KR20210083546A - Method of manufacturing organic light emitting display device - Google Patents

Abstract

An organic light emitting diode display according to an embodiment of the present invention may include a flexible substrate. A support film is disposed on the rear surface of the flexible substrate. A pixel array layer may be disposed on the upper surface of the flexible substrate. A polarizing plate may be disposed on the pixel array layer. A reinforcing member may include the corner parts of the flexible substrate, the support film, the pixel array layer, and the polarizing plate. The reinforcing member may be in contact with the side surfaces of the flexible substrate, the support film, the pixel array layer, and, and the polarizing plate. It is possible to provide an organic light emitting display device with improved durability by preventing defects (moisture permeation, disconnection, etc.) due to cracks occurring in a pixel array layer.

Description

An organic light emitting display device and a method of manufacturing an organic light emitting display device {METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present specification relates to an organic light emitting display device and a method of manufacturing the organic light emitting display device.

As the information society develops, the demand for a display device for displaying an image is increasing, and various types of display devices such as a liquid crystal display device and an organic light emitting display device are utilized.

In particular, an organic light emitting diode display is a next-generation display device having self-luminous characteristics, and has superior characteristics in terms of viewing angle, contrast, response speed, power consumption, and the like, compared to a liquid crystal display device.

Recently, a flexible display device in which a display unit and wiring are formed on a flexible substrate such as plastic, which is a flexible material, has been attracting attention as a next-generation display device. The range of application of the flexible display device to not only a computer monitor and TV but also a personal portable device is diversifying, and research to apply the flexible display device to an organic light emitting display device is being conducted.

As a method of manufacturing such an organic light emitting display device, a cell unit organic light emitting display device manufacturing method of separately manufacturing each organic light emitting display device and a plurality of organic light emitting display devices are simultaneously manufactured using a mother substrate and then a plurality of organic light emitting display devices are manufactured There is a method of manufacturing an organic light emitting display device in units of a mother substrate for separating the light emitting display device. Among the above-described two organic light emitting display manufacturing methods, the cell unit organic light emitting display manufacturing method is based on the organic light emitting diode display in terms of process time and cost in that only one organic light emitting display is manufactured in one process. There are disadvantages compared to a method of manufacturing a light emitting display device.

Meanwhile, after the flexible organic light emitting display device is separated into a plurality of cells using a mother substrate, the flexible organic light emitting diode display is cut to fit the shape of the flexible organic light emitting display device. After the cutting, a process of bending one side of the flexible substrate of the flexible organic light emitting display device and a process of bonding the cover window are performed.

In a process of manufacturing an organic light emitting diode display using a flexible substrate, a mother substrate is used to support the flexible substrate and components formed on the flexible substrate. A plurality of cells formed on the mother substrate are separated into individual cells and cut to fit the shape of the organic light emitting display device. Cell damage may occur during additional processing after cutting. Accordingly, the inventors of the present invention have attempted to solve a new method of manufacturing an organic light emitting display device for solving cell damage.

The tasks of the present specification are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the object as described above, an organic light emitting diode display according to an exemplary embodiment includes a flexible substrate, a support film disposed on a rear surface of the flexible substrate, and a pixel array on an upper surface of the flexible substrate. layers may be included. A polarizing plate may be disposed on the pixel array layer. The flexible substrate, the support film, the pixel array layer, and the polarizing plate may include a reinforcing member at the corners thereof. The reinforcing member may contact side surfaces of the flexible substrate, the support film, the pixel array layer, and the polarizing plate.

The details of other embodiments are included in the detailed description and drawings.

When the organic light emitting diode display is cut into an actual shape and then followed by a bending process, a cover member bonding process, and a reliability test process, cracks may increase to the inside of the pixel array layer. Propagation of cracks to the pixel array layer can be prevented by reinforcing the high modulus resin (resin) by coating the cracked portion. Accordingly, the present invention can provide an organic light emitting diode display with improved durability by preventing defects (such as moisture permeation, disconnection, etc.) due to cracks occurring in the pixel array layer.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a schematic flowchart illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment.
2A to 2R are process diagrams illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment.
3 is a schematic cross-sectional view illustrating an organic light emitting diode display according to an exemplary embodiment.
4 is a schematic flowchart illustrating a method of manufacturing an organic light emitting diode display according to another exemplary embodiment.
5 is a plan view illustrating an organic light emitting diode display according to another exemplary embodiment.
6A to 6C are process diagrams for explaining a method of manufacturing an organic light emitting diode display according to another exemplary embodiment.
7 is a schematic cross-sectional view illustrating an organic light emitting diode display according to another exemplary embodiment.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

Reference to a device or layer “on” another device or layer includes any intervening layer or other device directly on or in the middle of another device.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Like reference numerals refer to like elements throughout.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and technically various interlocking and driving are possible, as will be fully understood by those skilled in the art, and each embodiment may be independently implemented with respect to each other, It may be possible to implement together in a related relationship.

Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic flowchart illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment. 2A to 2R are process diagrams for explaining a method of manufacturing an organic light emitting diode display according to an exemplary embodiment.

First, the sacrificial layer 111 is formed on the lower mother substrate 110 in which the plurality of cells CE are defined ( S100 ).

The lower mother substrate 110 is a substrate for supporting the flexible substrate 120 and components disposed on the flexible substrate 120 during the manufacturing process of the organic light emitting diode display. The lower mother substrate 110 may be made of a rigid material, for example, may be made of glass, but is not limited thereto.

