JP2013101031A - Electronic device, manufacturing method of the same and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which suppresses adhesion of a sealing member to functional elements and can obtain excellent characteristics.SOLUTION: An electronic device 100 related to the present invention includes: a first member 10; a second member 20 which is made of silicone, is mounted on the first member 10 and is provided with a hole portion 40 provided on one surface 22 side and a cavity 32 provided on the other surface 24 side; functional elements 102 accommodated in the cavity 32; and a sealing member 60 disposed in the hole portion 40. The hole portion 40 has a polygonal opening 42, in a plan view, and communicates with the cavity 32 via a communication port 70 provided on a part of a bottom surface 41 of the hole portion 40.

Description

  The present invention relates to an electronic device, a manufacturing method thereof, and an electronic apparatus.

  In recent years, electronic devices such as inertial sensors that detect physical quantities using, for example, silicon MEMS (Micro Electro Mechanical System) technology have been developed. Among such inertial sensors, a gyro sensor (angular velocity sensor) that detects angular velocity is used for a camera shake correction function of a digital still camera (DSC), a motion sensing function of a game machine, or the like.

  Generally, it is desirable that a vibration type gyro sensor that vibrates a structure and detects a Coriolis force is sealed in a vacuum atmosphere. The vibration type gyro sensor constantly vibrates to detect the Coriolis force. When air (or other gas etc.) exists in the package (cavity) that houses the vibration type gyro sensor, This is because the vibration phenomenon is attenuated.

  As a technique for sealing the inside of the package in a vacuum, a technique using a laser disclosed in Patent Document 1 can be given. More specifically, in the technique described in Patent Document 1, a spherical sealing member is disposed in the through hole formed in the package, and the sealing member is melted by a laser to fill the inside of the through hole. The inside of the package is sealed in a vacuum.

JP 2005-64024 A

  However, for example, when the sealing member is melted in the above-described technique, a part of the sealing member may be scattered in the package and adhere to a functional element such as an inertial sensor. If a part of the sealing member adheres to the functional element, for example, the frequency of the functional element may change or the Q value may decrease. Therefore, characteristics such as frequency and Q value of an electronic device in which such a functional element is accommodated in a package may be deteriorated.

  One of the objects according to some embodiments of the present invention is to provide an electronic device that can suppress adhesion of a sealing member to a functional element and obtain good characteristics, and a method for manufacturing the same. . Another object of some aspects of the present invention is to provide an electronic apparatus including the electronic device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
An electronic device according to the present invention includes:
A first member;
A second member made of silicon provided on the first member and provided with a hole provided on one surface side and a cavity provided on the other surface side;
A functional element housed in the cavity;
A sealing member disposed in the hole;
Including
The hole has a polygonal opening in plan view, and communicates with the cavity through a communication port provided in a part of the bottom surface of the hole.

  According to such an electronic device, when the sealing member disposed in the hole is melted to seal the cavity, a part of the sealing member is scattered in the cavity and adheres to the functional element. This can be suppressed. As a result, such an electronic device can have good characteristics.

[Application Example 2]
In the electronic device according to the present invention,
The bottom surface of the hole may be flat.

  According to such an electronic device, for example, a gap can be provided between the bottom surface of the hole and the sealing member in a state where the spherical sealing member is disposed in the hole. Thereby, when making a cavity into a pressure reduction state, it can suppress that a sealing member jumps out. For example, if a gap is not provided in a state where the spherical sealing member is disposed in the hole, the sealing member may jump out of the package due to a pressure difference inside and outside the package.

[Application Example 3]
In the electronic device according to the present invention,
The area of the communication port may be smaller than the area of the opening.

  According to such an electronic device, even if the sealing member is scattered in the cavity, the scattered sealing member can be prevented from adhering to the functional element.

[Application Example 4]
In the electronic device according to the present invention,
The communication port may not overlap the functional element in plan view.

  According to such an electronic device, even if the sealing member is scattered in the cavity, the scattered sealing member can be prevented from adhering to the functional element.

[Application Example 5]
In the electronic device according to the present invention,
The side surface of the hole may be constituted by four flat surfaces.

  According to such an electronic device, for example, a gap can be provided between the side surface of the hole and the sealing member in a state where the spherical sealing member is disposed in the hole. Thereby, when making a cavity into a pressure reduction state, it can suppress that a sealing member jumps out.

[Application Example 6]
In the electronic device according to the present invention,
The first member is made of an insulating material,
The functional element may be a physical quantity sensor using silicon.

  According to such an electronic device, when the gyro sensor is formed by silicon MEMS processing, if the first member is silicon, for example, an insulating film is interposed in order to maintain insulation between the gyro sensor and the first member. Although it is necessary, by using an insulating material for the first member, there is no need to interpose an insulating film, and insulation can be easily separated.

[Application Example 7]
An electronic device manufacturing method according to the present invention includes:
Placing the functional element on the first member;
A second member made of silicon having a hole provided on one surface side and a cavity provided on the other surface side is placed on the first member, and the functional element is placed in the cavity. A housing process;
Arranging a sealing member in the hole;
Melting the sealing member and closing the hole;
Including
The hole has a polygonal opening in plan view, and is formed so as to communicate with the cavity through a communication port provided in a part of the bottom surface of the hole.

  According to such an electronic device manufacturing method, when the sealing member arranged in the hole is melted to seal the cavity, a part of the sealing member is scattered in the cavity and the functional element It can suppress adhering to. As a result, an electronic device having good characteristics can be formed.

[Application Example 8]
In the method for manufacturing an electronic device according to the present invention,
Etching the first surface side of the substrate to form the hole;
Etching the second surface side of the substrate opposite to the first surface to form a recess to be the cavity;
May further be included.

