JP2013084737A - Mounting head and electronic component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting head in which a suction nozzle is difficult to be displaced by external force, and an electronic component mounting machine.SOLUTION: A mounting head 8 includes: a head body 80; a driving source 82 arranged in the head body 80; a pair of movable nozzles 85 L, 85 R; and a link mechanism section 86 which connects the driving source 82 with the pair of movable nozzles 85 L, 85 R in such a manner that a pitch between the pair of movable nozzles 85 L, 85 R is changeable. In the case where external force FL, FR is applied to the pair of movable nozzles 85 L, 85 R from the same input direction, load FLa applied from one movable nozzle 85 L to the link mechanism section 86 and load FRa applied from the other movable nozzle 85 R to the link mechanism section 86 are applied to the link mechanism section 86 from directions opposite to each other.

Description

  The present invention relates to a mounting head for mounting an electronic component on a substrate, and an electronic component mounting machine including the mounting head.

  The electronic component mounting machine includes a component supply device and a mounting head. The component supply device includes a plurality of feeders arranged in the left-right direction. An electronic component is disposed in each of the plurality of feeders. The mounting head is movable in the front-rear and left-right directions. The mounting head includes a plurality of suction nozzles arranged in the left-right direction. By moving the mounting head, each of the plurality of suction nozzles can transport electronic components from the feeder to the substrate.

  Here, if the pitch (interval) between the plurality of suction nozzles does not match the spacing between the plurality of feeders, it is necessary to shift the suction nozzle, that is, the mounting head, in the left-right direction when sucking the electronic component from the feeder. is there. For example, when the pitch between the two suction nozzles α and β does not match the pitch between the two feeders a and b, the suction nozzle α first sucks the electronic components of the feeder a, and then the suction nozzle β. It is necessary to shift the mounting head in the left-right direction for alignment with the feeder b, and then suck the electronic components of the feeder b with the suction nozzle β. For this reason, the production efficiency is reduced by the amount of displacement of the mounting head.

  In view of this point, Patent Document 1 discloses an electronic component mounting machine in which three mounting heads are moved by two driving devices. Each of the three mounting heads includes a suction nozzle. The first mounting head can be moved in the Y-axis direction by the first driving device. The second and third mounting heads can be moved in the X-axis direction by the second driving device. According to the electronic component mounting machine described in this document, three mounting heads can be moved. For this reason, the pitch between the plurality of suction nozzles can correspond to the interval between the plurality of feeders. Therefore, it is not necessary to shift the suction nozzle, that is, the mounting head, in the left-right direction when sucking the electronic component from the feeder. That is, a plurality of electronic components can be taken out simultaneously by a plurality of suction nozzles.

JP 2007-115982 A

  However, in the case of the electronic component mounting machine described in this document, two driving devices are required to change the pitch between the three suction nozzles. For this reason, the structure of the mounting head, and thus the electronic component mounting machine, is complicated.

  Further, if the pitch between the plurality of suction nozzles can be changed, the suction nozzles are likely to be displaced with the acceleration / deceleration of the mounting head. For this reason, the pitch between the plurality of suction nozzles differs between when the mounting head is stopped (or when moving at a constant speed) and when the mounting head is accelerated / decelerated.

  For example, it is assumed that the left-right pitch between the plurality of suction nozzles can be changed. In this case, if acceleration / deceleration is performed when the mounting head moves in the left-right direction, an inertial force in the left-right direction acts on the suction nozzle. For this reason, the suction nozzle is displaced in the left-right direction due to “play” of the pitch variable mechanism of the suction nozzle and “reverse drive” of the drive source. Therefore, the left-right pitch between the plurality of suction nozzles differs between when the mounting head is stopped (or when moving at a constant speed) and when the mounting head is accelerated / decelerated.

  In the electronic component mounting machine, the electronic component sucked by the suction nozzle is picked up by the image pickup device while the electronic component is being transported from the feeder to the substrate. And the adsorption | suction state of an electronic component is discriminate | determined from the image.

  The imaging is usually performed with the mounting head stopped. However, in order to improve production efficiency, it is preferable to perform the imaging while moving the mounting head. When imaging is performed while moving the mounting head, a plurality of suction nozzles (that is, a plurality of electronic components) need to pass through the field of view of the imaging device. Here, when the mounting head accelerates or decelerates during passage, the suction nozzle is displaced. For this reason, the pitch between the plurality of suction nozzles differs between when the mounting head is stopped (or when moving at a constant speed) and when the mounting head is accelerated / decelerated. Therefore, it is difficult to capture a highly accurate image. Therefore, the determination accuracy of the suction state of the electronic component, and thus the mounting accuracy of the electronic component on the substrate is lowered.

  The mounting head and electronic component mounting machine of the present invention have been completed in view of the above problems. An object of the present invention is to provide a mounting head and an electronic component mounting machine in which the suction nozzle is not easily displaced by an external force.

  (1) In order to solve the above-described problem, the mounting head of the present invention includes a head body, a drive source disposed in the head body, a pair of movable nozzles, the drive source and the pair of movable nozzles, A link mechanism unit that connects the pair of movable nozzles so that the pitch between the pair of movable nozzles can be changed. When an external force is applied to the pair of movable nozzles from the same input direction, the link mechanism unit is applied from one movable nozzle to the link mechanism unit. A load and a load applied to the link mechanism from the other movable nozzle are applied to the link mechanism from opposite directions.

  The mounting head of the present invention includes at least a pair of suction nozzles or movable nozzles that are moved by a driving source. The load applied from one movable nozzle to the link mechanism and the load applied from the other movable nozzle to the link mechanism are applied to the link mechanism from opposite directions. That is, both loads act on the link mechanism in a direction that cancels each other. For this reason, the pair of movable nozzles are not easily displaced by an external force (for example, inertial force). Therefore, the pitch between the plurality of movable nozzles is less likely to be different when the mounting head is stopped (or when moving at a constant speed) and when the mounting head is accelerated / decelerated. Therefore, it is easy to capture a highly accurate image even when the electronic component is imaged while moving the mounting head. For this reason, it is possible to improve the accuracy of discriminating the suction state of the electronic component, and thus the accuracy of mounting the electronic component on the substrate. The pair of movable nozzles are driven by a single drive source. For this reason, compared with the mounting head of patent document 1, since there are few drive sources, a structure is simple.

