JP2018129479A - Electronic control device - Google Patents

Electronic control device Download PDF

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JP2018129479A
JP2018129479A JP2017023297A JP2017023297A JP2018129479A JP 2018129479 A JP2018129479 A JP 2018129479A JP 2017023297 A JP2017023297 A JP 2017023297A JP 2017023297 A JP2017023297 A JP 2017023297A JP 2018129479 A JP2018129479 A JP 2018129479A
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substrate
connector
front surface
case
control device
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敬法 佐脇
Takanori Sawaki
敬法 佐脇
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Keihin Corp
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PROBLEM TO BE SOLVED: To provide an electronic control device that house a first substrate having a first connector at one end and a second substrate having a second connector at one end in a case in a state in which the substrates overlap, and has a structure in which a terminal extending from the connector can be soldered only once.SOLUTION: A second substrate 30 is overlaid on a first substrate 20 such that a back surface 25 of the first substrate 20 and a front surface 31 of the second substrate 30 face each other, a first connector 24 does not interfere with the second substrate 30, and a second connector 33 does not interfere with the first substrate 20.SELECTED DRAWING: Figure 3

Description

本発明は、２枚の基板を重ねた状態でケースに収納してなる電子制御装置に関する。   The present invention relates to an electronic control device that is housed in a case in a state where two substrates are stacked.

２枚の基板を重ねた状態でケースに収納する形態の電子制御装置が実用に供されている（例えば、特許文献１（図２）参照）。   An electronic control device in which two substrates are stacked and housed in a case has been put to practical use (see, for example, Patent Document 1 (FIG. 2)).

特許文献１の図２に示されるように、メイン基板（１００）（括弧付き数字は、特許文献１に記載された符号を示す。以下同様）は、コネクタ（１１０、１５０）を備えている。
このようなメイン基板（１００）に重ねられる制御基板（２００）は、コネクタ（２１０、２５０）を備えている。 As shown in FIG. 2 of Patent Document 1, the main board (100) (the numbers in parentheses indicate the reference numerals described in Patent Document 1. The same applies hereinafter) includes connectors (110, 150).
The control board (200) stacked on the main board (100) includes connectors (210, 250).

コネクタ（１１０、１５０）の端子は、制御基板（２００）で覆われている。そのため、制御基板（２００）で覆われ前に、コネクタ（１１０、１５０）の端子を、メイン基板（１００）に半田する必要がある。
一方、コネクタ（２１０、２５０）の端子は、メイン基板（１００）に制御基板（２００）が重ねられた状態であっても、制御基板（２００）に半田が可能である。 The terminals of the connectors (110, 150) are covered with the control board (200). Therefore, it is necessary to solder the terminals of the connectors (110, 150) to the main board (100) before being covered with the control board (200).
On the other hand, the terminals of the connectors (210, 250) can be soldered to the control board (200) even when the control board (200) is superimposed on the main board (100).

すなわち、特許文献１の構造であれば、メイン基板（１００）にコネクタ（１１０、１５０）の端子を半田固定する第１半田工程と、制御基板（２００）にコネクタ（２１０、２５０）の端子を半田固定する第２半田工程とが必須の工程となる。半田工程が２度必要であるため、製造費が嵩む。   That is, according to the structure of Patent Document 1, the first soldering process of fixing the terminals of the connectors (110, 150) to the main board (100) and the terminals of the connectors (210, 250) to the control board (200). The second soldering process for soldering is an essential process. Since the soldering process is required twice, the manufacturing cost increases.

製造コストの低減が求められる中、半田工程が１度で済むような構造の電子制御装置が望まれる。   While a reduction in manufacturing cost is required, an electronic control device having a structure that requires only one soldering process is desired.

特開２００９−１０６０７３号公報JP 2009-106073 A

本発明は、一端に第１コネクタを有する第１基板と、一端に第２コネクタを有する第２基板とを重ねた状態でケースに収納してなる電子制御装置において、コネクタから延びる端子の半田工程が１度で済むような構造を提供することを課題とする。   The present invention relates to a soldering process for terminals extending from a connector in an electronic control device in which a first substrate having a first connector at one end and a second substrate having a second connector at one end are housed in a case. It is an object of the present invention to provide a structure that requires only one time.