  According to such an electronic device manufacturing method, the second member having the hole can be easily formed.

[Application Example 9]
In the method for manufacturing an electronic device according to the present invention,
In the step of sealing the cavity,
The sealing member may be melted after decompressing the cavity through the hole.

  According to such an electronic device manufacturing method, the cavity can be sealed in a reduced pressure state.

[Application Example 10]
In the method for manufacturing an electronic device according to the present invention,
In the step of sealing the cavity,
The sealing member may be melted while filling the cavity with an inert gas through the hole and the communication hole.

  According to such an electronic device manufacturing method, the cavity can be sealed as an inert gas atmosphere.

[Application Example 11]
The electronic device according to the present invention is
An electronic device according to the present invention is included.

  According to such an electronic apparatus, since the electronic device according to the present invention is included, it can have good characteristics.

FIG. 3 is a cross-sectional view schematically showing the electronic device according to the embodiment. FIG. 2 is a plan view schematically showing the electronic device according to the embodiment. 1 is a cross-sectional perspective view schematically showing an electronic device according to an embodiment. The top view which shows typically the functional element of the electronic device which concerns on this embodiment. The figure for demonstrating operation | movement of the functional element of the electronic device which concerns on this embodiment. The figure for demonstrating operation | movement of the functional element of the electronic device which concerns on this embodiment. The figure for demonstrating operation | movement of the functional element of the electronic device which concerns on this embodiment. The figure for demonstrating operation | movement of the functional element of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing and the top view which show typically the manufacturing process of the electronic device which concerns on this embodiment. Sectional drawing which shows typically the electronic device which concerns on the modification of this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

1. Electronic Device First, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing an electronic device 100 according to this embodiment. FIG. 2 is a plan view schematically showing the electronic device 100 according to the present embodiment. FIG. 3 is a cross-sectional perspective view schematically showing the electronic device 100 according to the present embodiment. 1 is a cross-sectional view taken along line AA in FIG. 2, and FIG. 3 is a cross-sectional perspective view taken along line AA in FIG. For convenience, FIGS. 1 to 3 illustrate an X axis, a Y axis, and a Z axis as three axes orthogonal to each other.

  As shown in FIGS. 1 to 3, the electronic device 100 includes a package 30 having a base body 10 as a first member and a lid 20 as a second member, a sealing member 60, and a functional element 102. . The electronic device 100 can further include a conductive layer 50. For convenience, the functional element 102 is simplified in FIGS. 1 and 2. In FIG. 2, the sealing member 60 is omitted. In FIG. 3, members other than the lid 20 are not shown.

  As the substrate 10, for example, a glass substrate, a silicon substrate, or a quartz substrate can be used. The base 10 supports the functional element 102. More specifically, a recess 12 is formed in the base 10, and the functional element 102 is disposed above the recess 12. By the recess 12, the functional element 102 can move only in a desired direction without being obstructed by the base 10.

  The lid 20 is placed on the base 10. The lid 20 may be bonded to the base body 10. In some cases, it may be bonded to a part of the functional element 102. As the lid 20, a silicon substrate (silicon substrate) is used. When a glass substrate is used as the substrate 10, the substrate 10 and the lid 20 may be bonded by anodic bonding.

  In addition, the joining method of the base | substrate 10 and the cover body 20 is not specifically limited, For example, joining by adhesives, such as low melting glass (glass paste), and joining by solder may be sufficient. Alternatively, a metal thin film (not shown) is formed at each joint portion of the base body 10 and the lid body 20, and the base metal film 10 and the lid body 20 are joined by heating and eutectic bonding the metal thin films. Also good.

  The base 10 and the lid 20 form a cavity 32 that houses the functional element 102. In the illustrated example, a concave portion is formed on the second surface 24 side of the lid body 20, and the concave portion is sealed by the base body 10 to become a cavity 32. The planar shape (the shape seen from the Z-axis direction) of the base body 10 and the lid body 20 is not particularly limited as long as the functional element 102 can be accommodated in the cavity 32. The planar shape of the base 10 and the lid 20 is, for example, a quadrangle (more specifically, a rectangle).

  The cavity 32 is sealed in a reduced pressure state or an inert gas (for example, nitrogen gas) atmosphere. In particular, when a vibration gyro sensor is used as the functional element 102, the cavity 32 is desirably in a reduced pressure state. Thereby, it can suppress that the vibration phenomenon of a vibration type gyro sensor attenuate | damps by air viscosity.

  In the example shown in the figure, the concave portion to be the cavity 32 is formed in the lid body 20, but may be formed in the base body 10, and the concave portion formed in the base body 10 is sealed by the lid body 20. By doing so, the cavity 32 may be formed.

  A hole 40 is provided on the first surface 22 side of the lid 20. The hole 40 has an opening 42 provided in the first surface 22 of the lid 20. The first surface 22 of the lid 20 is the surface of the lid 20 and is a surface that forms the outer shape of the package 30. The first surface 22 of the lid 20 is a surface on the opposite side of the second surface 24 of the lid 20. In addition, the 2nd surface 24 of the cover body 20 is a surface which prescribes | regulates the cavity 32 (the bottom face of the recessed part of the cover body 20 used as a cavity). The hole 40 has a shape in which the cross-sectional area (area in the XY plane) gradually increases from the bottom surface 41 toward the opening 42. That is, the area of the opening 42 is larger than the area of the bottom surface 41.