  (2) Preferably, in the configuration of the above (1), an imaginary axis extending in a pitch change direction of the pair of movable nozzles is an X axis, and the input direction of the external force is the X axis direction, The link mechanism section is preferably configured to transmit the driving force of the driving source to the pair of movable nozzles so that the pair of movable nozzles move in opposite directions along the X axis.

  According to this configuration, the pitch of the pair of movable nozzles in the X-axis direction can be changed. When an external force is applied from the X-axis direction, a load applied from one movable nozzle to the link mechanism unit and a load applied from the other movable nozzle to the link mechanism unit are applied to the link mechanism unit from opposite directions. For this reason, a pair of movable nozzle is hard to displace.

  (3) Preferably, in the configuration of the above (2), a virtual axis extending in a direction orthogonal to the X axis is a Z axis, and the link mechanism portion is a Z axis guide disposed in the head body. And a Z-axis guided portion that is guided in the Z-axis guide portion and moves in the Z-axis direction with respect to the head main body by the drive source, and is arranged in the head main body in the X-axis direction. An extended X-axis guide portion and a movable guide portion disposed on the Z-axis guided portion, and the pair of movable nozzles are both guided by the X-axis guide portion and the movable guide portion, As the Z-axis guided portion moves in the Z-axis direction, it is preferable that the pair of movable nozzles move in opposite directions along the X-axis guide portion.

  According to this configuration, the pair of movable nozzles can be moved in the X-axis direction and in opposite directions by the driving force in the Z-axis direction of the drive source. That is, the pair of movable nozzles can be moved as if they were opened and closed when viewed from a direction orthogonal to the X-axis direction (for example, the Z-axis direction).

  (3-1) Preferably, in the configuration of the above (3), the movable guide portion extends in a first inclination direction that is a direction between the X-axis direction and the Z-axis direction. And a second inclined guide portion extending in a second inclined direction that is axisymmetric with respect to the Z axis with respect to the first inclined direction, and one of the movable nozzles is guided to the first inclined guide portion. The other movable nozzle is preferably guided by the second inclined guide portion.

  According to this structure, the 1st inclination guide part is extended in the 1st inclination direction which is a direction between an X-axis direction and a Z-axis direction. Moreover, the 2nd inclination guide part is extended in the 2nd inclination direction which is a direction between an X-axis direction and a Z-axis direction. For this reason, the pair of movable nozzles can be moved in the X-axis direction by the movement of the Z-axis guided portion in the Z-axis direction.

  Moreover, according to this structure, the 1st inclination guide part and the 2nd inclination guide part are arrange | positioned symmetrically with respect to the Z-axis. That is, with respect to the Z axis, the first inclined guide portion and the second inclined guide portion are arranged in a “C” shape or an inverted “C” shape. For this reason, the pair of movable nozzles can be moved in directions opposite to each other.

  (4) Preferably, in any one of the configurations (1) to (3), the external force is an inertial force accompanying acceleration / deceleration of the head body. According to this structure, a pair of movable nozzle becomes difficult to displace by inertia force.

  (5) In order to solve the above-described problem, an electronic component mounting machine according to the present invention includes a mounting head having any one of the above-described configurations (1) to (4). According to the electronic component mounting machine of the present invention, as described in (1) above, the pair of movable nozzles are not easily displaced by an external force (for example, inertial force). Therefore, the pitch between the plurality of movable nozzles is less likely to be different when the mounting head is stopped (or when moving at a constant speed) and when the mounting head is accelerated / decelerated. Therefore, it is easy to capture a highly accurate image even when the electronic component is imaged while moving the mounting head. For this reason, it is possible to improve the accuracy of discriminating the suction state of the electronic component, and thus the accuracy of mounting the electronic component on the substrate. The pair of movable nozzles are driven by a single drive source. For this reason, compared with the mounting head of patent document 1, since there are few drive sources, a structure is simple.

  According to the present invention, it is possible to provide a mounting head and an electronic component mounting machine in which the suction nozzle is hardly displaced by an external force.

It is a perspective view of the electronic component mounting machine of 1st embodiment. It is a block diagram of the same electronic component mounting machine. It is a perspective view in the closed state of the mounting head of a first embodiment. It is a front view in the closed state of the mounting head. It is a perspective view of the head main body of the mounting head. It is a perspective view of the link mechanism part of the mounting head. It is a perspective view of a pair of movable part of the mounting head. It is a front view in the open state of the mounting head. It is a front view in acceleration of the mounting head. FIG. 10 is a transmission enlarged view in a circle X of FIG. 9. It is the permeation | transmission enlarged view in the circle XI of FIG. It is a perspective view in the closed state of the mounting head of a second embodiment. It is a front view of the link mechanism part and a pair of movable part in the closed state of the mounting head. It is a front view of the link mechanism part and a pair of movable part in the open state of the mounting head. It is a front view of a link mechanism part and a pair of movable parts during acceleration of the mounting head.

  Embodiments of a mounting head and an electronic component mounting machine according to the present invention will be described below. In the embodiments described below, the left-right direction corresponds to the X-axis direction, the front-rear direction corresponds to the Y-axis direction, and the up-down direction corresponds to the Z-axis direction.

<< First Embodiment >>
<Configuration of electronic component mounting machine>
First, the configuration of the electronic component mounting machine of this embodiment will be described. FIG. 1 is a perspective view of the electronic component mounting machine according to the present embodiment. The housing of the module 3 is shown in a transparent manner. FIG. 2 shows a block diagram of the electronic component mounting machine. As shown in FIGS. 1 and 2, the electronic component mounting machine 1 includes a base 2, a module 3, a component supply device 4, an image processing device 5, and a control device 7.

