JP2013084873A - Adhesive composition for masking tape of molded underfill process and masking tape using the same - Google Patents

Adhesive composition for masking tape of molded underfill process and masking tape using the same Download PDF

Info

Publication number
JP2013084873A
JP2013084873A JP2012006652A JP2012006652A JP2013084873A JP 2013084873 A JP2013084873 A JP 2013084873A JP 2012006652 A JP2012006652 A JP 2012006652A JP 2012006652 A JP2012006652 A JP 2012006652A JP 2013084873 A JP2013084873 A JP 2013084873A
Authority
JP
Japan
Prior art keywords
masking tape
weight
parts
energy ray
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012006652A
Other languages
Japanese (ja)
Other versions
JP5548711B2 (en
Inventor
Young Soo Kim
ス キム，ヨン
Ki Jeong Moon
ジョン ムン，キ
Kyong Yeon Jeon
ヨン ジョン，キョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Advanced Materials Korea Inc
Original Assignee
Toray Advanced Materials Korea Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Advanced Materials Korea Inc filed Critical Toray Advanced Materials Korea Inc
Publication of JP2013084873A publication Critical patent/JP2013084873A/en
Application granted granted Critical
Publication of JP5548711B2 publication Critical patent/JP5548711B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape of a molded underfill process and to provide a masking tape using the adhesive composition.SOLUTION: According to the invention, an adhesive composition for a masking tape of a molded underfill process and the masking tape using the adhesive composition solve the problems of an existing acryl mold resealing adhesive layer, such as adhesive residue remaining on a PCB surface and marks on the surface occurring with several kinds of sealing materials (EMC), by forming an improved acryl mold releasing adhesive layer. Forming the improved acryl mold releasing adhesive layer prevents the adhesive residue on the PCB surface to improve the process failure rate and solves the problem of marks on the surface which occur with several kinds of EMC thereby allowing the masking tape using the adhesive composition to be applicable to several kinds of sealing materials used in MUF process. The invention makes such advantages.

Description

本発明はモールドアンダーフィル工程のマスキングテープ用粘着剤組成物およびそれを用いたマスキングテープに係り、さらに詳しくは、エネルギー線硬化型シリコン樹脂を粘着剤組成として添加して用いることにより、プリント回路基板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ；ＰＣＢ）の表面に粘着剤が残留することを防ぎ、封止材（ＥＭＣ）の種類によらずに表面の跡防止特性を有するモールドアンダーフィル工程のマスキングテープ用粘着剤組成物およびそれを用いて製造されるマスキングテープに関する。   The present invention relates to an adhesive composition for a masking tape in a mold underfill process and a masking tape using the same, and more specifically, by adding an energy ray curable silicone resin as an adhesive composition and using the printed circuit board. (Printed Circuit Board; PCB) The adhesive composition for masking tape in the mold underfill process which prevents the adhesive from remaining on the surface and has surface trace prevention characteristics regardless of the type of the sealing material (EMC) And a masking tape manufactured using the same.

最近、信号処理およびメモリ容量増大に伴う要求と、携帯電話の小型化および低価格化の傾向に伴い、メモリ実装面積は減らす一方、増大するメモリ密度および性能を高めるために考案されたＰｏＰ（Ｐａｃｋａｇｅ ｏｎ ｐａｃｋａｇｅ）構造が登場している。かようなＰｏＰ構造の底層（Ｂｏｔｔｏｍ ｌａｙｅｒ）は、チップ（ｃｈｉｐ）が接地として用いられるため、チップの表面が露出された形のフリップチップパッケージ（Ｄｉｅ Ｅｘｐｏｓｅｄ Ｆｌｉｐ Ｃｈｉｐ Ｐａｃｋａｇｅ；ＤＥＦＣＰ）から構成される。次いで、チップの破損防止および放熱のためのモールドアンダーフィル（Ｍｏｌｄｅｄ Ｕｎｄｅｒｆｉｌｌ；ＭＵＦ）工程が実施され、このとき、チップをマスキング（ｍａｓｋｉｎｇ）する用途に粘着テープが用いられる。   Recently, PoP (Package) was devised to increase memory density and performance while reducing memory mounting area due to the demands associated with increased signal processing and memory capacity, and the trend toward smaller and cheaper mobile phones. on package) structure has appeared. The bottom layer of the PoP structure is formed of a flip chip package (DEFCP) in which the surface of the chip is exposed because the chip is used as a ground. Next, a mold underfill (MUF) process for preventing breakage of the chip and heat dissipation is performed. At this time, an adhesive tape is used for masking the chip.

かようなＤＥＦＣＰのＭＵＦ用粘着マスキングテープ用途の粘着テープとして、出願人は、例えば、下記の特許文献１を出願している。前記出願においては、既存のＰＥＴ−フィルム基材のモールド汚染の問題を改善するために、オリゴマー溶出特性が低いＰＥＮ−フィルムを基材として用い、優れた離型特性および耐熱性を有するアクリル離型粘着層を備える構造が提案されている。しかしながら、前記アクリル離型粘着層は、表面硬さが高くて優れた離型特性を有するのに対し、引っ掻かれ易いため、ＭＵＦ工程が行われる間にモールドの鋭い角部により粘着層が突き刺されるという現象が発生し、このとき、引き剥がされた粘着層がモールド下側のＰＣＢの表面に転写されるという問題が発生していた。なお、各種のＥＭＣでＭＵＦ工程を行う過程で、特定のＥＭＣの場合、モールディングされた表面の一部に跡が生じるという問題が発生していた。   As such an adhesive tape for DEFCP MUF adhesive masking tape, the applicant has applied for the following Patent Document 1, for example. In the above application, in order to improve the mold contamination problem of the existing PET-film substrate, an acrylic mold release having excellent release characteristics and heat resistance using a PEN-film having a low oligomer elution property as a substrate. A structure including an adhesive layer has been proposed. However, the acrylic release pressure-sensitive adhesive layer has high surface hardness and excellent release characteristics, but is easily scratched, so that the pressure-sensitive adhesive layer is pierced by the sharp corners of the mold during the MUF process. At this time, there has been a problem that the peeled adhesive layer is transferred to the surface of the PCB under the mold. In addition, in the process of performing the MUF process with various EMCs, in the case of a specific EMC, there is a problem that a trace is generated on a part of the molded surface.

そこで、本発明者らは、既存の前記ＤＥＦＣＰのＭＵＦ用粘着マスキングテープの優れたモールド汚染の防止特性はそのまま維持するが、表面硬さの調節および硬化剤種類の変更を通じて、ＰＣＢ表面への粘着剤残渣の防止および封止材（ＥＭＣ）の種類による表面の跡防止の特性を有する改善されたアクリル離型粘着層を構成することにより、前記問題点を解消し得ることを見出し、本発明を完成するに至った。   Therefore, the present inventors maintain the excellent mold contamination prevention property of the existing DEFCP MUF adhesive masking tape as it is, but by adjusting the surface hardness and changing the type of curing agent, the adhesion to the PCB surface is maintained. It has been found that the above-mentioned problems can be solved by constituting an improved acrylic release adhesive layer having the properties of preventing the residue of the agent and preventing the trace of the surface by the type of the sealing material (EMC). It came to be completed.

韓国特許第１０−２０１１−０００５９０２号公報Korean Patent No. 10-2011-0005902

本発明の目的は、エネルギー線硬化型オリゴマー樹脂にエネルギー線硬化型シリコン樹脂を添加して用いることにより、ＰＣＢ表面に粘着剤が残留することを防ぎ、封止材（ＥＭＣ）の種類によらずに表面の跡防止特性を有するモールドアンダーフィル工程のマスキングテープ用粘着剤組成物を提供することである。   The object of the present invention is to prevent the adhesive from remaining on the PCB surface by adding the energy ray curable silicone resin to the energy ray curable oligomer resin, and regardless of the type of the sealing material (EMC). It is providing the adhesive composition for masking tapes of the mold underfill process which has the surface trace prevention characteristic in the.

本発明の他の目的は、前記組成物を用いて製造されるマスキングテープを提供することである。   Another object of the present invention is to provide a masking tape produced using the composition.

前記目的を達成するための本発明のモールドアンダーフィル（ＭＵＦ）工程のマスキングテープ用粘着剤組成物は、（ａ）アクリル系共重合体１００重量部に対して、（ｂ）熱硬化剤１〜２０重量部と、（ｃ）エネルギー線硬化型ウレタン樹脂５〜４０重量部と、（ｄ）エネルギー線硬化型シリコン樹脂０．１〜５重量部と、（ｅ）エネルギー線開始剤と、を含む。   To achieve the above object, the pressure-sensitive adhesive composition for masking tape in the mold underfill (MUF) process of the present invention comprises (a) 100 parts by weight of an acrylic copolymer, 20 parts by weight, (c) 5 to 40 parts by weight of energy ray curable urethane resin, (d) 0.1 to 5 parts by weight of energy ray curable silicone resin, and (e) an energy ray initiator. .

エネルギー線硬化型ウレタン樹脂は、アリファチック２官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｄｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アリファチック３官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｔｒｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アリファチック６官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｈｅｘａｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アロマチック２官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｄｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アロマチック３官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｔｒｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）およびアロマチック６官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｈｅｘａｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）よりなる群から選ばれるいずれか一種以上であることが好ましい。   The energy ray curable urethane resin includes an aliphatic difunctional urethane acrylate (aliphatic difunctional urethane acrylate), an aliphatic trifunctional urethane acrylate (aliphatic trifunctional urethane acrylate), and an aliphatic hexafunctional urethane acrylate (aliphatic acrylate). Functional urethane acrylate (Aromatic trifunctional urethane acrylate), Aromatic trifunctional urethane acrylate (Aromatic trifunctional urethane acrylate) and It is preferably any one or more selected from the group consisting of aromatic hexafunctional urethane acrylate (Aromatic hexafunctional urethane acrylate).

