JP2013127994A - Light emitting device, light emitting device module, and manufacturing method of light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which reduces the cost of an apparatus equipped with the light emitting device and improves the light utilization efficiency.SOLUTION: A light emitting device comprises: a substrate 10 where a filling groove 11, having open surfaces 11a on two surfaces facing each other in one direction, is recessed; a light emitting element 2 installed on a bottom surface of the filling groove 11; and a sealing material 3 with which the filling groove 11 is filled to seal the light emitting element 2, the sealing material 3 being made of a transparent resin.

Description

  The present invention relates to a light emitting device in which a light emitting element is sealed in a substrate and a method for manufacturing the same. The present invention also relates to a light-emitting device module in which light-emitting devices in which light-emitting elements are sealed in a base are arranged in parallel in one direction.

  A conventional light emitting device is disclosed in Patent Document 1. This light-emitting device includes a base body having a bottomed truncated cone-shaped filling hole in the upper part, and a light-emitting element such as an LED is installed on the bottom surface of the filling hole. The filling hole is filled with a sealing material made of a transparent resin, and the light emitting element is sealed.

  The light emitted from the light emitting element is guided upward and laterally through the inside of the sealing material, and the light traveling in the lateral direction is reflected by the inner peripheral wall of the filling hole made of an inclined surface and travels upward. Thereby, light is emitted from the upper surface of the filling hole at a predetermined directivity angle corresponding to the inclination angle of the inner peripheral wall of the filling hole.

  Patent Document 2 discloses a light emitting device in which a sealing material protrudes above a filling hole. Light emission of the light emitting element is guided through the inside of the sealing material and emitted from the upper surface and the peripheral surface of the sealing material above the filling hole. Thereby, the directivity angle of the emitted light of the light emitting device can be widened.

Japanese Unexamined Patent Publication No. 2004-253404 (pages 6 to 10, FIG. 5) JP 2006-60253 A (page 3 to page 4, FIG. 1)

  FIG. 18 is a perspective view showing an edge light type backlight used in a liquid crystal display device or the like. The backlight 50 includes a light emitting device module 40 having a plurality of light emitting devices 1 and a light guide plate 51. In the light emitting device module 40, a plurality of light emitting devices 1 are mounted on a substrate 41, and the light emitting devices 1 are linearly arranged in one direction. The flat light guide plate 51 has an emission surface 51a facing a display panel (not shown). The light emitting device module 40 is disposed so as to face the incident surface 51b formed from one side surface of the light guide plate 51, and the upper surface of the light emitting device 1 faces the incident surface 51b.

  The light emitting device 1 emits light in the direction of the incident surface 51b (X direction). Light incident on the light guide plate 51 from the incident surface 51b is guided through the light guide plate 51 and emitted from the output surface 51a. Thereby, the display panel is illuminated.

  According to the light emitting device disclosed in Patent Document 1, each light emitting device 1 is arranged in the juxtaposed direction (Y direction) of the light emitting device 1 and the direction perpendicular to the juxtaposed direction (Z direction) by the inclination of the inner peripheral wall of the filling hole. It has a predetermined directivity angle. For this reason, when the space | interval of the light-emitting devices 1 becomes large, a light quantity will be insufficient in the area | region between the light-emitting devices 1, a dark part will be formed, and a brightness nonuniformity will generate | occur | produce. Therefore, since it is necessary to reduce the interval between the light emitting devices 1 so that dark portions are not formed, there is a problem that a large number of the light emitting devices 1 are required and the cost of the light emitting device module 40 is increased.

  According to the light emitting device disclosed in Patent Document 2, since the directivity angle in the Y direction is widened, the interval between the light emitting devices 1 can be increased. Therefore, the cost of the light emitting device module 40 can be reduced. However, since the directivity angle in the Z direction is also widened, the light traveling outside the incident surface 51a and the light reflected by the incident surface 51a increase. Accordingly, there is a problem that the use efficiency of the emitted light of the light emitting device 1 is lowered.

  An object of the present invention is to provide a light-emitting device that can reduce the cost of equipment equipped with the light-emitting device and improve the light utilization efficiency, and a method for manufacturing the same. It is another object of the present invention to provide a light emitting device module that can reduce costs and improve light utilization efficiency.

