JP2013102082A - Loader device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a loader device capable of efficiently washing and separating sheets of wafers cut off from a silicon ingot and suitable for mass production of the wafers.SOLUTION: The loader device includes: a storage device (30) having a turn table (31) with plural arm members (32) extending radially downward into a liquid tank (2) from the top of the liquid tank (2), in which a loading table (40) loaded with plural sheets of wafers W, which are cut off from a silicon ingot, horizontally in a layer on each of a seat (32a) of the arm members, and the sheets of wafers are transported in order while being rotated in a liquid in one direction and stored in the storage device (30); and a lift unit (10) including a pair of lifters (11, 12) which are operable independently to move loading table support members (13,14) within planes parallel with each other in a biaxial direction including a vertical direction in the liquid. Each of the pair of lifters directly performs transfer of the loading table between a loading table support member and the seat of an arm member at a predetermined stop position of the arm member of the storage device and transports the loading table in a plane in the biaxial direction.

Description

  The present invention relates to a loader device, and more particularly to a loader device suitable for a wafer separation device that cleans and separates a large number of wafers that have been cut into pieces by cutting a silicon ingot.

In recent years, various power generation technologies using natural energy have been developed to reduce the environmental impact during power generation, and solar power generation is one of them.
In general, silicon wafers for solar cells are used for solar power generation, and the demand for silicon wafers for solar cells is increasing with the spread of solar power generation.
Similar to conventional silicon wafers for semiconductors, solar cell silicon wafers are manufactured by cutting a silicon ingot into a thin plate with a wire saw and turning it into single sheets.

By the way, when the silicon ingot is cut, chips and the like are attached to the silicon ingot. For example, a large number of wafer groups immediately after being cut, or a large number of wafers arranged in a standing state after being cut into single wafers. A wafer group is immersed in a liquid tank containing a liquid, and chips and the like are washed away with the liquid. In addition, various types of wafers such as chips adhering to the liquid using fine bubbles are washed away (see Patent Documents 1 and 2).
However, while it is preferable to manufacture the silicon wafer for solar cells as thin as possible like the silicon wafer for semiconductors, it is preferable to have a large light receiving area. If the wafers that are in close contact with each other after being soaked are separated and separated one by one, there is a problem that the wafers are easily broken because the contact force is large in proportion to the area and the separation is difficult.

  In view of this, a device has been developed in which fine bubbles are included in the liquid in the liquid tank between wafers arranged in a single wafer, thereby improving the separability of multiple wafer groups that have passed the liquid ( (See Patent Document 3).

JP 2003-100703 A JP 2006-310456 A WO2010 / 082567

By the way, in the apparatus described in the above Patent Documents 1 to 3, a single wafer is washed after being soaked in a liquid from above, and then separated. Under the present situation where mass production of wafers is required. In mass production of wafers, it is difficult to say that the wafers are efficiently cleaned and separated.
The present invention has been made in order to solve such problems, and the object of the present invention is to enable efficient cleaning and separation of wafers that have been cut into pieces by cutting silicon ingots for mass production of wafers. It is to provide a suitable loader device.

  In order to achieve the above object, a loader device according to a first aspect of the present invention is directed to a loading table on which a large number of wafers obtained by cutting a silicon ingot are horizontally stacked and loaded in layers, a liquid tank containing a liquid, A rotating disk having a plurality of arm members extending radially from above the liquid tank into the liquid tank, and the loading table is placed on each of the seat portions of the arm members, and the liquid is absorbed by the rotating disk. Each having a storage device for storing the wafer group while being rotated in one direction and sequentially feeding, and a loading table support member for mounting the loading table, and the loading table support member includes two axes including the vertical direction in the liquid And a lifting device comprising a pair of elevators that move independently and freely in parallel planes extending in the direction to convey the loading platform, each of the pair of elevators being a predetermined of the arm member of the storage device The platform support at the stop position Characterized in that the conveying of the stacking table at directly performs the mounting base of exchanging the two-axis directions in the plane between the seat portion of the arm member.

