JP2013105906A - Current lead - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric cooling type current lead which stably realizes desired characteristics and improves the handleability.SOLUTION: A current lead connects a superconductive application device installed at a low temperature part with an external device installed at a normal temperature part and includes: a low temperature side electrode 102 connecting with the superconductive application device; a normal temperature side electrode 103 connecting with the external device; a thermoelectric element 101 where the low temperature side electrode is joined to one surface and the normal temperature side electrode is joined to the other surface; and a pressure adjustment mechanism adjusting pressure applied to joining parts where the thermoelectric element is joined to the low temperature side electrode and the normal temperature side electrode and including coil springs 104. The pressure adjustment mechanism properly adjusts the pressure applied to the thermoelectric element during solder joining and use of the current lead 10.

Description

  The present invention relates to a current lead for connecting a superconducting application device installed in a low temperature part and an external device installed in a room temperature part, and more particularly to a thermoelectric cooling type current lead using a thermoelectric conversion element.

In recent years, in the field of superconducting applied equipment using superconductivity such as superconducting cables and superconducting magnets, research and development have been conducted for practical use. In general, a superconducting application device is installed in a low temperature part (low temperature container) and connected to an external device (for example, a power source) installed in the normal temperature part via a current lead.
Since the operation of superconducting equipment is performed in a cryogenic environment, the heat insulation of the low temperature part is extremely important. If the heat insulation property of the low temperature part is poor and the heat penetration into the low temperature part is large, the cooling efficiency of the superconducting application equipment will decrease and the cooling cost for maintaining the superconducting state will increase. It becomes impossible to drive. As a path of heat penetration into the low temperature portion, a path for transferring heat through the low temperature container or a path for transferring heat through the current leads can be considered.

  As a technique for preventing heat intrusion through a cryogenic vessel, a dual-structure cryogenic vessel having a refrigerant tank containing a refrigerant such as liquid nitrogen and a superconducting application device and a vacuum tank provided outside the refrigerant vessel It has been known. According to this low-temperature container, heat penetration into the low-temperature part is reduced by vacuum insulation.

As a method for preventing heat intrusion through the current lead, a superconducting current lead using an oxide superconductor has been proposed (for example, Patent Documents 1 to 3). Oxide superconductors have lower electrical resistance and lower thermal conductivity than metal conductors (a few tenths of copper), so there is no Joule heat generation in the superconducting current leads, and transmission to the low temperature part. The amount of heat is very small. Therefore, according to the superconducting current lead, heat penetration into the low temperature portion is reduced.
However, the superconducting current lead requires a cooling facility for maintaining the current lead itself in a superconducting state, and has a drawback that the cooling cost increases.

  Therefore, as another method for preventing heat intrusion through the current lead, a thermoelectric cooling type current lead using a thermoelectric conversion element (hereinafter, Peltier element) has been proposed (for example, Patent Document 4). In a thermoelectric cooling type current lead, an electrode (low temperature side electrode) connected to a superconducting application device in a low temperature part and an electrode (normal temperature side electrode) connected to an external device in a normal temperature part are connected via a Peltier element. (See FIG. 1). Specifically, one end face of the low temperature side electrode and the Peltier element are joined by solder, and similarly, the other end face of the Peltier element and the room temperature side electrode are joined by solder. Hereinafter, when the low temperature side electrode and the normal temperature side electrode are not distinguished, they are simply referred to as electrodes.

  The Peltier element has a function of absorbing heat from one end side and releasing heat from the other end side when energized. The Peltier device is made of, for example, a BiTe (bismuth-tellurium) -based compound semiconductor. When the Peltier element is made of a p-type semiconductor, heat is absorbed on the current inflow side and heat is generated on the outflow side. Conversely, when the Peltier element is composed of an n-type semiconductor, heat is generated on the current inflow side and heat is absorbed on the outflow side. Therefore, by using a Peltier element composed of a p-type semiconductor or an n-type semiconductor according to the energization direction in the thermoelectrically cooled current lead, heat can be transferred from the low temperature portion to the normal temperature portion during energization. , Heat penetration into the low temperature part is reduced.

  The electrode is generally composed of oxygen-free copper (OFC) having a purity of 99.99% or more.

JP-A-7-283023 JP-A-9-153407 JP-A-8-273922 JP 2004-6859 A

  By the way, in the thermoelectric cooling type current lead, in order to obtain a desired Peltier effect at the time of use, it is necessary to fix the joint portion between the Peltier element and the electrode with a uniform holding force. This is because if a pressure of a certain level or higher (for example, 20.0 MPa or higher) is applied to the Peltier element, the Peltier effect is lowered, and the Peltier element may be damaged.

