JP2013095628A - Manufacturing method for sintered structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that it is difficult to raise dimensional accuracy of a sintered structure due to a shrinkage of nearly 15-30% of a ceramic green sheet in a process to bake a raw laminate in manufacturing a sintered structure such as a ceramic laminated substrate.SOLUTION: The manufacturing method for the sintered structure includes a preparation step to prepare a board and a substrate, a baking step to bake and integrate the board and the substrate, and a division step to divide a baked product into each piece. The manufacturing method uses the substrate that includes a second sintered material having a smaller shrinkage factor than a first sintered material contained in the board under the same baking condition and has a plurality of openings arranged in two dimensions and partition walls between adjacent openings made equal in thickness.

Description

  The present invention relates to a method for producing a sintered structure such as a ceramic laminated substrate made of a ceramic material. The sintered structure is used for, for example, a multilayer wiring circuit board, an electronic component storage package, or a pressure sensor.

  In general, a sintered structure such as a ceramic laminated substrate is produced by firing a green laminate formed by laminating a plurality of ceramic green sheets. However, in the process of firing the green laminate, the ceramic green sheet shrinks by about 10 to 25%, so it is difficult to increase the dimensional accuracy of the sintered structure. In particular, when a structure having a plate-like portion and a frame-like portion, such as an electronic component storage package and a pressure sensor, the plate-like portion may be greatly warped or bent.

  Patent Document 1 discloses a film mold in which the firing shrinkage rate of the substrate having the frame-shaped portion is smaller than the firing shrinkage rate of the film plate that is the plate-like portion, that is, the film plate contracts more greatly than the substrate. A method for manufacturing a voltage ceramic element is described. According to the manufacturing method described in Patent Document 1, the film plate is relatively greatly shrunk during firing due to the difference in the firing shrinkage rate, so that the film plate is formed smoothly under tension.

JP 2001-352111 A

  However, when a single sintered structure is produced by simply providing a difference in firing shrinkage between the plate-like portion and the frame-like portion, the above tension is concentrated at the boundary between the plate-like portion and the frame-like portion. It's easy to do. Therefore, there is a possibility that the bondability between the plate-like portion and the frame-like portion is lowered. This invention is made in view of the said subject, and provides the manufacturing method which can provide the sintered structure which has favorable joining property of a plate-shaped part and a frame-shaped part, and has high durability. For the purpose.

  The method for manufacturing a sintered structure according to one aspect of the present invention includes a plate-like body including a first sintered material, and a sintering shrinkage rate under the same firing conditions as that of the first sintered material. A preparatory step of preparing a substrate including a second sintered material smaller than the first sintered material, and having a plurality of openings arranged in a two-dimensional array and having the same partition wall thickness between adjacent openings, and the plurality of openings After the plate-like body is placed on the base so as to cover the part, the plate-like body and the base are fired and integrated, and the fired and integrated plate-like body and the base are attached to the partition wall. And a dividing step of dividing into individual pieces.

  In the method for manufacturing a sintered structure according to the above aspect, a sintered structure is manufactured using a base body in which a plurality of openings are provided in a two-dimensional array and the partition wall thickness between adjacent openings is equal. Has been. That is, instead of producing a single sintered structure, a plurality of sintered structures are produced simultaneously in a state where the frame-shaped portions are two-dimensionally arranged. Therefore, the force which pulls mutually in the part used as the plate-shaped part adjacent to each other in a plate-shaped object acts. That is, the above tension is distributed not only in the boundary between the plate-like body and the substrate but also in a plane between the portions of the plate-like body that are adjacent to each other.

  Furthermore, since the thicknesses of the partition walls between adjacent openings are made equal, the tension is concentrated on a specific region at the boundary between the plate-like portion and the frame-like portion of each of the plurality of sintered structures. Can be suppressed. Accordingly, it is possible to provide a sintered structure having good durability and high durability between the plate-like portion and the frame-like portion.

