KR20140023206A - Method for manufacturing member for electronic device, method for manufacturing electronic device, and member for electronic device - Google Patents

Abstract

The present invention relates to a method for manufacturing a member for an electronic device. The method for manufacturing a member for an electronic device includes: a seal process for manufacturing a seal structure which has a first lamination having a first substrate and a first supporting structure bonded with the first substrate as being able to be separated, a second lamination which is arranged to face the first lamination and has a second substrate and a second supporting structure bonded with the second substrate as being able to be separated, and a seal part formed to surround a device forming area for an electronic device between the first lamination and the second lamination; and a delamination process for delaminating the first supporting structure and the second supporting structure from the seal structure. A bonding part for bonding the first lamination and the second lamination is formed outside the seal part. The method of the present invention suppresses the delamination of the seal part and damage to the first substrate and the second substrate during the delamination process.

Description

TECHNICAL FIELD [0001] The present invention relates to a member for an electronic device, a method of manufacturing the electronic device, and a member for an electronic device. [0002]

TECHNICAL FIELD This invention relates to the member for electronic devices, the manufacturing method of an electronic device, and the member for electronic devices.

In recent years, miniaturization of electronic devices such as mobile phones, smart phones, portable information terminals, electronic book terminals, portable game machines, and the like, and electronic devices such as liquid crystal display panels, organic light emitting diodes (OLEDs), and electronic papers used therein The thinning and weight reduction of a device advance, and also the thinning of the glass substrate used for these electronic devices is progressing. However, the thinning of a glass substrate causes the problem that the strength of a glass substrate falls and the handleability of the glass substrate in the manufacturing process of an electronic device falls.

For this reason, conventionally, after forming various elements etc. using the glass substrate thicker than final plate | board thickness, the method of thinning a glass substrate by a chemical etching process is employ | adopted. However, according to this method, for example, when the thickness of the glass substrate is thinned to 0.7 mm to 0.2 mm or 0.1 mm, most of the material of the original glass substrate must be removed with an etching solution, so that the productivity and the use efficiency of raw materials are reduced. It is not necessarily desirable from the viewpoint.

In addition, in the thinning of the glass substrate by chemical etching, when minute scratches exist on the surface of the glass substrate, fine recesses (etch pits) starting from scratches are formed by etching treatment, resulting in optical defects. There is a case.

In order to cope with the above problem, it has been attempted to use a thin glass substrate having a final plate thickness from the beginning. Specifically, after laminating a glass substrate to a support structure, also called a reinforcement plate, to form a laminate, and forming various elements or the like on the surface of the glass substrate in the state of the laminate, a method of peeling the support structure from the glass substrate is It is proposed (for example, refer patent document 1). The support structure has a support plate and an adsorbent layer fixed on the support plate, and the glass substrate is in close contact with the adsorbent layer so as to be peelable. Finally, the support structure is peeled from the glass substrate, and a new glass substrate is laminated and reused in the peeled support structure.

Japanese Patent Application Laid-Open No. 8-86993

The member for liquid crystal display panels which is one type of member for electronic devices can be manufactured by the following method specifically using the said laminated body. In addition, below, the case where a liquid crystal dropping bonding system (ODF: One Drop Fill) is employ | adopted is shown.

First, two laminates are prepared, and a thin film transistor (TFT) is formed in a predetermined element formation region of one laminate and colored in the element formation region of the other laminate corresponding to this element formation region. The filter CF is formed. Subsequently, liquid crystal is dripped inside this frame-shaped sealing material, including a resinous sealing material so that the element formation area | region of one laminated body may be enclosed. Then, the laminate on the TFT side and the laminate on the CF side are laminated in a reduced pressure atmosphere and then exposed to atmospheric pressure to bring these laminates into close contact.

The sealing material is cured by irradiating ultraviolet rays to form a seal portion. Then, by peeling a support structure from each laminated body, the member for liquid crystal display panels which has one or two or more element formation areas which become a liquid crystal display panel is produced. Thereafter, a plurality of liquid crystal display panels are produced by cutting the glass substrate for each element formation region.

However, in the case of the method, when peeling the support structure from the member for the liquid crystal display panel, it is not necessarily peeled between the member for the liquid crystal display panel and the support structure, but inside the member for the liquid crystal display panel, specifically, the glass substrate and It may peel between sealing parts, and damage, such as a crack, may generate | occur | produce in a glass substrate. When peeling of a seal part and damage of a glass substrate generate | occur | produce in a member for liquid crystal display panels, this liquid crystal display panel member cannot be used for manufacture of a liquid crystal display panel.

This invention is made | formed in order to solve the said subject, The peeling of a seal part and the damage of a glass substrate can be suppressed at the time of peeling of a support structure, The member for electronic devices used for manufacture of electronic devices, such as a liquid crystal display panel, It aims at providing the manufacturing method of the member for electronic devices which can be manufactured favorably. Moreover, it aims at providing the manufacturing method of an electronic device which does not damage a glass substrate at the time of peeling of a support structure, and the member for high quality electronic devices.

The manufacturing method of the member for electronic devices of this invention has a sealing process and a peeling process. The seal step manufactures a seal structure having a first laminate, a second laminate, and a seal portion. The 1st laminated body has a 1st board | substrate and the 1st support structure joined so that peeling was possible with this 1st board | substrate. The 2nd laminated body is arrange | positioned facing a 1st laminated body, and has a 2nd board | substrate and the 2nd support structure joined with this 2nd board | substrate so that peeling was possible. The seal portion is formed to surround an element formation region serving as an electronic device between the first laminate and the second laminate. The peeling process peels a 1st support structure and a 2nd support structure from a seal structure. In the manufacturing method of the electronic device member of this invention, the adhesive part which adhere | attaches a 1st laminated body and a 2nd laminated body is formed in the outer side of a seal part. Thereby, peeling of the seal part in a peeling process and damage of a 1st board | substrate and a 2nd board | substrate are suppressed.

The manufacturing method of the electronic device of this invention has a member manufacturing process and a dividing process. A member manufacturing process manufactures the member for electronic devices by the manufacturing method of the member for electronic devices of this invention. The dividing step divides the member for an electronic device to manufacture an electronic device.

The electronic device member of this invention has a pair of laminated body, a seal part, and an adhesive part. A pair of laminated bodies have a board | substrate which has the 1 or more element formation area | region in which an electronic device is formed, and the support structure peelably joined to this board | substrate, and mutually mutual board | substrates are arrange | positioned opposingly. The seal portion is formed around the element formation region between the pair of laminates. The bonding portion is disposed outside the collecting region of the seal portion.

