JP2013110244A - Sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sticking method capable of reducing the cost of the sheet sticking device and sticking an adhesive sheet to the side surface of a piece-like body.SOLUTION: A sheet sticking device 1A which sticks an adhesive sheet AS to an adherend WF provided with a plurality of piece-like bodies CP comprises: support means 2 for supporting the adherend WF in which the adhesive sheet AS is stuck to the plurality of piece-like bodies CP; heating means 3 for heating the adhesive sheet AS stuck to the adherend WF supported by the support means 2; and spraying means 4 for spraying a gas to the adherend WF supported by the support means 2 from the adhesive sheet AS side. The spraying means 4 makes it possible to stick the adhesive sheet AS to the side surfaces CPX and CPY of each piece-like body CP by spraying the gas to the adhesive sheet AS softened by the heating means 3.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

  Conventionally, in a semiconductor manufacturing process, a convex part as a piece formed on one surface of a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) by so-called dicing or a wafer having a predetermined shape and a predetermined size. A semiconductor chip (hereinafter sometimes simply referred to as a chip) as an individual piece is covered with an adhesive sheet or coated with a resin or the like to cover these pieces. (For example, refer to Patent Document 1).

  The apparatus described in Patent Document 1 presses a chip coated with resin around it using a press mold having a recess that matches the shape of the chip, so that the top and side surfaces of the chip are coated with resin. It is configured to cover with.

JP 2008-16606 A

  However, since the conventional apparatus as described in Patent Document 1 presses using a press die that matches the chip shape, it is necessary to prepare a different press die for each shape of the chip formed on the wafer. There is a disadvantage that the number of parts of the apparatus increases. Moreover, since it is difficult to process the press-shaped concave portion with a shallow depth and accuracy, there is an inconvenience that the thickness of the coating layer is limited.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can reduce the number of components and can stick an adhesive sheet to the side surface of a piece-like body.

  The sheet sticking device of the present invention is a sheet sticking device for sticking an adhesive sheet to an adherend provided with a plurality of pieces, and supports the adherend to which the adhesive sheet is attached over the plurality of pieces. Supporting means for heating, heating means for heating the adhesive sheet affixed to the adherend supported by the support means, and spraying means for blowing gas from the adhesive sheet side to the adherend supported by the support means The spraying means is configured such that the adhesive sheet can be attached to the side surface of each piece by blowing gas onto the adhesive sheet softened by the heating means.

The sheet sticking apparatus of the present invention preferably includes a cleaving means for cleaving the adhesive sheet along the gaps between the plurality of pieces.
In the sheet sticking device of the present invention, it is preferable that the cleaving means is constituted by the spraying means.
In the sheet sticking device of the present invention, it is preferable that the cleaving means is constituted by an expanding means that widens the gaps between the plurality of pieces.

  The sheet sticking method of the present invention is a sheet sticking method for sticking an adhesive sheet to an adherend provided with a plurality of pieces, and supports the adherend to which the adhesive sheet is attached over the plurality of pieces. Then, while heating the adhesive sheet affixed to the supported adherend, the adhesive sheet is affixed to the side surface of each piece by blowing gas to the adhesive sheet softened by heating. .

  According to the present invention as described above, the adhesive sheet can be attached to the side surface of the piece-like body with a simple configuration, and the number of parts of the apparatus can be reduced. In addition, the adhesive sheet is configured by applying an adhesive to a film serving as a base material and can be easily thinned. Therefore, by using such an adhesive sheet, the coating layer can be thinned. .

Moreover, if a cleaving means is provided, the said adhesive sheet can be cleaved in the state which the adhesive sheet was affixed on the side surface of each piece-like body.
Furthermore, if the cleaving means is constituted by the spraying means, it is not necessary to separately provide a configuration for cleaving the adhesive sheet, and the number of parts of the apparatus can be further reduced.
On the other hand, if the cleaving means is constituted by the expanding means, the gap between the pieces can be expanded while cleaving the adhesive sheet, so that the plurality of pieces can be continuously operated without being transported to another pickup device. It is possible to improve the manufacturing work efficiency of the product using the piece.

