JP2007214315A - Electronic component sealing body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform vacuum hermetic seal of an electronic component sealing body provided with a shield electrode on the inner surface of a case by preventing inflow of molten sealing material into the case and filling a through-hole surely with the sealing material. <P>SOLUTION: The electronic component sealing body 10 has a case 12 provided with an opening and containing an electronic component (piezoelectric vibrator 11) internally, and a lid 16 bonded to the periphery of the opening and covering the opening wherein a through-hole 20 provided in the bottom 12b of the case 12 to communicate with the outside is sealed hermetically with a sealing material 30. Since a shield electrode 15 is provided on the inner surface of the case in order to remove the effect of noise, and a portion (nonmetallic portion 22) exhibiting low wettability to the molten sealing material 30 is provided between the through-hole 20 and the shield electrode 15; the molten sealing material 30 is hard to flow into the case 12 from the through-hole 20 along the shield electrode 15, and inflow of the molten sealing material 30 is prevented into the case 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component sealing body configured by sealing an electronic component such as a piezoelectric vibrator including a crystal resonator in a container made of a substrate such as ceramics and then hermetically sealing the container with a lid, and The present invention relates to a physical quantity sensor using an electronic component sealing body.

  An electronic component such as a piezoelectric vibrator device has a vibration element hermetically sealed inside a package composed of a container made of an insulating substrate such as ceramics and a metal lid that seals the opening of the container. It is configured to be stored in a stopped state.

  As electronic parts such as piezoelectric vibrator devices become smaller and thinner, demands for smaller, thinner, lower costs, and the like are increasing.

  For this reason, in recent years, many surface mount type (SMD) types have been developed, and in order to improve the characteristics of the piezoelectric vibrator device, it is required to increase the degree of vacuum and perform hermetic sealing. Piezoelectric vibratory gyros using piezoelectric vibrator devices have been developed and used in various fields such as vehicle position detection and attitude control systems, and camera shake prevention for digital cameras and digital video cameras (including mobile phones). It has become.

  Conventionally, electric furnace welding, seam welding, electron beam machining, and the like are used as a general hermetic sealing method for a piezoelectric vibrator device package. Electric furnace welding is a sealing method in which a container is heated in a vacuum to melt the sealing material, which is excellent in terms of cost and productivity, but is welded at once on the entire outer periphery of the sealing material. Therefore, there is a problem that the degree of vacuum deteriorates because outgas generated from the sealing material during welding is confined inside the package.

  Seam welding is a sealing method in which a pair of roller electrodes are pressed against the lid to pass an electric current, and the contact portion is heated by resistance to melt the sealing material. An expensive seal ring is required as a stop material, and the thickness of the ring portion has a limit in thinning, and is not suitable for high-speed welding work.

  Furthermore, electron beam processing is a sealing method in which a sealing material is melted by irradiating a lid with an electron beam and heating it, and is attracting attention because of demands for miniaturization and thinning. There is a problem that increases.

  FIG. 16 is a diagram for explaining a conventional configuration example of an electronic component sealing body configured to store electronic components such as a piezoelectric vibrator device.

  In FIG. 16, the electronic component sealing body 110 is attached to the support portion 114 on the inner surface 112 a surrounded by the side wall 112 c of the container 112 by fixing one end of the piezoelectric vibrator 111 with an adhesive 118 and then attached to the side wall of the container 112. The lid 116 is hermetically sealed with the sealing material 117 on the end surface 112d of 112c. Fig.16 (a) shows the front view of the state which removed the cover body, and FIG.16 (b), (c) has shown sectional drawing.

  A through hole 120 is provided in the bottom 112b of the container 112, and in a state where the lid body 116 is attached, the inside of the container 112 is evacuated through the through hole 120, and the inside is brought into a vacuum state. After the inside of the container 112 is evacuated, a sealing material 130 is disposed in the through hole 120, and the sealing material 130 is heated and melted by electron beam irradiation or laser beam irradiation to seal the through hole 120. The inside of the container 112 is kept in a vacuum state.

  For example, Patent Documents 1, 2, 3, and 4 are known as prior arts related to the above-described electronic component sealing body.

  Patent Document 1 relates to a piezoelectric vibrator container, and a metal layer made of high melting point metallization is deposited on the inner surface of a through-hole provided in the container, and the wettability of the brazing material of the sealing material on the surface of this metal layer. When the through-holes are sealed with a lead-tin alloy brazing filler encapsulating material by depositing an excellent plated metal layer such as nickel or gold, a part of the molten encapsulating material is formed on the upper surface of the insulating substrate or As a result, the sealing material protruding on the lower surface contacts the piezoelectric vibrator piece housed inside the container, and stops the oscillation of the piezoelectric vibrator piece or prevents normal vibration. In order to solve this problem, the through hole is composed of a first hole on the upper surface side and a second hole on the lower surface side whose opening is larger than that of the first hole. The sealed material spreads only around the opening on the second hole side of the first hole. Configuration so as not to reach the upper and lower surfaces of the substrate is described.

  Patent Document 2 relates to a package structure of an AT-cut piezoelectric vibrator, and has a laminated structure of an upper thin plate member having a mounting surface of a piezoelectric vibrating piece and a lower thin plate member having a bottom surface of the package, and a through hole has an upper thin plate. A configuration comprising a small-diameter portion formed in the member and a large-diameter portion formed concentrically with the small-diameter portion in the lower thin plate member is shown.

  Patent Document 3 relates to a piezoelectric device, in which the base of a package is configured by a first base sheet and a second base sheet in which sealing holes are concentrically formed, and the diameter of the sealing hole provided in the second base sheet. A diameter smaller than the diameter of the sealing hole provided in the first base sheet, this small diameter portion as a receiving portion of the metal brazing ball for sealing, the metal brazing ball is prevented from falling into the package, By making this receiving part a part of the frame material, by providing a sealing hole at a position away from the excitation electrode of the piezoelectric vibrating piece, the influence of splash generated when the metal brazing ball is melted is reduced, It is shown that by providing a metal film on the wall surface of the sealing hole, the sealing material is favorably welded to the wall surface of the sealing hole and prevented from drooping into the package.