According to the present invention, by forming an adhesive portion separately from the seal portion on the outside of the seal portion, peeling of the seal portion and breakage of the glass substrate at the time of peeling the support structure from the seal structure in the peeling step can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows one Embodiment of the member for electronic devices.
FIG. 2 is a cross-sectional view taken along a line AA of the member for an electronic device shown in FIG. 1. FIG.
Explanatory drawing explaining the peeling method of the member for electronic devices shown in FIG.
4 is a plan view illustrating a modification of the member for an electronic device.
5 is a plan view showing another modification of the member for an electronic device.

Hereinafter, an embodiment of the present invention will be described.

The manufacturing method of the electronic device member of this embodiment has a sealing process and a peeling process.

The seal step is formed so as to surround an element formation region that is a first laminate, a second laminate disposed to face the first laminate, and an electronic device between the first laminate and the second laminate. A seal structure having a seal portion is produced.

The 1st laminated body has a 1st board | substrate and the 1st support structure joined so that peeling was possible with the said 1st board | substrate. The 2nd laminated body has a 2nd board | substrate and the 2nd support structure joined with the said 2nd board | substrate so that peeling was possible.

In a peeling process, a 1st support structure and a 2nd support structure are peeled from a seal structure.

In the manufacturing method of the electronic device member of this embodiment, especially, the adhesive part which adhere | attaches a 1st laminated body and a 2nd laminated body is formed in the outer side of a seal part, and peeling of a seal part in a peeling process, and a 1st board | substrate and agent 2 Suppresses damage to the substrate.

According to the manufacturing method of the electronic device member of this embodiment, in a sealing process, while forming a sealing part between a pair of board | substrates used as an electronic device member, it is an adhesive part separately from the said seal part on the outer side of the said sealing part. To form. In addition, a seal part and an adhesion part may be formed in the same process, and may be formed in a different process, respectively.

When peeling a support structure from each board | substrate of a seal structure, since the adhesive part is formed in the vicinity of a seal part separately from the said seal part, the stress applied locally to a seal part can be reduced, and peeling of a seal part, That is, peeling of a board | substrate and a seal part can be suppressed. Moreover, since the adhesive part is formed in the vicinity of the seal part separately from the seal part, the stress applied locally to the substrate can also be reduced, and the breakage of the substrate can also be suppressed.

EMBODIMENT OF THE INVENTION Hereinafter, the manufacturing method of the member for electronic devices of this embodiment is demonstrated with reference to drawings. First, the seal structure manufactured by the sealing process is demonstrated.

1 is a plan view illustrating an example of a seal structure, and FIG. 2 is a cross-sectional view taken along line A-A thereof. 3 is explanatory drawing explaining the peeling method of a seal structure.

The seal structure 10 is used for manufacture of the electronic device member 20, and has a part used as the electronic device member 20 in a part as shown in FIG. The seal structure 10 includes a first laminate 11, a second laminate 12, a seal portion 13, and an adhesive portion 14.

Although not shown, the liquid crystal is filled inside the electronic device member 20 when the filling material, for example, the electronic device member 20 is a liquid crystal display panel member, as necessary. In addition, when the electronic device member 20 is a liquid crystal display panel member, in the step of the seal structure 10, a liquid crystal may be filled inside the frame-shaped seal portion 13 depending on the manufacturing method, The liquid crystal does not have to be charged. In addition, you may distribute a spacer inside the seal part 13. For example, when the liquid crystal dropping bonding method is adopted, the liquid crystal is filled inside the seal portion 13 in the seal structure 10. In the case of adopting the liquid crystal injection method, in general, the liquid crystal is not filled inside the seal portion 13 in the seal structure 10, and the electronic device member 20 is used. Liquid crystal is injected.

The 1st laminated body 11 and the 2nd laminated body 12 are mutually arrange | positioned at intervals. The plurality of seal portions 13 are formed between the first laminate 11 and the second laminate 12 so as to surround the element formation region R, which is an electronic device such as a liquid crystal display panel, for example. have. In the seal structure 10 shown in FIG. 1, six frame-shaped seal parts 13 are formed corresponding to six element formation regions R. As shown in FIG.

The 1st laminated body 11 has the 1st board | substrate 111 and the 1st support structure 112 joined to the said 1st board | substrate 111 so that exfoliation was possible. The first support structure 112 further includes a first support plate 113 and a first adsorption layer 114 formed on one main surface of the first support plate 113. The 1st support structure 112 is joined by the 1st adsorption layer 114 to the 1st board | substrate 111 so that peeling is possible.

In addition, although the support structure 112 of this embodiment is comprised from the support plate 113 and the adsorption layer 114, you may comprise only the support plate 113. As shown in FIG. For example, the support plate 113 and the first substrate 111 may be detachably coupled to each other by van der Waals forces acting between the support plate 113 and the first substrate 111. In addition, when the support plate 113 and the first substrate 111 are heated, an inorganic thin film such as ITO, SiN, SiC or the like may be formed on the surface of the support plate 113 so that both do not adhere together at a high temperature. Moreover, by forming the area | region which differs in surface roughness on the surface of the support plate 113, the area | region with which the bonding force differs in the interface of the support plate 113 and the 1st board | substrate 111 may be formed. In addition, although the support structure 112 of this embodiment is comprised from one support plate 113 and one adsorption layer 114, the support plate 113 may be two or more, and similarly, the adsorption layer 114 may be two or more. .

The 2nd laminated body 12 has the 2nd board | substrate 121 and the 2nd support structure 122 joined to the said 2nd board | substrate 121 so that exfoliation was possible. The second support structure 122 further includes a second support plate 123 and a second adsorption layer 124 formed on one main surface of the second support plate 123. The second support structure 122 is detachably bonded to the second substrate 121 by the second adsorption layer 124. Also about the 2nd laminated body 12, it may consist of only the support plate 123, inorganic thin films, such as ITO, SiN, and SiC, may be formed, and the area | region from which surface roughness differs may be formed.

In addition, portions of the seal structure 10 except for the first support structure 112 and the second support structure 122, that is, the first substrate 111, the second substrate 121, and a seal portion disposed therebetween. (13), the bonding part 14, etc. become the electronic device member 20 used for manufacture of electronic devices, such as a liquid crystal display panel.

The 1st laminated body 11 and the 2nd laminated body 12 are arrange | positioned so that the 1st board | substrate 111 and the 2nd board | substrate 121 may oppose. Although the electronic device member 20 is a liquid crystal display panel member, although not shown in the element formation area | region used as the liquid crystal display panel on the surface of the 1st board | substrate 111 and the 2nd board | substrate 121, it is a liquid crystal display In accordance with the method and as necessary, an insulating film, a transparent electrode film, a switching element such as a thin film transistor (TFT) or a thin film diode (TFD), a color filter CF, and the like are formed.