The side view of the sheet sticking apparatus which concerns on 1st Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. The side view of the sheet sticking apparatus which concerns on 2nd Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In the second and subsequent embodiments, the same constituent members as those described in the first embodiment and constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment. The description of is omitted or simplified. Further, with reference to FIG. 1 in the first embodiment and FIG. 3 in the second embodiment, the left-right direction is the X-axis direction, the orthogonal direction to the drawing is the Y-axis direction, and the vertical direction is the Z-axis direction. And

[First Embodiment]
In FIG. 1, the sheet sticking apparatus 1A has dicing lines formed in the X-axis direction and the Y-axis direction on the surface, and can be separated into a plurality of rectangular chips CP as pieces along the dicing lines. A device that sprays gas on the adhesive sheet AS in a state where the adhesive sheet AS is adhered to the wafer WF as the adherend, and adheres the adhesive sheet AS to the side surfaces CPX and CPY continuous from the surface of the chip CP. is there. Here, the adhesive sheet AS is formed in a size substantially equal to the outer shape of the wafer WF, and is attached to all the chips CP. A protective sheet PS is attached to the opposite surface of the wafer WF to which the adhesive sheet AS is attached.

  The sheet sticking apparatus 1A includes a support unit 2 that supports the wafer WF, a heating unit 3 that heats the adhesive sheet AS of the wafer WF supported by the support unit 2, and a spray unit that blows gas from the adhesive sheet AS side to the wafer WF. 4 and moving means 5 for moving the supporting means 2 and the spraying means 4 relative to each other.

  The support means 2 includes a table 21 that supports the wafer WF, and a rotation motor 22 that is provided below the table 21 and serves as a drive device that rotates the table 21 in the plane of the wafer WF. The table 21 is configured to be able to suck the wafer WF through a suction hole (not shown) that opens to the support surface of the wafer WF.

  The heating means 3 includes a heater 31 provided in the table 21. The heater 31 is configured such that the temperature can be appropriately set according to the temperature at which the adhesive sheet AS softens and the characteristics of the adhesive sheet AS.

  The spray means 4 includes an air outlet 41 connected to a gas supply device such as a pressure pump and a pressure tank (not shown), and is configured to be able to spray gas from the air outlet 41 to the adhesive sheet AS. The air outlet 41 is disposed opposite to the upper side of the wafer WF supported by the table 21 and is formed in a linear and narrow groove shape that is longer than the diameter of the wafer WF in the Y-axis direction.

  The moving means 5 includes a linear motion motor 52 as a driving device for driving the slider 51 that supports the spraying means 4, and the slider 51 is moved in the left-right direction in FIG. And the spraying means 4 are configured to be relatively movable.

In the above sheet sticking apparatus 1A, a procedure for sticking the adhesive sheet AS to the side surfaces CPX and CPY of the chip CP will be described.
First, as shown in FIG. 1, the support unit 2 sucks the wafer WF from the protective sheet PS side by the table 21. Further, the heating unit 3 heats the wafer WF with the heater 31 to soften the adhesive sheet AS attached to the wafer WF.

  In this state, the spraying means 4 starts gas spraying. Then, as shown in FIG. 2A, the spraying means 4 is moved rightward by the moving means 5 while blowing gas from the outlet 41 toward the adhesive sheet AS. At this time, as shown in FIG. 2B, when the air outlet 41 is positioned on the gap between the chips CP, the adhesive sheet AS enters the gap by the blowing force of the gas from the air outlet 41, and the adhesive sheet AS is The chip CP is attached to the side surface CPY parallel to the Y-axis direction. Then, as shown in FIG. 2C, the adhesive sheet AS is cleaved along the gap because stress due to the blowing force of the gas concentrates on the portion in the gap. That is, the cleaving means of this embodiment is constituted by the blowing means 4.

  Next, the table 21 is rotated by a predetermined angle (90 degrees in the present embodiment) in the in-plane direction of the wafer WF by driving the rotation motor 22, and then the spraying means 4 is moved by the moving means 5 in FIG. By being moved to the left, it is configured to perform a pasting operation and a cleaving operation on the side surface CPX parallel to the X-axis direction. Thereby, even when the gap is formed along a direction different from the Y-axis direction (X-axis direction in the case of the present embodiment), the rotation direction of the table 21 causes the formation direction of the outlet 41 and the formation direction of the gap. By combining the above, the adhesive sheet AS is reliably stuck and cleaved so that the gas is blown into the gap formed in any direction.