前記エネルギー線硬化型シリコン樹脂は、シリコンジアクリレート（Ｓｉｌｉｃｏｎｅ ｄｉａｃｒｙｌａｔｅ）、シリコンヘキサアクリレート（Ｓｉｌｉｃｏｎｅ ｈｅｘａａｃｒｙｌａｔｅ）、シリコンポリエステルアクリレート（Ｓｉｌｉｃｏｎｅ Ｐｏｌｙｅｓｔｅｒ ａｃｒｙｌａｔｅ）、シリコンウレタンアクリレート（Ｓｉｌｉｃｏｎｅ Ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）およびシリコンウレタンメタアクリレート（Ｓｉｌｉｃｏｎｅ Ｕｒｅｔｈａｎｅ ｍｅｔｈａｃｒｙｌａｔｅ）よりなる群から選ばれるいずれか一種以上であることが好ましい。   The energy ray curable silicone resin includes silicon diacrylate, silicon hexaacrylate, silicon polyester acrylate, silicon urethane acrylate, and silicone urethane methacrylate. It is preferably at least one selected from the group consisting of (methacrylate).

前記熱硬化剤は、メラミン系硬化剤であることが好ましい。   The thermosetting agent is preferably a melamine-based curing agent.

本発明のモールドアンダーフィル工程用マスキングテープは、耐熱性基材１１と、前記耐熱性基材の片面または両面に形成された帯電防止層と、前記帯電防止層の上に形成された粘着剤層と、を備える。   The masking tape for mold underfill process of the present invention includes a heat-resistant substrate 11, an antistatic layer formed on one or both sides of the heat-resistant substrate, and an adhesive layer formed on the antistatic layer. And comprising.

前記耐熱性基材は、ポリイミドフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンナフタレートフィルムおよびポリブチレンテレフタレートフィルムよりなる群から選ばれるいずれか一種であることが好ましい。   The heat resistant substrate is preferably any one selected from the group consisting of a polyimide film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polybutylene terephthalate film.

前記粘着剤層は、（ａ）アクリル系共重合体１００重量部に対して、（ｂ）熱硬化剤１〜２０重量部と、（ｃ）エネルギー線硬化型ウレタン樹脂５〜４０重量部と、（ｄ）エネルギー線硬化型シリコン樹脂０．１〜５重量部と、（ｅ）エネルギー線開始剤と、を含む粘着剤組成物から製造されるものであることが好ましい。   The pressure-sensitive adhesive layer comprises (a) 100 parts by weight of an acrylic copolymer, (b) 1 to 20 parts by weight of a thermosetting agent, (c) 5 to 40 parts by weight of an energy ray curable urethane resin, (D) It is preferable that it is manufactured from the adhesive composition containing 0.1-5 weight part of energy-beam curable silicone resins, and (e) energy-beam initiator.

前記粘着剤層のポリシュドシリコンウェーハ（ｐｏｌｉｓｈｅｄ ｓｉｌｉｃｏｎ ｗａｆｅｒ）面に対する常温粘着力は、５０ｇｆ／ｉｎｃｈ以下であることが好ましい。   The room temperature adhesive force of the pressure-sensitive adhesive layer to the surface of a polished silicon wafer is preferably 50 gf / inch or less.

前記粘着剤層の表面抵抗は、粘着層面が１０11Ω／□以下であることが好ましい。 The surface resistance of the pressure-sensitive adhesive layer is preferably 10 11 Ω / □ or less on the pressure-sensitive adhesive layer surface.

本発明のモールドアンダーフィル工程のマスキングテープ用粘着剤組成物およびそれを用いたマスキングテープは、改善されたアクリル離型粘着層を構成することにより、既存のアクリル離型粘着層のＰＣＢ表面粘着剤残渣（ｒｅｓｉｄｕｅ）および封止材（ＥＭＣ）の種類による表面の跡の問題を改善することができる。これにより、ＰＣＢ表面への粘着剤残渣を防いで、工程不良率を下げることができ、各種のＥＭＣによる表面の跡の問題を改善してＭＵＦ工程に用いられる様々な封止材への適用が可能であるというメリットがある。   The pressure-sensitive adhesive composition for masking tape in the mold underfill process of the present invention and the masking tape using the same constitute an improved acrylic release pressure-sensitive adhesive layer, thereby forming an existing acrylic release pressure-sensitive adhesive layer on the PCB surface. The problem of surface marks due to the type of residue and encapsulant (EMC) can be improved. This prevents adhesive residue on the PCB surface, lowers the process defect rate, improves the problem of surface traces caused by various EMC, and can be applied to various sealing materials used in MUF processes. There is a merit that it is possible.

本発明の粘着剤が適用されたモールドアンダーフィル（ＭＵＦ）工程のマスキングテープに対する模式的断面図である。It is typical sectional drawing with respect to the masking tape of the mold underfill (MUF) process to which the adhesive of this invention was applied. ＤＥＦＣＰのＭＵＦ工程において本発明のマスキングテープが適用される工程模式図である。It is a process schematic diagram in which the masking tape of the present invention is applied in the MUF process of DEFCP.

本発明のモールドアンダーフィル（ＭＵＦ）工程のマスキングテープ用粘着剤組成物は、（ａ）アクリル系共重合体と、（ｂ）熱硬化剤と、（ｃ）エネルギー線硬化型ウレタン樹脂と、（ｄ）エネルギー線硬化型シリコン樹脂と、（ｅ）エネルギー線開始剤と、を含む。以下、各組成を詳述する。   The pressure-sensitive adhesive composition for a masking tape in the mold underfill (MUF) process of the present invention includes (a) an acrylic copolymer, (b) a thermosetting agent, (c) an energy ray curable urethane resin, d) An energy ray curable silicone resin, and (e) an energy ray initiator. Hereinafter, each composition is explained in full detail.

１．粘着剤組成物
１−１．アクリル系共重合体
本発明のＭＵＦ工程のマスキングテープ用粘着剤組成物において、アクリル系共重合樹脂は、分子内二重結合がない飽和高分子（Ｓａｔｕｒａｔｅｄ ｐｏｌｙｍｅｒ）であり、その固有な性質の面で、酸化に対する抵抗に優れているため卓越した耐候性を有し、且つ、求められる必要物性に応じて、高分子（Ｐｏｌｙｍｅｒ）組成の変更や官能基（Ｆｕｎｃｔｉｏｎａｌ ｇｒｏｕｐ）の導入などによって改質され易いというメリットがある。本発明において、アクリル系共重合樹脂とは、アクリル酸および／またはメタクリル酸やこれらの誘導体の共重合体のことをいう。好ましくは、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ブチル（メタ）アクリレート、イソアミル（メタ）アクリレート、ｎ−ヘキシル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、イソオクチル（メタ）アクリレート、イソノニル（メタ）アクリレート、デシル（メタ）アクリレートおよびドデシル（メタ）アクリレートよりなる群から選ばれるいずれか一種以上のアクリルモノマーが単独または２種以上混合されて共重合されたものである。 1. 1. Adhesive composition 1-1. Acrylic Copolymer In the pressure-sensitive adhesive composition for masking tape in the MUF process of the present invention, the acrylic copolymer resin is a saturated polymer having no intramolecular double bond, and has an inherent property. Because of its excellent resistance to oxidation, it has excellent weather resistance and is modified by changing the polymer composition or introducing functional groups according to the required physical properties required. There is a merit that it is easy. In the present invention, the acrylic copolymer resin refers to a copolymer of acrylic acid and / or methacrylic acid or a derivative thereof. Preferably, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isononyl One or more acrylic monomers selected from the group consisting of (meth) acrylates, decyl (meth) acrylates, and dodecyl (meth) acrylates are copolymerized alone or in combination of two or more.

前記アクリル系共重合体としては、重量平均分子量が、好ましくは、１００，０００〜１，５００，０００であり、さらに好ましくは、５００，０００〜１，０００，０００であるものを使用する。前記重量平均分子量が１００，０００未満である場合には、コーティング後に得られた粘着層の内部凝集力に乏しいため、テープの引き剥がし後にプラズマに活性化されたチップの表面に樹脂成分を残留させ易く、１，５００，０００を超える場合には、溶媒への溶解性が減少して均一なコーティング層を形成することが困難になるだけではなく、熱硬化又はエネルギー線硬化による硬化効率が低下して、結果的に樹脂成分の残留が発生してしまうという問題点がある。   As the acrylic copolymer, those having a weight average molecular weight of preferably 100,000 to 1,500,000, more preferably 500,000 to 1,000,000 are used. When the weight average molecular weight is less than 100,000, the internal cohesive force of the adhesive layer obtained after coating is poor, so that the resin component remains on the surface of the chip activated by plasma after peeling off the tape. When it exceeds 1,500,000, not only the solubility in a solvent decreases and it becomes difficult to form a uniform coating layer, but also the curing efficiency by heat curing or energy beam curing decreases. As a result, there is a problem that the resin component remains.

１−２．熱硬化剤
本発明の粘着剤組成物において、熱硬化剤は、前記アクリル共重合体の架橋構造を形成するために用いられる。このための熱硬化剤としては、具体的に、メラミン系、ポリアジリジン系、アリールイソシアネート（ａｒｙｌ ｉｓｏｃｙａｎａｔｅ）系などの熱硬化剤を用いる。 1-2. Thermosetting agent In the adhesive composition of this invention, a thermosetting agent is used in order to form the crosslinked structure of the said acrylic copolymer. As the thermosetting agent for this purpose, specifically, a thermosetting agent such as a melamine type, a polyaziridine type or an aryl isocyanate is used.