Referring to FIG. 2A , the lower mother substrate 110 is a substrate used to simultaneously manufacture a plurality of organic light emitting display devices, and a plurality of cells CE is defined in the lower mother substrate 110 . Each of the plurality of cells CE defined in the lower mother substrate 110 finally corresponds to one organic light emitting diode display. In FIG. 2A , 16 cells CE are defined in the lower mother substrate 110 for convenience of explanation, but the present invention is not limited thereto.

Each of the plurality of cells CE includes a display area DA, a non-display area NA, and a pad area PA. The display area DA is an area in which an organic light emitting device is disposed to display an image, and is located in the center of the cell CE. A circuit unit including a thin film transistor, a capacitor, and the like may also be disposed in the display area DA. The non-display area NA is an area in which an image is not displayed and surrounds the display area DA. A circuit unit including a thin film transistor, a capacitor, or the like may be disposed in the non-display area NA. The pad area PA is an area in which a module such as a flexible printed circuit board or a COF (Chip On Film) disposed in the organic light emitting diode display is disposed, and is an area in which a pad electrode to be electrically connected to the module is disposed. The pad area PA is an area extending from one side of the non-display area NA. Although the pad area PA is illustrated as being separate from the non-display area NA in FIG. 2A , the pad area PA is an area included in the non-display area NA and is one side of the non-display area NA. It may be defined as an area located in . In FIG. 2A , the boundary between the plurality of cells CE is indicated by a dashed line, and the boundary between the display area DA, the non-display area NA, and the pad area PA within the plurality of cells CE is indicated by a dotted line. shown.

Referring to FIG. 2B , a sacrificial layer 111 is formed on the lower mother substrate 110 . The sacrificial layer 111 may be made of a material having a property of weakening the adhesive force with the flexible substrate 120 to be described later by decomposing the interfacial bonding force when irradiated with a laser. The sacrificial layer 111 may have, for example, a structure in which a silicon nitride (SiNx) layer and a silicon oxide (SiOx) layer are stacked. The sacrificial layer 111 may be formed by depositing silicon nitride and silicon oxide on the entire surface of the lower mother substrate 110 .

Next, the flexible substrate 120 is formed on the sacrificial layer 111 ( S105 ).

The flexible substrate 120 as shown in FIG. 2B supports various components of the organic light emitting diode display. The flexible substrate 120 may be made of a flexible plastic material, for example, polyimide (PI) or photo acryl. When the flexible substrate 120 is made of polyimide (PI), the flexible substrate 120 may be formed by a squeeze method.

Next, the pixel array layer 130 is formed on each of the plurality of cells CE on the flexible substrate 120 . The pixel array layer 130 includes a circuit unit and a display unit including an organic light emitting device (S110). In FIG. 2B , the pixel array layer 130 is illustrated as a single layer for convenience of description.

A circuit part is formed in the display area DA and the non-display area NA of each cell CE on the flexible substrate 120 . A thin film transistor, a capacitor, and a wiring are formed in the display area DA of each cell CE. For example, a circuit portion including various circuit elements for driving the organic light emitting diode, such as a driving thin film transistor, a switching thin film transistor, and a storage capacitor, may be formed in the display area DA. In addition, the circuit unit 130 for driving the organic light emitting diode is also formed in the non-display area NA of each cell CE. For example, a gate driver such as a gate in panel (GIP) may be formed in the non-display area NA.

A display unit including an organic light emitting device is formed on the circuit unit on the flexible substrate 120 . The organic light emitting diode may be disposed on a circuit unit such as a driving thin film transistor, a switching thin film transistor, and a storage capacitor. The organic light emitting diode may include an anode electrically connected to the driving thin film transistor, an organic layer on the anode, and a cathode on the organic layer. The organic layer may include, for example, a hole transport layer, a hole injection layer, an organic light emitting layer, an electron injection layer, and an electron transport layer.

Although not shown in FIG. 2B , an encapsulant may be disposed on the pixel array layer 130 . The encapsulation part is a component that covers the display part in order to protect the organic light emitting device, which is vulnerable to moisture, from being exposed to moisture. The encapsulation unit may be formed in a structure in which inorganic layers and organic layers are alternately stacked. For example, the encapsulation unit may include, but is not limited to, a first inorganic layer made of an inorganic material, an organic layer disposed on the first inorganic layer and made of an organic material, and a second inorganic layer covering the organic layer on the organic layer and made of an inorganic material.

Next, a temporary protective film 140 is disposed on the pixel array layer 130 ( S115 ).

Referring to FIG. 2C , a temporary protective film 140 is disposed on the pixel array layer 130 . The temporary protective film 140 is a protective film for protecting the display unit and the circuit unit during the manufacturing process of the organic light emitting display device, and is temporarily used during the manufacturing process of the organic light emitting display device and then removed. The temporary protective film 140 is disposed to correspond to the front surface of the lower mother substrate 110 .

The temporary protective film 140 may include a base film and an adhesive layer disposed on one surface of the base film. The base film of the temporary protective film 140 is a film made of a plastic material, and is a film for supporting the adhesive layer. The base film of the temporary protective film 140 may be made of, for example, polyethylene terephthalate (PET). The adhesive layer of the temporary protective film 140 may be made of a material having adhesive properties. As will be described later, the temporary protective film 140 should be removed during the manufacturing process of the organic light emitting display device, but should not be peeled off when adsorbed by an attachment plate for fixing during the manufacturing process. Therefore, the release force of the adhesive layer of the temporary protective film 140 . This is a major factor for selecting the material of the adhesive layer. Since the temporary protective film 140 is easily removed during the manufacturing process of the organic light emitting display device, and is not peeled off when it is adsorbed by the attachment plate, the adhesive strength of the adhesive layer of the temporary protective film 140 may be 10 gf/inch or less, preferably 5.3 gf/inch.

