JP2000252342A - Method for transporting thin plate and manufacture of liquid crystal panel - Google Patents
Method for transporting thin plate and manufacture of liquid crystal panelInfo
- Publication number
- JP2000252342A JP2000252342A JP5275499A JP5275499A JP2000252342A JP 2000252342 A JP2000252342 A JP 2000252342A JP 5275499 A JP5275499 A JP 5275499A JP 5275499 A JP5275499 A JP 5275499A JP 2000252342 A JP2000252342 A JP 2000252342A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thin plate
- liquid crystal
- adhesive
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、薄板の搬送方法に
関し、特に液晶パネル用の基板として使用される薄ガラ
スまたはプラスチックフィルムの搬送方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of transporting a thin plate, and more particularly to a method of transporting a thin glass or plastic film used as a substrate for a liquid crystal panel.
【０００２】[0002]
【背景技術】近年、携帯電話等の小型電子機器の薄型・
軽量化が要求されおり、その表示装置としての液晶表示
装置の薄型・軽量化が要求されている。そのため、この
ような薄型・軽量の液晶表示装置の液晶パネルに使用す
るガラス基板も次第に薄いものが要求されている。この
ような薄ガラス基板を備えた液晶パネルの製造工程にお
いて、薄ガラス基板が製造工程中で搬送（流動）される
間に割れるのを防止するために、薄ガラス基板を比較的
厚いガラス板やプラスチック板からなる搬送用の支持板
に貼り付けて仮固定することにより枚葉式で既存の液晶
表示装置の製造ラインをそのまま利用して搬送する方法
が知られている。また、近年、薄型・軽量で割れにくい
液晶パネルとしてプラスチックフィルムからなる液晶パ
ネル（プラスチックフィルムパネル／ＰＦＰ）が提案さ
れ、上記の薄ガラス基板の代わりにプラスチックフィル
ム基板を支持板に接着して製造工程中で搬送する方法も
知られている。これらの方法では、薄ガラス基板または
プラスチックフィルム基板を支持板に貼り付けるため
に、一般に一方の面の粘着力が非常に弱く他方の面の粘
着力が強い粘着剤が設けられた両面テープや剥離性シー
トなどを使用し、粘着力の強い側の面に支持板を貼り付
けるとともに粘着力が弱い側の面に薄ガラス基板または
プラスチックフィルム基板を貼り付けている。このよう
に搬送用に支持板を適用すれば、薄ガラス基板やプラス
チックフィルム基板によるパネル製造においても、従来
より使用していた既存の液晶パネルの製造ラインをその
まま使用することができることが知られている。BACKGROUND ART In recent years, thin electronic devices such as mobile phones have become thinner.
Light weight is required, and a liquid crystal display device as the display device is required to be thin and light. Therefore, a glass substrate used for a liquid crystal panel of such a thin and lightweight liquid crystal display device is also required to be gradually thinner. In a manufacturing process of a liquid crystal panel having such a thin glass substrate, in order to prevent the thin glass substrate from breaking during transportation (flow) in the manufacturing process, a relatively thick glass plate or a thin glass substrate is used. 2. Description of the Related Art There has been known a method in which a single-wafer type liquid crystal display device is transported by directly attaching it to a transport support plate made of a plastic plate and temporarily fixing the same to a production line of an existing liquid crystal display device. In recent years, a liquid crystal panel made of a plastic film (plastic film panel / PFP) has been proposed as a thin, lightweight, and hard-to-break liquid crystal panel, and a plastic film substrate is bonded to a support plate instead of the thin glass substrate described above. There is also known a method of transporting inside. In these methods, in order to attach a thin glass substrate or a plastic film substrate to a support plate, generally, a double-sided tape or a peeling adhesive provided with an adhesive having a very weak adhesive force on one surface and a strong adhesive force on the other surface is provided. A support plate is adhered to the surface having a strong adhesive force and a thin glass substrate or a plastic film substrate is adhered to the surface having a weak adhesive force by using an adhesive sheet or the like. It is known that if a support plate is used for transport in this way, the existing liquid crystal panel production line that has been used conventionally can be used as it is even in panel production using thin glass substrates or plastic film substrates. I have.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上述した従来
の薄ガラス基板やプラスチックフィルム基板の搬送方法
では、薄ガラス基板またはプラスチックフィルム基板を
支持板に貼り付ける剥離性シートの粘着剤に含まれるイ
オン性不純物などが溶け出して製造工程を汚染する場合
がある。これは、粘着剤からＮａ＋，Ｋ＋，Ｃｌ−，Ｓ
Ｏ４ ２−，ＮＯ３−等のイオン性不純物が溶け出してパ
ネルの中を汚染することであり、汚染される経路として
は工程に使用されるオーブン等により空気中への飛散に
よるパネルの汚染であったり、また特に水槽等を用いた
現像、エッチング、剥離といったウエット工程での汚染
が著しい。However, in the above-described conventional method of transporting a thin glass substrate or a plastic film substrate, the ion contained in the adhesive of the peelable sheet for attaching the thin glass substrate or the plastic film substrate to the support plate is not sufficient. In some cases, the impurities may be dissolved to contaminate the manufacturing process. This is because Na + , K + , Cl − , S
The ionic impurities such as O 4 2− and NO 3− elute and contaminate the inside of the panel. The contaminated route is the contamination of the panel by scattering into the air by an oven or the like used in the process. In particular, contamination in a wet process such as development, etching, and peeling using a water tank or the like is remarkable.