  According to a second aspect of the present invention, there is provided the loader device according to the first aspect, further comprising control means for controlling the operation of the storage device and the lifting device, wherein the control means includes the pair of lifts of the lifting device and the arm member. The loading table is alternately exchanged between the loading table support member and the arm member seat at the predetermined stop position, and the loading table is respectively set within the two axial planes. The rotary disk of the storage device is operated so as to be repeatedly conveyed without interfering with each other through the track, and between the loading table support member and the arm member seat at the predetermined stop position of the arm member. The platform is swiveled according to the operation of each of the pair of elevators of the lifting device so that the loading platform is exchanged alternately.

A loader device according to a third aspect of the present invention is the loader device according to the second aspect, wherein the loading table is placed on the loading table support member corresponding to a position separated from the storage device on the predetermined track on which the loading table is conveyed. A transfer unit that sequentially transfers the wafer at the uppermost position of the wafer group to the next step, and the control unit is configured to transfer the wafer at the uppermost position of the wafer group to the next step by the transfer unit. The pair of elevators are operated so as to raise the loading table together with the loading table support member by the thickness of the wafer.
In a loader device according to a fourth aspect of the present invention, in any one of the first to third aspects, the stacking base support member has a pair of support plates with an interval wider than the width of the seat portion of the arm member. The loading table is exchanged by lifting the loading table with a pair of support plates.

  According to the loader device of the first aspect of the present invention, the wafer group loaded on the loading table can be sufficiently cleaned with the cleaning liquid from the storage device to the lift device, and the pair of lifts are respectively provided in the storage device. The loading platform is directly transferred between the loading platform support member and the arm member seat at a predetermined stop position of the arm member, and the loading platform is placed in parallel planes extending in two axial directions including the vertical direction. Since the transfer is made, the loading table can be replaced with a simple configuration, and the loading table on which the wafer group is loaded can be moved efficiently.

  Further, according to the loader device of claim 2, the control means alternately performs the loading and unloading of the loading table between the loading table support member and the arm member seat at the predetermined stop position of the arm member, A pair of elevators of the lifting device are operated so that the loading table is repeatedly conveyed without interference with each other through a predetermined track in a biaxial plane, and the loading table support member and the arm at a predetermined stop position of the arm member Since the turntable of the storage device is swung according to the operation of each of the pair of elevators of the lifting device so that the loading table is exchanged with the seat portion of the member alternately, the structure can be simplified in a short time. The loading table can be exchanged, and the loading table on which the wafer group is loaded can be moved more efficiently.

According to the loader device of claim 3, the control means causes the pair of elevators to raise the loading table by the thickness of the wafer each time the uppermost wafer of the wafer group loaded on the loading table is sent to the next process. Therefore, the position of the uppermost wafer in the wafer group can always be kept constant, and the wafer can be stably sent to the next process with a simple configuration.
According to the loader device of claim 4, since the loading table support member lifts the loading table with a pair of support plates having a gap wider than the width of the seat portion of the arm member, the loading table is exchanged. The loading platform can be replaced with a simple configuration.

It is a front view showing the whole loader device composition concerning the present invention in a wafer separation device. It is the side view seen from the arrow A direction of FIG. It is a plane sectional view which meets the BB line of FIG. It is a top view of a basket. It is a front view of a basket. It is a side view of a basket. It is a top view which shows the relationship between the motion of the storage apparatus which is a loader apparatus, and the raising / lowering unit of an raising / lowering apparatus. It is a front view which shows the relationship between the motion of the storage apparatus which is a loader apparatus, and the raising / lowering unit of an raising / lowering apparatus. It is a part of flowchart which shows the operation | movement procedure of a storage apparatus and the raising / lowering unit R and the raising / lowering unit L. FIG. 10 is the remainder of the flowchart following FIG. 9.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view showing an overall configuration of a loader device according to the present invention in a wafer separating apparatus, FIG. 2 is a side view seen from the direction of arrow A in FIG. 1, and FIG. It is a plane sectional view which meets a line.
The wafer separation apparatus is an apparatus for liquid-washing a plurality of wafer groups loaded in layers by cutting a silicon ingot, and separating the wafers one by one and supplying them to the next process, as shown in FIG. As described above, roughly, the liquid tank 2 in which the cleaning liquid is accommodated, the elevating apparatus 10 that moves up and down a large number of wafer groups W in the liquid tank 2, and the wafer group W that is raised by the elevating apparatus 10 from the uppermost wafer. It comprises a belt conveyor (conveying means) 20 that conveys in order and a storage device 30 that stores a wafer group W that is lifted and lowered by the lifting device 10. Here, the lifting device 10 and the storage device 30 constitute a loader device according to the present invention.