請求項１に係る発明は、少なくともおもて面に電子部品が載せられると共に前記おもて面の一端に第１コネクタが設けられている第１基板と、
少なくともおもて面に電子部品が載せられると共に前記おもて面の一端に第２コネクタが設けられている第２基板と、
前記第１基板の裏面と前記第２基板のおもて面が対面するようにし且つ前記第１コネクタが前記第２基板に干渉しないようにすると共に前記第２コネクタが前記第１基板に干渉しないようにして前記第１基板に前記第２基板が重ねられ、この状態で前記第１基板及び前記第２基板を収容するケースとからなることを特徴とする。 The invention according to claim 1 is a first substrate on which an electronic component is mounted on at least a front surface and a first connector is provided at one end of the front surface;
A second substrate on which an electronic component is placed at least on the front surface and a second connector is provided at one end of the front surface;
The back surface of the first substrate and the front surface of the second substrate face each other, the first connector does not interfere with the second substrate, and the second connector does not interfere with the first substrate. Thus, the second substrate is overlaid on the first substrate, and in this state, the first substrate and the case for accommodating the second substrate are included.

請求項２に係る発明は、前記第１基板には、前記第１基板のおもて面に載せられる前記電子部品の一部又は全部から延びる端子を通過させる大径穴が設けられ、
前記第２基板には、前記大径穴を通過する端子に対応するスルーホールが設けられており、
前記スルーホールを通過した端子と、前記第１コネクタから延びて前記第１基板を通過した端子と、前記第２コネクタから延びて前記第２基板を通過した端子とが、前記第２基板の裏面側から見えるように配置されていることを特徴とする。 In the invention according to claim 2, the first substrate is provided with a large-diameter hole through which a terminal extending from a part or all of the electronic component placed on the front surface of the first substrate passes.
The second substrate is provided with a through hole corresponding to a terminal passing through the large diameter hole,
A terminal that passes through the through hole, a terminal that extends from the first connector and passes through the first substrate, and a terminal that extends from the second connector and passes through the second substrate are the back surface of the second substrate. It is arranged so that it can be seen from the side.

請求項３に係る発明は、ケースは、第１基板のおもて面に対面する基本面と、この基本面に立てた一対の側面と、一対の側面の一端同士を繋ぐと共に第１コネクタが通過する第１通孔を有する第１端面と、一対の側面の他端同士を繋ぐと共に第２コネクタが通過する第２通孔を有する第２端面とを有し、残る一面が開口部であるバスタブ型ケースであることを特徴とする。   In the invention according to claim 3, the case connects the basic surface facing the front surface of the first substrate, the pair of side surfaces standing on the basic surface, and one end of the pair of side surfaces, and the first connector includes It has a first end surface having a first through-hole that passes through, and a second end surface having a second through-hole that connects the other ends of the pair of side surfaces and through which the second connector passes, and the remaining one surface is an opening. It is a bathtub type case.

請求項４に係る発明は、第１基板のおもて面に載せられる電子部品に大型部品が含まれており、
ケースの基本面に大型部品を収納する凹部が形成されていることを特徴とする。 In the invention according to claim 4, the electronic component placed on the front surface of the first substrate includes a large component,
A concave portion for accommodating a large component is formed on the basic surface of the case.

請求項５に係る発明は、開口部は樹脂注入口を兼ねており、ケース内に樹脂モールドが充填されていることを特徴とする。   The invention according to claim 5 is characterized in that the opening portion also serves as a resin injection port, and a resin mold is filled in the case.

請求項１に係る発明では、第１基板の裏面と第２基板のおもて面が対面するようにし且つ第１コネクタが第２基板に干渉しないようにすると共に第２コネクタが第１基板に干渉しないように重ねられることで厚みを抑えることができ、小型化できる。   In the invention according to claim 1, the back surface of the first substrate and the front surface of the second substrate face each other, the first connector does not interfere with the second substrate, and the second connector is attached to the first substrate. By being stacked so as not to interfere with each other, the thickness can be suppressed and the size can be reduced.