  The hole 40 communicates with the cavity 32 through a communication port 70 provided in a part of the bottom surface 41 of the hole 40. The bottom surface 41 of the hole 40 can be said to be the surface of the lid 20 that defines the bottom of the hole 40. The bottom surface 41 of the hole 40 is, for example, flat. In the illustrated example, the bottom surface 41 of the hole 40 is parallel to the first surface 22 of the lid body 20. The communication port 70 is provided on the second surface 24 on the cavity 32 side. The area of the communication port 70 is smaller than the area of the opening 42 of the hole 40. As shown in FIG. 2, the communication port 70 is formed by an overlapped portion of the bottom surface 41 of the hole 40 and the second surface 24 of the lid 20 in plan view. Further, the communication port 70 is disposed at a position that does not overlap the functional element 102 in plan view. That is, the communication port 70 is disposed outside the outer edge of the functional element 102.

  The shape of the opening 42 of the hole 40 is a polygon as shown in FIG. In the illustrated example, the shape of the opening 42 is a rectangle (more specifically, a square). The shape of the bottom surface 41 of the hole 40 is, for example, a polygon. In the illustrated example, like the opening 42, the shape is a rectangle (more specifically, a square). The shape of the communication port 70 is, for example, a polygon. The shape of the communication port 70 is different from, for example, the shape of the opening 42. In the illustrated example, the shape of the communication port 70 is a rectangle having a long side along the Y axis, and the shape of the opening 42 is a square.

  The side surface of the hole portion 40 (the surface of the lid 20 that defines the side surface of the hole portion 40) is constituted by, for example, four flat surfaces 43, 44, 45, and 46. When the hole 40 is formed by wet-etching the lid 20 made of a (100) silicon substrate, the flat surfaces 43, 44, 45, and 46 are (111) surfaces. In this case, the flat surfaces 43, 44, 45, 46 are formed to be inclined at a predetermined angle (about 54.7 °) with respect to the second surface 24 of the lid 20.

  3, the length L1 along the X axis of the opening 42 of the hole 40, the length L2 along the X axis of the bottom surface 41 of the hole 40, and the length L3 along the X axis of the communication port 70 are shown. Has a relationship of L3 <L2 <L1. The length L1 along the X axis of the opening 42 of the hole 40 is, for example, about 426 μm. The length L2 along the X axis of the bottom surface 41 of the hole 40 is, for example, 100 μm. The length L3 along the X axis of the communication port 70 is, for example, about 10 μm. Moreover, the distance D between the 1st surface 22 and the 2nd surface 24 of the cover body 20 is about 230 micrometers, for example. The depth 32 of the cavity 32 (depth of the concave portion of the lid 20 serving as the cavity) H is, for example, about 50 μm.

  As shown in FIGS. 1 to 3, the conductive layer 50 is formed on the side surface (flat surfaces 43, 44, 45, 46) and the bottom surface 41 of the hole 40. As the conductive layer 50, for example, a layer obtained by laminating a chromium layer and a gold layer in this order from the inner surface side of the hole 40 can be used. The conductive layer 50 can improve the adhesion between the side surface and the bottom surface of the hole 40 and the sealing member 60. Although the thickness of the conductive layer 50 is not specifically limited, For example, it is about 30-200 nm.

  The material of the conductive layer 50 can be changed as appropriate depending on the material of the sealing member 60. Although not shown, the conductive layer 50 may be formed on the entire surface of the lid 20.

  The sealing member 60 is disposed in the hole 40 and seals the cavity 32. The material of the sealing member 60 is an alloy such as AuGe, AuSi, AuSn, SnPb, PbAg, SnAgCu, SnZnBi, for example.

  The functional element 102 is mounted on the base 10. The functional element 102 is placed (accommodated) in a cavity 32 formed by the base body 10 and the lid body 20 (enclosed by the base body 10 and the lid body 20). The functional element 102 may be bonded to the base 10 by, for example, anodic bonding or direct bonding, or may be bonded by an adhesive. The form of the functional element 102 is not particularly limited as long as it operates in a cavity 32 sealed in a reduced pressure state or an inert gas atmosphere. For example, a gyro sensor, an acceleration sensor, a vibrator, a SAW (elasticity) Various functional elements such as (surface wave) elements and microactuators can be mentioned.

  Hereinafter, an example in which a gyro sensor is used as the functional element 102 will be described. FIG. 4 is a plan view schematically showing the functional element 102 of the electronic device 100 according to the present embodiment. For convenience, FIG. 4 shows an X axis, a Y axis, and a Z axis as three axes orthogonal to each other. The same applies to FIGS. 5 to 8 described later.

  As shown in FIG. 4, the functional element 102 can include a vibration system structure 104, a driving fixed electrode 130, a detection fixing electrode 140, and a fixing unit 150.

  The vibration system structure 104 is integrally formed, for example, by processing a silicon substrate bonded to the base 10. Thereby, it is possible to apply a fine processing technique used for manufacturing a silicon semiconductor device, and the vibration system structure 104 can be downsized.

  The vibration system structure 104 is supported by a fixing portion 150 fixed to the base body 10 (see FIG. 1), and is disposed apart from the base body 10. The vibration system structure 104 can include a first vibration body 106 and a second vibration body 108. The first vibrating body 106 and the second vibrating body 108 are connected to each other along the X axis.

  The first vibrating body 106 and the second vibrating body 108 can have a shape that is symmetric with respect to a boundary line B (a straight line along the Y axis) of both. Therefore, hereinafter, the configuration of the first vibrating body 106 will be described, and the description of the configuration of the second vibrating body 108 will be omitted.

  The first vibrating body 106 includes a drive unit 110 and a detection unit 120. The drive unit 110 can include a drive support unit 112, a drive spring unit 114, and a drive movable electrode 116.

  The driving support 112 has, for example, a frame shape, and the detection unit 120 is disposed inside the driving support 112. In the illustrated example, the driving support portion 112 includes a first extension portion 112a extending along the X axis and a second extension portion 112b extending along the Y axis.