The cleaning liquid stored in the liquid tank 2 is, for example, water (tap water, pure water, etc.), and it is possible to wash away the chips generated on the silicon ingot and adhered to the wafer. The liquid tank 2 is provided with a dirt sensor 3 for detecting the dirt of the cleaning liquid. Based on information from the dirt sensor 3, the degree of dirt of the cleaning liquid can be monitored.
Here, the wafer group W is stacked horizontally in a layered manner on a basket (loading table) 40 having a unified standard. Specifically, the wafer group W is processed into a quadrangular shape with the periphery cut off, FIG. 4 shows a plan view of the basket 40, FIG. 5 shows a front view of the basket 40, and FIG. 6 shows a side view of the basket 40. As shown, the basket 40 has a right side wall 41, a left side wall 42, and a rear side wall 43 extending in the stacking direction of the wafer group W, and can position the square wafer group W appropriately. The standard is unified so that the upper part is opened. Thus, the wafer group W can be loaded into the basket 40 from one side and from above, and the wafer group W loaded on the basket 40 can be approached from one side and from above. The basket 40 is also provided with a right handle 44 and a left handle 45.

More specifically, the right side wall 41 is made of a plate member having a relatively wide width, while the left side wall 42 is made of a member having a width narrower than the width of the right side wall 41 (for example, about half the width of the right side wall 41). , Arranged on one side of the opened side. Further, the rear side wall 43 is made of a member having a width narrower than the width of the left side wall 42 (for example, approximately half the width of the left side wall 42), and is arranged on the right side. That is, the left side wall 42 and the rear side wall 43 are arranged such that the distance between the left side wall 42 and the rear side wall 43 is sufficiently larger than the distance between the right side wall 41 and the rear side wall 43. Further, the right handle 44 is composed of an inverted U-shaped bar member, while the left handle 45 is composed of an F-shaped bar member whose rear is opened.
In this way, the space between the left side wall 42 and the rear side wall 43 is widened, and the rear side of the left side handle 45 is opened, so that the broken wafer is opened as shown in the direction of the arrow in the figure and described in detail later. It is possible to eliminate by passing through the space.

  As shown in FIG. 2, the lifting device 10 includes a pair of left and right lifting units R (a pair of lifting machines) 11 and a lifting unit L (a pair of lifting machines) 12, and each of the pair of left and right lifting units R 11 and the lifting unit L 12 includes The basket 40 loaded with the wafer group W can be moved up and down. The elevating unit R11 and the elevating unit L12 can be raised and lowered by rotating a ball screw with a stepping motor, for example. Specifically, the lifting unit R11 and the lifting unit L12 are provided with basket support arms (loading table support members) 13 and 14 integrally with the lifting unit R11 and the lifting unit L12. The basket 40 is supported on the support arms 13 and 14, and the wafer group W together with the basket 40 can be moved up and down independently.

The lifting device 10 is also provided with slide units 15 and 16 so that the lifting unit R11 and the lifting unit L12 can be independently moved from the storage device 30 side to the belt conveyor 20 side or in the opposite direction. . The slide units 15 and 16 can also be operated by rotating a ball screw with a stepping motor, for example.
As a result, the lifting unit R11 and the lifting unit L12 are independently parallel to each other and extend in two axial directions including the vertical direction (the vertical direction and the horizontal direction in FIG. 1) as indicated by arrows in FIG. The wafer group W together with the basket 40 can be transported through the liquid tank 2 along a predetermined path.

The belt conveyor 20 is provided corresponding to a position away from the storage device 30 on the predetermined track on which the basket 40 is transported, and includes a first conveyor 21 and a second conveyor 22. The first conveyor 21 travels in a pair of endless belts, a vacuum unit 23 is provided from one end to a predetermined range between the pair of endless belts, and one end is predetermined with respect to the horizontal so that one end is immersed in the liquid. Inclined at an angle of (greater than 0 °). As a result, the first conveyor 21 can suck the wafer at the uppermost position of the wafer group W in the liquid by the vacuum unit 23, press the wafer against the belt, and transfer it to the second conveyor 22 at the other end. .
An uppermost position sensor 4 that detects the height position of the uppermost wafer of the wafer group W loaded on the basket 40 is provided above the liquid tank 2. For example, a photoelectric sensor is employed as the uppermost position sensor 4. Thereby, the uppermost position of the wafer group W loaded on the basket 40 can be grasped.
Similarly, the second conveyor 22 is inclined so that a pair of endless belts travel, and the wafer received from the first conveyor 21 can be further transferred to the next process.