請求項２に係る発明では、スルーホールを通過した端子と、第１コネクタから延びて第１基板を通過した端子と、第２コネクタから延びて第２基板を通過した端子とが、第２基板の裏面側から見えるように配置されているため、第２基板の裏側から一括して半田付けを実施することができる。
すなわち、本発明により、一端に第１コネクタを有する第１基板と、一端に第２コネクタイを有する第２基板とを重ねた状態でケースに収納してなる電子制御装置において、コネクタから延びる端子の半田工程が１度で済むような構造が提供される。 In the invention according to claim 2, the terminal that has passed through the through hole, the terminal that has passed from the first connector and passed through the first board, and the terminal that has passed from the second connector and passed through the second board are the second board. Therefore, soldering can be performed collectively from the back side of the second substrate.
That is, according to the present invention, in an electronic control device in which a first board having a first connector at one end and a second board having a second connector at one end are housed in a case, the terminals extend from the connector. A structure is provided in which the soldering process can be completed only once.

請求項３に係る発明は、ケースがバスタブ型ケースであるため、開口部から第１基板及び第２基板をケース内部へセットすることができる。すなわち、ケースと第１基板と第２基板の組立が容易になり、組立コストの低減が図れる。   In the invention according to claim 3, since the case is a bathtub type case, the first substrate and the second substrate can be set into the case from the opening. That is, the assembly of the case, the first substrate, and the second substrate is facilitated, and the assembly cost can be reduced.

請求項４に係る発明は、第１基板のおもて面に載せられる電子部品に大型部品が含まれており、ケースの基本面に大型部品を収納する凹部が形成されている。ケース内部に樹脂モールドを充填する場合に、樹脂材料が節約できる。   In the invention according to claim 4, the electronic component placed on the front surface of the first substrate includes a large component, and a recess for accommodating the large component is formed on the basic surface of the case. When the resin mold is filled in the case, the resin material can be saved.

請求項５に係る発明は、開口部は樹脂注入口を兼ねており、ケース内に樹脂モールドが充填されている。樹脂モールドにより第１基板及び第２基板が固定される。開口部が大きいため、樹脂材料の注入が容易である。   In the invention according to claim 5, the opening portion also serves as a resin injection port, and a resin mold is filled in the case. The first substrate and the second substrate are fixed by the resin mold. Since the opening is large, the resin material can be easily injected.

本発明に係る第１基板及び第２基板の斜視図である。It is a perspective view of the 1st substrate and the 2nd substrate concerning the present invention. 第１基板に第２基板を重ねた状態での側面図である。It is a side view in the state where the 2nd substrate was piled up on the 1st substrate. 第２基板の裏面側から見た図、要部断面図及びケースの斜視図である。It is the figure seen from the back surface side of the 2nd board | substrate, principal part sectional drawing, and the perspective view of a case. 樹脂注入工程を説明する図及び本発明に係る電子制御装置の斜視図である。It is a figure explaining a resin injection | pouring process, and a perspective view of the electronic controller which concerns on this invention.

本発明の実施の形態を添付図に基づいて以下に説明する。なお、本発明の電子制御装置１０の外観図は図４（ｂ）で示すが、説明の便利のため、図１〜図４（ａ）では、天地を逆にして説明する。すなわち、図１〜図４（ａ）では、おもて面が下、裏面が上になる。   Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that an external view of the electronic control device 10 of the present invention is shown in FIG. 4B, but for convenience of explanation, in FIG. 1 to FIG. That is, in FIG. 1 to FIG. 4A, the front surface is down and the back surface is up.

図１に示すように、第１基板２０は、おもて面２１に電子部品２２、２３が載せられると共に一端に第１コネクタ２４が載せられている。電子部品２３は、大型部品２３であり、例えばコンデンサである。   As shown in FIG. 1, the first substrate 20 has electronic parts 22 and 23 mounted on a front surface 21 and a first connector 24 mounted on one end. The electronic component 23 is a large component 23, for example, a capacitor.