[Base 2, Module 3]
The base 2 is arranged on the floor of the factory. The module 3 is replaceably disposed on the upper surface of the base 2. The module 3 includes a transport device 30, an XY robot 31, a mounting head 8, an imaging device 33, a base 34, a clamp device 35, and a device pallet 36.

(Device palette 36, base 34)
The device pallet 36 is attached to the front opening of the housing of the module 3. The base 34 is the bottom wall of the module 3. A pair of Y-axis guide rails 340 are disposed on the upper surface of the base 34. The pair of Y-axis guide rails 340 extend in the front-rear direction.

(Conveyance device 30, imaging device 33)
The conveyance device 30 includes a fixed wall portion 300, a movable wall portion 301, a pair of conveyor belts 302, and a conveyance motor 303. The fixed wall portion 300 and the movable wall portion 301 are juxtaposed in the front-rear direction. The movable wall portion 301 can slide in the front-rear direction with respect to the pair of Y-axis guide rails 340.

  The pair of conveyor belts 302 are disposed to face the rear surface of the fixed wall portion 300 and the front surface of the movable wall portion 301. The pair of conveyor belts 302 extends in the left-right direction. A substrate B is installed on the pair of conveyor belts 302.

  The conveyance motor 303 rotationally drives the pair of conveyor belts 302. That is, the transport motor 303 can transport the substrate B from the left side (upstream side in the transport direction) to the right side (downstream side in the transport direction). By moving the movable wall portion 301 in the front-rear direction, the width between the pair of conveyor belts 302, that is, the conveyance width of the substrate B can be expanded or reduced.

  The imaging device 33 is disposed in front of the fixed wall portion 300. The imaging device 33 is a CCD (Charge-Coupled Device) area sensor. The imaging device 33 has a visual field above.

(Clamping device 35)
The clamp device 35 includes a backup table 350, a large number of backup pins 351, a pair of clamp pieces 352, and a lifting motor 353. The backup table 350 is disposed between the fixed wall portion 300 and the movable wall portion 301. The lift motor 353 can reciprocate up and down the backup table 350. A large number of backup pins 351 are arranged on the upper surface of the backup table 350. When mounting an electronic component on the board B, a large number of backup pins 351 support the lower surface of the board B.

  The pair of clamp pieces 352 are disposed on the upper edges of the fixed wall portion 300 and the movable wall portion 301. When the electronic component is mounted on the substrate B, the pair of clamp pieces 352 presses the front and rear edges of the upper surface of the substrate B.

  In other words, when the electronic component is mounted, the board B is sandwiched and fixed by the pair of clamp pieces 352 from above and by the large number of backup pins 351 from below. By the fixing, the position of the substrate B is determined.

(XY robot 31)
The XY robot 31 includes a pair of X-axis guide rails 310, an X-axis slide 311, a pair of Y-axis guide rails 312, a Y-axis slide 313, an X-axis motor 314, and a Y-axis motor 315. Yes.

  The pair of Y-axis guide rails 312 is disposed on the lower surface of the upper wall of the housing of the module 3. The pair of Y-axis guide rails 312 extends in the front-rear direction. The Y-axis slide 313 can slide in the front-rear direction with respect to the pair of Y-axis guide rails 312.

  The pair of X-axis guide rails 310 are disposed on the front surface of the Y-axis slide 313. The pair of X-axis guide rails 310 extends in the left-right direction. The X-axis slide 311 can slide in the left-right direction with respect to the pair of X-axis guide rails 310.

  The X-axis motor 314 can drive the X-axis slide 311, and the Y-axis motor 315 can drive the Y-axis slide 313. The X-axis slide 311 can move in the front-rear and left-right directions by the driving force of the X-axis motor 314 and the Y-axis motor 315.

  The mounting head 8 is attached to the X-axis slide 311 in a replaceable manner. The configuration of the mounting head 8 will be described later in detail.

[Part supply device 4]
The component supply device 4 is attached to the device pallet 36 in a replaceable manner. The component supply device 4 includes a plurality of tape feeders 40. The plurality of tape feeders 40 are arranged in the left-right direction. Each of the plurality of tape feeders 40 includes a tape. On the tape, a large number of electronic components are arranged along the longitudinal direction. The electronic component is taken out from the tape by three nozzles (a fixed nozzle and a pair of movable nozzles) described later.

[Control device 7, image processing device 5]
As shown in FIG. 2, the control device 7 includes an input / output interface 70, a storage unit 71, and a calculation unit 72. The input / output interface 70 is connected to a transport motor 303, an X-axis motor 314, a Y-axis motor 315, a lift motor 353, a nozzle opening / closing Z-axis motor 82, and three nozzle lifting / lowering Z-axis motors via a drive circuit (not shown). 87, three θ-axis motors 88, and the imaging device 33 are electrically connected. The control device 7 controls these devices. The input / output interface 70 is electrically connected to the image processing apparatus 5. An image (specifically, image data) is transmitted from the imaging device 33 to the image processing device 5.

<Configuration of mounting head>
Next, the configuration of the mounting head of this embodiment will be described. As shown in FIG. 1, the mounting head 8 is attached to the X-axis slide 311 in a replaceable manner. For this reason, the mounting head 8 can move in the front-rear and left-right directions together with the X-axis slide 311.

  FIG. 3 is a perspective view of the mounting head of the present embodiment in the closed state. FIG. 4 shows a front view of the mounting head in the closed state. The closed state is a state in which the pair of movable nozzles 85L and 85R are closed.

  As shown in FIGS. 3 and 4, the mounting head 8 includes a head body 80, a fixed nozzle 81, a nozzle opening / closing Z-axis motor 82, a speed reducer (not shown), a ball screw portion 83, and a pair of Movable portions 84L and 84R, a pair of movable nozzles 85L and 85R, a link mechanism portion 86, three nozzle lifting / lowering Z-axis motors 87 (see FIG. 2), and three θ-axis motors 88 (see FIG. 2) It is equipped with.