メラミン系熱硬化剤としては、例えば、ｎ−ブチル化メラミン、イソ−ブチル化メラミンおよびｎ−ブチル化メラミン−ベンゾグアナミンなどがある。   Examples of the melamine thermosetting agent include n-butylated melamine, iso-butylated melamine, and n-butylated melamine-benzoguanamine.

ポリアジリジン系硬化剤としては、例えば、プロピレンイミン（アジリジン）、トリス（２−メチル−１−アジリジンイル）ホスフィンオキシドなどがある。   Examples of the polyaziridine-based curing agent include propyleneimine (aziridine) and tris (2-methyl-1-aziridinyl) phosphine oxide.

アリールイソシアネート系熱硬化剤としては、例えば、メチレンジフェニルジイソシアネート（Ｍｅｔｈｙｌｅｎｅ Ｄｉｐｈｅｎｙｌ Ｄｉｉｓｏｃｙａｎａｔｅ；ＭＤＩ）、トルエンジイソシアネート（Ｔｏｌｕｅｎｅ Ｄｉｉｓｏｃｙａｎａｔｅ；ＴＤＩ）などがある。   Examples of the aryl isocyanate-based thermosetting agent include methylene diphenyl diisocyanate (MDI), toluene diisocyanate (TDI), and the like.

好ましくは、メラミン系硬化剤を用いる。前記メラミン系熱硬化剤の場合、加熱時に反応が行われ、配合量と架橋構造量が比例して形成されるという特徴がある。イソシアネート系熱硬化剤の場合、反応性に優れているため常温下でも反応が行われ得るという特徴があり、アジリジン系熱硬化剤の場合、低温硬化に有利であるため硬化時間を短縮し易いものの、高価であるという欠点がある。   Preferably, a melamine type curing agent is used. In the case of the melamine-based thermosetting agent, a reaction is performed during heating, and the blending amount and the crosslinked structure amount are formed in proportion. In the case of isocyanate-based thermosetting agents, there is a feature that the reaction can be performed even at room temperature because of its excellent reactivity. In the case of aziridine-based thermosetting agents, although it is advantageous for low-temperature curing, the curing time can be easily shortened. , Has the disadvantage of being expensive.

前記熱硬化剤の含量は、好ましくは、アクリル系共重合体１００重量部に対して、１〜２０重量部、さらに好ましくは、１〜１５重量部である。前記熱硬化剤の含量が１重量部未満である場合、架橋構造が正常に形成されない結果、低い内部凝集力によって基材の表面に粘着剤が残留してしまう虞があり、前記熱硬化剤が２０重量部を超える場合、必要以上に架橋化が進んでしまい表面硬さが高くなるため、粘着層の破砕などの現象が発生する虞があるため好ましくない。   The content of the thermosetting agent is preferably 1 to 20 parts by weight, and more preferably 1 to 15 parts by weight with respect to 100 parts by weight of the acrylic copolymer. When the content of the thermosetting agent is less than 1 part by weight, the crosslinked structure is not formed normally, and as a result, the adhesive may remain on the surface of the substrate due to low internal cohesive force. When the amount exceeds 20 parts by weight, the crosslinking proceeds more than necessary and the surface hardness increases, which is not preferable because a phenomenon such as crushing of the adhesive layer may occur.

前記熱硬化剤は、硬化反応を促進するために、有機酸系熱硬化促進剤が併用可能である。このために用いられる有機酸系熱硬化促進剤としては、無水フタル酸(Ｐｈｔｈａｌｉｃ Ａｎｈｙｄｒｉｄｅ)、無水テトラヒドロフタル酸(Ｔｅｔｒａ ｈｙｄｒｏ Ｐｈｔｈａｌｉｃ Ａｎｈｙｄｒｉｄｅ)、無水メチルテトラヒドロフタル酸(Ｍｅｔｈｙｌ Ｔｅｔｒａ Ｈｙｄｒｏ Ｐｈｔｈａｌｉｃ Ａｎｈｙｄｒｉｄｅ)、無水ヘキサヒドロフタル酸(Ｈｅｘａ Ｈｙｄｒｏ Ｐｈｔｈａｌｉｃ Ａｎｈｙｄｒｉｄｅ)、無水メチルナジック酸(Ｍｅｔｈｙｌ Ｎａｄｉｃ Ａｎｈｙｄｒｉｄｅ)などがある。前記熱硬化促進剤を用いる場合に、その含量は、前記アクリル系共重合体１００重量部に対して１５重量部未満であり、好ましくは、１０重量部未満である。前記熱硬化促進剤の含量が１５重量部を超える場合には、熱硬化剤の含量が高いときと同様に、表面硬さが高くなるため、粘着層の破砕などの現象が発生する虞がある。   The thermosetting agent can be used in combination with an organic acid thermosetting accelerator in order to accelerate the curing reaction. Examples of the organic acid-based thermosetting accelerator used for this purpose include phthalic anhydride (Phthalic Anhydride), tetrahydrophthalic anhydride (Tetra hydrophthalic anhydride), methyltetrahydrophthalic anhydride (Methyl Tetra Hydro Anhydride), Examples thereof include phthalic acid (Hexa Hydro Anhydride) and methyl nadic anhydride (Methyl Nadic Anhydride). When using the said thermosetting accelerator, the content is less than 15 weight part with respect to 100 weight part of said acrylic copolymers, Preferably, it is less than 10 weight part. When the content of the thermosetting accelerator exceeds 15 parts by weight, the surface hardness becomes high as in the case where the content of the thermosetting agent is high, so that there is a possibility that a phenomenon such as crushing of the adhesive layer may occur. .

１−３．エネルギー線硬化型樹脂
エネルギー線硬化型樹脂は、ＵＶ、ＥＢ、放射線などの強いエネルギー線により分子鎖にラジカルが生成されることにより架橋化がなされる成分である。波長数が２００〜４００ｎｍの紫外線を粘着剤内に含まれている光開始剤が吸収して反応性を示した後、樹脂の主成分であるモノマーと反応して重合されて硬化される。紫外線硬化型樹脂内に含まれている光開始剤がＵＶを受光すれば、光重合反応が開始されて、樹脂の主成分である単量体（Ｍｏｎｏｍｅｒ）と中間体（Ｏｌｉｇｏｍｅｒ）が瞬時に重合体（Ｐｏｌｙｍｅｒ）を形成して硬化される。 1-3. Energy ray curable resin The energy ray curable resin is a component that is cross-linked by generating radicals in the molecular chain by strong energy rays such as UV, EB, and radiation. After the photoinitiator contained in the adhesive absorbs ultraviolet rays having a wavelength number of 200 to 400 nm and exhibits reactivity, it reacts with the monomer as the main component of the resin and is polymerized and cured. When the photoinitiator contained in the UV curable resin receives UV, the photopolymerization reaction is started, and the monomer (Monomer) and the intermediate (Oligomer), which are the main components of the resin, instantly overlap. A polymer is formed to be cured.

前記エネルギー線硬化型樹脂は、重合形態に応じて、ラジカル重合型、ラジカル付加型、陽イオン重合型に分類される。各分類による反応性樹脂として、ラジカル重合型にはアクリレート系、ラジカル付加型にはポリエン／ポリチオール系およびスピラン樹脂系、陽イオン重合型にはエポキシ樹脂およびビニルエーテルが用いられる。好ましくは、アクリレート系反応性オリゴマーが用いられる。アクリレート系オリゴマーとしては、エポキシアクリレート（Ｅｐｏｘｙ ａｃｒｙｌａｔｅ）、ウレタンアクリレート（Ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、ポリエステルアクリレート（Ｐｏｌｙｅｓｔｅｒ ａｃｒｙｌａｔｅ）、シリコンアクリレート（Ｓｉｌｉｃｏｎｅ ａｃｒｙｌａｔｅ）があり、本発明においては、好ましくは、ウレタンアクリレートとシリコンアクリレートとの混合物の形で用いられる。これらは、後述するエネルギー線開始剤と一緒に反応してｓｅｍｉ−ＩＰＮ構造を形成するために用いられる。   The energy ray curable resin is classified into a radical polymerization type, a radical addition type, and a cation polymerization type according to the polymerization form. As a reactive resin according to each classification, an acrylate type is used for the radical polymerization type, a polyene / polythiol type and a spirane resin type are used for the radical addition type, and an epoxy resin and vinyl ether are used for the cation polymerization type. Preferably, an acrylate reactive oligomer is used. Examples of the acrylate oligomer include epoxy acrylate, urethane acrylate, polyester acrylate, and silicon acrylate. In the present invention, preferably, urethane acrylate and silicon acrylate are used. In the form of a mixture of These are used to react with an energy ray initiator described later to form a semi-IPN structure.