  In order to achieve the above object, a light emitting device of the present invention includes a base body in which a filling groove having an open surface on two surfaces facing in one direction is recessed, a light emitting element installed on the bottom surface of the filling groove, And a sealing material made of a transparent resin that fills the filling groove and seals the light emitting element.

  According to this configuration, the light emitting element is disposed on the bottom surface of the filling groove that is recessed in the base, and the light emitting element is sealed by filling the filling groove with the sealing material. The filling groove has two open surfaces that face in one direction, and light emitted from the light emitting element is emitted from the upper surface of the filling groove while being guided through the sealing material, and from the open surface facing the side surface. Thereby, the directivity angle of the emitted light of the light emitting device is small in the direction in which the side walls of the filling groove face each other, and increases in the direction in which the open surface faces.

  According to the present invention, in the light emitting device having the above structure, the base is formed of ceramic.

  According to the present invention, in the light emitting device configured as described above, a step portion lower than a lower end of the open surface is formed on the bottom surface of the filling groove, and the light emitting element is arranged in the step portion. According to this configuration, a part of the light emitted from the light emitting element is blocked by the wall surface of the stepped portion, and the amount of emitted light from the open surface and the directivity angle in the direction in which the open surface is opposed are suppressed. Further, since the sealing material is in contact with the wall surface of the stepped portion, the contact area with the substrate is increased, and the adhesion strength of the sealing material is improved.

  According to the present invention, in the light emitting device having the above structure, opposing side walls of the filling groove are formed non-parallel at both ends.

  The light-emitting device module of the present invention is characterized in that a plurality of light-emitting devices having the above-described configuration are arranged side by side, and the open surfaces of the adjacent light-emitting devices are arranged to face each other.

  The light emitting device manufacturing method of the present invention includes an element installation step of installing a light emitting element on a bottom surface of a concave portion provided in a base material, and a sealing material made of a transparent resin filled in the concave portion. And a sealing material filling step for cutting the two opposing surfaces of the sealing material together with the first side wall and the second side wall across the first side wall and the second side wall facing each other in the recess. And a cutting step.

  According to this configuration, the concave portion having the annular inner wall or the inner wall with two opposite surfaces opened is recessed in the base material, and the light emitting element is installed on the bottom surface of the recess by bonding or the like in the element installation step. In the sealing material filling step, the recess is filled with the sealing material, and the light emitting element is sealed. In the sealing material cutting step, two opposing surfaces of the sealing material intersecting the first side wall and the second side wall facing the recess are cut by dicing or the like. Thereby, the two opposing surfaces of the recess filled with the sealing material are cut to form a filling groove having an open surface opened by the cut surface of the sealing material.

  According to the present invention, in the method of manufacturing a light emitting device having the above-described configuration, the recess has an annular inner peripheral wall in which the first side wall and the second side wall are connected by a connecting portion, and the connecting portion is cut in the sealing material cutting step. It is characterized by having been removed. According to this configuration, the base material is provided with a recess having an annular inner wall. In the sealing material cutting step, the sealing material is cut so as to intersect with the first side wall and the second side wall that face each other, and the connecting portion that connects the first side wall and the second side wall is removed.

  According to the present invention, in the manufacturing method of the light emitting device having the above-described configuration, a cutting depth in the sealing material cutting step is shallower than a depth of the concave portion. According to this configuration, the sealing material is cut while leaving the lower portion of the recess in the sealing material cutting step, and the open surface of the filling groove that fills the sealing material is formed by the cut surface. Thereby, the step part lower than the lower end of an open surface is formed in the bottom face of a filling groove.

  According to the present invention, in the method for manufacturing a light emitting device having the above-described configuration, the first side wall and the second side wall are formed non-parallel near the cutting position in the sealing material cutting step. According to this configuration, the opening area of the open surface is varied depending on the cutting position in the sealing material cutting step. Therefore, the amount of light emitted from the open surface can be adjusted by the cutting position.

  According to the light emitting device of the present invention, the filling groove that is recessed in the base and filled with the sealing material has the open surfaces on the two surfaces facing in one direction, so that the light emission of the light emitting element guides the sealing material. The light is emitted from the upper surface and the open surface. Thereby, the directivity angle of the emitted light of the light emitting device can be reduced in the direction in which the side walls of the filling groove face each other, and can be increased in the direction in which the open surface faces. Therefore, the interval between the light emitting devices can be increased in a device in which a plurality of light emitting devices are arranged in one direction, so that the cost of the device equipped with the light emitting device can be reduced and the light use efficiency can be improved.

