JP2013123442A - Control apparatus - Google Patents

Control apparatus Download PDF

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JP2013123442A
JP2013123442A JP2011271889A JP2011271889A JP2013123442A JP 2013123442 A JP2013123442 A JP 2013123442A JP 2011271889 A JP2011271889 A JP 2011271889A JP 2011271889 A JP2011271889 A JP 2011271889A JP 2013123442 A JP2013123442 A JP 2013123442A
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printed circuit
circuit board
groove
coating
coating material
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JP5824613B2 (en
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Yukio Kotani
幸男 小谷
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To achieve stable manufacturing which gives easy visibility after coating by coating only necessary portions with an insulation coating material.SOLUTION: A control apparatus has a printed circuit board 30 on which electronics parts are to be mounted, and a resin case to which the printed circuit board 10 is fixed. A groove 1 is formed on a bottom part inside the resin case 10 and the circumference of the groove 1 is in close contact with the printed circuit board 30. In the printed circuit board 30, two holes (4 and 5) are provided at portions requiring dampproofing, and one of the holes is taken as an insulation coat material-injecting opening 4 and the other thereof is formed so that the insulation coat material overflows after being filled in the groove, thereby preventing the injected insulation coat material from leaking from between the groove 1 and the printed circuit board 30. The one hole allows the insulation coat material to be injected therethrough and the other hole allows the overflowing of the insulation coat material into the formed resin groove to be visible, thereby eliminating variations in application amount and coating range.

Description

本発明は、プリント基板上の電子部品端子が、湿度などの影響により、端子間ショ−トを防ぐ為、電子部品の端子部を、絶縁コ−ト材でコ−ティングすることで、湿度の影響による、端子間ショ−トを防ぐことができるものである。確実に電子部品端子をコ−ティングができる仕組みと、樹脂ケ−スなどにはめ込んだ後でも、確実に塗布が行われたことが保証できる制御装置に関するものである。   In the present invention, since the electronic component terminal on the printed circuit board is prevented from being short-circuited due to the influence of humidity, the terminal portion of the electronic component is coated with an insulating coating material. The short circuit between terminals due to the influence can be prevented. The present invention relates to a mechanism capable of reliably coating an electronic component terminal and a control device capable of guaranteeing that coating has been performed reliably even after being fitted into a resin case.

水回りで使用する電化製品は、電子部品や、プリント基板に直接水などがかからない構造となっているが、脱衣場、風呂場などのような高温高湿環境に設置されることも想定される。そのような環境の中において、水、結露水等による湿度の影響でプリント基板上の電極部に水や結露水が付着することで、電子部品やプリント基板上のパタ−ン端子間ショ−トや電極間のショ−トにより、最悪の場合、発煙、発火、感電などの危険がある。それを防止する為に、プリント基板上の露出した部品端子や、プリント基板上のパタ−ン等、通電性のある危険部位には、絶縁コート材料（Ｖ−０）でコ−ティングをするなど、安全対策を施されている。   Electrical appliances used around water are structured so that water is not directly applied to electronic components or printed circuit boards, but it is also assumed that they are installed in high-temperature and high-humidity environments such as dressing rooms and bathrooms. . In such an environment, water and condensed water adhere to the electrodes on the printed circuit board due to the influence of humidity due to water, condensed water, etc. In the worst case, there is a danger of smoke, fire, electric shock, etc. due to the short circuit between the electrodes. In order to prevent this, coating with insulating coating material (V-0) is applied to exposed dangerous parts such as exposed component terminals on the printed circuit board and patterns on the printed circuit board. Safety measures have been taken.

また、図１のような樹脂ケース１０に電子部品を実装されたプリント基板に取り付けをされて、その樹脂ケース内にプリント基板内の金属部を覆い隠すまで、絶縁コ−ト材料を注入し、硬化をさせることで、水が直接金属部分、部品端子部にかからない仕組みとしている。   Also, an insulating coating material is injected until the resin part 10 as shown in FIG. 1 is attached to a printed circuit board on which electronic components are mounted and the metal part in the printed circuit board is obscured in the resin case, By curing, water is not directly applied to metal parts and component terminal parts.