It is a perspective view which shows the preparatory process in the manufacturing method of the sintered structure of 1st Embodiment. It is a top view of the base | substrate shown in FIG. It is XX sectional drawing of the plate-shaped body and base | substrate in the preparatory process of the manufacturing method shown in FIG. It is sectional drawing of the plate-shaped body and base | substrate in the baking process of the manufacturing method shown in FIG. It is sectional drawing of the plate-shaped body and base | substrate in the baking process of the division | segmentation method shown in FIG. It is sectional drawing of the plate-shaped body and base | substrate which show the 1st modification of the manufacturing method shown in FIG. It is sectional drawing of the plate-shaped body and base | substrate which show the 2nd modification of the manufacturing method shown in FIG. It is a perspective view which shows the preparation process in the manufacturing method of the sintered structure of 2nd Embodiment. It is YY sectional drawing of the plate-shaped body and base | substrate in the preparatory process of the manufacturing method shown in FIG.

  Hereinafter, the manufacturing method of the sintered structure according to the first embodiment (hereinafter, for convenience, the manufacturing method of the sintered structure is also simply referred to as a manufacturing method) will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the sintered structure of the following embodiment may include an arbitrary constituent member that is not shown in each drawing referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1-5, the manufacturing method of the sintered structure 1 of this embodiment is the preparatory process which prepares the plate-like body 3 and the base | substrate 5, and baking which integrates the plate-like body 3 and the base | substrate 5 by baking. A process and a dividing process of dividing into individual pieces.

  In the preparation step, the base body 5 is prepared in which the plate-like body 3 and the plurality of openings 7 are provided in a two-dimensional array and the thickness of the partition wall 9 between the adjacent openings 7 is equal. The plate-like body 3 includes a first sintered material. The base 5 includes a second sintered material having a sintering shrinkage rate lower than that of the first sintered material under the same firing conditions as the first sintered material. In the firing step, the plate-like body 3 and the base body 5 are fired and integrated after the plate-like body 3 is placed on the base body 5 so as to close the plurality of openings 7. In the dividing step, the fired and integrated plate-like body 3 and the base body 5 are divided by partition walls 9 and divided into individual pieces each including the opening 7.

  In addition, the sintering shrinkage rate in this embodiment means the ratio of the size after sintering to the size before sintering. For example, if the base 5 having a side length of 10 mm before sintering is subjected to a firing step and the length of one side is 8 mm after sintering, the sintering shrinkage rate is 80%. Can do.

  In the manufacturing method of the present embodiment, a plurality of sintered structures are formed using a base 5 in which a plurality of openings 7 are provided in a two-dimensional array and the thickness of the partition wall 9 between adjacent openings 7 is equal. The body 1 is manufactured. That is, instead of producing a single sintered structure 1, a plurality of sintered structures are formed in a state in which the frame-shaped portions (frame-shaped portions) in the individual sintered structure 1 are two-dimensionally arranged. 1 are produced simultaneously.

  The plate-like body 3 is also fired by the firing step in a state where the plate-like portions (plate-like portions) in the individual sintered structure 1 are two-dimensionally arranged. At this time, a pulling force is exerted between adjacent ones of the plate-like portions. That is, the above tension is distributed not only on the boundary between the plate-like body 3 and the substrate 5 but also on the entire plate-like body 3.

  Furthermore, since the thickness of the partition wall 9 between the adjacent openings 7 is made equal, tension is applied to a specific region at the boundary between the plate-like portion and the frame-like portion in each of the plurality of sintered structures 1. Concentration can be suppressed. Therefore, it is possible to provide the sintered structure 1 having good durability and high durability between the plate-like portion and the frame-like portion.

<Preparation process>
In the preparation step in the present embodiment, the base body 5 is prepared in which the plate-like body 3 and the plurality of openings 7 are provided in a two-dimensional array and the thickness of the partition wall 9 between the adjacent openings 7 is equal. .

  As the shape of the plate-like body 3, for example, a square plate shape can be used as shown in FIG. The size of the plate-like body 3 varies depending on the number of the sintered structures 1 to be singulated, but the portion of the plate-like body 3 in the state of the sintered structure 1 is, for example, one side when viewed in plan. The size can be set to 50-200 mm.

  For example, assuming that the size of one side in the portion of the plate-like body 3 in the state of the sintered structure 1 after singulation is 8 mm, as shown in FIG. 2, there are three sintered structures 1 in the vertical direction. When four-dimensionally arranged in the left-right direction, the size of one side in the vertical direction of the sintered plate-like body 3 is about 30 mm, and the size of one side in the left-right direction is about 40 mm. It should be set as follows. Moreover, as thickness of the plate-shaped body 3 after sintering, it can set to 0.1-5 mm, for example.

