JP2013098738A - Crystal wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal wafer which does not leave burrs which are a part of a connection part on a crystal piece when breaking off the crystal piece from the crystal wafer.SOLUTION: The crystal wafer includes a support part 2, and a crystal piece 2 integrally formed with the support part 2 through a connection part 3. Each of a first main surface and a second main surface of the connection part 3 has a recess K1 provided on positions different from each other in a width direction of the connection part 3 in plain perspective view. Since each of the first main surface and the second main surface of the connection part 3 has the recess K1 provided on the positions different from each other in the width direction of the connection part 3 in the plain perspective view, the connection part 3 is made easy to break in the width direction and the possibility of generating burrs is reduced while sufficiently securing the thickness of the connection part 3 and reducing the possibility of unintended breaking.

Description

  The present invention relates to a quartz wafer including a quartz piece.

  The crystal wafer has a crystal piece such as a crystal resonator element, for example, and the crystal piece is formed integrally with the support portion via a connecting portion. The crystal piece is folded at the connecting portion and taken out from the support portion by applying a force with a jig or the like, for example.

JP 2005-134364 A

  However, when the crystal piece is folded from the crystal wafer, there is a possibility that a burr that is a part of the connecting portion remains on the crystal piece. If burrs remain in the crystal piece, for example, when the crystal piece is mounted on a package, there is a possibility that problems such as difficulty in mounting the crystal piece at a desired position may occur.

  An object of the present invention is to provide a quartz wafer in which the possibility of burrs remaining on the quartz piece when it is broken is reduced.

  A crystal wafer according to one aspect of the present invention includes a crystal piece integrally formed with a support portion via a connecting portion, and each of the first main surface and the second main surface of the connecting portion is seen through in plane. , In the width direction of the connecting portion, there are recesses provided at different positions.

  In the quartz crystal wafer according to one aspect of the present invention, each of the first main surface and the second main surface of the connecting portion has recesses provided at different positions in the width direction of the connecting portion in a plan view. As a result, the thickness of the connecting portion can be sufficiently secured to reduce the possibility of unintentional breakage, and the possibility that the connecting portion can be easily cracked in the width direction to generate burrs can be reduced.

It is a perspective view which shows the quartz wafer in the 1st Embodiment of this invention. It is the elements on larger scale of the crystal wafer shown by FIG. FIG. 3 is a partial plan perspective view of the quartz wafer shown in FIG. 2. It is sectional drawing which shows the recessed part shape of the crystal wafer shown by FIG. It is a partial plane perspective view of the quartz-crystal wafer in which the recessed part shape of the modification in the 1st Embodiment of this invention was shown. It is a partial plane perspective view which shows the quartz wafer in the 2nd Embodiment of this invention. It is a partial plane perspective view of the crystal wafer in which the recessed part shape of the modification in the 2nd Embodiment of this invention was shown. It is a partial plane perspective view which shows the crystal wafer in the 3rd Embodiment of this invention. It is a partial plane perspective view which shows the crystal wafer in the 4th Embodiment of this invention. It is a partial plane perspective view which shows the crystal wafer in other embodiment of this invention. It is a partial plane perspective view which shows the crystal wafer in other embodiment of this invention.

  Hereinafter, some embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
As shown in FIGS. 1 to 3, the quartz wafer in the first embodiment of the present invention includes a support portion 1, a quartz piece 2, and a connecting portion 3.

  The support part 1 has a frame shape, for example. 1 to 3, the crystal wafer is provided in a virtual XYZ space. The support portion 1 is connected to a crystal piece 2 that is integrally connected by a connecting portion 3.

  The crystal piece 2 is provided inside the frame-shaped support portion 1. As shown in FIG. 2, the crystal piece 2 includes a base portion 21 and a vibrating arm portion 22, and the vibrating arm portion 22 includes a first vibrating arm portion 22a and a second vibrating arm portion 22b.

  The first vibrating arm portion 22a and the second vibrating arm portion 22b extend from one side of the base portion 21 in parallel to the virtual Y-axis direction.

  Such a crystal piece 2 has a tuning fork shape in which the base portion 21 and the vibrating arm portions 22 are integrated, and is formed by a photolithography technique and an etching technique.