  The drive spring portion 114 is disposed outside the drive support portion 112. In the illustrated example, one end of the driving spring portion 114 is connected to the vicinity of the corner portion of the driving support portion 112 (the connecting portion between the first extending portion 112a and the second extending portion 112b). The other end of the driving spring portion 114 is connected to the fixed portion 150.

  In the illustrated example, four driving spring portions 114 are provided in the first vibrating body 106. Therefore, the first vibrating body 106 is supported by the four fixing parts 150. Note that the fixing portion 150 on the boundary line B between the first vibrating body 106 and the second vibrating body 108 may not be provided.

  The drive spring portion 114 has a shape extending along the X axis while reciprocating along the Y axis. The plurality of driving spring portions 114 are imaginary lines (not shown) along the X axis passing through the center of the driving support portion 112 and imaginary lines along the Y axis passing through the center of the driving support portion 112 (see FIG. (Not shown). By making the drive spring portion 114 in the shape as described above, the drive spring portion 114 is prevented from being deformed in the Y-axis direction and the Z-axis direction, and the drive spring portion 114 is vibrated. The direction can be smoothly expanded and contracted in the X-axis direction. As the driving spring portion 114 expands and contracts, the driving support portion 112 (the driving portion 110) can be vibrated along the X axis. The number of the drive spring portions 114 is not particularly limited as long as the drive support portion 112 can vibrate along the X axis.

  The driving movable electrode 116 is disposed outside the driving support 112 and connected to the driving support 112. More specifically, the driving movable electrode 116 is connected to the first extending portion 112 a of the driving support portion 112.

  The driving fixed electrode 130 is disposed outside the driving support portion 112. The driving fixed electrode 130 is fixed on the base 10 (see FIG. 1). In the example shown in the drawing, a plurality of driving fixed electrodes 130 are provided, and are arranged to face each other via the driving movable electrode 116. In the illustrated example, the driving fixed electrode 130 has a comb-like shape, and the driving movable electrode 116 has a protrusion 116 a that can be inserted between the comb teeth of the driving fixed electrode 130. ing. By reducing the distance (gap) between the driving fixed electrode 130 and the protruding portion 116a, the electrostatic force acting between the driving fixed electrode 130 and the driving movable electrode 116 can be increased.

  When a voltage is applied to the driving fixed electrode 130 and the driving movable electrode 116, an electrostatic force can be generated between the driving fixed electrode 130 and the driving movable electrode 116. As a result, the drive spring portion 114 expands and contracts along the X axis, and the drive support portion 112 (drive portion 110) can vibrate along the X axis.

  In the illustrated example, four drive movable electrodes 116 are provided in the first vibrating body 106. However, the number of drive movable electrodes 116 is particularly limited if the drive support 116 can be vibrated along the X axis. It is not limited. In the illustrated example, the driving fixed electrode 130 is disposed to face the driving movable electrode 116. However, if the driving support 112 can be vibrated along the X axis, the driving fixing electrode 130 is fixed. The electrode 130 may be disposed only on one side of the driving movable electrode 116.

  The detection unit 120 is connected to the drive unit 110. In the illustrated example, the detection unit 120 is disposed inside the drive support unit 112. The detection unit 120 can include a detection support unit 122, a detection spring unit 124, and a detection movable electrode 126. Although not shown, the detection unit 120 may be disposed outside the drive support unit 112 as long as it is connected to the drive unit 110.

  The detection support part 122 has, for example, a frame shape. In the illustrated example, the detection support portion 122 includes a third extension portion 122a that extends along the X axis and a fourth extension portion 122b that extends along the Y axis.

  The detection spring portion 124 is disposed outside the detection support portion 122. The detection spring portion 124 connects the detection support portion 122 and the drive support portion 112. More specifically, one end of the detection spring part 124 is connected to the vicinity of a corner of the detection support part 122 (a connection part between the third extension part 122a and the fourth extension part 122b). The other end of the detection spring portion 124 is connected to the first extending portion 112 a of the drive support portion 112.

  The detection spring portion 124 has a shape extending along the Y axis while reciprocating along the X axis. In the illustrated example, four detection spring portions 124 are provided in the first vibrating body 106. The plurality of detection spring portions 124 are imaginary lines (not shown) along the X axis passing through the center of the detection support portion 122 and imaginary lines along the Y axis passing through the center of the detection support portion 122 (see FIG. (Not shown). By forming the detection spring portion 124 as described above, the detection spring portion 124 is prevented from being deformed in the X-axis direction and the Z-axis direction, and the detection spring portion 124 is vibrated by the detection unit 120. Can be smoothly expanded and contracted in the Y-axis direction. As the detection spring part 124 expands and contracts, the detection support part 122 (the detection part 120) can be vibrated along the Y axis. The number of the detection spring portions 124 is not particularly limited as long as the detection support portion 122 can vibrate along the Y axis.

  The detection movable electrode 126 is disposed inside the detection support portion 122 and connected to the detection support portion 122. In the illustrated example, the detection movable electrode 126 extends along the X axis and is connected to the two fourth extension portions 122 b of the detection support portion 122.

  The detection fixed electrode 140 is disposed inside the detection support part 122. The detection fixed electrode 140 is fixed on the substrate 10 (see FIG. 1). In the example shown in the figure, a plurality of detection fixed electrodes 140 are provided and are arranged to face each other via the detection movable electrode 126.

  The number and shape of the detection movable electrode 126 and the detection fixed electrode 140 are not particularly limited as long as a change in electrostatic capacitance between the detection movable electrode 126 and the detection fixed electrode 140 can be detected.

