 9%, SrO: 3 to 12.5%, BaO: 0 to 2%, and MgO + CaO + SrO + BaO: 9 to 18%.

The strain point of the alkali-free glass is preferably 640 ° C. or higher, and more preferably 650 ° C. or higher. The thermal expansion coefficient is preferably less than 40 × 10 ⁻⁷ / ° C., and preferably 30 × 10 ⁻⁷ / ° C. or more and less than 40 × 10 ⁻⁷ / ° C. The density is preferably less than 2.60 g / cc, more preferably less than 2.55 g / cc, and even more preferably less than 2.50 g / cc.

  In addition to the glass substrate, the substrates 111 and 121 may be a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, a composite body in which a resin substrate and a glass substrate are bonded, or the like. As resin substrates, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, polyetheretherketone resin, polyethylene naphthalate resin, polyacrylic resin, various types Examples thereof include liquid crystal polymer resins and silicone resins.

The first support plate 113 and the second support plate 123 are not particularly limited as long as they can effectively support the first substrate 111 and the second substrate 121, and a glass plate, a ceramic plate, a metal plate, and a resin plate are preferable. It is mentioned as a thing. The difference in coefficient of linear expansion between the first substrate 111 and the first support plate 113 is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C. Similarly, the difference in linear expansion coefficient between the second glass substrate 121 and the second support plate 123 is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 ×. 10 ⁻⁷ / ° C. or less is more preferable.

  As the glass plate, the same type as that used for the first substrate 111 and the second substrate 121 is used, and non-alkali borosilicate glass, borosilicate glass, soda lime glass, high silica glass, and the like. Oxide-based glass containing silicon oxide as a main component is preferable. Examples of the metal plate include stainless steel and copper.

  As resin plates, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, polyetheretherketone resin, polyethylene naphthalate resin, polyacrylic resin, various types Examples thereof include liquid crystal polymer resins and silicone resins.

  The thicknesses of the first support plate 113 and the second support plate 123 are not particularly limited, but are each 0.1 to 1.1 mm from the viewpoint of effectively supporting the first substrate 111 and the second substrate 121. The plate thickness is preferable. The plate thicknesses of the first support plate 113 and the second support plate 123 are preferably plate thicknesses that can be applied to current liquid crystal display panel production lines. For example, the thickness of the glass substrate used in the current production line for liquid crystal display panels is in the range of 0.5 to 1.2 mm, particularly 0.7 mm. Therefore, for example, the thickness of the first substrate 111 or the second substrate 121 is 0.3 mm or less so that the thickness of the first laminate 11 or the second laminate 12 is 0.7 mm. It is preferable to determine the thickness of the first support plate 113 and the second support plate 123 in consideration of the above.

  The first adsorption layer 114 can be attached to the first substrate 111 so that the first adsorption layer 114 can be peeled off. Compared to the peel strength between the first support plate 113 and the first adsorption layer 114, There is no particular limitation as long as the peel strength from the first adsorption layer 114 is low. Since the second adsorption layer 124 is basically the same, only the first adsorption layer 114 will be described.

  When the first support structure 112 is peeled from the seal structure 10, it is peeled between the first substrate 111 and the first adsorption layer 114, and the first support plate 113 and the first adsorption layer 114 are separated. It is necessary not to peel between. Therefore, it is preferable that the first adsorption layer 114 is not easily separated from the first support plate 113 and is easily separated from the first substrate 111.

  As a method for reducing the peel strength between the first substrate 111 and the first adsorption layer 114 compared to the peel strength between the first support plate 113 and the first adsorption layer 114, for example, the first adsorption A curable silicone resin composition is used as a constituent of the layer 114, and the curable silicone resin composition is applied on the first support plate 113 and cured to form the first adsorption layer 114. A method of attaching the first substrate 111 to the adsorption layer 114 is given.

  In addition, even if the curable silicone resin composition is brought into contact with both the first substrate 111 and the first support plate 113 and cured, the first support plate has a higher peeling strength than the first substrate 111. In the case where the peel strength with respect to 113 becomes high, the curable silicone resin composition may be brought into contact with both the first substrate 111 and the first support plate 113 and cured. As such a method, for example, a method of performing a surface treatment for increasing the concentration of silanol groups to increase the binding force on the surface of the first support plate 113 can be mentioned.