  On the other hand, when soldering the Peltier element and the electrode, it is necessary to perform solder bonding in a state where the Peltier element and the electrode are pressed at a certain pressure or higher (for example, 0.2 MPa or higher). If solder bonding is performed in a state where the Peltier element and the electrode are not pressed, defects such as irregularities and minute voids are generated on the bonding surface, which may reduce thermal conductivity and increase electrical resistance. .

  However, as shown in FIG. 1, the conventional thermoelectrically cooled current lead is not configured to finely adjust the pressure applied to the joint between the Peltier element and the electrode. That is, when the thermoelectric cooling type current lead is arranged vertically, the low temperature side fixing plate, in order to prevent the joint from being damaged by the weight of the superconducting wire connected to the low temperature side electrode and the low temperature side electrode, The joint is sandwiched and fixed by the room temperature side fixing plate and is merely reinforced.

  As described above, in the conventional thermoelectric cooling type current lead, the pressure applied to the joint portion between the Peltier element and the electrode cannot be appropriately adjusted depending on the use or solder joint, so that desired characteristics (heat conduction) Stability, electrical resistance, etc.) is difficult to achieve stably. That is, in the conventional thermoelectric cooling type current lead, the pressure applied to the Peltier element is adjusted by tightening the bolt to the connecting member that connects the low temperature side fixing plate and the normal temperature side fixing plate. When used, the Peltier effect is reduced, and conversely, if the tightening is slightly loose, bonding failure occurs at the time of soldering.

  Further, if an unintended external force is applied when the thermoelectric cooling type current lead is installed, the Peltier element may be directly shocked and damaged because the joint portion is fixed. That is, the conventional thermoelectric cooling type current lead has a problem in terms of handleability.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a thermoelectric cooling type current lead capable of stably realizing desired characteristics and improving handling. .

The current lead according to the present invention is a current lead for connecting a superconducting application device installed in a low temperature part and an external device installed in a room temperature part,
A low temperature side electrode connected to the superconducting application device;
A room temperature side electrode connected to the external device;
A thermoelectric conversion element in which the low temperature side electrode is bonded to one surface and the room temperature side electrode is bonded to the other surface;
A pressure adjusting mechanism for adjusting a pressure applied to a joint portion between the thermoelectric conversion element, the low temperature side electrode, and the normal temperature side electrode.

  According to the present invention, since the pressure adjusting mechanism is provided, the joining portion between the Peltier element and the electrode (low temperature side electrode, normal temperature side electrode) can be easily set within a predetermined pressure range according to use or soldering. Can be held. Therefore, desired characteristics can be stably realized in the thermoelectric cooling type current lead. Even if an unintended external force is applied when the thermoelectric cooling type current lead is installed, the external force is absorbed by the pressure adjusting mechanism. Therefore, the handling property of the thermoelectric cooling type current lead is remarkably improved.

It is a figure which shows the specific structure of the conventional thermoelectric cooling type | mold current lead. It is a figure which shows an example of the superconducting magnet apparatus using the current lead which concerns on one embodiment of this invention. It is a figure which shows the detailed structure of the current lead which concerns on embodiment. It is a figure which shows the current lead which concerns on other embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 2 is a diagram showing a superconducting magnet device using a current lead according to an embodiment of the present invention.
As shown in FIG. 2, the superconducting magnet device 1 includes a superconducting coil 11 installed in a low temperature part, a power supply 12 installed in a room temperature part, and two current leads electrically connecting the power supply 12 and the superconducting coil 11. 10 is provided. When the two current leads 10 are distinguished, they are referred to as current leads 10A and 10B.

  The superconducting coil 11 is installed in, for example, a cryogenic container 13 having a vacuum heat insulating structure and cooled by liquid helium. The power source 12 supplies a current necessary for exciting the superconducting coil 11 via the current lead 10.