It is preferable that the adhesive layer is not exposed to the outside before the temporary protective film 140 is used to manufacture the organic light emitting diode display. Accordingly, in order to protect the adhesive layer of the temporary protective film 140 , the temporary protective film 140 may be transported while the release film is attached to the adhesive layer. Thereafter, the temporary protective film 140 may be used by removing the release film to expose the adhesive layer of the temporary protective film 140 .

When the temporary protective film 140 is disposed only on a partial area rather than the front surface of the lower mother substrate 110 , a problem may occur in the process of attaching the support film 160 , which will be described later. For example, when each of the plurality of temporary protective films 140 is disposed to correspond to each cell CE or each of the plurality of temporary protective films 140 is disposed to correspond to each row in a stick type, temporary protection Since there is a space where the film 140 is not disposed, a stepped structure may occur. Accordingly, the pressure for attaching the support film 160 is not evenly applied due to the above-described step structure during the attachment process of the support film 160 . Accordingly, when the support film 160 is attached, air bubbles or the like may occur, or adhesion/degassing failure may occur. Accordingly, in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, the temporary protective film 140 is disposed to correspond to the front surface of the lower mother substrate 110 , so that when the support film 160 is attached as described above, The problem can be solved.

When the temporary protective film 140 is disposed, the temporary protective film 140 may be disposed such that the adhesive layer of the base film and the adhesive layer of the temporary protective film 140 faces the pixel array layer 130 . Also, when the encapsulant is disposed on the pixel array layer 130 as described above, the temporary protective film 140 may be disposed such that the adhesive layer of the temporary protective film 140 is in contact with the encapsulant.

In some embodiments, a barrier film may be disposed between the pixel array layer 130 and the temporary protective film 140 . As described above, since the organic light emitting diode is vulnerable to moisture, a barrier film may be disposed to cover at least the display unit.

Subsequently, the rear surface of the lower mother substrate 110 opposite to the surface on which the sacrificial layer 111 is disposed may be cleaned. Specifically, the rear surface of the lower mother substrate 110 may be cleaned using a brush. In the organic light emitting display device manufacturing process, stained foreign substances such as fingerprints and saliva may be disposed on the rear surface of the lower mother substrate 110 . In addition, a thread and other floating foreign materials disposed on the rear surface of the lower mother substrate 110 may be disposed. Accordingly, in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, a process of cleaning the rear surface of the lower mother substrate 110 using a brush may be employed to remove stained foreign matter and floating foreign matter, and scratch It is possible to suppress the occurrence of breakage due to, etc.

Next, a laser is irradiated to the lower mother substrate 110 (S120).

Referring to FIG. 2D , the laser is irradiated to the rear surface of the lower mother substrate 110 , that is, the surface opposite to the surface on which the sacrificial layer 111 is disposed in the lower mother substrate 110 . Specifically, in a state in which the lower mother substrate 110 , the sacrificial layer 111 , the flexible substrate 120 , the pixel array layer 130 , and the temporary protective film 140 are vertically inverted as shown in FIG. 2C , the lower The first laser source 810 is disposed to be spaced apart from the rear surface of the mother substrate 110 by a predetermined distance. The first laser source 810 may be a laser source for irradiating a UV laser. Thereafter, the adhesive force between the sacrificial layer 111 and the flexible substrate 120 may be weakened by irradiating a laser from the first laser source 810 . Accordingly, as described later, the lower mother substrate 110 and the flexible substrate 120 may be separated from each other.

Meanwhile, when the sacrificial layer 111 and/or the flexible substrate 120 are not normally formed during the manufacturing process of the organic light emitting display device, the lower mother substrate 110 and the flexible substrate 120 may not be separated. Specifically, the sacrificial layer 111 and the flexible substrate 120 may not be formed on the entire surface of the lower mother substrate 110 , but may be formed only on a partial region of the lower mother substrate 110 . The sacrificial layer 111 is formed on the lower mother substrate 110 through a deposition process, and the flexible substrate 120 is formed on the lower mother substrate 110 through a squeeze process. The substrate 120 may not be formed in a region adjacent to the edge of the lower mother substrate 110 . Also, either one of the sacrificial layer 111 and the flexible substrate 120 may not be formed in a region adjacent to the edge of the lower mother substrate 110 .

As described above, when at least one of the sacrificial layer 111 and the flexible substrate 120 is not formed in a region adjacent to the edge of the lower mother substrate 110 , the lower mother substrate 110 is irradiated with a laser light. The substrate 110 and the flexible substrate 120 may not be separated. Accordingly, in the process of separating the lower mother substrate 110 and the flexible substrate 120 after the laser irradiation process, there may be a problem that the lower mother substrate 110 is not separated. Accordingly, the defect rate in product production increases and productivity decreases.