  Examples of the curable silicone resin composition include linear organoalkenylpolysiloxane, linear organohydrogenpolysiloxane, and an additive such as a catalyst, and an addition reaction-type curability that is cured by heating. A silicone resin composition is preferred. The addition reaction type curable silicone resin composition is more likely to undergo a curing reaction, lower in shrinkage in curing, and easy to peel off the cured product than other curable silicone resin compositions. Examples of the form of the addition reaction type curable silicone resin composition include a solvent type, an emulsion type, and a solventless type, and any form may be used. As an addition reaction type curable silicone resin composition, what is disclosed by the international publication 2011/024775 pamphlet is preferable, for example.

  The seal portion 13 is not particularly limited as long as the first substrate 111 and the second substrate 121 can be bonded to each other. The seal portion 13 is a seal made of a known epoxy resin or the like that is generally used for manufacturing this type of electronic device member. It can be made of wood.

  For example, the sealing unit 13 may be formed by applying a sealing material such as an epoxy resin in a predetermined shape to one of the first substrate 111 in the first laminate and the second substrate 121 in the second laminate 12. The first laminated body and the second laminated body 12 can be formed by laminating them through an application material of a sealing material and then curing by heating.

  The method for applying the sealing material is not particularly limited, and drawing may be performed using a dispenser or an inkjet device, or printing may be performed by screen printing. The sealing material is not limited to an epoxy resin, and may be, for example, an ultraviolet curable epoxy-modified acrylic resin.

  The bonding portion 14 is not particularly limited as long as the first substrate 111 and the second substrate 121 can be bonded to each other, and can be made of an adhesive such as an epoxy resin. For example, the bonding portion 14 has an adhesive such as an epoxy resin in a predetermined shape as described above on one of the first substrate 111 in the first stacked body or the second substrate 121 in the second stacked body 12. It can be formed by applying and laminating the first laminated body and the second laminated body 12 through an application material of an adhesive, and then curing by heating.

  The method for applying the adhesive is not particularly limited, and may be drawn using a dispenser or an inkjet device, or may be printed by screen printing. The adhesive is not limited to an epoxy resin and may be, for example, an ultraviolet curable epoxy-modified acrylic resin.

  The formation of the adhesive portion 14 is preferably performed simultaneously with the formation of the seal portion 13. Specifically, the adhesive material to be the adhesive portion 14 is applied simultaneously with the application of the seal material to be the seal portion 13, and the first laminate and the second laminate 12 are applied with the seal material and the adhesive material. It is preferable to laminate them via heating and cure both by heating or the like. In particular, the seal material used for forming the seal portion 13 and the adhesive material used for forming the adhesive portion 14 are made of the same material, and the seal material and the adhesive material are applied in the same process using the same apparatus. It is preferable. By such a method, the adhesion part 14 can be formed efficiently. Note that the bonding portion 14 may be formed by other known methods as long as damage to the seal portion 13 can be suppressed when the support structures 112 and 122 are peeled off.

  Note that the sealing material and the adhesive are not necessarily formed by applying both of them to one of the first substrate 111 in the first stacked body or the second substrate 121 in the second stacked body 12. It can also be formed by coating independently. For example, the sealing material may be applied to the first substrate 111 in the first stacked body, and the adhesive material may be applied to the second substrate 121 in the second stacked body 12, or may be in the opposite state.

  The sealing step is a step of manufacturing the sealing structure 10 having the adhesive portion 14 having a predetermined shape as described above. The seal structure 10 is, for example, a seal that becomes a seal portion 13 on the opposing surface of the first laminate 11 or the second laminate 12 after the first laminate 11 and the second laminate 12 are manufactured. After applying the material and the adhesive material that becomes the adhesive portion 14 and laminating the first laminate 11 and the second laminate 12 via the seal material and the adhesive material, the seal material and the adhesive material are cured to manufacture. .