  Patent Document 4 relates to a container for a piezoelectric vibrator, and a through hole is formed in a stepped shape as a part for forming a side wall of the container, thereby preventing a sealing material such as a metal ball from falling off the bottom plate of the container. The configuration is shown.

  FIG. 17 schematically shows a through-hole having a two-layer structure provided at the bottom of the container. 17 (a) is a front view, FIGS. 17 (b) and 17 (c) are cross-sectional views, and FIG. 17 (d) is a structure in which a metal brazing ball receiving portion is formed by a part of the frame material. Is shown.

  The bottom portion of the container 112 has a two-layer structure, and a stepped portion A is formed in the through-hole 120 portion with different hole diameters. The stepped portion A prevents the sealing material 130 from falling into the container 112 and melts it. The sealed sealing material 130 is prevented from sagging inside the container 112.

  When the sealing material 130 is disposed on the step A of the through-hole 120, the container 112 is turned upside down from the direction shown in FIG. 17 so that the bottom 112b of the container 112 is the upper side, and a metal brazing ball or the like is sealed. The material 130 is put into the through hole 120 and is held by the stepped portion A.

  Further, in FIG. 17D, a step portion B is formed by a part of the wall portion 112c and the bottom portion 112b of the container constituting the frame material, and the sealing material 130 is held by the step portion B.

JP 2000-106515 A (paragraph 0012) JP 2002-76815 A (paragraph 0012) JP 2004-297344 A JP 2005-229340 A

  As described above, in order to solve the problem that the sealing material falls into the container or the molten sealing material enters the container, the bottom portion of the container has a two-layer structure with a stepped portion in the through hole. Although the structure to provide is proposed, there exists a problem that a structure becomes complicated in order to set it as this 2 layer structure, Therefore There also exists a problem that cost increases. Furthermore, it is difficult to make the container thinner.

  In addition, an electronic component sealing body in which an electronic component such as a piezoelectric vibrator device is enclosed is applied to various industrial products such as vehicle position detection and attitude control systems, digital cameras, digital video cameras, and mobile phones. . In this case, it is generally mounted and used together with the electronic components that make up the product. Usually, ICs and high-resistance electronic components on the circuit board easily pick up external noise and are affected. If this happens, a malfunction will occur.

  In general, it is known that a shield electrode is provided and connected to a ground potential as a technique for reducing the influence of noise.

  In the electronic component sealing body, noise may be generated during driving from the piezoelectric vibrating piece housed in the container or the electrode provided on the piezoelectric vibrating piece, and the product to which the electronic component sealing body is attached is provided. It adversely affects the IC and high resistance electronic components on the circuit board.

  FIG. 18 is a diagram for explaining the influence of noise and the state of the sealing material when a shield electrode is provided. In FIG. 18A, the electronic component sealing body 110 is mounted on the circuit board 150. In this state, when the piezoelectric vibrator 111 housed in the container 112 of the electronic component sealing body 110 generates noise during driving, the noise passes through the bottom or wall of the insulating material container 112. Then, it enters the electronic component mounted on the circuit board 150 side. Further, when noise is generated in the circuit mounted on the circuit board 150 side, the noise passes through the bottom or wall of the insulating material container 112 and the piezoelectric vibrator 111 housed in the container 112 or There is a possibility of entering the surrounding electrodes.

  FIG. 18B shows a state in which the shield electrode 115 is provided on the inner surface 112 a of the container 112 of the electronic component sealing body 111. Since the inner peripheral surface 120a of the through hole 120 is coated with a metal layer such as gold with nickel as a base, which has excellent wettability with the sealing material, the inner surface 112a penetrates the inner surface 112a of the container 112. The metal layer is continuously deposited on the inner peripheral surface 120a of the hole 120.

  When the through hole 120 of the container 112 provided with the shield electrode 115 is sealed with the sealing material 130, the sealing material 131 heated and melted by electron beam irradiation, laser beam irradiation, or the like passes through the through hole 120. There is a possibility of flowing into the container 112 along the shield electrode 115. 18C and 18D schematically show the state of the sealing material 131 that has flowed into the container 112. FIG. 18C shows a state in which the sealing material 131 flows onto the shield electrode 115 on the outer periphery of the through hole 120, and FIG. 18D shows the sealing material on the shield electrode 115 from one side of the through hole 120. 131 shows a state of flowing.

  As described above, when the sealing material 131 enters the inside of the container 112 along the shield electrode 115, the inside of the through hole 120 cannot be reliably filled with the sealing material, and as a result, the inside of the container 112 is accommodated. There arises a problem that the piezoelectric vibrator piece 111 cannot be hermetically sealed in a vacuum. Furthermore, a part of the molten sealing material protrudes from the upper surface of the shield electrode 115 provided on the inner surface 112 a of the container 112, and as a result, the sealing material 131 protruding from the upper surface of the shield electrode 115 enters the inside of the container 112. There is a problem that the piezoelectric vibrator piece 111 is brought into contact with the housed piezoelectric vibrator piece 111 to stop the oscillation of the piezoelectric vibrator piece 111 or to prevent normal vibration.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the conventional problems and prevent the molten sealing material from flowing into the container in the electronic component sealing body in which the shield electrode is provided on the inner surface of the container.

  An electronic component sealing body according to the present invention includes a container having an opening and an electronic component housed in an internal housing portion, and a lid that is joined to the periphery of the opening and covers the opening, and includes a bottom portion of the container. In an electronic component encapsulant that hermetically seals a through hole that communicates with the outside provided in a sealing material, a shield electrode is provided on the inner surface of the container in order to eliminate the influence of noise, and the through hole and the shield electrode By providing a configuration in which a portion having low wettability with the molten sealing material is provided, it is difficult for the molten sealing material to flow into the container along the shield electrode from the through hole. Is to prevent the inflow into the container.

  The configuration of the portion that reduces the wettability with the molten sealing material between the through hole and the shield electrode is the inner circumference of the through hole that communicates the shield electrode film provided on the inner surface of the container with the outside. A non-metal portion for preventing the flow of the sealing material is provided between the metal coating provided on the surface.

  Usually, as a sealing material, for example, a metal brazing material such as a gold-tin alloy or a gold-germanium alloy is used as a material not containing lead. By providing a metal coating on the inner peripheral surface of the through hole, the wettability with the metal brazing material is improved and the weldability is improved.