  As shown in FIG. 2, the crystal piece 2 includes excitation electrodes 23a, 23b, 24a and 24b, connection electrodes 25a and 25b, frequency adjusting metal films 26a and 26b, a conductive wiring pattern 27, 28.

  As shown in FIG. 2, the excitation electrode 23a is provided on the front and back main surfaces of the first vibrating arm portion 22a. In addition, the excitation electrode 23b is provided on both opposing side surfaces of the first vibrating arm portion 22a. The frequency adjusting metal film 26a is provided on the front main surface and the front end portions of both side surfaces of the first vibrating arm portion 22a. The connection electrode 25 a is provided on the front and back main surfaces of the base portion 21 on the first vibrating arm portion 22 a side of the base portion 21.

  Further, as shown in FIG. 2, the excitation electrode 24a is provided on the front and back main surfaces of the second vibrating arm portion 22b. In addition, the excitation electrode 24b is provided on both opposing side surfaces of the second vibrating arm portion 22b. The frequency adjusting metal film 26b is provided on the front main surface and the front end of the side surface of the second vibrating arm portion 22b. Further, the connection electrode 25 b is provided on the front and back main surfaces of the base portion 21 on the second vibrating arm portion 22 b side of the base portion 21.

  The frequency adjusting metal films 26a and 26b can adjust the vibration frequency value to a desired value by increasing or decreasing the amount of metal constituting the frequency adjusting metal films 26a and 26b.

  As shown in FIG. 2, the excitation electrodes 23a and 24b, the frequency adjusting metal film 26b, and the connection electrode 25b are electrically provided by, for example, a conductive wiring pattern 27 provided on the surface of the crystal piece 2. Connected. The connection electrode 25 b is electrically connected to the excitation electrode 23 a through a conductive wiring pattern 27 provided on the base 21. The connection electrode 25b is electrically connected to the excitation electrode 24b.

  Further, as shown in FIG. 2, the excitation electrodes 23b and 24a, the frequency adjusting metal film 26a, and the connection electrode 25a are formed by, for example, a conductive wiring pattern 28 provided on the surface of the crystal piece 2. Electrically connected. The connection electrode 25a is electrically connected to the excitation electrode 23b and the frequency adjusting metal film 26a. In addition, the conductive wiring pattern 28 provided on the front main surface of the base 21 is electrically connected to the excitation electrode 24a and the excitation electrode 23b.

  Each of the excitation electrodes 23a, 23b, 24a and 24b, the connection electrodes 25a and 25b, the frequency adjusting metal films 26a and 26b, and the conductive wiring patterns 27 and 28 are formed by laminating a plurality of metal films. The first metal film is formed on the crystal piece 2 and the second metal film is stacked on the upper surface of the first metal film. The first metal film is made of, for example, Cr (chromium), and the second metal film is made of, for example, gold.

  Further, the excitation electrodes 23a, 23b, 24a and 24b and the connection electrodes 25a and 25b are patterned in a predetermined pattern shape by a photolithography technique, a vapor deposition technique and a sputtering technique.

  When the crystal piece 2 is vibrated, an alternating voltage is applied to the connection electrodes 25a and 25b. When an electrical state after application is instantaneously captured, the excitation electrode 23b of the first vibrating arm portion 22a has a + (plus) potential, the excitation electrode 23a has a-(minus) potential, and changes from + to-. An electric field is generated. On the other hand, the excitation electrode of the second vibrating arm portion 22b at this time has a polarity opposite to the polarity generated in the exciting electrode of the first vibrating arm portion 22a. These applied electric fields cause an expansion / contraction phenomenon in the first vibrating arm portion 22a and the second vibrating arm portion 22b, and a bending vibration having a resonance frequency set in each vibrating arm portion 22 is obtained.

  As shown in FIG. 1 and FIG. 2, the connecting portion 3 is provided so that the crystal piece 2 and the support portion 1 are connected. The connecting part 3 plays a role of connecting the crystal piece 2 and the support part 1. In FIG. 3, the width direction of the connecting portion 3 is the virtual X-axis direction, and the length direction of the connecting portion 3 is the virtual Y-axis direction.

  As shown in FIGS. 2 and 3, the connecting portion 3 is connected to each of the first main surface 3a (see FIG. 2) and the second main surface 3b (see FIG. 2) in plan perspective. It has the recessed part K1 provided in the mutually different position in the width direction of the part 3. FIG. As shown in FIG. 3, the shape of the opening of the recess K1 is, for example, a quadrangular shape.