[Head body 80, fixed nozzle 81, Z-axis motor 82 for opening and closing the nozzle]
FIG. 5 shows a perspective view of the head body of the mounting head. As shown in FIG. 5, the head main body 80 includes a fixed nozzle mounting portion 800, a bottom wall portion 801, a standing wall portion 802, and an upper wall portion 803. The bottom wall portion 801 has a pair of left and right openings 801L and 801R. The fixed nozzle mounting portion 800 is provided so as to protrude forward from substantially the center in the left-right direction of the bottom wall portion 801. The standing wall portion 802 is erected upward from the rear edge of the bottom wall portion 801. The upper wall portion 803 is disposed at the upper left corner of the standing wall portion 802.

  The fixed nozzle 81 is replaceably disposed on the lower surface of the fixed nozzle mounting portion 800. The nozzle opening / closing Z-axis motor 82 is attached to the upper surface of the upper wall portion 803. The nozzle opening / closing Z-axis motor 82 is included in the concept of the “drive source” of the present invention.

[Link mechanism 86]
FIG. 6 shows a perspective view of the link mechanism portion of the mounting head. As shown in FIG. 6, the link mechanism 86 includes a Z-axis guide portion 860 (see FIG. 5), a Z-axis guided portion 861, a first X-axis guide portion 862L (see FIG. 5), and a second X A shaft guide portion 862R (see FIG. 5), a first inclined guide portion 863L, and a second inclined guide portion 863R are provided.

  The first X-axis guide portion 862L and the second X-axis guide portion 862R are each included in the concept of the “X-axis guide portion” of the present invention. The first inclined guide portion 863L and the second inclined guide portion 863R are each included in the concept of the “movable guide portion” of the present invention.

  As shown in FIG. 5, the Z-axis guide portion 860 is disposed on the right side portion of the front surface of the standing wall portion 802 of the head body 80. The Z-axis guide part 860 extends in the vertical direction. The first X-axis guide portion 862L and the second X-axis guide portion 862R are disposed on the lower surface of the bottom wall portion 801 of the head body 80. The first X-axis guide portion 862L is disposed in front of the opening 801L. The second X-axis guide portion 862R is disposed in front of the opening 801R. The first X-axis guide portion 862L and the second X-axis guide portion 862R each extend in the left-right direction. The first X-axis guide portion 862L and the second X-axis guide portion 862R are arranged on the left and right sides with the fixed nozzle attachment portion 800 interposed therebetween.

  As shown in FIG. 6, the Z-axis guided portion 861 includes a Z-axis slide 861a and a guided portion main body 861b. The guided portion main body 861b has a C-shape that opens downward. The Z-axis slide 861a is disposed on the right side portion of the rear surface of the guided portion main body 861b. As shown in FIGS. 3 and 5, the Z-axis slide 861 a is movable in the vertical direction with respect to the Z-axis guide portion 860. The first inclined guide portion 863L and the second inclined guide portion 863R are disposed on the front surface of the guided portion main body 861b. The first inclined guide portion 863L and the second inclined guide portion 863R are arranged in a “C” shape when viewed from the front. That is, the first inclined guide portion 863L extends in the upper right-lower left direction. The second inclined guide portion 863R extends in the upper left-lower right direction. As shown in FIGS. 3 and 5, the first inclined guide portion 863L can enter and leave the opening 801L. The second inclined guide portion 863R can enter and exit the opening 801R.

[Ball screw part 83]
As shown in FIGS. 3, 5, and 6, the ball screw portion 83 includes a shaft portion 830 and a nut portion 831. The shaft portion 830 is connected to the rotating shaft of the nozzle opening / closing Z-axis motor 82 via a speed reducer. The shaft portion 830 extends in the vertical direction. The nut portion 831 is disposed on the left side portion of the rear surface of the guided portion main body 861b. The nut portion 831 is screwed to the shaft portion 830 via a large number of balls (not shown).

[A pair of movable portions 84L and 84R, a pair of movable nozzles 85L and 85R]
FIG. 7 shows a perspective view of a pair of movable parts of the mounting head. As shown in FIG. 7, the pair of movable portions 84L and 84R includes X-axis slides 840L and 840R, inclined slides 841L and 841R, standing wall portions 842L and 842R, and movable nozzle mounting portions 843L and 843R. Yes.

  First, the left movable portion 84L will be described. The movable nozzle mounting portion 843L extends in the front-rear direction. The X-axis slide 840L is disposed on the rear portion of the upper surface of the movable nozzle mounting portion 843L. As shown in FIGS. 3 and 5, the X-axis slide 840L is movable in the left-right direction with respect to the first X-axis guide portion 862L. Returning to FIG. 7, the standing wall portion 842L is disposed on the rear surface of the X-axis slide 840L. The standing wall portion 842L is erected upward. The inclined slide 841L is disposed on the rear surface of the standing wall portion 842L. The inclined slide 841L extends in the upper right-lower left direction. As shown in FIGS. 3 and 6, the inclined slide 841L is movable in the upper right-lower left direction with respect to the first inclined guide portion 863L.

  Next, the right movable portion 84R will be described. The configuration of the movable portion 84R is the same as the configuration of the movable portion 84L. The arrangement of the movable portion 84R is bilaterally symmetrical with the arrangement of the movable portion 84L. That is, as shown in FIGS. 3 and 5, the X-axis slide 840R is movable in the left-right direction with respect to the second X-axis guide portion 862R. As shown in FIGS. 3 and 6, the inclined slide 841R is movable in the upper left-lower right direction with respect to the second inclined guide portion 863R.

  As shown in FIG. 7, the movable nozzle 85L is replaceably disposed on the lower surface of the movable nozzle mounting portion 843L. The movable nozzle 85R is replaceably disposed on the lower surface of the movable nozzle mounting portion 843R. As shown in FIG. 4, the movable nozzle 85 </ b> L is disposed on the left side of the fixed nozzle 81. The movable nozzle 85R is arranged on the right side of the fixed nozzle 81.

[Three nozzle lifting / lowering Z-axis motor 87 and three θ-axis motors 88]
As shown in FIG. 2, the three nozzle lifting / lowering Z-axis motors 87 are connected to the control device 7. The three nozzle lifting / lowering Z-axis motors 87 drive the fixed nozzle 81 and the pair of movable nozzles 85L and 85R in the vertical direction.