電子部品２２、２３及び第１コネクタ２４は接着、嵌合などにより第１基板２０に仮止めされているため、落下する心配はない。
第１基板２０の裏面２５から基板間接続ピン２６が立てられている。なお、第１基板２０の裏面２５に電子部品（図２、符号２７）を実装してもよい。 Since the electronic components 22 and 23 and the first connector 24 are temporarily fixed to the first substrate 20 by adhesion, fitting or the like, there is no fear of dropping.
Inter-substrate connection pins 26 are erected from the back surface 25 of the first substrate 20. An electronic component (FIG. 2, reference numeral 27) may be mounted on the back surface 25 of the first substrate 20.

第２基板３０は、おもて面３１に電子部品３２が載せられると共に一端に第２コネクタ３３が載せられている。
第２基板３０には、大型部品２３から延びる端子２３ａに対応するスルーホール３４及び基板間接続ピン２６に対応するスルーホール３５が設けられている。
下位の第１基板２０に対して上位の第２基板３０を重ねる。 The second substrate 30 has an electronic component 32 mounted on the front surface 31 and a second connector 33 mounted on one end.
The second substrate 30 is provided with a through hole 34 corresponding to the terminal 23 a extending from the large component 23 and a through hole 35 corresponding to the inter-substrate connection pin 26.
The upper second substrate 30 is overlaid on the lower first substrate 20.

重ねた形態は、図２に示される。
図２に示すように、第１基板２０の裏面２５と第２基板３０のおもて面３１が対面するようにし且つ第１コネクタ２４が第２基板３０に干渉しないようにすると共に第２コネクタ３３が第１基板２０に干渉しないようにして第１基板２０に第２基板３０が重ねられている。
第１コネクタ２４から延びる端子２４ａ、第２コネクタ３３から延びる端子３３ａ、大型部品２３から延びる端子２３ａ及び基板間接続ピン２６の先端が、全て上へ突出しており、結果、これらは第２基板３０の裏面３６側から見ることができる。 The superimposed form is shown in FIG.
As shown in FIG. 2, the back surface 25 of the first substrate 20 and the front surface 31 of the second substrate 30 face each other and the first connector 24 does not interfere with the second substrate 30 and the second connector. The second substrate 30 is superimposed on the first substrate 20 so that 33 does not interfere with the first substrate 20.
The terminals 24a extending from the first connector 24, the terminals 33a extending from the second connector 33, the terminals 23a extending from the large component 23, and the tips of the inter-board connection pins 26 all protrude upward, and as a result, these are the second substrate 30. It can be seen from the back surface 36 side.

図３（ａ）は第２基板３０の裏面３６側から見た図であり、第１コネクタ２４から延びる端子２４ａ、第２コネクタ３３から延びる端子３３ａ、大型部品２３から延びる端子２３ａ及び基板間接続ピン２６の先端に半田工程を施す。半田工程は１度で済む。   FIG. 3A is a view as seen from the back surface 36 side of the second substrate 30. The terminal 24 a extending from the first connector 24, the terminal 33 a extending from the second connector 33, the terminal 23 a extending from the large component 23, and the connection between the substrates A soldering process is applied to the tip of the pin 26. Only one soldering process is required.

図３（ｂ）は図３（ａ）のｂ−ｂ線断面図であり、大型部品２３の端子２３ａに対応して、第１基板２０に端子２３ａの外径より十分に大径の大径穴２８が設けられており、第２基板３０に端子２３ａの外径より僅かに大径のスルーホール３４が設けられている。大型部品２３は第１基板２０に載っているが第２基板３０に半田３７で固定される。大径穴２８のクリアランスにより、第１基板２０が第２基板３０に対して若干移動しても、端子２３ａが第１基板２０で曲げられる心配はない。   FIG. 3B is a cross-sectional view taken along the line bb in FIG. 3A, and corresponds to the terminal 23 a of the large component 23, and the first substrate 20 has a large diameter sufficiently larger than the outer diameter of the terminal 23 a. A hole 28 is provided, and a through hole 34 having a diameter slightly larger than the outer diameter of the terminal 23 a is provided in the second substrate 30. The large component 23 is mounted on the first substrate 20 but is fixed to the second substrate 30 with solder 37. Even if the first substrate 20 moves slightly with respect to the second substrate 30 due to the clearance of the large-diameter hole 28, there is no fear that the terminal 23 a is bent by the first substrate 20.