１−３−１．エネルギー線硬化型ウレタン樹脂
エネルギー線硬化型ウレタン樹脂は、粘着剤の優れた耐熱特性を与えるために用いられる。前記エネルギー線硬化型ウレタン樹脂としては、アリファチック２官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｄｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アリファチック３官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｔｒｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アリファチック６官能性ウレタンアクリレート（Ａｌｉｐｈａｔｉｃ ｈｅｘａｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アロマチック２官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｄｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アロマチック３官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｔｒｉｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、アロマチック６官能性ウレタンアクリレート（Ａｒｏｍａｔｉｃ ｈｅｘａｆｕｎｃｔｉｏｎａｌ ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）などがある。 1-3-1. Energy ray curable urethane resin The energy ray curable urethane resin is used to give excellent heat resistance characteristics of the pressure-sensitive adhesive. Examples of the energy ray curable urethane resin include aliphatic difunctional urethane acrylate (aliphatic difunctional urethane acrylate), aliphatic trifunctional urethane acrylate (aliphatic trifunctional urethane acrylate), and aliphatic hexafunctional urethane acrylate (aliphatic hexahydric urethane acrylate). Tic bifunctional urethane acrylate (aromatic difunctional urethane acrylate), aromatic trifunctional urethane acrylate (aromatic trifunctional urethane acrylate), Matic hexafunctional urethane acrylate (Aromatic hexafunctional urethane acrylate) and the like.

前記エネルギー線硬化型ウレタン樹脂の含量は、前記アクリル系共重合体１００重量部に対して、５〜４０重量部、好ましくは、５〜３５重量部である。前記エネルギー線硬化型ウレタン樹脂の含量が５重量部未満である場合、架橋構造が正常に形成されない結果、内部凝集力が低下し、粘着剤残渣が発生する虞がある。前記エネルギー線硬化型オリゴマー樹脂の含量が４０重量部を超える場合、表面硬化度が高くて粘着層が引っ掻かれ易いため、既存の粘着層のように、モールドの角部によって突き刺されるという現象が発生する虞がある。   The content of the energy ray curable urethane resin is 5 to 40 parts by weight, preferably 5 to 35 parts by weight with respect to 100 parts by weight of the acrylic copolymer. When the content of the energy ray curable urethane resin is less than 5 parts by weight, the cross-linked structure is not normally formed. As a result, the internal cohesive force is lowered, and an adhesive residue may be generated. When the content of the energy ray curable oligomer resin exceeds 40 parts by weight, since the degree of surface curing is high and the adhesive layer is easily scratched, there is a phenomenon that it is pierced by the corner of the mold like the existing adhesive layer. May occur.

１−３−２．エネルギー線硬化型シリコン樹脂
エネルギー線硬化型シリコン樹脂は、粘着剤の優れた離型特性を与えるために用いられる。前記エネルギー線硬化型シリコン樹脂としては、シリコンジアクリレート（Ｓｉｌｉｃｏｎｅ ｄｉａｃｒｙｌａｔｅ）、シリコンヘキサアクリレート（Ｓｉｌｉｃｏｎｅ ｈｅｘａａｃｒｙｌａｔｅ）、シリコンポリエステルアクリレート（Ｓｉｌｉｃｏｎｅ Ｐｏｌｙｅｓｔｅｒ ａｃｒｙｌａｔｅ）、シリコンウレタンアクリレート（Ｓｉｌｉｃｏｎｅ Ｕｒｅｔｈａｎｅ ａｃｒｙｌａｔｅ）、シリコンウレタンメタアクリレート（Ｓｉｌｉｃｏｎｅ Ｕｒｅｔｈａｎｅ ｍｅｔｈａｃｒｙｌａｔｅ）などがある。 1-3-2. Energy ray curable silicone resin The energy ray curable silicone resin is used to give excellent release properties of the pressure-sensitive adhesive. Examples of the energy ray-curable silicone resin include silicon diacrylate, silicon hexaacrylate, silicon polyester acrylate, silicon urethane acrylate, and silicon urethane methacrylate. (Urethane methacrylate).

エネルギー線硬化型シリコン樹脂の含量は、前記アクリル系共重合体１００重量部に対して、好ましくは、０．１〜５重量部、さらに好ましくは、１〜５重量部である。エネルギー線硬化型シリコン樹脂の含量が０．１重量部未満である場合、架橋構造が正常に形成されない結果、内部凝集力が低下し、しかも、粘着剤残渣が発生する虞がある。前記エネルギー線硬化型シリコン樹脂の含量が５重量部を超える場合、表面硬化度が高くて粘着層が引っ掻かれ易いため、既存の粘着層のようにモールドモールドの角部によって突き刺される現象が発生する虞がある。   The content of the energy ray curable silicone resin is preferably 0.1 to 5 parts by weight, more preferably 1 to 5 parts by weight with respect to 100 parts by weight of the acrylic copolymer. When the content of the energy ray curable silicone resin is less than 0.1 parts by weight, the cross-linked structure is not normally formed. As a result, the internal cohesive force is reduced, and an adhesive residue may be generated. When the content of the energy ray curable silicone resin exceeds 5 parts by weight, the surface hardening degree is high and the adhesive layer is easily scratched, so that a phenomenon of being pierced by the corner of the mold mold like the existing adhesive layer occurs. There is a risk of doing.

１−５．エネルギー線開始剤
前記エネルギー線開始剤は、紫外線のエネルギーを吸収して光重合反応を開始する機能をする。このために用いられる開始剤としては、ベンジルジメチルケタール、ヒドロキシシクロヘキシルフェニルケトン、ヒドロキシジメチルアセトフェノン、メチル−［４−メチルチオフェニル］−２−モルフォリンプロパノン、４−ベンジル−４´−メチルジフェニルスルフィド、イソプロピルチオキサントン、２−クロロチオキサントン、エチル−４−ジメチルアミノベンゾエート、２−エチルヘキシル−４−ジメチルアミノベンゾエート、ベンゾフェノン、４−メチルベンゾフェノン、メチル−オルト−ベンゾ−ベンゾエート、メチルベンゾイルホルメート、４−フェニルベンゾフェノン、２、４、６−トリメチルベンゾイル−ジフェニルホスフィン、２−ヒドロキシ−１、２−ジフェニルエタノンなどが使用可能である。 1-5. Energy Beam Initiator The energy beam initiator functions to absorb ultraviolet energy and initiate a photopolymerization reaction. Initiators used for this purpose include benzyl dimethyl ketal, hydroxycyclohexyl phenyl ketone, hydroxydimethyl acetophenone, methyl- [4-methylthiophenyl] -2-morpholine propanone, 4-benzyl-4'-methyldiphenyl sulfide, Isopropylthioxanthone, 2-chlorothioxanthone, ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, benzophenone, 4-methylbenzophenone, methyl-ortho-benzo-benzoate, methylbenzoylformate, 4-phenylbenzophenone 2,4,6-trimethylbenzoyl-diphenylphosphine, 2-hydroxy-1,2-diphenylethanone and the like can be used.

前記エネルギー線開始剤の含量は、前記アクリル系共重合体１００重量部に対して、１〜１５重量部、好ましくは、１〜１０重量部である。前記エネルギー線開始剤の含量が、前記エネルギー線硬化型ウレタン樹脂１００重量部に対して、１重量部未満である場合、エネルギー線硬化型樹脂の硬化が正常に行われなくなる虞があり、１５重量部を超える場合には、反応に与らずに残留するエネルギー線開始剤が粘着剤残渣となって半導体パッケージを汚染させる汚染源になる虞がある。   The content of the energy ray initiator is 1 to 15 parts by weight, preferably 1 to 10 parts by weight with respect to 100 parts by weight of the acrylic copolymer. When the content of the energy beam initiator is less than 1 part by weight with respect to 100 parts by weight of the energy beam curable urethane resin, there is a possibility that the curing of the energy beam curable resin may not be normally performed. In the case where the amount exceeds 50 parts, the energy ray initiator remaining without being subjected to the reaction may become a pressure-sensitive adhesive residue and become a contamination source that contaminates the semiconductor package.

１−６．さらなる添加剤
また、前記粘着層組成物は、上記の成分に加えて、溶媒および光増減剤、老化防止剤、レベリング剤などの添加剤がさらに使用可能である。 1-6. Further Additives In addition to the above-described components, the adhesive layer composition may further use additives such as a solvent and a light increase / decrease agent, an antiaging agent, and a leveling agent.

２．マスキングテープ
図１に基づき、本発明の粘着剤組成物が用いられるマスキングテープを説明する。図１は、本発明の粘着剤が適用されたモールドアンダーフィル（ＭＵＦ）工程のマスキングテープに対する模式的断面図である。図１を参照すれば、前記マスキングテープ１０は、耐熱性基材１１と、前記耐熱性基材１１の片面または両面に形成された帯電防止層１２、１２´と、前記帯電防止層１２または１２´の上に形成された粘着剤層１３と、から構成される。 2. Masking tape Based on FIG. 1, the masking tape in which the adhesive composition of this invention is used is demonstrated. FIG. 1 is a schematic cross-sectional view of a masking tape in a mold underfill (MUF) process to which an adhesive of the present invention is applied. Referring to FIG. 1, the masking tape 10 includes a heat resistant substrate 11, an antistatic layer 12, 12 ′ formed on one or both sides of the heat resistant substrate 11, and the antistatic layer 12 or 12. It is comprised from the adhesive layer 13 formed on '.

２−１．耐熱性基材
前記耐熱性基材は、ポリイミドフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンナフタレートフィルムおよびポリブチレンテレフタレートフィルムなどのポリエステルフィルムなどが挙げられる。前記基材フィルムの厚さは、通常、１０〜１００μｍであり、好ましくは、１０〜５０μｍであり、さらに好ましくは、２５〜５０μｍである。 2-1. Heat-resistant substrate Examples of the heat-resistant substrate include polyester films such as polyimide films, polyethylene terephthalate films, polyethylene naphthalate films, and polybutylene terephthalate films. The thickness of the base film is usually 10 to 100 μm, preferably 10 to 50 μm, and more preferably 25 to 50 μm.