  Thereafter, the adsorption of the wafer WF by the table 21 is stopped, and the wafer WF having the adhesive sheet AS adhered to the side surfaces CPX and CPY of the chip CP is picked up by a conveying means (not shown) while the protective sheet PS is adhered. It is conveyed to the subsequent process.

According to this embodiment, there are the following effects.
That is, the sheet sticking device 1A sticks the adhesive sheet AS to the side surfaces CPX and CPY of the chip CP by blowing gas onto the adhesive sheet AS softened by the heating means 3, and thus the top surface of each chip CP with a simple configuration. In addition, the adhesive sheet AS can be attached to the four side surfaces CPX and CPY, and the number of parts of the sheet attaching apparatus 1A can be reduced. Further, since the adhesive sheet AS can be easily thinned, by using such an adhesive sheet AS, the coating layer of the chip CP can be thinned.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 3, the sheet sticking apparatus 1 </ b> B of the present embodiment is different from the first embodiment in that it includes an expanding unit 7. Further, the wafer WF of the present embodiment has a configuration in which the adhesive sheet AS is attached to one surface of the wafer WF and is integrated with the ring frame RF through a dicing sheet DS attached to the other surface. This is different from the first embodiment.

  The expanding means 7 includes a plurality of linear motion motors 71 as drive devices supported by a bracket 75 fixed around the table 21, and a first contact portion 72 supported by an output shaft 71 </ b> A of the linear motion motor 71. A linear motion motor 73 as a driving device fixed to the first contact portion 72 and an output shaft 73A of the linear motion motor 73, and the ring frame RF portion is sandwiched together with the first contact portion 72. A second contact portion 74.

  In the above-described sheet sticking apparatus 1B, as a procedure for sticking the adhesive sheet AS to the side surfaces CPX and CPY of the chip CP, first, as shown in FIG. 3, the wafer WF is attracted to the support means 2 from the dicing sheet DS side. Further, the second contact portion 74 is lowered by driving the linear motion motor 71, and the ring frame RF portion is sandwiched between the second contact portion 74 and the first contact portion 72.

  In this state, as shown in FIG. 3, the sheet sticking device 1 </ b> B moves the spraying means 4 to the right in FIG. 3 while spraying gas onto the adhesive sheet AS softened by the heating means 3. AS is affixed to the side surface CPY of each chip CP. When the spraying means 4 reaches the position indicated by the two-dot chain line in the drawing, the table 21 is rotated 90 degrees in the in-plane direction of the wafer WF by driving the rotation motor 22, and then the spraying means 4 is moved to the left in the figure. It is moved in the direction to perform the pasting operation on the side surface CPX. At this point, the adhesive sheet AS is in a state of entering the gap between the chips CP and may not be cleaved. Since the adhesive sheet AS is formed of a plastically deformable material, the adhesive sheet AS does not act so as to shrink, and the adhesive sheet AS in the gap of the chip CP is peeled from the side surfaces CPX and CPY of the chip CP. There is nothing to do.

  Next, the expanding means 7 lowers the contact portions 72 and 74 by driving the linear motion motor 71 as shown in FIG. As a result, the dicing sheet DS is pulled to widen the gap between the chips CP, so that the adhesive sheet AS in the gap is cleaved. That is, the cleaving means of this embodiment is constituted by the expanding means 7.

  At this time, by further moving the spraying means 4 in the left-right direction in the figure and blowing the gas over the entire surface of the adhesive sheet AS, the cleaving of the adhesive sheet AS can be assisted. That is, the gas is blown onto the adhesive sheet AS, so that the gap between the chips CP is expanded in a state where the adhesive sheet AS in the gap is pressed downward. Therefore, a large tension is applied to the adhesive sheet AS, and the adhesive sheet AS Cleavage is promoted.

  Also according to this embodiment described above, the same effect as in the first embodiment can be obtained. Further, since the expanding means 7 can widen the gap between the chips CP while cleaving the adhesive sheet AS, the pick-up property of the chips CP can be improved, and the manufacturing work efficiency of semiconductor products using the chips CP can be improved. Can be improved.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

  For example, in the above-described embodiment, the cleaving means is configured by the spraying means 4 and the expanding means 7, but is not limited thereto, and may be configured by, for example, a cutting means provided with a cutting blade.