  The storage device 30 is configured so that an index table (rotary disc) 31 on which a plurality of L-shaped arm members 32 supporting the basket 40 are suspended can be rotated in one direction by a motor 33. Here, for example, a stepping motor is used as the motor 33, but other rotational driving means such as a servo motor may be used as the motor 33. Specifically, the water tank 2 has a hollow cylindrical portion 2a that extends upward in a cylindrical shape from the bottom, and a shaft portion 34 of a motor 33 positioned below the water tank 2 passes through the cylindrical portion 2a. An index table 31 is connected to the tip of the penetrating shaft 34, and an arm member 32 having a seat 32 a is suspended from the index table 31 toward the water tank 2. As shown in FIG. 3, the arm members 32 are composed of, for example, six pieces, and are arranged at regular intervals of, for example, 60 ° so that one side of the opened basket 40 is radiated and faces outward. Yes. Here, the arm members 32 are arranged at equal intervals of every 60 °, but are not limited to every 60 °.

Further, as shown in FIG. 3, the storage device 30 includes stages # 1 to # 6 corresponding to the number of arm members 32, and the arm members 32 pivot on each stage in the direction of the arrow and stop sequentially. It is configured. Here, stages # 1 to # 5 are stages on which an operator can place the basket 40 on the arm member 32, and stage # 6 is a stage on which the lifting unit R11 and the lifting unit L12 of the lifting device 10 transfer the basket 40. (Predetermined stop position).
The storage device 30 is provided with a torque limiter that limits the turning of the index table 31. For example, when the arm member 32 interferes with some obstacle, the index table 31 does not rotate and the motor 33 slips. Is configured to do. This slip is detected by, for example, a slip sensor, whereby the motor 33 is forcibly stopped to ensure safety.
Further, as shown in FIGS. 1 to 3, the wafer separation apparatus is provided with a liquid jet nozzle 50 so as to be spaced apart from one side of the basket 40 that is opened.

  The liquid jet nozzle 50 is composed of upper and lower two stages of a lower jet nozzle 51 and an upper jet nozzle 52, and jets a liquid flow from the lateral direction toward one side surface of the wafer group W loaded on the basket 40, respectively. Is configured to do. The lower injection nozzle 51 and the upper injection nozzle 52 are connected to a liquid flow generator 54. Specifically, the lower injection nozzle 51 is set so as to strongly inject a liquid flow with an injection intensity equal to or higher than a predetermined force, while the upper injection nozzle 52 has an injection port extending in the vertical direction and smaller than the predetermined force. The liquid flow is set to be jetted gently at the jetting intensity.

Further, below the liquid jet nozzle 50, there is provided a bubble discharge device 60 that discharges the bubbles so that the bubbles rise between the liquid jet nozzle 50 and the wafer group W. The bubble discharge device 60 is connected to the bubble generation device 62.
In addition to the liquid flow injection nozzle 50, a pair of second liquid flow injection nozzles 70, so as to inject a liquid flow obliquely upward toward one side surface of the wafer group W loaded on the basket 40, 70 is provided. A pair of second liquid flow jet nozzles 70, 70 are also connected to the liquid flow generator 54.

The wafer separation apparatus includes a control device (control means) 80. The lifting device 10, the belt conveyor 20, the storage device 30, the liquid flow generation device 54, and the bubble generation device 62 are the dirt sensor 3, the uppermost position sensor 4, and the like. Based on the output signals from the sensors, the operation is appropriately controlled by the control device 80.
Hereinafter, the operation of the wafer separating apparatus according to the present invention configured as described above, particularly the operation of the loader apparatus according to the present invention will be described.