また、前記基材フィルムには、帯電防止層および／または粘着層との密着維持性などを高めるために、マット処理、コロナ放電処理、プライマー処理および架橋結合処理などの通常の物理的または化学的な表面処理が施されてもよい。   In addition, the base film may be provided with a normal physical or chemical treatment such as mat treatment, corona discharge treatment, primer treatment, and cross-linking treatment in order to enhance adhesion maintenance with the antistatic layer and / or the adhesive layer. Surface treatment may be performed.

２−２．帯電防止層
さらに、前記基材フィルムの片面または両面には、帯電防止のための帯電防止層がコーティングされる必要がある。このとき、この帯電防止層には、界面活性剤、伝導性高分子などの帯電防止特性を有するコーティング性物質が使用可能であるが、好ましくは、帯電防止の尺度である表面抵抗値も低く、導電層の表面転移が少なく、湿度にあまり敏感ではなく、帯電性能も永久的に維持される伝導性高分子から導電層を構成するものとする。一般に、帯電防止コーティング用に用いられる高分子は、ポリアニリン、ポリピロール、ポリチオフェンなどである。さらに、ポリアニリン、ポリピロール、ポリチオフェンだけではなく、その誘導体なども使用可能である。かような伝導性コーティング液を基材フィルムの表面に円滑にコーティングするためにバインダーと混合するが、バインダーとしては、電気が伝達可能なアクリル、ウレタン、エステル、エーテル、エポキシ、アミド、イミド、スチレン系樹脂などが使用可能である。また、好ましくは、前記帯電防止層は、０．１〜１μｍにコーティングすることを特徴とする。これは、０．１μｍ以内に薄くコーティングすれば、所望の帯電特性が発現され難く、１μｍを超過するよう厚くコーティングすれば、必要以上の帯電性能が発現されてしまうとともに、伝導性高分子が高価であるため費用負担がある他、導電層の上に粘着層をコーティングする上で円滑にコーティングできなくなるという不都合がある。 2-2. Antistatic Layer Furthermore, it is necessary to coat an antistatic layer for antistatic on one side or both sides of the base film. At this time, for the antistatic layer, a coating material having antistatic properties such as a surfactant and a conductive polymer can be used, but preferably the surface resistance value as a measure of antistatic is also low, The conductive layer is formed of a conductive polymer that has a small surface transition of the conductive layer, is not very sensitive to humidity, and whose charging performance is permanently maintained. In general, polymers used for antistatic coating are polyaniline, polypyrrole, polythiophene and the like. Furthermore, not only polyaniline, polypyrrole and polythiophene but also derivatives thereof can be used. In order to smoothly coat such a conductive coating solution on the surface of the base film, it is mixed with a binder. As the binder, acrylic, urethane, ester, ether, epoxy, amide, imide, styrene, which can transmit electricity, are used. Series resins can be used. Preferably, the antistatic layer is coated to 0.1 to 1 μm. This is because if the coating is thin within 0.1 μm, the desired charging characteristics are hardly exhibited, and if the coating is thick so as to exceed 1 μm, the charging performance is more than necessary, and the conductive polymer is expensive. Therefore, there is an inconvenience that in addition to a cost burden, it is impossible to smoothly coat the adhesive layer on the conductive layer.

２−３．粘着剤層
前記帯電防止層の上に形成される粘着剤層の組成は、上述の通りである。 2-3. Adhesive layer The composition of the adhesive layer formed on the antistatic layer is as described above.

一方、粘着剤層の厚さは２〜３０μｍであることが好ましい。厚さが２μｍ未満であれば、被着剤の公差によってモールドの物性が低下し、厚さが３０μｍを超えると、円滑な紫外線硬化効率が期待し難く、これにより、粘着層の物性が低下して工程中に加わる圧力および刺激に弱くなる。   On the other hand, the thickness of the pressure-sensitive adhesive layer is preferably 2 to 30 μm. If the thickness is less than 2 μm, the physical properties of the mold deteriorate due to the tolerance of the adherent, and if the thickness exceeds 30 μm, it is difficult to expect smooth UV curing efficiency, which reduces the physical properties of the adhesive layer. Weakens to pressure and irritation applied during the process.

前記粘着剤層のポリシュドシリコンウェーハ（ｐｏｌｉｓｈｅｄ ｓｉｌｉｃｏｎ ｗａｆｅｒ）面に対する常温粘着力は、５０ｇｆ／ｉｎｃｈ以下であり、さらに好ましくは、３０ｇｆ／ｉｎｃｈ以下である。粘着力が５０ｇｆ／ｉｎｃｈを超えると、ＭＵＦ工程が行われる間にプラズマ処理により活性化されたチップ（Ｃｈｉｐ）の表面に残渣を生じさせる虞がある。   The room temperature adhesive force of the pressure-sensitive adhesive layer to the polished silicon wafer surface is 50 gf / inch or less, and more preferably 30 gf / inch or less. When the adhesive strength exceeds 50 gf / inch, there is a possibility that a residue is generated on the surface of the chip (Chip) activated by the plasma treatment during the MUF process.

前記粘着剤層の表面抵抗は、１０11Ω／□以下である。前記粘着剤層の表面抵抗が１０11Ω／□を超えると、工程中に静電気不良を生じさせて完成されたパッケージの電気的な性能を低下または喪失させる虞がある。 The pressure-sensitive adhesive layer has a surface resistance of 10 11 Ω / □ or less. When the surface resistance of the pressure-sensitive adhesive layer exceeds 10 11 Ω / □, there is a risk of causing a static electricity failure during the process and reducing or losing the electrical performance of the completed package.

３．ＭＵＦ工程
モールドアンダーフィル（ＭＵＦ）工程は、ＰｏＰパッケージの底層を絶縁樹脂により保護するが、接地として活用されるチップの表面を露出させるための工程であり、図２にその工程図を示す。 3. MUF Process The mold underfill (MUF) process is a process for exposing the surface of a chip used as a ground, although the bottom layer of the PoP package is protected by an insulating resin, and its process diagram is shown in FIG.

１）フィルム貼着工程
ＭＵＦ工程は、１７５°Ｃ天板／底板モールド１４、１５内に行われ、天板モールド１４に真空を用いて耐熱性基材フィルム１１を貼り付ける。このとき、フィルムの引張り強さが低過ぎると、フィルムがやぶれる虞があり、伸び率が低過ぎると、モールド内のキャビティ（Ｃａｖｉｔｙ）に密着できず、フィルムが浮いてしまう現象が発生することがある。本発明において基材として用いたＰＥＮフィルムは、これに適した１５ｋｇ／ｍｍ2以上の引張り強さおよび８０％以上の伸び率を保持することにより、モールド貼着特性に優れた特性を有する。 1) Film sticking process A MUF process is performed in 175 degreeC top plate / bottom plate molds 14 and 15, and heat resistant base film 11 is stuck on top plate mold 14 using vacuum. At this time, if the tensile strength of the film is too low, the film may be damaged. If the elongation rate is too low, the film may not be in close contact with the cavity in the mold and the film may float. is there. The PEN film used as a substrate in the present invention has excellent properties for mold adhesion by maintaining a tensile strength of 15 kg / mm 2 or more and an elongation of 80% or more suitable for this.

２）アンダーフィル工程
フィルムを貼り付けた後、天板モールド１４が下降して底板モールド１５と係合され、これにより、流れ性を有するＥＭＣ１９によってチップ１７の周縁が満たされ、チップの表面は粘着剤層１３によってマスキングされる。 2) Underfill process After the film is attached, the top plate mold 14 is lowered and engaged with the bottom plate mold 15, whereby the peripheral edge of the chip 17 is filled with the EMC 19 having flowability, and the surface of the chip is adhered. Masked by the agent layer 13.

このとき、粘着層の凝集特性が低下すれば、ＥＭＣ１９がチップ１７の表面に浸透してモールドフラッシュが発生することがある。本発明の耐熱アクリル粘着剤層１３は、耐熱特性および凝集力に優れたアクリル共重合体を構成することにより、モールドフラッシュを防ぐことができる。   At this time, if the cohesive properties of the adhesive layer deteriorate, the EMC 19 may permeate the surface of the chip 17 and mold flash may occur. The heat-resistant acrylic pressure-sensitive adhesive layer 13 of the present invention can prevent mold flash by constituting an acrylic copolymer having excellent heat resistance characteristics and cohesive strength.

３）フィルムの引き剥がし工程
アンダーフィル工程後、天板モールド１４が上昇して、基材１１がチップ１７の表面に硬化によりくっついているＥＭＣ１９から引き剥がされる。 3) Film peeling process After the underfill process, the top plate mold 14 is raised, and the base material 11 is peeled off from the EMC 19 which is stuck to the surface of the chip 17 by curing.

このとき、粘着剤層１３の離型力が足りない場合、基材フィルム１１が引き剥がされ難いか、あるいは、ＥＭＣ１９またはチップ１７の表面に残渣を残すことがある。本発明の耐熱アクリル粘着剤層１３は、エネルギー線硬化型シリコンアクリレートを含んでいて優れた離型特性を保有しているため、フィルムが引き剥がされ易いという特性を有する。   At this time, if the release force of the pressure-sensitive adhesive layer 13 is insufficient, the base film 11 may be difficult to peel off, or a residue may remain on the surface of the EMC 19 or the chip 17. Since the heat-resistant acrylic pressure-sensitive adhesive layer 13 of the present invention contains energy ray-curable silicon acrylate and has excellent release characteristics, it has a characteristic that the film is easily peeled off.