特開２０１０−２７９号公報JP 2010-279 A

しかしながら、上記のようにプリント基板全体を絶縁コ−ト材料でコ−ティング（一般的にはポッティングという）を行なおうとすると、プリント基板を取り付ける樹脂ケース内部に約７ｍｍ程度の高さで絶縁コ−ト材料を注入する為、絶縁コ−ト材料が大量に必要となり、材料コストが大きくかかってしまう。一般的に材料は２液タイプの混合によって、絶縁コ−ト材を液体状態から硬化をさせる為、設備投資、設備管理、作業時の管理工数が大きくなっている。   However, if the entire printed circuit board is coated with an insulating coating material as described above (generally called potting), the insulation coat is about 7 mm high inside the resin case to which the printed circuit board is attached. In order to inject the coating material, a large amount of the insulating coating material is required, which increases the material cost. Generally, the material is hardened from the liquid state by mixing two liquid types, so that the capital investment, equipment management, and management man-hours at the time of operation are large.

本発明は、絶縁コ−トが必要な箇所のみを絶縁コ−ト材でコーティングをする方式で、従来の２液から１液タイプの材料を使用することを前提としており、作業時における絶縁コ−ト材を必要箇所のみにコ−ティングするものであって、コーティング後の確認方法等、安定したもの造りを提供でき、コ−ティング作業の工数を減らし、使用絶縁コ−ト材のコストを抑えることを目的とする。   The present invention is a method in which only a portion requiring insulation coating is coated with an insulation coating material, and it is premised on the use of a conventional two-component to one-component type material. -Coating the coating material only at the necessary locations, providing a stable manufacturing method such as a confirmation method after coating, reducing the number of coating work, and reducing the cost of the insulating coating material used. The purpose is to suppress.

前記目的を達成するために、本発明は、電子部品が実装されるプリント基板と、プリント基板を取り付ける樹脂ケースとを有し、前記樹脂ケ−ス内の底部に溝を成型するとともに、前記溝の周囲とプリント基板とを密着する構造とし、前記プリント基板には、防湿必要箇所に２箇所の穴を設け、１箇所の穴は絶縁コ−ト材注入口とし、もう１箇所は絶縁コ−ト材が前記溝内に満たされた後に絶縁コ−ト材が溢れる構造としたものである。   In order to achieve the above object, the present invention includes a printed circuit board on which an electronic component is mounted, and a resin case to which the printed circuit board is attached. The groove is molded at the bottom of the resin case, and the groove The printed circuit board has a structure in which the printed circuit board is in close contact with the printed circuit board. The printed circuit board is provided with two holes where moisture is required, one hole is an insulating coating material inlet, and the other is an insulating coating. The insulating coating material overflows after the coating material is filled in the groove.

溝とプリント基板間から、絶縁コ−ト材を注入した際の漏れを防ぐことができる。また、一方から絶縁コート材を注入し、もう一方の穴で成型樹脂溝内に絶縁コ−ト材が溢れることを視認できるようにすることで必要塗布箇所に対して、塗布量、コーティング範囲にバラツキをなくすことが可能となる。   Leakage when an insulating coating material is injected from between the groove and the printed board can be prevented. Also, by injecting an insulating coating material from one side and making it possible to visually recognize that the insulating coating material overflows into the molded resin groove at the other hole, the coating amount and the coating range can be reduced with respect to the required application location. Variations can be eliminated.

従来の樹脂ケ−スの平面図Plan view of conventional resin case 本発明の実施の形態１における樹脂ケ−ス構造を現した平面図The top view showing the resin case structure in Embodiment 1 of this invention 本発明の実施の形態１における樹脂ケ−スにはめ込むプリント基板のはんだ面および部品面を現した平面図FIG. 2 is a plan view showing a solder surface and a component surface of a printed circuit board fitted into the resin case in the first embodiment of the present invention.

第１の発明は、子部品が実装されるプリント基板と、プリント基板を取り付ける樹脂ケースとを有し、前記樹脂ケ−ス内の底部に溝を成型するとともに、前記溝の周囲とプリント基板とを密着する構造とし、前記プリント基板には、防湿必要箇所に２箇所の穴を設け、１箇所の穴は絶縁コ−ト材注入口とし、もう１箇所は絶縁コ−ト材が前記溝内に満たされた後に絶縁コ−ト材が溢れる構造としたことにより、溝とプリント基板間から、絶縁コ−ト材を注入した際の漏れを防ぐことができる。また、一方から絶縁コート材を注入し、もう一方の穴で成型樹脂溝内に絶縁コ−ト材が溢れることを視認できるようすることで必要塗布箇所に対して、塗布量、コーティング範囲にバラツキをなくすことが可能となる。   1st invention has a printed circuit board with which a subpart is mounted, and a resin case which attaches a printed circuit board, and it forms a groove in the bottom part in the resin case, and the circumference of the groove, a printed circuit board, In the printed circuit board, two holes are provided where moisture is required, one hole is an insulating coating material inlet, and the other is an insulating coating material in the groove. Since the insulating coating material overflows after satisfying the above conditions, leakage when the insulating coating material is injected between the groove and the printed board can be prevented. Insulating coating material is injected from one side, and it is possible to visually recognize that the insulating coating material overflows into the molded resin groove at the other hole, so that there is a variation in the coating amount and coating range for the required application location. Can be eliminated.