【０００４】表１は発泡剥離性シートに含まれるイオン
性不純物を示すもので、発泡剥離性シート（約２グラム
のサンプル１〜８）を沸騰水（５０グラム）中で３０分
間沸騰抽出を行なった後にイオンクロマトグラフィーで
定量分析した結果を示す表である。この表より、サンプ
ルによっては特定のイオンが多量に溶け出し抽出されて
いることがわかる。[0004] Table 1 shows the ionic impurities contained in the foam-peelable sheet. The foam-peelable sheet (about 2 grams of samples 1 to 8) was subjected to boiling extraction in boiling water (50 grams) for 30 minutes. 7 is a table showing the results of quantitative analysis by ion chromatography after the measurement. From this table, it can be seen that a large amount of specific ions are extracted and extracted in some samples.
【０００５】[0005]
【表１】 [Table 1]
【０００６】この汚染によりこれらのイオン性不純物が
基板間に注入された液晶に溶け込んでしまう。このため
パネルを駆動して点灯すると消費電流値の増加を生じさ
せたり、またこれによる駆動電圧Ｖｏｐのバラツキを生
じさせたり、さらにコントラストの低下等の電気光学特
性の低下や腐食による信頼性の低下を引き起こしてい
る。[0006] Due to this contamination, these ionic impurities dissolve into the liquid crystal injected between the substrates. Therefore, when the panel is driven and turned on, the current consumption increases, the driving voltage Vop varies, and the electro-optical characteristics such as the contrast decrease and the reliability decrease due to corrosion. Is causing.
【０００７】従って、本発明は、支持板に薄ガラス基板
やプラスチックフィルム基板などの薄板を剥離性シート
等で支持板に仮固定して搬送を行なう液晶パネルの製造
工程において、剥離性シートの粘着剤に含まれるイオン
性不純物の流出を防止し製造工程の汚染を防止でき、液
晶パネルの品質として消費電流値の増加、駆動電圧Ｖｏ
ｐのバラツキ、コントラストの低下等の電気光学特性の
低下、腐食による信頼性の低下を防止できる薄板の搬送
方法を提供することを目的とする。Accordingly, the present invention provides a method for manufacturing a liquid crystal panel in which a thin plate such as a thin glass substrate or a plastic film substrate is temporarily fixed to a support plate with a peelable sheet or the like and transported. It is possible to prevent the outflow of ionic impurities contained in the agent and to prevent contamination in the manufacturing process, and to increase the current consumption and drive voltage Vo as the quality of the liquid crystal panel.
It is an object of the present invention to provide a method of transporting a thin plate capable of preventing a reduction in electro-optical characteristics such as a variation in p and a reduction in contrast, and a reduction in reliability due to corrosion.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明による薄板の搬送方法は、加熱処理によって
剥離可能な熱剥離粘着材によって薄板を支持板に仮固定
し、熱剥離粘着材の周縁部をシール材によって封止し、
薄板を仮固定した支持板を搬送することを特徴とする。In order to achieve the above object, a method for transporting a thin plate according to the present invention comprises temporarily fixing a thin plate to a support plate with a heat-peelable pressure-sensitive adhesive which can be peeled off by heat treatment. Seal the periphery with a sealing material,
The present invention is characterized in that a support plate on which a thin plate is temporarily fixed is transported.
【０００９】上記薄板の搬送方法では、薄板として薄ガ
ラスを使用することができ、厚さ０.３ｍｍ以下、特に
０.１ｍｍ乃至０.２ｍｍの薄ガラスを使用することがで
きる。また、薄板としてプラスチックフィルムを使用し
てもよい。さらに、支持板としてガラス板を使用するこ
とができる。In the above-described method of transporting a thin plate, a thin glass can be used as the thin plate, and a thin glass having a thickness of 0.3 mm or less, particularly 0.1 mm to 0.2 mm can be used. Further, a plastic film may be used as the thin plate. Further, a glass plate can be used as the support plate.