なお、基板間接続ピン２６についても第１基板２０に大径穴を設けることが望ましい。
第１基板２０が第２基板３０に対して若干移動しても、基板間接続ピン２６が第１基板２０で曲げられる心配がなくなるからである。 Note that it is desirable to provide a large-diameter hole in the first substrate 20 for the inter-substrate connection pins 26 as well.
This is because even if the first substrate 20 moves slightly with respect to the second substrate 30, there is no fear that the inter-substrate connection pins 26 are bent by the first substrate 20.

図３（ｃ）に示すように、ケース４０は、第１基板２０のおもて面３１に対面する基本面４１と、この基本面４１に立てた一対の側面４２、４２と、一対の側面４２、４２の一端同士を繋ぐと共に第１コネクタ２４が通過する第１通孔４４を有する第１端面４５と、一対の側面４２、４２の他端同士を繋ぐと共に第２コネクタ３３が通過する第２通孔４６を有する第２端面４７とを有し、残る一面（図では上面）が開口部４８であるバスタブ型ケースである。   As shown in FIG. 3C, the case 40 includes a basic surface 41 that faces the front surface 31 of the first substrate 20, a pair of side surfaces 42 and 42 that stand on the basic surface 41, and a pair of side surfaces. The first end surface 45 having a first through hole 44 through which the first connector 24 passes and the other end of the pair of side surfaces 42 and 42 are connected and the second connector 33 passes through. The bathtub-type case has a second end face 47 having two through holes 46, and the remaining one face (upper face in the figure) is an opening 48.

一面が開口部４８であるため、第１基板２０及び第２基板３０を容易にケース４０内部にセットすることができる。
好ましくは、ケース４０の基本面４１に大型部品（図２、符号２３）の一部を収納する凹部４９を設ける。凹部４９は外から見ると凸部（図４（ｂ）、符号５１）になる。
また、ケース４０は金属板をプレス成形してなるプレス品が好適であるが、樹脂成形品であってもよい。 Since one surface is the opening 48, the first substrate 20 and the second substrate 30 can be easily set inside the case 40.
Preferably, the basic surface 41 of the case 40 is provided with a recess 49 for accommodating a part of the large component (FIG. 2, reference numeral 23). The concave portion 49 becomes a convex portion (FIG. 4B, reference numeral 51) when viewed from the outside.
The case 40 is preferably a press product obtained by press molding a metal plate, but may be a resin molded product.

図４（ａ）にて、開口部４８から樹脂材料５２をケース４０内部へ注入する。
樹脂材料５２は、二液タイプ（ウレタン系樹脂又はエポキシ系樹脂）が推奨される。一液タイプは低温保管が必要であり、粘度が高く流動性に難がある。この点、二液タイプであれば常温保管が可能であり、流動性に富み、細部まで浸透する。 In FIG. 4A, the resin material 52 is injected into the case 40 from the opening 48.
As the resin material 52, a two-component type (urethane resin or epoxy resin) is recommended. The one-component type requires low-temperature storage, has a high viscosity, and is difficult to flow. In this respect, the two-component type can be stored at room temperature, has high fluidity, and penetrates into details.

樹脂材料５２は第１基板２０及び第２基板３０を覆う。開口部４８付近に達したら注入を停止する。固化すると樹脂モールド５３になる。樹脂モールド５３で第１基板２０及び第２基板３０が保護される。
なお、図３（ｃ）で説明したように、ケース４０に凹部４９の基本面４１を設けたことにより、樹脂材料５２の所要量が少なくなる。よって、ケース４０に凹部４９を設けることが推奨される。 The resin material 52 covers the first substrate 20 and the second substrate 30. The injection is stopped when the vicinity of the opening 48 is reached. When solidified, the resin mold 53 is obtained. The first substrate 20 and the second substrate 30 are protected by the resin mold 53.
As described with reference to FIG. 3C, since the basic surface 41 of the recess 49 is provided in the case 40, the required amount of the resin material 52 is reduced. Therefore, it is recommended to provide the recess 49 in the case 40.