  The three θ-axis motors 88 are connected to the control device 7. The three θ-axis motors 88 drive the fixed nozzle 81 and the pair of movable nozzles 85L and 85R in the rotational direction in the horizontal plane.

<Electronic component mounting machine movement>
Next, the movement of the electronic component mounting machine of this embodiment will be described. First, as shown in FIGS. 1 and 2, the control device 7 drives the transport motor 303 to rotate the pair of conveyor belts 302. Then, the board B is carried into the electronic component mounting machine 1. Subsequently, the control device 7 drives the lifting motor 353 to raise the backup table 350. Then, the substrate B is lifted from the pair of conveyor belts 302 by a large number of backup pins 351. Then, the substrate B is sandwiched and fixed between a large number of backup pins 351 and a pair of clamp pieces 352. That is, the substrate B is positioned.

  Next, the control device 7 appropriately drives the X-axis motor 314, the Y-axis motor 315, the nozzle opening / closing Z-axis motor 82, the three nozzle lifting / lowering Z-axis motors 87, and the three θ-axis motors 88. The electronic components are transported from the tape feeder 40 to the substrate B. Then, electronic components are mounted at predetermined mounting coordinates on the board B. In the middle of conveyance, the mounting head 8 passes over the imaging device 33 (that is, the visual field). The mounting head 8 repeatedly executes the above-described transport operation. The mounting head 8 mounts a predetermined number of electronic components assigned to the electronic component mounting machine 1 on the board B.

  Finally, the control device 7 drives the lifting motor 353 to lower the backup table 350. And the board | substrate B is handed over to a pair of conveyor belt 302 from many backup pins 351. FIG. Subsequently, the control device 7 drives the transport motor 303 to rotate the pair of conveyor belts 302. And the board | substrate B is paid out to downstream apparatuses (an electronic component mounting machine, a board | substrate external appearance inspection machine, etc.).

<The movement of the mounting head when opening and closing the nozzle>
As described above, the mounting head 8 takes out the electronic component from the tape feeder 40 when the electronic component is transported. Further, the mounting head 8 mounts the taken-out electronic component at predetermined mounting coordinates of the substrate B. As shown in FIG. 4, the mounting head 8 includes three nozzles (a fixed nozzle 81 and a pair of movable nozzles 85L and 85R). For this reason, the mounting head 8 can take out three electronic components from the three tape feeders 40 at a time. Further, the mounting head 8 can mount three electronic components at three mounting coordinates at a time.

  Here, the horizontal interval between the three tape feeders 40 for taking out the electronic components depends on the component type of the electronic component to be mounted on the substrate B in the transfer operation of an arbitrary electronic component. That is, the distance in the left-right direction between the three tape feeders 40 for taking out the electronic components changes every time the electronic components are transported, and is not constant.

  As shown by a dotted line in FIG. 4, when three electronic components are taken out from the three tape feeders 40c to 40e adjacent in the left-right direction, the distance in the left-right direction becomes a short distance. Further, when three electronic components are taken out from three tape feeders 40b, 40d, and 40f adjacent to each other in the left-right direction, the distance in the left-right direction becomes a medium distance. Further, when three electronic components are taken out from every three adjacent tape feeders 40a, 40d, and 40g in the left-right direction, the distance in the left-right direction becomes a long distance. Similarly, the interval between the three mounting coordinates for mounting the electronic component also changes for each electronic component transport operation and is not constant.

  In this regard, the mounting head 8 of the present embodiment can move the movable nozzles 85L and 85R in the left-right direction. That is, the nozzle can be opened and closed. For this reason, it is possible to flexibly cope with the change in the interval between the tape feeders 40 and the change in the interval between the mounting coordinates. The opening and closing of the nozzle is executed at a timing before taking out the electronic component and before mounting the electronic component.

  Hereinafter, the movement of the mounting head 8 of this embodiment when the nozzle is opened and closed will be described. FIG. 8 shows a front view of the mounting head of the present embodiment in the open state. The open state is a state where the pair of movable nozzles 85L and 85R are open (open state).

  When moving the pair of movable nozzles 85L and 85R from the closed state (FIGS. 3 and 4) to the open state (FIG. 8), the control device 7 shown in FIG. 2 drives the nozzle opening / closing Z-axis motor 82. When the nozzle opening / closing Z-axis motor 82 moves, the shaft portion 830 shown in FIG. 3 rotates around the axis, and the nut portion 831, that is, the Z-axis guided portion 861, as shown by the arrow Y 1 in FIG. Against the rise. And the 1st inclination guide part 863L and the 2nd inclination guide part 863R rise. At this time, the Z-axis slide 861 a of the Z-axis guided portion 861 is guided to the Z-axis guide portion 860.

  Here, the first inclined guide portion 863L extends in the upper right-lower left direction. On the other hand, the moving direction of the X-axis slide 840L is limited to the left-right direction by the first X-axis guide portion 862L. For this reason, when the first inclination guide part 863L rises, as shown by an arrow Y2L in FIG. 8, the inclination slide 841L relatively slides the first inclination guide part 863L from the upper right to the lower left. Therefore, as indicated by the arrow Y3L, the X-axis slide 840L relatively slides the first X-axis guide portion 862L from the right to the left. Therefore, the movable portion 84L moves from the right to the left with respect to the head main body 80. As described above, the first inclined guide portion 863L converts the upward force of the Z-axis guided portion 861 into the leftward force of the movable portion 84L in the orthogonal direction.

  Similarly, when the second inclined guide portion 863R rises, the inclined slide 841R relatively slides the second inclined guide portion 863R from the upper left to the lower right as indicated by an arrow Y2R in FIG. As indicated by an arrow Y3R, the X-axis slide 840R relatively slides the first X-axis guide portion 862R from left to right. Therefore, the movable portion 84R moves from the left to the right with respect to the head main body 80. As described above, the second inclined guide portion 863R converts the upward force of the Z-axis guided portion 861 into the rightward force of the movable portion 84R in the orthogonal direction.