【００１０】また、シール材はテープまたは接着剤から
なるのが好ましい。また、薄板として液晶パネルの基板
の材料となるものを使用することができる。Preferably, the sealing material is made of a tape or an adhesive. In addition, a thin plate that is used as a material of a substrate of a liquid crystal panel can be used.
【００１１】上述したような本発明による薄板の搬送方
法によれば、熱剥離粘着材の周縁部をシール材で封止し
ているので、粘着剤からイオン性不純物が溶け出して製
造工程を汚染することを防止することができる。According to the method of transporting a thin plate according to the present invention as described above, since the peripheral edge of the heat-peelable adhesive is sealed with the sealing material, ionic impurities are dissolved out of the adhesive and contaminate the manufacturing process. Can be prevented.
【００１２】また、薄板を液晶パネルの基板として製造
を行なう場合、基板のＩＴＯ層が形成された基板表面上
にイオン性不純物が拡散されることが無いので、後にこ
の基板に他方の基板を貼り合わせて組み立て液晶セルを
形成し、基板間に液晶を注入しても液晶にイオン性不純
物が溶け込むことが無い。このため、液晶パネルの製造
工程においてイオン性不純物で汚染されることが無いの
で、パネルを駆動して点灯しても消費電流値の増加、ま
たこれによる駆動電圧Ｖｏｐのバラツキ、コントラスト
の低下等の電気光学特性の低下、腐食による信頼性の低
下を防止することができ品質の良い液晶パネルを製造す
ることができる。When a thin plate is manufactured as a substrate of a liquid crystal panel, ionic impurities are not diffused onto the surface of the substrate on which the ITO layer is formed. Even when a liquid crystal cell is assembled and assembled to form a liquid crystal between the substrates, ionic impurities do not dissolve into the liquid crystal. Therefore, the liquid crystal panel is not contaminated by ionic impurities in the manufacturing process, so that even when the panel is driven and lit, the current consumption increases, and the driving voltage Vop varies, the contrast decreases, and the like. A reduction in electro-optical characteristics and a reduction in reliability due to corrosion can be prevented, and a high-quality liquid crystal panel can be manufactured.
【００１３】[0013]
【発明の実施の形態】以下、添付図面を参照して、本発
明による薄板の搬送方法の実施の形態として、液晶パネ
ルの製造方法に適用した例について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for transporting a thin plate according to the present invention applied to a method for manufacturing a liquid crystal panel will be described below with reference to the accompanying drawings.
【００１４】〔第１実施例〕図１は、本発明による薄板
の搬送方法を適用した液晶パネルの製造工程を示す図で
ある。[First Embodiment] FIG. 1 is a view showing a manufacturing process of a liquid crystal panel to which a method for transporting a thin plate according to the present invention is applied.
【００１５】まず、図１（ａ）に示すように、本発明に
よる薄板の搬送方法に適用可能な薄板としての基板１０
を用意する。この基板１０は、一対の基板の間に液晶層
を挟んだ液晶パネル用の薄ガラス基板またはプラスチッ
クフィルム基板として使用されるものであり、特に、本
発明による薄板の搬送方法は、厚さ０.１〜０.２ｍｍ程
度の薄ガラスにも適用できる。次いで、図１（ａ）に示
すように、液晶パネルを構成する一方の基板を基板１０
としてその上面に透明電極１２となるＩＴＯ層をスパッ
タリング法により形成する。First, as shown in FIG. 1 (a), a substrate 10 as a thin plate applicable to the method for transporting a thin plate according to the present invention.
Prepare The substrate 10 is used as a thin glass substrate or a plastic film substrate for a liquid crystal panel in which a liquid crystal layer is sandwiched between a pair of substrates. It can also be applied to thin glass of about 1 to 0.2 mm. Next, as shown in FIG. 1A, one of the substrates constituting the liquid crystal panel is
Then, an ITO layer to be the transparent electrode 12 is formed on the upper surface by a sputtering method.