The seal portion 13 is formed in a frame shape between the first laminate 11 and the second laminate 12 so as to surround the element formation region R that is an electronic device such as a liquid crystal display panel. The 1st laminated body 11 and the 2nd laminated body 12 are adhere | attached. The seal portion 13 is formed according to the number of element formation regions R, and as shown, when there are a plurality of element formation regions R, a plurality is formed, and when there is only one element formation region R, as shown in FIG. Only one is formed.

When the electronic device member 20 is a liquid crystal display panel member, the liquid crystal may or may not be charged inside the seal portion 13. When manufactured by the liquid crystal dropping bonding method, the liquid crystal is filled in the inside of the seal part 13 in the seal structure 10, and the shape of each seal part 13 is an opening part in order to hold the liquid crystal inside. It has a continuous frame shape without. On the other hand, when manufactured by the liquid crystal injection method, generally the liquid crystal is not filled in the seal part 13 in the seal structure 10, and the shape of each seal part 13 is internal in a subsequent process. It has a frame shape having an opening serving as an injection hole for injecting liquid crystal into the liquid crystal.

The adhesion part 14 adhere | attaches the 1st laminated body 11 and the 2nd laminated body 12 in the outer side of the seal part 13, and the 1st support structure 112 and the 2nd from the seal structure 10 are carried out. When peeling off the support structure 122, damage of the part used as the electronic device member 20, specifically, peeling of the seal part 13, and damage of the 1st board | substrate 111 and the 2nd board | substrate 121 are carried out. It becomes a shape and arrangement which can suppress this. That is, as long as damage to the part used as the electronic device member 20 at the time of peeling can be suppressed, the shape, arrangement | positioning, etc. of the bonding part 14 are not restrict | limited.

1, the adhesion part 14 is formed in linear form along the seal part 13 and along the outer periphery of the 1st laminated body 11 and the 2nd laminated body 12, for example. do. For example, when the seal structure 10 has a rectangular shape, the seal structure 10 is formed to extend in the long side direction of the seal structure 10 between the long side of the seal structure 10 and the seal portion 13 adjacent thereto. It is formed so that it may extend in the long side direction of the seal structure 10 between the seal parts 13 in the short side direction of the seal structure 10. As shown in FIG.

As for such a seal structure 10, the 1st support structure 112 peels from one end side, for example as shown in FIG. Specifically, it peels gradually over the direction of the opposite corner part from one corner part of the seal structure 10. At this time, since the adhesion part 14 is formed in the vicinity of the seal part 13, the peeling boundary line L which is a boundary line of the part which peeled already and the part peeled from now and is easy to apply a stress is the seal part 13 In addition to being located on the top, it is also located on the adjacent bonding portion 14. Thereby, it can suppress that a stress is locally applied only to a part of seal part 13, and peeling of the seal part 13, specifically, peeling of the 1st board | substrate 111 and the seal part 13 is carried out. The peeling of the 2nd board | substrate 121 and the seal part 13 can be suppressed. Similarly, local stress is applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed.

When the frame-shaped sealing material which becomes the frame-shaped sealing part 13 is arrange | positioned under reduced pressure, and is returned to atmospheric pressure, the inside of a frame is pressed and crushed by atmospheric pressure. Thereby, the width | variety of the linear part of a sealing material becomes wide, and the 1st board | substrate 111 and the 2nd board | substrate 121 are adhere | attached firmly. In addition, since the inside of the frame is pressed and crushed, the first substrate 111 and the second substrate 121 are partially separated at the time of peeling, or the first substrate 111 or the second substrate 121 is separated. Deformation cracking can be prevented. Therefore, as shown in FIG. 3, when peeling the 1st support structure 112 and the 2nd support structure 122, peeling and damage of the seal part 13 can be suppressed.

Moreover, also when peeling the 2nd support structure 122, it can carry out basically similarly, and the same effect can be acquired. In addition, as a peeling method of the 1st support structure 112 and the 2nd support structure 122, the method of the indication of international publication 2011/024689 etc. can be used.

When forming the linear bonding part 14, the area | region formed in the same length as the area | region in which the seal part 13 is formed, or the longer area | region in the long side direction of the seal structure 10 is formed. It is preferably formed in. Specifically, as shown in FIG. 1, in the case where three seal portions 13 are formed in the long side direction of the seal structure 10, it is similar to an area in which these three seal portions 13 are formed. It is preferable that it is formed in the area | region of the same length, or longer than it. By forming in such an area and length, for example, as shown in FIG. 3, when the second support structure 122 is peeled off from one corner portion, the peeling boundary L is located on the seal portion 13. At the same time, it is also located on the adhesive portion 14, and it is possible to suppress the stress applied locally to only a part of the seal portion 13, peeling off the seal portion 13 and the first glass substrate 111 and agent 2 The damage of the glass substrate 121 can be suppressed.

In addition, when forming the linear adhesion part 14, the adhesion part 14 formed between the long side of the seal structure 10 and the seal part 13 adjacent to the said long side is carried out from the seal part 13, It is preferable that the distance of is formed in the range of 10 mm. By making the distance from the seal part 13 to the adhesion part 14 close, peeling of the seal part 13 and damage of the 1st glass substrate 111 and the 2nd glass substrate 121 can be suppressed effectively. The inside of the range of 5 mm is more preferable, and, as for the distance from the seal part 13, the inside of the range of 3 mm is still more preferable. In addition, the distance of the adhesion part 14 and the seal part 13 does not necessarily need to be constant, Although it may differ in the longitudinal direction of the linear adhesion part 14, it is preferable to exist in the said range as a whole. Moreover, although the distance from the seal part 13 to the adhesion part 14 is so preferable, it is preferable that the adhesion part 14 is formed so that it may not contact with the sealing part 13. Here, the distance from the seal part 13 to the adhesion part 14 is made into the distance between the side part of the seal part 13, and the side part of the adhesion part 14. As shown in FIG.

In the case of forming the linear bonding portion 14, it is preferable to form at least between the long side of the seal structure 10 and the seal portion 13 adjacent to the long side, but in the short side direction of the seal structure 10. It is preferable to also form between the seal parts 13 in the process. In addition, when three or more seal parts 13 are formed in the short side direction of the seal structure 10, it is preferable to form between the whole seal parts 13 comrades. The adhesion part 14 formed between the seal parts 13 in the short side direction of the seal structure 10 is a viewpoint which equalizes the stress to the seal part 13 located in the both sides of the adhesion part 14 equally. In this case, the seal portions 13 are preferably formed at the center portion.

As for the width | variety of the linear adhesion part 14, 0.08 mm or more is preferable. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded by the bonding portion 14, and the peeling of the seal portion 13 and the first substrate 111 and Breakage of the second substrate 121 can be effectively suppressed. 0.1 mm or more is more preferable, and 0.5 mm or more of width is more preferable. The width | variety can fully adhere | attach the 1st board | substrate 111 and the 2nd board | substrate 121 as it is about 0.1 mm normally, From a viewpoint of productivity etc., 5 mm or less is preferable and 3 mm or less is more preferable.