  The shape of the base 5 may be, for example, a square plate shape, and the shape of the outer periphery when viewed in plan overlaps with the outer periphery of the plate-like body 3. Therefore, for example, when the plate-like body 3 after sintering is set to be about 30 × 40 mm as described above, the base 5 is similarly about 30 × 40 mm in size on one side after sintering. It may be set so as to be. Moreover, as thickness of the base | substrate 5 after sintering, it can set to 0.3-10 mm, for example.

  The base 5 is provided with a plurality of openings 7 arranged two-dimensionally. As shown in FIG. 3, each opening 7 has a concave shape that opens only on the upper surface of the substrate 5. In addition, the plurality of openings 7 are arranged so as to be positioned in the individual pieces divided by the partition walls 9 in the division step. Specifically, in the manufacturing method of the present embodiment, the openings 7 are provided at equal intervals in the vertical and horizontal directions in FIG. 2 so that the partition walls 9 between the openings 7 have a lattice shape. .

  The opening 7 of the sintered structure 1 in the present embodiment has a shape whose inner periphery is a square when viewed in plan. At this time, the size of one side of the inner periphery can be set to 3 to 18 mm, for example. The opening 7 in the present embodiment has a quadrangular shape, but the inner periphery in plan view may be circular or elliptical. Moreover, what is necessary is just to set as the depth of the opening part 7 about 0.2-9.5 mm.

  In the sintered structure 1 according to the present embodiment, the opening 7 has a concave shape that opens only on the upper surface of the substrate 5, but is not limited thereto. For example, as shown in FIG. 6, a substrate 5 may be used in which a plurality of openings 7 are respectively one of the plurality of through holes penetrating to the opposite side of the substrate 5. In other words, the opening 7 may be a through hole that opens on the upper surface and the lower surface of the base body 5. When the opening 7 is a through-hole that also opens on the lower surface of the base 5, when the plate-like body 3 and the base 5 are fired and integrated, the organic solvent and binder contained in these members before sintering are vaporized. The gas generated by this can escape from the opening on the lower surface side of the opening 7 to the outside. Therefore, it is possible to suppress the above gas from accumulating in the opening 7.

  In the case of a structure in which the opening 7 is a through-hole that opens to the upper surface and the lower surface of the substrate 5 as in the substrate 5 shown in FIG. 6, two plate-like bodies 3 are provided as shown in FIG. You may prepare. In this case, in the firing step described later, one plate-like body 3 is overlaid on the upper surface of the base 5 so as to close the opening on the upper surface side of the opening 7 having a through-hole shape, and the other plate-like body 3 is opened. 7 is overlaid on the lower surface of the base 5 so as to close the opening on the lower surface side. Thus, when the base | substrate 5 becomes a shape pinched | interposed by a pair of plate-shaped body 3, each flatness of a pair of plate-shaped body 3 which opposes on both sides of a through-hole can be made favorable. For this reason, for example, when the sintered structure 1 is used as a pressure sensor, it is possible to achieve extremely high reliability with even smaller variations in capacitance.

  In the base body 5 in the present embodiment, the thickness D1 of the partition wall 9 between the opening 7 located on the outermost peripheral side when viewed from above and the outermost periphery of the base body 5 is the partition wall 9 between the adjacent openings 7. A thickness thicker than the thickness D2 is used. As a result, the shape of the base body 5 can be stably held during the firing process in the partition wall 9 located between the opening 7 located on the outermost peripheral side when viewed from the top and the outermost periphery of the base body 5. Therefore, it is possible to further suppress warping or bending that occurs in the plate-like body 3 in the firing step. Further, since the stress applied to each partition wall 9 excluding the partition wall 9 can be reduced, the bondability between the plate-like portion and the frame-like portion in each of the plurality of sintered structures 1 divided into pieces is excellent. Can be anything.