  In the electronic component sealing of the present invention, the non-metallic part provided between the through hole and the shield electrode has low wettability with the sealing material made of a metal brazing material, so that the sealing melted from the through hole. Even if the stopper material flows into the inside of the container, the fluidity is reduced at the non-metallic part to suppress the flow, and further, it flows over the non-metallic part and flows into the shield electrode provided on the inner surface of the container. There is nothing.

  The configuration of the non-metal part for preventing the flow of the sealing material provided in the electronic component sealing body of the present invention can be in a plurality of modes.

  In the first aspect, the container of the electronic component sealing body is made of an insulating material, and a shield electrode film is provided on the inner surface of the container except for an annular portion having the inner periphery of the through hole on the inner surface side of the through hole. A non-metal part is formed by the exposed surface of the container in the annular region.

  This first aspect utilizes the insulation of the container of the electronic component sealing body. When the shield electrode is provided on the inner surface of the container of the electronic component sealing body, the peripheral edge of the through hole on the inner surface side of the container is used. A non-metal part can be formed only by setting a part for forming a shield electrode in which a shield electrode is provided except for an annular part as an inner periphery.

  In the second aspect, as in the first aspect, the container of the electronic component sealing body is made of an insulating material, and the inner periphery excluding the annular region of a part of the through hole in the axial direction on the inner peripheral surface of the through hole. A metal coating is provided on the surface, and the non-metal portion is formed by the exposed surface of the inner peripheral surface of the through hole in the annular region.

  This second aspect utilizes the insulating properties of the container of the electronic component sealing body, and when a metal coating is provided on the inner peripheral surface of the through hole, an annular region is provided for a part of the through hole in the axial direction. A non-metal part can be formed only by setting a part for forming a metal coating to be provided excluding.

  In the third aspect, the nonmetallic part is formed by providing an annular body made of an insulating member on the shielding electrode film provided on the inner surface of the container of the through hole so as to surround the through hole.

  In the third aspect, an annular insulating member is used, and the non-metallic portion can be formed simply by disposing the insulating annular body on the shield electrode so as to surround the through hole. it can.

  In the fourth aspect, the non-metal portion is formed by a cylindrical portion made of an insulating member having an inner diameter of the same diameter as the through-hole and covering at least a part of the inner peripheral surface in the axial direction of the through-hole in an annular shape. .

  In the fourth aspect, the insulating member of the cylindrical portion is used, and the non-metallic portion can be formed simply by fitting the insulating cylindrical portion into the through hole.

  The fifth aspect is a combination of the third aspect and the fourth aspect described above, and an annular body made of an insulating member surrounding the through hole on the shield electrode film provided on the inner surface of the through hole, and at least A non-metal part is formed by an annular part combined with a cylindrical body made of an insulating member that annularly covers a part of the inner peripheral surface of a part of the through hole in the axial direction.

  In the fifth aspect, the insulating member of the cylindrical portion is used, and the non-metallic portion can be formed simply by attaching the insulating cylindrical portion to the through hole portion.

  In a sixth aspect, the container of the electronic component sealing body is made of an insulating material, and the through hole has a conical shape with a cross section inclined from the peripheral edge on the container inner surface side to at least the middle of the through hole in the axial direction. In the inner peripheral surface, a metal coating is provided on the inner peripheral surface excluding the annular region for a part of the through hole in the axial direction, and a non-metal portion is formed by an exposed surface of the inner peripheral surface of the through hole in the annular region.

  This sixth aspect utilizes the insulating properties of the container of the electronic component sealing body, and when a metal coating is provided on the inner peripheral surface of the through hole, an annular region is provided for a part of the through hole in the axial direction. A non-metal part can be formed only by setting a part for forming a metal coating to be provided excluding.

  Moreover, the present invention can constitute a physical quantity sensor that detects a physical quantity applied from the outside by providing a piezoelectric vibrator as an electronic part in the electronic part sealing body. This physical quantity sensor can be used as a vibration type gyro sensor.

  ADVANTAGE OF THE INVENTION According to this invention, in the electronic component sealing body which provided the shield electrode in the inner surface of the container, it can prevent that the fuse | melted sealing material enters the inside of a container. That is, since the inside of the through hole can be reliably filled with the sealing material, the yield of vacuum hermetic sealing is greatly improved.

  Hereinafter, the electronic component sealing body of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram for explaining a schematic configuration of an electronic component sealing body according to the present invention. In FIG. 1, an electronic component sealing body 10 has an opening and a container 12 that stores an electronic component such as a piezoelectric vibrator 11 in an internal storage portion 13 and a lid that covers the opening by bonding to the periphery of the opening. 16.

  The container 12 has an inner surface 12a that houses one end of the piezoelectric vibrator 11 supported by a support portion 14 (not shown in FIG. 1), a side wall 12c that surrounds the outer periphery of the inner surface 12a, and an opening end opposite to the side wall 12c. The bottom part 12b which closes the side is provided. The inner surface 12 a and the side wall 12 c form a space for the storage portion 13 that stores the piezoelectric vibrator 11. The space of the storage portion 13 can be kept airtight by closing the cover 16 with a sealing material after the lid 16 is disposed on the side wall upper end surface 12d at the upper end of the side wall 12c.

  The bottom 12 b of the container 12 is provided with a through hole 20 that communicates the space of the storage unit 13 and the outside of the container 12. This through-hole 20 is a gas component released from a sealing material or the like to place the piezoelectric vibrator 11 in the storage portion 13 and attach the lid 16 to bring the storage portion 13 into a predetermined pressure state. This is a vent for exhausting the gas in the storage portion 13 in order to remove the air.

  After the inside of the storage portion 13 is in a predetermined pressure state, a sealing material is inserted into the through hole 20 and is hermetically sealed by being melted by heating by irradiation with a laser beam or the like.

  The through hole 20 is a communication hole that communicates the bottom 12b of the container 12 between the outside of the container 12 and the inside (the space of the storage portion 13). A metal coating 21 is provided on the inner peripheral surface 20a of the through hole 20. It is done. This metal coating 21 is a metal layer such as a high melting point metallization, and is excellent in wettability with a brazing filler metal, and is coated with a metal layer with nickel as a base and gold-plated on the surface. The airtightness of sealing the through hole 20 with a sealing material of a metal brazing material such as a gold-tin alloy or a gold-germanium alloy is improved.