4 is a plan view showing a modification of the seal structure 10, and in particular, a plan view showing a modification of the bonding portion 14.

About this seal structure 10, the structure other than the adhesion part 14, ie, the structure of the 1st laminated body 11, the 2nd laminated body 12, and the seal part 13, is shown in FIG. 1, FIG. It is similar to the seal structure 10 shown. The seal structure 10 differs in that the bonding portion 14 is formed along the periphery of the first laminate 11 and the second laminate 12 so as to surround the entirety of the plurality of seal portions 13. Do. Here, the frame-shaped area including the entirety of the plurality of seal parts 13 is an aggregation area.

Even when the frame-shaped adhesive portion 14 is formed so as to surround the entire seal portion 13, that is, the aggregate region, the peeling boundary L as shown in FIG. 3 is positioned on the seal portion 13. Simultaneously, it is also located on the adhesive part 14, and it can suppress that a stress is locally applied only to a part of the seal part 13, and peeling of the seal part 13, specifically, the 1st glass substrate ( Peeling of 111 and the seal part 13 and peeling of the 2nd glass substrate 121 and the seal part 13 can be suppressed. Similarly, local stress is applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed.

When forming the frame-shaped adhesive part 14, the adhesive part 14 formed between the long side of the seal structure 10 and the seal part 13 adjacent to the said long side is a distance from the seal part 13; Is preferably formed in the range of 10 mm. By making the distance from the seal part 13 to the adhesion part 14 close, peeling of the seal part 13 and damage of the 1st glass substrate 111 and the 2nd glass substrate 121 can be suppressed effectively. The inside of the range of 5 mm is more preferable, and, as for the distance from the seal part 13, the inside of the range of 3 mm is still more preferable. In addition, the distance of the adhesion part 14 and the seal part 13 does not necessarily need to be constant, Although it may differ in the longitudinal direction of the adhesion part 14, it is preferable to exist in the said range as a whole.

In addition, the adhesion part 14 formed between the short side of the seal structure 10 and the seal part 13 adjacent to the said short side is that the distance from the seal part 13 is formed in the range of 10 mm. desirable. By making the distance from the seal part 13 to the adhesion part 14 close, peeling of the seal part 13 and damage of the 1st board | substrate 111 and the 2nd board | substrate 121 can be suppressed effectively. The inside of the range of 5 mm is more preferable, and, as for the distance from the seal part 13, the inside of the range of 3 mm is still more preferable. In addition, the distance from the seal | sticker part 13 does not necessarily need to be constant, Although it may differ in the longitudinal direction of the adhesion part 14, it is preferable to exist in the said range as a whole.

The position of the bonding portion 14 is further preferably closer to the outer circumference (end surface of the substrate) of the first substrate 111 and the second substrate 121. In addition, it is preferable that the adhesion part 14 has a continuous linear pattern extending along the outer periphery of the 1st board | substrate 111 and the 2nd board | substrate 121 rather than a discontinuous dot pattern. In this way, the seal portion 13 is peeled off from the first substrate 111 and the second substrate 121 at the time of peeling the first support structure 112 and the second support structure 122, or the first substrate. Damage to the 111 and the second substrate 121 can be suppressed. It is preferable that the space | interval L1 of the outer periphery of the 1st board | substrate 111 and the 2nd board | substrate 121, and the linear part of the bonding part 14 in a lamination process becomes 10 mm or less.

The width of the frame-shaped adhesive portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded by the bonding portion 14, and the peeling of the seal portion 13 and the first substrate 111 and Breakage of the second substrate 121 can be effectively suppressed. 0.1 mm or more is more preferable, and 0.5 mm or more of width is more preferable. The width | variety can fully adhere | attach the 1st board | substrate 111 and the 2nd board | substrate 121 as it is about 0.1 mm normally, From a viewpoint of productivity etc., 5 mm or less is preferable and 3 mm or less is more preferable.

5 is a plan view showing another modification of the seal structure 10, and in particular, a plan view showing a modification of the bonding portion 14.

Also in this seal structure 10, the structure of other than the adhesion part 14, ie, the structure of the 1st laminated body 11, the 2nd laminated body 12, and the seal part 13, is shown in FIG. 1, FIG. It is similar to the seal structure 10 shown. This seal structure 10 differs in that the adhesion part 14 is formed so that each of the some seal part 13 may be enclosed.

Even when the frame-shaped adhesive portion 14 is formed so as to surround each of the plurality of seal portions 13, the peeling boundary L as shown in FIG. 3 is positioned on the seal portion 13 and the adhesive portion ( It is also located on 14, and it can suppress that a stress is applied locally only to a part of seal part 13, and peeling of seal part 13, specifically, 1st board | substrate 111 and seal part Peeling of (13) and peeling of the 2nd board | substrate 121 and the seal part 13 can be suppressed. Similarly, local stress is applied to the first substrate 111 and the second substrate 121, and damage to the first substrate 111 and the second substrate 121 can also be suppressed. In particular, by forming the frame-shaped adhesive portion 14 so as to surround each of the plurality of seal portions 13, the peeling of the seal portion 13 and the first separation, as compared with the case of forming the adhesive portion 14 of the other shape, Damage to the substrate 111 and the second substrate 121 can be effectively suppressed.

When forming the frame-shaped adhesion part 14 as mentioned above, it is preferable that the adhesion part 14 is formed in the range of 10 mm from the seal part 13. By making the distance from the seal part 13 to the adhesion part 14 close, peeling of the seal part 13 and damage of the 1st board | substrate 111 and the 2nd board | substrate 121 can be suppressed effectively. The inside of the range of 5 mm is more preferable, and, as for the distance from the seal part 13, the inside of the range of 3 mm is still more preferable. In addition, the distance from the seal | sticker part 13 does not necessarily need to be constant, Although it may differ in the longitudinal direction (circumferential direction) of the bonding part 14, it is preferable to exist in the said range as a whole.

The width of the frame-shaped adhesive portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first substrate 111 and the second substrate 121 can be effectively bonded by the bonding portion 14, and the peeling of the seal portion 13 and the first substrate 111 and Breakage of the second substrate 121 can be effectively suppressed. 0.1 mm or more is more preferable, and 0.5 mm or more of width is more preferable. The width | variety can fully adhere | attach the 1st board | substrate 111 and the 2nd board | substrate 121 as it is about 0.1 mm normally, From a viewpoint of productivity etc., 5 mm or less is preferable and 3 mm or less is more preferable.