  The expanding means 7 is not limited to that of the second embodiment. For example, when the wafer WF is not supported by the ring frame RF as in the first embodiment, the adhesive sheet AS is moved in the X-axis direction and the Y-direction. It is good also as a structure pulled toward the outer peripheral direction of the wafer WF, such as an axial direction.

  Further, the expanding means 7 is not limited to that of the second embodiment, and the ring frame RF may be fixed and the table 21 may be raised, or both the ring frame RF and the table 21 may be raised. Also good.

  Further, the length of the groove of the spraying means 4 is not limited to that of the above embodiment, and may be, for example, the length of one side of the chip CP or less.

In the above-described embodiment, the wafer WF that has been separated into a plurality of chips CP is used, and the adhesive sheet AS is attached. However, cutting is performed from one surface by tip dicing, and the other surface is reached. It is also possible to use a wafer WF having a plurality of projections as a piece having a groove without a groove and an adhesive sheet AS attached thereto.
In the embodiment, the wafer WF is supported by suction, but the wafer WF may be supported by a chuck device.

  In the above-described embodiment, the heating means 3 is constituted by the heater 31. However, the present invention is not limited to this. If the adhesive sheet AS can be directly or indirectly heated, hot water or a discharge heater is used instead of the heater 31. An infrared irradiation device, a microwave irradiation device, or the like may be used. Further, heating means such as the heater 31 may be provided outside the table 21, and the adhesive sheet AS may be heated by the heater 31 from above or from the side, or the atmosphere above the adhesive sheet AS may be heated. .

In the embodiment, the moving means 5 fixes the supporting means 2 and moves the spraying means 4. However, the moving means 5 may fix the spraying means 4 and move the supporting means 2. You may move both with the means 4. Further, the moving unit 5 may be omitted, and the spray unit 4 may be configured to spray the gas all over the surface of the wafer WF.
On the other hand, when performing the pasting operation, the table 21 may be fixed and the spraying means 4 may be rotated, or both the table 21 and the spraying means 4 may be rotated. Further, the predetermined angle at which the table 21 is rotated does not have to be 90 degrees, and can be, for example, 30 degrees or 60 degrees, and can be determined as appropriate depending on the formation pattern (formation direction, etc.) of the gaps of the chip CP.

  The type and material of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may have three or more layers such as an intermediate layer between the base sheet and the adhesive layer, or other layers. Good. The adhesive sheet AS may be a protective sheet, a dicing tape, a die attach film, or the like. Examples of the wafer WF include a silicon semiconductor wafer and a compound semiconductor wafer. The adhesive sheet AS to be attached to the wafer WF is not limited to a protective sheet, a dicing tape, and a die attach film, but any other sheet, film, An adhesive sheet having an arbitrary use and shape such as a tape can be applied. Furthermore, as a to-be-adhered body, not only a glass plate, a steel plate, a resin plate, etc., and other members, but also members and articles in any form can be targeted.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Support means 3 Heating means 4 Spraying means 7 Expanding means AS Adhesive sheet CP chip (strip-shaped body)
WF Wafer (Substrate)

Claims (5)

A sheet sticking device for sticking an adhesive sheet to an adherend having a plurality of pieces,
A support means for supporting an adherend to which an adhesive sheet is pasted over the plurality of pieces,
Heating means for heating the adhesive sheet affixed to the adherend supported by the support means;
Spraying means for blowing gas from the adhesive sheet side to the adherend supported by the supporting means,
The sheet applying apparatus, wherein the spraying unit is configured to be able to apply an adhesive sheet to a side surface of each piece by blowing gas onto the adhesive sheet softened by the heating unit.   The sheet sticking apparatus according to claim 1, further comprising a cleaving unit that cleaves the adhesive sheet along a gap between the plurality of pieces.   The sheet sticking device according to claim 2, wherein the cleaving means is constituted by the spraying means.   The sheet pasting device according to claim 2, wherein the cleaving means is constituted by an expanding means that widens a gap between the plurality of pieces. A sheet attaching method for attaching an adhesive sheet to an adherend having a plurality of pieces,
Support an adherend to which an adhesive sheet is pasted over the plurality of pieces,
A method for applying an adhesive sheet, wherein the adhesive sheet is attached to the side surface of each piece by heating the adhesive sheet attached to the supported adherend and blowing a gas to the adhesive sheet softened by heating. .

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