  Further, a part of the through hole 20 can be provided at the position of the inner surface 12a of the container 12, and the other part can be provided at a part of the side wall 12c. By aligning a part of the hole of the through hole 20 with a part of the side wall 12c, a step part of the through hole 20 is formed, and the metal brazing ball, which is a sealing material before melting, is formed on the step part. In addition to preventing the metal brazing ball from falling into the inside of the container 12, it is possible to reduce the influence that the splash generated when the metal brazing ball is melted adheres to the piezoelectric vibrator 11.

  The inner surface 12a of the container 12 has a shield electrode 15 in order to reduce noise leaking from the piezoelectric vibrator 11 during driving to the IC and high resistance electronic component on the circuit board outside the electronic component sealing body 10. Is provided. The shield electrode 15 is provided on almost the entire inner surface 12a of the container 12 except for the portion of the through hole 20, and is connected to the ground potential.

  The electronic component sealing body 10 according to the present invention includes a flow prevention unit that prevents a molten sealing material (not shown in FIG. 1) from flowing through the shield electrode 15 into the container 12 in the through hole 20. The non-metal part 22 to be formed is characteristically provided.

  This non-metallic part 22 is a metal provided between the shield electrode 15 provided on the inner surface 12 a in the container 12 and the through hole 20, more specifically on the inner peripheral surface 20 a of the shield electrode 15 and the through hole 20. It is provided between the coating 21. This non-metallic part 22 melts the sealing material introduced into the through-hole 20 and welds it to the inner peripheral surface 20a of the through-hole 20, thereby melting the sealing material when sealing the through-hole 20. By utilizing the low wettability with the material, the melted sealing material is stopped at the non-metallic portion 22 or in front thereof, and is prevented from flowing into the container 12.

  Therefore, the sealing material melted in the through-hole 20 stops at the portion of the metal coating 21 provided on the inner peripheral surface 20a of the through-hole 20 without flowing into the container 12, and seals the through-hole 20 well. To do.

  FIG. 2A shows a front view of the electronic component sealing body of the present invention with the lid removed, and FIGS. 2B and 2C show cross-sectional views seen from different cross-sections.

  The through hole 20 has a part of the hole formed in the bottom 12b of the container 12, and the other part of the hole is formed at the lower part of the side wall upper end surface 12d and at almost the same height as the bottom 12b. . As a result, an offset portion 12e constituting a step portion is formed by the through hole 20 in the lower portion of the side wall upper end surface 12d. In the offset portion 12e, the through hole 20 and the space of the storage portion 13 inside the container 12 communicate with each other through the opening portion 12f.

  A flow for preventing the inflow of the sealing material (not shown in FIG. 2) melted in the through-hole 20 into the inside of the container 12 on the inner surface 12 a side of the container 12 in the through-hole 20, mainly the through-hole 20. A prevention unit is provided. This flow prevention part is provided between the shield electrode 15 provided on the inner surface 12a of the container 12 and the through-hole 20, more specifically, the metal coating provided on the inner peripheral surface 20a of the shield electrode 15 and the through-hole 20. 21 and the non-metal part 22 provided between them.

  The storage portion 13 of the container 12 is provided with a sealing material 17 between the side wall upper end surface 12d of the container 12 and the lid body 16, and this sealing material 17 is irradiated with a beam, a lamp, or an electric furnace (not shown). When the lid body 16 is sealed by being heated and melted by heating or the like, and the lid body 116 is attached, the inside of the container 12 is exhausted through the through-hole 20 through an exhaust chamber (not shown) or a vacuum pump. The storage unit 13 inside the container 12 is evacuated by exhausting the mechanism. After the storage chamber 13 in the container 12 is evacuated to a predetermined pressure state, a sealing material is disposed in the through-hole 20, and the sealing material is heated and melted by laser beam irradiation or the like to melt the through-hole 20. And the inside of the container 12 is maintained at a predetermined pressure state. Since the sealing material disposed in the through hole 20 has a very small volume, the amount of gas generated when it is melted is extremely small. Therefore, the container 12 can be hermetically sealed in the same pressure atmosphere as the sealing processing chamber.

  The piezoelectric vibrator 11 is attached by fixing one end of the piezoelectric vibrator 11 with an adhesive 18 to a support portion 14 provided on the inner surface 12a. After fixing the piezoelectric vibrator 11, the container 12 is closed by the lid 16, the internal gas is exhausted through the through hole 20 to a predetermined pressure, and then the through hole 20 is sealed with a sealing material.

  Next, a configuration example of the non-metal portion 22 constituting the flow preventing portion in the electronic component sealing body of the present invention will be described with reference to FIGS.

  FIG. 3 is a cross-sectional view and a partial perspective view showing a first configuration example of a non-metal part provided in the electronic component sealing body of the present invention. 3A and 3C show a state before sealing with the sealing material, and FIG. 3B shows a sealing state with the sealing material.

  The through hole 20 is a communication hole that communicates the inside and outside of the container at the bottom 12b of the container 12, and the sealing material 30 is formed on the inner peripheral surface 20a of this hole in order to improve welding with the sealing material 30. A metal coating 21 of a metal layer, which is excellent in wettability with a brazing filler metal and is nickel-plated and gold-plated on the surface, is provided. A shield electrode 15 is provided on the inner surface of the container 12. The shield electrode 15 can be formed by plating or coating. The non-metallic part 22 constituting the flow preventing part of the present invention can be formed by exposing the insulating member constituting the container 12 as it is without providing the shield electrode 15 on the inner surface 12a.

  The portion of the container 12 where the insulating member is exposed can be an annular body 22a that surrounds the through hole 30 on the inner surface 12a of the container 12 with the peripheral edge of the through hole 30 as the inner periphery. Therefore, the annular body 22a is formed of an insulating member on which the shield electrode 15 is not formed on the inner surface 12a of the container 12. The ring width or outer diameter of the annular body 22a is determined by the molten sealing material 30 in accordance with the fluidity of the molten sealing material 30, the amount of the sealing material 30, and the like. The width can be determined arbitrarily so that it cannot be overcome.