7 and 8 show a plan view and a front view of the relationship between the movement of the storage device 30 that is a loader device and the movement of the lifting unit R11 and the lifting unit L12 of the lifting device 10, respectively. FIG. 10 is a flowchart showing the operation procedure of the storage device 30 and the elevating unit R11 and the elevating unit L12 controlled by the control device 80. The operation of the loader device according to the present invention is shown in FIG. Description will be made along the operation flow of FIGS. 9 and 10 with reference to FIGS.
When the wafer group W is loaded on the basket 40 by the operator, the basket 40 loaded with the wafer group W is carried by the operator with the handles 44 and 45 in step S10 in FIG. As shown in FIG. 4, the operator places the seat member 32 on the arm member 32 of the storage device 30 in the stage # 1.
As shown in FIG. 7, the basket 40 placed on the seat portion 32a of the arm member 32 as described above is sequentially sent to the respective stages as the arm member 32 pivots in the direction of the arrow, and the wafer group passes through the liquid. Reach stage # 6 while washing W.

During this time, one of the basket support arms 13 and 14 of the elevating unit R11 and the elevating unit L12 is located at the original position P which is an intermediate position. Here, in step S12, for example, the basket support arm 13 of the lifting unit R11 is positioned at the original position P, which is an intermediate position. The basket support arm 14 of the other lifting / lowering unit L12 waits at an appropriate position other than the original position P.
In step S20, it is determined whether or not the rotation of the index table 31 is completed and the arm member 32 is turned, and the basket 40 has reached stage # 6. When the determination result is false (No) and the rotation of the index table 31 is not completed, the process waits for the rotation of the index table 31 to be completed. On the other hand, if the determination result is true (Yes) and it is determined that the rotation of the index table 31 is completed, the process proceeds to step S30.

In stage # 6, with the arm member 32 stopped, the elevating unit R11 and the elevating unit L12 of the elevating device 10 operate so as to alternately receive the baskets 40 placed on the seat portion 32a of the arm member 32. Specifically, a pair of support plates 13a, 13a and 14a, 14a are formed on the basket support arms 13, 14 of the elevating unit R11 and the elevating unit L12, respectively, with a gap wider than the width of the seat portion 32a. The elevating unit R11 and the elevating unit L12 operate to receive the basket 40 by ascending and lifting the lower surface of the basket 40 with the pair of support plates 13a, 13a or 14a, 14a.
Here, in step S30, first, the basket support arm 13 of the elevating unit R11 is retracted from the original position P to the arm member 32 side of the stage # 6, and then lifted, and the pair of support plates 13a and 13a. Actuated to receive the basket 40 while lifting the lower surface of the basket 40.
Thereby, the basket 40 is supported by the basket support arm 13 of the lifting unit R11.

The lifting unit R11 and the lifting unit L12 that have received the basket 40 prevent the basket 40 on the basket support arm 13 and the basket 40 on the basket support arm 14 from interfering with each other in combination with the operation of the slide units 15 and 16. The basket 40 is moved in the liquid as indicated by a thick arrow in FIG. 8, and the height of the wafer at the uppermost position of the wafer group W based on information from the uppermost position sensor 4 while further cleaning the wafer group W. The basket 40 is positioned so that the position is in the vicinity of one end of the first conveyor 21. Thereby, the wafer at the uppermost position of the wafer group W is sequentially sucked and separated by the vacuum unit 23, discharged by the first conveyor 21, and transferred to the second conveyor 22.
Here, in step S32, the basket support arm 13 of the lifting unit R11 that has received the basket 40 is once advanced to the intermediate position. Thereafter, in step S <b> 34, the elevating unit R <b> 11 is raised, and the height position of the uppermost wafer in the wafer group W on the basket 40 is detected by the uppermost position sensor 4. Thereafter, in step S34, the elevating unit R11 is lowered and the basket support arm 13 is temporarily put on standby at the lowest position.

  In step S38, it is determined whether or not the wafer group W on the basket 40 of the basket support arm 14 of the elevating unit L12 has been completely discharged. Here, whether or not the wafer group W on the basket 40 is completely discharged is determined, for example, by counting the number of discharged wafers with a counter in the control device 80. However, the present invention is not limited to this, and a seating sensor that detects the presence or absence of a wafer on the basket 40 may be provided separately, and it may be determined whether or not the discharge is completed when the seating sensor does not detect the wafer. If the determination result in step S38 is false (No) and the wafer group W on the basket 40 of the basket support arm 14 has not been completely discharged, the process waits for the discharge to be completed. On the other hand, if the determination result is true (Yes) and it is determined that the wafer group W on the basket 40 of the basket support arm 14 is completely discharged, the process proceeds to step S40.