  As shown in FIG. 4, the cross-sectional shape of the recess K1 is, for example, a U-shape. By making the cross-sectional shape of the concave portion K1, for example, U-shaped, stress is concentrated on the bottom surface of the concave portion K1 when the crystal piece 2 is folded from the connecting portion 3, and the concentrated portion is the starting point. Since cracks are likely to progress in the depth direction of the connecting portion 3, the possibility of occurrence of burrs can be reduced. The depth of the connecting portion 3 is, for example, 100 μm, and the depth of the concave portion K1 is, for example, 10 to 30 μm.

  As shown in FIG. 5, in the modified example of the crystal wafer in the first embodiment, the opening shape of the recess K1 is circular. In addition, by making the opening shape of the concave portion K1 circular, when the crystal piece 2 is folded from the connecting portion 3, since the places where stress concentrates are arranged in the width direction, the crack is directed to the other concave portion K1. Therefore, the crack will progress in the width direction.

  The crystal piece 2 can be folded from the connecting portion 3 by using a mask jig provided with an opening at a location corresponding to the connecting portion 3 and a tray jig provided with a storage portion after being broken. Insert a quartz wafer. Next, the crystal piece 2 is broken off from the crystal wafer by pressing the breaker pin through the opening of the mask jig against the connecting portion 3.

  The crystal resonator 2 can be obtained by mounting the crystal piece 2 (that is, the crystal resonator element) folded off from the crystal wafer in this way on the mounting pad of the package with a conductive adhesive.

  Incidentally, a package used for a crystal resonator has, for example, a structure in which a mounting pad is provided on the upper surface of a flat insulating base, and a frame is provided on the insulating base so as to surround the mounting pad. Yes.

  In the crystal wafer according to the first embodiment, the concave portion K1 is formed in the width direction of the connecting portion 3 by having the concave portions K1 provided at different positions in the width direction of the connecting portion 3 when viewed through the plane. Compared with being provided at the same position, the gap between the front and back recesses K1 becomes thicker and can be prevented from being carelessly cracked.

 Further, since the concave portion K1 is displaced in the width direction, the crack starting from one concave portion K1 is likely to progress toward the other concave portion K1, and therefore, the crack propagates in the width direction. Therefore, since it cracks in the width direction of the connection part 3 in the position of the recessed part K1, possibility that a burr | flash will generate | occur | produce can be reduced.

  Further, by having the recesses K1 provided at different positions in the width direction of the connecting portion 3, the possibility of burrs occurring in the crystal piece can be reduced. For example, the crystal piece is used as a package mounting pad. When mounting, the burr does not hit the inner wall of the package frame and can be mounted at a desired position on the package.

(Second Embodiment)
As shown in FIG. 6, the crystal wafer according to the second embodiment is different from the first embodiment in that the concave portion K <b> 1 has a shape extending in the width direction of the connecting portion 3. In addition, in 2nd Embodiment, since the recessed part K1 has the shape extended in the width direction of the connection part 3, it is the same as that of 1st Embodiment, Therefore The description about this same part is Omitted.

  As shown in FIG. 6, the opening shape of the concave portion K <b> 1 has a shape extending in the width direction of the connecting portion 3, for example, in a rectangular shape. That is, as shown in FIG. 6, the opening of the recess K1 connects the line segment located on the crystal piece 2 side, the line segment located on the connecting part 3 side, and both ends of the two line segments. It is provided at a certain interval at a position surrounded by two line segments.

  Further, as shown in FIG. 6, the respective concave portions K1 of the first main surface and the second main surface are provided so that only a part thereof overlaps when seen in a plan view. When the crystal piece 2 is broken off from the connecting portion 3, it is easy to break, and productivity can be improved. Accordingly, it is preferable that the respective concave portions K1 of the first main surface and the second main surface are provided so that only a part thereof overlaps when seen in a plan view.

  As shown in FIG. 7, in the modified example of the crystal wafer according to the second embodiment, the opening shape of the recess K1 is an elliptical shape. Even in this way, when the crystal piece 2 is folded from the connecting portion 3, the crack starting from one of the recesses K1 tends to progress toward the other recess K1, so the crack progresses in the width direction. It will be. Moreover, the opening shape of the recessed part K1 is an ellipse extended in the width direction, and the crack progresses in the width direction by arranging the portions with small curvature radii where stress is likely to concentrate in the width direction.