  The current lead 10 is a thermoelectric cooling type current lead having a Peltier element 101 which is a thermoelectric conversion element. A low temperature side electrode 102 connected to the superconducting coil 11 is bonded to one surface of the Peltier element 101, and a normal temperature side electrode 103 connected to the power source 12 is bonded to the other surface. The low temperature side electrode 102 and the normal temperature side electrode 103 preferably have a Cu content of 90% by weight or more from the viewpoint of electrical resistance, and are made of oxygen-free copper having a purity of 99.99% or more, for example. The Peltier element 101 and the low temperature side electrode 102, and the Peltier element 101 and the normal temperature side electrode 103 are joined by soldering. As the solder used in this case, Sn—Ag—Cu (so-called lead-free solder) having a Sn content of 90 to 99% by weight is preferable from the viewpoint of heat resistance.

The Peltier device 101 is made of, for example, a BiTe-based, BiTeSb-based, or BiSb-based compound semiconductor. In particular, a BiTe-based semiconductor or BiTeSb-based semiconductor having a Te content of 5 to 50% by weight is preferable from the viewpoint of thermoelectric conversion efficiency. When a BiTe-based semiconductor or BiTeSb-based semiconductor is applied, a good cooling capacity can be obtained in a temperature range from room temperature to around 200K. In addition, when a BiSb-based semiconductor is applied, a good cooling capacity can be obtained in a temperature range from around 200K to around liquid nitrogen temperature (77K).
The Peltier device 101 has a maximum value of the figure of merit Z (= α ² / (κρ), α: Seebeck coefficient, κ: thermal conductivity, ρ: specific resistance) at a low temperature below room temperature. It is desirable to use a semiconductor whose composition is adjusted.

An n-type semiconductor is applied to the Peltier element 101 of the current lead 10A connected to the positive side of the power supply 12, and a p-type semiconductor is applied to the Peltier element 101 of the current lead 10B connected to the negative side. For example, the conductivity type of BiTe-based semiconductor is controlled in n-type by adding SbI _3, it is controlled in p-type by adding PbI _3. In addition, the conductivity type of the BiTe semiconductor can be controlled by slightly shifting the amount of the constituent element from the stoichiometric ratio.
In any of the current leads 10A and 10B, heat is generated on the low temperature side of the Peltier element 101, and heat is generated on the normal temperature side. That is, in the Peltier element 101, heat is transferred from the low temperature side to the normal temperature side when energized, so that heat penetration into the low temperature part is reduced and the superconducting coil 11 can be efficiently cooled.

FIG. 3 is a diagram illustrating a detailed configuration of the current lead 10 according to the embodiment.
As shown in FIG. 3, in the current lead 10, the low temperature side electrode 102 is joined to one surface of the Peltier element 101 by soldering, and the normal temperature side electrode 103 is joined to the other surface by soldering.

  Here, the room temperature side electrode 103 is divided into two members (referred to as a first room temperature side electrode 103a and a second room temperature side electrode 103b). The first room temperature side electrode 103a and the second room temperature side electrode 103b are connected by a flexible conductor 105 having flexibility. The flexible conductor 105 is composed of, for example, a flat knitted copper wire. The flexible conductor 105 absorbs bending and distortion generated at the junction B of the current lead 10, particularly the Peltier element 101, the low temperature side electrode 102, and the normal temperature side electrode 103.

  An opening (not shown) is formed at the center of the disk-shaped room temperature side fixing plate 110, and the first room temperature side electrode 103a is inserted into the opening. In the first room temperature side electrode 103a, a flange having a diameter larger than the opening of the room temperature side fixing plate 110 is formed. The first normal temperature side electrode 103a is prevented from falling off. A plurality of (for example, four at regular intervals) insertion holes are formed in the peripheral portion of the room temperature side fixing plate 110, and the room temperature side fixing bolts 108 are inserted into the insertion holes. And the 1st normal temperature side electrode 103a is fixed by screwing the normal temperature side fixing bolt 108 to the one end side of the connection spacer 111. As shown in FIG.

  The fixing mode of the low temperature side electrode 102 is substantially the same as the fixing mode of the first normal temperature side electrode 103a. That is, an opening (not shown) is formed in the central portion of the disk-shaped low temperature side fixing plate 109, and the low temperature side electrode 102 is inserted into this opening. The low temperature side electrode 102 is dropped in a state where the low temperature side electrode 102 is inserted into the low temperature side fixing plate 109, for example, by forming a flange having a diameter larger than the opening of the low temperature side fixing plate 109. It is supposed not to. A plurality of (for example, four at regular intervals) insertion holes are formed in the peripheral edge portion of the low temperature side fixing plate 109, and the low temperature side fixing bolts 107 are inserted into the insertion holes. And the low temperature side electrode 102 is fixed by screwing the low temperature side fixing bolt 107 to the other end side of the connecting spacer 111.