以下、本発明のより具体的な形態について、図面を参照しながら詳細に説明する。なお、この実施の形態によって本発明が限定されるものではない。   Hereinafter, more specific embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

（実施の形態１）
図２は、本発明の一実施形態にかかるプリント基板を取り付ける為の樹脂ケ−ス構造を現した図面である。 (Embodiment 1)
FIG. 2 is a view showing a resin case structure for attaching a printed circuit board according to an embodiment of the present invention.

図３は樹脂ケ−ス１０内に取り付けるプリント基板の図面である。プリント基板３０の双方の面には、コ−ティングが必要となる範囲をシルク印刷にて記してある。はんだ面のシルク印刷箇所（コーティング部３）の内側に絶縁コ−ト材を注入するコーティング注入穴４と、注入された絶縁コ−ト材が溢れてきたら図２における溝１に絶縁コ−ト材が満たされた状態と判断ができるコーティング確認穴５をほぼ対角に設置してある。   FIG. 3 is a drawing of a printed circuit board mounted in the resin case 10. On both sides of the printed circuit board 30, a range that requires coating is marked by silk printing. A coating injection hole 4 for injecting an insulating coating material inside the silk-printed portion (coating portion 3) of the solder surface, and when the injected insulating coating material overflows, the insulating coating is formed in the groove 1 in FIG. The coating confirmation holes 5 that can be determined to be filled with the material are installed almost diagonally.

図２の樹脂ケ−ス１０にプリント基板３０をはめ込み、コーティング注入穴４から絶縁コ−ト材を注入して、注入された絶縁コ−ト材がコーティング確認穴５から溢れてきたら溝１に絶縁コ−ト材が満たされた状態と判断ができる仕組みを特徴としている。   A printed circuit board 30 is fitted into the resin case 10 of FIG. 2, an insulating coating material is injected from the coating injection hole 4, and when the injected insulating coating material overflows from the coating confirmation hole 5, the groove 1 is formed. It is characterized by a mechanism that makes it possible to determine that the insulating coating material is filled.

図２において、樹脂ケース１０の底部に絶縁コ−ト材を溜める為の溝１を設けており、プリント基板３０のコーティング範囲と平面視同じ形状で且つ、プリント基板３０との隙間をなくすためにプリント基板と溝１の外周はプリント基板３０に密着している。   In FIG. 2, a groove 1 for collecting an insulating coating material is provided at the bottom of the resin case 10 so as to have the same shape as the coating range of the printed circuit board 30 in plan view and to eliminate a gap with the printed circuit board 30. The outer periphery of the printed circuit board and the groove 1 is in close contact with the printed circuit board 30.

図２の樹脂ケース１０におけるコーティング確認穴２は、φ１の穴をほぼ対角に２箇所設けられ、この２箇所の穴が、プリント基板３０の樹脂ケース１０への取り付けやコーティングなどの作業完了後に、はんだ面側のコ−ティングがなされているかをチェックできる穴となる。   The coating confirmation hole 2 in the resin case 10 of FIG. 2 is provided with two holes of φ1 almost diagonally, and these two holes are provided after the completion of operations such as mounting of the printed circuit board 30 to the resin case 10 and coating. This is a hole for checking whether the solder side is coated.

なお絶縁コ−ト材は、従来の２液から１液タイプの材料を使用することを前提としており、作業時における絶縁コ−ト材を必要箇所のみにコ−ティングするものであって、コーティング後の確認方法等、安定したもの造りを提供でき、コ−ティング作業の工数を最小限にでき、使用絶縁コ−ト材のコストを最小限に抑えることができる。   The insulation coating material is based on the premise that a conventional two-component to one-component type material is used, and the insulation coating material is coated only at a necessary location during the work. A stable manufacturing method such as a later confirmation method can be provided, the number of man-hours for the coating work can be minimized, and the cost of the insulating coating material used can be minimized.