  Further, according to the light emitting device module of the present invention, a plurality of light emitting devices having open surfaces on two surfaces that are recessed in the base and filled with the sealing material in one direction are arranged side by side. Since the open surfaces are opposed to each other, the interval between the light emitting devices can be increased. Therefore, it is possible to reduce the cost of the light emitting device module and improve the light use efficiency.

  According to the method for manufacturing a light emitting device of the present invention, the sealing material cutting is performed by cutting the two opposing surfaces of the sealing material together with the first side wall and the second side wall so as to intersect the first side wall and the second side wall facing the recess. Since the process is provided, it is possible to easily realize a filling groove that is filled with a sealing material and has open surfaces on two surfaces facing in one direction.

The perspective view which shows the light-emitting device of 1st Embodiment of this invention. The top view which shows the light-emitting device of 1st Embodiment of this invention. AA sectional view of FIG. The top view which shows the base material of the light-emitting device of 1st Embodiment of this invention. BB sectional view of FIG. The top view which shows the element installation process of the light-emitting device of 1st Embodiment of this invention. The top view which shows the sealing material filling process of the light-emitting device of 1st Embodiment of this invention. The top view which shows the sealing material cutting process of the light-emitting device of 1st Embodiment of this invention. The top view which shows the slice process of the light-emitting device of 1st Embodiment of this invention. The front view which shows the light-emitting device module which mounts the light-emitting device of 1st Embodiment of this invention. The top view which shows the light-emitting device module which mounts the light-emitting device of 1st Embodiment of this invention. The top view which shows the other aspect of the light-emitting device of 1st Embodiment of this invention. Sectional drawing which shows the further another aspect of the light-emitting device of 1st Embodiment of this invention. The perspective view which shows the light-emitting device of 2nd Embodiment of this invention. The top view which shows the other base material of the light-emitting device of 1st, 2nd embodiment of this invention. The top view which shows the other base material of the light-emitting device of 1st, 2nd embodiment of this invention. CC sectional view of FIG. Perspective view showing an edge light type backlight

  Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are perspective views showing the light emitting device of the first embodiment. FIG. 3 is a cross-sectional view taken along the line AA in FIG. The light emitting device 1 includes a base body 10 having a filling groove 11 provided in a concave shape on the upper surface. The filling groove 11 has side walls 11b and 11c that extend in one direction and are opposed to each other, and has open surfaces 11a that are opened on two opposed surfaces at both ends of the side walls 11b and 11c.

  The substrate 10 is formed by laminating ceramic sheets 12. The base 10 is provided with a heat radiating via 18 and an electrode via 19 extending downward from the bottom surface of the filling groove 11 and penetrating therethrough. A heat transfer portion 14 is formed on the upper surface of the heat dissipation via 18, and a heat dissipation portion 16 is formed on the lower surface.

  The light emitting element 2 made of LED is fixed on the heat transfer section 14 by adhesion or the like. Thereby, the light emitting element 2 is installed on the bottom surface of the filling groove 11. The heat generated by the light emitting element 2 is transmitted from the heat transfer section 14 to the heat dissipation section 16 through the heat dissipation via 18 to dissipate heat.

  A terminal 13 is formed on the upper surface of the electrode via 19, and an electrode 17 is formed on the lower surface. The terminal 13 and the electrode 17 are electrically connected by the electrode via 19. The light emitting element 2 is connected to the terminal 13 by a wire 4.

  The filling groove 11 is filled with a sealing material 3 made of a transparent resin in which phosphor particles are dispersed and contained. The light emitting element 2 is sealed by the sealing material 3.

  The light emitted from the light emitting element 2 is guided through the sealing material 3 and is converted in wavelength when it reaches the phosphor. Then, the wavelength-converted light and the light that does not reach the phosphor are mixed and emitted from the upper surface of the filling groove 11 and emitted from the open surface 11a facing the side surface. Thereby, the directivity angle of the emitted light of the light emitting device 1 is small in the direction in which the side walls 11b and 11c of the filling groove 11 face each other, and increases in the direction in which the open surface 11a faces.

  Next, a method for manufacturing the light emitting device 1 will be described. The manufacturing process of the light emitting device 1 includes a base material forming process, an element installation process, a sealing material filling process, a sealing material cutting process, and a slicing process. FIG. 4 is a plan view showing the base material 30 formed in the base material forming step. FIG. 5 is a cross-sectional view taken along the line BB in FIG.

