JP2013110593A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013110593A5 JP2013110593A5 JP2011254182A JP2011254182A JP2013110593A5 JP 2013110593 A5 JP2013110593 A5 JP 2013110593A5 JP 2011254182 A JP2011254182 A JP 2011254182A JP 2011254182 A JP2011254182 A JP 2011254182A JP 2013110593 A5 JP2013110593 A5 JP 2013110593A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- adhesive
- camera module
- frame member
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000007872 degassing Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011254182A JP5899862B2 (ja) | 2011-11-21 | 2011-11-21 | カメラモジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011254182A JP5899862B2 (ja) | 2011-11-21 | 2011-11-21 | カメラモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013110593A JP2013110593A (ja) | 2013-06-06 |
| JP2013110593A5 true JP2013110593A5 (enrdf_load_stackoverflow) | 2015-01-08 |
| JP5899862B2 JP5899862B2 (ja) | 2016-04-06 |
Family
ID=48706948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011254182A Expired - Fee Related JP5899862B2 (ja) | 2011-11-21 | 2011-11-21 | カメラモジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5899862B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6085028B2 (ja) * | 2013-07-30 | 2017-02-22 | 京セラ株式会社 | 撮像素子搭載用基板及び撮像装置 |
| CN106027863B (zh) * | 2016-05-27 | 2019-10-18 | 维沃移动通信有限公司 | 一种摄像头底座、摄像头及终端 |
| KR102493390B1 (ko) * | 2018-03-20 | 2023-01-30 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 광학 기기 |
| US12032279B2 (en) | 2018-03-20 | 2024-07-09 | Lg Innotek Co., Ltd. | Camera module and optical device comprising same |
| CN113132584B (zh) * | 2020-01-10 | 2022-07-12 | 宁波舜宇光电信息有限公司 | 滤光组件、摄像模组及多摄模组 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4554492B2 (ja) * | 2005-11-01 | 2010-09-29 | シャープ株式会社 | 半導体パッケージの製造方法 |
| JP4378394B2 (ja) * | 2007-05-31 | 2009-12-02 | シャープ株式会社 | 半導体装置およびそれを備えた光学装置用モジュール |
| KR20100032857A (ko) * | 2007-07-19 | 2010-03-26 | 가부시키가이샤후지쿠라 | 반도체 패키지와 그 제조 방법 |
| JP2010141123A (ja) * | 2008-12-11 | 2010-06-24 | Shinko Electric Ind Co Ltd | 電子部品装置 |
| JP2011159900A (ja) * | 2010-02-03 | 2011-08-18 | Panasonic Corp | 固体撮像装置 |
-
2011
- 2011-11-21 JP JP2011254182A patent/JP5899862B2/ja not_active Expired - Fee Related