Accordingly, in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, after irradiating the laser to the lower mother substrate 110 , the temporary protective film 140 is irradiated with a laser along the edge of the lower mother substrate 110 . can That is, the laser may be irradiated along a line spaced inwardly by a predetermined distance from the end of the lower mother substrate 110 . Accordingly, the temporary protective film 140 , the pixel array layer 130 , the flexible substrate 120 , and the sacrificial layer 111 disposed on the edge of the lower mother substrate 110 may be scribed.

Next, the lower mother substrate 110 is removed (S125).

Referring to FIG. 2E , the flexible substrate 120 and the lower mother substrate 110 are separated by removing the lower mother substrate 110 . Specifically, by attaching the attachment stage 890 to the temporary protective film 140 to fix the temporary protective film 140 to the attachment stage 890 , and then moving the attachment stage 890 upward, the flexible substrate ( 120 and the lower mother substrate 110 may be separated. However, the present invention is not limited thereto, and the flexible substrate 120 and the lower mother substrate 110 may be separated using a means other than the attachment stage 890 .

On the other hand, as the laser is irradiated along a line spaced inwardly by a predetermined distance from the end of the lower mother substrate 110 as described above, the temporary protective film 140 disposed on the edge of the lower mother substrate 110, The pixel array layer 130 , the flexible substrate 120 , and the sacrificial layer 111 may remain fixed to the lower mother substrate 110 while the flexible substrate 120 and the lower mother substrate 110 are separated.

Then, the support film 160 is attached to the flexible substrate 120 (S130).

Referring to FIG. 2F , in a state in which the temporary protective film 140 , the pixel array layer 130 , and the flexible substrate 120 are attached to the attachment stage 890 , the support film 160 is attached to the rear surface of the flexible substrate 120 . is attached The support film 160 is a state in which the first protective film 161, which is a release film, is removed from the support film 160 illustrated in FIG. 1 . Accordingly, a roller 880 is used so that the adhesive layer 162 of the adhesive layer 162 , the back plate 163 and the second protective film 164 is in contact with the back surface of the flexible substrate 120 for the support film 160 . Thus, the support film 160 may be attached. In FIG. 2f , an embodiment in which the support film 160 is attached using the roller 880 in a state in which the rear surface of the flexible substrate 120 is disposed to face downward is illustrated, but the present invention is not limited thereto, and the configuration shown in FIG. 2f is not limited thereto. The supporting film 160 may be attached to the flexible substrate 120 using the roller 880 in a state in which the elements are inverted, that is, in a state in which the rear surface of the flexible substrate 120 is disposed to face upward.

Next, a laser is irradiated to the support film 160 corresponding to the boundary of the bending area BA ( S135 ).

2G and 2H , a laser is irradiated to the support film 160 corresponding to the boundary of the bending area BA using the second laser source 820 . The bending area BA is a portion of the non-display area NA of the organic light emitting diode display, and a module such as a flexible circuit board and a COF disposed on one side of the organic light emitting diode display is disposed on the rear side of the flexible substrate 120 . It is an area that is bent to be placed. The bending area BA is disposed between the display area DA and the pad area PA.

2G and 2H , the second laser source 820 may irradiate the laser while moving along the boundary of the bending area BA on the support film 160 . That is, as shown in FIG. 2G , the second laser source 820 may radiate a laser to the boundary of the bending area BA while moving from the right to the left of the support film 160 in the arrow direction. However, the present invention is not limited thereto, and the laser may be irradiated while the second laser source 820 moves in the opposite direction, and the second laser source 820 is fixed and the temporary protective film 140 , the pixel array layer 130 , The flexible substrate 120 and the support film 160 may move. The second laser source 820 may be a laser source for irradiating a CO2 laser or a laser source for irradiating a UV laser.

As described above, as the laser is irradiated to the boundary of the bending area BA, the support film 160 corresponding to the boundary of the bending area BA may be scribed as shown in FIG. 2H . That is, only the support film 160 may be scribed by adjusting the intensity, irradiation time, etc. of the laser irradiated from the second laser source 820 .

Then, a portion of the support film 160 corresponding to the bending area BA is removed ( S140 ).

Referring to FIG. 2I , a portion corresponding to the bending area BA of the support film 160 is removed. As described above, the adhesive layer 162 of the support film 160 has an initial adhesive strength through which the support film 160 can be easily removed from the flexible substrate 120 . Accordingly, it is easy to remove the support film 160 corresponding to the bending area BA. An adhesive tape may be used to remove the support film 160 disposed on the bending area BA, but is not limited thereto. As the portion of the support film 160 corresponding to the bending area BA is removed as described above, the flexible substrate 120 may be more easily bent.

Next, a process for strengthening the adhesiveness of the remaining support film 160 is performed (S145).

As described above, the adhesion layer 162 of the support film 160 may have different initial adhesion strength in an initial state and final adhesion force in a state in which a predetermined treatment has been performed, and a predetermined treatment for the adhesion layer 162 may be performed. The final adhesive force in the advanced state may be higher than the initial adhesive force in the initial state. As described above, in order to remove the portion of the support film 160 corresponding to the bending area BA, the initial adhesive force has a lower value than the final adhesive force. However, after the portion of the support film 160 corresponding to the bending area BA is removed, the adhesiveness of the remaining support film 160 corresponding to the area other than the bending area BA must be strengthened. The peeling of the support film 160 from the flexible substrate 120 may be prevented during the manufacturing process and after the organic light emitting display device is manufactured. Accordingly, in the method for manufacturing an organic light emitting display device according to an embodiment of the present invention, a process for strengthening the adhesiveness of the support film 160 remaining after the portion of the support film 160 corresponding to the bending area BA is removed is performed. is carried out

First, when the adhesive layer 162 is the UV curing type adhesive layer 162 , a UV irradiation process may be performed to increase the adhesive force of the adhesive layer 162 . As the UV irradiation process is performed on the adhesive layer 162 , the adhesive layer 162 is fully cured to increase adhesive strength, and the support film 160 is more strongly attached to the flexible substrate 120 to prevent peeling. have.