  In the base material forming step, a plurality of ceramic sheets 12 having a thickness of about 0.1 mm are laminated. Thereby, the base material 30 is formed. Each lower ceramic sheet 12 is provided with a hole 12a. The heat radiation via 18 and the electrode via 19 (see FIG. 3) are formed by the hole 12a. The heat radiating via 18 and the electrode via 19 are filled with a conductive material.

  Each upper ceramic sheet 12 is provided with a hole 12b. A plurality of recesses 31 are formed in the matrix by being recessed in the upper surface of the base material 30 by the holes 12b. The concave portion 31 is formed in a substantially rectangular shape in plan view having an annular inner peripheral wall, and curved surface portions 31e are provided at four corners. Thereby, the recessed part 31 has the 1st, 2nd side wall 31a, 31b which the both ends are mutually non-parallel, and it connects with the connection part 31c which the both ends of the 1st side wall 31a and the 2nd side wall 31b mutually opposed. Is done.

  When the ceramic sheets 12 are laminated, they are fired at about 1000 ° C. in a firing furnace and integrated to obtain the base material 30. At this time, the terminal 13, the electrode 17, the heat transfer part 14, and the heat dissipation part 16 (all of which are shown in FIG. 3) may be formed by firing simultaneously with the ceramic sheet 12, or may be formed after firing. Thereafter, the terminal 13, the electrode 17, the heat transfer unit 14, and the heat dissipation unit 16 are plated.

  Next, FIG. 6 is a plan view showing an element installation process. In the element installation process, the light emitting element 2 is bonded onto the heat transfer section 14 with a resin having a good thermal conductivity or a metal material having a good thermal conductivity. Thereby, the light emitting element 2 is disposed on the bottom surface of the recess 31. And the terminal part (not shown) of the light emitting element 2 and the terminal 13 are connected by the wire 4.

  Next, FIG. 7 is a plan view showing a sealing material filling step. In the sealing material filling step, the sealing material 3 is filled into the recess 31. The light emitting element 2 is sealed by curing the sealing material 3.

  Next, FIG. 8 is a plan view showing a sealing material cutting step. In the sealing material cutting step, the sealing material 3 is cut across the first and second side walls 31a and 31b of the recess 31 by dicing using a rotating grindstone or the like. In the figure, D indicates the cutting position of the rotating grindstone. The cutting depth of the rotating grindstone is the same as that of the concave portion 31, and the sealing material 3 is cut by grooving with the rotating grindstone.

  At this time, the first and second side walls 31a and 31b of the recess 31 are simultaneously cut, and the connecting portion 31c of the recess 31 is removed. As a result, the sealing material 3 is exposed laterally at both ends of the first and second side walls 31a and 31b, and an open surface 11a (see FIG. 1) of the filling groove 11 is formed. Further, the side walls 11b and 11c (see FIG. 1) of the filling groove 11 are formed by the first and second side walls 31a and 31b.

  Next, FIG. 9 is a plan view showing a slicing step. In the slicing step, the substrate material 30 is fully cut at a predetermined position around the recess 31 by dicing using a rotating grindstone or the like. In the figure, E and F indicate cutting positions of the rotating grindstone. Thereby, a plurality of bases 10 (refer to Drawing 1) are cut out from base material 30, and light-emitting device 1 is obtained.

  10 and 11 are a front view and a top view showing a light emitting device module 40 in which a plurality of the above light emitting devices 1 are arranged side by side. The light emitting device module 40 is used in the backlight 50 shown in FIG. The light emitting device 1 is mounted on a substrate 41 extending in one direction, and a plurality of light emitting devices 1 are arranged in parallel in one direction. Moreover, the open surface 11a of the adjacent light-emitting device 1 is opposingly arranged. The substrate 41 exposes a resin or metal main material having a high surface reflectance.

  The light emitted from the light emitting device 1 is emitted from the upper surface and the open surface 11a as indicated by an arrow G. Since the directivity angle of the emitted light is large in the direction in which the open surface 11a faces (Y direction), the interval between the light emitting devices 1 can be increased. Further, since the directivity angle of the emitted light of the light emitting device 1 is small in the direction in which the side walls 11b and 11c of the filling groove 11 face each other, the light traveling on the outside of the incident surface 51b (see FIG. 18) of the light guide plate 51 and the incident surface 51b The light reflected by can be reduced. Therefore, the cost of the light emitting device module 40 can be reduced and the light use efficiency can be improved.