プリント基板３０を樹脂ケ−ス１０に予めはめ込むことにより、プリント基板３０の両面のコ−ティング作業を、部品面側から行うことができ、従来の工程である以下のａ〜ｄの工程（ａ．はんだ面へのコ−ティング、ｂ．表面硬化、ｃ．プリント基板の樹脂ケ−ス取付け、ｃ．部品面側へのコ−ティング、ｄ．完了）から、本実施の形態の工程である以下のＡ〜Ｂの工程（Ａ．プリント基板の樹脂ケ−ス取付け、Ｂ．はんだ面、部品面側の同時コ−ティング）とすることで、表面硬化による待機時間ロスによる工数削減、製品の硬化場所の確保等も不要となり、プリント基板３０の樹脂ケ−ス１０への取付けの際、絶縁コ−ト材への接触によるはがれの防止も可能となった。樹脂ケース１０に絶縁コ−ト材を溜める溝１を設けたので、必要塗布箇所に対して、塗布量、コーティング範囲にバラツキがなくなり、はんだ面側のコ−ティング確認も樹脂ケ−ス１０に設けたコーティング確認穴２を見ることで容易に行えるなど安定した品質確保が可能となる。   By previously fitting the printed circuit board 30 into the resin case 10, it is possible to perform the coating operation on both sides of the printed circuit board 30 from the component surface side, and the following processes a to d (a (B) coating on the solder surface, (b) surface hardening, (c) mounting the resin case on the printed circuit board, (c) coating on the component surface side, and (d) completion). By the following processes A to B (A. Resin case mounting on printed circuit board, B. Simultaneous coating on solder side and component side), man-hour reduction due to waiting time loss due to surface hardening, It is not necessary to secure a curing place, and it is possible to prevent peeling due to contact with the insulating coating material when the printed board 30 is attached to the resin case 10. Since the groove 1 for storing the insulating coating material is provided in the resin case 10, there is no variation in the application amount and the coating range with respect to the required application location, and the coating confirmation on the solder surface side is also in the resin case 10. Stable quality can be ensured such that the coating confirmation hole 2 can be easily seen.

このように、プリント基板３０のはんだ面（フロ−はんだ付けされた電子部品端はんだ付け面側）のコーティングで、危険部位へ絶縁コ−ト材をコ−ティングするに当っては、プリント基板３０を樹脂ケ−ス１０内にはめ込んでおき、その際、プリント基板３０を入れ込む為の樹脂ケ−ス１０は予め、プリント基板３０への塗布必要箇所と同位置に、樹脂成型によって絶縁コ−ト材を溜める溝１を成型したうえで、プリント基板３０をはめ込んだ際、溝１とプリント基板３０間に隙間がなくなるまで密着させることで、絶縁コ−ト材を注入した際の漏れを防ぐことができる。   As described above, when coating the insulating coating material to the dangerous part by coating the solder surface of the printed circuit board 30 (the soldered surface side of the soldered electronic component end), the printed circuit board 30 is used. Is inserted into the resin case 10, and the resin case 10 for inserting the printed circuit board 30 is preliminarily placed in the same position as the place where the application to the printed circuit board 30 is performed by resin molding. When the printed circuit board 30 is inserted after molding the groove 1 for storing the coating material, it is brought into close contact until there is no gap between the groove 1 and the printed circuit board 30 to prevent leakage when the insulating coating material is injected. be able to.

更に絶縁コ−ト材を溜める溝１にはφ１の穴（絶縁コ−ト材が注入されても漏れでない穴）を空けておく。プリント基板３０には、部品面から絶縁コ−ト材を注入するコーティング注入穴４と、絶縁コ−ト材の注入確認穴５を設け、一方から絶縁コート材を注入し、もう一方の穴で溝１内に絶縁コ−ト材が溢れることを確認できるようすることで、コーティング必要塗布箇所に対して、塗布量およびコーティング範囲におけるバラツキをなくすことが可能となる。   Further, a hole of φ1 (a hole that does not leak even if the insulating coating material is injected) is made in the groove 1 for storing the insulating coating material. The printed circuit board 30 is provided with a coating injection hole 4 for injecting an insulating coating material from the component surface and an injection confirmation hole 5 for insulating coating material, and an insulating coating material is injected from one side, and the other hole is used. By making it possible to confirm that the insulating coating material overflows into the groove 1, it is possible to eliminate variations in the coating amount and the coating range with respect to the coating-necessary coating location.

