JP2013077824A - Substrate processing apparatus, displaying method for substrate processing apparatus, and manufacturing method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simultaneously display mounting states of substrates held in a substrate holding tool and the detail information of the mounting states, on the same screen.SOLUTION: A substrate processing apparatus carries a substrate holding tool mounting a plurality of substrates, into a furnace and performs predetermined processing. Mounting states of the respective substrates, crack-detecting-result information of the respective substrates, and recovering states of the substrates which are determined as the abnormal substrates by the crack-detecting-result information are displayed on an operating screen.

Description

  The present invention relates to a substrate processing apparatus, a display method for a substrate processing apparatus, and a method for manufacturing a semiconductor device, and more particularly, a substrate processing apparatus and a substrate for displaying a substrate loading state of a substrate holder provided in the substrate processing apparatus on a screen. The present invention relates to a processing device display method and a semiconductor device manufacturing method.

Conventionally, as a method for displaying the transfer state of wafers to a boat, the image of the boat is displayed on the screen, and the type of wafer on the boat is clarified by color-coding the wafer in the boat image diagram.
For example, in Patent Document 1, in a substrate processing apparatus that displays a wafer boat, each wafer on the wafer boat is classified by color based on the slot information of the boat.
JP-A-11-121586

Up to now, when performing processing to remove wafers that were actually abnormal, for example, switching from the screen for displaying the transfer status of the boat to the setting screen for the wafer transfer device and specifying the operation of the wafer transfer device There was a need to do.
However, the screen for confirming the overall wafer transfer status of the boat, the screen for confirming the detailed information of the wafer, and the screen for removing the defective wafer were separate screens, so the usability was poor. It was.

Therefore, an object of the present invention is to display and confirm at least the transfer state of the wafer (substrate) held by the substrate holder and the detailed information thereof on the same screen.
In particular, when removing a wafer where an abnormality has occurred, designation of the processing to be removed and designation of abnormality removal processing after removal are performed on a screen that displays the substrate transfer status and detailed information on the substrate, and the results are transferred to the substrate. The purpose is to reflect the loading status and the detailed information of the board on the screen.

  According to an aspect of the present invention, there is provided a substrate processing apparatus for carrying out a predetermined process by loading a substrate holder on which a plurality of substrates are placed into a furnace, and relates to the substrate on the substrate holder. A substrate processing apparatus configured to display transfer information as a boat image diagram on the operation screen, divide the entire boat into a plurality of regions, and display detailed information on the substrates in each region on the operation screen. Provided.

  According to another aspect of the present invention, there is provided a substrate processing apparatus for carrying out a predetermined process by carrying a substrate holder on which a plurality of substrates are placed into a furnace, and transfer information relating to the substrate on the substrate holder The entire board holder is displayed on the operation screen as a boat image diagram, and the whole board holder is divided into a plurality of areas, and the transfer status and crack detection result information of the substrates in each area are displayed on the operation screen. A substrate processing apparatus configured to be provided is provided.

  According to still another aspect of the present invention, there is provided a substrate processing apparatus for carrying out a predetermined process by carrying a substrate holder on which a plurality of substrates are placed into a furnace, and transferring the substrate on the substrate holder There is provided a substrate processing apparatus configured to display the entire substrate holder on an operation screen as information on a boat image, and to display the recovery status of each substrate in which the abnormality has occurred on the operation screen.

  According to the present invention, it becomes possible to display the transfer status of the wafer held by the substrate holder and its detailed information on the same screen, and confirm the transfer status of the wafer and the detailed information of this wafer. be able to. In addition, because error processing can be specified on the same screen when an error occurs, processing will not stop due to a minor error (simple detection error), and error recovery processing will be completed and error cancellation will be confirmed immediately. As a result, the operating efficiency of the apparatus can be improved.

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a side perspective view of the substrate processing apparatus shown in FIG. 1. It is explanatory drawing which shows the wafer abnormality detection apparatus as an example of the transfer information detection means which concerns on one embodiment of this invention. It is a figure which shows an example of the controller of the substrate processing system which concerns on one embodiment of this invention and controls several substrate processing apparatuses. 1 is a block diagram illustrating an example of a controller of a substrate processing system according to an embodiment of the present invention. It is a figure which concerns on one embodiment of this invention and shows embodiment of the wafer status screen displayed on an operation screen. It is a figure which shows other embodiment of the wafer status screen which concerns on one embodiment of this invention. It is a figure which shows an example of the recovery command screen which concerns on one embodiment of this invention. FIG. 8 is an enlarged detailed view of the detailed display list of FIG. 7. It is a schematic block diagram of the information correction dialog concerning Embodiment of this invention. It is a schematic diagram explaining the wafer position data detected by the wafer abnormality detection apparatus.

  In the best mode for carrying out the present invention, the substrate processing apparatus is a vertical substrate processing apparatus (hereinafter simply referred to as a processing apparatus) that performs oxidation, diffusion processing, CVD processing, or the like on the substrate. Used as a processing apparatus in the manufacturing method of (IC).

  First, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a perspective view of a substrate processing apparatus applied to the present invention. 2 is a side perspective view of the substrate processing apparatus shown in FIG.
As shown in FIGS. 1 and 2, the substrate processing apparatus 100 uses a hoop (substrate container; hereinafter referred to as a pod) 110 as a wafer carrier. In front of the front wall 111a of the housing 111 of the substrate processing apparatus 100, a front maintenance plate 103 is opened as an opening for enabling maintenance. Front maintenance doors 104 and 104 are respectively built in the front maintenance door 103 to open and close it.
A pod loading / unloading port (substrate container loading / unloading) 112 is opened on the front wall 111 a of the casing 111 so as to communicate with the inside and outside of the casing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading opening / closing mechanism) 113.

A load port (substrate container delivery table) 114 is installed on the front front side of the pod loading / unloading port 112. The load port 114 is configured such that the pod 110 is placed and aligned.
The pod 110 is carried onto the load port 114 by an in-process carrying device (not shown), and is also carried out from the load port 114.
A rotary pod shelf (substrate container mounting table shelf) 105 is installed at a substantially central portion in the front-rear direction in the housing 111.
The rotary pod shelf 105 is configured to store a plurality of pods 110. In other words, the rotary pod shelf 105 is vertically arranged and intermittently rotated in a horizontal plane, and a plurality of shelf boards (supported by a substrate container) that are radially supported by the support 116 at each of the upper, middle, and lower positions. The rack 117 is configured to hold a plurality of pods 110 in a state where the pods 110 are respectively placed.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111, and the pod transfer device 118 moves up and down while holding the pod 110. A pod elevator (substrate container lifting mechanism) 118a and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism are configured. The pod transfer device 118 includes a pod elevator 118a and a pod transfer mechanism 118b. The pod 110 is transported between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by continuous operation.

A sub-housing 119 is constructed across the rear end of the lower portion of the housing 111 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages. A pair of pod openers 121 and 121 are installed at the upper and lower wafer loading / unloading openings 120 and 120, respectively.
The pod opener 121 includes a mounting table 122 on which the pod 110 is placed, and a cap attaching / detaching mechanism (benefits attaching / detaching mechanism) 123 that attaches / detaches a cap (lid) of the pod 110. The pod opener 121 is configured to open and close the wafer inlet / outlet port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

The sub-housing 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the pod transfer device 118 and the rotary pod shelf 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124, and the wafer transfer mechanism 125 is a wafer transfer device (rotation or linear movement of the wafer 200 in the horizontal direction). Substrate transfer device) 125a and wafer transfer device elevator (substrate transfer device lifting mechanism) 125b for raising and lowering wafer transfer device 125a.
As shown in FIG. 3, a wafer abnormality detection device 400 is attached to the wafer transfer device 125a in order to detect the transfer state of the wafer 200. For example, as shown in FIG. 3, the wafer abnormality detection device 400 rotates a pair of detection arms 401 and 401 rotatably attached to both sides of the wafer transfer device 125 a and the pair of detection arms 401 and 401. It is comprised from the actuator (not shown) for making it drive, and the transfer information of the wafer 200 is detected by the sensor S attached to the pair of detection arms 401 and 401. The sensor S is constituted by a light shielding sensor including a light emitting / receiving sensor, for example.

  FIG. 11 is a diagram for explaining the wafer position data detected by the wafer abnormality detection device 400. As is clear from FIG. 11, an actuator (not shown) is driven to move the wafer transfer device 125a from the bottom to the top. Then, the positions of Bottom, Peak, and Top are sequentially detected from the lower side of the wafer 200 as wafer position data detected by the wafer abnormality detection device 400 shown in FIG. Illustration of the boat 217 is omitted.

As schematically shown in FIG. 1, the wafer transfer apparatus elevator 125 b is installed between the right end of the pressure-resistant casing 111 and the right end of the front area of the transfer chamber 124 of the sub casing 119.
The continuous moving body of the wafer transfer device elevator 125b and the wafer transfer device 125a allows the tweezer (substrate holder) 125c of the wafer transfer device 125a to be a mounting portion of the wafer 200 and the boat (substrate holder) 217. The wafer 200 is loaded (charged) and unloaded (discharged).
In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured.
A processing furnace 202 is provided above the standby unit 126, and a lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace shutter (furnace port opening / closing mechanism) 147.

Further, a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed between the right end of the pressure-resistant casing 111 and the right end of the standby section 126 of the sub casing 119.
A seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a coupling device coupled to the elevator platform of the boat elevator 115.
The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202. The boat 217 includes a plurality of holding members having slots (grooves) for supporting a plurality of wafers 200 in multiple stages, and aligns the centers of a plurality of (for example, about 50 to 200) wafers 200. Each of the boats 217 is horizontally held in the state of being aligned in the vertical direction.

  A supply fan and a dust-proof filter are supplied to the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side so as to supply a clean atmosphere or clean air 133 which is an inert gas. A clean unit 134 is installed, and a notch serving as a substrate alignment device for aligning the circumferential position of the wafer 200 is not shown between the wafer transfer device 125a and the clean unit 134, although not shown. A matching device 135 is installed.

  The clean air 133 blown out from the clean unit 134 flows into the notch aligner 135, the wafer transfer device 125a, and the boat 217 in the standby unit 126, and is then sucked in through a duct (not shown) to the outside of the casing 111. Exhaust is performed, or the air is circulated to the primary side (supply side) that is the suction side of the clean unit 134, and is again blown into the transfer chamber 124 by the clean unit 134.

Next, the operation of the substrate processing apparatus 100 according to the present invention will be described with reference to FIGS.
When the pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113, and the pod 110 on the load port 114 is placed inside the casing 111 by the pod transfer device 118. It is carried in from.

The loaded pod 110 is automatically transported and delivered by the pod transport device 118 to the designated shelf 117 of the rotary pod shelf 105, temporarily stored, and then one pod opener from the shelf 117. After being transferred and transferred to 121 and temporarily stored, it is transferred from the shelf plate 117 to one pod opener 121 and transferred to the mounting table 122 or directly transferred to the pod opener 121 and mounted. 122.
At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133. For example, the transfer chamber 124 is filled with nitrogen gas as clean air 133, so that the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the casing 111 (atmosphere).

The pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 on the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. The wafer loading / unloading port is opened (substrate transfer).
When the pod 110 is opened by the pod opener 121, the wafer 200 is picked up from the pod 110 by the tweezer 125c of the wafer transfer device 125a through the wafer loading / unloading port, aligned with the notch alignment device 135 (not shown), and then transferred. It is carried into the standby section 126 behind the loading chamber 124 and loaded into the boat 217 (charge).
The wafer transfer device 125 a that has delivered the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

  During the loading operation of the wafer 200 to the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 is separated from the rotary pod shelf 105. The pod 110 is transferred by the pod transfer device 118, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When charging of the wafer 200 to the boat 217 is completed, the transfer information is detected by the wafer abnormality detection device 400. At this time, as shown in FIG. 3, the detection arm 401 is inserted below the wafer on the boat 217, and then the wafer transfer device 125a is rotated around the vertical axis, moved up and down, moved back and forth, and moved left and right. The wafer is sequentially moved to a plurality of wafer crack detection points. Whether or not the position of the boat slot is appropriate is detected by the light shielding of the sensor S by the light shielding of the sensor S, and the crack of the wafer 200 is compared with the displacement amount (deflection) of each point or each wafer. It is obtained from the relationship between the amount of displacement at the crack detection point and the allowable stress.

  When the boat 217 is inserted, the boat 217 is opened by a furnace shutter 147 that opens and closes the lower end of the processing furnace 202. Subsequently, the seal cap 219 holding a plurality of wafers 200 is lifted by the boat elevator 115, whereby the wafers 200 are loaded into the furnace by loading the boat 217 into the processing furnace 202 (loading). Is done.

After the wafer 200 is loaded, the processing furnace 202 performs arbitrary processing such as oxidation, film formation, and diffusion processing on the wafer 200.
After the processing, the wafer 200 and the pod 110 are operated in a generally reverse order except for the alignment process of the wafer 200 by the notch alignment device 135 (not shown) and the abnormality detection process of the wafer 200 after the boat 217 is unloaded. It is paid out outside, that is, outside the casing 111.

In the wafer abnormality detection step after unloading, a wafer abnormality, that is, a wafer crack is detected before the processed wafer 200 is extracted from the boat 217.
When a wafer crack is detected, the wafer transfer device 125a charges a wafer having an abnormal transfer state (hereinafter referred to as an abnormal wafer) and a peripheral wafer to a transfer container different from the pod 110.
Thereafter, normal wafers 200 without cracks are discharged from the pod 217 and are carried out of the apparatus.

  In the present embodiment, the case where the wafer abnormality detection process is set to be performed after unloading is described, but the present invention is not limited to this case. For example, the wafer abnormality detection step may be performed after the wafer 200 is loaded into the boat 217 and before the substrate is processed. With this setting, if a transport error occurs during wafer charging, the wafer charging can be interrupted and wafer cracks can be detected before the wafer 200 is recovered. It is possible to prevent loss such as out. Further, the wafer abnormality detection step can be performed both after the wafer 200 is loaded in the boat 217 and before the wafer 200 is recovered (discharged) from the boat 217 after the heat treatment. With this setting, the wafer abnormality detection process is performed after the heat treatment after obtaining the reference data before the heat treatment, so that the wafer crack can be detected under the optimum conditions.

FIG. 4 shows an example of a controller of the substrate processing system 300 that controls the plurality of substrate processing apparatuses 100.
The substrate processing system 300 is provided with a management or analysis computer 302, and the substrate processing apparatus 100 is provided with a process module controller (hereinafter referred to as PMC: Process Module Controller) 310. The PMC 310 is connected to a management or analysis computer 302 via a communication line 304 such as a LAN for communication. In general, the management computer 302 performs operation management of the plurality of substrate processing apparatuses 100, and the analysis computer 302 is used to analyze data transmitted from the plurality of substrate processing apparatuses 100. Installed outside the clean room.

FIG. 5 is a block diagram showing the configuration of the controller.
As shown in the figure, the controller includes a main control unit 312 and a sub-control unit 314. The main control unit 312 includes an input / output device 306, a CPU 316, and a storage unit 317 as a storage unit. , A transmission / reception processing unit 322 that transmits / receives data to / from the management or analysis computer 302, and an I / O control unit 324 that performs I / O control between the CPU 316 and the sub-control unit 314. The configuration of the management or analysis computer 302 is substantially the same as that of the main control unit 312.

  The sub-control unit 314 includes, for example, a temperature control unit 326 that controls the temperature in the processing chamber 201 to the substrate processing temperature by a heater (not shown) provided on the outer periphery of the processing furnace 202, and a gas in the processing furnace 202. A gas control unit 328 for controlling the supply amount of the reactive gas supplied into the processing furnace 202 based on an output value (detected value of the mass flow controller) 342 provided in the pipe 340, and a processing furnace The pressure in the processing chamber 201 of the processing furnace 202 is controlled to the substrate processing pressure by controlling the opening / closing or opening of the valve 348 based on the output value (detected value) of the pressure sensor 346 provided in the exhaust pipe 344 of the 202. Based on the detected value of the wafer abnormality detection device 400, the pressure control unit 330 that controls the transfer control unit 350 that controls the actuator of the substrate transfer system, and the like. Constituted by the abnormality determining unit 351 determines the transfer state of the wafer 200 Te. The abnormality determination unit 351 may be incorporated in the transport control unit 350.

The storage unit 317 includes, for example, a ROM (Read Only Memory) 318, a RAM (Random Access Memory) 320, and a hard disk HD, and stores recipes, various programs, and reference data.
As reference data, wafer individual information, wafer type information, wafer transfer information, and wafer transfer state correction information for each wafer 200 are stored.
Here, the wafer individual information includes, for example, a lot ID indicating the lot number of the wafer 200, a boat slot number indicating the slot insertion position of the pod 110, and a slot for the boat 217 designated by the boat 217 for inserting the wafer 200. The edited data is a set of a plurality of pieces of information including a boat slot number and a wafer type.
The wafer type information refers to information indicating the type of wafer, specifically, information indicating the type of wafer such as a production wafer, a monitor wafer, a side dummy wafer, a supplemental dummy wafer, and the like. The wafer transfer information refers to information indicating the transfer state of the wafer 200 on the boat 217 obtained from the individual information of each wafer 200.
Further, the transfer information of the wafer 200 includes information on the determination result determined by the abnormality determination unit 351. This information (abnormal information on the wafer 200) is roughly divided into normal or abnormal transfer state of the wafer.
When the transfer state is abnormal, the insertion depth of the wafer 200 into the slot of the boat 217 is shallow, the wafer 200 is ejected from the boat 217 (hereinafter referred to as wafer ejection), and the wafer 200 is cracked. The wafer 200 is inserted into the slot of another boat 217 (hereinafter referred to as a slot difference), not in the designated boat 217 slot, and in the wafer transfer device 125a side. There is information indicating an abnormal state such as a state in which the slot of the designated boat 217 is left empty (hereinafter referred to as an empty slot). When normal, there is information indicating a state of no abnormality.
Moreover, the correction information on the transfer state of the wafer 200 refers to information corrected by correction in the case of an abnormality in the transfer information of the wafer 200. The correction of the transfer state is necessary in order to combine the data on the hardware side of the substrate processing apparatus and the data on the system on the controller side after the transfer state is restored by maintenance.
The wafers 200 held in the boat 217 are displayed in different colors for distinction on the screen for each type, and the normal or abnormal transfer state (whether there is an abnormality) related to the wafers 200 held in the boat 217 is displayed on the screen. Is displayed. In addition, when the transfer state is abnormal, the correction information of the wafer transfer state is displayed on the screen separately between before correction (when abnormal) and after correction (after canceling abnormality).

  The input / output device 306 includes a display unit 334 that displays data stored in the storage unit 317, an input unit 332 that receives operator (user) input data (input instructions) from the operation screen of the display unit 334, and an input unit Until the input data received at 332 is transmitted to the transmission / reception processing unit 322 by the display control unit 336, which will be described later, the temporary storage unit 335 to store temporarily, the input data (input instruction) from the input unit 332 are received, The display control unit 336 transmits the input data to the display unit 334 or the transmission / reception processing unit 322.

  The display control unit 336 is configured to receive an instruction (execution instruction) for executing an arbitrary recipe among a plurality of recipes stored in the storage unit 317 by the CPU 316 via the transmission / reception processing unit 322, and the display unit 334. Operate various display screens required for substrate processing, such as recipe selection, editing and execution screens, command execution screens, recovery execution screens, and monitor screens for the operating status of the substrate processing apparatus 100 It is configured to display on the screen and to display wafer status screens G1 and G2 described later on the operation screen.

  When a recipe created or edited by the input / output device 306 on the operation screen is executed, the recipe setting values are referred to by the sub-control unit 314 in the order of each step, and the substrate transport system and substrate processing system of the substrate processing apparatus are referred to. Substrate processing, for example, substrate oxidation, diffusion, and film formation, is performed by feedback control of the actuator.

  When transferring the wafer 200 to the boat 217 or transferring the wafer 200 from the boat 217 to the pod 110, the transfer control unit 350 stores individual wafer information (for each wafer 200 stored in advance in the storage unit 17 ( The wafer transfer device 125a and the boat elevator 115 are configured to control the wafer 200 transfer system and the wafer transfer system with reference to the wafer ID).

  The abnormality determination unit 351 executes the recipe and processes the wafer 200, and after the boat 217 is unloaded from the processing furnace 202 or loaded into the processing furnace 202, the wafer abnormality detection apparatus 400 performs the wafer 200. The transfer state of the wafer 200 is determined based on the result detected for each.

  FIG. 6 shows an example of a wafer status screen G1 displayed on the operation screen by the display control unit 336.

On the wafer status screen G1, the type of each wafer 200 on the boat 217 and the transfer information of each wafer 200 are displayed in detail.
In addition, on the wafer status screen G1, as will be described later, an inquiry display 519 for inquiring the type and transfer state of the wafer 200 is displayed, the designation of the processing for removing the broken wafer, and the position of the jumped wafer are displayed. A button for specifying an operation for correction and a release process after removing the broken wafer is displayed.

  The wafer transfer state (map), wafer transfer state, and transfer state correction information are “Wafer Map” (MAP) 500, “Detect Info.” (BK) 501, and “Info. Correct” (SET) 502, respectively. The detailed information of the transfer information is displayed in the detailed information list 504.

  “Wafer Map” 500, “Detect Info.” 501, and “Info Correct” 502 are each displayed in the form of a boat image diagram. These boat image diagrams are displayed on the wafer status screen G1 in the form of a combination image or a combined image of a boat image that is a side image of the boat 217 and a wafer image that is a side image of the wafer 200.

In the boat image diagram of “Wafer Map” 500, the wafer type is distinguished by color coding. In addition, the wafer image does not have to be displayed in the slot of the boat 217 in which the wafer 200 is not placed. You may do it.
In the boat image diagram of “Detect Info.” 501, a wafer image in a normal transfer state and a wafer image in an abnormal transfer state are distinguished by color coding.
Further, in the boat image diagram of “Info Correct” 502, a wafer image in a normal transfer state that does not need to be corrected and a wafer image of correction information in the transfer state corrected by correction are distinguished by color coding. In this case, the wafer image of the correction information in which the transfer state is corrected is distinguished from the wafer image in the normal transfer state that does not need correction by color coding.
In the boat image diagram of “Detect Info.” 501, the color classification of the wafer type used in the boat image diagram of “Wafer Map” 500 is applied to the wafer image in the normal transfer state as it is, and the wafer in the abnormal transfer state is applied as it is. Only the image may be changed to a distinguishable color. In this way, what type of wafer is mounted in which slot in the boat image diagram of “Detect Info.” 501, and in which slot of the boat 217 the wafer 200 with an abnormal transfer state exists. I can grasp it.
Also, in the boat image diagram of “Info Correct” 502, the color classification of the wafer type used in the boat image diagram of “Wafer Map” 500 is directly applied to the wafer image in the normal transfer state, and the color of the wafer image after correction is changed. You may make it change into the color which can be distinguished from another color. In this way, in the boat image diagram of “Info Correct” 502, the type of the wafer 200, the transfer state, and the correction of the transfer state are clearly grasped. “No wafer” indicates a case where the wafer 200 is not inserted into the slot of the boat 217 from the beginning. Furthermore, the wafer image in the abnormal transfer state used in the boat image diagram of “Info Correct” 502 is applied as it is, so that the color of the corrected wafer image that has been processed to cancel the abnormality is distinguished from other colors. May be. Then, it becomes easy to grasp the progress of abnormal wafer recovery processing.
The correction of the wafer transfer state is executed after the maintenance of the abnormal wafer is performed by the operator.
When the transfer state is corrected, the display control unit 336 updates the transfer information stored in the storage unit 17.
When the correction of the transfer state on the boat 217 is executed after the maintenance of the operator in this way, the information on the system on the hardware side of the substrate processing apparatus 100 and the software side of the substrate processing system are mutually matched. Since they match, the mismatch between the actual transfer information of the boat 217 and the data on the system is resolved.

The detailed information list 504 includes a plurality of detailed displays 504a.
The detailed display 504a is provided for each wafer (or for each slot of the boat 217). The normal map state display (wafer type information) 608, the wafer state display 609 (wafer abnormality information), and the state correction button (wafer) (Transfer state correction information) 610, and the boats below the display categories set on the wafer status screen G1, for example, “001-010”, “011-020”,..., “121-125” Arranged in order of slot number. The numbers in “” of each section indicate the slot number of the boat 217, respectively.

In the normal map status display 608, the display color is determined based on the absence of a wafer (with a slot), the type of the wafer 200, and others (without a slot), and the wafer status display 609 and the status correction button 610 have no wafer (with a slot). The display color is determined based on the type of the wafer, the abnormal wafer, the removed wafer, the access prohibited wafer, and others (no slot).
Further, on the surface of the state correction button 610, symbols corresponding to the wafer type and the abnormal wafer type, for example, “S”, “P”, “M”, “?”, “!” Are displayed.
When the wafer is abnormal, that is, a broken wafer or a jumped wafer, the display color and symbol of the abnormal wafer are used as the display color and symbol of the state correction button 610.
“S” indicates a side dummy wafer, “P” indicates a product wafer, “M” indicates a monitor wafer, “?” Indicates an abnormal wafer, and “!” Indicates an access-prohibited wafer.

The state correction button 610 is linked to the execution program. When pressed, the state correction button 610 displays the wafer transfer information before correction, which is the detection result of the wafer abnormality detection device 400, corresponding to the result of the maintenance performed on the abnormal wafer. A pop-up window 611 for correction is displayed.
In the pop-up window 611, a “removal” button 612 and a “position correction” button 613 are displayed as correction buttons.
The “remove button” 612 is linked to the execution program, and when pressed, the display color of the state correction button 610, for example, red is changed to a display color without a wafer, for example, white, and the state correction button 610 is further displayed. The symbol of the abnormal wafer on the surface, for example, “?” Is changed without displaying the symbol corresponding to the state of no wafer.
The “no wafer” state is a state where the wafer 200 is not inserted into the slot. In other words, as a result of the maintenance performed on the broken wafer by pressing the “removal” button 612, that is, the removal of the wafer placed in the slot where the broken wafer is generated, and the display of the state correction button 610 corresponding to the slot. Can be matched.

A “position correction” button 613 is also linked to the execution program, and when pressed, the display color of the state correction button 610, for example, red is changed to a display color without a wafer, for example, white, and the state is further changed. A symbol of an abnormal wafer attached to the surface of the correction button 610, for example, “?” Is changed to a symbol for displaying the wafer type, for example, “S”.
That is, the result of the maintenance performed on the wafer jump-out, that is, the retry processing of the wafer placed in the slot in which the wafer jump-out occurs is matched with the display of the state correction button 610 corresponding to the slot.
Further, the display color of the wafer status display 609 is changed in conjunction with the change of the display color of the status correction button 610. Therefore, by pressing the state correction button 610, the wafer transfer information can be corrected and the display color of the abnormal wafer in the wafer state display 609 can be changed to the display color without a wafer.

  In the pop-up window 611, a “return” button 614 and a “CANCEL” button 615 are displayed. A “return” button 614 terminates the pop-up window 611 and returns to the original wafer status screen G1, and a “CANCEL” button 615 is a button for canceling correction by the “removal” button 612 and the “position correction” button 613. .

The inquiry display 519 is displayed separately by the display control unit 336, for example, on a wafer status screen G1 and a pop-up window 611. The pop-up window 611 includes “S: side dummy wafer”, “M: monitor wafer”, “P: product wafer”, “X: monitor wafer”, “F: dummy wafer”, “!: Access prohibited wafer”, etc. Inquiry information about the wafer type is displayed in the form of buttons or cells. The wafer status screen G1 displays inquiry information regarding the wafer transfer status such as “?: Abnormal wafer”, “!: Access prohibited wafer”, and the like.
The inquiry information is displayed in different colors based on the wafer type and the wafer transfer state type.

  In addition, the wafer status screen G1 is used for designating operations for collecting broken wafers, correcting the position of jumped wafers, and for releasing processing after removing broken wafers, and for reflecting the results on the screen. Button (to be described later), an “ERR CLR” button 601 for canceling the error, and a “setting” button 602 for confirming the operation of these buttons.

The abnormal wafer removal button includes a “force” button 603, a “continue processing” button 604, a “removal start” button 605, and a “removal end” button 606. The “Force” button 603 is a button for causing the wafer transfer device 125a to discharge the wafer 200, the “Continue processing” button 604 is a button for releasing the pause of the wafer transfer device 125a, and the “Start removal” button 605 is a wafer. A button for causing the transfer device 125a to perform an operation for removing the broken wafer, “Removal End” button 606, displays the transfer information of the slot of the boat 217 from which the broken wafer is removed after the broken wafer is removed. This is a button for enabling correction to change to an empty slot (no wafer) on G1.
The “setting” button 602 is a button for confirming the setting for the removed broken wafer and the setting for error cancellation of the jumped wafer.
The “ERR CLR” button 601 is a button for causing the wafer transfer device 125 a to recharge the jumped wafer to a normal position in the slot of the boat 217.
The “ERR CLR” button 607 is a crack detection operation error cancel button. This button 607 performs error cancellation when the wafer crack detection operation ends abnormally.
The results of these button operations are displayed on the status screen G1 as “break detection operation” and “pop-out state”.
The result of removing the broken wafer is displayed in the “crack detection operation”, and the result of correcting the position of the pop-out wafer is displayed in the “pop-out state”.

In the display of “break detection operation”, the result of the wafer break detection operation is displayed in the cell on the left side of the “ERR CLR” button 607 by “OK” or “ERR”.
“OK” indicates that the wafer crack detection operation has been completed normally, and “ERR” indicates that the wafer crack detection operation has been terminated abnormally.
When “ERR” is displayed, the crack detection error release button 607 is displayed as “ERR CLR” beside the cell displaying “ERR”, and when “OK” is displayed, “NOP” is displayed. Is done.
The display of “ERR CLR” and “NOP” is selectively displayed in this way based on the detection result of the wafer abnormality detection apparatus 400.

In the “flying state” display, the result of the wafer jumping is displayed by “OK” or “ERR”.
“OK” represents that the wafer 200 has not been ejected, and “ERR” represents that the wafer 200 has been ejected.
When “ERR” is displayed, the pop-up error release button 601 is displayed as “ERR CLR” next to the cell displaying “ERR”. When “OK” is displayed, “NOP” is displayed beside the cell displaying “OK”. Display of “ERR CLR” and “NOP” is selectively displayed in this way based on the detection result of the wafer abnormality detection apparatus 400.
When the “ERR CLR” button 601 is pressed, an error release instruction for correcting the pop-out wafer is output to the wafer transfer device 125a.
When an abnormal wafer is generated, the wafer designation button is omitted in this example, but one of the “set” button 602 and the state correction button 610 is designated as a shift key and designated by a combination. Also good.

  Next, referring to FIG. 6, an example of an abnormality detection procedure, and a wafer abnormality detection apparatus 400 specify a process after a wafer abnormality is detected and a cancellation process after removal, and the result is An example of a procedure for displaying the substrate transfer status and the detailed information of the substrate and reflecting it on the wafer status screen G1 will be described.

When an abnormal wafer occurs, in the boat image diagrams of “Detect Info.” 501 and “Info Correct” 502, the color of the wafer image of the abnormal wafer is a specific color of the abnormal wafer inquired in the inquiry display 519, for example, a dark color. It becomes.
For example, in FIG. 6, in “Detect Info.” 501, the slot No. Before and after 85, slot no. The color of the 60-70 wafer image is the color of the abnormal wafer. Further, the wafer status display 609 (wafer transfer information) of the detailed information list 504 and the color of the state correction button 610 for the same slot No. are the same as the color of the abnormal wafer.
Therefore, it can be seen from these results that a plurality of abnormal wafers exist in the boat 217.
Next, looking at the symbols attached to the state correction buttons 610, the slot No. 80, slot no. On the state correction button 610 of 85, the symbol “?” It can be seen that the state correction buttons 610 of 60 to 70 are marked with “M”. Therefore, by pressing the state correction button 610 and referring to the pop-up window 611 displayed on the wafer status screen, it can be seen that “M” is a monitor wafer.
Here, the combination of the color of the abnormal wafer and “?” Means a broken wafer, and “M” and “S” mean the wafer type. 80, slot no. Wafer cracking occurred at slot 85, and slot no. In each of the slots 60 to 70, it can be seen that the wafer is projected on the monitor wafer.

  When an abnormal wafer is found, a maintenance operation is performed from the wafer status screen G1 to eliminate wafer cracking and wafer jumping.

<About wafer crack maintenance>
<When collecting a wafer that was cracked first>
A “force” button 603, a “continue processing” button 604, a “removal start” button 605, and a “removal end” button 606 collect the broken wafer first by the operator opening the back door of the apparatus and collecting the remaining normal. Used when the wafer is collected by the wafer transfer device 125a.
When a wafer crack occurs, first, a “start removal” button 605 is pressed to make it possible to remove the broken wafer. The state in which the broken wafer can be removed means that the boat on which the broken wafer is placed is moved so that the operator can open the apparatus rear door and remove the boat. After removing the broken wafer, the operator closes the rear door of the apparatus and presses the “removal end” button 606. When the “removal end” button 606 is pressed, the boat on which normal wafers are loaded moves to a position where the wafer transfer device 125a can collect the boat. The operator corrects the wafer information of the broken wafer collected by hand. Thereafter, when the “continue processing” button 604 is pressed, the wafer crack detection operation is re-executed. When the “force” button 603 is pressed, a normal wafer is collected by the wafer transfer device 125a. This completes the maintenance of the broken wafer.
<When collecting normal wafers first>
The “normal wafer recovery” button 616 and the “redetection” button 617 are used when an operator opens the back door of the apparatus and manually recovers the broken wafer after the normal wafer is recovered by the wafer transfer apparatus 125a. .
When a wafer crack occurs, first, a “normal wafer recovery” button 616 is pressed, and a normal wafer is recovered by the wafer transfer device 125a. After the normal wafers are collected, the operator opens the rear door of the apparatus and collects the broken wafers by hand. After removing the broken wafer, the operator closes the rear door of the apparatus. Thereafter, wafer information correction of the broken wafer collected by hand is performed.
The wafer cracking state on the boat is confirmed, and if there is no abnormal wafer, a “redetection” button 617 is pressed.
If the wafer crack detection operation ends abnormally during maintenance, the error is cleared by pressing the “ERR CLR” button 607 displayed next to “Break detection operation”, and then the above operation procedure is repeated. To remove the broken wafer.
When the broken wafer is recovered normally, “OK” and “NOP” are displayed next to the display of “crack detection operation”.
<About correction of wafer transfer information>
When the recovery of the broken wafer is completed, the data on the hardware side and the system side of the substrate processing apparatus are subsequently matched. In this case, first, a pop-up window 611 is displayed on the wafer status screen G1 by pressing the state correction button 610.
At this time, the state correction button 610 to be pressed remains red, for example, before collecting the broken wafer.
When the “removal” button 612 of the pop-up window 611 is pressed, the colors of the state correction button 610 and the wafer state display 609 change from red to a color without a wafer, for example, white.
After confirming the color change of the state correction button 610 and the wafer state display 609, the change is confirmed by pressing the “set” button 602 on the wafer status screen G1.
As a result, the colors of the state correction button 610 and the wafer state display 609 are determined to be white, and in conjunction with this, the color of the wafer image of the broken wafer of “Info Correct” 502 is changed to the same white.

<Maintenance of wafer jump>
In this case, the wafer jumping state on the boat is confirmed. When there is a wafer in the jumping state, the operator opens the rear door of the apparatus and corrects the wafer jumping state. Thereafter, the “redetection” button 617 or the “continue processing” button 604 is pressed to re-execute the wafer crack detection operation.
If there is no wafer that has been ejected, the “re-detect” button 617 or the “continue processing” button 604 is pressed to re-execute the wafer crack detection operation.

  Note that, from the display of “Info Correct” 502 and the detailed display 504a in FIG. 110 and slot no. No wafer is inserted into the slot No. 70 and there is no slot. There are no slots after 126, that is, up to 125 wafers can be inserted. 51 to 60, the product wafer is slot No. 71 to 109, side dummy wafers are slot numbers. It can be seen that it is inserted in the state of no failure (no abnormality) in 111-120.

Therefore, according to the wafer status screen G1, it is possible to confirm on the same screen what type of wafer 200 is inserted on the boat 217, at which position, whether or not there is an abnormal wafer and its slot. In addition, since the abnormal wafer collection or slot insertion position can be corrected by pressing a button on the operation screen, the usability is greatly improved.
However, Wafer Map (Map) 500, Detect Info. (BK) 501 and Info Correct (SET) 502 boat image diagram and detailed display 504a of 1 to 160 (may be 1 to 200) are displayed on the same wafer status screen G1, characters and symbols The display content that can be displayed on each detail display 504a is limited, and the screen is difficult for the operator to grasp.

  FIG. 7 shows a wafer status screen G2 improved in view of such a background.

Similarly to the wafer status screen G1, the wafer status screen G2 also corrects wafer individual information, wafer type information for color-coded display, wafer transfer information, and wafer transfer state of each wafer 200 stored in the storage unit 17. It is created based on the information and displayed on the operation screen by the display control unit 336.
The wafer status screen G2 is displayed on the operation panel 510.
In this wafer status screen G2, “Wafer Map” (wafer map) 515, “Detect Info.” (Detection information) 516, “Info Correct” (correction information) 517, detailed information display 518, and inquiry display 519 are displayed. The
These “Wafer Map” (wafer map) 515, “Detect Info.” (Detection information) 516, and “Info Correct” (correction information) 517 are boat image diagrams closer to the boat 217 on the screen than the wafer status screen G1. However, since the configuration and function are the same, detailed description is omitted here. Also, “Boat usage” is designated as “Boat A”. For example, in the operation with the two-boat specification, the boat 217 can be selected here.

The inquiry display (wafer type and transfer status display) 519 is arranged at the upper part of the wafer status screen G2, and includes a plurality of cells for displaying the type of the wafer 200, and characters and symbols for inquiring the color of each cell. The
In the illustrated example, the production wafer (PD) is inquired by the color of “lightseagreen” and “PD: Product”, and the monitor 1 wafer (M1) is inquired by the color of “mediumplateblue” and “M1: Monitor1”. Further, the side dummy wafer (SD) is inquired by the color of “andybrown” and “SD: SideDummy”, the supplementary dummy wafer (FD) is collated by the color of “mediumpurple” and “FD: FillDummy”, and “darksalmon”. Anomalous wafers are queried by the color and “Abnormal”.

One detail display button 520 is assigned to each boat slot display section obtained by dividing (dividing) the number of boat slots of the boat 217 by a predetermined number.
In the present embodiment, one detail display button 520 is assigned to each of the eight display sections “1-25”, “26-51”,..., “176-200”. The detail display button 520 is provided at the center of the screen in parallel with the boat image and the boat slot No. of the boat 217. The same vertical display is displayed. When these detailed display buttons 520 are pressed, a list of transfer information (hereinafter referred to as a detailed display list) 521 of the wafers 200 in the assigned display category is displayed on the wafer status screen G2. It is configured.
Therefore, for example, when the detail display button 520 of “1-25” is pressed, the detail display list 521 of the wafers 200 inserted in the slots of the boat 217 corresponding to the slot numbers 1 to 25 of the boat 217 is displayed on the wafer status screen. When the detail display button 520 of “176-200” is pressed on G2, the detailed display list 521 of the wafers 200 inserted in the boat slot of the slot number 176-200 of the boat 217 is displayed on the wafer status screen G2. Displayed above.

The detailed display list 521 is displayed on the same screen as the boat image diagram with the display row of the detailed display buttons 520 interposed therebetween.
The detailed display list 521 is configured in a table format of n rows and m columns, and the numbers corresponding to the boat slot numbers, “Wafer Map”, “Detect Info.”, “Collection”, “Top”, “Peak”. , Each cell displaying detailed data of “Bottom”.
In the detailed display list 521, a “Wafer Map” cell 522, a “Detect Info.” Cell 523, and a “Collection” cell 524 are similar to the “Wafer Map” 515, “Detect Info.” 516, and “Info. Correction” 517. The color classification is performed based on the wafer type information, the wafer transfer information, and the wafer transfer state correction information stored in the storage unit 17.
In the “Wafer Map” cell 522, the same character symbol or abbreviation as the inquiry display 519, for example, “FD”, “M1”, “M2”, “PD”, “SD” is displayed, and the “Detect Info.” Cell is displayed. In the field 523, for example, “Normal” or “Abnormal” is displayed as the detailed information of the wafer type, and in the “Collection” cell 524, for example, blank (“Clear” is used as correction information for correcting the wafer transfer state. "Is used to mean blank). Each “Collection” cell 524 is a button that can be pressed. In this case, “Normal” in the “Detect Info.” Cell 523 and the “Correction” cell 524 means that the wafer 200 is inserted into the slot of the boat 217 without any abnormality.
Further, Top, Peak, and Bottom respectively display numerical data of each measurement point detected by the wafer abnormality detection device 400.

Here, the numerical data of each measurement point is collectively referred to as wafer position data 525. The wafer status screen G1 and the wafer status screen G2 are clearly different from each other in that the wafer position is shown in the detailed display list 512 together with the “Wafer Map” cell 522, the “Detect Info.” Cell 523, and the “Collection” cell 524. Data 525 is displayed. This wafer position data 525 is naturally displayed on the same screen as boat images such as “Wafer Map” 515, “Detective Info.” 516, “Info. Correction” 517, and the like. As is clear from the wafer status image G2, the normal wafer 200 in the transfer state is displayed as “Normal” in the “Detect Info.” Cell 523 and the “Collection” cell 524, and the wafer position in this case In the data 525, the difference between Top and Peak and the difference between Peak and Bottom are 5 each. However, the numerical values of the wafer position data 525 indicating the abnormal wafer are Top of 855, Peak of 875, and Bottom of 845, and it is clearly recognized that the wafer is abnormal.

On the wafer status screen G2, the number of detail display buttons 520 is greatly reduced, and the detailed display list 521 is displayed in the free space on the obtained screen. Therefore, the screen is easier to see and easier to operate than the wafer status screen G1. Is obtained. Further, when the detail display buttons 520 are arranged vertically between the boat image diagram and the detail display list 521, the details display button 520 can easily contrast the information of the boat image diagram with the information of the detail display list 521.
When the wafer status screen G2 is displayed, that is, when the wafer status screen G2 is opened, the detail display button 520 is programmed so that the detailed display list 521 including abnormal wafers is displayed. May be. In this way, when an abnormal wafer exists, the wafer status screen G2 is opened and the operator's attention is alerted at the same time, so the reliability of the system is improved. Note that the order of slot numbers is given priority in displaying such abnormal wafers.

Next, another status display of the wafer status screen G2 will be described.
The wafer status screen G2 includes a “Wafer Break Detect Unit Status” cell 511, a “Wafer Out Detect Unit Status” cell 512, and a “Wafer None Confirm” (no wafer confirmation). Display) Cell 513, “Transfer Status (display of operating status of wafer transfer device 125a)” cell 514 is displayed.
In addition, when specifying the information correction information of “Collection” in the detailed display list 521, a “1 Piece Cel” radio button and a “Zone Sel” radio button for selecting one or a plurality of designations are displayed. . These radio buttons are displayed on the wafer status screen G2 by the display control unit 336.

In the “Wafer Break Detect Unit Status (wafer break detection status)” cell 511, the text “None” or “Exist” is displayed.
“None” is displayed when the detection of the wafer abnormality detection device 400 is normal, and “Exist” is when the operation of the wafer abnormality detection device 400 is abnormal and currently the detection of the wafer crack is finished. Is displayed.

In the “Wafer Out Detect Status (wafer popping detection status)” cell 512, either “None” or “Exist” is displayed.
“None” is displayed when normal, that is, when a wafer jump-out has not occurred, and “Exist” is displayed when a wafer jump-out has occurred.
In addition, a “Clear” button is displayed next to the “Wafer Detect Unit Status” cell 511 and the “Wafer Out Detect Status” cell 512 as a release button for making it possible to cancel the abnormality of the wafer abnormality detection device 400.
The “Clear” button is displayed on the wafer status screen G2 only when the error can be canceled.

  A “Wafer None Confirm (wafer absence confirmation display)” cell 513 indicates whether or not the removal of the wafer 200 on the boat 217 has been completed. When an abnormal wafer is detected or a wafer jump is detected, “None (incomplete)” is displayed, and “None” is held until the wafer removal confirmation command on the boat 217 is normally completed. This alerts the operator.

In the “Transfer Status (status of the operation state of the wafer transfer device 125a)” cell 514, the operation state of the wafer transfer device 125a is displayed.
The operating states are Unknown (transfer device unspecified), HomePos (home position), Homing (during homing), SD Charging (during SD (side dummy wafer) charging), SD Disabling (during SD discharge), PD Charging ( PD (product wafer) charging), PD Discharging (PD discharge), M1 Charging (monitoring M1 wafer), M1 Discharging (M1 discharging), PM Charging (P & M wafer charging), PM Discharging ( P & M wafer discharging), AL Charging (all wafer charging), AL Discharging (all wafer discharge) ) “Broken Check” (wafer detection in progress) is displayed.

  As described above, the wafer status screen G2 includes the “Wafer Break Detect Unit Status (wafer break detection status)” cell 511, the “Wafer Out Detect Status (wafer popping detection status)” cell 512, and the “Wafer None Confirm (no wafer). (Confirmation display) "cell 513," Transfer Status (display of the operating state of the wafer transfer device 125a) "cell 514. Accordingly, the transfer state of the wafer 200 and the state of the wafer transfer device 125a are the same screens as the board image diagrams and the detailed display list 521 such as “Wafer Map” 515, “Detect Info.” 516, “Info. Correction” 517, etc. Since it is displayed on the screen, it becomes a user-friendly system.

Next, an example of the recovery function and the recovery operation using the wafer status screen G2 and the operation screen will be described.
“Wafer Break Detect Unit Status” cell 511 is “Exist (abnormal)” or “Wafer Out Detect Status (wafer popping detection status)” cell 512 is “Exist (abnormal)”. If this happens, the following recovery procedures (1) and (2) are executed.
(1) When “Wafer Break Detect Unit Status” cell 511 is “Exist (abnormal)” on wafer status screen G2:
In this case, the “Detect Retry” button is pressed from the recovery command. If the re-detection is not performed normally even if re-detection is performed, the “Force Clear (Clear)” button next to the “Wafer Break Detect Unit Status” cell 511 is pressed to forcibly cancel the error. After the release, the wafer 200 is collected and the wafer transfer device 125a and the crack detection mechanism are adjusted.
(2) When the “Wafer Out Detect Status (wafer popping detection status)” cell 512 is “Exist (abnormal)” on the wafer status screen G2:
In this case, the wafer jumping state of the boat 217 is confirmed.
If the wafer 200 of the boat 217 has jumped out, the jumping out is corrected and the “Detect Retry” button is pressed from the recovery command.
Even when the wafers 200 are not ejected from the boat 217, the “Detect Retry” button is pressed from the recovery command. If the re-detection is not performed normally even if re-detection is performed, the “Clear” button beside the “Wafer Out Detect Status” cell 512 is pressed to forcibly cancel the error. After the release, the wafer 200 is collected and the wafer transfer device 125a and the crack detection mechanism are adjusted.
The recovery command screen is displayed on the wafer status screen G2 when the “Recovery Command” button displayed on the operation panel 510 is pressed.

  FIG. 8 shows an example of a recovery command screen, which includes a “Detect Retry” button, a “Detect Result Confirm” button, a “Wafer Delete Confirm” button, and a “CANCEL” button.

The “Detect Retry” button is a wafer abnormality detection execution button linked to an execution program for operating the wafer transfer device 125a and detecting an abnormality of the wafer 200 by the sensor S of the detection arm 401, and the “Detect Result Confirm” button. ”Button is a wafer abnormality detection result confirmation button linked to an execution program for confirming the wafer abnormality detection result.
The “Wafer Delete Confirm” button is a crack detection confirmation button linked to an execution program for confirming the removal of an abnormal wafer. The cancel button is an execution program for returning from the recovery command screen to the original wafer status screen G2. Linked.

When “Wafer Break Detect Unit (crack detection mechanism status)” or “Wafer Out Detect Unit (wafer pop-up detection status)” is “Exist (abnormal)”, first, “Detect Retry” button on the recovery command screen By depressing, each error of cracking of the wafer 200 is detected again.
If the error is not resolved by the re-detection, the error transfer of the wafer transfer device 125a is canceled by pressing the “forced release (Clear)” button.

After the error is released, the wafers 200 on the boat 217 are collected, and the wafer transfer device 125a and the wafer abnormality detection device 400 are reset.
Here, the resetting means a setting for correctly detecting the transfer state of the wafer 200 with respect to the wafer 200 on the boat 217, for example, an abnormality or normality of the wafer 200. The adjustment of the actuator, the position adjustment of the sensor S, and the teaching of the wafer transfer device 125a correspond to this.

“Wafer Break Detect Unit Status Out Out Detect Status (break detection mechanism status)” cell 511 is “None (no abnormality)” and “Wafer Out Detect Status (wafer popping detection status)” cell 512 is “None (jump out)”. If there is a wafer 200 displayed as “Abnormal” in the “Detect Info.” Cells 516 and 523, recovery is executed in the next recovery procedure.
First, the state of abnormal wafers such as wafer cracks and jumps on the boat 217 is confirmed.
If there is an abnormal wafer, press the “Confirm crack detection result” button from the recovery command to confirm the result. The job is continued, and the wafer 200 in the area other than the abnormal wafer and the peripheral wafer is automatically collected. When the collection is completed, the job waits for abort completion and waits for recovery. Residual recovery of abnormal wafers and peripheral wafers.
The recovery of the broken wafer and the peripheral wafer is performed by an apparatus operator or an operator.
After collecting the broken wafer and the remaining wafer, the “Wafer Correct” button displayed on the operation panel 510 is pressed.
The “Wafer Correct” button is linked to an execution program for switching the screen mode of the wafer status screen G2 to the edit mode.
When the screen mode of the wafer status screen G2 is switched to the edit mode by pressing the “Wafer Correct” button, as shown in an enlarged view in FIG. 9, the button 524a in the “Collection” cell 524 of the detailed display list 521 is pressed. The transfer information can be edited.
Each button 524a is linked to an information correction screen stored in advance in the storage unit 17.
When the wafer transfer information (abnormal or normal) is corrected by correction, the transfer information is changed, stored in the storage unit 17, and referred to as wafer transfer information when the next wafer status screen G2 is displayed. .
In the present embodiment, the information correction dialog shown in FIG. 10 is displayed when the button 524a of the “Collection” cell 524 is pressed.
Here, “Wafer Delete” in FIG. 10 is selected when the wafer 200 is removed, and “Error Clear” can be selected when “Abnormal” can be transferred by the operator's confirmation.
After “Wafer Delete” and “Error Clear” are set, the setting is confirmed by pressing the “SET” button on the wafer status screen G2. When the setting is confirmed, the button 524a corresponding to each detailed data in the “Collection” cell 524 is held in a depressed state, and the display changes from “Abnormal” before correction to “blank” after correction, for example. Can be switched.
As a result, the display state of the wafer 200 in the boat image diagram matches the transfer state of the wafer 200 on the boat 217.
When all the recovery operations are completed, a “break wafer removal confirmation /“ Wafer Delete Confirm ”button is pressed from the recovery command.
When the removal confirmation is finished, the job waiting for the abort recovery is finished.

  As described above, according to the wafer status screen G2 according to the present invention, the transfer state of the wafer 200, the detailed information of the wafer 200, and the status of the wafer transfer device 125a can be confirmed on the same screen. improves.

  On the wafer status screen G2, the wafer position data 525 is displayed in the detailed display list 521 together with the “Wafer Map” cell 522, the “Detect Info.” Cell 523, and the “Collection” cell 524. Therefore, as described above, the abnormal wafer can be easily grasped by the numerical value of the wafer position data 525. In addition, by displaying actual numerical values, the numerical values are basically unchanged if the wafer is unchanged. However, the numerical value of the wafer position data 525 may change due to the film thickness deposited on the wafer. However, since the numerical values of Top, Peak, and Bottom can be confirmed on the screen, abnormal wafers can be managed by changing the difference between Top and Peak (or the difference between Peak and Bottom). For example, when the difference between Top and Peak (or the difference between Peak and Bottom) becomes ± 1 (4 or 6), an alert (warning) is notified, and when the difference becomes ± 2 (3 or 7), an alarm ( (Abnormal)). If such management can be performed, even if the wafer is not actually popped out or broken, it is possible to grasp signs of these abnormalities by managing changes in the wafer position data 525. As a result, it can be expected to prevent wafer jumping and wafer breakage.

Hereinafter, preferred embodiments according to the present embodiment will be additionally described.
<Embodiment 1>
Embodiment 1 is a substrate processing apparatus for carrying a predetermined process by carrying a substrate holder on which a plurality of substrates are placed into a furnace, and transferring information (Dect Info. 501) on the substrate on the substrate holder. 516) is displayed as a boat image diagram, and the entire boat is displayed on the operation screen, and the entire boat is divided into a plurality of areas, and the detailed information (detail display 504, detailed display list 521) of the substrates in each area is switched by screen operation. Provided is a substrate processing apparatus configured to be displayed on the operation screen.
<Embodiment 2>
Embodiment 2 is the same as Embodiment 1, but the boat image diagram displays a color-coded display according to wafer type, presence / absence of abnormality of the wafer, and a wafer display capable of correcting the information on the operation screen, respectively. A substrate processing apparatus is provided.
<Embodiment 3>
Embodiment 3 provides a substrate processing apparatus having a function of displaying an abnormal region in a selected state in the operation screen when the screen is first opened in Embodiment 2.

  The present invention is applicable not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD device as a substrate processing apparatus.

200 wafer (substrate)
217 Boat 504 Detailed information list 504a Detailed display 518 Detailed information display 519 Inquiry display 520 Detailed display button 608 Normal map state display 609 Wafer state display 610 Information correction button 611 Pop-up window G1 Wafer status screen G2 Wafer status screen

Claims (19)

A substrate processing apparatus including a display unit that displays a transfer status of a plurality of substrates on an operation screen,
The said display part is a substrate processing apparatus which displays the crack detection result information of each board | substrate, and the restoration condition of the board | substrate made abnormal by the said crack detection result information on the said operation screen.
And a substrate holder for holding the plurality of substrates.
The said display part divides | segments the said board | substrate holder into a some area | region when displaying the transfer information regarding the board | substrate on the said board | substrate holder, The detailed information of the board | substrate of each area | region is displayed on the said operation screen. 1. A substrate processing apparatus.
The substrate processing apparatus according to claim 2, wherein the display unit displays a color on the operation screen by changing a color according to a type of the substrate related to each region of the substrate holder.
The substrate processing apparatus according to claim 2, wherein the display unit displays a color on the operation screen depending on whether or not the substrate has an abnormality in each region of the substrate holder.
The substrate processing apparatus according to claim 2, wherein the display unit displays a color on the operation screen according to a restoration status of the substrate determined to be abnormal regarding each region of the substrate holder.
The display unit is configured to preferentially display, on the operation screen, an area where the abnormal substrate is present among the plurality of areas when displaying transfer information regarding the substrate on the substrate holder. Item 3. The substrate processing apparatus according to Item 2.
Furthermore, it has a cell for displaying the position data of the substrate regarding each area of the substrate holder numerically,
The substrate processing apparatus according to claim 2, wherein when displaying transfer information regarding the substrate on the substrate holder, the position data of the substrate includes three data of Top, Peak, and Bottom.
Further, the operation screen has a wafer crack detection status cell,
The substrate processing apparatus according to claim 1, wherein the display unit displays the presence / absence of the wafer crack in the cell when it is determined as abnormal in the crack detection result information.
Furthermore, the operation screen has a wafer jumping detection status cell,
The substrate processing apparatus according to claim 1, wherein the display unit displays presence / absence of the wafer jumping in the cell when the wafer jumping is detected by the crack detection result information.
The substrate processing apparatus according to claim 1, wherein the display unit displays means for designating a restoration process for a substrate that is abnormal in the crack detection result information on the operation screen.
The means for designating the recovery process includes a wafer crack detection execution means for re-execution of wafer crack detection, a crack detection result determination means for automatically recovering the substrate other than the abnormal substrate and its peripheral substrate, and termination of the recovery process. The substrate processing apparatus according to claim 10, further comprising crack detection confirmation means for confirming.
A display method for a substrate processing apparatus having an operation screen for displaying a transfer status of a plurality of substrates,
The display method of the substrate processing apparatus which displays the crack detection result information of each board | substrate, and the restoration condition of the board | substrate made abnormal by the said crack detection result information on the said operation screen.
Furthermore, the transfer information regarding the substrate on the substrate holder that holds the plurality of substrates is displayed,
The substrate processing apparatus according to claim 12, wherein the substrate holder is divided into a plurality of regions, and detailed information of the substrates in each region is displayed on the operation screen.
When displaying transfer information regarding the substrate on the substrate holder that holds the plurality of substrates,
The display method of a substrate processing apparatus according to claim 13, wherein an area where a substrate having an abnormality is present among the plurality of areas is preferentially displayed on the operation screen.
Furthermore, the display method of the substrate processing apparatus of Claim 12 which displays the presence or absence of the said wafer crack in a wafer crack detection status cell, when it determines with abnormality by the said crack detection result information.
Furthermore, the display method of the substrate processing apparatus of Claim 12 which displays the presence or absence of the said wafer jumping in a wafer popping-out detection status cell, when the wafer jumping is detected by the said crack detection result information.
13. The display method for a substrate processing apparatus according to claim 12, wherein means for designating a predetermined recovery process is displayed for a substrate that is abnormal in the crack detection result information.
18. The display method for a substrate processing apparatus according to claim 17, wherein means for canceling the abnormality is displayed after the predetermined restoration process is completed.
A processing step of carrying a predetermined process on the substrate by carrying a substrate holder on which a plurality of substrates are placed into a furnace;
A display step of displaying a transfer status of the plurality of substrates on an operation screen, and a manufacturing method of a semiconductor device having at least
In the display step, a method of manufacturing a semiconductor device that displays crack detection result information of each substrate and a restoration status of the substrate abnormal in the crack detection result information on the operation screen.