As mentioned above, although the typical shape etc. of the adhesion part 14 were demonstrated, the shape of the adhesion part 14, etc., is carried out, when peeling the 1st support structure 112 and the 2nd support structure 122 from the seal structure 10, The shape and arrangement which can suppress the damage of the part which becomes the device member 20, specifically, peeling of the seal part 13, and the damage of the 1st board | substrate 111 and the 2nd board | substrate 121, etc. are especially It is not limited.

For example, the bonding part 14 encloses the whole of the some seal part 13 as shown in FIG. 4, and is limited to surrounding each seal part 13 as shown in FIG. It may not be sufficient, and may surround only the some seal part 13 which adjoins among the some seal parts 13, The lattice shape formed between each of the some seal parts 13 may be sufficient, In addition, according to the number and arrangement | positioning of the seal part 13, each shape as mentioned above can be combined. In addition, the linear or frame-shaped adhesive part 14 does not necessarily need to be comprised from continuous linear part, but may be comprised by discontinuous linear part, such as a dotted line shape.

As the 1st board | substrate 111 and the 2nd board | substrate 121, it is preferable that the glass plate whose plate | board thickness is 0.3 mm or less, respectively is used. By setting the plate thickness to 0.3 mm or less, the liquid crystal display panel can be effectively reduced in weight. Although the size of the 1st board | substrate 111 and the 2nd board | substrate 121 is not specifically limited, For example, 100 mm or more of length x 100 mm or more is preferable, 500 mm or more of length x 500 mm or more is more preferable, for example. Do. In particular, a size of at least 730 mm in length and at least 920 mm in width is preferable. By setting it as such a magnitude | size, a some liquid crystal display panel can be manufactured efficiently. In addition, in such a size, the effect by forming the adhesion part 14 separately from the seal part 13 is large. As such a 1st board | substrate 111 and the 2nd board | substrate 121, the well-known glass plate used for manufacture of a liquid crystal display panel is used.

The glass plate is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a forming method may be a general method, and for example, a float method, a fusion method, a slot down draw method, a pull-call method, a lubrication method, or the like is used. Particularly, a glass sheet having a small sheet thickness can be obtained by a method in which the glass molded into a plate shape is once heated to a molding-enabling temperature and thinned by means of drawing or the like (lead-through method).

The kind of glass plate is not necessarily limited, Oxide type glass which has alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high silica glass, and other silicon oxide as a main component is preferable. As oxide type glass, glass with a content of 40-90 mass% of the silicon oxide by oxide conversion is preferable.

Since elution of an alkali metal component tends to affect a liquid crystal, the glass (alkali free glass) which does not contain an alkali metal component substantially is preferable especially. As the alkali-free glass, a mass percent based on the oxide is 50 to 66% of SiO ₂ , 10 to 24% of Al ₂ O ₃ , 0 to 12% of B ₂ O ₃ , 0 to 8% of MgO, 0 to 14.5%, SrO: 0 to 24%, BaO: 0 to 13.5%, MgO + CaO + SrO + BaO: 9 to 29.5% and ZnO: 0 to 5%.

When the content of SiO ₂ is less than 50%, the strain point can not be sufficiently raised, chemical durability is deteriorated, and the thermal expansion coefficient is increased. If it exceeds 66%, the solubility is lowered and the melt temperature is increased. Preferably, it is 58 to 66 mol%.

Al ₂ O ₃ suppresses the phase separation of the glass, lowers the coefficient of thermal expansion, and raises the strain point. If the content is less than 10.5%, this effect is not exhibited, and if it exceeds 24%, the solubility of the glass is deteriorated. Preferably, it is 15 to 22%.

Although B ₂ O ₃ is not essential, it can improve the chemical durability against various chemicals used for semiconductor formation and achieve a decrease in the thermal expansion coefficient and density without increasing the viscosity at high temperature. If the content exceeds 12%, the acid resistance is deteriorated and the distortion point is lowered. Preferably, it is 5 to 12%.

MgO has a low coefficient of thermal expansion in the alkaline earth metal oxide, and since the distortion point is not lowered, MgO can be contained although not essential. When the content exceeds 8%, the chemical durability against various chemicals used for semiconductor formation is lowered, and the glass is more likely to be separated.

CaO, although not essential, can improve the solubility of the glass. On the other hand, when the content exceeds 14.5%, the thermal expansion coefficient increases and the melt temperature increases. Preferably, it is 0 to 9%.

Although SrO is not essential, it is a useful component in order to suppress powder phase of glass and to improve chemical durability with respect to the various chemicals etc. used for semiconductor formation. When the content exceeds 24%, the expansion coefficient is increased. Preferably it is 3-12.5%.

Although BaO is not essential, it is a useful component from a viewpoint of small density and small thermal expansion coefficient. The content is 0 to 13.5%, and 0 to 2% is preferable.

When the content of MgO + CaO + SrO + BaO is less than 9%, the dissolution becomes difficult. When the content exceeds 29.5%, the density becomes large. MgO + CaO + SrO + BaO is preferably 9 to 18%.

ZnO is not essential but may be added to improve the solubility, refinability and moldability of the glass. 0-5% is preferable and, as for the content, 0-2% is more preferable.

In order to improve the solubility, refinability, and moldability of the glass, in addition to the above components, SO ₃ , F, and Cl may be added to the alkali-free glass in a total amount of 5% or less.

As the alkali-free glass, it is preferable to use a glass composition containing 58 to 66% of SiO ₂ , 15 to 22% of Al ₂ O ₃ , 5 to 12% of B ₂ O ₃ , 0 to 8% of MgO, 0 to 9% of CaO, 3 to 12.5% of SrO, 0 to 2% of BaO and 9 to 18% of MgO + CaO + SrO + BaO.

The distortion point of the alkali-free glass is preferably 640 캜 or higher, and more preferably 650 캜 or higher. Coefficient of thermal expansion, less than 40 × 10 ^-7 / ℃ is preferred, and preferably is at least 30 × 10 ^-7 / ℃ 40 × 10 under ^-7 / ℃. The density is preferably less than 2.60 g / cc, more preferably less than 2.55 g / cc, and most preferably less than 2.50 g / cc.

In addition to the glass substrate, the first substrate 111 and the second substrate 121 may be a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or a composite in which a resin substrate and a glass substrate are bonded together. As the resin substrate, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether sulfone resin, polyether ketone resin, polyether ether ketone resin, polyethylene naphthalate resin , Polyacrylic resins, various liquid crystal polymer resins, silicone resins and the like.

The first support plate 113 and the second support plate 123 are not particularly limited as long as the first substrate 111 and the second substrate 121 can be effectively supported, and a glass plate, a ceramic plate, a metal plate, and a resin plate may be used. Suitable ones. As for the difference of the linear expansion coefficient of the 1st board | substrate 111 and the 1st support plate 113, 150x10 <^-7> / degrees C or less is preferable, ^100x10 <^-7> / degrees C or less is more preferable, ^{50x10 <-7>} / It is more preferable that the temperature is lower than or equal to. Similarly, as for the difference of the linear expansion coefficient of the 2nd glass substrate 121 and the 2nd support plate 123, 150x10 <^-7> / degrees C or less are preferable, ^100x10 <^-7> / degrees C or less are more preferable, 50x10 More preferably ^-7 / ° C or less.