図４（ａ）を反転すると図４（ｂ）のようになる。
図４（ｂ）に示すように、電子制御装置１０は、ケース４０の基本面４１に凸部５１を備え、ケース４０の一端から第１コネクタ２４を突出させ、ケース４０の他端から第２コネクタ３３を突出させた形態の装置である。 When FIG. 4 (a) is inverted, it becomes as shown in FIG. 4 (b).
As shown in FIG. 4B, the electronic control device 10 includes a convex portion 51 on the basic surface 41 of the case 40, the first connector 24 protrudes from one end of the case 40, and the second from the other end of the case 40. This is a device in a form in which the connector 33 is protruded.

なお、本発明の電子制御装置１０は、車載装置に好適であるが、他の用途に適用することは差し支えない。   In addition, although the electronic control apparatus 10 of this invention is suitable for a vehicle-mounted apparatus, it does not interfere with applying to another use.

本発明は車両に搭載される電子制御装置に好適である。   The present invention is suitable for an electronic control device mounted on a vehicle.

１０…電子制御装置、２０…第１基板、２１…第１基板のおもて面、２２、３２…電子部品、２３…電子部品（大型部品、コンデンサ）、２３ａ…大型部品から延びる端子、２４…第１コネクタ、２４ａ…第１コネクタから延びる端子、２５…第１基板の裏面、２８…大径穴、３０…第２基板、３１…第２基板のおもて面、３３…第２コネクタ、３３ａ…第２コネクタから延びる端子、３４、３５……スルーホール、３６…第２基板の裏面、３７…半田、４０…ケース、４１…基本面、４２…側面、４４…第１通孔、４５…第１端面、４６…第２通孔、４７…第２端面、４８…開口部、４９…凹部、５１…凸部、５３…樹脂モールド。   DESCRIPTION OF SYMBOLS 10 ... Electronic control apparatus, 20 ... 1st board | substrate, 21 ... Front surface of 1st board | substrate, 22, 32 ... Electronic component, 23 ... Electronic component (large sized component, capacitor | condenser), 23a ... Terminal extended from a large sized component, 24 DESCRIPTION OF SYMBOLS 1st connector, 24a ... Terminal extended from 1st connector, 25 ... Back surface of 1st board | substrate, 28 ... Large diameter hole, 30 ... 2nd board | substrate, 31 ... Front surface of 2nd board | substrate, 33 ... 2nd connector 33a ... terminals extending from the second connector, 34, 35 ... through hole, 36 ... back surface of the second substrate, 37 ... solder, 40 ... case, 41 ... basic surface, 42 ... side surface, 44 ... first through hole, 45 ... 1st end surface, 46 ... 2nd through-hole, 47 ... 2nd end surface, 48 ... Opening part, 49 ... Recessed part, 51 ... Convex part, 53 ... Resin mold.

Claims (5)