  As described above, the joint B between the Peltier element 101, the low temperature side electrode 102, and the first normal temperature side electrode 103a is fixed in a state of being sandwiched between the low temperature side fixing plate 109 and the normal temperature side fixing plate 110. .

In the present embodiment, a coil spring 104 as an urging member is interposed between the head of the low temperature side fixing bolt 107 and the low temperature side fixing plate 109. As the low temperature side fixing bolt 107 is screwed to the connecting spacer 111, the coil spring 104 is compressed and an urging force is generated, so that a predetermined pressure is applied to the joint B via the low temperature side fixing plate 109. become. That is, the pressure applied to the joint portion B can be appropriately adjusted by adjusting the amount of tightening of the low temperature side fixing bolt 107 to the connecting spacer 111.
The coil spring 104 is applied with a pressure of 0.2 to 17.0 MPa applied to the joint B as the low temperature side fixing bolt 107 is screwed to the connecting spacer 111.

  Further, the low temperature side fixing bolts 107 are connected to the low temperature side fixing plates 107 such that when the plurality of low temperature side fixing bolts 107 are screwed to the connecting spacers 111, the urging force generated in the coil spring 104 is evenly transmitted to the low temperature side fixing plates 109. The coil spring 104 is compressed via a pressure equalizing plate 112 having the same shape as 109.

  Furthermore, a cylindrical protective tube 106 is disposed on the outer periphery of the joint B with the Peltier element 101, the low temperature side electrode 102, and the first normal temperature side electrode 103a. The protective tube 106 is a reinforcing member that directly receives an external force when an unintended external force is applied when the current lead 10 is installed.

  The protective tube 106 is preferably made of glass fiber reinforced plastic (GFRP) in which strength is improved by mixing glass fiber into plastic. By using the protective tube 106 made of GFRP, it is possible to block the inflow of heat from the outside, so that the temperature rise of the internal structure covered with the protective tube 106, and the damage and deterioration of the equipment accompanying this increase in temperature. Can be prevented.

  When the current lead 10 is manufactured, first, the low temperature side electrode 102 and the first normal temperature side electrode 103a are fixed as described above, and then the low temperature side electrode 102 is pushed back in the direction in which the coil spring 104 is compressed. Next, the Peltier element 101 is disposed with solid solder having a predetermined thickness interposed between the low temperature side electrode 102 and the first normal temperature side electrode 103a.

Then, the tightening amount of the low-temperature side fixing bolt 107 to the connection spacer 111 is adjusted so that the pressure applied to the joint B is 0.2 MPa or more. If solder bonding is performed in a state where the pressure applied to the bonding portion B is smaller than 0.2 MPa, defects such as irregularities and minute voids are generated on the bonding surface, and the thermal conductivity may be lowered and the electrical resistance may be increased. Because there is.
In this state, the temperature is raised to the melting temperature of the solder (about 250 ° C.) and held for a predetermined time, so that a stable quality solder layer without defects is formed. Therefore, the Peltier element 101, the low temperature side electrode 102, 1 room temperature side electrode 103a is firmly bonded.

  Further, when the current lead 10 is used, the tightening amount of the low-temperature side fixing bolt 107 to the connection spacer 111 is adjusted so that the pressure applied to the joint portion B is 17.0 MPa or less. This is because when a pressure higher than 17.0 MPa is applied to the Peltier element 101, the Peltier effect is lowered and the Peltier element 101 may be damaged. The pressure applied to the joint B can be easily adjusted even when the current lead 10 is installed in the superconducting magnet device 1.

As described above, the current lead 10 according to the present embodiment includes a pressure adjustment mechanism that adjusts the pressure applied to the junction B between the Peltier element 101, the low temperature side electrode 102, and the first normal temperature side electrode 103a.
Specifically, the pressure adjusting mechanism is configured to fix the joint B in a state of being held in the longitudinal direction (low temperature side fixing plate 109, low temperature side fixing bolt 107, room temperature side fixing plate 110, room temperature side fixing bolt). 108, a connecting spacer 111), and a pressing portion (coil spring 104, pressure equalizing plate 112, low temperature side fixing bolt 107) for pressing the fixing portion.