  In this way, the pair of movable nozzles 85L and 85R are moved from the closed state (FIGS. 3 and 4) to the open state (FIG. 8). When the pair of movable nozzles 85L and 85R are moved from the open state to the closed state, the Z-axis guided portion 861 is lowered with respect to the head main body 80. Using the moving mechanism, the mounting head 8 of the present embodiment can flexibly cope with changes in the spacing between the tape feeders 40 and changes in the spacing between mounting coordinates.

<Moving head during acceleration / deceleration>
As described above, the mounting head 8 that has taken out the three electronic components passes over the imaging device 33 (see FIG. 1) (that is, the visual field) in the middle of the electronic component transport operation. Specifically, the three nozzles (the fixed nozzle 81 and the pair of movable nozzles 85L and 85R) of the mounting head 8 pass through the field of view of the imaging device 33 without stopping in the left-right direction.

  As shown in FIG. 2, the imaging device 33 images three electronic components when the three nozzles pass. Note that imaging may be performed on three electronic components at a time. Moreover, you may perform an imaging separately with respect to three electronic components. The imaging device 33 transmits an image acquired by imaging to the image processing device 5. The image processing apparatus 5 determines the suction state of the electronic component with respect to the three nozzles based on the image.

  Here, when the imaging device 33 images three electronic components, if the relative positional relationship of the three electronic components is displaced due to acceleration / deceleration of the mounting head 8, it is difficult to capture a highly accurate image. Therefore, the determination accuracy of the suction state of the electronic component, and hence the mounting accuracy of the electronic component on the board B, is lowered.

  In this regard, according to the mounting head 8 of the present embodiment, even when the mounting head 8 is accelerated or decelerated, the relative positional relationship between the three electronic components, that is, the three nozzles, is not easily displaced. Hereinafter, the movement at the time of acceleration / deceleration of the mounting head 8 of this embodiment will be described. FIG. 9 shows a front view of the mounting head of the present embodiment during acceleration. As indicated by an arrow Y5 in FIG. 9, when the mounting head 8 moving from left to right accelerates, inertial forces FL and FR act on the pair of movable nozzles 85L and 85R from right to left. That is, the pair of movable nozzles 85 </ b> L and 85 </ b> R tends to move from the right to the left with respect to the head main body 80.

  FIG. 10 shows an enlarged view of the transmission in the circle X of FIG. As shown by a thick line in FIG. 10, the lower surface of the guided groove 841La of the inclined slide 841L and the lower surface of the first inclined guide portion 863L are in contact with each other. For this reason, the inertial force FL applied to the first inclined guide portion 863L from the inclined slide 841L via the contact surface is decomposed into the loads FLa and FLb. Due to the upward load FLa, the inclined slide 841L pushes up the first inclined guide portion 863L, that is, the Z-axis guided portion 861. As described above, the inertial force FL applied from the inclined slide 841L to the first inclined guide portion 863L acts in the direction in which the Z-axis guided portion 861 is raised.

  FIG. 11 shows a transmission enlarged view in the circle XI of FIG. As shown by a thick line in FIG. 11, the upper surface of the guided groove 841Ra of the inclined slide 841R and the upper surface of the second inclined guide portion 863R are in contact with each other. For this reason, the inertial force FR applied to the second inclined guide portion 863R from the inclined slide 841R via the contact surface is decomposed into the loads FRa and FRb. By the load FRa, the inclined slide 841L pushes down the second inclined guide portion 863R, that is, the Z-axis guided portion 861. As described above, the inertial force FR applied from the inclined slide 841R to the second inclined guide portion 863R acts in the direction in which the Z-axis guided portion 861 is lowered.

  Thus, the inertial force FL from the movable nozzle 85L acts in the direction in which the Z-axis guided portion 861 is raised. On the contrary, the inertial force FR from the movable nozzle 85R acts in the direction in which the Z-axis guided portion 861 is lowered. For this reason, the inertial forces FL and FR cancel each other in the Z-axis guided portion 861. Therefore, even if the mounting head 8 accelerates from left to right, the inertial forces FL and FR cancel each other, so that the pair of movable nozzles 85L and 85R are unlikely to be displaced with respect to the head body 80.

  In addition, when the mounting head 8 decelerates from left to right, accelerates from right to left, or decelerates from right to left, the inertial forces FL and FR cancel each other out in the same manner. . For this reason, the pair of movable nozzles 85 </ b> L and 85 </ b> R are not easily displaced with respect to the head main body 80.

<Effect>
Next, functions and effects of the mounting head and the electronic component mounting machine of this embodiment will be described. As shown in FIGS. 10 and 11, according to the mounting head 8 of the present embodiment, the load FLa applied to the link mechanism 86 from one movable nozzle 85L and the load FRa applied to the link mechanism 86 from the other movable nozzle 85R. Are added to the link mechanism 86 from opposite directions. That is, both loads FLa and FRa act on the link mechanism portion 86 in a direction to cancel each other. For this reason, the pair of movable nozzles 85L and 85R are not easily displaced by the inertial forces FL and FR. Therefore, the pitch between the pair of movable nozzles 85L and 85R is unlikely to differ when the mounting head 8 is stopped (or when moving at a constant speed) and when the mounting head 8 is accelerated / decelerated. Therefore, even when the electronic component is imaged while moving the mounting head 8, it is easy to capture a highly accurate image. For this reason, it is possible to improve the determination accuracy of the suction state of the electronic component, and hence the mounting accuracy of the electronic component on the substrate B. Further, as shown in FIG. 8, the pair of movable nozzles 85L and 85R are driven by a single nozzle opening / closing Z-axis motor 82. For this reason, compared with the mounting head of patent document 1, since there are few drive sources, a structure is simple.

  Further, according to the mounting head 8 of the present embodiment, the pair of movable nozzles 85L and 85R can be moved in the left-right direction and in opposite directions by the vertical driving force of the nozzle opening / closing Z-axis motor 82. it can. That is, the pair of movable nozzles 85L and 85R can be moved as if they were opened and closed when viewed from the up-down direction or the front-rear direction.