【００１６】一方、後述するガラスなどからなる搬送用
の支持板３０に基板１０を仮固定するための熱剥離シー
ト２０を用意する。この熱剥離シート２０は、図１
（ｂ）および図２に示すように、ポリエステルなどから
なる基材２１と、この基材２１の一方の面に塗布された
支持体接着用粘着剤２２と、基板２１の他方の面に塗布
された加熱剥離タイプの熱剥離粘着剤２３と、支持体接
着用粘着剤２２の外側面に貼り合わされたセパレータ
（ライナ）２４と、熱剥離接着剤２３の外側面に貼り合
わされたセパレータ（ライナ）２５とから構成されてい
る。支持体接着用粘着剤２２は、通常の粘着剤と同様
に、セパレータ２４を剥がして被着体としての搬送用の
支持板３０に貼り付けたときに支持体３０にしっかり接
着して、加熱処理などを行っても接着力が殆ど低下しな
い接着剤からなる。一方、熱剥離粘着剤２３は、常温で
は通常の粘着剤と同様に被着体としての基板１０に接着
し、基板１０から剥がすときには加熱するだけで簡単に
基板１０を剥離できるものである。熱剥離シート２０と
しては、日東電工（株）により市販されている熱剥離シ
ート「リバアルファ」を使用することができる。この熱
剥離シートは、ポリエステルフィルムからなる基材の一
方の面に熱剥離粘着剤が塗布されるとともに、他方の面
に通常の粘着剤である支持体接着用粘着剤が塗布された
シートであり、常温では通常の粘着シートと同様に熱剥
離粘着剤に被着体がしっかり接着され、被着体を剥がし
たいときに加熱処理を１００℃で１分間行うだけで熱剥
離粘着剤層が発泡して（面接触が点接触になり）接着面
積の低下により接着力がなくなり（殆どゼロになり）、
熱剥離粘着剤から被着体を簡単に剥離できるものであ
る。On the other hand, a heat release sheet 20 for temporarily fixing the substrate 10 to a transfer support plate 30 made of glass or the like to be described later is prepared. This heat release sheet 20 is shown in FIG.
As shown in FIG. 2B and FIG. 2, a base material 21 made of polyester or the like, a support adhesive 22 applied to one surface of the base material 21, and a base material 21 applied to the other surface of the substrate 21. The heat-peelable pressure-sensitive adhesive 23, the separator (liner) 24 bonded to the outer surface of the support-bonding pressure-sensitive adhesive 22, and the separator (liner) 25 bonded to the outer surface of the heat-release adhesive 23 It is composed of The adhesive 22 for bonding the support is, like the normal adhesive, firmly adhered to the support 30 when the separator 24 was peeled off and attached to the support plate 30 for transport as an adherend, and subjected to heat treatment. It is made of an adhesive whose adhesive strength hardly decreases even if it is performed. On the other hand, the heat-peelable pressure-sensitive adhesive 23 adheres to the substrate 10 as an adherend at room temperature in the same manner as a normal pressure-sensitive adhesive, and can easily peel off the substrate 10 only by heating when peeled from the substrate 10. As the thermal release sheet 20, a thermal release sheet “Riba Alpha” marketed by Nitto Denko Corporation can be used. This heat-peelable sheet is a sheet in which a heat-peelable pressure-sensitive adhesive is applied to one surface of a base material made of a polyester film, and a pressure-sensitive adhesive for bonding a support, which is a normal pressure-sensitive adhesive, is applied to the other surface. At room temperature, the adherend is firmly adhered to the heat-peelable pressure-sensitive adhesive in the same way as a normal pressure-sensitive adhesive sheet. (The surface contact becomes the point contact), the adhesive strength is lost due to the decrease of the adhesive area (almost zero),
The adherend can be easily peeled off from the heat-peelable pressure-sensitive adhesive.
【００１７】次に、図１（ｃ）に示すように、熱剥離粘
着剤２３の外側面に貼り合わされたセパレータ２５を剥
がして、上面にＩＴＯ層が形成された基板１０の下面を
熱剥離粘着剤２３の上面に重ね合わせて圧着する。な
お、熱剥離シート２０の粘着保持機能を確実にするため
に、空気を巻き込まないように熱剥離シート２０を基板
１０に貼り合わせ、しっかり圧着する必要がある。ま
た、熱剥離シート２０を基板１０の一部のみに貼り付け
ると、熱収縮によってその部分だけに応力が加わってし
まうので、熱剥離シート２０は基板１０の全面に貼り付
けるのが好ましい。Next, as shown in FIG. 1C, the separator 25 attached to the outer surface of the heat-peelable adhesive 23 is peeled off, and the lower surface of the substrate 10 having the ITO layer formed on the upper surface is heat-peelable. It is superposed on the upper surface of the agent 23 and pressed. In addition, in order to ensure the adhesive holding function of the thermal release sheet 20, it is necessary to bond the thermal release sheet 20 to the substrate 10 and prevent the air from being entrained, and firmly press-bond the same. Further, if the thermal release sheet 20 is attached to only a part of the substrate 10, stress is applied only to that part due to thermal shrinkage. Therefore, the thermal release sheet 20 is preferably attached to the entire surface of the substrate 10.