As a glass plate, the thing of the kind similar to what is used for the 1st board | substrate 111 and the 2nd board | substrate 121 is used, and an alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high silica glass, and other silicon oxides are a main component An oxide glass to be used is preferable. As a metal plate, stainless steel, copper, etc. are illustrated.

As the resin plate, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether sulfone resin, polyether ketone resin, polyether ether ketone resin, polyethylene naphthalate resin , Polyacrylic resins, various liquid crystal polymer resins, silicone resins and the like.

The thickness of the first support plate 113 and the second support plate 123 is not particularly limited, but from the viewpoint of effectively supporting the first substrate 111 and the second substrate 121, each of 0.1 to 1.1 mm is used. Plate thickness is preferred. As for the plate thickness of the 1st support plate 113 and the 2nd support plate 123, the plate thickness especially applicable to the manufacturing line of the present liquid crystal display panel is preferable. For example, the plate | board thickness of the glass substrate used for the production line of the current liquid crystal display panel exists in the range of 0.5-1.2 mm, and there are many 0.7 mm especially. Therefore, for example, the plate thickness of the first substrate 111 or the second substrate 121 is 0.3 mm or less so that the plate thickness of the first laminate 11 or the second laminate 12 is 0.7 mm. In consideration of the above, it is preferable to determine the plate thickness of the first support plate 113 or the second support plate 123.

The 1st adsorption layer 114 can join the 1st board | substrate 111 so that peeling is possible, and compared with the peeling strength of the 1st support plate 113 and the 1st adsorption layer 114, the 1st board | substrate 111 And the peel strength of the first adsorption layer 114 is not particularly limited. In addition, since it is basically the same also about the 2nd adsorption layer 124, only the 1st adsorption layer 114 is demonstrated.

When peeling the 1st support structure 112 from the seal structure 10, it peels between the 1st board | substrate 111 and the 1st adsorption layer 114, and the 1st support plate 113 and the 1st adsorption layer 114 It is necessary not to peel between them. Therefore, it is preferable that the 1st adsorption layer 114 does not peel easily with the 1st support plate 113, but peels easily with the 1st board | substrate 111. FIG.

As a method of making the peeling strength of the 1st board | substrate 111 and the 1st adsorption layer 114 low compared with the peeling strength of the 1st support plate 113 and the 1st adsorption layer 114, for example, 1st adsorption | suction. After the curable silicone resin composition is applied onto the first support plate 113 using the curable silicone resin composition as the constituting layer 114, and cured to form the first adsorption layer 114, the first adsorption layer The method of joining the 1st board | substrate 111 on 114 is mentioned.

Further, even when the curable silicone resin composition is brought into contact with both the first substrate 111 and the first support plate 113 to be cured, the peel strength with the first support plate 113 is greater than that with the first substrate 111. When becomes high, you may harden by making curable silicone resin composition contact both the 1st board | substrate 111 and the 1st support plate 113. FIG. As such a method, the surface treatment which raises the density | concentration of a silanol group is mentioned, for example with respect to the surface of the 1st support plate 113 in order to raise a bonding force.

Examples of the curable silicone resin composition include an addition reaction type curable silicone resin composition containing an additive such as linear organoalkenyl polysiloxane, linear organohydrogenpolysiloxane and a catalyst, and curing by heating . The curable silicone resin composition of the addition reaction type tends to undergo a curing reaction and has a low curing shrinkage as compared with other curable silicone resin compositions, so that the cured product can be easily peeled off. Examples of the form of the addition reaction type curable silicone resin composition include a solvent type, an emulsion type, and a solventless type, but any form may be used. As the addition reaction-type curable silicone resin composition, for example, those disclosed in International Publication No. 2011/024775 are preferable.

The seal portion 13 is not particularly limited as long as the first substrate 111 and the second substrate 121 can be bonded to each other, and a known epoxy resin generally used for the production of a member for an electronic device of this kind is known. It can be made including the sealing material of.

The seal part 13 is epoxy resin etc. to one side of the 1st board | substrate 111 in the 1st laminated body 11, or the 2nd board | substrate 121 in the 2nd laminated body 12, for example. Can be formed by applying the sealing material in a predetermined shape, laminating the first laminate 11 and the second laminate 12 via the coating material of the sealing material, and then curing by heating.

The method of applying the sealing material is not particularly limited and may be drawn using a dispenser or an inkjet apparatus, or may be printed by screen printing. In addition, as a sealing material, it is not limited to epoxy resin, For example, an ultraviolet curable epoxy modified acrylic resin etc. may be sufficient.

The bonding portion 14 is not particularly limited as long as the first substrate 111 and the second substrate 121 can be bonded together, and the bonding portion 14 may include an adhesive such as an epoxy resin. The adhesion part 14 is epoxy resin etc. to one side of the 1st board | substrate 111 in the 1st laminated body 11, or the 2nd board | substrate 121 in the 2nd laminated body 12, for example. It can be formed by apply | coating an adhesive material in the predetermined shape as mentioned above, laminating | stacking the 1st laminated body 11 and the 2nd laminated body 12 through the coating material of an adhesive material, and hardening by heating. .

The application | coating method of an adhesive material is not specifically limited, You may draw using a dispenser or an inkjet apparatus, and you may print by screen printing. Moreover, as an adhesive material, it is not limited to epoxy resin, For example, an ultraviolet curable epoxy modified acrylic resin etc. may be sufficient.

It is preferable to form the adhesion part 14 at the same time as the formation of the seal part 13. Specifically, application of the sealing material serving as the seal portion 13 and application of the adhesive material serving as the bonding portion 14 are carried out, and the first laminate 11 and the second laminate 12 are coated with the sealing material and the adhesive material. It is preferable to laminate | stack via water, and to heat both etc. and to harden both. In particular, the sealing material used for the formation of the seal portion 13 and the adhesive material used for the formation of the bonding portion 14 are made to contain the same material, and the application of the sealing material and the adhesive material is performed using the same apparatus. It is preferable to perform at. By this method, the adhesion part 14 can be formed efficiently. In addition, as long as the damage of the seal part 13 etc. can be suppressed at the time of peeling of the 1st support structure 112 and the 2nd support structure 122, even if the adhesion part 14 is formed by a well-known other method, do.