  The first stacked body 11 is manufactured, for example, by attaching the first substrate 111 to the support structure 114 in a peelable manner. The support structure 114 is manufactured, for example, by applying a curable silicone resin composition to be the first adsorption layer 112 to the first support plate 113 and curing the curable silicone resin composition. For example, the first stacked body 11 is manufactured by bonding the first substrate 111 to the first adsorption layer 114 of the support structure 114 manufactured in this way. Examples of the bonding method include a non-contact type pressure bonding method using a pressure chamber and a contact type pressure bonding method using a roll or a press. The second laminate 12 can be manufactured basically in the same manner.

  In each element formation region R of the first substrate 111 in the first laminate 11 and the second substrate 121 in the second laminate 12, when the electronic device member 20 is a member for a liquid crystal display panel, liquid crystal An insulating film, a transparent electrode film, a switching element such as a thin film transistor (TFT) and a thin film diode (TFD), a color filter (CF), and the like are formed according to the display method and as necessary (patterning step). Further, an alignment film such as a polyimide film is printed so that liquid crystal molecules can be aligned, and grooves for aligning are formed (rubbing step).

  Then, for example, while applying a sealing material that becomes the seal portion 13 so as to surround the element formation region R of the first substrate 111 in the first laminate 11 or the second substrate 121 in the second laminate 12, An adhesive material that becomes the bonding portion 14 is applied to the outside in a predetermined shape. Thereafter, when the liquid crystal dropping and bonding method is adopted, after the liquid crystal is dropped onto the element forming region R, the first stacked body 11 and the second stacked body 12 are interposed via the spacer, the sealing material, the adhesive, and the liquid crystal. Are stacked. Further, when the liquid crystal injection method is employed, the first stacked body 11 and the second stacked body 12 are stacked through a sealing material and an adhesive material.

  After the first laminated body 11 and the second laminated body 12 are laminated, the sealing material and the adhesive material are cured. For the curing of the sealing material and the adhesive material, an optimal curing method can be adopted according to the curing method of the sealing material and the adhesive material. For example, when an epoxy resin or the like is used as the sealing material and the adhesive material, it is cured by heating. In the case where an ultraviolet curable epoxy-modified acrylic resin or the like is used as the sealing material and the adhesive, curing is performed by ultraviolet irradiation. When the curing method is different between the seal and the adhesive, the curing may be performed in two or more steps.

  In the peeling step, the first support structure 112 and the second support structure 122 are peeled from the seal structure 10 to manufacture the electronic device member 20.

  For example, the first support structure 112 is peeled off from the seal structure 10 using, for example, a sharp blade-like one at the interface between one end of the electronic device member 20 and the first support structure 112, particularly at the corner. It can be performed by a method of spraying a mixed fluid of water and compressed air to the insertion portion after giving an opportunity for insertion and peeling. For example, as shown in FIG. 3, the peeling is preferably performed gradually from one end of the electronic device member 20 and the first support structure 112, particularly from the corner toward the opposite corner.

  Preferably, both surfaces of the seal structure 10 are vacuum-sucked by a plurality of vacuum suction pads, and in this state, a sharp blade is formed at one end of the electronic device member 20 and the first support structure 112, particularly at the interface of the corner. This is performed by moving the vacuum suction pad that sucks the first support structure 112 so that the first support structure 112 is gradually peeled from the insertion portion.

  The peeling of the second support structure 122 from the seal structure 10 (electronic device member 20) can be performed basically in the same manner.

  At the time of peeling, the first substrate 111 and the second substrate 121 in the electronic device member 20 are bonded to each other by the bonding portion 14 outside the sealing portion 13. Specifically, separation between the first substrate 111 and the seal portion 13 and separation between the second substrate 121 and the seal portion 13 can be suppressed. In addition, damage to the first substrate 111 and the second substrate 121 can be suppressed.

  When the electronic device member 20 is a liquid crystal display panel member and adopts a liquid crystal dropping and bonding method, the liquid crystal is filled in the seal portions 13 serving as the respective liquid crystal display panels of the manufactured electronic device member 20. Yes. Therefore, for example, when a plurality of seal portions 13 are formed, a liquid crystal display panel can be manufactured by separating the seal portions 13. Normally, the adhesive portion 14 is separated from the seal portion 13 and discarded as an unnecessary portion.