According to the current lead 10, the joint B between the Peltier element 101 and the electrode (low temperature side electrode 102, first normal temperature side electrode 103 a) is easily held in a predetermined pressure range according to use or soldering. can do. Since the dimensional tolerances of the Peltier element 101 and peripheral members are also absorbed by the pressure adjusting mechanism, it is extremely easy to adjust the pressure for holding the joint B.
Therefore, desired characteristics (thermal conductivity, electrical resistance, etc.) can be stably realized in the current lead 10.
Even if an unintended external force is applied when the current lead 10 is installed, the external force is absorbed by the pressure adjusting mechanism. Therefore, it is possible to prevent the Peltier element 101 and its peripheral members from being damaged by an external force, so that the handleability of the current lead 10 is remarkably improved.

In addition, the current lead 10 includes a protective tube 106 as a reinforcing member that covers the outer periphery of the joint B. Therefore, even if an unintended external force acts on the current lead 10 when the current lead 10 is installed, the influence on the joint B can be minimized, so that the characteristics of the current lead 10 can be stably maintained. .
When the current lead 10 is used, the normal temperature side of the protective tube 106 is heated to about 150 ° C., and the low temperature side of the protective tube 106 is cooled to about −100 ° C. It is considered that thermal distortion is caused by the difference in linear expansion coefficient between the low temperature side electrode 102 and the room temperature side electrode 103. However, since this thermal strain is absorbed by the flexible conductor 105, only the expected pressure acts on the joint B.

[Example]
In the example, solder bonding was performed while controlling the pressure applied to the joint B by the pressure adjusting mechanism, and the current lead 10 was produced. At this time, the pressure applied to the joint B was changed in the range of 0.2 to 17.0 MPa. And the evaluation with respect to a thermal history was performed using the produced several current lead 10. FIG.
In the embodiment, in order to confirm the effect of the pressure adjustment mechanism, the room temperature side electrode 103 is constituted by one member, and the protective tube 106 and the flexible conductor 105 are omitted.

Specifically, a BiTeSb compound semiconductor element having a square shape of 10 mm × 10 mm and a thickness of 4 mm was used as the Peltier element 101. Ni plating layers were formed on the bonding surface of the Peltier element 101 with the low temperature side electrode 102 and the bonding surface with the normal temperature side electrode 103.
The low temperature side electrode 102 and the normal temperature side electrode 103 were made of oxygen-free copper having a square shape with a cross section of 10 mm × 10 mm and a length of about 100 mm. An Ag plating layer was formed on the joint surface between the low temperature side electrode 102 and the normal temperature side electrode 103 with the Peltier element 101.

As described in the embodiment, solid solder made of a 50 μm thick Sn—Ag—Cu alloy is inserted between the Peltier element 101 and the low temperature side electrode 102 and between the Peltier element 101 and the room temperature side electrode 103. Then, the tightening amount of the low-temperature side fixing bolt 107 to the connection spacer 111 was adjusted so that the pressure applied to the joint B was 0.2 to 17.0 MPa. Note that the pressure applied to the joint B was calculated from the measured value of the amount of contraction of the spring.
In this state, the temperature is raised to 250 ° C. and held for 60 minutes, and the Peltier element 101 and the low-temperature side electrode 102 and the Peltier element 101 and the normal-temperature side electrode 103 are soldered to produce a current lead 10 having a current carrying capacity of 100A. did.

First, the electrical resistance (initial value) at room temperature of the junction B was measured by the direct current four-terminal method using the produced current lead 10.
Next, a direct current was passed through the current lead 10, and the current value was adjusted so that the temperature difference between both ends of the Peltier element 101 was 100 ° C. or more. The temperature at both ends of the Peltier element 101 was measured by a thermocouple installed in the vicinity of the Peltier element 101 of the low temperature side electrode 102 and the normal temperature side electrode 103.
After maintaining this temperature difference state for 10 minutes, the energization was stopped and left in the atmosphere, and the joint B was cooled until the temperature reached room temperature. This thermal history was repeated 50 times and given to the current lead 10 (thermal history test).

  Evaluation of the thermal history of the current lead 10 was performed by measuring the electrical resistance at room temperature of the joint B after the thermal history test by the direct current four-terminal method and comparing it with the initial value. Moreover, the external appearance of the junction part B after a heat history test was observed.

  Table 1 shows the configuration of the current lead 10 according to the example, the solder joint condition (applied pressure), and the evaluation result.