  Further, in the manufacturing method of the present embodiment, the opening 7 has a concave shape that opens only on the upper surface of the base body 5, and the plate-like body 3 is disposed on the upper surface of the base body 5 in the firing step described later. It is not limited to. For example, the opening 7 may have a concave shape that opens only on the lower surface of the base body 5, and the plate-like body 3 may be disposed on the lower surface of the base body 5 in a baking process described later.

  As the plate-like body 3 and the substrate 5, a member having high insulation can be used. Examples of the insulating member include a member such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. Can be used.

  A mixed member is produced by mixing the raw material powder containing the above members, an organic solvent, and a binder. A green sheet is produced by forming the mixing member into a sheet. As a method for forming the sheet, for example, a doctor blade method may be used.

  A single layer or a laminate of these green sheets can be used as the plate-like body 3 and the substrate 5 before firing. Alternatively, the green sheet itself may be used, but if the plate-like body 3 and the substrate 5 can be sintered and integrated in the firing step described later, the green sheet is pre-fired in the form of a plate. It may be used as the body 3 or the substrate 5.

  The plate-like body 3 in the present embodiment includes a first sintered material. Further, the base 5 includes a second sintered material having a sintering shrinkage rate smaller than that of the first sintered material under the same firing conditions as the first sintered material. As a 1st sintered material and a 2nd sintered material, it can select from the member which has said insulation. By making the above-mentioned insulating member into a green sheet preparation composition having a desired sintering shrinkage rate, the sintering shrinkage rate of the second sintered material under the same firing conditions as that of the first sintering material can be reduced. Can be smaller than the binding material.

  Further, the shrinkage rate of the green sheet can also be adjusted by the type or amount of the organic solvent and binder mixed in the insulating member. Therefore, as the first sintered material and the second sintered material, the first sintered material and the second sintered material are included in the first sintered material by adjusting the kind of the organic solvent and the binder, or the particle size distribution of the material. The sintering shrinkage rate of the second sintered material under the same firing conditions may be smaller than that of the first sintered material.

  Moreover, it is preferable to use the plate-like body 3 and the substrate 5 having the same thermal expansion coefficient when they are fired and integrated in the firing step. If the thermal expansion coefficients of the plate-like body 3 and the substrate 5 are different from each other, a large residual stress is generated between the plate-like body 3 and the substrate 5 due to the shrinkage after the firing step, and breakage or the like based on the boundary surface may occur. May occur. However, since the residual stress can be reduced by using the plate-like body 3 and the base body 5 having the same thermal expansion coefficient when they are fired and integrated in the firing step, the durability of the sintered structure 1 is improved. Can be improved.

  When the sintered structure 1 manufactured by the manufacturing method of the present embodiment is used as, for example, a pressure sensor, the region facing the opening 7 on the lower surface of the plate-like body 3 and the bottom surface of the opening 7 are opposed to each other. A metal layer (not shown) may be formed. Through the firing step, such a metal layer can be used as a pair of counter electrodes.

  The metal layer to be a pair of counter electrodes is obtained, for example, by adding and mixing an organic binder, a solvent, a plasticizer, a dispersant, and the like into a metal powder such as copper, silver, gold, platinum, nickel, tungsten, and molybdenum. Metal paste can be used. What is necessary is just to print such a metal paste on said area | region, for example using a screen printing method. The printed metal paste becomes a pair of counter electrodes through a baking process.

  Similarly, when the sintered structure 1 manufactured by the manufacturing method of the present embodiment is used as, for example, a multilayer wiring circuit board or a package, the above-described structure is formed on the surface or inside of the green sheet according to a desired circuit structure. What is necessary is just to print a metal paste. The printed metal paste becomes a predetermined wiring circuit through a baking process.

<Baking process>
In the firing step of this embodiment, as shown in FIG. 4, the plate-like body 3 and the base body 5 are fired and integrated after the plate-like body 3 is placed on the base body 5 so as to block the plurality of openings 7. Yes. Specifically, since the opening 7 in the present embodiment is a concave shape that opens only on the upper surface side of the base 5, the lower surface of the plate-like body 3 closes the plurality of openings 7. Are placed on top of each other.