  4A and 4B are a front view and a cross-sectional view showing a second configuration example of the non-metal part provided in the electronic component sealing body of the present invention.

  4 can be the same as the configuration shown in FIG. 2 except for the configuration of the flow prevention unit. In the second configuration example shown in FIG. 4, the shield electrode 15 provided on the inner surface 12 a of the container 12 has no through-hole 20 without providing an annular insulating portion surrounding the through-hole 20 as shown in the first configuration example. It can be provided on the entire inner surface 12a excluding these holes.

  In the second configuration, the non-metallic part 22 constituting the flow preventing part is provided on the inner peripheral surface of the through hole 20.

  FIG. 5 is a cross-sectional view and a partial perspective view showing a second configuration example of the non-metal part provided in the electronic component sealing body of the present invention. 5A and 5C show a state before sealing with the sealing material, and FIG. 5B shows a sealing state with the sealing material.

  The through hole 20 is a communication hole that communicates the inside and outside of the container at the bottom 12b of the container 12, and the sealing material 30 is formed on the inner peripheral surface 20a of this hole in order to improve welding with the sealing material 30. A metal coating 21 of a metal layer, which is excellent in wettability with a brazing filler metal and is nickel-plated and gold-plated on the surface, is provided. A shield electrode 15 is provided on the inner surface of the container 12. The shield electrode 15 can be formed by plating or coating.

  The non-metal portion 22 constituting the flow preventing portion of the present invention is an annular region in which the insulating member constituting the container 12 is exposed as it is without providing the metal coating 21 on a part of the inner peripheral surface 20a of the through hole 20. 22b.

  On the inner peripheral surface 20a of the through hole 20, a metal coating 21 is provided on the inner peripheral surface 20a excluding the annular region 22b for a part of the through hole 20 in the axial direction, and the remaining annular portion exposes the insulating member of the container 12. Let The non-metal portion 22b is formed by a portion where the insulating member is exposed.

  In FIG. 5, the shield electrode 15 is provided up to the peripheral portion of the through hole 20, and the metal coating 21 is provided up to the middle portion toward the inner surface 12 a of the container 12 in the axial direction of the through hole 20. The non-metallic portion 22b is formed by exposing the annular portion between the shield electrode 15 and the non-metallic portion due to the insulating portion between the shield electrode 15 and the metal coating 21. Any structure may be used as long as it is formed. For example, the shield electrode 15 may be formed extending in the axial direction from the periphery of the through hole 20. In this case, an interval of a predetermined length is provided in the axial direction between the inner peripheral surface 20a of the through hole 20 and the end of the shield electrode 15 extending in the axial direction from the periphery of the through hole 20. The metal coating 21 is provided.

  Therefore, the annular body 22 b is formed by an insulating member between the inner peripheral surface 20 a of the through hole 20 and the shield electrode 15. Note that the ring width (length in the axial direction) of the annular body 22b depends on the fluidity of the molten sealing material 30, the amount of the sealing material 30, and the like. The width can be determined arbitrarily so as not to get over the ring portion.

  FIG. 6 is a cross-sectional view and a partial perspective view showing a third configuration example of a non-metal part provided in the electronic component sealing body of the present invention. 6A and 6C show a state before sealing with a sealing material, and FIG. 6B shows a sealing state with a sealing material.

  Similar to the first and second configuration examples described above, the through hole 20 is a communication hole that communicates the inside and the outside of the container at the bottom 12b of the container 12, and a metal coating 21 is provided on the inner peripheral surface 20a of the hole. A shield electrode 15 is provided on the inner surface of the container 12.

  Here, the shield electrode 15 and the metal coating 21 may be continuously formed at the inner peripheral edge portion of the through hole 20, and a gap is provided between the shield electrode 15 and the metal coating 21. It is good also as a structure which formed and exposed the insulating member of the container 12. FIG.

  The non-metal portion 22 constituting the flow preventing portion of the present invention is made of an insulating member or the like so as to surround the opening portion on the inner side of the through hole 20 on the upper surface of the shield electrode 15 provided on the inner surface 12a of the container 12. A non-metallic annular body 22c is placed and attached. Attachment of the annular body 22c onto the shield electrode 15 can be performed using, for example, an adhesive.

  The outer diameter of the annular body 22c forms an annular region that constitutes the flow preventing portion depending on the width between the outer diameter and the inner diameter of the annular body 22c. The width of the annular region is arbitrarily wide enough so that the molten sealing material 30 does not get over the ring portion of the annular body 22c according to the fluidity of the molten sealing material 30, the amount of the sealing material 30, and the like. Can be determined. The outer diameter of the annular body 22c is determined from the width of the annular area and the inner diameter of the annular body 22c because the difference in diameter from the inner diameter of the annular body 22c determines the width of the annular area.

  Moreover, although the internal diameter of the annular body 22c is substantially the same diameter as the inner periphery of the container 12 of the through-hole 20, it may be smaller than the diameter of the periphery of the through-hole. FIG. 6 shows a case where the inner diameter of the annular body 22c is the same as the inner peripheral edge of the through hole 20 of the container 12. In this case, the sealing material 30 melted in the through-hole 20 is in contact with the inner diameter portion of the annular body 22c at the inner peripheral edge of the container 12, and by the surface of the annular body extending from the inner diameter portion to the outer diameter portion. Inflow to the inside is stopped.

  Further, when the inner diameter of the annular body 22c is smaller than the diameter of the peripheral edge of the through hole, the inner peripheral portion of the annular body 22c is approximately the same height as the inner surface 12a of the container 12 and the center of the hole of the through hole 20 The hole diameter of the through hole 20 is reduced. In this case, the sealing material 30 melted in the through hole 20 comes into contact with a portion of the annular body 22c that has entered the through hole 20 at the inner periphery of the container 12, and from this portion, the annular body 22c Inflow to the inside is stopped by the surface of the annular body extending from the inner diameter portion to the outer diameter portion.