  Further, in the case of the liquid crystal injection method, the liquid crystal is not filled in the seal portions 13 which are the respective liquid crystal display panels of the generally manufactured electronic device member 20. Accordingly, liquid crystal is injected into the seal portion 13 to obtain a liquid crystal display panel. Specifically, for example, liquid crystal is injected in the state of the electronic device member 20, and then cut into the respective seal portions 13 to form a liquid crystal display panel. Further, for example, after separating the electronic device member 20 into the respective seal portions 13, liquid crystal may be injected into the respective seal portions 13 to form a liquid crystal display panel, or the electronic device member 20 may be divided into several seal portions. After the liquid crystal display panel is cut into a predetermined size including 13, liquid crystal is injected into each seal portion 13 and further cut into each seal portion 13 to form a liquid crystal display panel.

  An electronic device such as a liquid crystal display panel manufactured in this manner can be used as a display unit of various electronic devices. Electronic devices include, for example, personal computers such as mobile phones and notebook computers, portable information devices such as PDA (Personal Digital Assistants), workstations, digital still cameras, digital video cameras, in-vehicle monitors, liquid crystal televisions, cars A navigation apparatus, an electronic notebook, a calculator, a POS terminal, etc. are mentioned. In addition to the liquid crystal display panel, examples of the electronic device include OLED (Organic Light Emitting Diode), electronic paper, and a liquid crystal lens.

  Note that the liquid crystal display panel can be a transmissive, reflective, or transflective liquid crystal display panel of monochrome or color. Further, various liquid crystal display panels of a passive matrix type and an active matrix type can be obtained.

  In the case of a liquid crystal display panel, a liquid crystal material such as a thermotropic liquid crystal, a low molecular liquid crystal, a polymer liquid crystal, a polymer dispersed liquid crystal, a ferroelectric liquid crystal, or an antiferroelectric liquid crystal is used as a filling material. These liquid crystal materials exhibit a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, and the like depending on conditions. In the case of OLED, an organic electroluminescent material is used as a filling material.

  As electronic paper, for example, an electronic ink in which a plurality of microcapsules including first particles having a positive charge and second particles having a negative charge are dispersed in a solvent is used, and an electric field is applied to the electronic ink. In this case, the particles in the microcapsule are moved in opposite directions to display only the color of the particles assembled on one side. In the case of such electronic paper, electronic ink is disposed as a filling material.

  Further, as electronic paper, a twisting ball display method can be cited. In the twist ball display system, spherical particles separately painted in white and black are arranged between a pair of electrodes, and a potential difference is generated between the pair of electrodes to control the direction of the spherical particles to perform display. In the case of such electronic paper, a material having at least spherical particles is disposed as a filling material. A liquid crystal lens is a lens in which liquid crystal is sealed in a lens-shaped space, and the function of the optical lens is realized by changing the apparent refractive index of the liquid crystal by adjusting the applied voltage.

  As mentioned above, although the manufacturing method of the member for electronic devices of embodiment was demonstrated, in the limit which is not contrary to the meaning of this invention, the structure can be changed suitably as needed. For example, the seal structure is not limited to one having the number of seal portions as illustrated, and may have a larger number of seal portions. A liquid crystal display panel can be manufactured more efficiently according to the one having a large number of seal portions. Moreover, when providing a some seal | sticker part, it is not limited to the magnitude | size, arrangement | positioning, etc. which were shown in figure about the magnitude | size, arrangement | positioning, etc. of each seal part, It can change suitably. Furthermore, the size and arrangement of the adhesive portion can be changed as appropriate in accordance with the size and arrangement of the seal portion.