  In the crystal wafer according to the second embodiment, since the concave portion K1 has a shape extending in the width direction of the connecting portion 3, the crack starting from the concave portion K1 progresses in the width direction. Therefore, since it cracks in the width direction at the position of the concave portion K1, the possibility of occurrence of burrs in the crystal piece 2 can be reduced.

(Third embodiment)
As shown in FIG. 8, the crystal wafer according to the third embodiment is the first embodiment in that the concave portion K <b> 1 is provided at the ends of the first main surface and the second main surface. And different. The third embodiment is the same as the first embodiment except that the recess K1 is provided at the end portions of the first main surface and the second main surface. The description about the part is omitted.

  In the crystal wafer according to the third embodiment, the concave portion K1 is provided so as to be directed inward from the end portion in the width direction of the connecting portion 3, so that the outer end portion of the concave portion K1 extends in the length direction of the connecting portion 3. Since the possibility that the cracks progress is reduced, it is easy to crack from one end portion to the other end portion in the width direction of the connecting portion 3. Therefore, it is preferable that the recess K1 is provided so as to be directed inward from the end in the width direction.

(Fourth embodiment)
As shown in FIG. 9, the quartz wafer according to the fourth embodiment has a length of the connecting portion 3 when the concave portions K <b> 1 of the first main surface and the second main surface of the connecting portion 3 are seen through the plane. It differs from the first embodiment in that it is provided at different positions in the vertical direction. In the fourth embodiment, the concave portion K1 is located at a position where the concave portions K1 of the first main surface and the second main surface of the connecting portion 3 are different from each other in the length direction of the connecting portion 3 in plan view. Since it is the same as that of 1st Embodiment except being provided in this, description about this same part is abbreviate | omitted.

  The opening shape of the recess K1 has an elliptical shape or a square shape, for example. The concave portions K1 are provided at different positions in the length direction of the connecting portion 3.

  In the quartz wafer according to the fourth embodiment, the recesses K1 are provided at different positions in the length direction of the connecting portion 3, so that the progress of cracks in the length direction is shifted in the length direction. It is likely to occur between the recesses, and the possibility of the development of cracks in the length direction other than between the recesses can be reduced.

  Further, in the quartz wafer according to the fourth embodiment, the recess K1 is provided so as to be directed inward from the end portion in the width direction of the connecting portion 3, so that the crack is further developed between the recesses, and further in the length direction. It is possible to reduce the possibility of crack growth.

  It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the scope of the present invention. As shown in FIG. 10, a plurality of recesses K1 provided in the first main surface are provided side by side from one end side, and the recess K1 provided in the second main surface. May be provided side by side from the other end side.

  Further, as shown in FIG. 11, a plurality of the concave portions K1 provided on the first main surface are provided, and the concave portions K1 provided on the second main surface are seen through the plane. The first main surface may be provided so as to be positioned between the recesses K1.

  In the above-described embodiment, the tuning fork type crystal piece has been described. However, a rectangular crystal piece may be used.

DESCRIPTION OF SYMBOLS 1 ... Support part 2 ... Crystal piece 21 ... Base 22a ... 1st vibration arm part 22b ... 2nd vibration arm part 23a, 23b, 24a, 24b ... Excitation electrode 25a, 25b ... connecting electrodes 26a, 26b ... frequency adjusting metal films 27, 28 ... conductive wiring pattern 3 ... connecting part 3a ... first main surface 3b ... second Main surface of K1 ... concave

Claims (4)

A support part;
A crystal piece integrally formed with the support portion via a connecting portion,
Each of the first main surface and the second main surface of the connecting portion has a concave portion provided at a position different from each other in the width direction of the connecting portion in a plan view. .   The quartz wafer according to claim 1, wherein the concave portion has a shape extending in the width direction of the connecting portion.   The quartz wafer according to claim 1, wherein the recess is provided at an end of the first main surface and the second main surface.   The respective concave portions of the first main surface and the second main surface are provided at positions different from each other in a length direction of the connecting portion in a plan view. The crystal wafer according to any one of the above.

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