  Next, the operation of the functional element 102 will be described. 5-8 is a figure for demonstrating operation | movement of the functional element 102 of the electronic device 100 which concerns on this embodiment. For convenience, in FIG. 5 to FIG. 8, each part of the functional element 102 is illustrated in a simplified manner.

  When a voltage is applied to the driving fixed electrode 130 and the driving movable electrode 116 by a power source (not shown), an electrostatic force can be generated between the driving fixed electrode 130 and the driving movable electrode 116. Accordingly, as shown in FIGS. 5 and 6, the driving spring portion 114 can be expanded and contracted along the X axis, and the driving portion 110 can be vibrated along the X axis.

  More specifically, a first alternating voltage is applied between the driving movable electrode 116 and the fixed electrode 130 of the first vibrating body 106, and the driving movable electrode 116 and the fixed electrode 130 of the second vibrating body 108 are A second alternating voltage having a phase difference of 180 degrees from the first alternating voltage is applied between them. As a result, the first driving unit 110a of the first vibrating body 106 and the second driving unit 110b of the second vibrating body 108 can be vibrated along the X-axis at opposite phases and at a predetermined frequency. That is, the first driving unit 110a and the second driving unit 110b that are coupled to each other along the X axis vibrate in the opposite phase along the X axis (first vibration). For example, as shown in FIG. 5, first, the first drive unit 110a is displaced in the α1 direction, and the second drive unit 110b is displaced in the α2 direction opposite to the α1 direction. Next, as shown in FIG. 6, the first drive unit 110a is displaced in the α2 direction, and the second drive unit 110b is displaced in the α1 direction. The first driving unit 110a and the second driving unit 110b repeat this operation. In this way, the first driving unit 110a and the second driving unit 110b vibrate in mutually opposite phases.

  Since the detection unit 120 is connected to the drive unit 110, the detection unit 120 also vibrates along the X axis in accordance with the vibration of the drive unit 110. That is, the first vibrating body 106 and the second vibrating body 108 vibrate in mutually opposite phases along the X axis.

  As shown in FIG. 7 and FIG. 8, when the angular velocity ω around the Z axis is applied to the functional element 102 in a state where the driving units 110 a and 110 b are performing the first vibration, Coriolis force acts, and the detection unit 120 , Along the Y axis. That is, the first detection unit 120a connected to the first drive unit 110a and the second detection unit 120b connected to the second drive unit 110b are opposite to each other along the Y axis due to the first vibration and the Coriolis force. Displace in the direction. For example, first, as shown in FIG. 7, the first detector 120a is displaced in the β1 direction, and the second detector 120b is displaced in the β2 direction opposite to the β1 direction. Next, as shown in FIG. 8, the first detection unit 120a is displaced in the β2 direction, and the second detection unit 120b is displaced in the β1 direction. The first detection unit 120a and the second detection unit 120b repeat this operation while receiving the Coriolis force.

  As the detection units 120a and 120b are displaced along the Y axis, the distance L between the detection movable electrode 126 and the detection fixed electrode 140 changes. Therefore, the capacitance between the detection movable electrode 126 and the detection fixed electrode 140 changes. The functional element 102 detects the amount of change in capacitance between the detection movable electrode 126 and the detection fixed electrode 140 by applying a voltage to the detection movable electrode 126 and the detection fixed electrode 140, and Z An angular velocity ω around the axis can be obtained.

  In addition, although the form (electrostatic drive system) which drives the drive part 110 with an electrostatic force was demonstrated above, the method to drive the drive part 110 is not specifically limited, A piezoelectric drive system or the Lorentz force of a magnetic field It is possible to apply an electromagnetic drive system using

  The electronic device 100 according to the present embodiment has the following features, for example.

  In the electronic device 100, the hole 40 communicates with the cavity 32 through a communication port 70 provided in a part of the bottom surface 41 of the hole 40. Thus, when the sealing member disposed in the hole 40 is melted and the cavity 32 is sealed, for example, the bottom surface 41 of the hole 40 is contained in the second surface 24 of the lid 20 in a plan view. Compared to such a case (when a communication port is provided on the entire bottom surface of the hole), it is possible to suppress a part of the sealing member from scattering into the cavity 32 and adhering to the functional element 102. As a result, the electronic device 100 can have good characteristics. Further, since the area of the communication port 70 can be made smaller than the area of the bottom surface 41 of the hole 40, the sealing member disposed in the hole 40 is melted to seal the cavity 32. The gas generated from the member can be prevented from entering the cavity 32. Thereby, the vacuum degree of the cavity which accommodates a functional element can be raised.

  In the electronic device 100, the side surface of the hole 40 is constituted by four flat surfaces 43, 44, 45, 46. Therefore, for example, a gap 48 can be provided between the flat surfaces 43, 44, 45, 46 and the sealing member 60a in a state where the spherical sealing member 60a is disposed in the hole 40 (FIG. 14 ( b)). Thereby, when making the cavity 32 into a pressure-reduced state, it can suppress that the sealing member 60a jumps out. For example, if a gap is not provided in a state where the spherical sealing member is disposed in the hole, the sealing member may jump out of the package due to a pressure difference inside and outside the package. Furthermore, in the electronic device 100, the bottom surface 41 of the hole 40 is flat. Therefore, for example, when the spherical sealing member 60a is disposed in the hole 40, the portion where the sealing member 60a contacts the bottom surface 41 can be reduced, and between the bottom surface 41 and the sealing member 60a, A gap 49 can be provided (see FIG. 14A). Thereby, when making the cavity 32 into a pressure-reduced state, it can suppress more reliably that the sealing member 60a jumps out.