  In addition, when the inner diameter of the annular body 22c is larger than the diameter of the peripheral edge of the through hole, the inner peripheral portion of the annular body 22c is substantially the same height as the inner surface 12a of the container 12 and the hole of the through hole 20 is. It will be the position going out from the center. In this case, the sealing material 30 melted in the through-hole 20 first flows into the container 12 along the shield electrode 15 inside the inner diameter of the annular body 22c at the inner periphery of the container 12. Thereafter, contact with the inner diameter portion of the annular body 22c is stopped, and the inflow to the inside is stopped by the surface of the annular body extending from this portion to the outer diameter portion of the annular body 22c. Therefore, when the width of the shield electrode 15 is wide, the inflow of the molten sealed body into the container increases, but within a range where the influence of the molten sealed body into the container is allowed. If it exists, it is good also as a structure which makes the internal diameter of the annular body 22c larger than the diameter of the periphery of a through-hole.

  FIG. 7 is a cross-sectional view and a partial perspective view showing a fourth configuration example of the non-metal part provided in the electronic component sealing body of the present invention. FIGS. 7A and 7C show a state before sealing with the sealing material, and FIG. 7B shows a sealing state with the sealing material.

  In the fourth configuration example shown in FIG. 7, as in the first to third configuration examples described above, the through hole 20 is a communication hole that communicates the inside and outside of the container at the bottom 12 b of the container 12. A metal coating 21 is provided on the surface 20a. A shield electrode 15 is provided on the inner surface of the container 12.

  Here, the shield electrode 15 and the metal coating 21 may be formed continuously at the inner peripheral edge portion of the container of the through hole 20 as in the third configuration example described above. It is good also as a structure which formed the space | interval between metal coatings 21, and exposed the insulating member of the container 12. FIG.

  The non-metallic part 22 constituting the flow preventing part of the present invention has an outer diameter slightly smaller than the inner diameter of the through hole 20, and at least a part of the inner peripheral surface 20a in the axial direction of the through hole 20 is annular. It is formed by a cylindrical portion 22d made of an insulating member that covers and is attached on the metal coating 21 provided on the inner peripheral surface 20a of the through hole 20. Attachment of the cylindrical body 22d onto the metal coating 21 can be performed using, for example, an adhesive.

  The axial length of the cylindrical body 22d is set to be shorter than at least the axial length of the through hole 20. In the inner peripheral surface 20a of the through hole 20, the axial length of the metal coating 21 for performing good welding with the sealing body 30 is attached in the through hole 20 from the axial length of the through hole 20. This is the length obtained by subtracting the axial length of the cylindrical body 22d. Therefore, the axial length of the cylindrical body 22d is the axial length of the through hole 20 (the thickness of the bottom of the container), the axial length of the metal coating 21 necessary for welding the sealing body, It is determined in consideration of the length of the insulating portion necessary to prevent the melted sealing body from flowing in.

  The sealing material 30 melted in the through-hole 20 is prevented from moving in the axial direction of the through-hole 20 by the cylindrical body 22d provided in the through-hole 20, thereby stopping the inflow into the container. It is done.

  FIG. 8 is a cross-sectional view and a partial perspective view showing a fifth configuration example of the non-metal part provided in the electronic component sealing body of the present invention. 8A and 8C show a state before sealing with the sealing material, and FIG. 8B shows a sealing state with the sealing material.

  The fifth configuration example is a configuration example in which the annular body 22c of the third configuration example described above and the cylindrical body 22d of the fourth configuration example are combined.

  In the fifth configuration example shown in FIG. 8, similarly to the third and fourth configuration examples described above, the through hole 20 is a communication hole that communicates the inside and outside of the container at the bottom 12b of the container 12, and the inner circumference of this hole is shown in FIG. A metal coating 21 is provided on the surface 20a. A shield electrode 15 is provided on the inner surface of the container 12.

  Here, the shield electrode 15 and the metal coating 21 may be formed continuously at the inner peripheral edge portion of the container of the through hole 20 as in the third configuration example described above. It is good also as a structure which formed the space | interval between metal coatings 21, and exposed the insulating member of the container 12. FIG.

  The non-metallic part 22 constituting the flow preventing part of the present invention includes a non-metallic annular body 22c made of an insulating member or the like attached to the upper surface of the shield electrode 15 of the third structural example, and at least the axial direction of the through hole 20 It is formed by the annular body 22e which unitedly combined with the cylindrical part 22d which consists of an insulating member which cyclically covers a part of inner peripheral surface 20a. When this annular body 22e is attached to the shield electrode 15 and the inner peripheral surface 20a of the through hole 20, for example, an adhesive can be used.

  In the annular body 22e, the length of the portion that prevents the melted sealing body from flowing in is the axial length of the cylindrical body portion provided in the through hole 20 and the radial direction of the annular body provided on the shield electrode. Is the sum of the widths of The lengths of these parts are the length in the axial direction of the through-hole 20 (the thickness of the bottom of the container), the length in the axial direction of the metal coating 21 necessary for welding the sealing body, the length of the molten sealing body It is determined in consideration of the length of the insulating part necessary to prevent inflow.

  The sealing material 30 melted in the through hole 20 is prevented from moving in the axial direction of the through hole 20 by the cylindrical body provided in the through hole 20, and further, by the annular body provided on the shield electrode 15. Inflow into the container is stopped.

  9A and 9B are a front view and a cross-sectional view showing sixth and seventh configuration examples of the non-metal portion provided in the electronic component sealing body of the present invention. FIG. 9 shows the case of the sixth configuration example.

  In the sixth and seventh configuration examples, the shape of the inner periphery of the container 12 of the through-hole 20 is a conical shape whose section is inclined, and a shield electrode is formed to the edge or halfway of the inclined surface. In the surface, the insulating member constituting the container is exposed. Other configurations are the same as those in FIG. 2 described above, and thus the description thereof is omitted here.

  FIG. 10 is a cross-sectional view and a partial perspective view showing a sixth configuration example of the non-metal part provided in the electronic component sealing body of the present invention. 10A and 10C show a state before sealing with a sealing material, and FIG. 10B shows a sealing state with a sealing material.

  The through-hole 20 is a communication hole that communicates the inside and outside of the container at the bottom 12b of the first container 12, as in the first configuration example shown in FIG. 3 or the second configuration example shown in FIG. The inner peripheral surface 20a of this hole was gold-plated on the surface with nickel as a base and excellent in wettability with the brazing material of the sealing material 30 in order to improve the welding with the sealing material 30. A metal coating 21 of the metal layer is provided. A shield electrode 15 is provided on the inner surface of the container 12. The shield electrode 15 can be formed by plating or coating.