In addition, when the adhesive layer 162 is the adhesive layer 162 of the thermal curing type, a thermal curing process such as a baking process may be performed to increase the adhesive strength of the adhesive layer 162 . For example, the thermal curing process may be performed at a temperature of 60° C. to 70° C. for a time of 5 minutes to 10 minutes. Alternatively, the thermal curing process may be performed a plurality of times. As the heat curing process is performed on the adhesive layer 162 , the adhesive layer 162 is fully cured to increase adhesive strength, and the support film 160 is more strongly attached to the flexible substrate 120 to prevent peeling. have.

In addition, when the adhesive layer 162 is a chemical reaction type adhesive layer 162 , a primer treatment is performed on the adhesive layer 162 to which the adhesive layer 162 is attached, that is, one surface of the flexible substrate 120 , and the adhesive layer If (162) is attached to the surface to be adhered and left at room temperature, the adhesive force may gradually increase. Accordingly, the support film 160 is more strongly attached to the flexible substrate 120 , so that the peeling phenomenon can be prevented.

Next, a laser is irradiated to the boundary between the non-display area NA and the pad area PA (S150).

2J and 2K , a laser is irradiated to the boundary between the non-display area NA and the pad area PA using the third laser source 830 . The third laser source 830 moves along the boundary between the non-display area NA and the pad area PA on the temporary protective film 140 and applies a laser to the boundary between the non-display area NA and the pad area PA. can be investigated That is, as shown in FIG. 2J , the third laser source 830 moves from the right to the left of the temporary protective film 140 in the direction of the arrow and applies the laser to the boundary between the non-display area NA and the pad area PA. can be investigated However, the present invention is not limited thereto, and the laser may be irradiated while the third laser source 830 moves in the opposite direction, and the third laser source 830 is fixed and the temporary protective film 140 , the pixel array layer 130 , The flexible substrate 120 and the support film 160 may move. The third laser source 830 may be a laser source for irradiating a CO2 laser or a laser source for irradiating a UV laser.

As described above, as the laser is irradiated to the boundary between the non-display area NA and the pad area PA, temporary protection corresponding to the boundary between the non-display area NA and the pad area PA as shown in FIG. 2K . Film 140 may be scribed. That is, only the temporary protective film 140 may be scribed by adjusting the intensity of the laser irradiated from the third laser source 830 and the irradiation time.

Next, a laser is irradiated to the boundary of the plurality of cells CE (S155).

Referring to FIGS. 2L and 2M , a laser is irradiated to the boundary of the plurality of cells CE using the fourth laser source 840 . The fourth laser source 840 may radiate a laser to the boundary of the plurality of cells CE while moving along the boundary of the plurality of cells CE on the temporary protective film 140 . That is, as shown in FIG. 2L , the fourth laser source 840 irradiates a laser to the boundary of the plurality of cells CE while moving from the upper side to the lower side of the temporary protection film 140 in the direction of the arrow, and the temporary protection film The laser may be irradiated to the boundary of the plurality of cells CE while moving in the direction of the arrow from the right to the left of 140 . However, the present invention is not limited thereto, and the laser may be irradiated while the fourth laser source 840 moves in the opposite direction. The fourth laser source 840 may be a laser source for irradiating a UV laser or a laser source for irradiating a CO2 laser and a UV laser. In some embodiments, a plurality of laser sources may be used to irradiate a laser to the boundary of the plurality of cells CE. That is, one laser source for irradiating the CO2 laser and the other laser source for irradiating the UV laser may be used.

As described above, as the laser is irradiated to the boundary of the plurality of cells CE, the temporary protective film 140, the pixel array layer 130, the flexible substrate 120, and the The support film 160 may be scribed. Accordingly, the plurality of organic light emitting display devices may be divided into cell unit organic light emitting display devices.

Next, the temporary protective film 140 is removed (S160).

First, referring to FIG. 2N , the temporary protective film 140 corresponding to the pad area PA of the temporary protective film 140 is removed. In FIG. 2N , only the organic light emitting diode display corresponding to one cell CE among the plurality of cells CE is illustrated. As described above, the release force of the adhesive layer of the temporary protective film 140 has a value in which the adhesive layer is easily removed from the pixel array layer 130 or the encapsulation unit. Accordingly, it is easy to remove the temporary protective film 140 disposed on the pad area PA. An adhesive tape may be used to remove the temporary protective film 140 disposed on the pad area PA, but is not limited thereto.

Subsequently, dry cleaning may be performed on the pad area PA. Specifically, dry cleaning is performed by injecting air through the dry cleaner, so that foreign substances disposed in the pad area PA may be easily removed. As described above, since the organic light emitting device of the pixel array layer 130 is very vulnerable to moisture, damage to the organic light emitting device by moisture during the cleaning process can be minimized by performing dry cleaning.

Subsequently, a lighting test may be performed through the pad electrode disposed in the pad area PA. That is, the lighting test may be performed using a probe or the like on the pad electrode disposed in the pad area PA from which the temporary protective film 140 has been removed, and other tests may also be performed if necessary.