  Furthermore, according to the electronic device 100, the gas in the cavity 32 can be discharged through the gaps 48 and 49 when the cavity 32 is in a reduced pressure state. Therefore, the degree of vacuum of the cavity 32 can be increased.

  In the electronic device 100, the hole 40 has a shape in which the area of the communication port 40 is smaller than the area of the opening 42. The range of the sealing member can be reduced. Thereby, even if the sealing member scatters in the cavity 32, it is possible to more reliably suppress the scattered sealing member from adhering to the functional element 102.

  According to the electronic device 100, the communication port 70 and the functional element 102 are not arranged at an overlapping position in plan view. Thereby, even if the sealing member scatters in the cavity 32, it is possible to more reliably suppress the scattered sealing member from adhering to the functional element 102.

  According to the electronic device 100, the lid 20 in which the hole 40 is formed can be a silicon substrate. Thereby, when forming the hole part 40, the processing technique used for preparation of a silicon semiconductor device can be applied. As a result, the hole 40 can be formed with a fine and high accuracy.

  According to the electronic device 100, the base material 10 is an insulating material, and the functional element 102 is a gyro sensor using silicon. Therefore, when the gyro sensor is formed by MEMS processing of silicon, if the base is made of silicon, for example, an insulating film needs to be interposed in order to maintain insulation between the gyro sensor and the base. Therefore, it is not necessary to interpose an insulating film, and insulation can be easily separated.

2. Next, a method for manufacturing an electronic device according to the present embodiment will be described with reference to the drawings. 9 to 14 are cross-sectional views schematically showing manufacturing steps of the electronic device 100 according to the present embodiment. In addition to the cross-sectional view (FIG. 14A), FIG. 14 also shows a plan view (FIG. 14B) schematically showing the manufacturing process of the electronic device 100. For convenience, the functional element 102 is simplified in FIGS.

  As shown in FIG. 9, for example, a glass substrate is patterned to form a recess 12 to obtain a substrate 10. Next, a silicon substrate 102 a to be a functional element 102 is bonded to the base 10. The bonding between the base 10 and the silicon substrate 102a is performed using, for example, anodic bonding, direct bonding, or an adhesive.

  As shown in FIG. 10, the silicon substrate 102a is ground by, for example, a grinding machine to form a thin film, and then patterned into a desired shape to form the functional element 102. Thereby, the functional element 102 can be mounted on the base 10. The patterning is performed by a photolithography technique and an etching technique, and a Bosch method can be used as a more specific etching technique. Thereby, fine processing is possible, and the functional element 102 can be miniaturized.

  As shown in FIG. 11, the second surface 21b side of the silicon substrate 20a having the first surface 21a and the second surface 21b is patterned to form a recess 32a that becomes the cavity 32. The patterning is performed by a photolithography technique and an etching technique, and wet etching can be used as a more specific etching technique.

  As shown in FIG. 12, the hole 40 and the communication port 70 are formed by etching the first surface 21a side opposite to the second surface 21b of the silicon substrate 20a. The hole 40 and the communication port 70 are formed by wet etching from the first surface 21a side. The communication port 70 is formed by a part of the bottom of the hole 40 reaching the recess 32a and the communication between the hole 40 and the recess 32a by the wet etching (the communication port 70 is in plan view). (It is formed in a portion where the bottom surface 41 and the second surface 24 overlap). By this wet etching, the side surface of the hole 40 can be a flat surface having a (111) surface, and the shape of the opening 42 can be a polygon (more specifically, a quadrangle). Further, the hole 40 can be formed so that the area of the communication port 41 is smaller than the area of the opening 42. Further, the bottom surface 41 of the hole 40 can be a flat surface. In addition, the order of the process of forming the hole part 40 and the process of forming the recessed part 32a is not specifically limited. The recess 32a may be formed after the hole 40 is formed. Moreover, the hole 40 and the recessed part 32a may be formed simultaneously.

  Next, the conductive layer 50 is formed on the inner surface of the hole 40. The conductive layer 50 is formed, for example, by forming a conductive layer (not shown) by sputtering and patterning the conductive layer.

  As shown in FIG. 13, the lid 20 is joined to the base 10, and the functional element 102 is accommodated in the cavity 32 formed by the base 10 and the lid 20. The bonding between the base 10 and the lid 20 is performed using, for example, anodic bonding or an adhesive. The base 10 and the lid 20 are joined so that the communication port 70 and the functional element 102 do not overlap in plan view.

  As shown in FIG. 14, the sealing member 60 a is disposed in the hole 40. In the illustrated example, the sealing member 60a is spherical and is a so-called solder ball. As described above, the side surface of the hole 40 is composed of the four flat surfaces 43, 44, 45, 46. Therefore, as shown in FIG. 14B, the gap 48 is provided between the side surface of the hole 40 and the sealing member 60 a in a state where the sealing member 60 a is disposed in the hole 40 in a plan view. Can do. Further, the bottom surface 41 of the hole 40 is flat. Therefore, as shown in FIG. 14 (a), when the sealing member 60a is disposed in the hole 40, the portion where the sealing member 60a contacts the bottom surface 41 of the hole 40 can be reduced. A gap 49 can be provided between 41 and the sealing member 60a. In the illustrated example, the sealing member 60 a is in contact with the bottom surface 41 of the hole 40 at a point.

Next, the sealing member 60a is melted by irradiation with an energy beam (for example, laser) to close the hole 40 and seal the cavity 32 (see FIG. 1). Thereby, the cavity 32 can be sealed. The type of laser is not particularly limited, and for example, a YAG laser or a CO ₂ laser can be used. The sealing member 60a is melted, for example, after the cavity 32 is decompressed (after evacuation) through the hole 40 and the communication port 70. For example, in the vacuum chamber, the sealing member 60a may be melted by irradiating a laser to close the hole 40.