【００１８】次に、図１（ｄ）に示すように、熱剥離シ
ート２０を貼り付けた基板１０を適当な寸法に裁断す
る。その後、図１（ｅ）に示すように、支持体接着用粘
着剤２２の外側面に貼り合わされたセパレータ２４を剥
がした後、図１（ｆ）に示すように、支持体接着用粘着
剤２２の下面を支持板３０に貼り合わせて圧着する。こ
のようにして、熱剥離シート２０によって基板１０が支
持板３０に貼り付けられて仮固定される。なお、この貼
付け順として剥離性シート２０を先に支持板３０に先に
貼り付けてから基板１０のＩＴＯ層が形成された面の反
対側の面を熱剥離シート２０の熱剥離粘着剤２３の上面
に重ね合わせて圧着してもよく、貼付け後図１（ｆ）の
積層構造となっていれば良い。さらに、熱剥離シート２
０の熱剥離粘着剤２３は種々のイオン性不純物を含むの
で、熱剥離粘着剤２３が基板１０の端面または切断面か
らはみ出て種々のイオン性不純物が溶け出し、液晶パネ
ルの製造工程を汚染する可能性がある。このような汚染
を防止するため、図１（ｆ）、図２および図３に示すよ
うに、熱剥離シート２０の周縁部をシール材４０で封止
してイオン性不純物が溶け出さないようにする。すなわ
ち、支持板３０の表面から基板１０の断面（又はＩＴＯ
層が形成された基板表面の端部）にかけてシール材４０
が設けられているので、熱剥離シート２０が外気にさら
されず完全に覆われている。従って、基板１０のＩＴＯ
層が形成された基板表面上にイオン不純物が拡散される
ことが無いので、後に基板１０に他方の基板を貼り合わ
せて組み立て、基板間に液晶を注入しても液晶にイオン
性不純物が溶け込むことが無い。このようなシール材４
０としては、接着剤などを使用することができる。Next, as shown in FIG. 1D, the substrate 10 to which the heat release sheet 20 has been attached is cut into appropriate dimensions. Thereafter, as shown in FIG. 1 (e), the separator 24 attached to the outer surface of the support bonding adhesive 22 is peeled off, and as shown in FIG. 1 (f), the support bonding adhesive 22 is removed. Is bonded to the support plate 30 and pressure-bonded. In this way, the substrate 10 is stuck to the support plate 30 by the heat release sheet 20 and temporarily fixed. In this order, the surface of the substrate 10 opposite to the surface on which the ITO layer was formed was first adhered to the support plate 30 and then the surface of the heat-peelable adhesive 23 of the heat-peelable sheet 20 was applied. It may be overlaid on the upper surface and pressure-bonded, and it is sufficient that the laminated structure shown in FIG. Further, the heat release sheet 2
Since the heat-peelable pressure-sensitive adhesive 23 contains various ionic impurities, the heat-peelable pressure-sensitive adhesive 23 protrudes from the end face or the cut surface of the substrate 10 and the various ionic impurities dissolve, contaminating the manufacturing process of the liquid crystal panel. there is a possibility. In order to prevent such contamination, as shown in FIGS. 1 (f), 2 and 3, the periphery of the heat-peelable sheet 20 is sealed with a sealing material 40 so that ionic impurities do not dissolve. I do. That is, the cross section of the substrate 10 (or the ITO
(The edge of the substrate surface on which the layer is formed)
Is provided, the heat release sheet 20 is completely exposed without being exposed to the outside air. Therefore, the ITO of the substrate 10
Since ionic impurities do not diffuse on the surface of the substrate on which the layer is formed, the ionic impurities dissolve into the liquid crystal even when the other substrate is attached to the substrate 10 and assembled later, and the liquid crystal is injected between the substrates. There is no. Such a sealing material 4
As 0, an adhesive or the like can be used.
【００１９】次に、図１（ｇ）に示すように、支持板３
０に仮固定された基板１０を液晶パネルの製造工程中で
搬送（流動）して、基板１０の透明電極１２側に対する
フォトレジスト膜の形成、所定のパターンの露光・現
像、透明電極１２のエッチング、残存フォトレジストの
除去、配向膜の形成、ラビング処理などの一連の処理を
行う。Next, as shown in FIG.