  In this way, a green laminate is produced by placing the base body 5 on the plate-like body 3. By firing the produced green laminate, the plate-like body 3 and the substrate 5 are fired and integrated. The optimum firing temperature varies depending on the materials used as the plate-like body 3 and the substrate 5, but when using a high-temperature fired ceramic material such as aluminum oxide, the plate-like body 3 and the substrate 5 are fired at 1550 ° C to 1600 ° C. do it. Further, when a low-temperature fired ceramic material such as glass ceramic is used, the plate-like body 3 and the substrate 5 may be fired at 1000 to 1400 ° C.

  In the manufacturing method of the present embodiment, a plurality of openings 7 are provided in a two-dimensional array, and a plurality of sintered structures 1 are produced simultaneously. Therefore, the stress caused by the difference in the sintering shrinkage rate between the plate-like body 3 and the base body 5 is separated into not only the boundary between the plate-like body 3 and the base body 5 but also, for example, by a dividing step in the plate-like body 3. In this case, as in the portions 3A and 3B respectively located in the adjacent sintered structures 1, the portions that are adjacent to each other also act as pulling forces.

  At this time, since the plate-like body 3 is planar, the plurality of openings 7 are two-dimensionally arranged, so that the plate-like body 3 is dispersed in a plane between adjacent portions. Therefore, it is possible to suppress the concentration of stress at the boundary between the plate-like body 3 and the base 5 with respect to the tension acting in the vertical direction and the tension acting in the left-right direction in FIG. Furthermore, since the thickness of the partition wall 9 between the adjacent openings 7 is made equal, it is possible to suppress stress from being excessively concentrated on a part of the plurality of sintered structures 1.

  When firing a large number of green laminates due to the difference in shrinkage between the substrate and the plate-like body, a member composed of a material not bonded to the laminate or a weight coated with such a material is used. It may be used to reduce curved warpage occurring in the entire multi-piece sintered body.

<Division process>
In the dividing step of this embodiment, as shown in FIG. 5, the fired and integrated plate-like body 3 and the base body 5 are divided at the partition wall 9 and divided into individual pieces each including the opening 7. . Specifically, in the manufacturing method of this embodiment, the plate-like body 3 and the base body 5 are divided along the alternate long and short dash line shown in FIG. Thereby, a plurality of sintered structures 1 having the openings 7 are produced.

  In addition, a groove or a through hole is provided in the base body 5 along the alternate long and short dash line shown in FIG. 2, which is a line to be divided into individual pieces, excluding the outermost peripheral portion constituting the outside of the multi-cavity area of the base body. Also good. When such grooves or through holes are provided, the dividing step can be easily performed.

  In the plurality of sintered structures 1 manufactured based on the manufacturing method of the present embodiment, stress is dispersed as described above, and stress is excessively concentrated on a part of the plurality of sintered structures 1. Is suppressed. Therefore, the durability of each sintered structure 1 is good, and the quality of flatness, size, durability, etc. of the plate-like body 3 after sintering in each of the plurality of sintered structures 1 varies. Can be reduced.

  The produced sintered structure 1 having a hollow structure is used as a hollow structure such as a pressure sensor, for example. Since the sintered structure 1 in the present embodiment has good flatness of the plate-like body 3, for example, when used as a pressure sensor, the sintered structure 1 can be made highly reliable with little variation in capacitance.

  As shown in FIG. 6, when the opening 7 is a through hole that opens to the upper surface and the lower surface of the base body 5, the sintered structure 1 can be used as a highly reliable electronic component storage package. Since the opening 7 opens in the lower surface of the base body 5, electronic components (not shown) such as capacitors, IC elements, and optical elements can be placed from the lower surface side of the sintered structure 1. At this time, since the flatness of the surface of the plate-like body 3 is high, the electronic component can be stably placed on the sintered structure 1. Further, when an optical element is used as the electronic component, the optical axis can be easily aligned. As a result, it is possible to increase the bonding reliability between the electronic component and the package. Further, it is possible to contribute to the improvement of the productivity of the electronic device including the sintered structure of the present embodiment and the electronic component housed in the hollow space of the sintered structure.

  Next, the manufacturing method of the sintered structure 1 of 2nd Embodiment is demonstrated in detail using drawing. In addition, in each structure concerning this embodiment, about the structure which has a function similar to 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted. Detailed descriptions of the same steps as those in the first embodiment are also omitted.