As shown in Table 1, as a result of adjusting the pressure applied to the joint B by the pressure adjusting mechanism in the range of 0.2 to 17.0 MPa, abnormalities such as cracks did not occur in the joint B even after the thermal history, There was almost no deterioration of electrical resistance (Examples 1-6).
Moreover, when the said pressure was adjusted in the range of 0.3-15.0 Mpa, the initial electrical resistance became small and the favorable result was obtained (Examples 2-5).
Furthermore, when the pressure was adjusted to 0.5 to 10.0 MPa, it was confirmed that the initial electrical resistance was extremely small (Examples 3 and 4).

[Comparative example]
In the comparative example, a current lead having a conventional structure without a pressure adjusting mechanism (see FIG. 1) was produced, and a thermal history test was performed. Conditions other than the presence or absence of the pressure adjustment mechanism were the same as in the example.
Table 2 shows the configuration of the current leads according to the comparative example and the evaluation results.

  As shown in Table 2, when the pressure applied to the joint B at the time of soldering is not adjusted, the initial electrical resistance is large and the deterioration after the thermal history is extremely large compared to the examples. . Moreover, regarding the external appearance, the crack was generate | occur | produced in the junction part B. FIG. This is probably because the pressure applied to the joint B was not appropriate, so that a defect occurred during solder joining or the Peltier element was damaged during testing. Thus, the difference between the example and the comparative example was obvious.

As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and can be changed without departing from the gist thereof.
For example, as shown in FIG. 4, the low temperature side electrode 102 may be divided into two members 102a and 102b, and these may be connected by a flexible conductor 105 having flexibility.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 1 Superconducting magnet apparatus 10 Current lead 11 Superconducting coil 12 Power supply 13 Low temperature container 101 Peltier element 102 Low temperature side electrode 103 Room temperature side electrode 104 Coil spring 105 Flexible conductor 106 Protection tube 107 Low temperature side fixing bolt 108 Room temperature side fixing bolt 109 Low temperature side fixing plate 110 Room temperature side fixed plate 111 Connecting spacer 112 Pressure equalizing plate B Joint

Claims (9)

A current lead for connecting a superconducting application device installed in a low temperature part and an external device installed in a normal temperature part,
A low temperature side electrode connected to the superconducting application device;
A room temperature side electrode connected to the external device;
A thermoelectric conversion element in which the low temperature side electrode is bonded to one surface and the room temperature side electrode is bonded to the other surface;
A current lead, comprising: a pressure adjusting mechanism for adjusting a pressure applied to a joint portion between the thermoelectric conversion element, the low temperature side electrode, and the normal temperature side electrode. A fixing portion for fixing the pressure adjusting mechanism in a state where the joint portion is held in the longitudinal direction; and
The current lead according to claim 1, further comprising a pressing portion that presses the fixing portion. The fixing part is a low temperature side fixing plate for fixing the low temperature side electrode;
A room temperature side fixing plate for fixing the room temperature side electrode;
A connecting spacer for connecting the low temperature side fixing plate and the normal temperature side fixing plate;
A low temperature side fixing bolt for fixing the low temperature side fixing plate to the connecting spacer;
The room temperature side fixing bolt for fixing the room temperature side fixing plate to the connecting spacer, and
The pressing portion is the low temperature side fixing bolt or the normal temperature side fixing bolt,
An urging member that presses the low temperature side fixing plate or the normal temperature side fixing plate when the low temperature side fixing bolt or the normal temperature side fixing bolt is fastened to the connecting spacer;
The current lead according to claim 2, wherein a pressure applied to the joint is adjusted by tightening the connection spacer with the low-temperature side fixing bolt or the normal temperature-side fixing bolt.   The current lead according to any one of claims 1 to 3, wherein a pressure applied to the joint portion is adjusted to a range of 0.2 to 17.0 MPa by the pressure adjusting mechanism.   5. The current lead according to claim 4, wherein the pressure applied to the joint is adjusted in a range of 0.3 to 15.0 MPa by the pressure adjusting mechanism.   The current lead according to claim 5, wherein the pressure applied to the thermoelectric conversion element is adjusted to a range of 0.5 to 10.0 MPa by the pressure adjusting mechanism.   The current lead according to any one of claims 1 to 6, further comprising a reinforcing member that covers an outer periphery of the joint portion.   The current lead according to claim 7, wherein the reinforcing member is a glass fiber reinforced plastic.   The said low temperature side electrode or the said normal temperature side electrode is comprised by the divided | segmented two member, and the flexible conductor which has a flexibility interposes between them, The any one of Claim 1 to 8 characterized by the above-mentioned. The current lead described.

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