以下、実施例および比較例を挙げて、本発明の構成およびそれによる効果をより詳述する。しかしながら、これらの実施例は本発明をより具体的に説明するための単なる例示に過ぎず、本発明の範囲がこれらの実施例に限定されることはない。   Hereinafter, the configuration of the present invention and the effects thereof will be described in more detail with reference to examples and comparative examples. However, these examples are merely examples for more specifically describing the present invention, and the scope of the present invention is not limited to these examples.

＜実施例１＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。この後、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）２重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムの片面に約１０μｍの厚さで塗布して、１５０°Ｃで５分間乾燥した後（熱硬化）、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Example 1>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Thereafter, 25 parts by weight (based on solid content) of Aliphatic polyurethane acrylate (Nippon Gosei Co., Ltd., UV7600B80), which is an energy ray curable oligomer resin, 2 parts by weight (based on solid content) of silicon hexaacrylate (manufactured by CYTEC, EB1360) ), 1 part by weight of a phosphine-based energy ray initiator (manufactured by CYTEC, DAROCUR TPO) is stirred for 1 hour, and 5 parts by weight of melamine-based thermosetting agent (SM-20, SM-20) (based on solid content) Then, 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (S-20, manufactured by Summon Co., Ltd.) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to one side of a 38 μm PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and the thickness was about 10 μm, and the temperature was 150 ° C. for 5 minutes. After drying (thermal curing), energy ray curing was performed with a light amount of about 500 W using a UV irradiation device to produce a masking tape.

＜実施例２＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）４重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍの厚さで塗布し、１５０°Ｃで５分間乾燥した後、エネルギー線硬化を行ってマスキングテープを製造した。 <Example 2>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (based on solid content) of Aliphatic polyurethane acrylate (manufactured by Nippon Gosei Co., Ltd., UV7600B80) which is an energy ray curable oligomer resin, 4 parts by weight (based on solid content) of silicon hexaacrylate (manufactured by CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (CYTEC, DAROCUR TPO) was mixed and stirred for 1 hour, and 5 parts by weight (based on solid content) of a melamine-based thermosetting agent (SM20, SM-20), 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (manufactured by Summon Co., Ltd., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray hardening was performed and the masking tape was manufactured.

＜実施例３＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）２重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）３重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）１重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Example 3>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (solid content basis) of an aliphatic polyurethane acrylate (manufactured by Nippon Gosei Co., Ltd., UV7600B80) which is an energy ray curable oligomer resin, and 2 parts by weight (solid content basis) of silicon hexaacrylate (manufactured by CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (manufactured by CYTEC, DAROCUR TPO) was stirred for 1 hour, and 3 parts by weight (based on solid content) of a melamine-based thermosetting agent (manufactured by Summon, SM-20), 1 part by weight (based on solid content) of an organic acid thermosetting accelerator (Summon Corp., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray curing was performed with a light amount of about 500 W using a UV irradiation device, and a masking tape was manufactured.

＜実施例４＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）１重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行ってマスキングテープを製造した。 <Example 4>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Subsequently, 25 parts by weight (solid content basis) of an alipatic polyurethane acrylate (manufactured by Nippon Gosei Co., Ltd., UV7600B80), which is an energy ray curable oligomer resin, 1 part by weight (based on solid content) of silicon hexaacrylate (CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (CYTEC, DAROCUR TPO) was mixed and stirred for 1 hour, and 5 parts by weight (based on solid content) of a melamine-based thermosetting agent (SM20, SM-20), 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (manufactured by Summon Co., Ltd., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. The masking tape was manufactured by performing energy ray curing with a light amount of about 500 W using a UV irradiation apparatus.

＜実施例５＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）５重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Example 5>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (solid content basis) of an aliphatic polyurethane acrylate (manufactured by Nippon Gosei Co., Ltd., UV7600B80) which is an energy ray curable oligomer resin, and 5 parts by weight (solid content basis) of silicon hexaacrylate (manufactured by CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (CYTEC, DAROCUR TPO) was mixed and stirred for 1 hour, and 5 parts by weight (based on solid content) of a melamine-based thermosetting agent (SM20, SM-20), 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (manufactured by Summon Co., Ltd., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray curing was performed with a light amount of about 500 W using a UV irradiation device, and a masking tape was manufactured.

＜比較例１＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）１０重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Comparative Example 1>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (based on solid content) of Aliphatic Polyurethane Acrylate (Nippon Gosei Co., Ltd., UV7600B80), which is an energy ray curable oligomer resin, 10 parts by weight (based on solid content) of silicon hexaacrylate (CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (CYTEC, DAROCUR TPO) was mixed and stirred for 1 hour, and 5 parts by weight (based on solid content) of a melamine-based thermosetting agent (SM20, SM-20), 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (manufactured by Summon Co., Ltd., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray curing was performed with a light amount of about 500 W using a UV irradiation device, and a masking tape was manufactured.

＜比較例２＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）３重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、イソシアネート系熱硬化剤（ダウコーニング社製、ＣＥ１３８）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Comparative example 2>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (solid content basis) of an aliphatic polyurethane acrylate (Nihon Gosei Co., Ltd., UV7600B80) which is an energy ray-curable oligomer resin, 3 parts by weight (solid content basis) of silicon hexaacrylate (CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (manufactured by CYTEC, DAROCUR TPO) is mixed and stirred for 1 hour, and 3 parts by weight (based on solid content) of an isocyanate-based thermosetting agent (manufactured by Dow Corning, CE138) is added. The mixture was further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray curing was performed with a light amount of about 500 W using a UV irradiation device, and a masking tape was manufactured.

＜比較例３＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０5Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムに、約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Comparative Example 3>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (based on solid content) of Aliphatic Polyurethane Acrylate (Nippon Gosei Co., Ltd., UV7600B80), which is an energy ray curable oligomer resin, and 1 part by weight of a phosphine-based energy ray initiator (manufactured by CYTEC, DAROCUR TPO) Mix and stir for 1 hour, 5 parts by weight of melamine thermosetting agent (Sumon, SM-20) (based on solid content), 3 parts by weight of organic acid thermosetting accelerator (Sumon, A-20) (Solid content basis) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to a 38 μm thick PEN film coated with an antistatic coating solution having a surface resistance of 10 5 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Then, energy ray curing was performed with a light amount of about 500 W using a UV irradiation device, and a masking tape was manufactured.

＜比較例４＞
アクリル系共重合体（サモン社製、ＡＴ５１００）１００重量部（固形分基準）に対してエチルアセテート（ＥＡ）６００重量部を投入し、１時間攪拌した。次いで、エネルギー線硬化型オリゴマー樹脂であるアリファチックポリウレタンアクリレート（日本合成社製、ＵＶ７６００Ｂ８０）２５重量部（固形分基準）、シリコンヘキサアクリレート（ＣＹＴＥＣ社製、ＥＢ１３６０）２重量部（固形分基準）、ホスフィン系エネルギー線開始剤（ＣＹＴＥＣ社製、ＤＡＲＯＣＵＲ ＴＰＯ）１重量部を混合して１時間攪拌し、メラミン系熱硬化剤（サモン社製、ＳＭ−２０）５重量部（固形分基準）、有機酸系熱硬化促進剤（サモン社製、Ａ−２０）３重量部（固形分基準）を投入して１時間さらに攪拌した。前記粘着剤組成物を、両面に１０9Ω／□の表面抵抗を有する帯電防止コーティング液が塗布された３８μｍのＰＥＮフィルムの片面に約１０μｍ厚さで塗布し、１５０°Ｃで５分間乾燥した後、ＵＶ照射装置を用いて約５００Ｗの光量でエネルギー線硬化を行い、マスキングテープを製造した。 <Comparative example 4>
600 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solid content) of an acrylic copolymer (manufactured by Summon, AT5100) and stirred for 1 hour. Next, 25 parts by weight (solid content basis) of an aliphatic polyurethane acrylate (manufactured by Nippon Gosei Co., Ltd., UV7600B80) which is an energy ray curable oligomer resin, and 2 parts by weight (solid content basis) of silicon hexaacrylate (manufactured by CYTEC, EB1360) , 1 part by weight of a phosphine-based energy ray initiator (CYTEC, DAROCUR TPO) was mixed and stirred for 1 hour, and 5 parts by weight (based on solid content) of a melamine-based thermosetting agent (SM20, SM-20), 3 parts by weight (based on solid content) of an organic acid thermosetting accelerator (manufactured by Summon Co., Ltd., A-20) was added and further stirred for 1 hour. The pressure-sensitive adhesive composition was applied to one side of a 38 μm PEN film coated with an antistatic coating liquid having a surface resistance of 10 9 Ω / □ on both sides, and dried at 150 ° C. for 5 minutes. Thereafter, energy ray curing was performed with a UV irradiation device with a light amount of about 500 W to produce a masking tape.

＜評価＞
前記実施例および比較例に従い製造されたＤＥＦＣＰの製造のためのＭＵＦ工程用マスキングテープをそれぞれ評価し、下記表１に示す。各評価項目は、既存の粘着層に比べて改善された粘着層の特性を把握するための評価項目から構成し、下記の評価方法によって行われた。 <Evaluation>
The masking tapes for MUF process for the production of DEFCP produced according to the above examples and comparative examples were evaluated and shown in Table 1 below. Each evaluation item was composed of evaluation items for grasping the properties of the pressure-sensitive adhesive layer improved compared to the existing pressure-sensitive adhesive layer, and was performed by the following evaluation method.