  The non-metal portion 22 constituting the flow preventing portion of the present invention has an inclined surface on the inner peripheral side of the container of the through hole 20, and the insulating member constituting the container 12 without providing the shield electrode 15 on the inclined surface. It is formed by exposing as it is.

  The portion of the container 12 where the insulating member is exposed is formed on the entire inner peripheral surface 20a of the through hole 20 on the entire inclined surface or a part of the inclined surface, and the exposed portion of the inclined surface covers the metal coating 21 of the through hole 30. An annular body 22f surrounding the portion can be formed. Therefore, the annular body 22f is formed of an insulating member in which the metal coating 21 is not formed on the inner peripheral surface 20a of the through hole 20. Note that the length of the inclined portion of the inclined surface and the width of the ring of the annular body 22f are such that the molten sealing material 30 is annular according to the fluidity of the molten sealing material 30, the amount of the sealing material 30, and the like. The width can be arbitrarily determined so as not to get over the ring portion of the body 22f.

  FIG. 11 is a cross-sectional view showing a seventh configuration example of the non-metal portion provided in the electronic component sealing body of the present invention. FIGS. 11A and 11C show the state before sealing with the sealing material, and FIGS. 11B and 11D show the sealing state with the sealing material.

  The annular body 22g of the configuration example shown in FIGS. 11A to 11D is a configuration in which the inclination angle in the sixth configuration example shown in FIG. 10 is varied, and the inner diameter of the container 12 is reduced. Among these, the annular body 22g in the configuration example shown in FIGS. 11C and 11D has a configuration in which the entire axial length of the through hole 20 is inclined. Also in the configuration example shown in FIG. 11, the same effects as those of the sixth configuration example described above can be obtained.

  Next, the sealing operation in the electronic component sealing body of the present invention will be described using the flowchart of FIG. 12 and the explanatory diagrams of FIGS.

  First, the container 12 is in a state in which the lid body 16 is not attached, the container 12 is in an opened state, and an electronic component such as the piezoelectric vibrator 11 is not attached. At this time, the through hole 20 is in an open state.

  In this state, one end of the piezoelectric vibrator 11 is placed on the support base 14 provided on the inner surface 12a in the container 12, and fixed with an adhesive 18 or the like (FIG. 13A) (S1).

  After the piezoelectric vibrator 11 is attached, the lid body 16 attached with the sealing material 17 is positioned and placed on the side wall upper end surface 12 d of the container 12, and the sealing material 17 is irradiated with the beam from the lid body 16. Join by heating with lamp irradiation or electric furnace. This joining is called a primary welding process. (FIGS. 13B and 13C) (S2).

  The container 12 to which the piezoelectric vibrator 11 is attached is inverted so that the bottom 12b and the through hole 20 of the container 12 are the upper surface. In this state, after inserting the sealing material 30 such as a metal brazing ball into the through hole 20 (FIG. 13D) (S3), the entire container 12 is accommodated in the sealing processing chamber 50. The sealing processing chamber includes a chamber that houses an electronic component sealing body, an exhaust mechanism that sets a pressure in the processing chamber to a predetermined pressure, a gas supply mechanism that introduces an inert gas or a rare gas into the chamber, and A heating mechanism for heating the stored electronic component sealing body to a predetermined temperature is provided (S4). Since these introduced gases are stable atoms having no chemical force, long-term storage stability can be improved by hermetically sealing the piezoelectric vibrator in these gas atmospheres.

  In a state where the electronic component sealing body 10 is housed in the sealing processing chamber 50, the sealing processing chamber is exhausted by the exhaust mechanism. At this time, the gas in the container 12 of the electronic component sealing body 10 is also exhausted through the through hole 20. Furthermore, the electronic component sealing body is heated and annealed at a temperature below the melting point of the metal brazing ball sealing material by a heating mechanism. By this annealing, the gas component is released from the adhesive or the sealing material, and is exhausted out of the sealing processing chamber 50 by the exhaust mechanism (S5).

  After annealing the electronic component sealing body, the gas supply amount into the sealing processing chamber 50 is adjusted to a predetermined pressure. At this stage, since the through hole 20 is communicated, the pressure inside the container 12 becomes the same pressure as the adjusted pressure in the sealing processing chamber 50 (FIG. 14A) (S6).

  The sealing material 30 is heated by irradiating the sealing material 30 inserted into the through-hole 20 from the outside with the laser beam 40. As a result, the sealing material is melted, fills the inside of the through hole 20 and closes the through hole 20. This process is called a secondary welding process. Thereby, the container of the electronic component sealing body is hermetically sealed (FIG. 14B) (S7). The electronic component sealing body 10 is taken out from the sealing processing chamber 50 (FIG. 14C) (S8).

  In the pressure adjusting step of S6 described above, the pressure in the container of the electronic component sealing body equipped with the piezoelectric vibrator is adjusted to a predetermined pressure, and the CI value of the piezoelectric vibrator is adjusted by this pressure adjustment. The CI value is one of evaluation values for evaluating the characteristics of the piezoelectric vibrator. Between this CI value and the degree of vacuum of the container, for example, there is a characteristic as shown in FIG. 15, and the CI value decreases as the vacuum increases (to the left in the figure). In addition, although the vacuum degree in FIG. 15 is not illustrated, it is a logarithmic scale.

  This CI value is an evaluation value related to the sensitivity of the vibrator. Conventionally, it has been required to lower this CI value in order to obtain high sensitivity, and efforts have been made to lower the pressure in the container housing the vibrator. Yes.

  However, the inventor of the present application finds that there is a problem that it takes time until the driving of the vibrator becomes stable if the CI value is too low. It is found that it is necessary to set a predetermined CI value that satisfies both the desired sensitivity and the time required for stabilization, instead of lowering the value, and further, the predetermined CI value is adjusted by adjusting the pressure in the container. Found that can be set.