なお、プリント基板３０を予めはめ込んで有るので、コ−ティング箇所に触れることもなく、次作業の部品面側のコ−ティング作業に入ることができるので時間ロスも防ぐことができる。   Since the printed circuit board 30 is fitted in advance, it is possible to enter the coating work on the component surface side of the next work without touching the coating location, and to prevent time loss.

また、リント基板３０の樹脂ケース１０への取り付けやコーティングなどの作業完了後に、はんだ面側へのコ−ティングが行われているかの製品チェックは、樹脂ケ−ス１０内の溝１に空けた穴から、絶縁コ−ト材が出ていることでコ−ティング作業に問題がないことを確認できる仕組みとしている。   In addition, after completion of operations such as attaching the lint substrate 30 to the resin case 10 and coating, a product check as to whether the coating on the solder surface side is performed was made in the groove 1 in the resin case 10. The mechanism is such that it can be confirmed that there is no problem in the coating work due to the insulating coating material coming out of the hole.

以上のように、本発明にかかる制御装置は、溝とプリント基板間から、絶縁コ−ト材を注入した際の漏れを防ぐことができ、また、一方から絶縁コート材を注入し、もう一方の穴で成型樹脂溝内に絶縁コ−ト材が溢れることを視認できるようすることで必要塗布箇所に対して、塗布量、コーティング範囲にバラツキをなくすことが可能となるので、様々な制御装置に有用である。   As described above, the control device according to the present invention can prevent leakage when the insulating coating material is injected between the groove and the printed board, and also injects the insulating coating material from one side and the other side. By making it possible to visually recognize that the insulating coating material overflows into the molded resin groove at the hole, it is possible to eliminate variations in the coating amount and coating range for the required coating location, so various control devices Useful for.

１ 溝
２ コーティング確認穴
３ コーティング部
４ コーティング注入穴
５ 注入確認穴
１０ 樹脂ケース
３０ プリント基板 1 groove 2 coating confirmation hole 3 coating part 4 coating injection hole 5 injection confirmation hole 10 resin case 30 printed circuit board

Claims (1)

電子部品が実装されるプリント基板と、プリント基板を取り付ける樹脂ケースとを有し、前記樹脂ケ−ス内の底部に溝を成型するとともに、前記溝の周囲とプリント基板と密着する構造とし、前記プリント基板には、防湿必要箇所に２箇所の穴を設け、１箇所の穴は絶縁コ−ト材注入口とし、もう１箇所は絶縁コ−ト材が前記溝内に満たされた後に絶縁コ−ト材が溢れる構造とした制御装置。 A printed circuit board on which an electronic component is mounted, and a resin case to which the printed circuit board is attached, and a groove is formed at the bottom of the resin case, and the printed circuit board is in close contact with the periphery of the groove, The printed circuit board is provided with two holes where moisture proofing is required. One hole is used as an insulating coating material injection port, and the other is an insulating coating after the insulating coating material is filled in the groove. -A control device that has a structure overflowing with the timber.
JP2011271889A 2011-12-13 2011-12-13 Control device Expired - Fee Related JP5824613B2 (en)

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JP2013123442A true JP2013123442A (en) 2013-06-24
JP5824613B2 JP5824613B2 (en) 2015-11-25

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461367A (en) * 1990-06-29 1992-02-27 Sanyo Electric Co Ltd Control unit module and washing machine using same
JPH06154467A (en) * 1992-11-24 1994-06-03 Sanyo Electric Co Ltd Washing machine
JPH09139586A (en) * 1995-11-14 1997-05-27 Aichi Tokei Denki Co Ltd Mounting structure of photocoupler in net controller for terminal use
JP2010177359A (en) * 2009-01-28 2010-08-12 Shindengen Electric Mfg Co Ltd Production process of electronic circuit device and electronic circuit device
JP2011023459A (en) * 2009-07-14 2011-02-03 Denso Corp Electronic control unit

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461367A (en) * 1990-06-29 1992-02-27 Sanyo Electric Co Ltd Control unit module and washing machine using same
JPH06154467A (en) * 1992-11-24 1994-06-03 Sanyo Electric Co Ltd Washing machine
JPH09139586A (en) * 1995-11-14 1997-05-27 Aichi Tokei Denki Co Ltd Mounting structure of photocoupler in net controller for terminal use
JP2010177359A (en) * 2009-01-28 2010-08-12 Shindengen Electric Mfg Co Ltd Production process of electronic circuit device and electronic circuit device
JP2011023459A (en) * 2009-07-14 2011-02-03 Denso Corp Electronic control unit

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