Subsequently, referring to FIG. 2O , the temporary protective film 140 corresponding to the non-display area NA and the display area DA is removed. An adhesive tape may be used to remove the temporary protective film 140 corresponding to the non-display area NA and the display area DA, but is not limited thereto.

Next, the polarizing plate 150 is attached on the pixel array layer 130 ( S165 ).

Referring to FIG. 2P , a polarizing plate 150 may be disposed on the pixel array layer 130 . An adhesive layer such as OCA may be disposed on the rear surface of the polarizing plate 150 , so that the polarizing plate 150 may be attached to the upper surface of the pixel array layer 130 . FIG. 2P is a cross-sectional view showing the cross-sectional view shown in FIG. 2O closer to the actual proportion, and FIG. 2P is only the proportion changed compared to FIG. 2O .

Next, the COF 180 is attached to the pad area PA ( S170 ).

Referring to FIG. 2P , the COF 180 is attached to the pad area PA of the flexible substrate 120 . The COF 180 may be implemented in a state in which a chip such as a driving IC is mounted on a base film made of a flexible material. Although it has been described that the COF 180 is attached to the pad area PA in FIG. 2P , the present invention is not limited thereto, and various modules such as a flexible printed circuit board may be attached to the pad area PA.

In some embodiments, a laser trim process or the like may be performed to deform the outer shape of the flexible substrate 120 . For example, when the organic light emitting display device is applied to a product having a shape other than a square shape, such as a smart watch, the external shape of the flexible substrate 120 may be changed to match the shape of the corresponding product. For example, when the organic light emitting diode display is applied to a smart watch having rounded corners, a laser trim process for rounding the corners of the flexible substrate 120 may be additionally performed.

Next, a micro cover layer (MCL) 190 is applied (S175).

Referring to FIG. 2Q , the micro cover layer 190 is applied to the bending area BA of the flexible substrate 120 . The micro cover layer 190 is an insulating layer disposed to reduce stress on various wirings and various insulating layers disposed in the bending area BA. That is, as the micro cover layer 190 is disposed on the bending area BA, the position of the neutral plane in the bending area BA may be adjusted, and a wiring that may receive stress as the bending area BA is bent. And by disposing the insulating layer as close to the neutral plane as possible, it is possible to minimize cracks in the wiring and the insulating layer as the bending area BA is bent.

Next, trimming is performed to match the shape of the organic light emitting diode display (S185).

Referring to FIG. 2R, as in FIGS. 2L and 2M described above, a laser 830 is irradiated to the boundary between the plurality of cells CE formed on the mother substrate, and the plurality of cells are divided into cell unit organic light emitting display devices. . However, the divided cell unit is scribing for separating each cell from the mother substrate, which is different from the actual organic light emitting diode display. Accordingly, a process of trimming in the form of an actual organic light emitting display device is performed. For example, a laser is irradiated to a trimming line using the fifth laser source 930 . The corners of each cell can be cut in a curved shape, and a notch can be formed in the center of the upper part of the cell to maximize the display area.

Next, the organic light emitting diode display is bent using the implant 195 ( S180 ).

The implant 195 is used to define a radius of curvature when the organic light emitting diode display is bent. For a more detailed description of the organic light emitting diode display bent using the implant 195 , reference is also made to FIG. 3 .

3 is a schematic cross-sectional view illustrating an organic light emitting diode display according to an exemplary embodiment.

Referring to FIG. 3 , the organic light emitting diode display 100 may be bent using the implant 195 . First, the second protective film 164 of the support film 160 is removed before the organic light emitting diode display 100 is bent. Thereafter, the organic light emitting diode display 100 is bent so that the backplate is in contact with the upper and lower surfaces of the implant 195 , and the flexible substrate 120 is in contact with one end of the implant 195 to contact the organic light emitting display apparatus 100 . A bending curvature of may be defined. However, the present invention is not limited thereto, and the implant 195 may not be in contact with the flexible substrate 120 .

After the organic light emitting diode display 100 is bent, a cover member (not shown) may be disposed on the polarizing plate. The cover member may be adhered through an adhesive layer (not shown). The cover member protects the pixel array layer 130 from external impact, and transmits light emitted from the pixel array layer 130 so that an image displayed on the pixel array layer 130 is viewed from the outside.

Such a cover member is, for example, polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), polyethylene terephthalate having impact resistance and light transmittance. It may be a film type formed of an organic material such as (polyethylene terephthalate, PET), PI (Polyimide), or PA (Polyaramid), or may be formed of an inorganic material such as thin glass or sapphire.

The adhesive layer may be, for example, an optically clear adhesive (OCA). OCA is specially manufactured for the purpose of using an optically transparent adhesive, and has excellent transparency and adhesion, so it is used for touch screen applications and various applications requiring optically transparent adhesion.

The adhesive layer is an acrylic resin, a poly(meth)acrylate-based resin, a vinyl resin, a styrene resin, an ester-based resin, a rubber-based resin, an epoxy-based resin, a polyimide resin, a polyamide resin, and a phenoxy resin in order to implement the above-described adhesion function. It may be composed of a resin, a polyurethane resin, or the like.