１．ＰＣＢ残渣
ＰＣＢ基板に粘着フィルムを貼り付け、周縁が尖っているモールド欠片を載せた後、天／底板１７５°Ｃのホットプレス機器にて７００ＭＰａの圧力にて押し付けた。次いで、顕微鏡を用いてＰＣＢ基板に対する粘着層残渣の存否を確認し、残渣がない場合を良好（Ｏ）とし、残渣が発生した場合を不良（Ｘ）とした。 1. PCB residue An adhesive film was attached to a PCB substrate, and a mold piece having a sharp edge was placed thereon, and then pressed with a hot press machine at 175 ° C. at a pressure of 700 MPa. Subsequently, the presence or absence of the adhesive layer residue with respect to a PCB board | substrate was confirmed using the microscope, the case where there was no residue was made favorable (O), and the case where a residue generate | occur | produced was made into defect (X).

２．ＥＭＣの跡と離型特性
粘着フィルムの上にＥＭＣペレットを載せた後、天／底板１７５°Ｃのホットプレス機器にて７００ＭＰａの圧力にてモールディングを行った。ＥＭＣの跡は、モールディングされた表面がきれいな場合を良好（Ｏ）とし、跡が発生したり粘着層側にＥＭＣが超えてきた場合を不良（Ｘ）とした。離型特性は、粘着フィルムを引き剥がすときに、モールディング面に粘着剤残渣なしに弱い力でも容易に引き剥がされる場合を良好（Ｏ）とし、残渣が発生したり引き剥がされ難い場合を不良（Ｘ）とした。 2. EMC Trace and Release Characteristics After placing the EMC pellets on the adhesive film, molding was performed at 700 MPa with a hot press machine at 175 ° C on the top / bottom plate. The EMC trace was defined as good (O) when the molded surface was clean, and defective (X) when trace was generated or the EMC exceeded the adhesive layer side. The mold release characteristics are good when the adhesive film is peeled off easily even with a weak force without adhesive residue on the molding surface (O), and poor when the residue is generated or difficult to peel off ( X).

評価に用いたそれぞれのＥＭＣの種類および特性につき、下記表１に示す。   Table 1 below shows the types and characteristics of each EMC used in the evaluation.

３．粘着力
粘着フィルムを長手方向に幅１ｉｎｃｈ、長さ１５ｃｍに切り出した後、ポリシュドウェーハの上に、粘着フィルムを、２ｋｇのローラーを用いて常温往復２回のラミネーションを行った。次いで、万能材料試験機（ＵＴＭ）を用いて３００ｍｍ／ｍｉｎの速度にて１８０°粘着力を測定した。 3. Adhesive strength After the adhesive film was cut into a length of 1 inch and a length of 15 cm in the longitudinal direction, the adhesive film was laminated on the polished wafer twice at room temperature using a 2 kg roller. Subsequently, 180 degree | times adhesive force was measured at the speed | rate of 300 mm / min using the universal material testing machine (UTM).

４．表面抵抗
表面抵抗測定機（アドバンテスト社製、Ｒ８３４０Ａ）を用いて、電圧１００Ｖの印加時における粘着フィルムの表面抵抗を測定した。 4). Surface resistance The surface resistance of the adhesive film when a voltage of 100 V was applied was measured using a surface resistance measuring device (manufactured by Advantest, R8340A).

前記評価の結果を下記表２にまとめて示す。   The results of the evaluation are summarized in Table 2 below.

前記表１から明らかなように、本発明に係る実施例１から実施例５の場合には、あらゆる主な要求特性を満足していた。しかしながら、シリコン系オリゴマーを過量投入した比較例１の場合、他の特性はいずれも良好であったものの、表面硬化度が高くてＰＣＢ残渣が発生し、イソシアネート系硬化剤を投入した比較例２の場合、流れ性が良くないパナソニック ＥＣＯＭ Ｅ ＥＭＣに対してＥＭＣが過度に硬化された粘着層に浸透することにより、ＥＭＣの表面に跡が発生した。イソシアネート系硬化剤は、常温下でも反応が行われる程度に速い反応性を保有しているというメリットがあるが、過硬化が進んで表面硬さがやや高くなるという特徴がある。このため、流れ性が良好なＥＭＣの場合には、粘着層との接触面に浸透されずに横広がりに良好に広がるため問題を引き起こさないものの、流れ性が良くないＥＭＣの場合、粘着層と接触される過程で表面硬さが高い粘着層にＥＭＣが浸透しやすく、その結果、ＥＭＣの表面に不均一な跡が発生してしまう。このため、比較例２を除く他の実施例および比較例の場合、配合量に見合う分だけ架橋構造が形成されるメラミン系熱硬化剤と反応性を増大させる熱硬化促進剤とを併用することにより過硬化を防ぐとともに表面硬さを調節してＥＭＣの種類によらずにあらゆるＥＭＣに対して表面の跡が発生しないようにした。シリコン系オリゴマーを除去した比較例３の場合、ＥＭＣから引き剥がされ難く、粘着力も１００ｇｆを超えていた。１０9Ω／□の表面抵抗を有する帯電防止コーティング液を両面に塗布した比較例４の場合、粘着面の表面抵抗が１０14Ω／□であって、帯電防止機能を失っていた。 As is clear from Table 1, all of the main required characteristics were satisfied in the case of Examples 1 to 5 according to the present invention. However, in Comparative Example 1 in which an excessive amount of silicon-based oligomer was added, all other characteristics were good, but the degree of surface curing was high, PCB residues were generated, and Comparative Example 2 in which an isocyanate-based curing agent was added. In this case, traces were generated on the surface of the EMC by infiltrating the adhesive layer where the EMC was excessively cured with respect to the Panasonic ECOM E EMC having poor flowability. Isocyanate-based curing agents have a merit that they are fast enough to react even at room temperature, but are characterized by a slight increase in surface hardness due to excessive curing. For this reason, in the case of EMC with good flowability, it does not permeate the contact surface with the adhesive layer and spreads laterally well, causing no problem, but in the case of EMC with poor flowability, EMC easily penetrates into the adhesive layer having a high surface hardness in the process of contact, and as a result, uneven marks are generated on the surface of the EMC. For this reason, in the case of other examples and comparative examples other than Comparative Example 2, a melamine thermosetting agent in which a crosslinked structure is formed corresponding to the blending amount and a thermosetting accelerator that increases the reactivity are used in combination. Thus, overcuring was prevented and the surface hardness was adjusted so that no trace of the surface was generated for any EMC regardless of the type of EMC. In the case of Comparative Example 3 in which the silicon-based oligomer was removed, it was difficult to peel off from the EMC, and the adhesive strength exceeded 100 gf. In the case of Comparative Example 4 in which an antistatic coating liquid having a surface resistance of 10 9 Ω / □ was applied to both surfaces, the surface resistance of the adhesive surface was 10 14 Ω / □, and the antistatic function was lost.

以上、本発明の好適な実施例について詳述したが、本発明はこれらに何ら限定されるものではなく、本発明の技術的思想の範囲内において様々な形態に変形および修正可能であることは当業者にとって自明であり、このような変形および修正が特許請求の範囲に属するということはいうまでもない。   The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to these embodiments, and can be modified and modified in various forms within the scope of the technical idea of the present invention. It will be apparent to those skilled in the art that such variations and modifications fall within the scope of the claims.

１０…マスキングテープ
１１…耐熱性基材
１２、１２´…帯電防止層
１３…粘着剤層
１４…天板モールド
１５…底板モールド
１６…ＰＣＢ基板
１７…チップ
１８…ソルダーボール
１９…ＥＭＣ DESCRIPTION OF SYMBOLS 10 ... Masking tape 11 ... Heat-resistant base material 12, 12 '... Antistatic layer 13 ... Adhesive layer 14 ... Top plate mold 15 ... Bottom plate mold 16 ... PCB substrate 17 ... Chip 18 ... Solder ball 19 ... EMC

Claims (8)