  In the above description, an example (see FIGS. 11 and 12) in which the lid 20 is obtained by forming the hole 40 and the recess 32a to be the cavity 32 after mounting the functional element 102 on the base body 10 (see FIG. 10). As described above, first, the hole 40 or the like may be formed to obtain the lid 20, and then the functional element 102 may be mounted on the base 10.

  Further, in the above-described process of sealing the cavity 32, the sealing member 60 a is melted after reducing the pressure of the cavity 32 through the hole 40 and the communication port 70, but the cavity 32 is transmitted through the hole 40 and the communication port 70. Alternatively, the sealing member 60a may be melted after being filled with an inert gas (specifically, nitrogen gas). Thereby, the cavity 32 can be made into an atmospheric pressure state (inert gas atmosphere). For example, when an acceleration sensor is used as the functional element 102, the cavity 32 is preferably in an atmospheric pressure state. This is because in the case of an acceleration sensor, the viscosity of the inert gas greatly contributes to the sensitivity characteristics as a damping effect.

  Through the above steps, the electronic device 100 can be manufactured.

  The method for manufacturing the electronic device 100 according to this embodiment has the following features, for example.

  According to the method for manufacturing the electronic device 100, the hole 40 is formed to communicate with the cavity 32 through the communication port 70 provided in a part of the bottom surface 41 of the hole 40. Thus, when the sealing member disposed in the hole 40 is melted and the cavity 32 is sealed, the bottom surface 41 of the hole 40 is included in the second surface 24 of the lid 20 in a plan view. Compared to the case (when the communication port is provided on the entire bottom surface of the hole), it is possible to prevent a part of the sealing member from scattering into the cavity 32 and adhering to the functional element 102. As a result, an electronic device having good characteristics can be formed. Further, since the area of the communication port 70 can be made smaller than the area of the bottom surface 41 of the hole 40, the sealing member disposed in the hole 40 is melted to seal the cavity 32. The gas generated from the member can be prevented from entering the cavity 32. Thereby, the vacuum degree of the cavity which accommodates a functional element can be raised.

  According to the method for manufacturing the electronic device 100, the side surface of the hole 40 is configured by the four flat surfaces 43, 44, 45, 46, and thus, for example, a spherical sealing member 60 a is disposed in the hole 40. In this state, a gap 48 can be provided between the flat surfaces 43, 44, 45, 46 and the sealing member 60a. Thereby, when making the cavity 32 into a pressure-reduced state, it can suppress that the sealing member 60a jumps out. Furthermore, according to the method for manufacturing the electronic device 100, the bottom surface 41 of the hole 40 is flat. Therefore, for example, when the spherical sealing member 60a is disposed in the hole 40, the portion where the sealing member 60a contacts the bottom surface 41 can be reduced, and between the bottom surface 41 and the sealing member 60a, A gap 49 can be provided. Thereby, when making the cavity 32 into a pressure-reduced state, it can suppress more reliably that the sealing member 60a jumps out.

  Furthermore, according to the method for manufacturing the electronic device 100, the gas in the cavity 32 can be discharged through the gaps 48 and 49 when the cavity 32 is in a reduced pressure state. Therefore, the degree of vacuum in the cavity 32 can be increased.

  According to the method for manufacturing the electronic device 100, the step of forming the lid 20 includes the step of etching the second surface 21b side of the silicon substrate 20a to form the recess 32a that becomes the cavity 32, and the step of forming the silicon substrate 20a. Etching the first surface 21a side to form the hole 40 and the communication port 70. Thereby, the cover part 20 can be formed easily.

  According to the method for manufacturing the electronic device 100, the sealing member 60 a can be melted after the cavity 32 is decompressed through the hole 40. Thereby, the cavity 32 can be sealed in a reduced pressure state, and the vibration of the functional element 102 (more specifically, the gyro sensor) can be suppressed from being attenuated by the air viscosity.

  According to the method for manufacturing the electronic device 100, the communication port 70 and the functional element 102 can be arranged so as not to overlap each other in plan view. Thereby, even when a part of the sealing member 60 a is scattered in the cavity 32 when the sealing member 60 a is melted, the scattered sealing member can be more reliably prevented from adhering to the functional element 102. .

3. Next, an electronic device according to a modification of the present embodiment will be described with reference to the drawings. FIG. 15 is a cross-sectional view schematically showing an electronic device 200 according to a modification of the present embodiment, and corresponds to FIG. Hereinafter, in the electronic device 200 according to the modified example of the present embodiment, members having the same functions as the constituent members of the electronic device 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the example of the electronic device 100, the hole 40 is formed in the lid 20 as shown in FIG. On the other hand, in the electronic device 200, the hole 40 is formed in the base 10 as shown in FIG.

  In the electronic device 200, a silicon substrate can be used as the substrate 10. By using a silicon substrate as the base 10, it is possible to apply a processing technique used for manufacturing a silicon semiconductor device when the hole 40 is formed in the base 10. As a result, the hole 40 can be formed with a fine and high accuracy. As the lid 20, for example, a glass substrate, a silicon substrate, or a quartz substrate can be used.

  In the electronic device 200, the opening 42 of the hole 40 is provided on the third surface 14 of the base body 10. The third surface 14 of the substrate 10 is the surface of the substrate 10 and is a surface that forms the outer shape of the package 30. It can be said that the bottom surface 41 of the hole 40 is the surface of the base 10 that defines the bottom of the hole 40. In the electronic device 200, a recess that becomes the cavity 32 is formed in the base 10.