In step S40, the basket support arm 14 of the elevating unit L12 is retracted to the intermediate position, and in step S42, the basket support arm 13 of the elevating unit R11 is advanced and raised, and as described above, from the uppermost position sensor 4. Based on this information, the basket 40 is positioned so that the height position of the uppermost wafer in the wafer group W is in the vicinity of one end of the first conveyor 21. In step S44, the wafers on the basket 40 are sequentially separated and discharged by the first conveyor 21.
When all the wafers are transferred to the first conveyor 21 and the basket 40 becomes empty, the empty basket 40 is moved to the position of the stage # 6 by the lifting unit R11 and the lifting unit L12 by the operation of the slide units 15 and 16. An empty basket 40 is placed on the seat portion 32 a of the arm member 32.
When the empty basket 40 is placed on the arm member 32, the elevating unit R11 and the elevating unit L12 are once retracted, and then the arm member 32 is turned in the direction of the arrow, so that the empty basket 40 is placed on the stage # 1. Returned and removed by the operator.
Therefore, in step S46 of FIG. 10, it is determined whether or not the seat 32a of the stage # 6 is empty. If the determination result is false (No) and the seat 32a of the stage # 6 is not empty, it waits for it to become empty. On the other hand, if the determination result of step S46 is true (Yes) and it is determined that the seat 32a of stage # 6 is empty, the process proceeds to step S48.

In step S48, the basket support arm 14 of the elevating unit L12 is further retracted and lowered, and the basket 40 is placed on the seat 32a of the stage # 6 and returned. Then, in step S50, the basket support arm 14 is once advanced to the intermediate position and waited.
In step S52, as in step S20, it is determined whether or not the rotation of the index table 31 is completed, the arm member 32 is turned, and the basket 40 has reached stage # 6. When the determination result is false (No) and the rotation of the index table 31 is not completed, the process waits for the rotation of the index table 31 to be completed. On the other hand, if the determination result is true (Yes) and it is determined that the rotation of the index table 31 is completed, the process proceeds to step S54.
In step S54, as in steps S30 to S50, the basket support arm 14 of the elevating unit L12 is moved backward from the original position P to the arm member 32 side and then lifted, and the pair of support plates 14a and 14a Actuated to receive the basket 40 while lifting the lower surface of the basket 40.

  In step S56, the basket support arm 14 of the elevating unit L12 that has received the basket 40 is once advanced to the intermediate position. Thereafter, in step S58, the elevating unit L12 is raised, and the uppermost position sensor 4 detects the height position of the uppermost wafer in the wafer group W. In step S60, the elevating unit L12 is lowered to move the basket support arm. 14 is once made to stand by at the lowest position. In step S62, it is determined whether or not all the wafer groups W on the basket 40 of the basket support arm 13 of the elevating unit R11 have been completely discharged. If the determination result in step S62 is false (No) and the wafer group W on the basket 40 of the basket support arm 13 has not been completely discharged, the process waits for the discharge to be completed. On the other hand, if the determination result is true (Yes) and it is determined that the wafer group W on the basket 40 of the basket support arm 13 has been completely discharged, the process proceeds to step S64.

In step S64, after the basket support arm 13 of the elevating unit R11 is retracted to the intermediate position, in step S66, the basket support arm 13 is advanced and raised, and the information from the uppermost position sensor 4 as described above. Accordingly, the basket 40 is positioned so that the height position of the uppermost wafer in the wafer group W is in the vicinity of one end of the first conveyor 21. In step S68, the wafers on the basket 40 are sequentially separated and discharged by the first conveyor 21.
Returning to FIG. 9, in step S70, it is determined whether or not the seat 32a of the stage # 6 is empty. If the determination result is false (No) and the seat 32a of the stage # 6 is not empty, it waits for it to become empty. On the other hand, when the determination result of step S70 is true (Yes) and the seat 32a of stage # 6 is determined to be empty, the process proceeds to step S72.
In step S72, the basket support arm 13 of the lifting unit R11 is further retracted and lowered to place the basket 40 on the seat 32a of the stage # 6. Then, in step S74, the basket support arm 13 is once advanced to the intermediate position and waited.