  Moreover, according to the mounting head 8 of this embodiment, the 1st inclination guide part 863L is extended in the 1st inclination direction (upper right-lower left direction) which is a direction between the left-right direction and an up-down direction. The second inclined guide portion 863R extends in a second inclined direction (upper left-lower right) that is a direction between the left-right direction and the up-down direction. For this reason, the pair of movable nozzles 85L and 85R can be moved in the left-right direction by the vertical movement of the Z-axis guided portion 861.

  Further, according to the mounting head 8 of the present embodiment, the first inclined guide portion 863L and the second inclined guide portion 863R are arranged symmetrically with respect to the Z axis (vertical axis). That is, the first inclined guide portion 863L and the second inclined guide portion 863R are arranged in a “C” shape with respect to the Z axis. Specifically, the first inclined guide portion 863L extends in the + 45 ° direction and the second inclined guide portion 863R extends in the −45 ° direction with respect to the horizontal plane. For this reason, the pair of movable nozzles 85L and 85R can be moved in directions opposite to each other.

<< Second Embodiment >>
The difference between the mounting head and electronic component mounting machine of the present embodiment and the mounting head and electronic component mounting machine of the first embodiment is only the structure of the link mechanism. Here, only differences will be described.

  First, the configuration of the mounting head 8 will be described. FIG. 12 shows a perspective view of the mounting head of the present embodiment in the closed state. In addition, about the site | part corresponding to FIG. 3, it shows with the same code | symbol. FIG. 13 shows a front view of the link mechanism portion and the pair of movable portions in the closed state of the mounting head.

  As shown in FIGS. 12 and 13, a guide groove portion 801a is formed in the bottom wall portion 801 of the head main body 80 of the mounting head 8 of the present embodiment. The guide groove 801a extends in the left-right direction. A nozzle opening / closing X-axis motor 82 a is disposed on the left surface of the bottom wall portion 801. The nozzle opening / closing X-axis motor 82a is included in the concept of the “drive source” of the present invention. The link mechanism unit 89 is a so-called ball screw. The link mechanism portion 89 includes a shaft portion 890 and a pair of nut portions 891L and 891R. The shaft portion 890 is disposed in the guide groove portion 801a. The shaft portion 890 extends in the left-right direction. The shaft portion 890 is connected to the rotation shaft of the nozzle opening / closing X-axis motor 82a via a speed reducer (not shown). On the left half and the right half of the shaft portion 890, a screw portion 890L and a screw portion 890R are formed with a center line L1 extending in the vertical direction as a boundary. The spiral direction of the screw portion 890L and the spiral direction of the screw portion 890R are opposite to each other. The nut portion 891L is screwed into the screw portion 890L. The nut portion 891L is fixed to the movable portion 84L. The nut portion 891R is screwed into the screw portion 890R. The nut portion 891R is fixed to the movable portion 84R.

  Next, the movement of the mounting head 8 when the nozzle is opened and closed will be described. FIG. 14 shows a front view of the link mechanism portion and the pair of movable portions in the open state of the mounting head of the present embodiment.

  When the pair of movable nozzles 85L and 85R are moved from the closed state (FIGS. 12 and 13) to the open state (FIG. 14), the control device 7 shown in FIG. 2 drives the nozzle opening / closing X-axis motor 82a. When the nozzle opening / closing X-axis motor 82a moves, the shaft portion 890 rotates around the axis. Here, the spiral direction of the screw portion 890L and the spiral direction of the screw portion 890R are opposite to each other. Therefore, the nut portion 891L, that is, the movable portion 84L moves to the left as indicated by an arrow Y10L in FIG. Further, the nut portion 891R, that is, the movable portion 84R moves to the right side as indicated by an arrow Y10R in FIG.

  In this way, the pair of movable nozzles 85L and 85R are moved from the closed state (FIGS. 12 and 13) to the open state (FIG. 14). In addition, when moving a pair of movable nozzle 85L, 85R from an open state to a closed state, the shaft part 890 is rotated in a reverse direction. Using the moving mechanism, the mounting head 8 of the present embodiment can flexibly cope with changes in the spacing between the tape feeders 40 and changes in the spacing between mounting coordinates.

  Next, the movement of the mounting head 8 during acceleration / deceleration will be described. FIG. 15 is a front view of the link mechanism portion and the pair of movable portions during acceleration of the mounting head of the present embodiment. As indicated by an arrow Y15 in FIG. 15, when the mounting head 8 moving from left to right accelerates, inertial forces FL and FR act on the pair of movable nozzles 85L and 85R from right to left. That is, the pair of movable nozzles 85 </ b> L and 85 </ b> R tends to move from the right to the left with respect to the head main body 80.

  Here, the spiral direction of the screw portion 890L and the spiral direction of the screw portion 890R are opposite to each other. For this reason, when the shaft portion 890 is viewed from the left side, the nut portion 891L applies a load F10L in the counterclockwise direction to the shaft portion 890. On the other hand, when the shaft portion 890 is viewed from the left side, the nut portion 891R applies a load F10R in the clockwise direction to the shaft portion 890.

  As described above, the inertial force FL from the movable nozzle 85L acts in the direction in which the shaft portion 890 is rotated counterclockwise. On the contrary, the inertial force FR from the movable nozzle 85R acts in the direction in which the shaft portion 890 is rotated in the clockwise direction. For this reason, the pair of inertial forces FL and FR cancel each other out at the shaft portion 890. Therefore, even if the mounting head 8 accelerates from the left to the right, the pair of inertial forces FL and FR cancel each other, so that the pair of movable nozzles 85L and 85R are not easily displaced with respect to the head body 80.

  When the mounting head 8 decelerates from left to right, accelerates from right to left, or decelerates from right to left, the pair of inertia forces cancel each other out in the same manner. For this reason, the pair of movable nozzles 85 </ b> L and 85 </ b> R are not easily displaced with respect to the head main body 80.

  The mounting head and the electronic component mounting machine according to the present embodiment and the mounting head and the electronic component mounting machine according to the first embodiment have the same operational effects with respect to the parts having the same configuration.