In addition, a sealing material and an adhesive material apply | coat both to the 1st board | substrate 111 in the 1st laminated body 11, or the 2nd board | substrate 121 in the 2nd laminated body 12, and is formed. There is no need to do this, and it can also apply | coat and form independently of each other. For example, a sealing material may be apply | coated to the 1st board | substrate 111 in the 1st laminated body 11, and an adhesive material may be apply | coated to the 2nd board | substrate 121 in the 2nd laminated body 12, You may make it the opposite state.

The seal step is a step of manufacturing the seal structure 10 having the adhesive portion 14 of the predetermined shape as described above. The seal structure 10 is, for example, after the first laminate 11 and the second laminate 12 are manufactured, and then the seal structure 10 is sealed on the opposing surface of the first laminate 11 or the second laminate 12. After applying the sealing material which becomes the part 13 and the adhesive material which becomes the adhesion part 14, and laminating | stacking the 1st laminated body 11 and the 2nd laminated body 12 through a sealing material and an adhesive material, It is prepared by curing the adhesive.

The 1st laminated body 11 is manufactured by bonding the 1st board | substrate 111 to the support structure 114 so that peeling is possible, for example. The support structure 114 apply | coats the curable silicone resin composition used as the 1st adsorption layer 112 to the 1st support plate 113, and hardens and manufactures the said curable silicone resin composition. The 1st laminated body 11 is manufactured by bonding the 1st board | substrate 111 to the 1st adsorption layer 114 of the support structure 114 manufactured in this way, for example. Examples of the bonding method include a non-contact type pressing method using a pressure chamber, and a contact type pressing method using a roll or press. Also about the 2nd laminated body 12, it can basically manufacture similarly.

Electronic device member 20 is formed in each element formation region R of the first substrate 111 in the first laminate 11 and the second substrate 121 in the second laminate 12. ) Is a member for a liquid crystal display panel, according to the liquid crystal display system and, if necessary, switching elements such as an insulating film, a transparent electrode film, a thin film transistor (TFT), a thin film diode (TFD), a color filter CF, and the like. It forms (patterning process). Moreover, in order to arrange liquid crystal molecules, alignment films, such as a polyimide film, are printed and the groove | channel for orientating is formed (rubbing process).

For example, the seal portion may surround the element formation region R of the first substrate 111 in the first laminate 11 or the second substrate 121 in the second laminate 12. The sealing material which is (13) is coated, and the adhesive material which becomes the adhesion part 14 is apply | coated to the outer side in a predetermined shape. Then, when employ | adopting a liquid crystal dropping bonding system, after liquid crystal dropping in the element formation area | region R, the 1st laminated body 11 and the 2nd laminated body 12 through a spacer, a sealing material, an adhesive material, and a liquid crystal. Laminated. In addition, when employing a liquid crystal injection method, the first laminate 11 and the second laminate 12 are laminated via the sealing material and the adhesive material.

After lamination | stacking the 1st laminated body 11 and the 2nd laminated body 12, hardening of a sealing material and an adhesive material is performed. The hardening of a sealing material and an adhesive material can employ | adopt the optimal hardening method according to the hardening method of a sealing material and an adhesive material, For example, when an epoxy resin etc. are used as a sealing material and an adhesive material, it hardens by heating, When ultraviolet-curable epoxy modified acrylic resin etc. are used as a sealing material and an adhesive material, it hardens by ultraviolet irradiation. When a hardening system differs from a seal | sticker and an adhesive material, you may divide and harden | cure by two or more processes.

A peeling process peels the 1st support structure 112 and the 2nd support structure 122 from the seal structure 10, and manufactures the member 20 for electronic devices.

Peeling of the first support structure 112 from the seal structure 10 is, for example, a blade-shaped sharp edge at the interface between the electronic device member 20 and the first support structure 112. After inserting and forming the starting point of peeling, it can carry out by the method of spraying the mixed fluid of water and compressed air to this insertion part. For example, as shown in FIG. 3, the peeling is preferably performed gradually toward one end of the electronic device member 20 and the first support structure 112, particularly toward the opposite corner from the corner.

Preferably, both surfaces of the seal structure 10 are vacuum-adsorbed by a plurality of vacuum adsorption pads, and in this state, at the interface between one end of the electronic device member 20 and the first support structure 112, in particular, the corner part. A sharp blade-shaped thing is inserted and it moves so that the vacuum suction pad which adsorb | sucks the 1st support structure 112 may be lifted so that the 1st support structure 112 may peel gradually from this insertion part.

The peeling of the 2nd support structure 122 from the seal structure 10 (member 20 for electronic devices) can be performed basically similarly.

At the time of peeling, since the 1st board | substrate 111 and the 2nd board | substrate 121 in the electronic device member 20 are adhere | attached by the adhesion part 14 in the outer side besides the seal part 13, the seal part ( Peeling of 13), specifically, peeling of the 1st board | substrate 111 and the seal part 13 and peeling of the 2nd board | substrate 121 and the seal part 13 can be suppressed. In addition, damage to the first substrate 111 and the second substrate 121 can also be suppressed.

When the electronic device member 20 is a liquid crystal display panel member and the liquid crystal dropping bonding method is adopted, the liquid crystals are charged in the seal portions 13 of the liquid crystal display panels of the manufactured electronic device member 20. It is. Therefore, when the seal part 13 is formed in multiple numbers, for example, a liquid crystal display panel can be manufactured by isolate | separating into each seal part 13. In addition, as an unnecessary part with respect to the adhesion part 14, it isolate | separates from the seal part 13 and discards it normally.

In addition, in the case of a liquid crystal injection system, the liquid crystal is not filled in the seal part 13 which becomes each liquid crystal display panel of the member 20 for electronic devices manufactured generally. Therefore, liquid crystal is inject | poured into the seal part 13, and it is set as a liquid crystal display panel. Specifically, for example, liquid crystal is injected in the state of the electronic device member 20, and then separated into respective seal portions 13 to form a liquid crystal display panel. For example, after separating the electronic device member 20 into each seal part 13, liquid crystal may be inject | poured into each seal part 13, and it may be set as a liquid crystal display panel, and the electronic device member 20 ) May be separated into a predetermined size including several seal portions 13, and then liquid crystal is injected into each seal portion 13, and separated into respective seal portions 13 to form a liquid crystal display panel. .

Electronic devices, such as a liquid crystal display panel manufactured in this way, can be used as a display part of various electronic devices. Examples of the electronic device include personal computers such as mobile phones and laptop computers, portable information devices such as PDAs (Personal Digital Assistants), workstations, digital still cameras, digital video cameras, in-vehicle monitors, liquid crystal televisions, and car navigation systems. A device, an electronic notebook, an electronic calculator, a POS terminal, etc. are mentioned. As an electronic device, besides a liquid crystal display panel, OLED (Organic Light Emitting Diode), electronic paper, a liquid crystal lens, etc. are mentioned, for example.