  Further, since the reflectance of the substrate 41 is high, the light (arrow G0) emitted from the open surface 11a and reaching the substrate 41 is reflected by the substrate 41 and travels in the direction of the incident surface 51b (X direction). Therefore, the light use efficiency can be further improved.

  In addition, you may cut | disconnect the curved surface part 31e of the recessed part 31 by the sealing material cutting process shown in above-mentioned FIG. FIG. 12 is a plan view showing the light emitting device 1 formed thereby. Since the first side wall 31a and the second side wall 31b are formed non-parallel at both ends by the curved surface portion 31e, the opening area of the open surface 11a can be varied depending on the cutting position. Thereby, the light quantity of the emitted light from the open surface 11a can be adjusted with a cutting position.

  Further, the cutting depth in the sealing material cutting step may be made shallower than the depth of the recess 31. FIG. 13 is a cross-sectional view showing the light emitting device 1 formed thereby, and shows the same cross section as that of FIG. Since the cutting depth for cutting the sealing material 3 is shallower than the depth of the recess 31, a stepped portion 20 lower than the lower end of the open surface 11 a is formed at the bottom of the filling groove 11.

  A part of the light emitted from the light emitting element 2 arranged in the stepped portion 20 is blocked by the wall surface of the stepped portion 20, and the amount of light emitted from the open surface 11a and the directivity angle in the direction in which the open surface 11a faces are suppressed. Is done. Thereby, the directivity angle can be adjusted by changing the cutting depth. Further, since the sealing material 3 is in contact with the wall surface of the stepped portion 20, the contact area with the base 10 is increased, and the adhesion strength of the sealing material 3 can be improved.

  According to the present embodiment, the filling groove 11 that is recessed in the base 10 and filled with the sealing material 3 has the open surfaces 11a on the two surfaces facing in one direction. The light is guided and emitted from the upper surface and the open surface 11a. Thereby, the directivity angle of the emitted light of the light emitting device 1 can be reduced in the direction in which the side walls 11b and 11c of the filling groove 11 face each other, and can be increased in the direction in which the open surface 11a faces. Accordingly, the interval between the light emitting devices 1 can be increased in a device such as the light emitting device module 40 in which a plurality of light emitting devices 1 are arranged in one direction, thereby reducing the cost of the device equipped with the light emitting device 1 and using light. Efficiency can be improved.

  Moreover, since the step part 20 lower than the lower end of the open surface 11a is formed on the bottom surface of the filling groove 11 and the light emitting element 2 is arranged in the step part 20, the contact area between the sealing material 3 and the substrate 10 increases. The adhesion strength of the sealing material 3 can be improved.

  Further, the two opposing surfaces of the sealing material 3 are cut together with the first side wall 31a and the second side wall 31b so as to intersect the first side wall 31a and the second side wall 31b facing each other of the recess 31 provided in the base material 30. Since the sealing material cutting step is provided, it is possible to easily realize the filling groove 11 having the open surfaces 11a on the two surfaces that are filled with the sealing material 3 and face in one direction.

  Further, since the cutting depth in the sealing material cutting step is shallower than the depth of the recess 31, the stepped portion 20 can be easily formed at the bottom of the filling groove 11. Thereby, the light quantity and directivity angle of the emitted light from the open surface 11a can be adjusted easily.

  Moreover, since the 1st side wall 31a and the 2nd side wall 31b of the recessed part 31 are formed non-parallel in the cutting position vicinity of a sealing material cutting process, the opening area of the open surface 11a can be changed with a cutting position. Thereby, the light quantity of the emitted light from the open surface 11a can be adjusted with a cutting position.

  Next, FIG. 14 shows a perspective view of the light emitting device 1 of the second embodiment. For convenience of explanation, the same reference numerals are given to the same parts as those in the first embodiment shown in FIGS. In the present embodiment, the base material 30 is fully cut in the sealing material cutting step to cut out the base 10. Thereby, it can serve as a sealing material cutting process and a slicing process. Accordingly, the number of manufacturing steps for the light emitting device 1 can be reduced.