The substrate 10 temporarily fixed to 0 is conveyed (flowed) during the manufacturing process of the liquid crystal panel, and a photoresist film is formed on the transparent electrode 12 side of the substrate 10, a predetermined pattern is exposed and developed, and the transparent electrode 12 is etched. Then, a series of processes such as removal of the remaining photoresist, formation of an alignment film, and rubbing are performed.
【００２０】これらの処理が終了した後、シール材４０
として接着剤を使用した場合には、図３において一点鎖
線で示すように支持板３０およびそれに仮固定された基
板１０を切断して、接着剤の部分を取り除く。その後、
図１（ｈ）に示すように加熱処理を行えば、支持板３０
に仮固定した薄板１０は上方に持ち上げるだけで容易に
取り外すことができる（図１（ｉ）参照）。加熱処理の
方法は、ホットプレート、熱風炉、近赤外線による加熱
のいずれでもよい。After these processes are completed, the sealing material 40
In the case where an adhesive is used, the support plate 30 and the substrate 10 temporarily fixed thereto are cut off as shown by a dashed line in FIG. 3 to remove the adhesive. afterwards,
If the heat treatment is performed as shown in FIG.
The thin plate 10 temporarily fixed can be easily removed simply by lifting it upward (see FIG. 1 (i)). The method of the heat treatment may be any of a hot plate, a hot blast stove, and heating by near infrared rays.
【００２１】液晶パネルを構成する他方の基板において
も同様に行われ、しかる後に両基板が互いにＩＴＯ層が
形成された面を対向させて貼り合わされ、液晶が注入さ
れて封止される。The same applies to the other substrate constituting the liquid crystal panel. Thereafter, the two substrates are bonded to each other with the surfaces on which the ITO layers are formed facing each other, and the liquid crystal is injected and sealed.
【００２２】上述した本発明による薄板の搬送方法によ
れば、熱剥離シート２０の周縁部をシール材４０により
封止しているので粘着剤からＮａ＋，Ｋ＋，Ｃｌ−，Ｓ
Ｏ４ ２−，ＮＯ３−等のイオン性不純物が溶け出すこと
が無く、製造工程において使用されるオーブン等により
イオン性不純物が空気中へ飛散してパネルを汚染させる
こともなく、また特に水槽等を用いた現像、エッチン
グ、剥離といったウエット工程で溶け出すことによる汚
染が生じないので、製造工程でのイオン性不純物による
汚染を防止することができる。従って、イオン性不純物
が基板間に注入された液晶に溶け込むことも無いので、
パネルを駆動して点灯しても消費電流値の増加、またこ
れによる駆動電圧Ｖｏｐのバラツキ、コントラストの低
下等の電気光学特性の低下、腐食による信頼性の低下を
防止することができ品質の良い液晶パネルを製造するこ
とができる。According to the above-described method of transporting a thin plate according to the present invention, since the peripheral portion of the heat-peelable sheet 20 is sealed with the sealing material 40, Na + , K + , Cl − , and S are removed from the adhesive.
No ionic impurities such as O 4 2− and NO 3− do not dissolve, and no ionic impurities are scattered into the air by an oven or the like used in the manufacturing process to contaminate the panel. No contamination is caused by melting out in a wet process such as development, etching, and peeling using the method, etc., so that contamination due to ionic impurities in a manufacturing process can be prevented. Therefore, since ionic impurities do not dissolve in the liquid crystal injected between the substrates,
Even when the panel is driven and turned on, an increase in current consumption, a variation in driving voltage Vop, a decrease in electro-optical characteristics such as a decrease in contrast, and a decrease in reliability due to corrosion can be prevented. A liquid crystal panel can be manufactured.
【００２３】〔第２実施例〕本発明による薄板の搬送方
法の他の実施の形態として、第１実施例のシール材４０
としてテープ４を用いたものであり、各製造工程及び積
層構造は第１実施例と同様であり、同一な部分の説明は
省略するものとする。図４は基板が支持板に仮固定され
た状態を示す断面図、および図５は基板が支持板に仮固
定された状態を示す平面図を示すものであり、第１実施
例と共通な部分は同一な符号を付してある。[Second Embodiment] As another embodiment of the method of transporting a thin plate according to the present invention, the sealing material 40 of the first embodiment is used.
The manufacturing process and the laminated structure are the same as those of the first embodiment, and the description of the same parts will be omitted. FIG. 4 is a cross-sectional view showing a state in which the substrate is temporarily fixed to the support plate, and FIG. 5 is a plan view showing a state in which the substrate is temporarily fixed to the support plate. Are given the same reference numerals.