少なくともおもて面に電子部品が載せられると共に前記おもて面の一端に第１コネクタが設けられている第１基板と、
少なくともおもて面に電子部品が載せられると共に前記おもて面の一端に第２コネクタが設けられている第２基板と、
前記第１基板の裏面と前記第２基板のおもて面が対面するようにし且つ前記第１コネクタが前記第２基板に干渉しないようにすると共に前記第２コネクタが前記第１基板に干渉しないようにして前記第１基板に前記第２基板が重ねられ、この状態で前記第１基板及び前記第２基板を収容するケースとからなることを特徴とする電子制御装置。 A first substrate on which an electronic component is placed at least on the front surface and a first connector is provided at one end of the front surface;
A second substrate on which an electronic component is placed at least on the front surface and a second connector is provided at one end of the front surface;
The back surface of the first substrate and the front surface of the second substrate face each other, the first connector does not interfere with the second substrate, and the second connector does not interfere with the first substrate. Thus, the second substrate is overlaid on the first substrate, and in this state, the electronic control device comprises a case for accommodating the first substrate and the second substrate. 前記第１基板には、前記第１基板のおもて面に載せられる前記電子部品の一部又は全部から延びる端子を通過させる大径穴が設けられ、
前記第２基板には、前記大径穴を通過する端子に対応するスルーホールが設けられており、
前記スルーホールを通過した端子と、前記第１コネクタから延びて前記第１基板を通過した端子と、前記第２コネクタから延びて前記第２基板を通過した端子とが、前記第２基板の裏面側から見えるように配置されていることを特徴とする請求項１記載の電子制御装置。 The first substrate is provided with a large-diameter hole through which a terminal extending from a part or all of the electronic component placed on the front surface of the first substrate is passed,
The second substrate is provided with a through hole corresponding to a terminal passing through the large diameter hole,
A terminal that passes through the through hole, a terminal that extends from the first connector and passes through the first substrate, and a terminal that extends from the second connector and passes through the second substrate are the back surface of the second substrate. 2. The electronic control device according to claim 1, wherein the electronic control device is arranged so as to be visible from the side. 前記ケースは、前記第１基板の前記おもて面に対面する基本面と、この基本面に立てた一対の側面と、前記一対の側面の一端同士を繋ぐと共に前記第１コネクタが通過する第１通孔を有する第１端面と、前記一対の側面の他端同士を繋ぐと共に前記第２コネクタが通過する第２通孔を有する第２端面とを有し、残る一面が開口部であるバスタブ型ケースであることを特徴とする請求項１又は請求項２記載の電子制御装置。   The case connects a basic surface facing the front surface of the first substrate, a pair of side surfaces standing on the basic surface, one end of the pair of side surfaces, and the first connector through which the first connector passes. A bathtub having a first end surface having one through hole and a second end surface having a second through hole that connects the other ends of the pair of side surfaces and through which the second connector passes, and the remaining one surface is an opening. The electronic control device according to claim 1, wherein the electronic control device is a mold case. 前記第１基板のおもて面に載せられる電子部品に大型部品が含まれており、
前記ケースの前記基本面に前記大型部品を収納する凹部が形成されていることを特徴とする請求項３記載の電子制御装置。 The electronic component placed on the front surface of the first substrate includes a large component,
The electronic control device according to claim 3, wherein a concave portion for accommodating the large component is formed on the basic surface of the case. 前記開口部は樹脂注入口を兼ねており、前記ケース内に樹脂モールドが充填されていることを特徴とする請求項３又は請求項４記載の電子制御装置。   The electronic control device according to claim 3, wherein the opening serves also as a resin injection port, and the case is filled with a resin mold.
JP2017023297A 2017-02-10 2017-02-10 Electronic control device Pending JP2018129479A (en)

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JPH06503690A (en) * 1991-11-05 1994-04-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical devices, e.g. switching and control devices for automobiles
JP2002205610A (en) * 2001-01-09 2002-07-23 Honda Motor Co Ltd Control apparatus for vehicle
JP2009106073A (en) * 2007-10-23 2009-05-14 Aisin Aw Co Ltd Inverter unit
JP2009200190A (en) * 2008-02-21 2009-09-03 Keihin Corp Electric control unit and manufacturing method thereof
JP2010278091A (en) * 2009-05-27 2010-12-09 Diamond Electric Mfg Co Ltd On-vehicle semiconductor device
JP2014086671A (en) * 2012-10-26 2014-05-12 Keihin Corp Electronic control device for vehicle

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06503690A (en) * 1991-11-05 1994-04-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical devices, e.g. switching and control devices for automobiles
JP2002205610A (en) * 2001-01-09 2002-07-23 Honda Motor Co Ltd Control apparatus for vehicle
JP2009106073A (en) * 2007-10-23 2009-05-14 Aisin Aw Co Ltd Inverter unit
JP2009200190A (en) * 2008-02-21 2009-09-03 Keihin Corp Electric control unit and manufacturing method thereof
JP2010278091A (en) * 2009-05-27 2010-12-09 Diamond Electric Mfg Co Ltd On-vehicle semiconductor device
JP2014086671A (en) * 2012-10-26 2014-05-12 Keihin Corp Electronic control device for vehicle

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