<< Other >>
The embodiments of the mounting head and the electronic component mounting machine according to the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  For example, the structure of the link mechanism 86 is not particularly limited. A cam or the like may be used in addition to the rail and the ball screw. It is only necessary that the pair of movable nozzles 85L and 85R can be driven in opposite directions by a single drive source. The power transmission mechanism from the drive source to the movable nozzles 85L and 85R may use a fluid (liquid or gas) cylinder, a solenoid, or the like in addition to the ball screw.

  The inclination angles of the first inclination guide portion 863L and the second inclination guide portion 863R of the mounting head 8 of the first embodiment are not particularly limited. The magnitudes of the loads FLa and FRa shown in FIGS. 10 and 11 can be freely adjusted by the inclination angle. Further, the first inclined guide portion 863L and the second inclined guide portion 863R may be arranged in a reverse “C” shape when viewed from the front. Further, each of the first inclination guide part 863L and the second inclination guide part 863R may be curved.

  The spiral angle of the screw portions 890L and 890R of the shaft portion 890 of the mounting head 8 of the second embodiment is not particularly limited. The magnitudes of the loads F10L and F10R shown in FIG. 15 can be freely adjusted by the spiral angle. Further, the first inclined guide portion 863L and the second inclined guide portion 863R may be arranged in the left and right directions.

  Further, the arrangement direction of the three nozzles (the fixed nozzle 81 and the pair of movable nozzles 85L and 85R) of the mounting head 8 shown in FIG. 4 is not limited. Left-right direction or front-back direction may be sufficient. Further, the fixed nozzle 81 may not be arranged. A plurality of movable nozzles 85L may be arranged. A plurality of movable nozzles 85R may be arranged. Preferably, the number of movable nozzles 85L and the number of movable nozzles 85R is the same.

  Further, the component supply device 4 may include a tray instead of the tape feeder 40. In this case, among a plurality of electronic components arranged on the tray, three electronic components can be simultaneously conveyed and mounted using the mounting head of the present invention. In addition, a CMOS (Complementary Metal-Oxide Semiconductor) area sensor may be used as the imaging device 33.

1: electronic component mounting machine, 2: base, 3: module, 4: component supply device, 5: image processing device, 7: control device, 8: mounting head.
30: Conveying device, 31: XY robot, 33: Imaging device, 34: Base, 35: Clamping device, 36: Device palette, 40: Tape feeder, 40a to 40g: Tape feeder, 70: Input / output interface, 71: Memory , 72: arithmetic unit, 80: head body, 81: fixed nozzle, 82: Z-axis motor for opening / closing nozzle (drive source), 82a: X-axis motor for nozzle opening / closing (drive source), 83: ball screw unit, 84L : Movable part, 84R: Movable part, 85L: Movable nozzle, 85R: Movable nozzle, 86: Link mechanism part, 87: Z axis motor for raising and lowering nozzle, 88: θ axis motor, 89: Link mechanism part.
300: fixed wall portion, 301: movable wall portion, 302: conveyor belt, 303: transport motor, 310: X axis guide rail, 311: X axis slide, 312: Y axis guide rail, 313: Y axis slide, 314: X-axis motor, 315: Y-axis motor, 340: Y-axis guide rail, 350: Backup table, 351: Backup pin, 352: Clamp piece, 353: Lifting motor, 800: Fixed nozzle mounting part, 801: Bottom wall part, 801L: Opening, 801R: Opening, 801a: Guide groove, 802: Standing wall, 803: Upper wall, 830: Shaft, 831: Nut, 840L: X-axis slide, 840R: X-axis slide, 841L: Inclined slide, 841La: Guided groove, 841R: Inclined slide, 841Ra: Guided groove, 842L: Standing wall , 843L: movable nozzle mounting portion, 843R: movable nozzle mounting portion, 860: Z-axis guide portion, 861: Z-axis guided portion, 861a: Z-axis slide, 861b: guided portion main body, 862L: first X-axis guide Portion (X-axis guide portion), 862R: second X-axis guide portion (X-axis guide portion), 863L: first tilt guide portion (movable guide portion), 863R: second tilt guide portion (movable guide portion), 890 : Shaft portion, 890L: Screw portion, 890R: Screw portion, 891L: Nut portion, 891R: Nut portion.
B: substrate, F10L: load, F10R: load, FL: inertial force, FLa: load, FR: inertial force, FRa: load, L1: center line.

Claims (5)

The head body,
A drive source disposed in the head body;
A pair of movable nozzles;
A link mechanism unit that connects the drive source and the pair of movable nozzles such that a pitch between the pair of movable nozzles can be changed;
With
When an external force is applied to the pair of movable nozzles from the same input direction, a load applied from one movable nozzle to the link mechanism unit and a load applied from the other movable nozzle to the link mechanism unit are the link mechanism unit. In contrast, mounting heads that are applied from opposite directions. An imaginary axis extending in the pitch changing direction of the pair of movable nozzles as an X axis,
The input direction of the external force is the X-axis direction;
2. The mounting according to claim 1, wherein the link mechanism transmits the driving force of the driving source to the pair of movable nozzles such that the pair of movable nozzles move in opposite directions along the X axis. head. A virtual axis extending in a direction perpendicular to the X axis is a Z axis,
The link mechanism is
A Z-axis guide portion disposed in the head body;
A Z-axis guided portion that is guided by the Z-axis guide portion and moves in the Z-axis direction with respect to the head body by the drive source;
An X-axis guide portion disposed in the head body and extending in the X-axis direction;
A movable guide portion disposed on the Z-axis guided portion;
With
The pair of movable nozzles are guided by the X-axis guide part and the movable guide part,
The mounting head according to claim 2, wherein the pair of movable nozzles move in directions opposite to each other along the X-axis guide portion as the Z-axis guided portion moves in the Z-axis direction.   The mounting head according to claim 1, wherein the external force is an inertial force accompanying acceleration / deceleration of the head body.   An electronic component mounting machine comprising the mounting head according to any one of claims 1 to 4.

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