  At this time, the step 20 shown in FIG. 13 can be formed by narrowing the opening area of the hole 12b (see FIG. 5) of a part of the ceramic sheets 12. Thereby, the depth of the stepped portion 20 is determined when the base material 30 is formed in the base material forming process.

  When the sealing material cutting step and the slicing step are performed in separate steps as shown in the first embodiment, the depth of the stepped portion 20 is changed by changing the cutting depth of the sealing material cutting step after the sealing agent 3 is filled. Can be varied. Therefore, when the light-emitting device 1 in which the depth of the stepped portion 20 is different for a plurality of models is required, the work-in-process can be made common if the sealing material cutting step and the slicing step are separated.

  In the first and second embodiments, the recess 31 provided in the base material 30 has a first side wall 31a and a second side wall 31b formed in a substantially rectangular shape in a plan view, but the first side wall 31a and the second side wall facing each other. The side wall 31b may be formed by a curved surface. Thereby, the 1st side wall 31a and the 2nd side wall 31b can be formed non-parallel in the cutting position vicinity of a sealing material cutting process. At this time, as shown in FIG. 15, the connecting portion 31c that connects the first side wall 31a and the second side wall 31b is formed in an oval shape or a circle that is integral with the first side wall 31a and the second side wall 31b in plan view. May be.

  Moreover, you may form the recessed part 31 of the base material 30 in the groove | channel shape extended in one direction, as shown in FIG. 16, FIG. 16 shows a plan view of the base material 30, and FIG. 17 shows a CC cross-sectional view of FIG. A light-emitting device 1 similar to that shown in FIGS. 1 and 14 can be obtained according to the cutting depth in the sealing material cutting step.

  At this time, the first side wall 31a and the second side wall 31b opposed to the recess 31 may be viewed in a plan view to have a wave shape. Thereby, the 1st side wall 31a and the 2nd side wall 31b can be formed non-parallel in the cutting position vicinity of a sealing material cutting process.

  INDUSTRIAL APPLICABILITY According to the present invention, it can be used for an edge light type backlight mounted with a light emitting device module in which light emitting elements are arranged side by side in one direction, a light source for a scanner, LED illumination, and the like.

DESCRIPTION OF SYMBOLS 1 Light emitting device 2 Light emitting element 3 Sealing material 4 Wire 10 Base | substrate 11 Filling groove | channel 11a Open surface 11b, 11c Side wall 12 Ceramic sheet 12a Hole part 13 Terminal 14 Heat transfer part 16 Heat radiation part 17 Electrode 18 Heat radiation via 19 Electrode via 20 Step part 30 Substrate material 31 Recessed portion 31a First side wall 31b Second side wall 31c Connecting portion 32 Groove portion 40 Light emitting device module 41 Substrate

Claims (9)

  A base body in which a filling groove having an open surface on two surfaces facing in one direction is recessed, a light emitting element installed on a bottom surface of the filling groove, and filling the filling groove to seal the light emitting element. A light-emitting device comprising: a sealing material made of a transparent resin.   The light emitting device according to claim 1, wherein the substrate is made of ceramic.   The light emitting device according to claim 1, wherein a step portion lower than a lower end of the open surface is formed on a bottom surface of the filling groove, and the light emitting element is arranged in the step portion.   The light emitting device according to any one of claims 1 to 3, wherein the opposite side walls of the filling groove are formed non-parallel at both ends.   5. A light emitting device module comprising a plurality of the light emitting devices according to claim 1 arranged in parallel, wherein the open surfaces of the adjacent light emitting devices are arranged to face each other.   An element installation step of installing a light emitting element on the bottom surface of the concave portion provided in the base material; a sealing material filling step of sealing the light emitting element by filling a sealing material made of a transparent resin into the concave portion; A sealing material cutting step of cutting the two opposing surfaces of the sealing material together with the first side wall and the second side wall across the first side wall and the second side wall facing the concave portion. Manufacturing method of light-emitting device.   The light emitting device according to claim 6, wherein the concave portion has an annular inner peripheral wall in which the first side wall and the second side wall are connected by a connecting portion, and the connecting portion is removed in the sealing material cutting step. Device manufacturing method.   The method for manufacturing a light emitting device according to claim 7, wherein a cutting depth in the sealing material cutting step is shallower than a depth of the concave portion.   The method for manufacturing a light-emitting device according to claim 6, wherein the first side wall and the second side wall are formed non-parallel near a cutting position in the sealing material cutting step.

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