【００２４】図４及び図５に示すように、熱剥離シート
２０の周縁部をテープ４で封止してイオン性不純物が溶
け出さないようにする。すなわち、板１０のＩＴＯ層が
形成された基板表面の端部から支持板３０の表面に跨っ
てテープ４が貼られているので、熱剥離シート２０が外
気にさらされず完全に覆われている。従って、基板１０
のＩＴＯ層が形成された基板表面上にイオン不純物が拡
散されることが無いので、後に基板１０に他方の基板を
貼り合わせて組み立て、基板間に液晶を注入しても液晶
にイオン性不純物が溶け込むことが無い。As shown in FIGS. 4 and 5, the peripheral portion of the heat-peelable sheet 20 is sealed with a tape 4 so that ionic impurities do not dissolve. That is, since the tape 4 is applied from the end of the substrate surface of the plate 10 on which the ITO layer is formed to the surface of the support plate 30, the heat release sheet 20 is completely exposed without being exposed to the outside air. Therefore, the substrate 10
Since the ionic impurities are not diffused on the surface of the substrate on which the ITO layer is formed, the ionic impurities are not added to the liquid crystal even when the other substrate is bonded to the substrate 10 and the liquid crystal is injected between the substrates. There is no melting.
【００２５】この状態で、支持板３０に仮固定された基
板１０を液晶パネルの製造工程中で搬送（流動）して、
基板１０の透明電極１２側に対するフォトレジスト膜の
形成、所定のパターンの露光・現像、透明電極１２のエ
ッチング、残存フォトレジストの除去、配向膜の形成、
ラビング処理などの一連の処理を行う。In this state, the substrate 10 temporarily fixed to the support plate 30 is conveyed (flowed) during the manufacturing process of the liquid crystal panel.
Formation of a photoresist film on the transparent electrode 12 side of the substrate 10, exposure and development of a predetermined pattern, etching of the transparent electrode 12, removal of the remaining photoresist, formation of an alignment film,
A series of processing such as rubbing processing is performed.
【００２６】これらの処理が終了した後、図５において
一点鎖線で示すように支持板３０およびそれに仮固定さ
れた基板１０を切断して、テープ４の貼付け部分を取り
除く。その後、図１（ｈ）に示すように加熱処理を行え
ば、支持板３０に仮固定した薄板１０は上方に持ち上げ
るだけで容易に取り外すことができる（図１（ｉ）参
照）。加熱処理の方法は、ホットプレート、熱風炉、近
赤外線による加熱のいずれでもよい。After these processes are completed, the support plate 30 and the substrate 10 temporarily fixed thereto are cut off as shown by the alternate long and short dash line in FIG. Thereafter, if a heat treatment is performed as shown in FIG. 1 (h), the thin plate 10 temporarily fixed to the support plate 30 can be easily removed simply by lifting it upward (see FIG. 1 (i)). The method of the heat treatment may be any of a hot plate, a hot blast stove, and heating by near infrared rays.
【００２７】液晶パネルを構成する他方の基板において
も同様に行われ、しかる後に両基板が互いにＩＴＯ層が
形成された面を対向させて貼り合わされ、液晶が注入さ
れて封止される。The same applies to the other substrate constituting the liquid crystal panel. Thereafter, the two substrates are bonded to each other with the surfaces on which the ITO layers are formed facing each other, and the liquid crystal is injected and sealed.
【００２８】上述した本発明による薄板の搬送方法によ
れば、熱剥離シート２０の周縁部をシール材４０により
封止しているので粘着剤からＮａ＋，Ｋ＋，Ｃｌ−，Ｓ
Ｏ４ ２−，ＮＯ３−等のイオン性不純物が溶け出すこと
が無く、製造工程において使用されるオーブン等により
イオン性不純物が空気中へ飛散してパネルを汚染させる
こともなく、また特に水槽等を用いた現像、エッチン
グ、剥離といったウエット工程で溶け出すことによる汚
染が生じないので、製造工程でのイオン性不純物による
汚染を防止することができる。従って、イオン性不純物
が基板間に注入された液晶に溶け込むことも無いので、
パネルを駆動して点灯しても消費電流値の増加、またこ
れによる駆動電圧Ｖｏｐのバラツキ、コントラストの低
下等の電気光学特性の低下、腐食による信頼性の低下を
防止することができ品質の良い液晶パネルを製造するこ
とができる。According to the above-described method of transporting a thin plate according to the present invention, since the peripheral portion of the heat-peelable sheet 20 is sealed with the sealing material 40, Na + , K + , Cl − , S −
No ionic impurities such as O 4 2− and NO 3− do not dissolve, and no ionic impurities are scattered into the air by an oven or the like used in the manufacturing process to contaminate the panel. No contamination is caused by melting out in a wet process such as development, etching, and peeling using the method, etc., so that contamination due to ionic impurities in a manufacturing process can be prevented. Therefore, since ionic impurities do not dissolve in the liquid crystal injected between the substrates,
Even when the panel is driven and turned on, an increase in current consumption, a variation in driving voltage Vop, a decrease in electro-optical characteristics such as a decrease in contrast, and a decrease in reliability due to corrosion can be prevented. A liquid crystal panel can be manufactured.