  DESCRIPTION OF SYMBOLS 10 ... Seal structure, 11 ... 1st laminated body, 12 ... 2nd laminated body, 13 ... Seal part, 14 ... Adhesion part, 20 ... Member for electronic devices, 111 ... 1st board | substrate, 112 ... 1st Support structure, 113 ... first support plate, 114 ... first adsorption layer, 121 ... second substrate, 122 ... second support structure, 123 ... second support plate, 124 ... second Adsorption layer, R ... Element formation region

Claims (17)

A first laminate having a first substrate and a first support structure that is detachably bonded to the first substrate; and a second substrate disposed to face the first laminate. And a second laminated body having a second support structure that is detachably bonded to the second substrate, and an electronic device between the first laminated body and the second laminated body. A sealing step of manufacturing a sealing structure having a seal portion provided so as to surround the element formation region;
A method for producing a member for an electronic device, comprising: a peeling step of peeling the first support structure and the second support structure from the seal structure,
An adhesive portion for bonding the first laminate and the second laminate is provided outside the seal portion, and the seal portion is peeled off in the peeling step and the first substrate and the second substrate are separated. The manufacturing method of the member for electronic devices characterized by suppressing damage.   The method for manufacturing an electronic device member according to claim 1, wherein the electronic device member has a plurality of the seal portions.   The method for manufacturing a member for an electronic device according to claim 2, wherein the adhesive portion is provided linearly along the seal portion.   The method for manufacturing a member for an electronic device according to claim 2, wherein the adhesive portion is provided so as to surround the entirety of the plurality of seal portions.   The method for manufacturing a member for an electronic device according to claim 2, wherein the adhesive portion is provided so as to surround each of the plurality of seal portions.   6. The method of manufacturing a member for an electronic device according to claim 1, wherein the adhesion portion is provided along an outer periphery of the first laminated body and the second laminated body.   The method for manufacturing a member for an electronic device according to claim 1, wherein an interval between the linear portion and the outer periphery of the first and second substrates is 10 mm or less.   The method for manufacturing a member for an electronic device according to claim 1, wherein the substrate has a thickness of 0.3 mm or less.   The method for manufacturing a member for an electronic device according to claim 1, wherein the first substrate and the second substrate have a size of 730 mm in length × 920 mm in width.   The method for manufacturing an electronic device member according to claim 1, wherein the substrate is made of alkali-free glass. The said board | substrate is a manufacturing method of the member for electronic devices of Claim 10 which consists of an alkali free glass containing the following in the mass percentage display of an oxide basis.
SiO _2: 50~66%
Al ₂ O _3: 10.5~24%
B ₂ O _3: 0~12%
MgO: 0 to 8%
CaO: 0 to 14.5%
SrO: 0 to 24%
BaO: 0 to 13.5%
MgO + CaO + SrO + BaO: 9 to 29.5%
ZnO: 0 to 5% The said board | substrate is a manufacturing method of the member for electronic devices of Claim 10 which consists of an alkali free glass containing the following in the mass percentage display of an oxide basis.
SiO _2: 58~66%
Al ₂ O _3: 15~22%
B ₂ O _3: 5~12%
MgO: 0 to 8%
CaO: 0 to 9%
SrO: 3 to 12.5%
BaO: 0 to 2%
MgO + CaO + SrO + BaO: 9 to 18%   13. The method according to claim 1, wherein in the peeling step, the first support structure and the second support structure are peeled from the seal structure gradually from one end of the seal structure. The manufacturing method of the member for electronic devices of description.   The method of manufacturing a member for an electronic device according to any one of claims 1 to 13, wherein the electronic device is any one of a liquid crystal display panel, an OLED, and an electronic paper.   15. The first substrate and the second substrate are any one of a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or a composite body in which a resin substrate and a glass substrate are bonded to each other. The manufacturing method of the member for electronic devices of any one of these. The member manufacturing process which manufactures the member for electronic devices by the manufacturing method of the member for electronic devices of any one of Claims 1 thru | or 15,
An electronic device manufacturing method comprising: a dividing step of manufacturing the electronic device by dividing the electronic device member. A pair of laminates having a substrate having one or more element formation regions in which an electronic device is formed, and a support structure that is detachably bonded to the substrate, and the substrates are arranged to face each other;
A seal portion provided around the element formation region between the pair of stacked bodies;
An electronic device member, comprising: an adhesive portion disposed outside an assembly region of the seal portion.

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