In Step S76, similarly to Step S20, it is determined whether or not the rotation of the index table 31 is completed, the arm member 32 is turned, and the basket 40 has reached stage # 6. When the determination result is false (No) and the rotation of the index table 31 is not completed, the process waits for the rotation of the index table 31 to be completed. On the other hand, when it is determined that the determination result is true (Yes) and the rotation of the index table 31 is completed, the process proceeds to step S30 again.
Thereafter, the series of operations from step S30 to step S76 is sequentially repeated.
By the way, when the basket 40 is positioned such that the uppermost wafer of the wafer group W is in the vicinity of one end of the first conveyor 21, bubbles are discharged from the bubble discharge device 60. It rises between the injection nozzle 50 and the wafer group W. At this time, the liquid flow is jetted from the liquid jet nozzle 50 toward the wafer group W.

In this way, the bubbles rise between the liquid jet nozzle 50 and the wafer group W, and the liquid flow is jetted from the lower jet nozzle 51 and the upper jet nozzle 52 which are the liquid jet nozzles 50 toward the wafer group W. If so, the bubbles P are pushed between the wafers of the wafer group W by the liquid flow.
The liquid flow injected from the lower injection nozzle 51 is set so as to strongly inject the liquid flow with an injection intensity equal to or greater than a predetermined force. Thus, a gap is first formed between the wafers of the wafer group W by the liquid flow from the lower injection nozzle 51.
In particular, here, the liquid flow injected from the lower injection nozzle 51 is set to an injection strength that is equal to or higher than a predetermined force capable of blowing off a damaged and broken wafer. Therefore, if there is a damaged wafer at this time, the wafer thus broken and divided is no longer regulated by the right side wall 41, the left side wall 42, and the rear side wall 43, and the liquid jetted from the lower jet nozzle 51. The air is blown out rearward through the open space behind the left side wall 42, the rear side wall 43 and the left side handle 45, and is eliminated. Thus, since the damaged wafer can be easily removed, it is possible to prevent the apparatus from being stopped due to jamming, and to improve the operation rate of the apparatus.

On the other hand, the liquid flow injected from the upper injection nozzle 52 is set to inject the liquid flow with an injection strength smaller than a predetermined force. Thereby, the bubbles P are gently pushed into the gaps between the wafers formed by the liquid flow from the lower injection nozzle 51 by the liquid flow injected from the upper injection nozzle 52, and are uniformly arranged between the wafers. The gap of is gradually enlarged.
As described above, the bubbles P are sufficiently pushed into the gaps between the wafers, so that the wafer can be lifted by the presence of the bubbles P and easily peeled off. As a result, the uppermost wafer can be smoothly peeled off and pressed against the belt by suction of the vacuum unit 23, and the wafers can be reliably separated one by one and transported to the next process.

Further, in the state where the bubbles P are pushed into the gaps between the wafers as described above, the wafers are easily peeled off due to the presence of the bubbles P in the gaps between the wafers. When the liquid flow is jetted obliquely upward from the two liquid jet nozzles 70, the wafer is largely separated on the second liquid jet nozzle 70 side by the liquid flow from the second liquid jet nozzle 70, that is, The wafer is inclined with an elevation angle greater than 0 ° so that the second liquid jet nozzle 70 side becomes higher. At this time, since the first conveyor 21 is inclined at a predetermined angle (greater than 0 °) with respect to the horizontal so that one end is immersed in the liquid, the wafer easily follows the inclined belt of the first conveyor 21. So close. Thereby, only the wafer at the uppermost position of the wafer group W is smoothly sucked by the vacuum unit 23 and pressed against the belt, and is sequentially transferred to the second conveyor 22 by the first conveyor 21.
In step S44 or step S68, the control device 80 counts, for example, the number of discharged wafers with a counter in the control device 80, and each time the wafer is transferred to the first conveyor 21, the lift unit R11 or the lift unit L12 is activated to raise the basket 40 by the thickness of the wafer. As a result, the position of the uppermost wafer in the wafer group W can always be maintained at a position near one end of the first conveyor 21.

  As described above, according to the loader device of the present invention, the liquid 40 while the wafer group W is loaded and the basket 40 placed on the seat portion 32a of the arm member 32 is rotated by the rotation of the index table 31 of the storage device 30. In the stage # 6, the baskets are alternately alternately placed between the basket support arms 13 and 14 of the lifting device 10 and the seat portion 32a of the arm member 32 of the storage device 30. 40, and the elevator unit R11 and the elevator unit L12 are operated freely in planes parallel to each other extending in the biaxial direction so that the basket 40 is sequentially transported in liquid to a position near one end of the first conveyor 21. I am doing so.