  As shown in FIGS. 8 and 9, the manufacturing method of the present embodiment is similar to the manufacturing method of the first embodiment, in which the plate-like body 3 and the base body 5 are prepared, and the plate-like body 3 and the base body 5 are prepared. And a dividing step of dividing the piece into individual pieces.

  At this time, the manufacturing method of the sintered structure 1 according to the present embodiment further prepares the second substrate 11 in the preparation step as compared with the manufacturing method according to the first embodiment. The second base 11 is made of the same material as that of the base 5 and has a second opening 13 having a size in which a plurality of openings 7 are included when the base 5 is overlapped with the base 5 and seen through the plane. .

  In the firing step, such a second substrate 11 is disposed so as to overlap the plate-like body 3 so that the plate-like body 3 is sandwiched from both sides by the substrate 5 and the second substrate 11. And the base | substrate 5, the plate-shaped body 3, and the 2nd base | substrate 11 are integrated by baking.

  In the manufacturing method of the present embodiment, since the second base 11 made of the same material as the base 5 is used, the second base 11, the plate-like body 3, and the second base 11 are integrated by firing. Tension is also generated between the substrate 11 and the plate-like body 3. Therefore, when the base body 5, the plate-like body 3, and the second base body 11 are baked and integrated, the tension generated between the base body 5 and the plate-like body 3 is dispersed between the second base body 11 and the plate-like body 3. Can be made. As a result, the bondability between the substrate 5 and the plate-like body 3 can be further improved.

  Since the same material as the first substrate 5 is used as the second substrate 11, a member having high insulation can be used. Examples of the insulating member include a member such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. Can be used.

  The sintered structure 1 from which the second substrate 11 is removed is used as, for example, a multilayer wiring circuit board, an electronic component storage package, or a pressure sensor. The second substrate 11 may be finally removed after the sintering step, but in the case of removal, the substrate 5, the plate-like body 3, and the second substrate 11 are integrated by firing prior to the dividing step. It is preferably removed from the waste. Compared with the case where the second substrate 11 is removed from the individual sintered structures 1 after the cutting step, the second substrate 11 can be easily removed, and the plate in each sintered structure 1 is removed. This is because the thickness of the portion of the sheet-like body 3 and the flatness of the surface of the plate-like body 3 to which the second substrate 11 is joined can be improved.

  Although the manufacturing method of the sintered structure of each embodiment has been described as described above, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Sintered structure 3 ... Plate-shaped body 5 ... Base | substrate 7 ... Opening part 9 ... Partition 11 ... 2nd base | substrate

Claims (6)

A plate-like body containing the first sintered material, and a second sintered material having a sintering shrinkage rate smaller than that of the first sintered material under the same firing conditions as the first sintered material, and a plurality of openings A preparatory step of preparing a substrate which is provided in a two-dimensional array and has the same partition wall thickness between adjacent openings;
A firing step in which the plate-like body and the base body are fired and integrated after the plate-like body is placed on the base body so as to cover the plurality of openings;
A method for producing a sintered structure, comprising: a step of dividing the plate-like body and the base body, which are integrated by firing, into pieces by dividing the base body by the partition walls.   The method for manufacturing a sintered structure according to claim 1, wherein the plate-like body and the substrate have the same thermal expansion coefficient when they are fired and integrated in the firing step.   As the base, a thickness of the partition wall between the opening located on the outermost peripheral side when viewed from above and the outermost periphery of the base is larger than the thickness of the partition wall between adjacent openings. The manufacturing method of the sintered structure of Claim 1 or Claim 2 to be used. In the preparation step, a second base made of the same material as the base and having a second opening having a size in which the plurality of openings are included inside when overlapped with the base and viewed through the plane is further provided. Prepare
In the firing step, the second base is disposed so as to overlap the plate-like body so that the plate-like body is sandwiched from both sides by the base and the second base to be integrally fired. The manufacturing method of the sintered structure in any one of Claim 1 thru | or 3.   The manufacturing of the sintered structure according to claim 4, wherein a part of the second substrate is removed from the substrate, the plate-like body, and the second substrate which are integrated by firing prior to the dividing step. Method. The firing according to any one of claims 1 to 5, wherein the base is one in which the plurality of openings are each one of a plurality of through holes penetrating to the opposite side of the base. A method for producing a bonded structure.

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