  When a physical quantity sensor such as a vibration-type gyro sensor or vibration-type acceleration sensor that detects a physical quantity applied from the outside by a piezoelectric vibrator is configured, the sensitivity is high when the CI value is low, and even slight vibration changes are detected. However, it takes time for the detection output to stabilize. When the CI value is high, the detection output is stabilized in a short time, but cannot be detected following a slight vibration change.

  FIG. 15 schematically shows the CI value with respect to the degree of vacuum. In FIG. 15, when W is a CI value width that satisfies the sensitivity required for the piezoelectric vibrator and the time required for stabilization, the degree of vacuum is adjusted to P1 for the piezoelectric vibrator having the characteristic curve indicated by C1. Thus, the CI value can be set within a range to be obtained. For the piezoelectric vibrator having the characteristic curve indicated by C2, the CI value can be set within a range obtained by adjusting the degree of vacuum to P2.

  Therefore, in the pressure adjusting step in S6 described above, the pressure value is obtained based on the characteristic curve between the degree of vacuum and CI of the piezoelectric vibrator, the sensitivity required by the apparatus using the piezoelectric vibrator, and the time required for stability. Then, the pressure is adjusted so as to obtain this pressure value. By this pressure adjustment, the characteristics of the piezoelectric vibrator can be set to a desired value.

  The electronic component sealing body of the present invention can be applied to a vibration gyro sensor, a vibration acceleration sensor, or the like.

It is a figure for demonstrating schematic structure of the electronic component sealing body of this invention. It is the front view and sectional drawing which show the 1st structural example of the nonmetallic part with which the electronic component sealing body of invention is equipped. It is sectional drawing and a partial perspective view which show the 1st structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is the front view and sectional drawing which show the 2nd structural example of the nonmetallic part with which the electronic component sealing body of invention is equipped. It is sectional drawing and a partial perspective view which show the 2nd structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is sectional drawing and a partial perspective view which show the 3rd structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is sectional drawing and a partial perspective view which show the 4th structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is sectional drawing and a partial perspective view which show the 5th structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is the front view and sectional drawing which show the 6th, 7th structural example of the nonmetallic part with which the electronic component sealing body of invention is equipped. It is sectional drawing and a partial perspective view which show the 6th structural example of the nonmetallic part with which the electronic component sealing body of invention is equipped. It is sectional drawing and a partial perspective view which show the 7th structural example of the nonmetallic part with which the electronic component sealing body of this invention is provided. It is a flowchart for demonstrating the sealing operation | movement in the electronic component sealing body of this invention. It is explanatory drawing for demonstrating the sealing operation | movement in the electronic component sealing body of this invention. It is explanatory drawing for demonstrating the sealing operation | movement in the electronic component sealing body of this invention. It is a figure which shows schematically CI value with respect to a vacuum degree. It is a figure for demonstrating one example of the conventional structure of the electronic component sealing body comprised by accommodating electronic components, such as a piezoelectric vibrator device. It is a figure which shows the outline of a through-hole provided with the 2 layer structure provided in the bottom part of the container. It is a figure for demonstrating the influence of noise and the state of the sealing material at the time of providing a shield electrode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component sealing body 11 Piezoelectric vibrator 12 Container 12a Inner surface 12b Bottom part 12c Side wall 12d Side wall upper end surface 12e Offset part 12f Opening part 13 Storage part 14 Support stand 15 Shield electrode 16 Cover body 17 Sealing material 18 Adhesive material 20 Through-hole 20a Inner peripheral surface 21 Metal coating 22 Non-metallic part 22a Annular body 22b Annular region 22c Annular body 22d Cylindrical part 22e Annular body 22f Annular body 30 Sealing material 50 Sealing processing chamber

Claims (9)

A container having an opening and an electronic component stored in an internal storage portion;
A lid that covers the opening by joining to the periphery of the opening;
In the electronic component sealing body that hermetically seals the through-hole communicating with the outside provided in the bottom of the container using a sealing material,
A non-metal portion for preventing the flow of the molten sealing material is provided between the shielding electrode film provided on the inner surface of the container and the metal coating provided on the inner peripheral surface of the through hole communicating with the outside. An electronic component sealing body characterized by being provided. The container is an insulating material;
On the inner surface of the container, the shield electrode is provided on the inner surface of the container excluding an annular region whose inner periphery is the peripheral edge of the through hole on the inner surface of the container,
2. The electronic component sealing body according to claim 1, wherein the non-metal portion is formed by an exposed surface of the container in the annular region. The container is an insulating material;
In the inner peripheral surface of the through hole, the metal coating is provided on the inner peripheral surface excluding the annular region for a part of the axial direction of the through hole,
3. The electronic component sealing body according to claim 1, wherein the non-metal portion is formed by an exposed surface of an inner peripheral surface of the through hole in the annular region.   2. The electronic component seal according to claim 1, wherein the non-metal portion includes an annular body made of an insulating member surrounding the through hole on a shielding electrode film provided on an inner surface of the container of the through hole. Stop body.   The non-metal part has a cylindrical body made of an insulating member that has an inner diameter of the same diameter as the through hole and that can be fitted into the through hole and covers an inner peripheral surface of the through hole. Item 11. A sealed electronic component according to Item 1. The non-metal part is an annular body made of an insulating member surrounding the through hole on the shielding electrode film provided on the inner surface of the container of the through hole;
An annular portion having an inner diameter of the same diameter as the through-hole and including a cylindrical body made of an insulating member that covers at least a part of the inner peripheral surface of the through-hole in the axial direction is provided. The electronic component sealing body according to claim 1. The container is an insulating material;
The through hole is a conical shape having a cross section inclined from the peripheral edge on the inner surface side of the container to at least the middle of the through hole in the axial direction;
The non-metal portion is provided with the metal coating on the inner peripheral surface of the inner peripheral surface of the through hole except for the annular region for a part of the through hole in the axial direction
3. The electronic component sealing body according to claim 1, wherein the non-metal portion is formed by an exposed surface of an inner peripheral surface of the through hole in the annular region. The electronic component sealing body according to any one of claims 1 to 7 includes a piezoelectric vibrator as an electronic component,
A physical quantity sensor for detecting a physical quantity applied from outside.   The physical quantity sensor according to claim 8, wherein the physical quantity sensor is a vibration gyro sensor.