【図１】本発明による薄板の搬送方法を適用した液晶表
示装置の製造工程を示す図。FIG. 1 is a diagram showing a manufacturing process of a liquid crystal display device to which a method for transporting a thin plate according to the present invention is applied.
【図２】本発明による薄板の搬送方法の実施の形態にお
いて、基板が支持板に仮固定された状態を示す断面図。FIG. 2 is a cross-sectional view showing a state in which the substrate is temporarily fixed to the support plate in the embodiment of the method for transporting a thin plate according to the present invention.
【図３】本発明による薄板の搬送方法の実施の形態にお
いて、基板が支持板に仮固定された状態を示す平面図。FIG. 3 is a plan view showing a state in which the substrate is temporarily fixed to the support plate in the embodiment of the method for transporting a thin plate according to the present invention.
【図４】本発明による薄板の搬送方法の他の実施の形態
において、基板が支持板に仮固定された状態を示す断面
図。FIG. 4 is a cross-sectional view showing a state in which a substrate is temporarily fixed to a support plate in another embodiment of the method for transporting a thin plate according to the present invention.
【図５】本発明による薄板の搬送方法の他の実施の形態
において、基板が支持板に仮固定された状態を示す平面
図。FIG. 5 is a plan view showing a state in which a substrate is temporarily fixed to a support plate in another embodiment of the method for transporting a thin plate according to the present invention.
１０ 基板 １２ ＩＴＯ層（透明電極） ２０ 熱剥離シート ２１ 基材 ２２ 支持体接着用粘着剤 ２３ 熱剥離粘着剤 ２４、２５ セパレータ ３０ 支持板 ４０ シール材 ４ テープ DESCRIPTION OF SYMBOLS 10 Substrate 12 ITO layer (transparent electrode) 20 Thermal peeling sheet 21 Substrate 22 Adhesive for bonding a support 23 Thermal adhesive 24, 25 Separator 30 Support plate 40 Sealing material 4 Tape
Claims (8)
し、前記粘着材の周縁部をシール材によって封止し、薄
板を仮固定した支持板を搬送することを特徴とする、薄
板の搬送方法。1. A transport of a thin plate, wherein the thin plate is temporarily fixed to a support plate with an adhesive material, a peripheral portion of the adhesive material is sealed with a sealant, and the support plate on which the thin plate is temporarily fixed is transported. Method.
な熱剥離粘着材であることを特徴とする、請求項１に記
載の薄板の搬送方法。2. The method according to claim 1, wherein the pressure-sensitive adhesive is a heat-peelable pressure-sensitive adhesive that can be peeled off by heat treatment.
する、請求項１または請求項２に記載の薄板の搬送方
法。3. The method according to claim 1, wherein the thin plate is thin glass.
ことを特徴とする、請求項１または請求項２に記載の薄
板の搬送方法。4. The method according to claim 1, wherein the thin plate is a plastic film.
とする、請求項１乃至請求項４のいずれかに記載の薄板
の搬送方法。5. The method according to claim 1, wherein the supporting plate is a glass plate.
徴とする、請求項１乃至請求項５のいずれかに記載の薄
板の搬送方法。6. The method for transporting a thin plate according to claim 1, wherein the sealing material is made of a tape.
徴とする、請求項１乃至請求項５のいずれかに記載の薄
板の搬送方法。7. The method for conveying a thin plate according to claim 1, wherein the sealing material is made of an adhesive.
の薄板の搬送方法を用いたことを特徴とする、液晶パネ
ルの製造方法。8. A method for manufacturing a liquid crystal panel, comprising using the method for conveying a thin plate according to claim 1. Description:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5275499A JP2000252342A (en) | 1999-03-01 | 1999-03-01 | Method for transporting thin plate and manufacture of liquid crystal panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5275499A JP2000252342A (en) | 1999-03-01 | 1999-03-01 | Method for transporting thin plate and manufacture of liquid crystal panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000252342A true JP2000252342A (en) | 2000-09-14 |
Family
ID=12923692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5275499A Withdrawn JP2000252342A (en) | 1999-03-01 | 1999-03-01 | Method for transporting thin plate and manufacture of liquid crystal panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000252342A (en) |
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