Accordingly, the wafer group W loaded in the basket 40 can be sufficiently cleaned with the cleaning liquid from the storage device 30 to the lifting device 10, and the storage device 30 including the rotating index table 31, the lifting unit R11, and the lifting and lowering device. The basket 40 can be exchanged with a simple configuration using the lifting device 10 including the unit L12, and the basket 40 loaded with the wafer group W can be efficiently transported to a position near one end of the first conveyor 21.
In particular, by controlling the storage device 30 and the lifting device 10 using the control device 80, the basket 40 can be exchanged in a short time with a simple configuration, and the basket 40 on which the wafer group W is loaded can be changed more efficiently. It can be transported to a position near one end of one conveyor 21.
In this case, the loader device according to the present invention operates the lifting unit R11 and the lifting unit L12 to raise the basket 40 by the thickness of the wafer every time the wafer is delivered to the first conveyor 21 by the control device 80. Since the position of the uppermost wafer in the wafer group W can always be kept constant in the vicinity of one end of the first conveyor 21, the wafer can be smoothly separated from a large number of wafer groups W with a simple configuration. Can be sent stably to the next process.
Further, the elevating unit R11 and the elevating unit L12 operate to receive the basket 40 by lifting the lower surface of the basket 40 with a pair of support plates 13a, 13a or 14a, 14a provided on the basket support arms 13, 14. Therefore, the basket 40 can be exchanged efficiently with a very simple configuration.

Although the description of the loader device according to the present invention is finished above, the present invention is not limited to the above embodiment.
For example, in the above-described embodiment, the liquid jet nozzle 50, the bubble discharge device 60, and the pair of second liquid jet nozzles 70 and 70 are provided. It is feasible.

2 Liquid tank 10 Lifting device 11 Lifting unit R (a pair of elevators)
12 Lifting unit L (a pair of elevators)
13, 14 Basket support arm (loading table support member)
13a, 14a Support plate 20 Belt conveyor (conveying means)
30 Storage device 31 Index table (rotary disc)
32 Arm member 32a Seat 33 Motor 40 Basket (loading platform)
80 controller

Claims (4)

A loading table on which a large number of wafers formed by cutting a silicon ingot are horizontally stacked and stacked in layers;
A liquid tank containing a liquid;
The rotating disk has a plurality of arm members extending radially from above the liquid tank into the liquid tank, and the loading table is placed on each of the seat portions of the arm members, and the rotating disk holds the liquid in the liquid. A storage device for storing the wafer group while turning in one direction and sequentially feeding;
Each having a loading table supporting member for mounting the loading table, and independently moving the loading table supporting member independently in a plane parallel to each other extending in two axial directions including the vertical direction in the liquid. A lifting device composed of a pair of elevators that convey the loading platform,
The pair of elevators transfer the loading table directly between the loading table support member and the arm member seat at a predetermined stop position of the arm member of the storage device, respectively, in the biaxial direction. A loader device that conveys the loading platform in the plane of Control means for controlling the operation of the storage device and the lifting device;
The control means includes
The pair of elevators of the lifting device are alternately exchanged between the loading platform support member and the arm member seat at the predetermined stop position of the arm member, and The loading platform is operated so as to be repeatedly conveyed without interference with each other through a predetermined path in the plane of the two axes.
The raising and lowering of the rotating disk of the storage device is performed so that the loading table is alternately exchanged between the loading table support member and the arm member seat at the predetermined stop position of the arm member. The loader device according to claim 1, wherein the loader device is swiveled according to an operation of each of the pair of elevators of the device. Corresponding to a position separated from the storage device on the predetermined trajectory on which the loading table is transported, an uppermost wafer of the wafer group loaded on the loading table mounted on the loading table support member Having transport means for transporting to the next process in order,
The control means operates the pair of elevators so as to raise the loading table together with the loading table support member by the thickness of the wafer every time the uppermost wafer of the wafer group is sent to the next process by the transfer device. The loader device according to claim 2, wherein:   The loading table support member has a pair of support plates with a gap wider than the width of the seat portion of the arm member, and the loading table is transferred by lifting the loading table with the pair of support plates. The loader device according to claim 1, wherein the loader device is performed.

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