The inventors of the present specification discovered a problem involved in the process of bending the organic light emitting display device 100 and attaching a cover member (not shown) after each cell is cut to the actual shape of the organic light emitting display device 100 . did. In the scribing process of dividing a plurality of cells formed on the mother substrate into cells of each organic light emitting display unit, a laser is irradiated to the boundary of each cell to separate the cells, and the boundaries of each cell are all straight lines. However, as described above, the process of cutting each cell may include cutting in a straight line, but cutting in a curved line in order to form an actual organic light emitting display device. There is no problem in the part cut in a straight line, but if the laser is irradiated to the part cut in a curve, it is not cut evenly and microcracks may occur. Thereafter, when an additional process is performed and/or a reliability test is performed, cracks increase and defects occur. Accordingly, the inventors recognized this problem and devised a new structure and process in which cracks do not occur when cutting the cell.

4 is a schematic flowchart illustrating a method of manufacturing an organic light emitting diode display according to another exemplary embodiment. Since the same manufacturing method as in the past has already been described in FIG. 1 , only the parts that are different from FIG. 1 will be described.

Referring to FIG. 4 , after applying the micro cover layer ( S175 ), each cell is cut in the same manner as the actual organic light emitting display device ( S176 ). The reinforcing member 210 made of resin (resin) is coated on the side corners CA of each cut cell (S177). Then, the coated reinforcing member 210 is cured (S178). After the reinforcing member 210 is hardened, the overlaid reinforcing member 210 is removed to match the cutting line (S179). More details will be described with reference to FIGS. 6A to 6C .

5 is a plan view illustrating an organic light emitting diode display according to another exemplary embodiment. Referring to FIG. 5 , it can be seen that each cell is trimmed in the shape of an actual organic light emitting display device. The corner area CA located at the edge of the organic light emitting diode display 100 is cut into a curve rather than a straight line. The flexible substrate 120 including the bending area BA and the pad area PA also has a curved portion, but a wire transmitting a signal to the upper portion of the flexible substrate 120 and a micro-coating layer ( 190), so the problem described above does not occur.

6A to 6C are schematic cross-sectional views illustrating an organic light emitting diode display 100 according to another exemplary embodiment. 6A to 6C are cross-sectional views for explaining a manufacturing method newly added to the existing manufacturing method described with reference to FIG. 1 .

When trimming is performed as in the actual shape of the organic light emitting diode display 100 , the laser is irradiated inward from the trimming line within a margin of the trimming line. As described above, in the cut cell, microcracks are generated in the corner area CA of the corner. A reinforcing member 210 for preventing the expansion of cracks is coated on the corner area CA where microcracks occur (S177). The reinforcing member 210 may be made of an epoxy-based resin (resin) material. The reinforcing member 210 may be a thermosetting type including a thermosetting initiator. That is, the modulus of the reinforcing member 210 may be increased after the thermal curing process is performed in the initial state. The reinforcing member 210 may be a photocuring type including a photocuring initiator. When the photocuring initiator receives light such as UV, a photopolymerization reaction is initiated, and monomers (monomers) and dimers (dimers) form a polymer and are cured. UV used for curing may have a wavelength of 260 to 420 nm. The reinforcing member 210 may be a naturally-curing resin that does not contain an initiator. Natural curing can be initiated by moisture by absorbing moisture in the air. Therefore, the bonding operation can be simplified and curing at room temperature is possible without the need for curing treatment such as heating.

The reinforcing member 210 may be in a state having viscosity for coating in an initial state. In order to protect the cut surface of the cracked cell, a process of hardening the reinforcing member 210 may be performed (S178). As described above, the resin (resin) contains an initiator for curing. As shown in FIG. 6B , the reinforcing member 210 may be hardened using the hardening device 260 . Although the curing process includes thermal curing, photocuring, and natural curing processes, in this embodiment, a photocuring process using UV is performed.

The reinforcing member 210 on which the curing process is completed has a greater modulus than the micro-coating layer 190 . In the present specification, a modulus of 1 GPa or more is defined as a high modulus, and a resin (resin) having a high modulus is defined as a high modulus resin. In the case of the micro-coating layer, the modulus may be 200 to 300 MPa. The high modulus resin of the present specification may have a modulus of 3 GPa or more.

The reinforcing member 210 may include a dye. For example, it may include a pigment such as carbon black. In this way, when a dye is added to the reinforcing member 210 , when light leakage occurs through the side surface of the polarizing plate of the organic light emitting diode display, light leakage may be blocked. When light leakage occurs, image quality of the organic light emitting diode display may be deteriorated. Accordingly, adding a dye to the reinforcing member 210 also has an effect of blocking light leakage.

The reinforcing member 210 may have a thickness of 8 μm to 100 μm in order to block light and reinforce a cracked portion. A thickness of at least 8 μm is required to block light. When the thickness of the reinforcing member 210 exceeds 100 μm, the flexible substrate 120 may have an additional bezel even without the reinforcing member 210 because the bezel portion of the non-display area becomes thick. ) is not needed.

Since the reinforcing member 210 has a low modulus before hardening, the lower side may be thicker than the upper side due to gravity. Alternatively, overcoating may occur due to the coating equipment. The reinforcing member 210 applied to the lower surface of the back plate 163 or the upper surface of the polarizing plate 150 is later removed together when the release film attached to the back plate 163 and the polarizing plate 150 is removed. The reinforcing member 210 overlaid on the side may be a factor of failure when fastening the set parts. Accordingly, a process of removing the reinforcing member 210 overlaid outside the trimming line by using the sixth laser source 950 may be performed (S179).