  As a manufacturing method of the electronic device 200, the above-described manufacturing method of the electronic device 100 can be basically applied. Therefore, the detailed description is abbreviate | omitted.

  According to the electronic device 200, like the electronic device 100, the hole 40 communicates with the cavity 32 through the communication port 70 provided in a part of the bottom surface 41 of the hole 40. Thus, when the sealing member disposed in the hole 40 is melted and the cavity 32 is sealed, the hole is a through hole and does not have a bottom surface (the entire bottom surface of the hole communicates). Compared with a case where a mouth is provided), it is possible to prevent a part of the sealing member from scattering into the cavity 32 and adhering to the functional element 102. As a result, the electronic device 200 can have good characteristics.

4). Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic apparatus according to the present embodiment includes the electronic device according to the present invention. Below, the electronic device containing the electronic device 100 is demonstrated as an electronic device which concerns on this invention.

  FIG. 16 is a perspective view schematically showing a mobile (or notebook) personal computer 1100 as the electronic apparatus according to the present embodiment.

  As shown in FIG. 16, the personal computer 1100 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1108. The display unit 1106 has a hinge structure portion with respect to the main body portion 1104. It is supported so that rotation is possible.

  Such a personal computer 1100 incorporates an electronic device 100.

  FIG. 17 is a perspective view schematically showing a mobile phone (including PHS) 1200 as an electronic apparatus according to the present embodiment.

  As shown in FIG. 17, the mobile phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. .

  Such a cellular phone 1200 incorporates the electronic device 100.

  FIG. 18 is a perspective view schematically showing a digital still camera 1300 as the electronic apparatus according to the present embodiment. Note that FIG. 18 also shows a simple connection with an external device.

  Here, an ordinary camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 1310 displays an object as an electronic image. Functions as a viewfinder.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. A television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, if necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates the electronic device 100.

  The electric appliances 1100, 1200, and 1300 as described above include the electronic device 100 having good characteristics. Therefore, the electric devices 1100, 1200, and 1300 can have favorable characteristics.

  Note that the electronic apparatus including the electronic device 100 includes, for example, an ink jet type discharge in addition to the personal computer (mobile personal computer) shown in FIG. 16, the mobile phone shown in FIG. 17, and the digital still camera shown in FIG. Devices (for example, inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, various navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game machines, word processors, work Station, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measurements Equipment, instruments (eg If, vehicle, aircraft, gauges of a ship), can be applied to a flight simulator.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

10 substrate (first member), 12 recess, 14 third surface, 20 lid (second member),
20a silicon substrate, 21a first surface, 21b second surface, 22 first surface,
24 Second surface, 30 package, 32 cavity, 32a recess, 40 hole,
41 bottom surface, 42 opening, 43 to 46 flat surface, 48 gap, 50 conductive layer,
60 sealing member, 60a sealing member, 70 communication port, 100 electronic device,
102 functional element, 102a silicon substrate, 104 vibration system structure,
106 first vibrating body, 108 second vibrating body, 110 driving unit, 112 driving support unit,
112a first extending portion, 112b second extending portion, 114 driving spring portion,
116 movable electrode for driving, 116a protrusion, 120 detector, 122 support for detection,
122a third extension part, 122b fourth extension part, 124 spring part for detection,
126 movable electrode for detection, 130 fixed electrode for driving, 140 fixed electrode for detection,
150 fixed part, 200 electronic device, 1100 personal computer,
1102 Keyboard, 1104 Main unit, 1106 Display unit,
1108 Display unit, 1200 mobile phone, 1202 operation buttons, 1204 earpiece,
1206 Mouthpiece, 1208 Display unit, 1300 Digital still camera,
1302 Case, 1304 Light receiving unit, 1306 Shutter button,
1308 Memory, 1310 Display unit, 1312 Video signal output terminal,
1314 Input / output terminal, 1430 TV monitor,
1440 personal computer

Claims (11)

A first member;
A second member made of silicon provided on the first member and provided with a hole provided on one surface side and a cavity provided on the other surface side;
A functional element housed in the cavity;
A sealing member disposed in the hole;
Including
The hole has a polygonal opening in a plan view, and communicates with the cavity through a communication port provided in a part of the bottom of the hole. The electronic device according to claim 1, wherein a bottom surface of the hole is flat. In claim 1 or 2,
The electronic device has an area of the communication port smaller than an area of the opening. In any one of Claims 1 thru | or 3,
The communication port is an electronic device that does not overlap the functional element in plan view. In any one of Claims 1 thru | or 4,
The side surface of the hole is an electronic device configured by four flat surfaces. In any one of Claims 1 thru | or 5,
The first member is made of an insulating material,
The functional device is an electronic device which is a physical quantity sensor using silicon. Placing the functional element on the first member;
A second member made of silicon having a hole provided on one surface side and a cavity provided on the other surface side is placed on the first member, and the functional element is placed in the cavity. A housing process;
Arranging a sealing member in the hole;
Melting the sealing member and closing the hole;
Including
The hole has a polygonal opening in plan view, and is formed so as to communicate with the cavity through a communication port provided in a part of the bottom surface of the hole. . In claim 7,
Etching the first surface side of the substrate to form the hole;
Etching the second surface side of the substrate opposite to the first surface to form a recess to be the cavity;
A method for manufacturing an electronic device, further comprising: In claim 7 or 8,
In the step of sealing the cavity,
A method for manufacturing an electronic device, comprising: depressurizing the cavity through the hole and the communication port, and then melting the sealing member. In claim 7 or 8,
In the step of sealing the cavity,
An electronic device manufacturing method, wherein the sealing member is melted after the cavity is filled with an inert gas through the hole and the communication port.   An electronic apparatus comprising the electronic device according to claim 1.