In addition, the liquid crystal display panel can be a transmissive, reflective or semi-transmissive, monochrome or color liquid crystal display panel. Moreover, it can be set as various liquid crystal display panels of a passive matrix type and an active matrix type.

In the case of a liquid crystal display panel, as a filling material, liquid crystal materials, such as a thermotropic liquid crystal, a low molecular liquid crystal, a polymer liquid crystal, a polymer dispersion type liquid crystal, a ferroelectric liquid crystal, and an antiferroelectric liquid crystal, are used. These liquid crystal materials show a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, etc. by conditions. In the case of OLEDs, organic electroluminescent materials are used as the filling material.

As the electronic paper, for example, an electronic ink in which a plurality of microcapsules containing a first particle having a positive charge and a second particle having a negative charge are dispersed in a solvent is used to apply an electric field to the electronic ink, And moving the particles in opposite directions to display only the color of the collected particles on one side. In the case of such electronic paper, electronic ink is disposed as a filling material.

As the electronic paper, a twisted ball display system can be mentioned. In the twisted ball display system, spherical particles divided into white and black are arranged between a pair of electrodes, and a potential difference is generated between the pair of electrodes to control the direction of the spherical particles to perform display. In the case of such electronic paper, what has at least spherical particle | grains as a filling material is arrange | positioned. The liquid crystal lens is a liquid crystal enclosed in a lens-shaped space. By adjusting the applied voltage, the refractive index of the apparent liquid crystal is changed to realize the function of the optical lens.

As described above, the method of manufacturing the electronic device member of the embodiment has been described. However, the configuration of the electronic device member can be appropriately changed as long as it does not contradict the object of the present invention. For example, as a seal structure, it is not limited to having the number of seal parts as shown, and may have many seal parts. By having many sealing parts, a liquid crystal display panel can be manufactured more efficiently. In the case of forming a plurality of seal portions, the size, arrangement, and the like of each seal portion are not limited to the size, arrangement, and the like as shown, but can be appropriately changed. In addition, the adhesion part can change size, arrangement | positioning, etc. suitably according to the magnitude | size, arrangement | positioning, etc. of such a seal part.

This application is based on Japanese Patent Application No. 2012-180942 for which it applied on August 17, 2012, and Japanese Patent Application No. 2013-060430 for which it applied on March 22, 2013, The content is referred here. Included as.

10: seal structure
11: first laminate
12: second laminate
13: seal
14: adhesive part
20: member for an electronic device
111: first substrate
112: first support structure
113: first support plate
114: first adsorption layer
121: second substrate
122: second support structure
123: second support plate
124: second adsorption layer
R: element formation region

Claims (17)

A first laminated body having a first substrate and a first support structure bonded to the first substrate so as to be peelable, and disposed to face the first laminated body, and capable of being separated from the second substrate and the second substrate. A seal step of manufacturing a seal structure having a second laminate having a second support structure bonded securely, and a seal portion formed to surround an element formation region serving as an electronic device between the first laminate and the second laminate. and,
It is a manufacturing method of the member for electronic devices which has a peeling process which peels a said 1st support structure and a said 2nd support structure from the said seal structure,
The electron which forms the adhesive part which adhere | attaches the said 1st laminated body and the said 2nd laminated body to the outer side of the said seal part, and suppresses peeling of the said seal part in the said peeling process, and damage of the said 1st board | substrate and said 2nd board | substrate. The manufacturing method of the member for devices. The said electronic device member is a manufacturing method of the electronic device member of Claim 1 which has a plurality of said seal parts. The manufacturing method of the member for electronic devices of Claim 2 in which the said adhesion part is formed in linear form along the said seal part. The method for manufacturing an electronic device member according to claim 2, wherein the adhesive portion is formed so as to surround the entirety of the plurality of seal portions. The method for manufacturing an electronic device member according to claim 2, wherein the adhesive portion is formed to surround each of the plurality of seal portions. The said adhesion part is a manufacturing method of the member for electronic devices in any one of Claims 1-5 formed along the outer periphery of the said 1st laminated body and the said 2nd laminated body. The said bonding part is a manufacturing method of the member for electronic devices in any one of Claims 1-6 whose spacing of the linear part of the said bonding part, and the outer periphery of the said 1st board | substrate and the said 2nd board | substrate is 10 mm or less. The said 1st board | substrate and the said 2nd board | substrate have a plate | board thickness of 0.3 mm or less, The manufacturing method of the member for electronic devices in any one of Claims 1-7. The said 1st board | substrate and the said 2nd board | substrate are manufacturing methods of the member for electronic devices in any one of Claims 1-8 which have a size of 730 mm x 920 mm or more. The method of manufacturing a member for an electronic device according to any one of claims 1 to 9, wherein the first substrate and the second substrate include an alkali free glass. The manufacturing method of the member for electronic devices of Claim 10 in which the said 1st board | substrate and the said 2nd board | substrate contain the alkali free glass containing the following by the mass percentage display on an oxide basis.
SiO ₂ : 50 to 66%,
Al ₂ O ₃ : 10.5-24%,
B ₂ O ₃ : 0-12%,
MgO: 0 to 8%,
CaO: 0-14.5%,
SrO: 0-24%,
BaO: 0-13.5%,
MgO + CaO + SrO + BaO: 9 to 29.5%, and
ZnO: 0 to 5%. The manufacturing method of the member for electronic devices of Claim 10 in which the said 1st board | substrate and the said 2nd board | substrate contain the alkali free glass containing the following by the mass percentage display on an oxide basis.
SiO ₂ : 58-66%,
Al ₂ O ₃ : 15-22%,
B ₂ O ₃ : 5-12%,
MgO: 0 to 8%,
CaO: 0-9%,
SrO: 3 to 12.5%,
BaO: 0-2%, and
MgO + CaO + SrO + BaO: 9 to 18%. The electronic device according to any one of claims 1 to 12, wherein in the peeling step, the peeling of the first support structure and the second support structure from the seal structure is performed gradually from one end of the seal structure. Method for producing a dragon member. The method of manufacturing a member for an electronic device according to any one of claims 1 to 13, wherein the electronic device is any one of a liquid crystal display panel, an OLED, and an electronic paper. The said 1st board | substrate and the said 2nd board | substrate are either any one of a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or the composite which bonded the resin substrate and the glass substrate, The manufacturing method of the member for electronic devices which is one. A member manufacturing process which manufactures the member for electronic devices by the manufacturing method of the member for electronic devices in any one of Claims 1-15,
A dividing step of dividing the electronic device member to produce an electronic device
Of the electronic device. A pair of laminates each having a substrate having at least one element formation region where an electronic device is formed, a support structure detachably joined to the substrate, and having substrates opposed to each other;
A seal portion formed around the element formation region between the pair of laminates,
Bonding portion disposed outside the gathering region of the seal portion
An electronic device member having a.

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