After removing the overlaid reinforcing member 210, the reinforcing member 210 is in contact with the side surfaces of the back plate 163, the flexible substrate 120, the pixel array layer 130, and the polarizing plate 150 as shown in FIG. You can see that it is covered. Although not shown in FIG. 7 , in the case of a touch screen-integrated organic light emitting display device in which the touch sensor layer is formed between the pixel array layer 130 and the polarizing plate 150 , a side surface of the touch sensor layer may also contact the reinforcing member.

As described above, in the organic light emitting display device according to an example of the present specification, a crack occurs when the organic light emitting diode display is cut into a curve by coating a reinforcing member made of a resin (resin) on the curved corner region of the side surface of the organic light emitting display device. Corner areas can be reinforced. That is, when the organic light emitting display device is cut into an actual shape and then followed by a bending process, a cover member bonding process, a reliability test process, etc., cracks may increase to the inside of the pixel array layer. High modulus resin Propagation of cracks to the pixel array layer can be prevented by reinforcing (resin) by coating the cracked portion. Accordingly, the present invention can provide an organic light emitting diode display with improved durability by preventing defects (such as moisture permeation, disconnection, etc.) due to cracks occurring in the pixel array layer.

Although the embodiments of the present specification have been described in detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit thereof. Accordingly, the embodiments disclosed in the present specification are intended to explain, not to limit the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically variously linked and operated by those skilled in the art, and each embodiment may be implemented independently of each other or together in a related relationship. may be carried out. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

110: lower ledger substrate
111: sacrificial layer
120: flexible substrate
130: pixel array layer
140: temporary protective film
150: polarizer
160: support film
161: first protective film
162: adhesive layer
163: back plate
164: second protective film
180: COF
190: micro cover layer
195: implant
210: reinforcing member
260: curing device
100: organic light emitting display device
810: first laser source
820: second laser source
830: third laser source
840: fourth laser source
930: fifth laser source
950: sixth laser source
880: roller
890: attachment stage
CE: cell
PA: pad area
DA: display area
NA: non-display area
BA: bending area

Claims (20)

flexible substrate;
a support film disposed on a rear surface of the flexible substrate;
a pixel array layer disposed on an upper surface of the flexible substrate;
a polarizing plate disposed on the pixel array layer;
and a reinforcing member at a corner of the flexible substrate, the support film, the pixel array layer, and the polarizing plate.
The reinforcing member is in contact with side surfaces of the flexible substrate, the support film, the pixel array layer, and the polarizing plate.
According to claim 1,
The reinforcing member is an organic light emitting display device made of a resin (resin) material.
3. The method of claim 2,
The reinforcing member includes at least one of a photocuring initiator and a thermal curing initiator.
3. The method of claim 2,
The reinforcing member is an organic light emitting display device of a naturally-curing type resin that does not contain an initiator.
3. The method of claim 2,
The reinforcing member has a modulus of 3 GPa or more.
6. The method of claim 5,
The reinforcing member further includes a dye that blocks light.
7. The method of claim 6,
The dye includes at least one of black ink and carbon.
8. The method of claim 7,
The thickness of the reinforcing member is 8 μm to 50 μm.
According to claim 1,
The organic light emitting display device further comprising a touch sensor layer between the pixel array layer and the polarizing plate.
10. The method of claim 9,
The reinforcing member is in contact with a side surface of the touch sensor layer.
forming a plurality of cells on a lower mother substrate including a display area, a non-display area surrounding the display area, and a pad area extending from one side of the non-display area;
separating the plurality of cells by cell unit by irradiating a laser on the boundary of the plurality of cells;
attaching a polarizing plate to the top of the cell;
cutting the cell by irradiating a laser on the cutting line of the cell;
coating a reinforcing member on the side surface of the cell;
and curing the reinforcing member.
12. The method of claim 11,
The method of claim 1, wherein the reinforcing member is coated on a corner portion weak against cracks among side surfaces of the cell.
13. The method of claim 12,
wherein the reinforcing member is made of resin (resin).
14. The method of claim 13,
The method of manufacturing an organic light emitting display device, wherein the reinforcing member includes at least one of a photocuring initiator and a thermal curing initiator.
14. The method of claim 13,
wherein the reinforcing member has a modulus of 3 GPa or more.
16. The method of claim 15,
The method of manufacturing an organic light emitting display device, wherein the reinforcing member further includes a dye that blocks light.
17. The method of claim 16,
The thickness of the reinforcing member is 8 μm to 50 μm.
12. The method of claim 11,
Forming the plurality of cells comprises:
forming a sacrificial layer on a lower mother substrate in which a plurality of cells are defined;
forming a flexible substrate on the sacrificial layer;
forming a pixel array layer in each of a plurality of cells on the flexible substrate;
removing the lower mother substrate;
attaching a support film to the flexible substrate;
irradiating a portion of the support film corresponding to a boundary of a bending region of the flexible substrate;
removing a portion of the support film corresponding to the bending region of the flexible substrate;
performing a treatment for strengthening the adhesiveness of the support film remaining after a portion of the support film is removed;
and irradiating a boundary between the non-display area extending from the bending area and the pad area extending from the non-display area.
19. The method of claim 18,
The reinforcing member is in contact with side surfaces of the flexible substrate, the support film, the pixel array layer, and the polarizing plate.
19. The method of claim 18,
The method of manufacturing an organic light emitting display device comprising the step of cutting the overlaid portion of the reinforcing member after curing the reinforcing member.

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