（ａ）アクリル系共重合体１００重量部に対して、（ｂ）熱硬化剤１〜２０重量部と、（ｃ）エネルギー線硬化型ウレタン樹脂５〜４０重量部と、（ｄ）エネルギー線硬化型シリコン樹脂０．１〜５重量部と、（ｅ）エネルギー線開始剤と、を含むモールドアンダーフィル工程のマスキングテープ用粘着剤組成物。   (A) With respect to 100 parts by weight of the acrylic copolymer, (b) 1 to 20 parts by weight of a thermosetting agent, (c) 5 to 40 parts by weight of energy ray curable urethane resin, and (d) energy ray curing. A pressure-sensitive adhesive composition for a masking tape in a mold underfill process, comprising 0.1 to 5 parts by weight of a type silicon resin and (e) an energy ray initiator. エネルギー線硬化型ウレタン樹脂は、アリファチック２官能性ウレタンアクリレート、アリファチック３官能性ウレタンアクリレート、アリファチック６官能性ウレタンアクリレート、アロマチック２官能性ウレタンアクリレート、アロマチック３官能性ウレタンアクリレート、及びアロマチック６官能性ウレタンアクリレートよりなる群から選ばれるいずれか一種以上であることを特徴とする請求項１に記載のマスキングテープ用粘着剤組成物。   The energy ray curable urethane resin includes an aliphatic difunctional urethane acrylate, an aliphatic trifunctional urethane acrylate, an aliphatic hexafunctional urethane acrylate, an aromatic bifunctional urethane acrylate, an aromatic trifunctional urethane acrylate, and an aromatic hexafunctional The masking tape pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive composition is one or more selected from the group consisting of water-soluble urethane acrylates. 前記エネルギー線硬化型シリコン樹脂は、シリコンジアクリレート、シリコンヘキサアクリレート、シリコンポリエステルアクリレート、シリコンウレタンアクリレート、およびシリコンウレタンメタアクリレートよりなる群から選ばれるいずれか一種以上であることを特徴とする請求項１に記載のマスキングテープ用粘着剤組成物。   2. The energy ray curable silicone resin is at least one selected from the group consisting of silicon diacrylate, silicon hexaacrylate, silicon polyester acrylate, silicon urethane acrylate, and silicon urethane methacrylate. A pressure-sensitive adhesive composition for a masking tape according to 1. 前記熱硬化剤は、メラミン系硬化剤であることを特徴とする請求項１に記載のマスキングテープ用粘着剤組成物。   The pressure-sensitive adhesive composition for masking tape according to claim 1, wherein the thermosetting agent is a melamine-based curing agent. 耐熱性基材と、
前記耐熱性基材の片面または両面に形成された帯電防止層と、
前記帯電防止層の上に形成され、請求項１に記載の粘着剤組成物から製造される粘着剤層と、
を備えることを特徴とするモールドアンダーフィル工程用マスキングテープ。 A heat resistant substrate;
An antistatic layer formed on one or both sides of the heat-resistant substrate;
An adhesive layer formed on the antistatic layer and produced from the adhesive composition according to claim 1,
A masking tape for mold underfill process, comprising: 前記耐熱性基材は、ポリイミドフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンナフタレートフィルムおよびポリブチレンテレフタレートフィルムよりなる群から選ばれるいずれか一種であることを特徴とする請求項５に記載のモールドアンダーフィル工程用マスキングテープ。   6. The mold underfill process according to claim 5, wherein the heat-resistant substrate is one selected from the group consisting of a polyimide film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polybutylene terephthalate film. Masking tape. 前記粘着剤層のポリシュドシリコンウェーハ面に対する常温粘着力は、５０ｇｆ／ｉｎｃｈ以下であることを特徴とする請求項５に記載のモールドアンダーフィル工程用マスキングテープ。   The masking tape for mold underfill process according to claim 5, wherein the adhesive layer has a room temperature adhesive force to the polished silicon wafer surface of 50 gf / inch or less. 前記粘着剤層の表面抵抗は、粘着層面が１０11Ω／□以下であることを特徴とする請求項５に記載のモールドアンダーフィル工程用マスキングテープ。 The masking tape for a mold underfill process according to claim 5, wherein the adhesive layer has a surface resistance of 10 11 Ω / □ or less.
JP2012006652A 2011-10-07 2012-01-17 Masking tape adhesive composition for mold underfill process and masking tape using the same Expired - Fee Related JP5548711B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0102320 2011-10-07
KR1020110102320A KR101209552B1 (en) 2011-10-07 2011-10-07 Adhesive composition for masking tape for mold underfill process and masking tape using the same

Publications (2)

Publication Number Publication Date
JP2013084873A true JP2013084873A (en) 2013-05-09
JP5548711B2 JP5548711B2 (en) 2014-07-16

Family

ID=47907127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012006652A Expired - Fee Related JP5548711B2 (en) 2011-10-07 2012-01-17 Masking tape adhesive composition for mold underfill process and masking tape using the same

Country Status (3)

Country Link
JP (1) JP5548711B2 (en)
KR (1) KR101209552B1 (en)
TW (1) TWI445786B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160130804A (en) 2014-03-07 2016-11-14 아사히 가라스 가부시키가이샤 Mold release film, method for manufacturing same, and method for manufacturing semiconductor package
JP2016222863A (en) * 2015-06-03 2016-12-28 日東電工株式会社 Adhesive tape for masking
KR20170023865A (en) 2014-07-02 2017-03-06 히타치가세이가부시끼가이샤 Photosensitive refractive index-adjusting transfer film
KR20170033270A (en) 2014-07-24 2017-03-24 히타치가세이가부시끼가이샤 Photosensitive resin composition, photosensitive film, pattern substrate, photosensitive conductive film, and conductive pattern substrate
JP2017177463A (en) * 2016-03-29 2017-10-05 三井化学東セロ株式会社 Processing release film excellent in appearance of molding, use thereof, and method for producing resin sealed semiconductor using the same
KR20180063106A (en) 2015-09-30 2018-06-11 히타치가세이가부시끼가이샤 Transfer-type photosensitive film for refractive-index modulation
JP2018161448A (en) * 2017-03-27 2018-10-18 日本絨氈株式会社 Tile carpet
JPWO2018021051A1 (en) * 2016-07-28 2019-01-31 日東電工株式会社 Reinforcing film with separator

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190144726A1 (en) * 2016-05-13 2019-05-16 3M Innovative Properties Company Thermally stable siloxane-based protection film
CN112250818A (en) * 2020-09-27 2021-01-22 长春一汽富维东阳汽车塑料零部件有限公司 Recyclable water-based polyurethane shielding material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166904A (en) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd Mold releasing sheet for semiconductor mold
WO2009050785A1 (en) * 2007-10-16 2009-04-23 Denki Kagaku Kogyo Kabushiki Kaisha Pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayered pressure-sensitive adhesive sheet, and process for producing electronic part
WO2010035703A1 (en) * 2008-09-29 2010-04-01 電気化学工業株式会社 Semiconductor member manufacturing method and adhesive tape
JP2010263041A (en) * 2009-05-01 2010-11-18 Nitto Denko Corp Dicing tape with die attach film, and method of manufacturing semiconductor apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166904A (en) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd Mold releasing sheet for semiconductor mold
WO2009050785A1 (en) * 2007-10-16 2009-04-23 Denki Kagaku Kogyo Kabushiki Kaisha Pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayered pressure-sensitive adhesive sheet, and process for producing electronic part
WO2010035703A1 (en) * 2008-09-29 2010-04-01 電気化学工業株式会社 Semiconductor member manufacturing method and adhesive tape
JP2010263041A (en) * 2009-05-01 2010-11-18 Nitto Denko Corp Dicing tape with die attach film, and method of manufacturing semiconductor apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160130804A (en) 2014-03-07 2016-11-14 아사히 가라스 가부시키가이샤 Mold release film, method for manufacturing same, and method for manufacturing semiconductor package
KR20170023865A (en) 2014-07-02 2017-03-06 히타치가세이가부시끼가이샤 Photosensitive refractive index-adjusting transfer film
KR20170033270A (en) 2014-07-24 2017-03-24 히타치가세이가부시끼가이샤 Photosensitive resin composition, photosensitive film, pattern substrate, photosensitive conductive film, and conductive pattern substrate
JP2016222863A (en) * 2015-06-03 2016-12-28 日東電工株式会社 Adhesive tape for masking
US10858552B2 (en) 2015-06-03 2020-12-08 Nitto Denko Corporation Masking pressure-sensitive adhesive tape
KR20180063106A (en) 2015-09-30 2018-06-11 히타치가세이가부시끼가이샤 Transfer-type photosensitive film for refractive-index modulation
JP2017177463A (en) * 2016-03-29 2017-10-05 三井化学東セロ株式会社 Processing release film excellent in appearance of molding, use thereof, and method for producing resin sealed semiconductor using the same
JPWO2018021051A1 (en) * 2016-07-28 2019-01-31 日東電工株式会社 Reinforcing film with separator
JP2018161448A (en) * 2017-03-27 2018-10-18 日本絨氈株式会社 Tile carpet

Also Published As

Publication number Publication date
KR101209552B1 (en) 2012-12-06
TWI445786B (en) 2014-07-21
TW201315786A (en) 2013-04-16
JP5548711B2 (en) 2014-07-16

Similar Documents

Publication Publication Date Title
JP5548711B2 (en) Masking tape adhesive composition for mold underfill process and masking tape using the same
TWI761604B (en) Reinforcing film
KR101392441B1 (en) Adhesive composition for masking tape of mold underfill process and masking tape using the same
JP6059499B2 (en) Surface protection sheet
KR102007111B1 (en) Semiconductor processing tape
KR100907982B1 (en) Dicing Die Bonding Film comprising the Adhesive Film for Semi-Conductor Packaging formed composition for Preparing Adhesive Film
JP2008280520A (en) Pressure-sensitive adhesive tape for fixing semiconductor
KR101089631B1 (en) Multilayer adhesive film for semiconductor package
KR100894173B1 (en) Mulitlayer adhesive film for semiconductor package
JP5942321B2 (en) Adhesive composition for masking tape in mold underfill process and masking tape using the same
KR102255547B1 (en) Adhesive composition, adhesive sheet, and method for producing semiconductor device
JP2011132354A (en) Ultraviolet-curing adhesive film
JP2019137832A (en) Pressure-sensitive adhesive sheet and laminate of pressure-sensitive adhesive sheet
JP5607401B2 (en) Antistatic type semiconductor processing adhesive tape
JP2010278297A (en) Adhesive tape for fixing semiconductor and method of manufacturing the same
CN111527594A (en) Adhesive sheet and method for manufacturing semiconductor device
JP6461892B2 (en) Surface protection sheet
TWI770371B (en) Die bonding film, dicing die bonding sheet, and method for producing semiconductor chip
KR101929581B1 (en) Adhesive Protective Film for Flexible Print Circuit Board
KR20150111864A (en) Adhesive sheet
JP2012193321A (en) Radiation-curable type adhesive composition, adhesive tape for wafer processing by using the same, and method for discriminating radiation-curable type adhesive composition
TW202018034A (en) Base material for adhesive sheet, and adhesive sheet for processing electronic component
KR102460037B1 (en) Pressure-sensitive adhesive sheet
JP6566554B2 (en) LAMINATED SHEET AND METHOD FOR PRODUCING LAMINATED SHEET
KR20140073297A (en) Adhesive Protective Film for Flexible Print Circuit Board with Excellent Heat-Resistance

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140114

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140409

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140513

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140519

R150 Certificate of patent or registration of utility model

Ref document number: 5548711

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees