JP2008078351A - Substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing system capable of preventing a mistake in setting a recipe and reducing a recipe set time. <P>SOLUTION: In a group management program 40 executed by a group managing device 20, a recipe storage part 408 stores a plurality of recipes in which procedures for treating a substrate are described. A matrix storage part 402 stores correspondence (recipe determination matrix) between lot information and the recipe. A lot information reception part 404 receives the lot information which has been sent. A recipe selection part 406 selects a recipe among a plurality of the recipes stored in the recipe storage part 408 based on the lot information received by the lot information reception part 404 and the recipe determination matrix stored in the matrix storage part 402. A recipe transmission part 410 sends the recipe selected by the recipe selection part 406 to a recipe processing device 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing system for processing a semiconductor substrate, a glass substrate, or the like.

  In this type of substrate processing system, a substrate processing apparatus processes a substrate based on a recipe describing a detailed procedure for processing the substrate. In general, the recipe is manually set for the substrate processing apparatus by an operator.

  However, since the operator needs to manually input many set values regarding control parameters (temperature, gas flow rate, pressure, etc.) in order to designate a recipe for each process, the operation is complicated. Even if an operator sets an incorrect recipe (an undesired recipe) due to a minor input mistake or the like, the substrate processing apparatus may execute an incorrect process. As a result, the operating rate of the substrate processing apparatus may be reduced.

  An object of this invention is to provide the substrate processing system which can implement | achieve prevention of the setting mistake at the time of recipe preparation, and shortening of the designated time of a recipe.

  In order to achieve the above object, a substrate processing system according to the present invention is a substrate processing system including a plurality of substrate processing apparatuses that process a substrate based on a recipe and a group management apparatus connected to the substrate processing apparatus. The group management device includes: a recipe storage unit that stores a plurality of recipes; a correspondence storage unit that stores a correspondence between lot information and a recipe; a lot information reception unit that receives lot information; and the lot information reception Recipe selection means for selecting a recipe from a plurality of recipes stored in the recipe storage means based on the lot information received by the means and the correspondence relation stored in the correspondence relation storage means, and the recipe selection Transmitting means for transmitting the recipe selected by the means to the substrate processing apparatus.

  The group management apparatus according to the present invention is a group management apparatus connected to a plurality of substrate processing apparatuses that process a substrate based on a recipe, a recipe storage unit that stores a plurality of recipes, lot information, and a recipe Based on the correspondence relationship storage means for storing the correspondence relationship, the lot information acceptance means for accepting the lot information, the lot information accepted by the lot information acceptance means, and the correspondence relation stored in the correspondence relationship storage means And a recipe selection means for selecting a recipe from a plurality of recipes stored in the recipe storage means, and a transmission means for transmitting the recipe selected by the recipe selection means to the substrate processing apparatus.

  According to the substrate processing system of the present invention, it is possible to prevent setting mistakes during recipe creation and shorten the recipe designation time.

FIG. 1 is a diagram showing a configuration of a substrate processing system 1 according to an embodiment of the present invention.
As shown in FIG. 1, the substrate processing system 1 includes a plurality of substrate processing apparatuses 10-1 to 10-n, a group management apparatus 20, and a lot information transmission apparatus 50. The substrate processing apparatuses 10-1 to 10-n, the group management apparatus 20, and the lot information transmission apparatus 50 are connected via a network 12 such as a LAN. Therefore, the data is transmitted and received via the network 12 between the substrate processing apparatuses 10-1 to 10-n, the group management apparatus 20, and the lot information transmission apparatus 50. In addition, when it shows, without specifying any of several component parts, such as the substrate processing apparatus 10-1 to 10-n, it may be abbreviated simply as the substrate processing apparatus 10 or the like.

  In the substrate processing apparatus 10, the input / output device 16 is provided integrally with the substrate processing apparatus 10 or connected via the network 12 and has an operation screen 18. On the operation screen 18, an input screen for inputting predetermined data by the operator and a display screen showing the status of the apparatus and the like are displayed. A process module controller (PMC) 14 is provided in the substrate processing apparatus 10, and each apparatus in the substrate processing apparatus 10 is controlled by the PMC 14.

  The substrate processing apparatus 10 receives the recipe transmitted from the group management apparatus 20, and executes substrate processing based on the received recipe. Specifically, such a recipe describes a procedure for processing a substrate, and the PMC 14 controls each device in the substrate processing apparatus 10 based on a recipe configured by a plurality of steps. .

  As an example, the substrate processing apparatus 10 is configured as a semiconductor manufacturing apparatus that implements a processing apparatus in a semiconductor device (IC) manufacturing method. In the following description, an embodiment will be described in which a vertical apparatus that performs oxidation, diffusion processing, CVD processing, or the like is applied to a substrate as the substrate processing apparatus.

  The group management device 20 stores a plurality of recipes, stores the correspondence between lot information and recipes, accepts lot information transmitted from the lot information transmission device 50, and stores the received lot information and the stored lot information. A recipe is selected from the plurality of stored recipes based on the corresponding relationship, and the selected recipe is transmitted to the substrate processing apparatus 10. The group management device 20 will be described in detail later.

  The lot information transmission device 50 has a lot information reading device 52 and transmits the lot information read by the lot information reading device 52 to the group management device 20. The lot information reading device 52 is a device that reads lot information indicated on a substrate container or the like, and is realized by, for example, a bar code reader, a two-dimensional code reader, an RFID reader, or the like. The lot information includes information such as the type of product to be produced. The lot information transmitting device 50 may be included in the same housing as the group management device 20 or may be included in at least one of the substrate processing apparatuses 10-1 to 10-n. Here, when the types are different, it is necessary to change the recipe or change the setting of the control parameter.

FIG. 2 is a perspective view of the substrate processing apparatus 10 according to the embodiment of the present invention. FIG. 3 is a side perspective view of the substrate processing apparatus 10 shown in FIG.
As shown in FIGS. 2 and 3, an embodiment of the present invention in which a hoop (substrate container; hereinafter referred to as a pod) 110 is used as a wafer carrier containing a wafer (substrate) 200 made of silicon or the like. The substrate processing apparatus 10 according to FIG. A front maintenance port 103 serving as an opening provided for maintenance is opened at the front front portion of the front wall 111a of the casing 111, and front maintenance doors 104 and 104 for opening and closing the front maintenance port 103 are respectively constructed. It is attached.

  A pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111a of the casing 111 so as to communicate between the inside and the outside of the casing 111. The pod loading / unloading port 112 has a front shutter (substrate container loading / unloading port). The loading / unloading opening / closing mechanism 113 is opened and closed. A load port (substrate container delivery table) 114 is installed in front of the front side of the pod loading / unloading port 112, and the load port 114 is configured so that the pod 110 is placed and aligned. The pod 110 is carried onto the load port 114 by an in-process carrying device (not shown), and is also carried out from the load port 114.

  A rotary pod shelf (substrate container mounting shelf) 105 is installed at an upper portion of the casing 111 in a substantially central portion in the front-rear direction. The rotary pod shelf 105 stores a plurality of pods 110. It is configured. In other words, the rotary pod shelf 105 is vertically arranged and intermittently rotated in a horizontal plane, and a plurality of shelf boards (supported by a substrate container) that are radially supported by the support 116 at each of the upper, middle, and lower positions. And a plurality of shelf plates 117 are configured to hold the pods 110 in a state where a plurality of pods 110 are respectively placed.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111, and the pod transfer device 118 moves up and down while holding the pod 110. A pod elevator (substrate container lifting mechanism) 118a and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism are configured. The pod transfer device 118 includes a pod elevator 118a and a pod transfer mechanism 118b. The pod 110 is transported between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by continuous operation.

  A sub-housing 119 is constructed across the rear end of the lower portion of the housing 111 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages. A pair of pod openers 121 and 121 are installed at the wafer loading / unloading ports 120 and 120 at the upper and lower stages, respectively. The pod opener 121 includes mounting bases 122 and 122 on which the pod 110 is placed, and cap attaching / detaching mechanisms (lid attaching / detaching mechanisms) 123 and 123 for attaching and detaching caps (lids) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  The sub-housing 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the pod transfer device 118 and the rotary pod shelf 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124, and the wafer transfer mechanism 125 rotates the wafer 200 in the horizontal direction or can move the wafer 200 in the horizontal direction. A substrate transfer device) 125a and a wafer transfer device elevator (substrate transfer device lifting mechanism) 125b for moving the wafer transfer device 125a up and down. As schematically shown in FIG. 2, the wafer transfer device elevator 125 b is installed between the right end of the pressure-resistant casing 111 and the right end of the front area of the transfer chamber 124 of the sub casing 119. By the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the tweezer (substrate holder) 125c of the wafer transfer device 125a is used as a placement portion for the wafer 200 with respect to the boat (substrate holder) 217. The wafer 200 is loaded (charged) and unloaded (discharged).

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147.

  As schematically shown in FIG. 2, a boat elevator (substrate holder lifting / lowering) for raising and lowering the boat 217 is provided between the right end of the pressure-resistant casing 111 and the right end of the standby section 126 of the sub casing 119. Mechanism) 115 is installed. A seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a connecting tool connected to a lifting platform of the boat elevator 115, and the seal cap 219 supports the boat 217 vertically, and a lower end of the processing furnace 202. It is comprised so that a part can be obstruct | occluded. The boat 217 includes a plurality of holding members, and is configured to hold a plurality of (for example, about 50 to 125) wafers 200 horizontally in a state where the centers are aligned in the vertical direction. Has been.

  As schematically shown in FIG. 2, the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side is a cleaned atmosphere or inert gas. A clean unit 134 composed of a supply fan and a dust-proof filter is installed so as to supply clean air 133. Between the wafer transfer device 125a and the clean unit 134, although not shown, the circumferential direction of the wafer A notch aligning device 135 is installed as a substrate aligning device for aligning the positions.

  The clean air 133 blown out from the clean unit 134 flows into the notch aligning device 135, the wafer transfer device 125a, and the boat 217 in the standby unit 126, and is then sucked in through a duct (not shown) to the outside of the housing 111. Exhaust is performed or it is circulated to the primary side (supply side) that is the suction side of the clean unit 134, and is again blown into the transfer chamber 124 by the clean unit 134.

Next, the PMC 14 that controls the components of the substrate processing apparatus 10 will be described.
FIG. 4 shows a hardware configuration centered on the PMC 14.
The PMC 14 includes a CPU 140, a ROM (read-only memory) 142, a RAM (random-access memory) 144, an input / output interface (IF) 146 that transmits and receives data to and from the input / output device 16, a temperature control unit 150, Communication for controlling data communication with an external computer via the network 12, an I / O control unit 148 that performs I / O control with the gas control unit 152, the pressure control unit 154, the temperature control unit 150, and the like It has a control unit 156 and a hard disk drive (HDD) 158 for storing data. These components are connected to each other via a bus 160, and data is transmitted and received between the components via the bus 160.

  In the PMC 14, the CPU 140 processes the substrate based on the recipe transmitted by the group management device 20. Specifically, the CPU 140 outputs control data (control instruction) to the temperature control unit 150, the gas control unit 152, and the pressure control unit 154. The ROM 142, the RAM 144, and the HDD 158 store a sequence program, data input from the input / output device 16, data input via the communication control unit 156, and the like.

  The temperature control unit 150 controls the temperature in the processing chamber 202 by the heater 338 provided on the outer periphery of the processing furnace 202 described above. The gas control unit 152 controls the supply amount of the reaction gas supplied into the processing furnace 202 based on the output value from the MFC (mass flow controller) 342 provided in the gas pipe 340 of the processing furnace 202. The pressure control unit 154 controls the pressure in the processing chamber 202 by opening and closing the valve 348 based on the output value of the pressure sensor 346 provided in the exhaust pipe 344 of the processing furnace 202. As described above, the temperature control unit 150 and the like control each unit (the heater 338, the MFC 342, the valve 348, and the like) of the substrate processing apparatus 10 based on a control instruction from the CPU 140.

  Therefore, when recipe data is transmitted from the group management apparatus 20, the recipe data is input to the PMC 14 via the communication control unit 156. The CPU 140 activates the sequence program, and calls and executes the transmitted recipe command according to the sequence program, thereby sequentially executing the steps in which the control parameter target values and the like are set, and the I / O control unit 148. A control instruction for processing the substrate is transmitted to the temperature control unit 150, the gas control unit 152, the pressure control unit 154, and the transfer control unit (not shown). The temperature control unit 150 and the like control each unit (the heater 338, the MFC 342, the valve 348, and the like) in the substrate processing apparatus 10 according to a control instruction. Thereby, the processing of the wafer 200 described above is performed.

FIG. 5 is a diagram showing the configuration of the group management device 20 with the control device 22 as the center.
As shown in FIG. 5, the group management device 20 includes a control device 22 including a CPU 24 and a memory 26, a communication device 28 that transmits and receives data to and from an external computer via the network 12, a hard disk drive, and the like. And a display / input device 30 including a display device such as a liquid crystal display and a pointing device such as a keyboard and a mouse. Thus, the group management apparatus 20 is a general-purpose computer in which, for example, a group management program 40 described later is installed.

FIG. 6 is a diagram showing a functional configuration of the group management program 40 executed by the group management apparatus 20 in the substrate processing system 1 according to the embodiment of the present invention.
As shown in FIG. 6, the group management program 40 includes a matrix registration unit 400, a matrix storage unit 402, a lot information reception unit 404, a recipe selection unit 406, a recipe storage unit 408, and a recipe transmission unit 410. The group management program 40 is stored in a recording medium 34 (FIG. 5) such as FD, CD, or DVD, supplied to the group management device 20, loaded into the memory 26, and operates on the control device 22 (not shown). It is executed using hardware on the OS. The group management program 40 may be supplied from the external computer connected to the network 12 to the control device 22 via the communication device 28.

  In the group management program 40, the recipe storage unit 408 stores a plurality of recipes describing a procedure for processing a substrate. The recipe storage unit 408 is realized by at least one of the memory 26 and the storage device 32.

  The matrix storage unit 402 constitutes a correspondence storage unit that stores the correspondence between the lot information and the recipe (recipe determination matrix). More specifically, the matrix storage unit 402 stores the relationship between the product type included in the lot information and the recipe used for the type for each process. Similar to the recipe storage unit 408, the matrix storage unit 402 is realized by the storage device 32 and the like. The recipe determination matrix stored in the matrix storage unit 402 will be described in detail later.

  The matrix registration unit 400 receives a recipe determination matrix input via the display / input device 30 and stores it in the matrix storage unit 402. In addition, the matrix registration unit 400 accepts processing such as addition, change, and deletion of a recipe determination matrix that is input in the same manner, and changes the recipe determination matrix stored in the matrix storage unit 402 based on the received contents. Etc. It should be noted that the matrix registration unit 400 may accept data related to a change in the recipe determination matrix input and transmitted from an external computer via the communication device 28.

  The lot information receiving unit 404 receives the lot information transmitted by the lot information transmitting device 50 and outputs it to the recipe selecting unit 406. For example, the lot information receiving unit 404 receives lot information transmitted via the network 12 and received by the communication device 28.

  The recipe selection unit 406 selects a recipe from a plurality of recipes stored in the recipe storage unit 408 based on the lot information received by the lot information reception unit 404 and the recipe determination matrix stored in the matrix storage unit 402. select. More specifically, when the recipe selection unit 406 inputs the lot information from the lot information reception unit 404, the recipe selection unit 406 refers to the recipe determination matrix stored in the matrix storage unit 402, and recipe information corresponding to the received lot information. To get. For example, the recipe selection unit 406 acquires the name of the recipe corresponding to this product type based on the product type information included in the lot information.

  When the recipe selection unit 406 acquires recipe information, the recipe selection unit 406 selects a corresponding recipe from a plurality of recipes stored in the recipe storage unit 408. For example, the recipe selection unit 406 searches the recipe storage unit 408 based on the recipe name. The recipe selection unit 406 outputs the selected recipe to the recipe transmission unit 410.

  The recipe transmission unit 410 receives a recipe transmission request from the substrate processing apparatus 10 via the network 12 and transmits the recipe selected by the recipe selection unit 406 to the substrate processing apparatus 10. For example, the recipe transmission unit 410 receives a notification that a substrate container (the pod 110 shown in FIGS. 2 and 3) has been inserted into the substrate processing apparatus 10 as a recipe transmission request. In this case, the recipe transmission unit 410 transmits the recipe to the substrate processing apparatus 10 in which the pod 110 is inserted.

FIG. 7 is a diagram illustrating a recipe determination matrix stored in the matrix storage unit 402 of the group management program 40.
As illustrated in FIG. 7, the recipe is determined in advance for each lot information and for each process. For example, the recipe is determined for each process (process 1 to process v) for each type information (type 1 to type u) as lot information. When the received lot information indicates the product type 1, the recipe selection unit 406 of the group management program 40 selects the recipe corresponding to the process 1 to the process v of the product type 1, that is, the recipe 1 to the recipe v and selects the recipe. Output to the transmission unit 410. In the recipe determination matrix, the recipe may be registered with the name of the recipe, or may be registered with an identifier (for example, a character string made up of alphanumeric symbols) that uniquely identifies the recipe.

Next, control processing of the substrate processing system 1 according to the embodiment of the present invention will be described.
FIG. 8 is a flowchart showing the recipe selection process (S10) by the group management program 40 operating on the group management apparatus 20.
As shown in FIG. 8, in step 100 (S100), the lot information receiving unit 404 of the group management program 40 receives the lot information read and transmitted by the lot information transmitting device 50.

  In step 102 (S102), the recipe selecting unit 406 refers to the recipe determination matrix stored in the matrix storage unit 402, and determines a recipe corresponding to the lot information received by the lot information receiving unit 404 for each process. .

In step 104 (S104), the recipe selection unit 406 acquires the recipe determined in the process of S102 from the plurality of recipes stored in the recipe storage unit 408.
In this way, the group management apparatus 20 selects a recipe corresponding to the lot information transmitted by the lot information transmission apparatus 50.

FIG. 9 is a flowchart showing the overall operation (S20) of the substrate processing system 1 according to the embodiment of the present invention.
As shown in FIG. 9, in step 200 (S200), the operator uses the lot information reading device 52 of the lot information transmitting device 50 to give to the processing target (for example, the pod 110 put into the substrate processing apparatus 10). Loaded lot information. The lot information may be assigned to the processing target in the form of a barcode, a two-dimensional code, or the like, or may be included in an RFID tag attached to the processing target.
In step 202 (S202), the lot information transmission device 50 transmits the read lot information to the group management device 20 via the network 12.

  In step 204 (S204), when the pod 110 is loaded into the substrate processing apparatus 10, the substrate processing apparatus 10 transmits a loading notification of the pod 110 to the group management apparatus 20. In the group management device 20, the recipe transmission unit 410 of the group management program 40 receives the input notification. The group management apparatus 20 recognizes the substrate processing apparatus 10 that is the target of transmitting the recipe among the substrate processing apparatuses 10-1 to 10-n.

  In the group management device 20, a recipe selection process (FIG. 8; S10) is executed. Note that the recipe selection process can be executed after lot information is received, and may be performed before the process of S204.

In step 206 (S206), the group management apparatus 20 transmits the recipe selected in the process of S10 to the substrate processing apparatus 10 in which the pod 110 is inserted. The substrate processing apparatus 10 receives the recipe transmitted from the group management apparatus 20.
In step 208 (S208), the substrate processing apparatus 10 processes the substrate based on the received recipe.

Next, the substrate processing by the substrate processing apparatus 10 will be described in detail.
As shown in FIGS. 2 and 3, when the pod 110 is supplied to the load pot 114, the pod loading / unloading port 112 is opened by the front shutter 113, and the pod 110 above the load port 114 serves as a pod transfer device. 118 is carried into the housing 111 from the pod loading / unloading port 112.

  The loaded pod 110 is automatically transported and delivered by the pod transport device 118 to the designated shelf 117 of the rotary pod shelf 105, temporarily stored, and then one pod opener from the shelf 117. After being transferred to 121 and delivered and temporarily stored, it is transferred from the shelf 117 to one of the pod openers 121 and transferred to the mounting table 122 or directly transferred to the pod opener 121 and mounted. It is transferred to the mounting table 122. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133. For example, the transfer chamber 124 is filled with nitrogen gas as clean air 133, so that the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the casing 111 (atmosphere).

  The pod 110 mounted on the mounting table 122 has its opening-side end face pressed against the opening edge of the wafer loading / unloading port 120 on the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. The wafer loading / unloading port is opened.

  When the pod 110 is opened by the pod opener 121, the wafer 200 is picked up from the pod 110 by the tweezer 125c of the wafer transfer device 125a through the wafer loading / unloading port, aligned with the notch alignment device 135 (not shown), and then transferred. It is carried into the standby section 126 behind the chamber 124 and loaded (charged) into the boat 217. The wafer transfer device 125 a that has delivered the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 110 into the boat 217.

  During the loading operation of the wafer into the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, another pod from the rotary pod shelf 105 is loaded into the other (lower or upper) pod opener 121. 110 is transferred and transferred by the pod transfer device 118, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafers 200 is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

  After loading, processing is performed on the wafer 200 in the processing furnace 202 based on the recipe transmitted from the group management apparatus 20. After the processing, the wafer 200 and the pod 110 are ejected to the outside of the casing by the reverse procedure described above except for the wafer alignment process in the notch alignment device 135 (not shown).

  The substrate processing apparatus according to the present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD device. In addition, the substrate processing apparatus according to the present invention does not limit the processing in the furnace, but performs film forming processing including processing for forming CVD, PVD, oxide film, nitriding diffusion, and processing for forming a film containing metal. be able to. The substrate processing apparatus according to the present invention can be applied not only to a vertical apparatus but also to a single wafer apparatus.

1 is a diagram showing a configuration of a substrate processing system 1 according to an embodiment of the present invention. 1 is a perspective view of a substrate processing apparatus 10 according to an embodiment of the present invention. 1 is a side perspective view of a substrate processing apparatus 10 according to an embodiment of the present invention. The hardware configuration centering on PMC14 is shown. FIG. 2 is a diagram illustrating a configuration of a group management device 20 with a control device 22 as a center. 3 is a diagram illustrating a functional configuration of a group management program 40 executed by the group management apparatus 20. FIG. 4 is a diagram illustrating a recipe determination matrix stored in a matrix storage unit 402 of the group management program 40. FIG. It is a flowchart which shows the recipe selection process (S10) by the group management program 40 which operate | moves on the group management apparatus 20. FIG. It is a flowchart which shows the whole operation | movement (S20) of the substrate processing system 1 which concerns on embodiment of this invention.

Explanation of symbols

1 substrate processing system 10 substrate processing apparatus 12 network 14 PMC
16 input / output device 20 group management device 22 control device 28 communication device 40 group management program 50 lot information transmission device 52 lot information reading device 400 matrix registration unit 402 matrix storage unit 404 lot information reception unit 406 recipe selection unit 408 recipe storage unit 410 Recipe transmitter

Claims (1)

A substrate processing system including a plurality of substrate processing apparatuses for processing a substrate based on a recipe and a group management apparatus connected to the substrate processing apparatus,
The group management device includes:
Recipe storage means for storing a plurality of recipes;
Correspondence storage means for storing the correspondence between the lot information and the recipe;
Lot information receiving means for receiving lot information;
Recipe selection means for selecting a recipe from a plurality of recipes stored in the recipe storage means based on the lot information received by the lot information reception means and the correspondence relation stored in the correspondence relation storage means; ,
A substrate processing system comprising: a transmission unit configured to transmit a recipe selected by the recipe selection unit to the substrate processing apparatus.

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